CN101419399B - Method for modifying white defect of photomask - Google Patents
Method for modifying white defect of photomask Download PDFInfo
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- CN101419399B CN101419399B CN2008101339281A CN200810133928A CN101419399B CN 101419399 B CN101419399 B CN 101419399B CN 2008101339281 A CN2008101339281 A CN 2008101339281A CN 200810133928 A CN200810133928 A CN 200810133928A CN 101419399 B CN101419399 B CN 101419399B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/72—Repair or correction of mask defects
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
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Abstract
The invention provides a white defect correction method for a photo mask, comprising: a transmission image of a reference pattern without a white defect is obtained (step S11); after the start of correction work (step S12), a transmission image of a defect corrected part is obtained (step S13); after that, the luminance of every pixel of the transmission image is computed (step S14); one or more determination values are calculated from the arithmetic result (step S15); it is determined based on the determination value whether or not the correction work is ended or not (step S16); it is determined whether or not the work condition should be changed (step S17) before it is determined that the correction work is ended; after the work condition is changed as needed (step S18), the process after the step S13 is repeated; and when the end of correction work is determined in the step S16, the correction work is ended (step S19). Thus, white defects may be corrected with high precision and high efficiency even at complicated correction process conditions.
Description
Technical field
The present invention relates to the photomask method for modifying white defect, particularly the method for modifying white defect of shadow tone.
Background technology
In recent years, the research and development of liquid crystal indicator (Liquid Crystal Display:LCD) make progress rapidly, and along with the maximization of LCD, the photomask that uses in its manufacturing step is also maximizing.In addition, form the purpose of step from the circuit of cutting down LCD, also occurred many gray scale masks such as gray mask and half-tone mask at the LCD that is merely traditional binary mask in photomask, its practicability advances.
When photomask is made at it, be referred to as the defective of white defective and black defective.When revising white defective, through for example use laser CVD (Chemical Vapor Deposition: chemical vapour deposition) method, form accumulating film in defective part, carry out the correction of defective.When shadow tone is carried out the correction of this white defective, in order to revise the defective of half tint, need and to be controlled on the value of expectation by the transmitance that correction is processed to form the part of accumulating film.
In the past, reached the value of expectation, confirmed to revise the relation of transmitance of machined parameters and the retouch of processing in advance, revised processing according to this relation in order to make transmitance after the defect correction.Here, so-called machined parameters is temperature and the carrier gas flux of CVD unstrpped gas etc. of CVD material container of the vapour pressure of the power that is related to irradiating laser for example, irradiation time, CVD unstrpped gas.
But; In the formation of accumulating film; Owing to be related to the surface state of defect correction part, the light intensity distributions of irradiating laser and the complicated conditions such as CVD raw gas concentration of defect correction reality partly; Even confirm the relation of machined parameters and transmitance, also be difficult to the actual good repeatability that obtains.
In addition, also attempt measuring in revising processing or after the processing transmitance of retouch, judged the defect correcting method that whether finishes to revise processing according to this transmitance.As employed transmitance measuring method in this modification method; The method (the 1st transmitance measuring method) that sees through power of irradiating laser that measure to revise processing usefulness is for example arranged and the measuring detector illumination of transmitance is mapped on the processing portion, measure the method (the 2nd transmitance measuring method) that it sees through light intensity.
But, in the method for modifying white defect that uses these transmitance measuring methods, the problem below existing.Above-mentioned the 1st transmitance measuring method is to use the light of the irradiating laser of revising processing usefulness to measure the method for transmitance, and it is often different with the wavelength of the light source of the exposure device that is used for photomask to revise the wavelength of irradiating laser of processing usefulness usually.Therefore, need the transmitance of being measured is converted into the optical source wavelength transmitance down of the exposure device of photomask, and the spectrophotometric transmittance of retouch owing to it membranous and thickness and different, also receive the influence of processing conditions in addition.Therefore, in fact exist the problem of the conversion difficult treatment of transmitance.
