CN101458416A - Touching control panel and method for producing the same - Google Patents
Touching control panel and method for producing the same Download PDFInfo
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- CN101458416A CN101458416A CNA2007101987805A CN200710198780A CN101458416A CN 101458416 A CN101458416 A CN 101458416A CN A2007101987805 A CNA2007101987805 A CN A2007101987805A CN 200710198780 A CN200710198780 A CN 200710198780A CN 101458416 A CN101458416 A CN 101458416A
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- stilts
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Abstract
The invention discloses a method for manufacturing a touch panel, comprising the following steps: firstly, taking a first substrate which has a first electrode layer; forming a sealant around the edge of the first substrate to definite a closed zone; and then dropping dielectric materials into the closed zone; secondly, taking a second substrate which has a second electrode layer, gluing the first and the second substrates by the sealant and filling in the closed zone with dielectric materials to form a dielectric layer between the first and the second substrates. The touch panel has good quality and the manufacturing method of the touch panel has high process rate.
Description
Technical field
The invention relates to a kind of touch panel structure provided and manufacture method, and particularly relevant for a kind of capacitance type touch-control panel and manufacture method thereof.
Background technology
Because semiconductor industry is flourishing day by day, mobile phone (Mobile Phone), personal digital assistant (Personal Digital Assistant), mobile computer (Notebook), multimedia player (Multi Media Player) and Tablet PC digitization tools such as (Planet Computer) develop towards direction more convenient, multi-functional and attractive in appearance invariably.In recent years, fast development and application along with infotech, wireless mobile communication and information household appliances, in order to reach more convenient, lighter and handyizatioier of volume and more humane purpose, many information products change into and use contact panel (Touch Panel) as input media by input medias such as traditional keyboard or mouses.
Fig. 1 is known a kind of contact panel.Please refer to Fig. 1, contact panel 100 for example is a capacitance type touch-control panel, it comprise first substrate 110, second substrate 120 and be sandwiched in first substrate 110 and second substrate 120 between dielectric layer 130.Have first electrode layer 112 on first substrate 110, and second substrate 120 has the second electrode lay 122.First electrode layer 112 can be made up of a plurality of strip shaped electric poles (strip electrode) respectively with the second electrode lay 122, and to stretch direction different and interlaced first electrode layer 112 and the edge of the second electrode lay 122.As user during with finger or object (as pointer etc.) contact contact panel 100, contact panel 100 can produce an electrical change (as pressure drop or electric current variation etc.) on finger or pointer institute position contacting, this change on electrically can be converted to a controlling signal, and then makes various functions such as information products are play, shown, calculating.
In known contact panel 100, how can make dielectric layer 130 with optical cement, constitute a touch control display panel so that combine with display panel.The thickness of dielectric layer 130 can determine the capacitance between first electrode layer 112 and the second electrode lay 122, also influences the characteristic of contact panel 100 simultaneously.Therefore, dielectric layer 130 must be kept fixing thickness between first electrode layer 112 and the second electrode lay 122, and better is to thicken along with different design requirements or attenuation.Yet the optical cement of thick-layer is made and is difficult for, thereby has limited the thickness of dielectric layer 130.In addition, when first substrate 110 and second substrate 120 were hard substrate such as glass substrate, regular meeting produced bubble in the middle of the process that first substrate 110 and second substrate 120 are fitted.Therefore, contact panel 100 can't be kept good quality, and particularly, when the size of contact panel 100 increased, these problems were with even more serious.
Summary of the invention
The method for making that the purpose of this invention is to provide a kind of contact panel is to improve the making yield of contact panel.
Another object of the present invention provides a kind of contact panel, produces the problem of bubble when wayward and two substrates is fitted with the medium thickness that solves contact panel between the substrate.
The present invention proposes a kind of manufacture method of contact panel.At first, provide first substrate, this first substrate has first electrode layer.Moreover, on first substrate, forming frame glue (Sealant), frame glue centers on the edge of first substrate to define the closed region.Then, in the closed region, splash into dielectric material.Then, provide second substrate, wherein second substrate has a second electrode lay.In addition, with first substrate and second baseplate-laminating, and make dielectric material fill up the closed region by frame glue, to form a dielectric layer between first substrate and second substrate.
