CN101445392A - Graphite matrix flawless TaC coating and manufacturing method thereof - Google Patents

Graphite matrix flawless TaC coating and manufacturing method thereof Download PDF

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CN101445392A
CN101445392A CNA2008101867992A CN200810186799A CN101445392A CN 101445392 A CN101445392 A CN 101445392A CN A2008101867992 A CNA2008101867992 A CN A2008101867992A CN 200810186799 A CN200810186799 A CN 200810186799A CN 101445392 A CN101445392 A CN 101445392A
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coating
sic
gas
deposition
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李国栋
熊翔
张红波
黄伯云
陈招科
孙威
王雅雷
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Central South University
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Abstract

The invention discloses a graphite matrix flawless TaC coating and a manufacturing method thereof. A tie coat is deposited on a graphite matrix. A TaC main coating is deposited on the outer layer of the tie coat. The tie coat is composed of a SiC-TaC codeposition coating or compounded by two transition layers of the SiC-TaC codeposition coating and a SiC-TaC laminated coating. When the tie coat is compounded by two transition layers of the SiC-TaC codeposition coating and the SiC-TaC laminated coating, the SiC-TaC codeposition coating serves as a first transition layer, and the SiC-TaC laminated coating serves as a second transition layer; and then the deposition of the tie coat is ended; or the SiC-TaC codeposition coating and the SiC-TaC laminated coating are alternatively deposited many times. Good TaC coating which has small heat stress, no macroscopic cracking, corrosion-resistance, and good thermal stability is deposited out of the surface of the graphite material. The method is suitable for preparing graphite substrate, graphite crucible, graphite windpipe, graphite guide shell coating in the crystal and semiconductor production, protecting and cleaning coating such as antisepsis, anti-pollution, anti-infiltration, anti-oxidation of graphite parts in other various hot environments.

Description

一种石墨基体无裂纹TaC涂层及其制造方法 A kind of crackless TaC coating on graphite substrate and its manufacturing method

技术领域 technical field

本发明涉及一种石墨基体无裂纹TaC涂层,本发明还涉及该石墨基体无裂纹TaC涂层的制造方法,属于晶体、半导体材料生产制备领域,主要用于晶体、半导体生产用石墨等炭素材料或部件的高性能涂层的制备。The invention relates to a TaC coating without cracks on graphite substrates. The invention also relates to a method for manufacturing the TaC coating without cracks on graphite substrates. It belongs to the field of production and preparation of crystals and semiconductor materials, and is mainly used for carbon materials such as graphite for crystals and semiconductor production. Or the preparation of high-performance coatings for components.

技术背景technical background

晶体、半导体生产用石墨材料是指晶体、半导体生产用的基座、坩埚、发热体、导流筒、操作手、工装石墨等高温高纯石墨材料或部件,它的纯度和化学稳定性等性能直接关系到半导体材料的纯度、性能和品质,因而是晶体、半导体生产的关键材料。由于石墨中的挥发性气体或晶体、半导体生产过程与石墨反应气体,对晶体、半导体的性能和品质产生重大的影响,国际上通用的作法是采用密封性能良好的高温耐腐蚀、抗侵蚀涂层技术,对石墨进行表面改性,减少或消除石墨对晶体、半导体成分、结构和性能的影响,从而达到对晶体、半导体成分、性能的精确控制,提高材料的品质。Graphite materials for crystal and semiconductor production refer to high-temperature and high-purity graphite materials or components such as bases, crucibles, heating elements, guide tubes, operators, tooling graphite, etc. for crystals and semiconductor production. Its purity and chemical stability and other properties It is directly related to the purity, performance and quality of semiconductor materials, so it is the key material for crystal and semiconductor production. Due to the volatile gases or crystals in graphite, semiconductor production process and graphite reaction gas, it has a significant impact on the performance and quality of crystals and semiconductors. The international common practice is to use high-temperature corrosion-resistant and anti-erosion coatings with good sealing performance Technology, to modify the surface of graphite, reduce or eliminate the influence of graphite on crystal, semiconductor composition, structure and performance, so as to achieve precise control of crystal, semiconductor composition and performance, and improve the quality of materials.

目前,国内外普遍采用的是化学气相沉积高性能SiC、BN涂层技术,一方面防止石墨中的挥发性气体对晶体、半导体的影响,提高了石墨的品质;另一方面,阻止了腐蚀性气体与石墨的反应及碳元素的气相扩散。然而,实践证明,对于一些要求更高的新型半导体或有高温腐蚀性气体时,进行SiC、BN涂层后石墨部件,仍然可能对生产的半导体产生较大的污染和较大的影响。如MOCVD生长技术制备GaN、GaAlN外延片时,受高温NH3、H2等气体的腐蚀,SiC中的碳及BN中的硼仍会以气态的形式(如CH4、SiH4、BH3)对GaN半导体的质量产生影响。因此,必须采用高温稳定性更高、抗腐蚀性更强的物质作为涂层材料,才能获得高品质GaN等半导体。At present, chemical vapor deposition high-performance SiC and BN coating technologies are commonly used at home and abroad. On the one hand, it prevents the volatile gases in graphite from affecting crystals and semiconductors, and improves the quality of graphite; on the other hand, it prevents corrosion. The reaction of gas and graphite and the gas phase diffusion of carbon. However, practice has proved that for some new types of semiconductors with higher requirements or high-temperature corrosive gases, graphite parts after SiC and BN coating may still cause greater pollution and greater impact on the produced semiconductors. For example, when GaN and GaAlN epitaxial wafers are prepared by MOCVD growth technology, the carbon in SiC and boron in BN will still be in gaseous form (such as CH 4 , SiH 4 , BH 3 ) due to the corrosion of high-temperature NH 3 , H 2 and other gases. have an impact on the quality of GaN semiconductors. Therefore, it is necessary to use substances with higher high temperature stability and stronger corrosion resistance as coating materials in order to obtain high-quality GaN and other semiconductors.

