CN101437356A - Circuit board module and structure intensification method thereof - Google Patents
Circuit board module and structure intensification method thereof Download PDFInfo
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- CN101437356A CN101437356A CNA2007101863338A CN200710186333A CN101437356A CN 101437356 A CN101437356 A CN 101437356A CN A2007101863338 A CNA2007101863338 A CN A2007101863338A CN 200710186333 A CN200710186333 A CN 200710186333A CN 101437356 A CN101437356 A CN 101437356A
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- circuit board
- substrate
- electronic component
- board module
- intensification method
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Abstract
The invention relates to a circuit board module, which comprises a circuit board and a reinforcement substrate, wherein one surface of the circuit board is provided with at least one electronic component; and the reinforcement substrate is partially connected with the surface of the circuit board and surrounds the electronic component. The invention also discloses a method for reinforcing the structure of the circuit board module.
Description
Technical field
The present invention relates to a kind of circuit board module and structure intensification method thereof.
Background technology
Along with development of integrated circuits, the electronic component of various kinds can be incorporated on the circuit board, and is applied to all kinds of electronic products.In addition, along with electronic product towards lightening developing rapidly, circuit board also needs slimming, to be applied to lightening electronic product.And when circuit board because of too thin when making that structural strength is not enough, the electronic component on it just damages because of improper use or collision easily.
Please refer to shown in Figure 1ly, a kind of known circuit board module 1 comprises circuit board 11, a plurality of electronic component 12 and packaging plastic 13.Electronic component 12 and packaging plastic 13 are arranged on the circuit board 11, and wherein, packaging plastic 13 is in order to strengthen the intensity of circuit board 11.
Yet, the structural strength of utilizing packaging plastic to increase circuit board module 1 many shortcomings of will deriving.At first, packaging plastic 13 needs through some glue, bakings and cool off three road technologies just can be arranged on the circuit board 11, and this measure will increase the process time, and extra some glue and roasting plant also cause the increase of cost.In addition, the easy uneven thickness of some glue, and assembling and rate of finished products after the influence because of packaging plastic 13.In addition, industry still has with injection molding method, circuit board is encapsulated with the glue material, yet this also needs mould and Jet forming machine, and identical also can raise the cost, and increases the process time.And the circuit board that injection molding method is made is if there is problem also can't keep in repair, and then the reduction rate of finished products.
Therefore, how to provide a kind of circuit board module and structure intensification method thereof, can simplify technology and promote rate of finished products, and then shorten the process time and reduce cost, real is one of current important topic.
Summary of the invention
Because above-mentioned problem, purpose of the present invention is for providing a kind of circuit board module and the structure intensification method thereof that can simplify technology and promote rate of finished products.
Therefore, for reaching above-mentioned purpose, comprise circuit board and strengthen substrate according to a kind of circuit board module of the present invention.One surface of circuit board is provided with at least one electronic component.Strengthen substrate and link with surface partly, and around electronic component.
For reaching above-mentioned purpose, the structure intensification method of foundation a kind of circuit board module of the present invention comprises the following steps: to be provided with the conduction following layer in a surface of circuit board; At least one electronic component is set and strengthens substrate and contact with lip-deep conduction following layer; And with electronic component and strengthen substrate surface and the surface combination of circuit board.
From the above, according to a kind of circuit board module of the present invention and structure intensification method thereof, be installed on circuit board and reinforced structure by strengthening substrate surface.With known art, the present invention is without packaging plastic, so can save Processes and apparatus such as a glue, baking and cooling; Otherwise strengthening substrate can be incorporated on the circuit board simultaneously with electronic component, and then simplifies technology, reduces the production time and reduce production costs.In addition, use and strengthen the problem that substrate can not cause uneven thickness, and then promote rate of finished products.In addition, the present invention does not use ejection formation, and is to use sheet material in conjunction with strengthening circuit board, and then escapable cost, and can keep in repair and improve rate of finished products.
Description of drawings
Fig. 1 is a kind of schematic diagram of known circuit plate module;
Fig. 2 is the schematic diagram according to a kind of circuit board module of the preferred embodiment of the present invention; And
Fig. 3 is the flow chart according to the structure intensification method of the circuit board module of the preferred embodiment of the present invention.
Description of reference numerals
1,2: circuit board module
11,21: circuit board
12,22: electronic component
13: packaging plastic
211: the surface
23: strengthen substrate
231: metal level
S01～S03: structure-reinforced step
Embodiment
Hereinafter with reference to relevant indicators, a kind of circuit board module and structure intensification method thereof according to the preferred embodiment of the present invention are described, wherein components identical will be illustrated with identical reference marks.
Please refer to shown in Figure 2ly, a kind of circuit board module 2 of the preferred embodiment of the present invention comprises circuit board 21, at least one electronic component 22 and strengthens substrate 23.Circuit board module of the present invention is not limited to any kind of, preferred person is the circuit board module in order to the slot effect that is inserted in electronic installation, for example storage card (memory card), wireless network card (WLAN card) or global positioning system card (GPS card) etc.Wherein, storage card can be again flash (Compact Flash, CF) card, secure digital (SecurityDigital, SD) card, multimedia card (MultiMedia Card, MMC) or memory stick (Memory stick, MS) or the like.
