CN101462104A - Method and equipment for processing coated metallic plate - Google Patents
Method and equipment for processing coated metallic plate Download PDFInfo
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- CN101462104A CN101462104A CNA2008100938346A CN200810093834A CN101462104A CN 101462104 A CN101462104 A CN 101462104A CN A2008100938346 A CNA2008100938346 A CN A2008100938346A CN 200810093834 A CN200810093834 A CN 200810093834A CN 101462104 A CN101462104 A CN 101462104A
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Abstract
The invention discloses a method for processing a coated metal plate, which comprises the following steps: performing surface chemical treatment on the facade of a substrate; coating a coating on the part outside edge areas of two opposite sides on the surface of a chemical treatment layer; and simultaneously coating a conductive coating on the rear of the substrate. The invention provides the method and a device for processing the coated metal plate, which are used for producing coated metal plates for shells of products such as computer cases subjected to an electromagnetic interference test.
Description
Technical field
The present invention relates to a kind of processing method of coated metallic plate, particularly a kind of coated metallic plate processing method and equipment that is used for to do the electric appliance casing of complete machine Electromagnetic Interference Test.
Background technology
Traditional coated metallic plate comprises substrate, and substrate can be made by steel plates such as cold-reduced sheet, electrolytic galvanized sheet, heat zinc coating plate, aluminium plating zinc plates, on the front of substrate, the back side chemical treatment layer is arranged all, and the skin of chemical treatment layer has the coating protection layer.This coated metallic plate does not have any pollution as household appliances shell to environment, is widely used on the products such as outer case of refrigerator, refrigerator side plate, microwave oven shell, air conditioner casing, washing machine shell.But, can't satisfy the complete machine Electromagnetic Interference Test because local conduction can't be realized in traditional coated metallic plate surface.Therefore, on need doing the electric appliance casing of complete machine Electromagnetic Interference Test, seldom uses computer housing etc.
Because computer housing need be done complete machine EMI (electromagnetic interference) test, the sheet edge that requires to be processed conducts electricity, and other positions are non-conductive for anti-static electrification.This technical barrier is the bottleneck problem promoted on produce markets such as computer housing of coated metallic plate just also.
Existing coated metallic plate surface is owing to production technology characteristic and face coat characteristics, and positive part can not be conducted electricity behind the external coating.
The production of existing computer housing, as use the technology of dusting or spraying paint after traditional first moulding, final product after complex procedures and the technology of dusting or spraying paint can cause more serious pollution and increase manufacturing cost and moulding occurs dusting or spraying paint inhomogeneous easily, makes product appearance coarse.
Therefore, how providing a kind of coated metallic plate processing method and equipment that computer housing etc. need be done the electric equipment products shell of complete machine Electromagnetic Interference Test that is used for, is the present technical issues that need to address.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of coated metallic plate processing method and equipment, is used to produce the coated metallic plate that the shell of the products such as computer housing that carry out Electromagnetic Interference Test uses of satisfying the demand.
Specifically, the invention discloses a kind of coated metallic plate processing method on the one hand, said method comprising the steps of:
Chemical surface treatment is carried out in the front of substrate;
Substrate after the chemical surface treatment is carried out the surface baking, form the chemical treatment layer;
Part coating composition layer beyond two opposite side border areas of described chemical treatment laminar surface; The conductive coating of substrate back coating simultaneously.
Preferably, before the step of chemical surface treatment is carried out in described front with substrate, comprising:
To carry out surface clean as the steel plate of substrate;
Substrate after cleaning is carried out dry tack free.
Preferably, the part coating composition layer beyond two opposite side border areas of described chemical treatment laminar surface; The step of the conductive coating of substrate back coating simultaneously is specially:
Part primer coating coating beyond two opposite side border areas of described chemical treatment laminar surface, the conductive coating of substrate back coating simultaneously;
The substrate 1 that has been coated with priming paint is carried out the priming paint hot setting, form primer coating;
At primer coating surface coating finish paint, form topcoat.
Preferably, two opposite side of described chemical treatment laminar surface are specially two long limits of described substrate.
Preferably, described two opposite side border area sizes are identical.
