CN101424813A - Adhering device and method for - Google Patents
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- CN101424813A CN101424813A CNA2007101651264A CN200710165126A CN101424813A CN 101424813 A CN101424813 A CN 101424813A CN A2007101651264 A CNA2007101651264 A CN A2007101651264A CN 200710165126 A CN200710165126 A CN 200710165126A CN 101424813 A CN101424813 A CN 101424813A
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Abstract
The invention relates to an agglutinate device and an agglutinate method of a polarizing plate. The agglutinate device is used for agglutinating a first protective film on a first surface of a polarizing photon and comprises a first spray heating mechanism, a first pressing idler wheel and a baking oven, wherein the first spray heating mechanism is used for forming a first thermalization fog colloid on the first protective film, the first pressing idler wheel contacts the first protective film and is used for pressing the first protective film on the first surface of the polarizing photon, the first thermalization fog colloid is arranged between the polarizing photon and the first protective film, the first protective film and the polarizing photon pass through the baking oven which is used for roasting the first thermalization fog colloid between the polarizing photon and the first protective film, and the first protective film is enabled to be agglutinated on the first surface of the polarizing photon. The agglutinate method comprises the steps that the first thermalization fog colloid is formed on the first protective film, the first protective film is pressed on the first surface of the polarizing photon, the first thermalization fog colloid is arranged between the polarizing photon and the first protective film, and the first protective film is enabled to be agglutinated on the first surface of the polarizing photon when heated.
Description
Technical field
The present invention relates to a kind of bonding device and method, and be particularly related to a kind of bonding device and method of Polarizer.
Background technology
Referring to Fig. 1, it is the synoptic diagram of the bonding mechanism 100 of traditional Polarizer 170.Bind mechanism 100 and be used for respectively diaphragm 150a and 150b are bonding on relative two surfaces of polarisation 160.Bind mechanism 100 and comprise two dispense tip 110a and 110b, two pressing roller 120a and 120b and baking oven 130.Dispense tip 110a and 110b are respectively applied for the coating colloid on the surface of diaphragm 150a and 150b.Afterwards, pressing roller 120a and 120b are pressed on diaphragm 150a and 150b on relative two surfaces of polarisation 160 respectively.
Owing to can comprise moisture in the general colloid, therefore, if will firmly diaphragm 150a and 150b be bonding on the surface of polarisation 160, then the moisture in the colloid needs moderately to remove.Diaphragm 150a, 150b and polarisation 160 are by baking oven 130.After through baking oven 130 bakings, the moisture in the colloid can little by little evaporate.Like this, diaphragm 150a and 150b can attach to respectively on relative two surfaces of polarisation 160, to form Polarizer 170.
After cooperatively interacting, the process said modules produces Polarizer 170.Yet because dispense tip 110a and 110b are the thickness when deciding the colloid coating by Control Flow, therefore, the thickness of colloid easily has the too thick situation of inequality or thickness.When colloid in uneven thickness, make Polarizer 170 cause look inequality (mura) phenomenon of light leak when being applied in the display easily, and influenced display effect.In addition, when the thickness of colloid is too thick, the material cost of not only wasting colloid, and the thickness of Polarizer 170 also can increase accordingly.
In addition, in the process of making Polarizer 170, need the moisture of removing in the colloid by baking oven 130.Yet the thickness of colloid on diaphragm 150a and 150b is too thick and surface area that come out is too little, therefore, if will remove the interior moisture of colloid effectively, needs the length of lengthening baking oven 130 usually.So, the expenditure of equipment cost can increase, and the space of configuration device also need increase.Moreover if diaphragm 150a, 150b and polarisation 160 are long the heat time heating time in baking oven 130, then diaphragm 150a, 150b or polarisation 160 may produce distortion because of contraction.
Summary of the invention
The present invention relates to a kind of bonding device and method of Polarizer, its chance to produce vaporific colloid and the mode of vaporific colloid heating to be improved water evaporates in the colloid.Like this; when between polarisation of Polarizer and diaphragm, forming the vaporific colloid of heating; not only can increase the attaching ability between diaphragm and polarisation, and the uniformity coefficient of the vaporific colloid that forms and thickness can improve effectively all between polarisation and diaphragm.At this moment, for the space cost or the equipment cost of for example baking oven, and the material cost of colloid all can reduce accordingly, reduces total manufacturing cost.