TaC熔点高(3880℃),在还原气氛下能耐受包括王水在内酸、碱、盐几乎所有物质的侵蚀(仅HF+HNO3复合酸除外),高温化学稳定性和耐腐蚀性远高于SiC、BN,且TaC与石墨具有良好的化学相容性,因而,TaC是性能优异的石墨涂层材料。目前,美国、日本已经开始研制TaC涂层用于GaN、GaAlN、AlN、GaAs、InP等新型晶体、半导体生产用石墨涂层。TaC has a high melting point (3880°C), and can withstand the erosion of almost all substances including aqua regia, acid, alkali, and salt in a reducing atmosphere (except for HF+HNO 3 complex acid), and its high-temperature chemical stability and corrosion resistance are far superior. It is higher than SiC and BN, and TaC has good chemical compatibility with graphite, so TaC is an excellent graphite coating material. At present, the United States and Japan have begun to develop TaC coatings for GaN, GaAlN, AlN, GaAs, InP and other new crystals and graphite coatings for semiconductor production.

如日本东洋炭素株式会社已开始了TaC涂层的研究,并于2006年在我国进行了有关单一TaC制备技术专利(碳化钽被覆碳材料及其制造方法,200680000138.5公开,未授权)的申请。For example, Japan Toyo Tanso Co., Ltd. has started the research on TaC coating, and in 2006, it applied for a single TaC preparation technology patent (tantalum carbide coated carbon material and its manufacturing method, published in 200680000138.5, not authorized) in my country in 2006.

但就目前的TaC制备技术来说,主要是单一TaC涂层的制备,它的缺点就是:涂层薄时,抗透气性不高,达不到应有的目的;而当涂层的厚度超过一定的值(如20μm)时,涂层易出现裂纹,从而失去对石墨的保护。主要原因是TaC涂层的热膨胀系数大,约为半导体用高纯石墨热膨胀系数的两倍以上,直接在高纯石墨进行TaC涂层,很容易出现裂纹而报废。必须解决TaC涂层与半导体石墨的热膨胀失配的问题,才能顺利实现高性能的TaC涂层对半导体石墨的表面改性。But as far as the current TaC preparation technology is concerned, it is mainly the preparation of a single TaC coating. Its disadvantages are: when the coating is thin, the air resistance is not high, and the desired purpose cannot be achieved; and when the thickness of the coating exceeds At a certain value (such as 20 μm), the coating is prone to cracks, thus losing the protection of graphite. The main reason is that the thermal expansion coefficient of TaC coating is large, which is more than twice that of high-purity graphite for semiconductors. If TaC coating is directly applied to high-purity graphite, it is easy to crack and be scrapped. The thermal expansion mismatch between TaC coating and semiconducting graphite must be solved in order to successfully realize the surface modification of semiconducting graphite with high performance TaC coating.

发明内容 Contents of the invention

本发明所要解决的第一个技术问题是提供一种表面沉积出热应力小、无宏观裂纹、耐腐蚀、热稳定性好的石墨基体无裂纹TaC涂层。The first technical problem to be solved by the present invention is to provide a crack-free TaC coating deposited on the surface of a graphite substrate with small thermal stress, no macro cracks, corrosion resistance and good thermal stability.

本发明所要解决的第二个技术问题是提供一种碳化物涂层不易开裂、热震性好、能提高整体涂层的抗腐蚀和抗扩散的能力的石墨基体无裂纹TaC涂层的制造方法。The second technical problem to be solved by the present invention is to provide a method for manufacturing a carbide coating without cracks on a graphite substrate, which has good thermal shock resistance and can improve the anti-corrosion and anti-diffusion capabilities of the overall coating. .

为了解决上述技术问题,本发明提供的石墨基体无裂纹TaC涂层,包括石墨基体,在所述的石墨基体上沉积过渡涂层,在所述的过渡涂层外层沉积一层TaC主涂层;所述的过渡涂层由SiC—TaC共沉积涂层构成,或由SiC—TaC共沉积涂层和SiC/TaC多层涂层两种过渡层复合构成;所述的过渡涂层为SiC—TaC共沉积涂层和SiC/TaC多层涂层两种过渡层复合构成时,所述的SiC—TaC共沉积涂层作为第一过渡层,所述的SiC/TaC多层涂层作为第二过渡层,然后结束过渡涂层的沉积或进行SiC—TaC共沉积涂层和SiC/TaC多层涂层交替沉积多次;SiC—TaC共沉积过渡涂层厚度为15~30μm,SiC/TaC多层涂层中SiC涂层厚度为0.05~5μm,TaC涂层厚度为0.05~5μm,纯TaC涂层厚度为5~1000μm。In order to solve the above-mentioned technical problems, the graphite substrate crack-free TaC coating provided by the present invention includes a graphite substrate, a transition coating is deposited on the graphite substrate, and a TaC main coating is deposited on the outer layer of the transition coating ; The transition coating is composed of SiC—TaC co-deposition coating, or is composed of two transition layers of SiC—TaC co-deposition coating and SiC/TaC multilayer coating; the transition coating is SiC— When the TaC co-deposition coating and the SiC/TaC multi-layer coating are composed of two transition layers, the SiC-TaC co-deposition coating is used as the first transition layer, and the SiC/TaC multi-layer coating is used as the second transition layer. transition layer, and then end the deposition of the transition coating or alternately deposit SiC-TaC co-deposition coating and SiC/TaC multi-layer coating multiple times; The thickness of the SiC coating in the layer coating is 0.05-5 μm, the thickness of the TaC coating is 0.05-5 μm, and the thickness of the pure TaC coating is 5-1000 μm.