On the other hand, the invention discloses a kind of coating metal board processing device, be used for the processing metal plate, described process equipment comprises: first applicator roll with the described dope layer of coating, with the roller that is used to be coated with described coated metallic plate back side conductive coating, and the location pulley that is used to locate described metallic plate.
Preferably, the length of described first applicator roll is less than described coated metallic plate width, and described first applicator roll is coated with the zone beyond two opposite side border areas of described coated metallic plate.
Preferably, described first applicator roll comprises the home roll that applies described dope layer and all join with described home roll both sides and coaxial with described home roll two auxilliary rollers; Described auxilliary roller diameter is less than described home roll diameter.
Preferably, the length of the roller of described coated metallic plate back side conductive coating equals described coated metallic plate width.
Preferably, described location pulley is positioned at two opposite side border areas of described coated metallic plate.
The third aspect, the invention discloses a kind of coating metal board processing device, be used for the processing metal plate, described process equipment comprises: second applicator roll with the described dope layer of coating, it is parallel with the described second applicator roll axis to be arranged on described second applicator roll, one end, and two scrapers that are used to remove described applicator roll coating between described second applicator roll and described coated metallic plate, with the roller that is used to be coated with described coated metallic plate back side conductive coating, and be used to install the knife rest of described scraper and the location pulley of the described metallic plate in location that is installed together with described knife rest.
Preferably, distance is described dope layer width between described two scrapers.
Preferably, described location pulley is two, and lengthwise position is the position of corresponding described scraper respectively.
Preferably, described second applicator roll runs well when being counterclockwise, and described scraper is arranged on the described second applicator roll bottom.
Compare with the above-mentioned background technology, since the described coated metallic plate processing method of the embodiment of the invention, the part coating composition layer beyond two opposite side border areas of described chemical treatment laminar surface; The conductive coating of substrate back coating simultaneously, the described coated metallic plate processing method of the embodiment of the invention, the positive local conduction that the coated metallic plate that machines just has and two specific characters of back side conduction like this.After described coated metallic plate is being processed into specific product, can satisfy the requirement of Electromagnetic Interference Test.
The manufacturer of product such as computer housing uses the described coated metallic plate processing method of the embodiment of the invention just can simplified processing process like this, reduces processing technology such as spray paint, the saving manufacturing cost.
Description of drawings
Fig. 1 is the structural representation of prior art coated metallic plate;
Fig. 2 is the coated metallic plate processing method first embodiment flow chart of the present invention;
The coated metallic plate structure chart that Fig. 3 makes for flow process shown in Figure 2;
Fig. 4 is a coated metallic plate front view shown in Figure 3;
Fig. 5 is the coated metallic plate processing method second embodiment flow chart of the present invention;
Fig. 6 is coated metallic plate processing method the 3rd an embodiment flow chart of the present invention;
The coated metallic plate structure chart that Fig. 7 makes for flow process shown in Figure 6;
Fig. 8 is the described coating metal board processing device of a first embodiment of the invention structure chart.
Fig. 9 is the described coating metal board processing device of a second embodiment of the invention structure chart.
The specific embodiment
The invention provides a kind of coated metallic plate processing method and equipment, the processing needs of the shell of the products such as computer housing that carry out Electromagnetic Interference Test of being used to satisfy the demand.
Referring to Fig. 2 to Fig. 4, Fig. 2 is first kind of embodiment flow chart of coated metallic plate processing method of the present invention; The coated metallic plate structure chart that Fig. 3 makes for flow process shown in Figure 2; Fig. 4 is a coated metallic plate front view shown in Figure 3.
The described coated metallic plate processing method of first embodiment of the invention specifically may further comprise the steps:
S110, chemical surface treatment is carried out in the front of substrate.
In order to guarantee good chemical treatment effect, before chemical surface treatment is carried out in the front of substrate, need and will carry out surface clean as the steel plate of substrate 1, the substrate 1 after will cleaning then carries out dry tack free.
Chemical surface treatment is carried out in front to dried substrate 1; Can select one side as positive arbitrarily to dried substrate 1.
S120, the substrate after the chemical surface treatment is carried out surface baking, form the chemical treatment layer.