A kind of bonding device of Polarizer is proposed according to a first aspect of the invention.Bind the first surface that device is used for first diaphragm is bonding on polarisation.Bind device and comprise the first spraying heating arrangements, first pressing roller and the baking oven.The first spraying heating arrangements is used for forming the vaporific colloid of first thermalization on first diaphragm.The first pressing roller contacts first diaphragm.The first pressing roller is used for first diaphragm is pressed on the first surface of polarisation.The vaporific colloid of first thermalization is between polarisation and first diaphragm.First diaphragm and polarisation pass through baking oven.Baking oven is used to toast the vaporific colloid of first thermalization between polarisation and first diaphragm, makes first diaphragm attach to the first surface of polarisation.
This binds device, also comprises at least one first preheating roller, contacts first diaphragm, and the first preheating roller is used to heat first diaphragm.
The first pressing roller of this bonding device also is used to heat first diaphragm.
The first spraying heating arrangements of this bonding device comprises: first atomizer, and towards the first diaphragm setting, first atomizer is used to produce vaporific colloid; And the first pre-roasting baking oven, first diaphragm is by the first pre-roasting baking oven, and the first pre-roasting baking oven is used to toast first diaphragm and heats vaporific colloid, so that vaporific colloid changes the vaporific colloid of first thermalization into.
First atomizer of this bonding device is arranged in the first pre-roasting baking oven.
The material of the vaporific colloid of this bonding device is a polyvinyl alcohol (PVA).
The viscosity scope of the vaporific colloid of this bonding device is 1～100 centipoise.
First atomizer of this bonding device is conical hollow atomizer, solid cone shaped atomizer or fan-spray atomizer.
The first spraying heating arrangements of this bonding device also is used for forming the vaporific colloid of first thermalization on the first surface of polarisation.
The material of first diaphragm of this bonding device is Triafol T, poly-cyclic olefin polymer, cyclic olefine copolymer, poly-bornylene or polyester.
The bonding device of this bonding device also is used for second diaphragm is bonding on the second surface of polarisation, and second surface is relative with first surface, binds device and also comprises: the second spraying heating arrangements is used for forming the vaporific colloid of second thermalization on second diaphragm; And the second pressing roller, contacting second diaphragm, the second pressing roller is used for second diaphragm is pressed on the second surface of polarisation, and the vaporific colloid of second thermalization is between polarisation and second diaphragm; Wherein, baking oven also is used to toast the vaporific colloid of second thermalization between second diaphragm and polarisation, makes first diaphragm and second diaphragm attach to the first surface and the second surface of polarisation respectively, to form Polarizer.
This binds device, also comprises: at least one second preheating roller, contact second diaphragm, and the second preheating roller is used to heat second diaphragm.
The second pressing roller of this bonding device also is used to heat second diaphragm.
The second spraying heating arrangements of this bonding device comprises: second atomizer, and towards the second diaphragm setting, second atomizer is used to produce vaporific colloid; And the second pre-roasting baking oven, second diaphragm is by the second pre-roasting baking oven, and the second pre-roasting baking oven is used to toast second diaphragm and heats vaporific colloid, so that vaporific colloid changes the vaporific colloid of second thermalization into.
Second atomizer of this bonding device is arranged in the second pre-roasting baking oven.
The material of the vaporific colloid of this bonding device is a polyvinyl alcohol (PVA).
The viscosity scope of the vaporific colloid of this bonding device is 1～100 centipoise.
Second atomizer of this bonding device is conical hollow atomizer, solid cone shaped atomizer or fan-spray atomizer.
The second spraying heating arrangements of this bonding device also is used for forming the vaporific colloid of second thermalization on the second surface of polarisation.
The material of second diaphragm of this bonding device is Triafol T, poly-cyclic olefin polymer, cyclic olefine copolymer, poly-bornylene or polyester.
This polarisation that binds device is a polyvinyl alcohol film.
This binds device, also comprises: main preheating roller, and contact polarisation, main preheating roller is used to heat polarisation.
According to a second aspect of the invention, propose a kind of bonding method of Polarizer, be used for first diaphragm is bonding on the first surface of polarisation.The bonding method may further comprise the steps.At first, on first diaphragm, form the vaporific colloid of first thermalization.Then, first diaphragm is pressed on the first surface of polarisation.The vaporific colloid of first thermalization is between polarisation and first diaphragm.Then, heat, make first diaphragm attach to the first surface of polarisation.
This bonding method forms the step of the vaporific colloid of first thermalization on first diaphragm before, the bonding method also comprises: heat first diaphragm.