本发明提供的石墨基体无裂纹TaC涂层的制造方法,其方法是:The manufacture method of graphite substrate without crack TaC coating provided by the invention, its method is:

(A)、SiC—TaC共沉积过渡涂层的制备工艺如下:石墨基体放入化学气相沉积炉中,抽真空到50Pa以下,加温到900~1500℃,同时通入碳源气、TaCl5、三氯甲基硅烷、氢气和稀释气体Ar气,其中TaCl5、三氯甲基硅烷由Ar气体带入,炉压保持100~5000Pa,调整气体比例使涂层中的TaC与SiC摩尔比例在0.15~7范围,SiC—TaC共沉积过渡涂层厚度为15~30μm;(A) The preparation process of SiC—TaC co-deposited transition coating is as follows: the graphite substrate is placed in a chemical vapor deposition furnace, vacuumed to below 50Pa, heated to 900-1500°C, and carbon source gas, TaCl 5 , trichloromethylsilane, hydrogen and Ar gas as a diluent gas, in which TaCl 5 and trichloromethylsilane are brought in by Ar gas, the furnace pressure is maintained at 100-5000Pa, and the gas ratio is adjusted so that the molar ratio of TaC and SiC in the coating is between 0.15-7 range, SiC-TaC co-deposition transition coating thickness is 15-30μm;

(B)、SiC/TaC多层过渡涂层的制备工艺如下:石墨基体放入化学气相沉积炉中,抽真空到50Pa以下,加温到900~1500℃,控制炉压为100~5000Pa,先通入三氯甲基硅烷、氢气和稀释气体Ar气,进行SiC涂层沉积,SiC涂层厚度为0.05~5μm;然后,终止SiC涂层的沉积,通入碳源气、TaCl5、氢气和稀释气体Ar气,进行TaC涂层沉积,TaC涂层厚度为0.05~5μm;终止TaC涂层的沉积,再次进行SiC涂层的沉积;再次终止SiC涂层的沉积,重新进行TaC涂层的沉积;多次重复,进行多层SiC/TaC涂层沉积;(B), the preparation process of SiC/TaC multilayer transition coating is as follows: the graphite substrate is placed in a chemical vapor deposition furnace, vacuumed to below 50Pa, heated to 900-1500°C, and the furnace pressure is controlled to 100-5000Pa. Introduce trichloromethylsilane, hydrogen and diluent gas Ar to carry out SiC coating deposition . Dilute the gas Ar gas to deposit TaC coating, the thickness of TaC coating is 0.05~5μm; stop the deposition of TaC coating, and proceed to the deposition of SiC coating again; stop the deposition of SiC coating again, and redo the deposition of TaC coating ; Repeatedly, multi-layer SiC/TaC coating deposition;

(C)、TaC主涂层的制备工艺如下:控制炉压为100~5000Pa,同时通入碳源气、TaCl5、氢气和稀释气体Ar气,进行纯TaC涂层沉积,TaC涂层厚度5~1000μm。(C) The preparation process of the TaC main coating is as follows: the furnace pressure is controlled at 100-5000Pa, and carbon source gas, TaCl 5 , hydrogen and Ar gas are introduced at the same time to deposit a pure TaC coating with a thickness of 5 ~1000μm.

所述的碳源气为CH4、C2H6、C3H8、C3H6、C2H4或C2H2气态碳氢化合物或可汽化碳氢化合物如液化气、天然气、环己烷或C6H6The carbon source gas is CH 4 , C 2 H 6 , C 3 H 8 , C 3 H 6 , C 2 H 4 or C 2 H 2 gaseous hydrocarbons or vaporizable hydrocarbons such as liquefied gas, natural gas, Cyclohexane or C6H6 .

采用上述技术方案的石墨基体无裂纹TaC涂层及其制造方法,为避免石墨等炭素材料表面的碳化物涂层易开裂、热震性差的缺点,利用多层涂层、梯度涂层、共沉积涂层材料的抗热震性,提出石墨基体无裂纹TaC复合涂层的制造方法。本发明将SiC涂层与TaC涂层有机复合,在沉积TaC主涂层之前,先沉积SiC与TaC组成的过渡层,既能够解决TaC涂层与半导体石墨的热膨胀失配的问题,还能提高整体涂层的抗腐蚀和抗扩散的能力。本发明的工艺技术简单,控制方便,主要是利用化学气相沉积涂层的可设计性原理与过渡涂层的制备原理,解决TaC与石墨等基体热膨胀失配的关键问题,使该涂层的具有较好的抗热冲击性能。该方法适应于制备半导体生产用的石墨基座、石墨气管、石墨导流筒、石墨坩埚TaC涂层及其他各种高温环境下使用的石墨等炭素部件防腐、防污染、防渗透、防氧化等防护与保洁涂层。The graphite substrate crack-free TaC coating and its manufacturing method adopting the above-mentioned technical scheme, in order to avoid the shortcomings of easy cracking and poor thermal shock resistance of the carbide coating on the surface of carbon materials such as graphite, multi-layer coating, gradient coating, co-deposition Thermal shock resistance of coating materials, and a method for manufacturing crack-free TaC composite coatings on graphite substrates was proposed. In the present invention, the SiC coating and the TaC coating are organically compounded, and the transition layer composed of SiC and TaC is deposited before depositing the TaC main coating, which can not only solve the problem of thermal expansion mismatch between the TaC coating and the semiconductor graphite, but also improve the The ability of the overall coating to resist corrosion and diffusion. The process technology of the present invention is simple, and control is convenient, mainly utilizes the principle of the designability of the chemical vapor deposition coating and the preparation principle of the transition coating to solve the key problem of thermal expansion mismatch between TaC and graphite and other substrates, so that the coating has Good thermal shock resistance. This method is suitable for the preparation of graphite bases, graphite gas pipes, graphite guide cylinders, graphite crucibles, TaC coatings for semiconductor production, and other graphite and other carbon parts used in various high-temperature environments for anti-corrosion, anti-pollution, anti-penetration, anti-oxidation, etc. Protective and cleaning coatings.

