CN101441153A - Material tester based on system chip - Google Patents
Material tester based on system chip Download PDFInfo
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- CN101441153A CN101441153A CNA2008102075628A CN200810207562A CN101441153A CN 101441153 A CN101441153 A CN 101441153A CN A2008102075628 A CNA2008102075628 A CN A2008102075628A CN 200810207562 A CN200810207562 A CN 200810207562A CN 101441153 A CN101441153 A CN 101441153A
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Abstract
The invention discloses a system chip based material tester, which comprises a displacement, force data acquisition part, a converter control part, a minimum system part, a slave computer man-machine interface part and a host computer man-machine interface part, wherein a CPLD position data acquisition module in the displacement, force data acquisition part is connected with a system chip in the minimum system part through a data and control bus; a conversion control in the converter control part is connected with the system chip in the minimum system part through a common I/O port and a DA port; the system chip in the minimum system part, connected with a keyboard module in the slave computer man-machine interface part through a IIC bus, connected with a minitype printer in the slave computer man-machine interface part through a serial port, is connected with a LCD liquid crystal module in the slave computer man-machine interface part through the data and control bus. The invention has the advantages of low cost, wide application, friendly man-machine interface, high frequency, and high precision.
Description
[technical field]
The present invention relates to material testing machine observe and control system, specifically, is a kind of based on the System on Chip/SoC Material Testing Machine.
[background technology]
Along with the raising of living standard, make people couple and life closely bound up material and starting material propose more requirement; New compound substance and new technology constantly occur, and need test and demarcate the performance and the correlation parameter of these new materials; Environment and security etc. are had higher requirement to the performance and the material behavior of product; Relevant standard has all been formulated to various types of materials in each countries and regions, and the performance of material has been proposed more and more harsher requirement.Under the background in this big epoch, Material Testing Machine is arisen at the historic moment.
Along with development of integrated circuits, entered System on Chip/SoC (System on Chip, the be called for short SoC) epoch now,, low-power consumption high-speed in order to pursue, small size and low cost realize that on chip piece systemic-function becomes the trend of integrated circuit development.The C8051F020 of Cygnal company is a high performance System on Chip/SoC, carries out the control system exploitation based on it, variable-frequency motor is controlled, and then the control universal testing machine; Compare with other testing machine, the electronic universal tester main characteristics is that suitable material is wide, measures and the control accuracy height, and test function is many; Only be not suitable for the tensile, compressive, bending test of metal material as universal hydraulic testing machine, clamp-replacing is cumbersome; And electronic universal tester can be realized function: can realize stretching, compression, crooked, shear, peel off, tear, protect carry, multiple tests such as bursting, pine are held, circulation, creep, the configuration corresponding device thereof also can realize tests such as bending.The material that electronic universal tester was suitable for: applicable to metal (comprising sheet material, bar, tubing, wire rod, paper tinsel etc.), plastics, rubber, electric wire, film, paper, packaging for foodstuff, textile fibres, macromolecular material, spring, compound substance and goods or the like; Develop its control system at electronic universal tester its actual economic implications is arranged.
The C8051F series performance of Cygnal company is much better than 8051 of classical architecture, and it manages to have released the cpu model of CIP-51 keeping under the constant situation of CISC structure and order set instruction operation being carried out line production.In this pattern, abandoned the notion of machine cycle, instruction is a run unit with the clock period.Average each clock can be carried out 1 one-cycle instruction, thereby has improved instruction operation speed greatly.Promptly compare with 8051, the one-cycle instruction travelling speed is original 12 times under identical clock; Whole instruction set average running speed is original 8051 9.5 times, makes 8051 compatible series enter 8 high-speed microprocessor ranks.Up to now, the I/O port mostly is the I/O port that is fixed as certain specific function, can be single function or multi-functional, the I/O port is able to programme be chosen as one-way/two-way and on draw, open leakage and wait.The I/O port of fixed form, it is many both to have taken pin, disposes and underaction.In C8051F, adopt cross bar switch to realize the flexible configuration of I/O port with software mode.By in the I/O port system of crossbar configuration, the single-chip microcomputer outside is a universaling I/O port, as P0 mouth, P1 mouth and P2 mouth this.In the circuit unit of I/O is arranged, the crossbar configuration by corresponding configuration register control is to selected port.C8051F has taken the lead in disposing the jtag interface (IEEE1149.1) of standard in 8 single-chip microcomputers.Introducing jtag interface will make 8 traditional artificial debuggings of single-chip microcomputer produce change completely.The product of each model all has the ADC and the DAC of multichannel different accuracy.C8051F is a single-chip microcomputer of at first breaking away from 5V power supply in 8 machines, and (voltage range 2.7-3.6V) greatly reduces system power dissipation to have realized the 3V power supply of simulation and digital circuit in the sheet.Based on the superior function of above-mentioned high speed SoC MCU, the present invention adopts a kind of Material Testing Machine of the economical speed control system based on the C8051F series monolithic.