For the corrosion resistance of assurance substrate 1 and the adhesive force of substrate 1 and dope layer 3, before carrying out dope layer 3 applications, need that at first substrate 1 is done chemical treatment and form chemical treatment layer 2.Described chemical treatment layer 2 can be divided into from the composition and contain chromium and Chrome-free two big class chemical treatment layers.
And in order to guarantee the adhesive force of substrate 1 used steel plate and follow-up dope layer 3, the surface that requires described substrate 1 is not pass through the sheet material that phosphatization or chromating are handled.
S130, the part coating composition layer beyond two opposite side border areas of described chemical treatment laminar surface; The conductive coating of substrate back coating simultaneously.
Two opposite side of described chemical treatment laminar surface specifically can be two long limits of described substrate.Promptly realized the edge conduction in described coated metallic plate front.
Described conductive coating is specifically as follows the inorganic conductive coating of anti-the fingerprint, has promptly realized described coated metallic plate back side conduction.
Because the described coated metallic plate processing method of first embodiment of the invention, part coating composition layer 3 beyond two the opposite side border areas in described chemical treatment layer 2 surface, the conductive coating 4 of substrate 1 back side coating simultaneously, the described coated metallic plate processing method of the embodiment of the invention like this, two specific characters that conduct electricity at the front edge conduction that the coated metallic plate that machines just has and the back side.After described coated metallic plate is being processed into specific product, can satisfy the requirement of Electromagnetic Interference Test.
Referring to Fig. 5, this figure is the coated metallic plate processing method second embodiment flow chart of the present invention.
Relative first embodiment of coated metallic plate processing method second embodiment of the present invention, described step S130 specifically can be by step S30 and replacement.
The described coated metallic plate processing method of second embodiment of the invention specifically can may further comprise the steps:
S10, chemical surface treatment is carried out in the front of substrate.
Equally, in order to guarantee good chemical treatment effect, before chemical surface treatment is carried out in the front of substrate, need and will carry out surface clean as the steel plate of substrate 1, the substrate 1 after will cleaning then carries out dry tack free.
Chemical surface treatment is carried out in front for dried substrate 1.Can select one side as positive arbitrarily for dried substrate 1.
S20, the substrate after the chemical surface treatment 1 is carried out surface baking, form chemical treatment layer 2.
Identical with first embodiment, for the corrosion resistance of assurance substrate 1 and the adhesive force of substrate 1 and dope layer 3, before carrying out dope layer 3 applications, need that at first substrate 1 is done chemical treatment and form chemical treatment layer 2.Described chemical treatment layer 2 can be divided into from the composition and contain chromium and Chrome-free two big class chemical treatment layers.
And in order to guarantee the adhesive force of substrate 1 used steel plate and follow-up dope layer 3, the surface that requires described substrate 1 is not pass through the sheet material that phosphatization or chromating are handled equally.
S30, the coating that will be used for the corresponding described substrate two side areas of applicator roll of coating composition layer are wiped off, simultaneously the substrate 1 after the baking of surface are carried out surperficial coating composition layer, the conductive coating 4 of substrate 1 back side coating simultaneously.
The coating of the corresponding described substrate two side areas on the applicator roll of coating composition layer is wiped off, made an applicator roll coated portion chemical treatment layer, and expose the chemical treatment layer of the conduction of both sides.Substrate 1 back side specifically can be coated with the inorganic conductive coating of anti-fingerprint the 4 simultaneously.
In order to protect the described coated metallic plate of the embodiment of the invention, can be after described coated metallic plate machine, step below increasing:
S40, at described substrate 1 front dope layer 3 outer surface pasting protective films.
The described coated metallic plate processing method of second embodiment of the invention, when the whole dope layer of substrate front side application, the coating of the corresponding described substrate two side areas on the applicator roll of coating composition layer is wiped off, made the two edges in the described coated metallic plate of embodiment of the invention front conduct electricity; And described substrate reverse side is coated with conductive coating, the described coated metallic plate processing method of the embodiment of the invention like this, two specific characters that conduct electricity at the front edge conduction that the coated metallic plate that machines just has and the back side.After described coated metallic plate is being processed into specific product, can satisfy the requirement of Electromagnetic Interference Test.