In one embodiment of this invention, the method of above-mentioned formation frame glue comprises carries out printing process, and wherein printing process comprises screen painting (screen printing), ink jet printing (Ink Jet Printing), lithography (offset printing), letterpress or intaglio printing (gravure printing).
In one embodiment of this invention, the method for above-mentioned formation frame glue comprises and carries out some glue processing procedures (dispensing process).
In one embodiment of this invention, the manufacture method of above-mentioned contact panel is cured processing procedure (Solidation process) after more being included in first substrate and second baseplate-laminating, so that the frame adhesive curing.This curing process comprises thermal curing method, photocuring method, ultraviolet light thermal curing method or above-mentioned combination.
In one embodiment of this invention, the method for above-mentioned formation dielectric layer comprises and splashes into liquid dielectric material in the closed region and solidify liquid dielectric material.
In one embodiment of this invention, the manufacture method of above-mentioned contact panel more is included in first substrate or second substrate forms a plurality of stilts (support) on one of them at least, and these stilts are arranged in the closed region.In addition, frame glue for example can form simultaneously with stilt.
In one embodiment of this invention, the method for above-mentioned formation stilt comprises that a plurality of spherical stilts of distribution (ball support) are in the closed region.In addition, the method that forms stilt also can be to carry out a gold-tinted processing procedure (lithography process), or carries out some glue processing procedures to form stilt.Furthermore, the method that forms stilt can also be to carry out a printing process to form, and wherein printing process comprises screen painting, ink jet printing, lithography, letterpress or intaglio printing.
The present invention proposes a kind of contact panel in addition, comprises first substrate, second substrate, frame glue and dielectric layer.First substrate has first electrode layer, and second substrate has the second electrode lay.Frame glue is disposed between first substrate and second substrate, and crosses the closed region jointly with first substrate and second substrate.Simultaneously, dielectric layer is disposed in the closed region.
In one embodiment of this invention, the first above-mentioned electrode layer comprises a plurality of strip shaped electric poles.
In one embodiment of this invention, above-mentioned the second electrode lay comprises a plurality of strip shaped electric poles.
In one embodiment of this invention, above-mentioned contact panel more comprises a plurality of stilts, and it is disposed in the closed region.These stilts can be a plurality of column supports or a plurality of spherical stilt.When stilt was column support, its material comprised photoresist, photo-curing material or thermosetting material.When stilt was spherical stilt, its material comprised silicon dioxide.
In one embodiment of this invention, the first above-mentioned substrate for example is between first electrode layer and dielectric layer.
In one embodiment of this invention, the first above-mentioned electrode layer can be between first substrate and dielectric layer.
In one embodiment of this invention, the second above-mentioned substrate can be between the second electrode lay and dielectric layer.
In one embodiment of this invention, above-mentioned the second electrode lay more can be between this second substrate and this dielectric layer.
In one embodiment of this invention, the material of above-mentioned dielectric layer comprises a photo-curing material, a thermosetting material or a ultraviolet light thermosetting material.
The present invention because of by a frame glue with two baseplate-laminatings to make contact panel, help to keep the distance between two substrates.Specifically, in the contact panel, but the thickness of mat frame glue change to adjust the capacitance size between first electrode layer and the second electrode lay, therefore the design of contact panel of the present invention is more flexible.In addition, the present invention can also form a plurality of stilts in the dielectric layer between two substrates, so when the size of contact panel increases, can further make contact panel of the present invention have good quality by these stilts so that the distance between the two substrates is kept necessarily.
For above and other objects of the present invention, feature and advantage can be become apparent, especially exemplified by preferred embodiment, and cooperate appended graphicly, be described in detail below.
Description of drawings
Fig. 1 is the synoptic diagram of known a kind of contact panel.
Fig. 2 A～Fig. 2 D is the three-dimensional process flow diagram of method for making of the contact panel of one embodiment of the invention.