The temperature range of heating first diaphragm is 40～65 ℃ in this bonding method.
The step that forms the vaporific colloid of first thermalization in this bonding method on first diaphragm comprises: form vaporific colloid; And heat vaporific colloid and toast first diaphragm, vaporific colloid being changed into the vaporific colloid of first thermalization, and on first diaphragm, form the vaporific colloid of first thermalization.
The vaporific colloid of heating and the temperature range of toasting first diaphragm are 40～75 ℃ in this bonding method.
The step that in this bonding method first diaphragm is pressed on the first surface of polarisation comprises: heat first diaphragm.
The temperature range of heating first diaphragm is 40～65 ℃ in this bonding method.
In the step that heats, the temperature range of heating is 40～120 ℃ in this bonding method.
The bonding method also is used for second diaphragm is bonding on the second surface of polarisation in this bonding method, and second surface is relative with first surface, and the bonding method also comprises: form the vaporific colloid of second thermalization on second diaphragm; Second diaphragm is pressed on the second surface of polarisation, and the vaporific colloid of second thermalization is between polarisation and second diaphragm; And heat, make first diaphragm and second diaphragm attach to the first surface and the second surface of polarisation respectively, to form Polarizer.
Before forming the step of the vaporific colloid of second thermalization in this bonding method on second diaphragm, the bonding method also comprises: heat second diaphragm.
The temperature range of heating second diaphragm is 40～65 ℃ in this bonding method.
The step that forms the vaporific colloid of second thermalization in this bonding method on second diaphragm comprises: form vaporific colloid; And heat vaporific colloid and toast second diaphragm, vaporific colloid being changed into the vaporific colloid of second thermalization, and on second diaphragm, form the vaporific colloid of second thermalization.
The temperature range of vaporific colloid of heating and baking second diaphragm is 40～75 ℃ in this bonding method.
The step that in this bonding method second diaphragm is pressed on the second surface of polarisation comprises: heat second diaphragm.
The temperature range of heating second diaphragm is 40～65 ℃ in this bonding method.
This bonding method is in the step that heats, and the temperature range of heating is 40～120 ℃.
This bonding method also comprises: heating polarisation.
The temperature range of heating polarisation is 40～65 ℃ in this bonding method.
For foregoing of the present invention can be become apparent, hereinafter special with preferred embodiment, and conjunction with figs., be described in detail below:
Description of drawings
Fig. 1 is the synoptic diagram of the bonding mechanism of traditional Polarizer;
Fig. 2 is the bonding schematic representation of apparatus of Polarizer according to the preferred embodiment of the invention;
Fig. 3 is the process flow diagram of the bonding method of Polarizer according to the preferred embodiment of the invention.
Embodiment
Below describe the present invention in detail with preferred embodiment, yet embodiment is an illustrative purposes only, is not to be used to limit the scope that the present invention protects.In addition, omit unnecessary assembly in the icon, with clear demonstration technical characterstic of the present invention.
Referring to Fig. 2, it is the synoptic diagram of the bonding device 200 of Polarizer 400 according to the preferred embodiment of the invention.In the present embodiment, bind the first surface 301 that device 200 is used for first diaphragm 310 is bonding on polarisation 300.The material of first diaphragm 310 for example is Triafol T (Triacetyl Cellulose; TAC), poly-cyclic olefin polymer (Cyclo-olefin Polymer; COP), cyclic olefine copolymer (Cyclo-olefinCopolymer; COC), poly-bornylene (Polynorbornene) or polyester (Polyester), polarisation 300 for example is a polyvinyl alcohol film.
The vaporific colloid of first thermalization is the colloid that passes through the vaporific form of heat treated, and therefore, with traditional colloid comparison, the moisture that is comprised in the vaporific colloid of first thermalization is less.In other words; the bonding effect of the colloid that is produced with the dispense tip 110a and the 110b that utilize as shown in Figure 1 relatively, utilizing the vaporific colloid of first thermalization (low moisture content) of the first spraying heating arrangements 210 to bind first diaphragm 310 can be better with the effect of polarisation 300.In addition, thickness and the uniformity coefficient that forms the vaporific colloid of first thermalization on first diaphragm 310 also can be controlled effectively.For the thickness that traditional colloid is approximately micron grade, utilize the first spraying heating arrangements 210 to be produced in the present embodiment, the thickness that forms the vaporific colloid of first thermalization on first diaphragm 310 for example is 1～0.1 nanometer.