The coated metallic plate that the described coated metallic plate processing method of second embodiment of the invention is made, comprise the conductive coating 4 that substrate 1, the described substrate 1 positive chemical treatment layer 2 that covers, described substrate 1 back side cover, and the dope layer 3 that covers described chemical treatment layer 2 partial width, and the two side areas of described chemical treatment layer 2 on width all do not cover dope layer.
The width that described chemical treatment layer 2 width do not cover the two side areas of dope layer can be identical, also can be inequality.Specifically can process needs according to reality determines.Coating roll can be by the coating on equipment such as the scraper realization removal coating roll.
The edge line position of coated metallic plate dope layer 3 width of the present invention can be adjusted according to processing request.To produce the host computer product is example, and the width of described dope layer 3 equals the width of host computer front or side.
The coated metallic plate that the described coated metallic plate processing method of second embodiment of the invention is made, substrate 1 thickness can be for 0.2 to 1.5mm, and chemical treatment layer 2 thickness are less than 1um, and dope layer 3 thickness can be for 6 to 20um, and conductive coating 4 thickness can be for 1 to 3um.In order to protect the described coated metallic plate of the embodiment of the invention, can be at dope layer 3 outer surface pasting protective films 5.Diaphragm 5 can be for 30 to 60um, and concrete diaphragm 5 can be transparent protective film.
The coated metallic plate that the described coated metallic plate processing method of the embodiment of the invention is made, can be applied to products such as household appliances shell, building internal and external ornament, being applied to especially can be by panel beating modes such as bending, impact, stretchings, and complete machine is had in the product casings such as the computer housing of electromagnetic shielding requirement and DVD.
From the angle of electromagnetic shielding, desirable screening housing is used very thick metallic plate, and it has continuous structure, not seam and opening.And in fact, designing a good screening housing must be with desired consistent, not only to have and enter the passage that maintenance and repair are carried out in inside, human factor is arranged, the watch window of control button and connector and instrument and indicator also to be arranged, and the heat of casing inner electronic equipment is shed easily.
Metal material has firm structure, and has high electricity to lead continuity in seam and corner, can obtain fine effectiveness.Under the various mechanical stresses that the shell of this form in use may occur, can keep effectiveness constant.Require the seam of conducting surface separately must not be insulation or very high impedance arranged.Therefore, the seam crossing of product casing such as computer housing and DVD need have conductive characteristic.
After computer housing and the machine-shaping of DVD shell, need carry out complete machine EMI test, require the sheet edge conduction of being processed, for anti-static electrification and other positions non-conductive.
The described coated metallic plate processing method of second embodiment of the invention can be determined the width of dope layer 3 according to the shape of product casings such as computer housing and DVD, guarantees the front edge conduction of described coated metallic plate, and dope layer 3 is non-conductive.
The described coated metallic plate processing method of second embodiment of the invention, be on substrate 1, to use the technology that is coated with the linear oil-free polyester resin coating series of macromolecule in the front, be heating and curing with the heated-air drying baking oven and form whole dope layer, using edge reservation painting device to remove the dope layer in the coating roll zone of substrate 1 front edge correspondence, ensured coated metallic plate front edge conduction of the present invention.Simultaneously, at substrate 1 back coating conductive coating, guarantee the coated metallic plate back side conductive characteristic that coated metallic plate processing method of the present invention is made.
The described coated metallic plate processing method of second embodiment of the invention, the described coated metallic plate back side can the application conductive coating of anti-the fingerprint, the front edge conduction, and has excellent flexibility, anti-pollution, chemical proofing, decay resistance and good hardness, the requirement that requires and prevent electromagnetic interference as the machine-shaping of products such as computer housing can be satisfied, batch machining and industrial applications can be realized.
Referring to Fig. 6 and Fig. 7, Fig. 6 is the third embodiment flow chart of coated metallic plate processing method of the present invention; The coated metallic plate structure chart that Fig. 7 makes for flow process shown in Figure 6.
The difference of relative second embodiment of the third embodiment of coated metallic plate processing method of the present invention, described coating composition layer comprises primer coating coating and topcoat.
The described coated metallic plate processing method of the third embodiment of the present invention specifically may further comprise the steps:
S100, will carry out surface clean as the steel plate of substrate 1.
