CN101444935A - Cutting wire - Google Patents

Cutting wire Download PDF

Info

Publication number
CN101444935A
CN101444935A CNA2008101853203A CN200810185320A CN101444935A CN 101444935 A CN101444935 A CN 101444935A CN A2008101853203 A CNA2008101853203 A CN A2008101853203A CN 200810185320 A CN200810185320 A CN 200810185320A CN 101444935 A CN101444935 A CN 101444935A
Authority
CN
China
Prior art keywords
cutting
wire
weight
coating
solar wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2008101853203A
Other languages
Chinese (zh)
Inventor
赵方实
严华
汤小雷
杨卫军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHANGJIAGANG JUNMA STELL CORD CO Ltd
Original Assignee
ZHANGJIAGANG JUNMA STELL CORD CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHANGJIAGANG JUNMA STELL CORD CO Ltd filed Critical ZHANGJIAGANG JUNMA STELL CORD CO Ltd
Priority to CNA2008101853203A priority Critical patent/CN101444935A/en
Publication of CN101444935A publication Critical patent/CN101444935A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses a cutting wire which can improves the cutting fractured surface and reduces the cutting cost, comprising a steel core wire. A copper zinc alloy plating layer is coated on the surface of the core wire, the plating layer contains 66 percent to 70 percent of copper parts by weight, and the residual is zinc; and in the cutting wire per kilogram, the weight of the copper zinc alloy plating layer is 7 grams to 9 grams. The flexibility of the cutting wire is better, and when the solar wafer is cut, the wire breaking ratio is lower, therefore, the cutting cost is greatly reduced; and furthermore, the cutting fractured surface of the solar wafer cut out by using the cutting wire is smoother, and the quality of the solar wafer is improved.

Description

A kind of cutting silk
Technical field
The present invention relates to a kind of cutting silk.
Background technology
At present, be used to cut the cutting silk of solar wafer (single-chip and polycrystalline sheet), directly come branch that plurality of specifications is arranged by its line, be respectively 0.11,0.12,0.14,0.16 and 0.25 millimeter, its margin of tolerance is ± 0.003 millimeter, and its structure comprises: the steel heart yearn, and the surface of heart yearn is coated with ormolu coating, described coating contains the copper of 62.5~65.5% weight, and all the other are zinc; In every kilogram the cutting silk, the weight of ormolu coating is 5~6 grams.The solar wafer that this cutting silk cuts out, the cutting section of wafer is rough, and in cutting process, the cutting silk is very easy to disconnected, causes cutting cost higher.
Summary of the invention
Technical problem to be solved by this invention is: a kind of cutting silk that improves cutting section, reduces cutting cost is provided.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of cutting silk comprises: the steel heart yearn, and the surface of heart yearn is coated with ormolu coating, and described coating contains the copper of 66~70% weight, and all the other are zinc; In every kilogram the cutting silk, the weight of ormolu coating is 7~9 grams.
The invention has the beneficial effects as follows: thickness and the copper in coating, zinc content of cutting silk of the present invention by adjusting coating, the intensity and the pliability of this cutting silk have been strengthened, make the wire broken rate of this cutting silk when the cutting solar wafer reduce greatly, thereby greatly reduce cutting cost; And, with the cutting section smoother of a this cutting solar wafer that cuts out, improved the quality of solar wafer.
Description of drawings
Fig. 1 is the structural representation of cutting silk of the present invention.
Among the figure: 1, heart yearn, 2, coating.
The specific embodiment
The invention will be further described below in conjunction with the drawings and specific embodiments.
Embodiment 1:
As shown in Figure 1, cutting silk of the present invention comprises: steel heart yearn 1, and the surface of heart yearn 1 is coated with ormolu coating 2, and described coating 2 contains the copper of 66% weight, and all the other are zinc; In every kilogram the cutting silk, the weight of ormolu coating 2 is 7 grams.
Embodiment 2:
As shown in Figure 1, cutting silk of the present invention comprises: steel heart yearn 1, and the surface of heart yearn 1 is coated with ormolu coating 2, and described coating 2 contains the copper of 70% weight, and all the other are zinc; In every kilogram the cutting silk, the weight of ormolu coating 2 is 9 grams.
Embodiment 3:
As shown in Figure 1, cutting silk of the present invention comprises: steel heart yearn 1, and the surface of heart yearn 1 is coated with ormolu coating 2, and described coating 2 contains the copper of 68% weight, and all the other are zinc; In every kilogram the cutting silk, the weight of ormolu coating 2 is 8 grams.