In the present embodiment, strengthening substrate 23 does along at least a portion periphery of circuit board 21 and is provided with and around to the electronic component 22 of small part, in order to protection electronic component 22.Be that the height of electronic component 22 must be above the height of strengthening substrate 23 what this paid special attention to.In addition, strengthen substrate 23 and also have metal level 231, at this, metal level 231 is a ground metal layer, can prevent making electromagnetic interference (ElcctroMagnetic Interference, EMI).Ground metal layer 231 electrically connects with the earth point of circuit board 21.Metal level 231 can electrically connect by lead and earth point, or electrically connects via the conductive hole of strengthening substrate 23 and earth point.In addition, the material of the reinforcement substrate 23 of present embodiment also can be single metal or alloy.
Please refer to shown in Figure 3ly, a kind of circuit board module structure intensification method of the preferred embodiment of the present invention comprises that step S01 is to step S03.Please be simultaneously with reference to Fig. 2 and Fig. 3 with the description architecture intensifying method.
In step S01, a conduction following layer is set in the surface 211 of circuit board 21.Wherein, the conduction following layer for example is a tin cream.
In step S02, at least one electronic component 22 is set and strengthens substrate 23 on the surface 211 of circuit board 21.
In step S03, electronic component 22 and reinforcement substrate 23 are combined with the surface 211 of circuit board 21.At this, electronic component 22 and reinforcement substrate 23 combine with the surface 211 of circuit board 21 by reflow (reflow) technology.That is, the electronic component 22 of present embodiment and reinforcement substrate 23 are incorporated on the circuit board 21 simultaneously with surface mounting technology.In addition, strengthen the principal character of substrate 23 and describe in detail in the foregoing description, so repeat no more with the relative position of circuit board 21.
In sum, according to a kind of circuit board module of the present invention and structure intensification method thereof, be installed on circuit board and reinforced structure by strengthening substrate surface.With known art, the present invention is without packaging plastic, so can save Processes and apparatus such as a glue, baking and cooling; Otherwise strengthening substrate can be incorporated on the circuit board simultaneously with electronic component, and then simplifies technology, reduces the production time and reduce production costs.In addition, use and strengthen the problem that substrate can not cause uneven thickness, and then promote rate of finished products.Moreover, have ground metal layer owing to strengthen substrate, so the anti-system of ground connection electromagnetic interference can be arranged.In addition, the present invention does not use ejection formation, and is to use the sheet material combination to strengthen circuit board, and then escapable cost, and convenient for maintaining.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the appended claim its equivalent modifications of carrying out or change.
Claims (16)
1, a kind of circuit board module comprises:
Circuit board, its surface is provided with at least one electronic component; And
Strengthen substrate,, and should strengthen substrate around this electronic component with this surface binding of this circuit board partly.
2, circuit board module as claimed in claim 1 wherein should be strengthened substrate and link with a surface mounting technology and this circuit board.
3, circuit board module as claimed in claim 1 wherein should be strengthened at least a portion periphery setting of substrate along this circuit board.
4, circuit board module as claimed in claim 1, wherein the height of this electronic component is not strengthened the height of substrate above this.
5, circuit board module as claimed in claim 1, wherein the material of this reinforcement substrate comprises resin, pottery, metal or alloy.
6, circuit board module as claimed in claim 1, wherein this reinforcement substrate also has a metal level, and this metal level is a ground metal layer.
7, circuit board module as claimed in claim 6, wherein this reinforcement substrate has a conductive hole, and this conductive hole electrically connects with the earth point of this metal level and this circuit board respectively.
8, circuit board module as claimed in claim 1, it is storage card, wireless network card or global positioning system card, and this memory card applications is in flash memory cards, safe digital card, multimedia card or memory stick.
9, a kind of structure intensification method of circuit board module comprises the following steps:
Circuit board is provided;
At least one electronic component is set on a surface of this circuit board;
The reinforcement substrate is provided; And
With this surface combination of this electronic component and this reinforcement substrate and this circuit board, and should strengthen substrate with this surface binding of this circuit board of part and around this electronic component.
10, structure intensification method as claimed in claim 9 wherein also be provided with a conduction following layer between this surface of this reinforcement substrate and this circuit board, and this electronic component and this reinforcement substrate contacts directly with this conduction following layer.
11, structure intensification method as claimed in claim 10, wherein this conduction following layer is a tin cream, and this electronic component and this are strengthened substrate and combined with this circuit board by reflow.
12, structure intensification method as claimed in claim 9 wherein is somebody's turn to do and strengthens substrate with a surface mounting technology and the binding of this circuit board, and should strengthen at least a portion periphery setting of substrate along this circuit board.
13, structure intensification method as claimed in claim 9, wherein the height of this electronic component is not strengthened the height of substrate above this.
14, structure intensification method as claimed in claim 9 also comprises a step:
Forming metal level strengthens on the substrate in this; And
Make this metal level ground connection.
15, structure intensification method as claimed in claim 14, wherein this metal level electrically connects and ground connection by the earth point of conductive hole and this circuit board.
16, structure intensification method as claimed in claim 9, wherein the material of this reinforcement substrate comprises resin, pottery, metal or alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101863338A CN101437356A (en) | 2007-11-12 | 2007-11-12 | Circuit board module and structure intensification method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101863338A CN101437356A (en) | 2007-11-12 | 2007-11-12 | Circuit board module and structure intensification method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101437356A true CN101437356A (en) | 2009-05-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101863338A Pending CN101437356A (en) | 2007-11-12 | 2007-11-12 | Circuit board module and structure intensification method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101437356A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107438330A (en) * | 2017-08-23 | 2017-12-05 | 西安易朴通讯技术有限公司 | A kind of device architecture |
-
2007
- 2007-11-12 CN CNA2007101863338A patent/CN101437356A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107438330A (en) * | 2017-08-23 | 2017-12-05 | 西安易朴通讯技术有限公司 | A kind of device architecture |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090520 |