In addition; In the measuring method of the 2nd transmitance, need and assemble detector light, make its size little than the defect correction part; And light shine the optical system on the defect correction part, and will be through the optical system of detector optical convergence on photodetector of accumulating film.If they are assembled on the illuminating optical system of processing with laser,, exist that so-called optical system maximizes and the problem of weight increase then because the increase of number of components and design complicated.
Except these problem, defect correction on half-tone mask part is generally all complex-shaped, and for the retouch that shape is so complicated covers interior to measure transmitance, need shine the detector photoscanning.Therefore, also there is the problem that is difficult to realize transmitance measurement efficiently and white defect correction.
On the other hand, the spy opens in the 2000-162760 communique when the defect correction of photomask, to utilize the technology of Flame Image Process for example to be disclosed in.But traditional image is handled and to be mainly used in the defective of judging in the binary mask and to have or not, particularly not with to the flaw evaluation of the medium tone of shadow tone for example transmitance etc. be that purpose is used.
Summary of the invention
The present invention's purpose is, even the correction processing conditions for complicacy is provided, and also can high precision, the photomask method for modifying white defect of the white defective of high-level efficiency correction.
Photomask method for modifying white defect of the present invention is revised the white defective of processing photomask with the laser CVD method, it is characterized in that comprising: obtain with above-mentioned white defective same position on no white defective reference pattern through the step of image; Obtaining the defect correction step that sees through image partly of having done above-mentioned correction processing under the same condition of image with seeing through of above-mentioned reference pattern; The step that sees through image of above-mentioned reference pattern of calculation process and above-mentioned defect correction part; The decision content more than at least 1 of calculating according to the result from above-mentioned calculation process judges whether to finish above-mentioned correction processing steps; Finish above-mentioned correction first being processed being judged as, the repeating step that the step to the major general from the step that sees through image that obtains above-mentioned defect correction part repeats; In this repeating step,, judge whether to change the step of above-mentioned correction processing conditions according to above-mentioned decision content.
In the present invention, obtain the image that sees through that sees through image and defect correction part of reference pattern under the same conditions.Here so-called the same terms refers to pattern position, lighting condition (transmission illumination light wavelength and transmission illumination light light quantity etc.) and shooting condition from the image for example (multiplying power of object lens, the kind of object lens, kind, camera gain, biasing and the time shutter etc. of observing multiplying power, video camera) and waits and consider the influence that sees through image and definite rated condition is identical.And these see through the resulting operation result of image and calculate the decision content more than at least 1 from calculation process, judge whether to finish to revise processing according to this decision content, and whether will change processing conditions.So, need not directly to measure the correction state that transmitance just can be estimated the defect correction part.In addition, for the operation result that for example sees through each pixel of image,,, also can carry out the evaluation of whole defect correction part efficiently even for the such complicated shape of the white defective of half-tone mask through obtaining its mean value etc.
At this moment, the above-mentioned calculation process that sees through image also can comprise the processing of brightness that deducts each pixel of above-mentioned defect correction part from the brightness of each pixel of above-mentioned reference pattern.So,, can be easily compare, estimate with the brightness of reference pattern with the transmitance of defect correction part form as the brightness of each pixel.In addition; Processing is revised on the brightness ground that is similar to reference pattern through the brightness that makes the defect correction part; Even the correction processing conditions, particularly be difficult to fully know, the measurement of transmitance is brought the condition change of influence, also can be accurately near the transmitance of expectation.
In addition, the above-mentioned calculation process that sees through image also can comprise the correcting process that sees through offset on the image of image to above-mentioned reference pattern and above-mentioned defect correction part.
Moreover the above-mentioned calculation process that sees through image also can comprise at least one side's of adjustment the above-mentioned processing that sees through the brightness of image, makes the brightness that sees through image of relevant above-mentioned reference pattern and above-mentioned defect correction part become white level and black level equates separately.