[summary of the invention]
The objective of the invention is to overcome the deficiencies in the prior art, provide a kind of based on the System on Chip/SoC Material Testing Machine.
The objective of the invention is to be achieved through the following technical solutions:
A kind of based on the System on Chip/SoC Material Testing Machine, comprise the minimum system part, displacement, power Value Data collecting part, Frequency Converter Control part, slave computer man-machine interface part and host computer man-machine interface part; System on Chip/SoC in the minimum system part links to each other with CPLD placement data acquisition module in displacement, the power Value Data collecting part by DCB; System on Chip/SoC in the minimum system part links to each other with controller in the Frequency Converter Control part by I/O mouth and DA port; System on Chip/SoC in the minimum system part links to each other with Keysheet module in the slave computer man-machine interface part by iic bus, link to each other by the mini-printer in serial ports and the slave computer man-machine interface part, link to each other by DCB and the slave computer man-machine interface LCD Liquid Crystal Module in partly; System on Chip/SoC in the minimum system part links to each other with communication module by serial port data line, and communication module links to each other by serial port data line and the host computer man-machine interface PC in partly;
Described minimum system part comprises power module, and minimum systematic module and real-time clock module, power module, are powered to system in system by general physical connection; Minimum systematic module by System on Chip/SoC with and peripheral circuit form; Real-time clock module is connected on the System on Chip/SoC by the spi bus of simulation, for system provides real-time clock;
Described displacement, power Value Data collecting part, comprise 16 AD modules, the photoelectric encoder acquisition module, CPLD placement data acquisition module, wherein, displacement signal is gathered and is sent by the photoelectric encoder acquisition module, receive and gather by the CPLD module, CPLD is connected with System on Chip/SoC by DCB, by bus displacement signal is sent to System on Chip/SoC and carries out data processing, the collection of completion bit shifting signal; Force sensor signals produces voltage signal by the force transducer collection, amplifies the back by common 16 AD modules that are connected to System on Chip/SoC through amplifying circuit, finishes the collection that 16 AD voltage transitions realize sensor signal;
Described Frequency Converter Control part, comprise 12 DA modules, frequency-variable controller, the control signal end, wherein, inverter control signal is divided into Digital Signals and simulating signal control, and digital controlled signal is produced by common I/O mouth by the control end signal, realize motor is just changeed the control of state such as reverse and stop by the high-low level of control end; Analog control signal is directly produced by System on Chip/SoC by 12 DA modules, realizes the control of motor speed by the size of regulating simulating signal;
Described slave computer man-machine interface part, comprise Keysheet module, mini-printer module and LCD Liquid Crystal Module, wherein, Keysheet module is connected on the System on Chip/SoC by iic bus, finishes keypad function by the key assignments register that iic bus reads on the chip in the Keysheet module; Mini-printer is connected on the System on Chip/SoC by serial ports, realizes printing reports by serial communication; The LCD Liquid Crystal Module is connected on the System on Chip/SoC by the DCB form;
Described host computer man-machine interface part comprises PC, printer and Labview man-machine interface, and the host computer man-machine interface is connected with System on Chip/SoC by communication module, realizes the transmission of data.
A kind of good effect based on the System on Chip/SoC Material Testing Machine of the present invention is:
(1) controlling object of the present invention is an alternating-current variable frequency motor, because variable-frequency motor has certain limitation on precision, with and to the controller electromagnetic interference (EMI), so to control mode, interference problem, FEEDBACK CONTROL etc. have proposed new requirement, and the alternating-current variable frequency motor price is low, at industrial circle very big application space is arranged;
(2) cost of the present invention is low, and the one, the price that is embodied in alternating-current variable frequency motor is low; The 2nd, be to use 16 AD that carry on the MCU, adopt oversampling technique, can reach 20 effect; Three are 12 DA using MCU to carry, adopt the isolated controlling motor, the 3rd, and MCU selects the C8051F020 chip of Cygnal for use, reduces the cost of controller;
(3) the present invention has adopted a series of quarantine measures to prevent the electromagnetic interference (EMI) of alternating-current variable frequency motor to controller, adopts photoelectricity to isolate to come the isolated controlling end signal, and the high impedance input of employing voltage follower and Low ESR are exported and isolated the DA control signal;
(4) the present invention adopts 2 personal-machine interfaces, and the one, the man-machine friendly interface of forming by the liquid crystal of 240 x 128, the 2nd, with the friendly man-machine interface of Labview software from exploitation; And can finish two control the seamless of interface but changes;
(5) the present invention adopts CPLD to carry out the collection that No. three photoelectric encoders carry out position signalling; Has the sample frequency height, the characteristics that precision is high.