Fig. 3 A～Fig. 3 D is the section process flow diagram of method for making of the contact panel of one embodiment of the invention.
Fig. 4 is the synoptic diagram of the contact panel of one embodiment of the invention.
The primary clustering symbol description
100,200: contact panel
110,210: the first substrates
112,212: the first electrode layers
120,240: the second substrates
122,242: the second electrode lay
130,230: dielectric layer
220: frame glue
222: stilt
232: liquid dielectric material
P: closed region
Embodiment
Contact panel has multiple different kenel, and with capacitance type touch-control panel, it is to dispose the dielectric layer of suitable thickness between two electrode layers to keep fixing capacitance between two electrode layers.Yet, by prior art as can be known, in this type of contact panel, the thickness of dielectric layer be subject to dielectric material self characteristics such as optical cement and can't be unscrupulous thicken.Simultaneously, when the size of contact panel constantly increased, the thickness of dielectric layer was wayward especially.Therefore, the present invention proposes frame glue is disposed between two substrates and makes contact panel at this, to keep the distance between the two substrates.The method for making and the contact panel of the present invention of contact panel of the present invention below will be proposed, so that spirit of the present invention to be described in the narration.Yet the following stated content is all enforcement example of the present invention, is not in order to limit the present invention.
Fig. 2 A～Fig. 2 D is the three-dimensional process flow diagram of method for making of the contact panel of one embodiment of the invention, and Fig. 3 A～Fig. 3 D is the section process flow diagram of method for making of the contact panel of one embodiment of the invention.Fig. 2 A～Fig. 2 D and Fig. 3 A～Fig. 3 D are corresponding step mutually, that is to say that Fig. 2 A illustrates with Fig. 3 A and is identical step, and Fig. 2 B and Fig. 3 B, Fig. 2 C and Fig. 3 C and Fig. 2 D and Fig. 3 D illustrate respectively and be identical step.
Please earlier with reference to Fig. 2 A and Fig. 3 A, provide first substrate 210, this first substrate 210 has first electrode layer 212.In the present embodiment, first substrate 210 for example is hard substrates such as glass substrate or silica substrate.First electrode layer 212 is formed by a plurality of strip shaped electric poles, and first electrode layer 212 also can be made up of the electrode block of a plurality of other geometric configuratioies on the practice.The material of first electrode layer 212 can be the oxide material of tool electric conductivity, for example indium tin oxide (Indium Tin Oxide, ITO) or indium-zinc oxide (Indium Zinc Oxide, IZO) etc.
Moreover, please on first substrate 210, form frame glue 220 simultaneously with reference to Fig. 2 B and Fig. 3 B, its center glue 220 is around the edge of first substrate 210, to define closed region P.The method that forms frame glue 220 comprises carries out printing process, and it for example is screen painting, ink jet printing, lithography, letterpress or intaglio printing.In addition, the method for formation frame glue 220 also can be to carry out some glue processing procedures.Specifically, the generation type of frame glue 220 is the edges that heat-curable glue, ultraviolet cured adhesive or ultraviolet heat-curable glue isocolloid material are formed at first substrate 210 with the printing or the mode of some glue processing procedure.In the present embodiment, the thickness of frame glue 220 can be along with different design requirements, and increase or reduce by the adjustment of processing procedure.
When forming frame glue 220, also can in the P of closed region, form a plurality of stilts 222.In other words, the formation method of stilt 222 can be to adopt printing or some glue processing procedure and make.Density and position that stilt 222 distributes can change along with different design requirements.For instance, when the size of first substrate 210 was big, the size that can form more a plurality of stilt 222, the first substrates 210 in the P of closed region was than hour then disposing more a spot of stilt 222 or not dispose stilt 222 in the P of closed region.In addition, stilt 222 can not made with frame glue 220 simultaneously yet, and is formed among the P of closed region in other making step.Furthermore, stilt 222 does not limit and will be made and be formed by printing or some glue processing procedure.In other embodiments, the method for making of stilt 222 also can be to scatter processing procedure with one, spheres such as glass bead, silica spheres are interspersed among among the P of closed region, or the patterning photoresistance is formed among the P of closed region with the usefulness as clearance support 222 with a gold-tinted processing procedure.