综上所述,本发明是一种碳化物涂层不易开裂、热震性好、能提高整体涂层的抗腐蚀和抗扩散的能力的石墨基体无裂纹TaC涂层的制造方法。In summary, the present invention is a method for manufacturing a carbide coating without cracks, good thermal shock resistance, and can improve the corrosion resistance and diffusion resistance of the overall coating.

附图说明 Description of drawings

图1是石墨基体无裂纹TaC涂层的制造流程方框图;Fig. 1 is a block diagram of the manufacturing process of a graphite substrate without a crack TaC coating;

图2是TaC-SiC共沉积涂层SEM照片;Figure 2 is a SEM photo of TaC-SiC co-deposition coating;

图3是TaC-SiC共沉积涂层与TaC/SiC多层过渡涂层SEM照片;Figure 3 is a SEM photo of TaC-SiC co-deposition coating and TaC/SiC multilayer transition coating;

图4是有TaC-SiC共沉积和TaC/SiC多层复合过渡涂层的TaC涂层表面SEM照片;Fig. 4 is the SEM photo of the TaC coating surface with TaC-SiC co-deposition and TaC/SiC multilayer composite transition coating;

图5是有TaC-SiC共沉积和TaC/SiC多层复合过渡涂层的TaC涂层断面SEM照片;Figure 5 is a SEM photo of the TaC coating section with TaC-SiC co-deposition and TaC/SiC multilayer composite transition coating;

图6是有多个TaC-SiC共沉积和多个TaC/SiC多层复合过渡涂层的TaC涂层SEM照片。Figure 6 is a SEM photo of a TaC coating with multiple TaC-SiC co-depositions and multiple TaC/SiC multilayer composite transition coatings.

具体实施方式 Detailed ways

现结合附图对本发明做进一步描述。The present invention will be further described now in conjunction with accompanying drawing.

实施例1:Example 1:

工艺流程参见图1,取密度高于1.80g/cm3高纯石墨为基体材料,切割成Φ50mm×7mm的试样,先后用200#、400#、1000#氧化铝耐水砂纸进行打磨、抛光,用超声波洗涤30~60min,取出在130℃的烘箱中烘干2hr,秤量后,放入化学气相沉积炉中;抽真空到50Pa以下,加温到1300℃;同时通入C3H6、TaCl5、三氯甲基硅烷(CH3SiCl3)、氢气和稀释气体Ar气,其中TaCl5、三氯甲基硅烷(CH3SiCl3)由Ar气体带入,炉压保持2000Pa,进行SiC—TaC共沉积涂层沉积,10hr后,SiC—TaC共沉积涂层厚度为23μm(结构如图2);停止通入三氯甲基硅烷,通入C3H6、TaCl5、氢气和稀释气体Ar气,炉压保持2000Pa以下,进行TaC涂层沉积,30hr后,TaC涂层厚度为100μm;停止通入C3H6、TaCl5、氢气,只通入Ar气;断电降温;冷却至200℃以下出炉。制得的TaC涂层为均匀的金黄色,表面致密、光亮、无裂纹。See Figure 1 for the process flow. Take high-purity graphite with a density higher than 1.80g/cm 3 as the base material, cut it into a sample of Φ50mm×7mm, and use 200 # , 400 # , 1000 # alumina water-resistant sandpaper to grind and polish successively. Wash with ultrasonic waves for 30-60 minutes, take it out and dry it in an oven at 130°C for 2 hours, weigh it, and put it into a chemical vapor deposition furnace; evacuate it to below 50Pa, heat it to 1300 °C; 5. Trichloromethylsilane (CH 3 SiCl 3 ), hydrogen and diluent gas Ar gas, wherein TaCl 5 and trichloromethylsilane (CH 3 SiCl 3 ) are brought in by Ar gas, the furnace pressure is kept at 2000Pa, and SiC— TaC co-deposition coating was deposited, after 10 hours, the thickness of SiC—TaC co-deposition coating was 23 μm (structure as shown in Figure 2); stop feeding trichloromethylsilane, and feed C 3 H 6 , TaCl 5 , hydrogen and diluent gas Ar gas, keep the furnace pressure below 2000Pa, and deposit TaC coating. After 30 hours, the thickness of TaC coating is 100μm; stop feeding C 3 H 6 , TaCl 5 , hydrogen, and only feed Ar gas; power off and cool; Baked out below 200°C. The obtained TaC coating is uniform golden yellow, with a dense, bright surface and no cracks.

实施例2:Example 2:

工艺流程参见图1,取密度高于1.80g/cm3高纯石墨为基体材料,切割成Φ150mm×7mm的试样,先后用200#、400#、1000#氧化铝耐水砂纸进行打磨、抛光,用超声波洗涤30~60min,取出在130℃的烘箱中烘干2hr,秤量后,放入化学气相沉积炉中;抽真空到50Pa以下,加温到970℃;①同时通入C3H6、TaCl5、三氯甲基硅烷(CH3SiCl3)、氢气和稀释气体Ar气,其中TaCl5、三氯甲基硅烷(CH3SiCl3)由Ar气体带入,炉压保持2000~3000Pa,进行SiC—TaC共沉积涂层沉积10hr,SiC—TaC共沉积涂层厚度为50μm;②停止通入三氯甲基硅烷,通入C3H6、TaCl5、氢气和稀释气体Ar气,炉压保持3000Pa以下,进行TaC涂层沉积,沉积2hr后,TaC涂层厚度约为1μm;③停止通入C3H6、TaCl5气,通入三氯甲基硅烷、氢气和稀释气体Ar,炉压保持2000Pa以下,进行SiC涂层沉积,SiC涂层厚度约为1μm;交替重复②、③多次;停止通入三氯甲基硅烷,通入C3H6、TaCl5、氢气和稀释气体Ar气,炉压保持1000~2000Pa,进行TaC主涂层沉积,TaC主涂层厚度为15μm;停止通入C3H6、TaCl5、氢气,只通入Ar气;断电降温;冷却至200℃以下出炉。制得的TaC涂层为均匀的金黄色,表面致密、光亮、无裂纹(如图3、图4)。See Figure 1 for the process flow. Take high-purity graphite with a density higher than 1.80g/cm 3 as the base material, cut it into a sample of Φ150mm×7mm, and use 200 # , 400 # , 1000 # alumina water-resistant sandpaper to grind and polish successively. Wash with ultrasonic waves for 30-60 minutes, take it out and dry it in an oven at 130°C for 2 hours, weigh it, and put it into a chemical vapor deposition furnace; vacuumize it below 50Pa, and heat it to 970 ° C; TaCl 5 , trichloromethylsilane (CH 3 SiCl 3 ), hydrogen and diluent gas Ar gas, wherein TaCl 5 and trichloromethylsilane (CH 3 SiCl 3 ) are brought in by Ar gas, and the furnace pressure is maintained at 2000-3000Pa, Deposit SiC—TaC co-deposited coating for 10 hours, and the thickness of SiC—TaC co-deposited coating is 50 μm; ② Stop feeding trichloromethylsilane, and feed C 3 H 6 , TaCl 5 , hydrogen and diluent gas Ar, and the furnace The pressure was kept below 3000Pa, and the TaC coating was deposited. After 2 hours of deposition, the thickness of the TaC coating was about 1 μm. The furnace pressure is kept below 2000Pa, and the SiC coating is deposited. The thickness of the SiC coating is about 1 μm; alternately repeat ② and ③ several times; stop feeding trichloromethylsilane, and feed C 3 H 6 , TaCl 5 , hydrogen and diluted Gas Ar gas, the furnace pressure is kept at 1000-2000Pa, and the TaC main coating is deposited, the thickness of the TaC main coating is 15μm; stop feeding C 3 H 6 , TaCl 5 , hydrogen, and only feed Ar gas; power off and cool down; cooling Take it out of the oven below 200°C. The obtained TaC coating is uniform golden yellow, and the surface is dense, bright and free of cracks (as shown in Fig. 3 and Fig. 4).

实施例3:Example 3:

参见图1,取密度高于1.80g/cm3高纯石墨为基体材料,切割成Φ150mm×7mm的试样,先后用200#、400#、1000#氧化铝耐水砂纸进行打磨、抛光,用超声波洗涤30~60min,取出在130℃的烘箱中烘干2hr,秤量后,放入化学气相沉积炉中;抽真空到50Pa以下,加温到900℃。(1)同时通入C3H6、TaCl5、三氯甲基硅烷(CH3SiCl3)、氢气和稀释气体Ar气,其中TaCl5、三氯甲基硅烷(CH3SiCl3)由Ar气体带入,炉压保持2000~3000Pa,进行SiC—TaC共沉积涂层沉积20hr,SiC—TaC共沉积涂层厚度为30μm。(2)由下列步骤组成,①停止通入三氯甲基硅烷,通入C3H6、TaCl5、氢气和稀释气体Ar气,炉压保持2000Pa以下,进行TaC涂层沉积,沉积1hr后,TaC涂层厚度为0.05μm;②停止通入C3H6、TaCl5气,通入三氯甲基硅烷、氢气和稀释气体Ar,炉压保持2000Pa以下,进行SiC涂层沉积,1hr后,SiC涂层厚度为0.05μm;交替重复①、②多次。(3)交替重复(1)、(2)一次(结构如图5)。停止通入三氯甲基硅烷,通入C3H6、TaCl5、氢气和稀释气体Ar气,炉压保持1000~2000Pa,进行TaC主涂层沉积,沉积10hr,TaC主涂层厚度为100μm;如沉积时间100hr,TaC主涂层厚度为1000μm。停止通入C3H6、TaCl5、氢气,只通入Ar气;断电降温;冷却至200℃以下出炉。制得的TaC涂层为均匀的金黄色,表面致密、光亮、无裂纹。See Figure 1, take high-purity graphite with a density higher than 1.80g/ cm3 as the base material, cut it into a sample of Φ150mm×7mm, use 200 # , 400 # , 1000 # alumina water-resistant sandpaper to grind and polish successively, and use ultrasonic Wash for 30-60 minutes, take it out and dry it in an oven at 130°C for 2 hours, weigh it, put it into a chemical vapor deposition furnace; vacuumize it to below 50Pa, and heat it to 900°C. (1) Simultaneously feed C 3 H 6 , TaCl 5 , trichloromethylsilane (CH 3 SiCl 3 ), hydrogen and diluent gas Ar, wherein TaCl 5 and trichloromethylsilane (CH 3 SiCl 3 ) are replaced by Ar The gas is brought in, the furnace pressure is kept at 2000-3000Pa, and the SiC-TaC co-deposition coating is deposited for 20 hours, and the thickness of the SiC-TaC co-deposition coating is 30 μm. (2) It consists of the following steps: ① stop feeding trichloromethylsilane, feed C 3 H 6 , TaCl 5 , hydrogen gas and Ar gas as a diluent gas, keep the furnace pressure below 2000Pa, and deposit TaC coating, after 1 hr of deposition , the thickness of TaC coating is 0.05μm; ②Stop feeding C 3 H 6 , TaCl 5 gas, and feeding trichloromethylsilane, hydrogen gas and diluent gas Ar, keep the furnace pressure below 2000Pa, and deposit SiC coating, after 1hr , the SiC coating thickness is 0.05 μm; alternately repeat ① and ② multiple times. (3) Repeat (1) and (2) alternately once (the structure is shown in Figure 5). Stop feeding trichloromethylsilane, feed C 3 H 6 , TaCl 5 , hydrogen and diluent gas Ar, keep the furnace pressure at 1000-2000Pa, and deposit TaC main coating for 10 hours, the thickness of TaC main coating is 100μm ; If the deposition time is 100hr, the thickness of the TaC main coating is 1000μm. Stop feeding C 3 H 6 , TaCl 5 , and hydrogen, and only feed Ar gas; turn off the power and cool down; cool to below 200°C and take out of the furnace. The obtained TaC coating is uniform golden yellow, with a dense, bright surface and no cracks.