[description of drawings]
Fig. 1 structural representation of the present invention.
[embodiment]
Come to be described further based on the System on Chip/SoC Material Testing Machine below in conjunction with accompanying drawing to the present invention is a kind of.
See also accompanying drawing 1, a kind of based on the System on Chip/SoC Material Testing Machine, comprise the minimum system part, displacement, power Value Data collecting part, Frequency Converter Control part, slave computer man-machine interface part and host computer man-machine interface part; System on Chip/SoC in the minimum system part links to each other with CPLD placement data acquisition module in displacement, the power Value Data collecting part by DCB; System on Chip/SoC in the minimum system part links to each other with controller in the Frequency Converter Control part by I/O mouth and DA port; System on Chip/SoC in the minimum system part links to each other with Keysheet module in the slave computer man-machine interface part by iic bus, link to each other by the mini-printer in serial ports and the slave computer man-machine interface part, link to each other by DCB and the slave computer man-machine interface LCD Liquid Crystal Module in partly; System on Chip/SoC in the minimum system part links to each other with communication module by serial port data line, and communication module links to each other by serial port data line and the host computer man-machine interface PC in partly;
Described minimum system part comprises power module, and minimum systematic module and real-time clock module, power module, are powered to system in system by general physical connection; Minimum systematic module by System on Chip/SoC with and peripheral circuit form; Real-time clock module is connected on the System on Chip/SoC by the spi bus of simulation, for system provides real-time clock;
Wherein, power module: exchange introduction by 220v, change out the three paths of independent power supply by transformer.Three-way power respectively behind the rectifying and wave-filtering and then voltage stabilizing become required voltage, last three-way power on the casing of testing machine for ground; The purpose of doing like this is that numeral power supply and simulation power supply are separated, and to improve the stability of system, also can reduce the interference of power supply to A/D and D/A conversion simultaneously, improves conversion accuracy; Proving effect is fine as a result; Real-time clock module: this module is used for the timing of system clock and adopts the simulation spi bus to communicate by letter with System on Chip/SoC; Native system selects for use the DS1302 clock chip to finish this function; System clock clocking requirement system cut-off successor so can carry out timing, and native system is just realized with chargeable tweezer battery; Minimum systematic module: be the basis of forming controller, the design of minimum system has very big influence to the stability of system; Minimum systematic module comprises power module, reseting module and clock module.Wherein the PCB layout of clock module will be paid special attention to; Because the frequency of operation of native system is very high, is easy to produce and disturbs; So will reduce the included area of module wiring when clock module is carried out PCB layout as far as possible;
Described displacement, power Value Data collecting part, comprise the AD module, the photoelectric encoder acquisition module, CPLD placement data acquisition module, wherein, displacement signal is gathered and is sent by the photoelectric encoder acquisition module, receive and gather by the CPLD module, CPLD is connected with System on Chip/SoC by DCB, by bus displacement signal is sent to System on Chip/SoC and carries out data processing, the collection of completion bit shifting signal; Force sensor signals produces voltage signal by the force transducer collection, amplifies the back by the common AD module that is connected to System on Chip/SoC through amplifying circuit, finishes the collection that 16 AD voltage transitions realize sensor signal;
Wherein, the AD module, what the collection force signal was used is S type pressure transducer; S type pressure transducer mainly is made up of elastic body, resistance strain gage, cable etc., and internal wiring adopts Huygens's electric bridge; This sensor of S type Bss series LOAD CELLS that is specially Transcell Technology company has higher structural strength, antivibration, shock resistance, good stability, owing to utilized the superiority of shearing mechanism and elastic body to adopt I-beam, make the force change in location little to the influence of sensor output signal, thereby guaranteed the measuring accuracy of industry spot, improved the bending strength of vertical and horizontal greatly simultaneously and guaranteed overload and anti-horizontal dynamometry performance; This sensor construction is simple, volume is little, installation and maintenance are convenient, is applicable to the installation of various device; CPLD displacement data acquisition module: native system does the precision of displacement acquisition and row requirement in real time; At these characteristics, native system is just realized the collection of displacement model with CPLD; CPLD has the precision height, the characteristics that real-time is good; System on Chip/SoC reads the 24 Bit Shift signals of CPLD by emulation bus, and can realize forward and reverse plus-minus counting; Facts have proved and can realize high precision and real-time displacement signal collection like this; The photoelectric encoder module: this module is finished the collection of displacement, and its accuracy requirement is higher; Native system adopts the photoelectric encoder of 1000p/r, and its precision can satisfy the accuracy requirement of system; Scrambler is powered with 9v, and A is arranged, B, and the output of Z three road pulse signals can realize positive and negative displacement counting;