In addition, above-mentioned correction processing begins before can being arranged in obtaining through image of initial above-mentioned defect correction part, is being judged as the above-mentioned correction processing of end back end.So, can, the correction processing of white defective obtain the image that sees through of defect correction part in carrying out in real time, estimate.
Also have, above-mentioned correction processing can be arranged in seeing through of above-mentioned defect correction part and stop for the time being before image being obtained, and does not finish to begin after the above-mentioned correction processing being judged as again.So, even, also can not bring influence ground not revise processing to transmitance owing to the restriction of processing speed is difficult to carry out in real time under the situation of defect correction evaluation partly.
According to the present invention, even but can provide for the correction processing conditions of the complicacy also photomask method for modifying white defect of the white defective of high-accuracy high-efficiency rate correction.
Description of drawings
Fig. 1 is the process flow diagram of the photomask method for modifying white defect of expression the present invention the 1st embodiment.
Fig. 2 is the synoptic diagram in order to the subtraction process that sees through image in the photomask method for modifying white defect of explanation the present invention the 1st embodiment.
Fig. 3 is the process flow diagram of the photomask method for modifying white defect of expression the present invention the 2nd embodiment.
Embodiment
Below, specify with regard to embodiments of the invention with reference to accompanying drawing.At first, the 1st embodiment of the present invention is described.Fig. 1 is the process flow diagram of the photomask method for modifying white defect of expression the present invention the 1st embodiment, and Fig. 2 is the synoptic diagram of explanation about the calculation process that sees through image of the defect correction part of reference pattern and white defective.
As shown in Figure 1, begin the correction operations of white defective, shown in step S11, at first obtain no white defective reference pattern see through image.More particularly, take the image that sees through of reference pattern, obtain the brightness data of its each pixel.In following steps, this reference pattern for the defect correction part of having done the processing of white defect correction, become obtain see through image and calculation process the time benchmark.Light source when being used for seeing through image and obtaining uses the optical source wavelength of the exposure device with photomask or the illumination light of the wavelength that it closely is close to.
Then, the image that sees through to being obtained carries out suitable smoothing as required and handles, and removes noise contribution, on its each pixel, revises the change that changes the white black level that causes in short-term by the transmission illumination light quantity.Here; The change correction of white black level is obtaining under the situation of image with the for example monochrome digital video camera of 10 bit gradation; Luminance transformation on the glass substrate that does not form photomask is become 1024 (white levels), the luminance transformation on the photomask that is formed on the glass substrate is become zero (black level).The brightness of level is obtained with following equality 1 wherein.Moreover in order to shorten the processing time, the pixel of revising is limited in the predetermined defect correction part.In addition, essential location, the position on the image of reference pattern and defect correction part, the influence that waits with the not even phantom (ghost) that results from optical system of the illumination of removing transmission illumination light and correct unanimity.Therefore, in this step,, obtain the position of pattern edge or the centre of gravity place of pattern in advance about the non-defect pattern of white level or black level.
[formula 1]
Then, shown in step S12, begin to revise processing.Revise processing according to predetermined machined parameters, form accumulating film in white defective part with the laser CVD method.In the present embodiment, the correction processing that begins at step S12, be performed until after be judged as process finishing among the step S16 that states, and finish at step S19.
Continue it, shown in step S13, obtain the image that sees through of defect correction part.In this step, use with step S11 in the seeing through image and obtain of reference pattern the time identical condition obtain the image that sees through of defect correction part.Here; So-called identical condition refers to according to pattern position, lighting condition (transmission illumination light wavelength and transmission illumination light quantity etc.) and shooting condition on the image for example (multiplying power of object lens, the kind of object lens, observe multiplying power, the kind of video camera, gain, biasing and the time shutter etc. of video camera) and waits consideration to definite rated condition is identical through the influence of image.For the image of being obtained that sees through, the same with above-mentioned step S11, carry out the change correction of smoothing processing and white black level in case of necessity.