实施例4:Example 4:

参见图1,取密度高于1.80g/cm3高纯石墨为基体材料,切割成Φ150mm×7mm的试样,先后用200#、400#、1000#氧化铝耐水砂纸进行打磨、抛光,用超声波洗涤30~60min,取出在130℃的烘箱中烘干2hr,秤量后,放入化学气相沉积炉中;抽真空到50Pa以下,加温到1000℃。(1)同时通入C3H6、TaCl5、三氯甲基硅烷(CH3SiCl3)、氢气和稀释气体Ar气,其中TaCl5、三氯甲基硅烷(CH3SiCl3)由Ar气体带入,炉压保持2000~3000Pa,进行SiC—TaC共沉积涂层沉积10hr,SiC—TaC共沉积涂层厚度为5μm。(2)由下列步骤组成,①停止通入三氯甲基硅烷,通入C3H6、TaCl5、氢气和稀释气体Ar气,炉压保持200Pa以下,进行TaC涂层沉积,沉积1hr后,TaC涂层厚度为0.65μm;②停止通入C3H6、TaCl5气,通入三氯甲基硅烷、氢气和稀释气体Ar,炉压保持200Pa以下,进行SiC涂层沉积,1hr后,SiC涂层厚度为0.25μm;交替重复①、②多次。(3)交替重复(1)、(2)多次。停止通入三氯甲基硅烷,通入C3H6、TaCl5、氢气和稀释气体Ar气,炉压保持100~200Pa,进行TaC主涂层沉积,沉积10hr,TaC主涂层8μm。停止通入C3H6、TaCl5、氢气,只通入Ar气;断电降温;冷却至200℃以下出炉。制得的TaC涂层为均匀的金黄色,表面致密、光亮、无裂纹(结构如图6)。See Figure 1, take high-purity graphite with a density higher than 1.80g/ cm3 as the base material, cut it into a sample of Φ150mm×7mm, use 200 # , 400 # , 1000 # alumina water-resistant sandpaper to grind and polish successively, and use ultrasonic Wash for 30 to 60 minutes, take it out and dry it in an oven at 130°C for 2 hours, weigh it, and put it into a chemical vapor deposition furnace; evacuate it to below 50Pa, and heat it to 1000°C. (1) Simultaneously feed C 3 H 6 , TaCl 5 , trichloromethylsilane (CH 3 SiCl 3 ), hydrogen and diluent gas Ar, wherein TaCl 5 and trichloromethylsilane (CH 3 SiCl 3 ) are replaced by Ar The gas is brought in, the furnace pressure is kept at 2000-3000Pa, and the SiC-TaC co-deposition coating is deposited for 10 hours, and the thickness of the SiC-TaC co-deposition coating is 5 μm. (2) It consists of the following steps: ① stop feeding trichloromethylsilane, feed C 3 H 6 , TaCl 5 , hydrogen gas and Ar gas as a diluent gas, keep the furnace pressure below 200Pa, and deposit TaC coating, after 1 hr of deposition , the thickness of the TaC coating is 0.65μm; ② stop feeding C 3 H 6 , TaCl 5 gas, feed trichloromethylsilane, hydrogen and diluent gas Ar, keep the furnace pressure below 200Pa, and deposit SiC coating, after 1hr , the SiC coating thickness is 0.25 μm; alternately repeat ① and ② multiple times. (3) Alternately repeat (1), (2) multiple times. Stop feeding trichloromethylsilane, feed C 3 H 6 , TaCl 5 , hydrogen and diluent gas Ar, keep the furnace pressure at 100-200 Pa, and deposit the main TaC coating for 10 hours, and the TaC main coating is 8 μm. Stop feeding C 3 H 6 , TaCl 5 , and hydrogen, and only feed Ar gas; turn off the power and cool down; cool to below 200°C and take out of the furnace. The obtained TaC coating is uniform golden yellow, with a dense, bright, and crack-free surface (the structure is shown in Figure 6).

实施例5:Example 5:

工艺流程参见图1,取密度高于1.80g/cm3高纯石墨为基体材料,切割成Φ50mm×7mm的试样,先后用200#、400#、1000#氧化铝耐水砂纸进行打磨、抛光,用超声波洗涤30~60min,取出在130℃的烘箱中烘干2hr,秤量后,放入化学气相沉积炉中;抽真空到50Pa以下,加温到1500℃;同时通入C3H6、TaCl5、三氯甲基硅烷(CH3SiCl3)、氢气和稀释气体Ar气,其中TaCl5、三氯甲基硅烷(CH6SiCl6)由Ar气体带入,炉压保持5000Pa,进行SiC—TaC共沉积涂层沉积20hr后,,SiC—TaC共沉积涂层厚度为50μm;停止通入三氯甲基硅烷,通入C6H6、TaCl5、氢气和稀释气体Ar气,炉压保持5000Pa,进行TaC涂层沉积,30hr后,TaC涂层厚度为1000μm;停止通入C3H6、TaCl5、氢气,只通入Ar气;断电降温;冷却至200℃以下出炉。制得的TaC涂层为均匀的金黄色,表面致密、光亮、无裂纹。See Figure 1 for the process flow. Take high-purity graphite with a density higher than 1.80g/cm 3 as the base material, cut it into a sample of Φ50mm×7mm, and use 200 # , 400 # , 1000 # alumina water-resistant sandpaper to grind and polish successively. Wash with ultrasonic waves for 30-60 minutes, take it out and dry it in an oven at 130°C for 2 hours, weigh it, and put it into a chemical vapor deposition furnace; evacuate it to below 50Pa, and heat it to 1500°C; simultaneously pass C 3 H 6 , TaCl 5. Trichloromethylsilane (CH 3 SiCl 3 ), hydrogen and diluent gas Ar gas, wherein TaCl 5 and trichloromethylsilane (CH 6 SiCl 6 ) are brought in by Ar gas, the furnace pressure is kept at 5000Pa, and SiC— After 20 hours of deposition of the TaC co-deposition coating, the thickness of the SiC-TaC co-deposition coating was 50 μm; the feeding of trichloromethylsilane was stopped, and C 6 H 6 , TaCl 5 , hydrogen and the dilution gas Ar were fed, and the furnace pressure was kept 5000Pa, for TaC coating deposition, after 30hrs, the thickness of TaC coating is 1000μm; stop feeding C 3 H 6 , TaCl 5 , hydrogen, and only feed Ar gas; power off and cool down; cool down to below 200°C and leave the furnace. The obtained TaC coating is uniform golden yellow, with a dense, bright surface and no cracks.