Moreover first diaphragm 310 is by the first pre-roasting baking oven 213, and therefore, the first pre-roasting baking oven 213 also is used to toast first diaphragm 310.So; vaporific colloid is except reducing the inner moisture because of changing the vaporific colloid of first thermalization into; the vaporific colloid of first thermalization is because of on first diaphragm 310 that is attached to preheating; therefore; moisture in the vaporific colloid of first thermalization can further reduce because of being heated again, the effect of sticking with raising.
As shown in Figure 2, bind device 200 and also comprise at least one main preheating roller 290.Main preheating roller 290 contact polarisation 300.Main preheating roller 290 is used to heat polarisation 300.Because the first pre-roasting baking oven 213 is open spaces, therefore along with the change of air-flow, the vaporific colloid of first thermalization that the first spraying heating arrangements 210 forms also might be attached on the first surface 301 of polarisation 300.So heating polarisation 300 later also helps to evaporate the moisture in the vaporific colloid of first thermalization, to improve the ability that first diaphragm 310 attaches to polarisation 300.In addition; polarisation 300 can contact with the vaporific colloid of first thermalization that is attached to first diaphragm 310 at the first pressing roller, 230 places, and therefore polarisation 300 that heats by main preheating roller 290 also can further reduce the moisture in the vaporific colloid of first thermalization that is attached to first diaphragm 310 again.
In the present embodiment, the first pressing roller 230 also is used to heat first diaphragm 310 except being used for being pressed on first diaphragm 310 on polarisation 300.So; first diaphragm 310 is pressed on the first surface 301 of polarisation 300 and heats simultaneously again by the first pressing roller 230; cumulative water-oil ratio regular meeting in the vaporific colloid of first thermalization descends again, to allow first diaphragm 310 more firmly attach on the first surface 301 of polarisation 300.
The bonding device 200 of present embodiment also is used for second diaphragm 320 is bonding on the second surface 302 of polarisation 300, and second surface 302 is relative with first surface 301.Bind device 200 and also comprise second spraying heating arrangements 220, the second pressing roller 240 and at least one the second preheating roller 280.The material of second diaphragm 320 for example is Triafol T, poly-cyclic olefin polymer, cyclic olefine copolymer, poly-bornylene or polyester.Owing to the mechanism of the second surface 302 that second diaphragm 320 is bonding on polarisation 300 is similar to the mechanism of the first surface 301 that first diaphragm 310 is bonding on polarisation 300, therefore do not repeat to give unnecessary details herein.
When first diaphragm 310, when polarisation 300 and second diaphragm 320 passes through baking oven 250; baking oven 250 is except toasting the vaporific colloid of first thermalization between first diaphragm 310 and polarisation 300; baking oven 250 also toasts the vaporific colloid of second thermalization between polarisation 300 and second diaphragm 320; so that first diaphragm 310 attaches to the first surface 301 of polarisation 300 and the second surface 302 that second diaphragm 320 attaches to polarisation 300, to form Polarizer 400.So, by the cooperation of each assembly in the present embodiment, the moisture that is comprised in vaporific colloid of first thermalization and the vaporific colloid of second thermalization can reduce effectively.The length of the baking oven 250 in the present embodiment then can reduce accordingly.For example, compare with the length of traditional baking oven and the length of the baking oven in the present embodiment 250, the length of the baking oven 250 of present embodiment can reduce 5～10 meters.That is to say that the bonding device 200 of present embodiment can reduce the waste of the equipment cost and the device space simultaneously.
With reference to Fig. 3, it is the process flow diagram of the bonding method of Polarizer 400 according to the preferred embodiment of the invention simultaneously.Though below be the embodiment that cooperates the flowchart text bonding device 200 of Fig. 3, yet those of ordinary skill in the art should know the embodiment of the bonding device 200 among Fig. 2 and be not limited to the step and the order of the process flow diagram of Fig. 3, can modify and adjust according to the practical application situation.
At first, in step 701, heating polarisation 300.Step 701 is to utilize the main preheating roller 290 among Fig. 2 to come 300 heating of polarisation, and the temperature range of main preheating roller 290 heating is 40～65 ℃.
Then; step 703a is respectively first diaphragm 310 to be carried out preheating and the vaporific colloid of first thermalization is attached to the step of first diaphragm 310 to step 705a, and step 703b is the step of respectively second diaphragm 320 being carried out preheating and the vaporific colloid of second thermalization being attached to second diaphragm 320 to step 705b.The following step of explanation earlier 703a is to step 705a.