Described Frequency Converter Control part, comprise 12 DA modules, frequency-variable controller, the control signal end, wherein, inverter control signal is divided into Digital Signals and simulating signal control, and digital controlled signal is produced by common I/O mouth by the control end signal, realize motor is just changeed the control of state such as reverse and stop by the high-low level of control end; Analog control signal is directly produced by System on Chip/SoC by 12 DA modules, realizes the control of motor speed by the size of regulating simulating signal;
Wherein, described 12 DA modules adopt the low noise high precision operating amplifier; The input voltage of setting frequency converter is 0-10V, and DA is output as 0-2.4V, so need a voltage amplifier to carry out voltage amplification; Low noise high precision operating amplifier OP07 high precision operating amplifier has extremely low input offset voltage, and extremely low offset voltage temperature is floated, characteristics such as low-down input noise voltage amplitude and long-term stability; Can be widely used in stablizing the accurate amplification of integration, accurate absolute value circuit, comparer and feeble signal; Frequency converter controller adopts HLP frequency converter HOLIP-C+, the frequency of coming the control of conversion device by DA, and then control of conversion rotating speed of motor; Frequency-variable controller; Native system is selected Tai An company ground EV300 frequency-variable controller for use.
Described slave computer man-machine interface part, comprise Keysheet module, mini-printer module and LCD Liquid Crystal Module, wherein, Keysheet module is connected on the System on Chip/SoC by iic bus, finishes keypad function by the key assignments register that iic bus reads on the Keysheet module chip; Mini-printer is connected on the System on Chip/SoC by serial ports, realizes printing reports by serial communication; The LCD Liquid Crystal Module is connected on the System on Chip/SoC by the DCB form;
Wherein, Keysheet module: be selected from ZLG7290, can sample 64 buttons or sensor of described ZLG7290 can detect the double hit number of times of each button, adopt ZLG7290 to carry out key scan, and with scanning result by the I2C bus, pass to single-chip microcomputer (only needing 3 pins) but economizer port, and guarantee the reliability of collection; The ZLG7290 basic function is as follows: keyboard goes dithering process, two key interlock process, and the double hit key is handled, and function key is handled; So described keyboard goes dithering process to be meant level state may be occurred and change repeatedly and be called keyboard shake and can not cause that keypad order mistake will go dithering process to be as the criterion to read stable keyboard state if do not deal with when key is pressed and decontrol; The described pair of key interlock process be meant when two above buttons are pressed simultaneously ZLG7290 only sample the high button priority of priority for (S1〉S2〉... S64, sample S2 when pressing S2 and S18 simultaneously); Described double hit key is handled and is meant that double hit time counter (RepeatCnt) can be distinguished out and clicks (some function does not allow double hit such as switch) or double hit; Judge the double hit number of times, can detect by by the time to prevent some function maloperation; Described function key is handled and is meant that " Shift, Ctrl, Alt " key typical case that the function bond energy realizes that 2 above buttons are pressed down on expansion number of keys or realization specific function such as the PC simultaneously uses;
LED Liquid Crystal Module: be 240 * 128 liquid crystal of built-in T6963C control type, the driving control system of the LCD MODULE of described built-in T6963C control type is by LCD controller T6963C and peripheral circuit thereof, the line driver group, column driver bank and liquid crystal drive bias circuit are formed; The maximum characteristics of T6963C are to have unique hardware initial value function is set, parameter that display driver is required such as dutycycle coefficient, the byte number/row that drives transmission and the font selection of character etc. all have the pin level setting, the initialization of T6963C is finished with regard to basic setup when powering on like this, and software operation just can concentrate in the design of display frame;
The mini-printer module: system needs the printing test form, and native system is selected bright bright Chinese character mini-printer for use; In order to save System on Chip/SoC O/I resource, adopt serial interface communication mode; Drive by the programming mini-printer, realize the printing of form.