Then, shown in step S14, carry out the calculation process of the image of obtaining.Image operation about this step is handled, and describes with synoptic diagram shown in Figure 2.Among Fig. 2, for simplicity, illustrate with image 3 after the seeing through image 1, defect correction and see through image 2 and calculation process of reference pattern, but the brightness data (2 dimension array data) that is actually images recorded in the memory storage carries out calculation process.
As shown in Figure 2, the image 1 that sees through of reference pattern has reference pattern 11 and photomask pattern 12 and 13.Reference pattern 11 be in the middle of transmitance pattern (below be called halftone pattern), photomask pattern 12,13 is respectively the black level pattern.Except reference pattern 11 and photomask pattern 12 and 13, be the white level zone that does not form photomask.As stated, the image 1 that sees through of reference pattern has been done the above-mentioned smoothing processing and the change correction of white black level.In addition, the pattern edge position (x on the image of photomask 13
1, y
1) obtain with pixel unit.
The image 2 that sees through of defect correction part has defect correction part 21 and photomask pattern 22 and 23.Defect correction part 21 is halftone patterns.Owing to produce white defective in this part, be processed to form accumulating film with revising.The image 2 that sees through of defect correction part has done too that smoothing is handled and the change correction of white black level.In addition, the pattern edge position (x on the image of photomask 23
2, y
2) obtain with pixel unit.
Then; In order to remove the influence of the offset on the pattern edge that remains in reference pattern 11 and defect correction part 21; To be fixed on the black level from the brightness of the inboard certain pixel of pattern edge separately; Then, carry out the image operation processing that sees through image 2 that sees through image 1 and defect correction part of reference pattern, the offset between correction image with following equality 2.
[formula 2]
I
3(x，y)＝I
1(x，y)-I
2(x-x
2+x
1，y-y
2+y
1)
In equality 2, I
1(x, y), I
2(x, y) and I
3(x y) representes respectively for the brightness on the location of pixels (x, y) of the image after reference pattern, defect correction part and the calculation process.Shown in equality 2, deduct the brightness of the pixel that sees through image 2 of defect correction part through the pixel intensity that sees through image 1 from reference pattern, obtain comprising the image 3 of the defective part 31 after the calculation process.
Then, shown in the step S15 of Fig. 1, according to by the brightness I after equality 2 calculation process
3(x, y) calculate after judge whether to finish to process the value of using when whether changing processing conditions in the step stated.Below, the value of calculating among this step S15 is generically and collectively referred to as " decision content ".Here, as decision content, with regard to the brightness I of the image after the calculation process
3(x y), calculates the poor of mean value, maximal value, minimum value and maximal value and minimum value.Moreover, through calculating mean value, know fully that according to its symbol brightness is surpassing and deficiency of transmitance easily, its absolute value is more little, and the possibility of brightness that the brightness of defect correction part 21 is similar to reference pattern 11 is big more.But,,, also have the mean value of apparent to become the situation of the value that sees through image 1 that approaches reference pattern in surpassing and deficiency when roughly balanced of brightness even the difference of maximal value and minimum value is big.Therefore, be necessary the difference of maximal value and minimum value is calculated as decision content.
Then, shown in step S16, the decision content of calculating according to step S15 judges whether to finish to revise processing.Here, judge whether the decision content of being calculated is in according in the transmitance and the predefined qualified reference range of permissible range thereof as target.In the judgement, when the difference of mean value and maximal value and minimum value is all in acceptability limit as normal termination, with mean value in qualified reference range and the difference of maximal value and minimum value outside qualified reference range the time as abnormal ending.If normal termination or abnormal ending all get into step S19 and finish to revise processing, correction operations also just so finishes.If result of determination is that normal termination and abnormal ending all do not meet, then get into the processing of step S17.
In above-mentioned step S16,, then shown in step S17, judge whether to change processing conditions according to decision content if be judged to be normal termination and abnormal ending does not all meet.Here, at first, write down decision content during from the processing beginning one by one.Below, as an example,, infer brightness I when judging the next time of step S16 according to the passing of decision content
3(whether x, mean value y) become below the setting value of regulation in the qualified reference range.If infer that mean value becomes below the setting value, then be judged as the change processing conditions, get into the processing of step S18.If being inferred as mean value does not become below the setting value, then be judged as constant more processing conditions, turn back to the processing of step S13.