Then, please refer to Fig. 2 C and Fig. 3 C, liquid dielectric material 232 is splashed in the P of closed region.This liquid dielectric material 232 for example is a liquid optical cement, and it can have the photocuring or the character of heat curing.Certainly, liquid dielectric material 232 also can be other material with photocuring or heat curing character.After the liquid dielectric material 232 among the P of closed region is cured, then can be to form among the P of closed region dielectric layer (not illustrating among Fig. 2 C).Because liquid dielectric material 232 is to drop among the closed region P that is crossed by frame glue 220, and the welcome adjustment of the thickness of frame glue 220, so the use amount of liquid dielectric material 232 also can be along with change.In other words, can have different-thickness after liquid dielectric material 232 is cured and make the process design of present embodiment have more elasticity.
Then, please refer to Fig. 2 D and Fig. 3 D, second substrate 240 is provided and by frame glue 220 first substrate 210 and second substrate 240 is fitted, wherein second substrate 240 has a second electrode lay 242.Simultaneously, the material of second substrate 240 for example is identical with first substrate 210, and the second electrode lay 242 can be that a plurality of strip shaped electric poles is formed, and also can be made up of the electrode of other shape.On the practice, the bearing of trend of the strip shaped electric poles on first substrate 210 can be interlaced with the bearing of trend of strip shaped electric poles on second substrate 240, and just 242 of first electrode layer 212 and the second electrode lays have the part area overlapped.First electrode layer 212 and the second electrode lay 242 overlapping parts for example can form an electric capacity and can be used as an induction control zone.
In detail, the method for fit first substrate 210 and second substrate 240 comprises earlier that first substrate 210 and 240 groups of second substrates is upright, and carries out a curing process so that frame glue 220 is solidified.At this moment, in first substrate 210 and 240 groups of upright processes of second substrate, the liquid dielectric material 232 that drips in the P of closed region can fill up closed region P.In other words, liquid dielectric material 232 can be sealed among the P of closed region by frame glue 220.
On the practice, the curing process that curing frame glue 220 is carried out can be decided on the material of frame glue 220, if the material of frame glue 220 is heat-curable glue, the method for then solidifying frame glue 220 can be thermal curing method or ultraviolet light thermal curing method.In other words, if frame glue 220 is made with the photocuring material, the method for then solidifying frame glue 220 for example is the photocuring processing procedure.When first substrate 210 and second substrate 240 are fitted, frame glue 220 is arranged as supporting, even therefore first substrate 210 is all hard substrate with second substrate 240, for example glass substrate also has been not easy the bubble generation in this step.That is method for making of the present invention has higher process rate.
Because stilt 222 can be to adopt the material identical with frame glue 220 to be made, also can be when therefore solidifying frame glue 220 with stilt 222 curing.If stilt 222 is not to adopt the material identical with frame glue 220 to be made, then can be after stilt 222 be formed at closed region P, just after the step of Fig. 2 B and Fig. 3 B with stilt 222 curing soon.In addition, if liquid dielectric material 232 has photocuring character, and frame glue 220 is to adopt the photocuring material to make, and when needing solidify with the photocuring method, liquid dielectric material 232 can be cured in identical photocuring processing procedure simultaneously with frame glue 220.In like manner, if liquid dielectric material 232 has heat curing character, and frame glue 220 is to adopt the heat curing material to make, and liquid dielectric material 232 also can be cured in identical heat curing processing procedure with frame glue 220.Certainly, liquid dielectric material 232 more can be to be cured with different curing process in different steps with frame glue 220.