S200, the substrate 1 after will cleaning carry out dry tack free.
S300, chemical surface treatment is carried out in the front of dried substrate 1.
Can select one side as positive arbitrarily to dried substrate 1.
For the corrosion resistance of assurance substrate 1 and the adhesive force of substrate 1 and dope layer 3, before carrying out dope layer 3 applications, need that at first substrate 1 is done chemical treatment and form chemical treatment layer 2.Described chemical treatment layer 2 can be divided into from the composition and contain chromium and Chrome-free two big class chemical treatment layers.
And in order to guarantee the adhesive force of substrate 1 used steel plate and follow-up dope layer 3, the surface that requires described substrate 1 is not pass through the sheet material that phosphatization or chromating are handled.
S400, the substrate after the chemical surface treatment 1 is carried out surface baking, form chemical treatment layer 2.
S500, the primer base that will be used for the corresponding described substrate two side areas of applicator roll of coating composition layer are wiped off, simultaneously the substrate 1 after the baking of surface are carried out surperficial primer coating; Substrate 1 back side is coated with the inorganic conductive coating of anti-fingerprint the 4 simultaneously.
The first, in order to guarantee the adhesive force between substrate 1 surface and the topcoat 32.
The second, can provide good anti-corrosion and weather resistance for substrate 1.
S600, the substrate 1 that will be coated with priming paint carry out the priming paint hot setting, form primer coating 31.
The solidification temperature of primer coating 31 requires: the highest metallic plate temperature of the metallic plate of primer coating coating 31 in baking oven is 180 ℃ to 250 ℃, and continues heating 40 to 100 seconds.
For the coating of primer coating 31,, require primer coating 31 must have enough pliabilitys and extensibility in order to guarantee follow-up metallic plate processing forming.
S700, at primer coating 31 surface coating finish paints, form topcoat 32.
Coated face lacquer coat 32 makes the coating metal of making have enough pliabilitys and extensibility, can satisfy the flawless bending requirement of 180 degree bendings.
Coating width on the above-mentioned coating roll that is removed can be identical, also can be inequality.Specifically can process needs according to reality determines.The coating that is removed can be realized by equipment such as scrapers.
The step S500 to S700 of the described coated metallic plate processing method of the invention described above second embodiment can be realized by following three steps:
S500a, the part primer coating coating beyond two opposite side border areas of described chemical treatment laminar surface, the conductive coating of substrate back coating simultaneously.
S600a, the substrate 1 that will be coated with priming paint carry out the priming paint hot setting, form primer coating.
S700a, at primer coating surface coating finish paint, form topcoat.
The product colour of the described coated metallic plate of the embodiment of the invention can be colors such as monochrome, metallochrome for being coated with as required.The product gloss of described coated metallic plate also can be according to the effect of needs of production coating for Gao Guang, half light, inferior light, pearly-lustre.
For the coated metallic plate of protecting the described coated metallic plate processing method of third embodiment of the invention to produce, can be after described coated metallic plate machine, step below increasing:
S800, at described topcoat 32 outer surface pasting protective films.
The described coated metallic plate processing method of third embodiment of the invention, owing to increased the step of coated face lacquer coat 32, therefore make that the coating metal of making has enough pliabilitys and extensibility, can satisfy the flawless bending requirement of 180 degree bendings, expanded the application of coated metallic plate.
The described coated metallic plate processing method of third embodiment of the invention, since the substrate back application the inorganic conductive coating of anti-the fingerprint arranged, and the front edge conduction, therefore, can satisfy the complete machine EMI performance test of product casings such as computer machine in conjunction with the electric conductivity of these two faces.
Relative second embodiment of the described coated metallic plate processing method of the third embodiment of the present invention, the coated metallic plate of making, because described dope layer 3 comprises primer coating 31 and topcoat 32, can better guarantee anti-pollution, chemical proofing, the decay resistance of described metallic plate like this.
The coated metallic plate that the described coated metallic plate processing method of third embodiment of the invention is made, specifically comprise the chemical treatment layer 2 of substrate 1, the covering of described substrate front side, the conductive coating 4 that described substrate 1 back side covers, and the primer coating 31 and the topcoat 32 that cover described chemical treatment layer 2 partial width, described topcoat 32 covers described primer coating 31, and the width of described primer coating 31 equals described topcoat width 32.And the two side areas of described chemical treatment layer 2 width does not all cover described primer coating 31 and topcoat 32.