In above-mentioned step S17,, then shown in step S18, carry out the change of processing conditions and handle if be judged as the change processing conditions.Here, according to the inferred results of step S17, the machined parameters of processing is revised in change.In the example of above-mentioned step S17, for example change machined parameters, the stackeding speed that is formed on the accumulating film on the defect correction part is descended.After this, process according to machined parameters continuation dialogue defective part correction after changing.After the processing of the step that is through with S18, be back to the processing of step S13.
Below, describe with regard to the effect of present embodiment.In the present embodiment, in correction processing is carried out, obtain the image that sees through of reference pattern and defect correction part,, obtain brightness I through processing that they are subtracted
3(x, y).According to from this brightness I
3(x, the qualified reference range or the setting value of decision content of y) calculating and regulation, the judgement that whether finishes to process or do not change processing conditions.
In the present embodiment, the image of reference pattern of just under identical conditions, obtaining and defect correction part pattern subtracts each other through brightness data and to estimate, can be easily with the form of brightness relatively reference pattern and defect correction transmitance partly.In addition, even when under the condition that the surface state of the part of defect correction for example and CVD raw gas concentration etc. are difficult to fully know, producing change, also can estimate the transmitance of defect correction part accurately.And, calculate mean value etc. through the brightness of each pixel after calculation process, can easily make the evaluation that covers whole defect correction part.Therefore, there is no need as traditional, to carry out the detector photoscanning, can realize estimating efficiently.
In addition; According to present embodiment; Need see through the light source and the filming apparatus of image in order to shooting, but there is no need to append, also there is no need scan detector light in order fully to know transmitance in order to shine, to assemble the optical system of the measuring detector light of transmitance etc.Therefore, need not to increase weight and the component count etc. of the white defect correction device of photomask, transmitance that can the whole defect correction part of efficient evaluations.Shown in as described above, the method for modifying white defect of present embodiment can be specially adapted to the correction of the white defective of defect correction complex-shaped halftone pattern partly.
Moreover, in the present embodiment, before the correction processing beginning of step S12, carry out the image that sees through of 1 reference pattern shown in the step S11 and obtain, but the present invention is not limited by this.For example, for example, also can with the processing of step S11 before the processing of step S13 (after the processing of step S17 and step S18) or handle after carry out.At this moment, the number of times of obtaining that sees through image of the reference pattern in the correction operations increases, but for the change in short-term of conditions such as for example CVD raw gas concentration, can obtain with more approaching condition reference pattern and defect correction part through image.
In addition, in the present embodiment, when the judgement of secondary step S16, infer brightness I
3(whether x, mean value y) become the processing conditions change of the setting value of the regulation in the qualified reference range with the determining step S17 that gets off, but the present invention is not limited by this.For example, also can be used as the difference of inferring maximal value and minimum value and whether be in the tendency that becomes big.In addition, for example for mean value, also can make mean value gradually near qualified reference range with the extraneous arbitrary value of qualified benchmark as setting value.
Then, describe with regard to the 2nd embodiment of the present invention.Fig. 3 is the process flow diagram of the photomask method for modifying white defect of expression the present invention the 2nd embodiment.Moreover in Fig. 3, about the step identical with flow process shown in Figure 1 has same tag, it specifies omission.
At first, obtain about the image that sees through of the reference pattern shown in the step S11 of Fig. 3, identical with the 1st above-mentioned embodiment.Then, shown in step S22, carry out the correction processing of dialogue defective part.Here, the same with the 1st above-mentioned embodiment, according to predetermined machined parameters, form accumulating film with the laser CVD method in defective part and revise white defective.In the present embodiment, revise be processed on the processing this point that this step stops, getting into then step S13 for the time being different with above-mentioned the 1st embodiment.Defect correction shown in follow-up step S13 to 15 step part see through that image is obtained, the computing of image and each step of calculating of decision content, identical with the 1st above-mentioned embodiment.