Described host computer man-machine interface part comprises PC, printer and Labview man-machine interface, and the host computer man-machine interface is connected with System on Chip/SoC by RS232 communication, realizes the transmission of data.
Communication module: for convenience finish with PC between communicate by letter, native system adopts the RS232 serial communication; Undertaken communicating by letter with PC after the level conversion by individual MAX232.
Realized the FEEDBACK CONTROL of system by the co-ordination between the various piece in the system.Suppose by minimum system part or operating rate of the man-machine interface setting of slave computer man-machine interface part (speed 1).By Frequency Converter Control part starter motor, but actual operating rate (speed 2) has certain error (variable-frequency motor has the error of revolutional slip and control signal itself) with the speed of setting.Gather displacement signal and real-time clock module extraction time by displacement, power Value Data collecting part behind the starter motor, System on Chip/SoC is calculated speed 2 by displacement and times two variograph, and System on Chip/SoC compares speed 1 and speed 2 then.According to result relatively, System on Chip/SoC will partly produce control signal by Frequency Converter Control once more, speed 2 is controlled near the speed 1, thus the FEEDBACK CONTROL of the speed of realization.
The above only is a preferred implementation of the present invention; should be pointed out that for those skilled in the art, without departing from the inventive concept of the premise; can also make some improvements and modifications, these improvements and modifications also should be considered within the scope of protection of the present invention.
Claims (6)
1. one kind based on the System on Chip/SoC Material Testing Machine, comprises the minimum system part, displacement, power Value Data collecting part, Frequency Converter Control part, slave computer man-machine interface part and host computer man-machine interface part; It is characterized in that the System on Chip/SoC in the minimum system part links to each other with CPLD placement data acquisition module in displacement, the power Value Data collecting part by DCB; System on Chip/SoC in the minimum system part links to each other with controller in the Frequency Converter Control part by I/O mouth and DA port; System on Chip/SoC in the minimum system part links to each other with Keysheet module in the slave computer man-machine interface part by iic bus, link to each other by the mini-printer in serial ports and the slave computer man-machine interface part, link to each other by DCB and the slave computer man-machine interface LCD Liquid Crystal Module in partly; System on Chip/SoC in the minimum system part links to each other with communication module by serial port data line, and communication module links to each other by serial port data line and the host computer man-machine interface PC in partly.
2. according to claim 1 a kind of based on the System on Chip/SoC Material Testing Machine, it is characterized in that described minimum system part comprises power module, minimum systematic module and real-time clock module, power module by physical connection in the System on Chip/SoC of minimum systematic module; Minimum systematic module by System on Chip/SoC with and peripheral circuit form; Real-time clock module is connected on the System on Chip/SoC of minimum systematic module by the spi bus of simulation.
3. according to claim 1 a kind of based on the System on Chip/SoC Material Testing Machine, it is characterized in that, described displacement, power Value Data collecting part, comprise 16 AD modules, the photoelectric encoder acquisition module, CPLD placement data acquisition module, wherein, displacement signal is gathered and is sent by the photoelectric encoder acquisition module, receive and gather by the CPLD module, CPLD is connected with System on Chip/SoC by DCB, by bus displacement signal is sent to System on Chip/SoC and carries out data processing, the collection of completion bit shifting signal; Force sensor signals produces voltage signal by the force transducer collection, amplifies the back by common 16 AD modules that are connected to System on Chip/SoC through amplifying circuit, finishes the collection that 16 AD voltage transitions realize sensor signal.
4. according to claim 1 a kind of based on the System on Chip/SoC Material Testing Machine, it is characterized in that, described Frequency Converter Control part, comprise 12 DA modules, frequency-variable controller, control signal end, wherein, digital controlled signal is produced by common I/O mouth by the control end signal, realizes motor is just changeed the control of reversing and stopping by the high-low level of control end; Analog control signal is directly produced by System on Chip/SoC by 12 DA modules, realizes the control of motor speed by the size of regulating simulating signal.