The coated metallic plate that the described coated metallic plate processing method of third embodiment of the invention is made, substrate 1 thickness can be for 0.2 to 1.5mm, chemical treatment layer 2 thickness are less than 1um, primer coating 31 thickness can be for 6 to 20um, topcoat 32 can adopt the high temperature varnish coating, thickness is specifically as follows 6 to 20um, and conductive coating 4 thickness can adopt the electrically-conducting paint of anti-fingerprint coating, are specifically as follows 1 to 3um.In order to protect described coated metallic plate, can be at topcoat 32 outer surface pasting protective films 5.Diaphragm 5 can be for 30 to 60um, and concrete diaphragm 5 can be transparent protective film.
Certainly, for simplified processing process, described primer coating 31 and topcoat 32 can be selected the primer coating 31 and the topcoat 32 of the direct application respective width of applicator roll of corresponding length directly according to the needs of actual product.
The edge line position of coated metallic plate dope layer 3 width of the present invention can be adjusted according to processing request.To produce the host computer product is example, and the width of described dope layer 3 equals the width of host computer front or side.
The invention provides a kind of coating metal board processing device, be used to process the coated metallic plate of shell of the products such as computer housing that carry out Electromagnetic Interference Test of to satisfy the demand.
Referring to Fig. 8, this figure is the described coating metal board processing device of a first embodiment of the invention structure chart.
The described coating metal board processing device of first embodiment of the invention is used for the processing metal plate.Described process equipment comprises: have first applicator roll 703 that applies described dope layer and the roller (not shown) that is used to be coated with described coated metallic plate back side conductive coating, and the location pulley 705 that is used to locate described metallic plate.
The applicator roll length of first applicator roll 703 is less than described coated metallic plate 701 width, and equals the width of predetermined dope layer 701a
The length of the roller of described coated metallic plate 701 back side conductive coatings equals described coated metallic plate 701 width.
Location pulley 705 specifically can pass through fixed mount 704 and stationary table.Location pulley 705 is specifically as follows 2, lays respectively at the position, two side end faces of described coated metallic plate 701, and two location pulleys 705 are by fixed mount 704 and stationary table.
Because the described coating metal board processing device of first embodiment of the invention, has first applicator roll 703 that is used to be coated with described dope layer, can can realize exposing described chemical treatment layer 2 width two side areas in the chemical treatment layer 2 surface coating of described coated metallic plate; But also has the roller that is used to be coated with described coated metallic plate 701 back side conductive coatings, when can satisfy the coating of first applicator roll 703 at substrate 1 back side coating conductive coating 4, two specific characters that conduct electricity at the front edge conduction that the coated metallic plate that uses the described coating metal board processing device of the embodiment of the invention to machine so just has and the back side.After described coated metallic plate is being processed into specific product, can satisfy the requirement of Electromagnetic Interference Test.
Described first applicator roll 703 can comprise the home roll that applies described dope layer and all join with described home roll both sides and coaxial with described home roll two auxilliary rollers; Described auxilliary roller diameter is less than described home roll diameter.Just can with the applying coating on it on described coated metallic plate, just there be application to coat on the described coated metallic plate of auxilliary roller correspondence when home roll runs well like this.
The invention provides also a kind of coating metal board processing device, be used to process the coated metallic plate of shell of the products such as computer housing that carry out Electromagnetic Interference Test of to satisfy the demand.
Referring to Fig. 9, this figure is the described coating metal board processing device of a second embodiment of the invention structure chart.
The described two kinds of coating metal board processing devices of the embodiment of the invention are used for the processing metal plate.
The described coating metal board processing device of second embodiment of the invention comprises: second applicator roll 803 with the described dope layer of coating, it is parallel with described second applicator roll, 803 axis to be arranged on described second applicator roll, 803 1 ends, and two scrapers 802 that are used to remove described applicator roll coating between described applicator roll 803 and described coated metallic plate 801, with equal the roller (not shown) that described coated metallic plate 801 width are used to be coated with described coated metallic plate 801 back side conductive coatings, and be used to install the knife rest 804 of described scraper 802 and the location pulley 805 of the described coated metallic plate 801 in location that is installed together with described knife rest 804.