To step 705a, step 703a heats first diaphragm 310 at step 703a.In step 703a, utilize the first preheating roller 270 heating, first diaphragm 310 among Fig. 2, and the temperature range that heats first diaphragm 310 is 40～65 ℃.
Then, step 705a forms the vaporific colloid of first thermalization on first diaphragm 310.In step 705a; utilize first atomizer 211 among Fig. 2 to form vaporific colloid; and utilize the in advance roasting baking oven 213 vaporific colloids of heating of first among Fig. 2 and toast first diaphragm 310; to change vaporific colloid is the vaporific colloid of first thermalization, and forms the vaporific colloid of first thermalization on first diaphragm 310.The first pre-roasting baking oven 213 vaporific colloids of heating and the temperature range of toasting first diaphragm 310 are 40～75 ℃.
Similar to step 703b as for step 703b to step 705b and step 703a.To step 705b, step 703b heats second diaphragm 320 at step 703b.In step 703b, utilize the second preheating roller 280 heating, second diaphragm 320 among Fig. 2, and the temperature range that heats second diaphragm 320 is 40～65 ℃.
Then, step 705b forms the vaporific colloid of second thermalization on second diaphragm 320.In this step 705b; utilize second atomizer 221 among Fig. 2 to form vaporific colloid; and utilize the in advance roasting baking oven 223 vaporific colloids of heating of second among Fig. 2 and toast second diaphragm 320; to change vaporific colloid is the vaporific colloid of second thermalization, and forms the vaporific colloid of second thermalization on second diaphragm 320.The second pre-roasting baking oven 223 vaporific colloids of heating and the temperature range of toasting second diaphragm 320 are 40～75 ℃.
Then, be step 707 after step 705a and the step 705b.In step 707; utilize the first pressing roller 230 heating first diaphragms 310 among Fig. 2 and first diaphragm 310 is pressed on the first surface 301 of polarisation 300, and utilize the second pressing roller, 240 heating second diaphragms 320 among Fig. 2 and second diaphragm 320 is pressed on the second surface 302 of polarisation 300.At this moment, the vaporific colloid of first thermalization is between polarisation 300 and first diaphragm 310, and the vaporific colloid of second thermalization is between polarisation 300 and second diaphragm 320.
Then, in step 709, heat, make first diaphragm 310 and second diaphragm 320 attach to the first surface 301 and the second surface 302 of polarisation 300 respectively, to form Polarizer 400.Step 709 is to utilize the vaporific colloid of second thermalization of the vaporific colloid of first thermalization of baking oven 250 heating first diaphragms 310 and 300 of polarisation among Fig. 2 and second diaphragm 320 and sub 300 of polarisation, and the temperature range that baking oven 250 heats is 40～120 ℃.
The bonding device and method of the Polarizer that the above embodiment of the present invention is disclosed, be respectively by the vaporific colloid of first thermalization and the vaporific colloid of second thermalization as the medium that first diaphragm and second diaphragm is bonding on polarisation.Vaporific colloid of first thermalization and the vaporific colloid of second thermalization have reduced the moisture ratio that itself comprised in air; in addition, first diaphragm of preheating, second diaphragm and polarisation further allow vaporific colloid of first thermalization and the interior moisture of the vaporific colloid of second thermalization reduce in the present embodiment.Therefore, the length of baking oven can correspondingly reduce, to reduce the flexibility ratio of equipment cost and increase spatial configuration.In addition, the vaporific colloid of first thermalization in Polarizer and the thickness of the vaporific colloid of second thermalization can reduce, and the uniformity coefficient of vaporific colloid of first thermalization and the vaporific colloid distribution of second thermalization can increase.
In sum, though the present invention with the preferred embodiment disclosure as above, yet it is not to be used to limit the present invention.The general technical staff of the technical field of the invention under the premise without departing from the spirit and scope of the present invention, can do various changes and modification.Therefore, protection scope of the present invention is worked as with being as the criterion that claims were defined.
Symbol description
100: bind the 110a of mechanism, 110b: dispense tip
120a, 120b: pressing roller 130,250: baking oven
150a, 150b: diaphragm 160,300: polarisation
170,400: Polarizer 200: bind device
211: the first atomizers of 210: the first spraying heating arrangements
213: the first pre-roasting baking ovens spraying in 220: the second heating arrangements
223: the second pre-roasting baking ovens of 221: the second atomizers
240: the second pressing rollers of 230: the first pressing rollers
280: the second preheating rollers of 270: the first preheating rollers
290: main preheating roller 301: first surface
302: 310: the first diaphragms of second surface
320: the second diaphragms.