Then, shown in step S26,, judge whether to finish correction operations according to the decision content of calculating by step S15.Here, the same with the 1st above-mentioned embodiment, the decision content of being calculated judges whether be in the predetermined qualified reference range according to transmitance and permissible range thereof as target.In the judgement, when both of the difference of mean value and maximal value and minimum value are in qualified reference range as normal termination, mean value in qualified reference range and the difference of maximal value and minimum value outside qualified reference range the time as abnormal ending.Under the situation of normal termination or abnormal ending, finish correction operations same as before.If the result who judges is that any one does not all meet in normal termination and the abnormal ending, then get into the processing of step S17.
In above-mentioned step S26,, then shown in step S17, judge whether to change processing conditions according to decision content if be judged as normal termination and abnormal ending does not all meet.In addition, in step S17,, then shown in step S18, carry out the change of processing conditions and handle if be judged as the change processing conditions.Step S17 is identical with above-mentioned the 1st embodiment with step S18 contents processing separately.In step S17,, then turn back to the processing of step S22 if be judged as after constant processing of more processing conditioned disjunction step S18 finishes.
In the modification method of present embodiment, after the correction processing of carrying out with step S22 stops for the time being, obtain the image that sees through of defect correction part., through the subtraction process of image, whether change the judgement of processing conditions and as required carry out the processing of processing conditions change after, be back to step S22, begin to revise processing more thereafter.Therefore, come compared with the 1st embodiment, the correction operations required time is elongated, even but have under the slow situation of the processing speed of each step, can be to the influential advantage of transmitance of defect correction part yet.
Moreover, in the present embodiment, obtaining before the correction processing and implementation of step S22 through image of the reference pattern shown in the step S11 carried out 1 time, but the present invention is not limit by this.For example, also can the processing of step S11 be carried out before or after the processing of step S13.In this case; After correction processing stops for the time being, all need obtain the image that sees through of reference pattern at every turn, but for example; For the change in short-term of conditions such as CVD raw gas concentration, can obtain the image that sees through of reference pattern and defect correction part with more approaching condition.
The present invention is applicable to the white defect correction of the photomask of the manufacturing of for example liquid crystal indicator.
Claims (6)
1. photomask method for modifying white defect with the white defective of laser CVD method correction processing photomask, it is characterized in that comprising the steps: obtaining with said white defective same position on no white defective reference pattern through image; With the seeing through under the identical condition of image of said reference pattern, obtain the image that sees through of the defect correction part of having done said correction processing; The image that sees through to said reference pattern and said defect correction part is made calculation process; According to the decision content more than at least 1 that the result from said calculation process calculates, judge whether arbitrary side in corresponding normal termination and the abnormal ending and finish said correction processing; In being judged to be not corresponding normal termination and abnormal ending, during arbitrary side, repeat from the step of the step that sees through image that obtains said defect correction part; In this repeating step, judge whether to change the condition of said correction processing according to said decision content,
Brightness I with regard to the image after the calculation process
3(x; Y); Calculate the poor of mean value, maximal value, minimum value and maximal value and minimum value; When the difference of mean value and maximal value and minimum value is all in qualified reference range as normal termination, with mean value in qualified reference range and the difference of maximal value and minimum value outside qualified reference range the time as abnormal ending.
2. photomask method for modifying white defect as claimed in claim 1 is characterized in that, the said calculation process that sees through image comprises: deduct the processing of brightness of each pixel of said defect correction part from the brightness of each pixel of said reference pattern.
3. according to claim 1 or claim 2 photomask method for modifying white defect is characterized in that, the said calculation process that sees through image comprises: see through image, the processing of the offset on the correction image for said reference pattern and said defect correction part.
4. according to claim 1 or claim 2 photomask method for modifying white defect; It is characterized in that; The said calculation process that sees through image comprises: for the brightness that sees through image of said reference pattern and said defect correction part; Adjust at least one side's the said brightness that sees through image, so that white level and black level become equal processing separately.