Distance is the width of coated metallic plate 801 required dope layer 801a between described two scrapers 802, and promptly the width marker of Fig. 9 floating coat metallic plate promptly is scheduled to the width marker of dope layer 801a.
Knife rest 804, location pulley 805 and two scrapers 802 are one, between do not have relative motion.By location pulley 805, with coated metallic plate 801 is that benchmark positions, knife rest 804 with coated metallic plate 801 swing and same moved further, realize the accurate location of scraper 802 on coated metallic plate 801, thereby make scraper 802 that the coating of assigned address on second applicator roll 803 is scraped off, realize that technology is reserved in the part coating of the described coated metallic plate of the embodiment of the invention.
Location pulley 805 specifically can pass through knife rest 804 and stationary table.Location pulley 805 is specifically as follows 2, lays respectively at the position, two side end faces of described coated metallic plate 801, and two location pulleys 705 are that benchmark positions with coated metallic plate 801, by fixed mount 704 and stationary table.
When using special edge to stay the limit frock, at first to calculate according to the width of coated metallic plate 801 and the sheet material specification of customer requirement, make the position of two scrapers 802 on the frock, need to adjust the angle of scraper 802 simultaneously, control scrapes the flow direction of coating, avoids occurring when coating the long-pending limit of coating.Scraper 802 Material Selection are particular importance also, select the suitable material of material hardness, guarantee that material can not damage the coated metallic plate 801 and second applicator roll 803, will guarantee also simultaneously that coating is scraped must be clean, guarantees that all sites at coated metallic plate 801 edges all conducts electricity.
Described second applicator roll 803 runs well when being counterclockwise, and described scraper 802 can be arranged on described applicator roll 803 bottoms.
Described location pulley 805 has side-friction with described metallic plate 801, and described metallic plate 801 move left and right drive described location pulley 805 move left and right, thereby drives described scraper 802 move left and right by described knife rest 804.
The above only is a preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (14)
1, a kind of coated metallic plate processing method is characterized in that, said method comprising the steps of:
Chemical surface treatment is carried out in the front of substrate;
Substrate after the chemical surface treatment is carried out the surface baking, form the chemical treatment layer;
Part coating composition layer beyond two opposite side border areas of described chemical treatment laminar surface; The conductive coating of substrate back coating simultaneously.
2, coated metallic plate processing method according to claim 1 is characterized in that, before the step of chemical surface treatment is carried out in described front with substrate, comprising:
To carry out surface clean as the steel plate of substrate;
Substrate after cleaning is carried out dry tack free.
3, coated metallic plate processing method according to claim 1 is characterized in that, the part coating composition layer beyond two opposite side border areas of described chemical treatment laminar surface; The step of the conductive coating of substrate back coating simultaneously is specially:
Part primer coating coating beyond two opposite side border areas of described chemical treatment laminar surface, the conductive coating of substrate back coating simultaneously;
The substrate 1 that has been coated with priming paint is carried out the priming paint hot setting, form primer coating;
At primer coating surface coating finish paint, form topcoat.
4, coated metallic plate processing method according to claim 1 is characterized in that, two opposite side of described chemical treatment laminar surface are specially two long limits of described substrate.
5, coated metallic plate processing method according to claim 1 is characterized in that, described two opposite side border area sizes are identical.
6, a kind of coating metal board processing device, be used for the processing metal plate, it is characterized in that, described process equipment comprises: first applicator roll with the described dope layer of coating, with the roller that is used to be coated with described coated metallic plate back side conductive coating, and the location pulley that is used to locate described metallic plate.
7, coating metal board processing device according to claim 6 is characterized in that, the length of described first applicator roll is less than described coated metallic plate width, and described first applicator roll is coated with the zone beyond two opposite side border areas of described coated metallic plate.
8, coating metal board processing device according to claim 6 is characterized in that, described first applicator roll comprises the home roll that applies described dope layer and all join with described home roll both sides and coaxial with described home roll two auxilliary rollers; Described auxilliary roller diameter is less than described home roll diameter.