Claims (10)
1. the bonding device of a Polarizer is used for first diaphragm is bonding on the first surface of polarisation, and described bonding device comprises:
The first spraying heating arrangements is used for forming the vaporific colloid of first thermalization on described first diaphragm;
The first pressing roller contacts described first diaphragm, and the described first pressing roller is used for described first diaphragm is pressed on the described first surface of described polarisation, and the vaporific colloid of described first thermalization is between described polarisation and described first diaphragm; And
Baking oven, described first diaphragm and described polarisation are by described baking oven, and described baking oven is used to toast the vaporific colloid of first thermalization between described polarisation and described first diaphragm, makes described first diaphragm attach to the first surface of described polarisation.
2. bonding device according to claim 1 also comprises:
At least one first preheating roller contacts described first diaphragm, and the described first preheating roller is used to heat described first diaphragm.
3. bonding device according to claim 1, the wherein said first spraying heating arrangements comprises:
First atomizer, towards the described first diaphragm setting, described first atomizer is used to produce vaporific colloid; And
The first pre-roasting baking oven, described first diaphragm are by the described first pre-roasting baking oven, and the described first pre-roasting baking oven is used to toast described first diaphragm and heats described vaporific colloid, so that described vaporific colloid changes the vaporific colloid of described first thermalization into.
4. bonding device according to claim 3, wherein said first atomizer are arranged in the described first pre-roasting baking oven.
5. bonding device according to claim 1, wherein said bonding device also is used for second diaphragm is bonding on the second surface of described polarisation, and described second surface is relative with described first surface, and described bonding device also comprises:
The second spraying heating arrangements is used for forming the vaporific colloid of second thermalization on described second diaphragm; And
The second pressing roller contacts described second diaphragm, and the described second pressing roller is used for described second diaphragm is pressed on the second surface of described polarisation, and the vaporific colloid of described second thermalization is between described polarisation and described second diaphragm;
Wherein, described baking oven also is used to toast the vaporific colloid of second thermalization between described second diaphragm and described polarisation; make described first diaphragm and described second diaphragm attach to the first surface and the second surface of described polarisation respectively, to form described Polarizer.
6. bonding device according to claim 5 also comprises:
At least one second preheating roller contacts described second diaphragm, and the described second preheating roller is used to heat described second diaphragm.
7. bonding device according to claim 5, the wherein said second spraying heating arrangements comprises:
Second atomizer, towards the described second diaphragm setting, described second atomizer is used to produce vaporific colloid; And
The second pre-roasting baking oven, described second diaphragm are by the described second pre-roasting baking oven, and the described second pre-roasting baking oven is used to toast described second diaphragm and heats described vaporific colloid, so that described vaporific colloid changes the vaporific colloid of described second thermalization into.
8. bonding device according to claim 1 also comprises:
Main preheating roller contacts described polarisation, and described main preheating roller is used to heat described polarisation.
9. the bonding method of a Polarizer is used for first diaphragm is bonding on the first surface of polarisation, and described bonding method comprises:
On described first diaphragm, form the vaporific colloid of first thermalization;
Described first diaphragm is pressed on the described first surface of described polarisation, and the vaporific colloid of described first thermalization is between described polarisation and described first diaphragm; And
Heat, make described first diaphragm attach to the first surface of described polarisation.
10. bonding method according to claim 9, the step that wherein forms the vaporific colloid of described first thermalization on described first diaphragm comprises:
Form vaporific colloid; And
Heat described vaporific colloid and toast described first diaphragm, described vaporific colloid being changed into the vaporific colloid of described first thermalization, and on described first diaphragm, form the vaporific colloid of described first thermalization.
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|---|---|---|---|
| CNA2007101651264A CN101424813A (en) | 2007-10-29 | 2007-10-29 | Adhering device and method for |
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| CNA2007101651264A CN101424813A (en) | 2007-10-29 | 2007-10-29 | Adhering device and method for |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7377024B2 (en) | 2019-08-26 | 2023-11-09 | 日東電工株式会社 | Polarizing film drying device, drying method and manufacturing method thereof |
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2007
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7377024B2 (en) | 2019-08-26 | 2023-11-09 | 日東電工株式会社 | Polarizing film drying device, drying method and manufacturing method thereof |
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Open date: 20090506 |