Claims (1)

1. one kind is cut silk, comprising: the steel heart yearn, and the surface of heart yearn is coated with ormolu coating, it is characterized in that: described coating contains the copper of 66~70% weight, and all the other are zinc; In every kilogram the cutting silk, the weight of ormolu coating is 7~9 grams.
CNA2008101853203A 2008-12-15 2008-12-15 Cutting wire Pending CN101444935A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA2008101853203A CN101444935A (en) 2008-12-15 2008-12-15 Cutting wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2008101853203A CN101444935A (en) 2008-12-15 2008-12-15 Cutting wire

Publications (1)

Publication Number Publication Date
CN101444935A true CN101444935A (en) 2009-06-03

Family

ID=40740967

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2008101853203A Pending CN101444935A (en) 2008-12-15 2008-12-15 Cutting wire

Country Status (1)

Country Link
CN (1) CN101444935A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102152416A (en) * 2011-01-27 2011-08-17 王楚雯 Diamond fretsaw and manufacture method thereof
CN102172995A (en) * 2011-01-27 2011-09-07 王楚雯 Metal composite wire and preparation method thereof
CN102172994A (en) * 2011-01-27 2011-09-07 王楚雯 Metal composite wire, preparation method thereof and metal wire
CN102248610A (en) * 2011-06-30 2011-11-23 蒙特集团(香港)有限公司 Zirconium-based amorphous alloy modified cutting steel wire
CN102267195A (en) * 2011-07-13 2011-12-07 雷世友 Steel wire for attaching silicon carbide particles to cut surface

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102152416A (en) * 2011-01-27 2011-08-17 王楚雯 Diamond fretsaw and manufacture method thereof
CN102172995A (en) * 2011-01-27 2011-09-07 王楚雯 Metal composite wire and preparation method thereof
CN102172994A (en) * 2011-01-27 2011-09-07 王楚雯 Metal composite wire, preparation method thereof and metal wire
CN102152416B (en) * 2011-01-27 2014-05-28 盛利维尔(中国)新材料技术有限公司 Diamond fretsaw and manufacture method thereof
CN102172995B (en) * 2011-01-27 2014-07-30 王楚雯 Metal composite wire and preparation method thereof
CN102172994B (en) * 2011-01-27 2014-11-26 王楚雯 Metal composite wire, preparation method thereof and metal wire
CN102248610A (en) * 2011-06-30 2011-11-23 蒙特集团(香港)有限公司 Zirconium-based amorphous alloy modified cutting steel wire
CN102248610B (en) * 2011-06-30 2014-04-16 凡登(常州)新型金属材料技术有限公司 Zirconium-based amorphous alloy modified cutting steel wire
CN102267195A (en) * 2011-07-13 2011-12-07 雷世友 Steel wire for attaching silicon carbide particles to cut surface

Similar Documents

Publication Publication Date Title
CN101444935A (en) Cutting wire
EP3006152B1 (en) High-precision zinc-based alloy electrode wire and preparation method therefor
CN102922065A (en) Electrode wire for electro-discharge machining and method for manufacturing the same
CN103491716A (en) Pattern electrically conductive circuit structure and forming method thereof
AU2003301776A1 (en) Method for increasing the copper to superconductor ratio in a superconductor wire
CN202042202U (en) Copper-plated stainless steel wire rope
CN102244976A (en) Bismaleimide and triazine (BT) circuit board alloy plating layer suitable for gold wire bonding
CN205384881U (en) Compound copper strands
CN201477911U (en) Copper-clad copper alloy wire
CN102982888B (en) A kind of copper cover aluminum nickel alloy telecommunication cable and preparation method thereof
CN202430308U (en) Device for manufacturing diamond fretsaw
CN201112382Y (en) Rectifier bridge
CN201477914U (en) Copper-clad aluminium conductor
CN213303719U (en) Wear-resistant ultrafine silver-plated copper wire
CN101444978A (en) Single filament used for manufacturing steel rope
CN101621003A (en) Novel production process of high-pressure diode
CN107221392B (en) High-speed compound stranding machine
CN205751870U (en) A kind of chip inductor
ZA200805250B (en) Composite electrical conductor and method for producing it
CN205289878U (en) Prevent dead saw bit milling cutter of long -pending bits card
CN204288837U (en) Slice collimator band
CN213601634U (en) Superfine multi-strand copper wire
CN201438383U (en) Low-loss overhead conductor
CN216849953U (en) Solar module structure containing effect-enhancing adhesive film and effect-enhancing adhesive film
CN213483428U (en) Alloy stranded copper wire

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20090603