Contact panel such as Fig. 4 via the above steps made illustrate.Please refer to Fig. 4, contact panel 200 comprises first substrate 210, frame glue 220, dielectric layer 230 and second substrate 240.First substrate 210 has first electrode layer 212, and second substrate 240 has the second electrode lay 242.Frame glue 220 is disposed between first substrate 210 and second substrate 240, and crosses closed region P jointly with first substrate 210 and second substrate 240.Simultaneously, dielectric layer 230 is made after being solidified by above-mentioned liquid dielectric material 232, and it is disposed among the P of closed region.In addition, contact panel 200 more comprises a plurality of stilts 222 that are disposed among the P of closed region.Yet, in other embodiments, can stilt 222 be disposed among the P of closed region yet.
In the contact panel 200, first substrate 210 and second substrate 240 fit together by frame glue 220, and therefore, the distance of first substrate 210 and second substrate 240 can be by the thickness of frame glue 220 with decision.When if the size of contact panel 200 increases, contact panel 200 can also support by stilt 222 and make the distance of first substrate 210 and second substrate 240 keep fixing.Therefore, in the contact panel 200 of the present invention, the distance between first electrode layer 212 and the second electrode lay 242 can be roughly the same in each zone, and make contact panel 200 all can keep certain capacitance in each zone.That is to say that contact panel 200 of the present invention has good quality.
In addition, if select the material of the liquid optical cement of good optical properties for use, when then a contact panel 200 and a display panel attach, can make touch-control display panel that superior display quality is arranged as dielectric layer 230.In addition, contact panel 200 can also have different designs.For example, first electrode layer 212 can be disposed between first substrate 210 and the dielectric layer 230 as Fig. 4, and first substrate 210 is disposed between first electrode layer 212 and the dielectric layer 230.Same, the second electrode lay 242 can be between second substrate 240 and dielectric layer 230, and also can be that second substrate 240 is between the second electrode lay 242 and dielectric layer 230 among other embodiment.In other words, electrode layer (212 or 242) can be disposed at the same side or the relative both sides of substrate (210 or 240) simultaneously with dielectric layer 230.
In sum, contact panel of the present invention and preparation method thereof has the advantage of the following stated at least.At first, in the method for making of contact panel of the present invention, be difficult between two substrates, producing bubble during by frame glue, and make contact panel of the present invention have higher process rate first substrate and second baseplate-laminating.Among the present invention, the thickness of frame glue can change to some extent along with different designs, and therefore in the contact panel of the present invention, the thickness of dielectric layer can have different variations, and makes the design of contact panel have bigger elasticity.In addition, the present invention forms a plurality of stilts keeping the distance between the two substrates in contact panel, and makes contact panel more can keep good quality.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the claim person of defining.
Claims (24)
1, a kind of manufacture method of contact panel is characterized in that, comprising:
One first substrate is provided, and this first substrate has one first electrode layer;
Form a frame glue on this first substrate, this frame glue centers on the edge of this first substrate to define a closed region;
In this closed region, splash into a dielectric material; And
One second substrate is provided and by this frame glue with this first substrate and this second baseplate-laminating, and make this dielectric material fill up this closed region and form a dielectric layer between this first substrate and this second substrate, wherein this second substrate has a second electrode lay.
2, the manufacture method of contact panel as claimed in claim 1 is characterized in that: the method that wherein forms this frame glue comprises carries out a printing process or some glue processing procedure.
3, the manufacture method of contact panel as claimed in claim 2 is characterized in that: this printing process comprises screen painting, ink jet printing, lithography, letterpress or intaglio printing.
4, the manufacture method of contact panel as claimed in claim 1 is characterized in that: after this first substrate and this second baseplate-laminating, more comprise and carry out a curing process, so that this frame adhesive curing.
5, the manufacture method of contact panel as claimed in claim 4 is characterized in that: this curing process comprises thermal curing method, photocuring method, ultraviolet light thermal curing method or above-mentioned combination.
6, the manufacture method of contact panel as claimed in claim 1 is characterized in that: the method that wherein forms this dielectric layer more comprises solidifies this dielectric material in this closed region.
7, the manufacture method of contact panel as claimed in claim 1 is characterized in that: more be included in this first substrate or this second substrate and form a plurality of stilts on one of them at least, and those stilts are arranged in this closed region.