实施例6:Embodiment 6:

参见图1,取密度高于1.80g/cm3高纯石墨为基体材料,切割成Φ150mm×7mm的试样,先后用200#、400#、1000#氧化铝耐水砂纸进行打磨、抛光,用超声波洗涤30~60min,取出在130℃的烘箱中烘干2hr,秤量后,放入化学气相沉积炉中;抽真空到50Pa以下,加温到1000℃。(1)同时通入C3H6、TaCl5、三氯甲基硅烷(CH3SiCl3)、氢气和稀释气体Ar气,其中TaCl5、三氯甲基硅烷(CH3SiCl3)由Ar气体带入,炉压保持2000~3000Pa,进行SiC—TaC共沉积涂层沉积10hr,SiC—TaC共沉积涂层厚度为5μm。(2)由下列步骤组成,①停止通入三氯甲基硅烷,通入C3H6、TaCl5、氢气和稀释气体Ar气,炉压保持100Pa以下,进行TaC涂层沉积,沉积1hr后,TaC涂层厚度为0.05μm;②停止通入C3H6、TaCl5气,通入三氯甲基硅烷、氢气和稀释气体Ar,炉压保持100Pa以下,进行SiC涂层沉积,1hr后,SiC涂层厚度为0.05μm;交替重复①、②多次。(3)交替重复(1)、(2)多次。停止通入三氯甲基硅烷,通入C3H6、TaCl5、氢气和稀释气体Ar气,炉压保持100~200Pa,进行TaC涂层沉积,TaC涂层厚度为80μm。停止通入C3H6、TaCl5、氢气,只通入Ar气;断电降温;冷却至200℃以下出炉。制得的TaC涂层为均匀的金黄色,表面致密、光亮、无裂纹。See Figure 1, take high-purity graphite with a density higher than 1.80g/ cm3 as the base material, cut it into a sample of Φ150mm×7mm, use 200 # , 400 # , 1000 # alumina water-resistant sandpaper to grind and polish successively, and use ultrasonic Wash for 30 to 60 minutes, take it out and dry it in an oven at 130°C for 2 hours, weigh it, and put it into a chemical vapor deposition furnace; evacuate it to below 50Pa, and heat it to 1000°C. (1) Simultaneously feed C 3 H 6 , TaCl 5 , trichloromethylsilane (CH 3 SiCl 3 ), hydrogen and diluent gas Ar, wherein TaCl 5 and trichloromethylsilane (CH 3 SiCl 3 ) are replaced by Ar The gas is brought in, the furnace pressure is kept at 2000-3000Pa, and the SiC-TaC co-deposition coating is deposited for 10 hours, and the thickness of the SiC-TaC co-deposition coating is 5 μm. (2) Consisting of the following steps, ① Stop feeding trichloromethylsilane, feed C 3 H 6 , TaCl 5 , hydrogen and Ar gas as a diluent gas, keep the furnace pressure below 100Pa, and deposit TaC coating, after 1 hr of deposition , TaC coating thickness is 0.05μm; ②Stop feeding C 3 H 6 , TaCl 5 gas, feeding trichloromethylsilane, hydrogen gas and diluent gas Ar, keep the furnace pressure below 100Pa, and deposit SiC coating, after 1hr , the SiC coating thickness is 0.05 μm; alternately repeat ① and ② multiple times. (3) Alternately repeat (1), (2) multiple times. Stop feeding trichloromethylsilane, feed C 3 H 6 , TaCl 5 , hydrogen and diluent Ar gas, keep the furnace pressure at 100-200 Pa, and deposit TaC coating with a thickness of 80 μm. Stop feeding C 3 H 6 , TaCl 5 , and hydrogen, and only feed Ar gas; turn off the power and cool down; cool to below 200°C and take out of the furnace. The obtained TaC coating is uniform golden yellow, with a dense, bright surface and no cracks.

实施例7:Embodiment 7:

工艺流程参见图1,取密度高于1.80g/cm3高纯石墨为基体材料,切割成Φ330mm×8mm的试样,先后用200#、400#、1000#氧化铝耐水砂纸进行打磨、抛光,用超声波洗涤30~60min,取出在130℃的烘箱中烘干2hr,秤量后,放入化学气相沉积炉中;抽真空到50Pa以下,加温到900℃;①同时通入C3H6、TaCl5、三氯甲基硅烷(CH3SiCl3)、氢气和稀释气体Ar气,其中TaCl5、三氯甲基硅烷(CH3SiCl3)由Ar气体带入,炉压保持5000Pa,进行SiC—TaC共沉积涂层沉积10hr,SiC—TaC共沉积涂层厚度为5μm;②停止通入三氯甲基硅烷,通入C3H6、TaCl5、氢气和稀释气体Ar气,炉压保持5000Pa,进行TaC涂层沉积,TaC涂层厚度为5μm,沉积2hr后;③停止通入C3H6、TaCl5气,通入三氯甲基硅烷、氢气和稀释气体Ar,炉压保持5000Pa,进行SiC涂层沉积,2hr后,SiC涂层厚度为5μm;交替重复②、③多次;停止通入三氯甲基硅烷,通入C3H6、TaCl5、氢气和稀释气体Ar气,炉压保持5000Pa,进行TaC涂层沉积,沉积20hr,TaC涂层厚度为5μm;停止通入C3H6、TaCl5、氢气,只通入Ar气;断电降温;冷却至200℃以下出炉。制得的TaC涂层为均匀的金黄色,表面致密、光亮、无裂纹。See Figure 1 for the process flow. Take high-purity graphite with a density higher than 1.80g/cm 3 as the base material, cut it into a sample of Φ330mm×8mm, and use 200 # , 400 # , 1000 # alumina water-resistant sandpaper to grind and polish successively. Wash with ultrasonic waves for 30-60 minutes, take it out and dry it in an oven at 130°C for 2 hours, weigh it, and put it into a chemical vapor deposition furnace; evacuate it to below 50Pa, and heat it to 900 ° C; TaCl 5 , trichloromethylsilane (CH 3 SiCl 3 ), hydrogen and diluent gas Ar gas, where TaCl 5 and trichloromethylsilane (CH 3 SiCl 3 ) are brought in by Ar gas, the furnace pressure is kept at 5000Pa, and the SiC —TaC co-deposited coating was deposited for 10 hours, and the thickness of SiC—TaC co-deposited coating was 5 μm; ② Stop feeding trichloromethylsilane, and feed C 3 H 6 , TaCl 5 , hydrogen and diluent gas Ar, and keep the furnace pressure 5000Pa, for TaC coating deposition, the thickness of TaC coating is 5μm, after deposition for 2hr; ③Stop feeding C 3 H 6 , TaCl 5 gas, feeding trichloromethylsilane, hydrogen and diluent gas Ar, and keep the furnace pressure at 5000Pa , carry out SiC coating deposition, after 2 hours, SiC coating thickness is 5μm; alternately repeat ②, ③ multiple times; stop feeding trichloromethylsilane, and feed C 3 H 6 , TaCl 5 , hydrogen and diluent gas Ar , the furnace pressure was maintained at 5000Pa, and the TaC coating was deposited for 20 hours, and the thickness of the TaC coating was 5 μm; stop feeding C 3 H 6 , TaCl 5 , hydrogen, and only feed Ar gas; power off and cool down; cool to below 200°C out of the oven. The obtained TaC coating is uniform golden yellow, with a dense, bright surface and no cracks.

Claims (3)

1, a kind of graphite matrix flawless TaC coating comprises graphite matrix, it is characterized in that: deposit tie coat on described graphite matrix, in the outer deposition of described tie coat one deck TaC master coating; Described tie coat is made of SiC-TaC codeposition coating, or by SiC-TaC codeposition coating and two kinds of compound formations of transition layer of SiC/TaC laminated coating; When described tie coat is the compound formation of SiC-TaC codeposition coating and two kinds of transition layers of SiC/TaC laminated coating, described SiC-TaC codeposition coating is as first transition layer, described SiC/TaC laminated coating is as second transition layer, finish the deposition of tie coat then or carry out SiC-TaC codeposition coating and SiC/TaC laminated coating alternating deposit repeatedly; SiC-TaC codeposition tie coat thickness is 15~30 μ m, and the SiC coat-thickness is 0.05~5 μ m in the SiC/TaC laminated coating, and the TaC coat-thickness is 0.05~5 μ m, and pure TaC coat-thickness is 5~1000 μ m.
2, make the method for the described graphite matrix flawless TaC coating of claim 1, it is characterized in that:
(A), the preparation technology of SiC-TaC codeposition tie coat is as follows: in chemical vapor deposition stove, be evacuated down to below the 50Pa, be warmed to 900~1500 ℃, feed carbon source gas, TaCl simultaneously 5, trichloromethyl silane, hydrogen and diluent gas Ar gas, wherein TaCl 5, trichloromethyl silane is written into by Ar gas, furnace pressure keeps below the 5000Pa, adjusts gas ratio and makes TaC in the coating and SiC molar ratio in 0.15~7 scope, SiC-TaC codeposition tie coat thickness is 15~30 μ m;
(B), the preparation technology of SiC/TaC multilayer tie coat is as follows: in chemical vapor deposition stove, be warmed to 900~1500 ℃, the control furnace pressure feeds trichloromethyl silane, hydrogen and diluent gas Ar gas earlier below 5000Pa, carry out SiC coating deposition, the SiC coat-thickness is 0.05~5 μ m; Then, stop the deposition of SiC coating, feed carbon source gas, TaCl 5, hydrogen and diluent gas Ar gas, carry out TaC coating deposition, the TaC coat-thickness is 0.05~5 μ m; Stop the deposition of TaC coating, carry out the deposition of SiC coating once more; Stop the deposition of SiC coating once more, carry out the deposition of TaC coating again; Repeatedly repeat, carry out multilayer SiC/TaC coating deposition;
(C), the preparation technology of TaC master's coating is as follows: furnace pressure keeps feeding carbon source gas, TaCl simultaneously below the 5000Pa 5, hydrogen and diluent gas Ar gas, carry out pure TaC coating deposition, the TaC coat-thickness is 5~1000 μ m.
3, the manufacture method of graphite matrix flawless TaC coating according to claim 2 is characterized in that: described carbon source gas is CH 4, C 2H 6, C 3H 8, C 3H 6, C 2H 4Or C 2H 2Gaseous hydrocarbon maybe can vaporize hydrocarbon polymer such as liquefied gas, Sweet natural gas, hexanaphthene or C 6H 6
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