5. according to claim 1 or claim 2 photomask method for modifying white defect is characterized in that, the image that sees through that said correction is processed in initial said defect correction part begins before obtaining, and finishes said correction processing back and finishes being judged as.
6. according to claim 1 or claim 2 photomask method for modifying white defect is characterized in that, the image that sees through that said correction is processed in said defect correction part stops before obtaining for the time being, does not finish to begin after the said correction processing being judged as again.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-182248 | 2007-07-11 | ||
| JP2007182248A JP5127328B2 (en) | 2007-07-11 | 2007-07-11 | Photomask white defect correction method |
| JP2007182248 | 2007-07-11 |
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| Publication Number | Publication Date |
|---|---|
| CN101419399A CN101419399A (en) | 2009-04-29 |
| CN101419399B true CN101419399B (en) | 2012-04-18 |
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| CN2008101339281A Expired - Fee Related CN101419399B (en) | 2007-07-11 | 2008-07-11 | Method for modifying white defect of photomask |
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| JP (1) | JP5127328B2 (en) |
| KR (1) | KR100960546B1 (en) |
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| JP2011227209A (en) * | 2010-04-16 | 2011-11-10 | Cowin Dst Co Ltd | Repair method and repair system for half tone mask |
| US8741506B2 (en) | 2012-06-15 | 2014-06-03 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Mask and repairing method therefor |
| CN102736405B (en) * | 2012-06-15 | 2014-07-16 | 深圳市华星光电技术有限公司 | Photomask and amendment method therefor |
| CN103019029B (en) * | 2012-12-03 | 2015-02-11 | 深圳清溢光电股份有限公司 | Method and device for reducing strips of photomask plates |
| JP6386898B2 (en) * | 2014-12-15 | 2018-09-05 | 株式会社ニューフレアテクノロジー | Inspection method and inspection apparatus |
| JP6513951B2 (en) * | 2015-01-08 | 2019-05-15 | 株式会社ニューフレアテクノロジー | Inspection method |
| JP2019003203A (en) * | 2018-08-10 | 2019-01-10 | 株式会社ニューフレアテクノロジー | Inspection method and inspection apparatus |
| JP7105135B2 (en) * | 2018-08-17 | 2022-07-22 | 東京エレクトロン株式会社 | PROCESSING CONDITIONS CORRECTION METHOD AND SUBSTRATE PROCESSING SYSTEM |
| TWI838399B (en) * | 2018-09-28 | 2024-04-11 | 日商Ｈｏｙａ股份有限公司 | Photomask substrate repairing method, photomask substrate manufacturing method, photomask substrate processing method, photomask manufacturing method, and substrate processing apparatus |
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| JP2000330261A (en) * | 1999-05-24 | 2000-11-30 | Toppan Printing Co Ltd | Laser correcting device and method for guaranteeing defect of photomask |
| US6634018B2 (en) | 2000-08-24 | 2003-10-14 | Texas Instruments Incorporated | Optical proximity correction |
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- 2008-07-11 KR KR1020080067565A patent/KR100960546B1/en not_active IP Right Cessation
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| CN1448783A (en) * | 2002-03-28 | 2003-10-15 | 保谷株式会社 | Method for correcting defect of grey part in grey mask |
| CN1534365A (en) * | 2003-04-01 | 2004-10-06 | Hoya株式会社 | Defect examining method of gray mask and mfg. method thereof |
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| JP特开2004-356330A 2004.12.16 |
| JP特开2006-330017A 2006.12.07 |
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Also Published As
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| CN101419399A (en) | 2009-04-29 |
| JP5127328B2 (en) | 2013-01-23 |
| KR20090006793A (en) | 2009-01-15 |
| KR100960546B1 (en) | 2010-06-03 |
| JP2009020277A (en) | 2009-01-29 |
| TW200923566A (en) | 2009-06-01 |
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