8, the manufacture method of contact panel as claimed in claim 7 is characterized in that: this frame glue and those stilts form simultaneously.
9, the manufacture method of contact panel as claimed in claim 7 is characterized in that: the method that wherein forms those stilts comprises that carrying out one scatters processing procedure, so that a plurality of spherical stilts are interspersed among in this closed region.
10, the manufacture method of contact panel as claimed in claim 7 is characterized in that: the method that wherein forms those stilts comprises carries out a gold-tinted processing procedure, some glue processing procedure or printing process.
11, the manufacture method of contact panel as claimed in claim 10 is characterized in that: this printing process comprises screen painting, ink jet printing, lithography, letterpress or intaglio printing.
12, a kind of contact panel is characterized in that, comprising:
One first substrate has one first electrode layer;
One second substrate has a second electrode lay;
One frame glue is disposed between this first substrate and this second substrate, and crosses a closed region jointly with this first substrate and this second substrate; And
One dielectric layer is disposed in this closed region.
13, contact panel as claimed in claim 12 is characterized in that: this first electrode layer comprises a plurality of strip shaped electric poles.
14, contact panel as claimed in claim 12 is characterized in that: this second electrode lay comprises a plurality of strip shaped electric poles.
15, contact panel as claimed in claim 12 is characterized in that: more comprise a plurality of stilts, be disposed in this closed region.
16, contact panel as claimed in claim 15 is characterized in that: those stilts are a plurality of column supports.
17, contact panel as claimed in claim 16 is characterized in that: the material of those column supports be a photoresist, a photo-curing material and a thermosetting material one of them.
18, contact panel as claimed in claim 15 is characterized in that: those stilts are a plurality of spherical stilts.
19, contact panel as claimed in claim 18 is characterized in that: the material of those spherical stilts comprises silicon dioxide or glass.
20, contact panel as claimed in claim 12 is characterized in that: this first substrate is between this first electrode layer and this dielectric layer.
21, contact panel as claimed in claim 12 is characterized in that: this first electrode layer is between this first substrate and this dielectric layer.
22, contact panel as claimed in claim 12 is characterized in that: this second substrate is between this second electrode lay and this dielectric layer.
23, contact panel as claimed in claim 12 is characterized in that: this second electrode lay is between this second substrate and this dielectric layer.
24, contact panel as claimed in claim 12 is characterized in that: the material of this dielectric layer be a photo-curing material, a thermosetting material and a ultraviolet light thermosetting material one of them.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101987805A CN101458416A (en) | 2007-12-12 | 2007-12-12 | Touching control panel and method for producing the same |
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2007101987805A CN101458416A (en) | 2007-12-12 | 2007-12-12 | Touching control panel and method for producing the same |
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| CN101458416A true CN101458416A (en) | 2009-06-17 |
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| CNA2007101987805A Pending CN101458416A (en) | 2007-12-12 | 2007-12-12 | Touching control panel and method for producing the same |
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| CN101950226A (en) * | 2010-08-27 | 2011-01-19 | 天马微电子股份有限公司 | Capacitive touch screen and manufacturing process thereof |