5. according to claim 1 a kind of based on the System on Chip/SoC Material Testing Machine, it is characterized in that, described slave computer man-machine interface part, comprise Keysheet module, mini-printer module and LCD Liquid Crystal Module, wherein, Keysheet module is connected on the System on Chip/SoC by iic bus, finishes keypad function by the key assignments register that iic bus reads on the chip in the Keysheet module; Mini-printer is connected on the System on Chip/SoC by serial ports, realizes printing reports by serial communication; The LCD Liquid Crystal Module is connected on the System on Chip/SoC by the DCB form.
6. according to claim 1 a kind of based on the System on Chip/SoC Material Testing Machine, it is characterized in that described host computer man-machine interface part comprises PC, printer and Labview man-machine interface, the host computer man-machine interface is connected with System on Chip/SoC by communication module.
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| CN2008102075628A CN101441153B (en) | 2008-12-23 | 2008-12-23 | Material tester based on system chip |
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| CN2008102075628A CN101441153B (en) | 2008-12-23 | 2008-12-23 | Material tester based on system chip |
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| CN2008102075628A Expired - Fee Related CN101441153B (en) | 2008-12-23 | 2008-12-23 | Material tester based on system chip |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102095653A (en) * | 2011-01-28 | 2011-06-15 | 华东理工大学 | High-precision electronic insertion-withdrawal force testing system |
| CN102253655A (en) * | 2010-05-21 | 2011-11-23 | 鸿富锦精密工业（深圳）有限公司 | Machine motion control system |
| CN103676893A (en) * | 2013-12-19 | 2014-03-26 | 上海华龙测试仪器股份有限公司 | Testing machine measurement and control system |
| CN109143998A (en) * | 2018-08-14 | 2019-01-04 | 浙江工业大学 | A kind of design method of material testing machine control platform system framework |
| CN109580389A (en) * | 2019-01-25 | 2019-04-05 | 安阳师范学院 | Fiber reinforcement regeneration brick aggregate concrete shearing property testing device and method |
| CN110987597A (en) * | 2019-12-30 | 2020-04-10 | 广东火炬检测有限公司 | Universal material testing machine |
| CN111750795A (en) * | 2020-06-18 | 2020-10-09 | 哈尔滨工程大学 | Distributed creep measurement system and measurement method |
| CN113032324A (en) * | 2020-04-01 | 2021-06-25 | 大连新亮兴电子技术有限公司 | Low-delay test instrument measurement and control system structure and method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87208742U (en) * | 1987-05-29 | 1988-04-27 | 江苏建筑机械厂 | Digital display for measuring tensile and compressive force of hydraulic test machine |
| US5978942A (en) * | 1996-12-19 | 1999-11-02 | Simd Solutions, Inc. | STAR-I: scalable tester architecture with I-cached SIMD technology |
| DE19812971C2 (en) * | 1998-03-24 | 2003-11-13 | Rohde & Schwarz | microcontroller |
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2008
- 2008-12-23 CN CN2008102075628A patent/CN101441153B/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102253655A (en) * | 2010-05-21 | 2011-11-23 | 鸿富锦精密工业（深圳）有限公司 | Machine motion control system |
| CN102095653A (en) * | 2011-01-28 | 2011-06-15 | 华东理工大学 | High-precision electronic insertion-withdrawal force testing system |
| CN103676893A (en) * | 2013-12-19 | 2014-03-26 | 上海华龙测试仪器股份有限公司 | Testing machine measurement and control system |
| CN109143998A (en) * | 2018-08-14 | 2019-01-04 | 浙江工业大学 | A kind of design method of material testing machine control platform system framework |
| CN109580389A (en) * | 2019-01-25 | 2019-04-05 | 安阳师范学院 | Fiber reinforcement regeneration brick aggregate concrete shearing property testing device and method |
| CN109580389B (en) * | 2019-01-25 | 2024-02-06 | 安阳师范学院 | Device and method for testing shear performance of fiber reinforced recycled brick aggregate concrete |
| CN110987597A (en) * | 2019-12-30 | 2020-04-10 | 广东火炬检测有限公司 | Universal material testing machine |
| CN113032324A (en) * | 2020-04-01 | 2021-06-25 | 大连新亮兴电子技术有限公司 | Low-delay test instrument measurement and control system structure and method thereof |
| CN111750795A (en) * | 2020-06-18 | 2020-10-09 | 哈尔滨工程大学 | Distributed creep measurement system and measurement method |
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| Publication number | Publication date |
|---|---|
| CN101441153B (en) | 2011-08-31 |
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