According to the arbitrary described coating metal board processing device of claim 6 to 8, it is characterized in that 9, the length of the roller of described coated metallic plate back side conductive coating equals described coated metallic plate width.
According to the arbitrary described coating metal board processing device of claim 6 to 8, it is characterized in that 10, described location pulley is positioned at two opposite side border areas of described coated metallic plate.
11, a kind of coating metal board processing device, be used for the processing metal plate, it is characterized in that, described process equipment comprises: second applicator roll with the described dope layer of coating, it is parallel with the described second applicator roll axis to be arranged on described second applicator roll, one end, and two scrapers that are used to remove described applicator roll coating between described second applicator roll and described coated metallic plate, with the roller that is used to be coated with described coated metallic plate back side conductive coating, and be used to install the knife rest of described scraper and the location pulley of the described metallic plate in location that is installed together with described knife rest.
12, coating metal board processing device according to claim 11 is characterized in that, distance is described dope layer width between described two scrapers.
13, coating metal board processing device according to claim 11 is characterized in that, described location pulley is two, and lengthwise position is the position of corresponding described scraper respectively.
14, coating metal board processing device according to claim 11 is characterized in that, described second applicator roll runs well when being counterclockwise, and described scraper is arranged on the described second applicator roll bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100938346A CN101462104A (en) | 2008-04-30 | 2008-04-30 | Method and equipment for processing coated metallic plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100938346A CN101462104A (en) | 2008-04-30 | 2008-04-30 | Method and equipment for processing coated metallic plate |
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| CN101462104A true CN101462104A (en) | 2009-06-24 |
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| CNA2008100938346A Pending CN101462104A (en) | 2008-04-30 | 2008-04-30 | Method and equipment for processing coated metallic plate |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105450959A (en) * | 2015-12-31 | 2016-03-30 | 珠海拾比佰彩图板股份有限公司 | Integrated television backboard |
| CN107159510A (en) * | 2016-03-08 | 2017-09-15 | 住友化学株式会社 | The manufacture method of scraper plate, apparatus for coating and laminated clapboard |
| CN107509313A (en) * | 2017-07-20 | 2017-12-22 | 青岛海尔特种钢板研制开发有限公司 | A kind of preparation method of conductive PCM plate |
| CN107953638A (en) * | 2017-12-20 | 2018-04-24 | 浙江华正新材料股份有限公司 | One kind can punching press bending high intensity back veneer material and preparation method thereof |
| CN108515002A (en) * | 2018-03-09 | 2018-09-11 | 安徽墙煌彩铝科技有限公司 | Two-sided decoration color coated aluminum plate preparation process |
| WO2020209858A1 (en) * | 2019-04-11 | 2020-10-15 | Hewlett-Packard Development Company, L.P. | Covers for electronic devices |
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2008
- 2008-04-30 CN CNA2008100938346A patent/CN101462104A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105450959A (en) * | 2015-12-31 | 2016-03-30 | 珠海拾比佰彩图板股份有限公司 | Integrated television backboard |
| CN107159510A (en) * | 2016-03-08 | 2017-09-15 | 住友化学株式会社 | The manufacture method of scraper plate, apparatus for coating and laminated clapboard |
| CN107509313A (en) * | 2017-07-20 | 2017-12-22 | 青岛海尔特种钢板研制开发有限公司 | A kind of preparation method of conductive PCM plate |
| CN107509313B (en) * | 2017-07-20 | 2020-07-24 | 青岛河钢复合新材料科技有限公司 | Manufacturing method of conductive PCM (phase change memory) board |
| CN107953638A (en) * | 2017-12-20 | 2018-04-24 | 浙江华正新材料股份有限公司 | One kind can punching press bending high intensity back veneer material and preparation method thereof |
| CN108515002A (en) * | 2018-03-09 | 2018-09-11 | 安徽墙煌彩铝科技有限公司 | Two-sided decoration color coated aluminum plate preparation process |
| WO2020209858A1 (en) * | 2019-04-11 | 2020-10-15 | Hewlett-Packard Development Company, L.P. | Covers for electronic devices |
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