| CN101989157A (en) * | 2009-08-03 | 2011-03-23 | 义隆电子股份有限公司 | High-sensitivity capacitance type touch assembly and manufacturing procedure thereof |
| CN102541340A (en) * | 2010-12-15 | 2012-07-04 | 宏碁股份有限公司 | Touch display structure and manufacturing method thereof |
| CN102662504A (en) * | 2012-02-29 | 2012-09-12 | 南京瀚宇彩欣科技有限责任公司 | A touch control device |
| CN102991092A (en) * | 2012-12-13 | 2013-03-27 | Tcl显示科技（惠州）有限公司 | Method for adhering touch screen and display panel |
| CN103440074A (en) * | 2013-07-18 | 2013-12-11 | 苏州触动电子科技有限公司 | Manufacturing process of projection type capacitive touch screen |
| CN103782201A (en) * | 2011-09-07 | 2014-05-07 | 应用材料公司 | Method and system for manufacturing a transparent body for use in a touch panel |
| CN104169084A (en) * | 2012-05-22 | 2014-11-26 | 优志旺电机株式会社 | Method for laminating works and touch panel |
| CN105093582A (en) * | 2015-08-12 | 2015-11-25 | 小米科技有限责任公司 | Method and device for detecting pressure in mobile terminal |
| CN105677098A (en) * | 2016-01-05 | 2016-06-15 | 京东方科技集团股份有限公司 | Touch screen and touch device |
| WO2017024727A1 (en) * | 2015-08-12 | 2017-02-16 | 小米科技有限责任公司 | Liquid crystal display screen and mobile terminal |
| CN107329640A (en) * | 2017-07-04 | 2017-11-07 | 深圳市志凌伟业技术股份有限公司 | A kind of capacitance touch screen preparation method |
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| CN101989157A (en) * | 2009-08-03 | 2011-03-23 | 义隆电子股份有限公司 | High-sensitivity capacitance type touch assembly and manufacturing procedure thereof |
| CN101950226A (en) * | 2010-08-27 | 2011-01-19 | 天马微电子股份有限公司 | Capacitive touch screen and manufacturing process thereof |
| CN102541340A (en) * | 2010-12-15 | 2012-07-04 | 宏碁股份有限公司 | Touch display structure and manufacturing method thereof |
| CN103782201A (en) * | 2011-09-07 | 2014-05-07 | 应用材料公司 | Method and system for manufacturing a transparent body for use in a touch panel |
| CN102662504A (en) * | 2012-02-29 | 2012-09-12 | 南京瀚宇彩欣科技有限责任公司 | A touch control device |
| CN102662504B (en) * | 2012-02-29 | 2015-02-18 | 南京瀚宇彩欣科技有限责任公司 | A touch control device |
| US9046945B2 (en) | 2012-02-29 | 2015-06-02 | Hannstar Display (Nanjing) Corp. | Touch control device |
| CN104169084B (en) * | 2012-05-22 | 2016-01-06 | 优志旺电机株式会社 | The applying method of workpiece and touch panel |
| CN104169084A (en) * | 2012-05-22 | 2014-11-26 | 优志旺电机株式会社 | Method for laminating works and touch panel |
| CN102991092A (en) * | 2012-12-13 | 2013-03-27 | Tcl显示科技（惠州）有限公司 | Method for adhering touch screen and display panel |
| CN103440074A (en) * | 2013-07-18 | 2013-12-11 | 苏州触动电子科技有限公司 | Manufacturing process of projection type capacitive touch screen |
| CN105093582A (en) * | 2015-08-12 | 2015-11-25 | 小米科技有限责任公司 | Method and device for detecting pressure in mobile terminal |
| WO2017024727A1 (en) * | 2015-08-12 | 2017-02-16 | 小米科技有限责任公司 | Liquid crystal display screen and mobile terminal |
| US10310316B2 (en) | 2015-08-12 | 2019-06-04 | Xiaomi Inc. | Liquid crystal display panel and mobile terminal |
| CN105677098A (en) * | 2016-01-05 | 2016-06-15 | 京东方科技集团股份有限公司 | Touch screen and touch device |
| CN105677098B (en) * | 2016-01-05 | 2018-09-11 | 京东方科技集团股份有限公司 | A kind of touch screen and touch control device |
| CN107329640A (en) * | 2017-07-04 | 2017-11-07 | 深圳市志凌伟业技术股份有限公司 | A kind of capacitance touch screen preparation method |
| CN107479774A (en) * | 2017-07-04 | 2017-12-15 | 深圳市志凌伟业技术股份有限公司 | A kind of large-scale touch-screen preparation method |
| CN107589586A (en) * | 2017-09-26 | 2018-01-16 | 京东方科技集团股份有限公司 | Color membrane substrates, display panel, the preparation method of display device and color membrane substrates |
| CN110045867A (en) * | 2019-03-25 | 2019-07-23 | 深圳市华星光电半导体显示技术有限公司 | Touch-control display panel and touch control display apparatus |
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