CN101418440A - Method for preparing metal membrane on porous matrix by chemical plating - Google Patents
Method for preparing metal membrane on porous matrix by chemical plating Download PDFInfo
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- CN101418440A CN101418440A CNA2008102447118A CN200810244711A CN101418440A CN 101418440 A CN101418440 A CN 101418440A CN A2008102447118 A CNA2008102447118 A CN A2008102447118A CN 200810244711 A CN200810244711 A CN 200810244711A CN 101418440 A CN101418440 A CN 101418440A
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- plating bath
- nickel
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- 239000011159 matrix material Substances 0.000 title claims abstract description 48
- 238000007747 plating Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 21
- 239000002184 metal Substances 0.000 title claims abstract description 21
- 239000000126 substance Substances 0.000 title claims abstract description 13
- 239000012528 membrane Substances 0.000 title description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000007772 electroless plating Methods 0.000 claims description 27
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 229910052763 palladium Inorganic materials 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 239000011734 sodium Substances 0.000 claims description 7
- 241000080590 Niso Species 0.000 claims description 6
- 229910001096 P alloy Inorganic materials 0.000 claims description 6
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 claims description 5
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 claims description 5
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 101150003085 Pdcl gene Proteins 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 229910052723 transition metal Inorganic materials 0.000 claims description 4
- 150000003624 transition metals Chemical class 0.000 claims description 4
- 101710134784 Agnoprotein Proteins 0.000 claims description 3
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 3
- 239000003792 electrolyte Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000004310 lactic acid Substances 0.000 claims description 3
- 235000014655 lactic acid Nutrition 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 235000011006 sodium potassium tartrate Nutrition 0.000 claims description 3
- 208000004631 alopecia areata Diseases 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000000576 coating method Methods 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 11
- 230000004913 activation Effects 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 206010070834 Sensitisation Diseases 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001235 sensitizing effect Effects 0.000 description 2
- 239000008399 tap water Substances 0.000 description 2
- 235000020679 tap water Nutrition 0.000 description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 238000006424 Flood reaction Methods 0.000 description 1
- 206010016825 Flushing Diseases 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- 241001124569 Lycaenidae Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 235000019219 chocolate Nutrition 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
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Abstract
The invention relates to a method for chemically plating a metal film on a porous matrix, that is, before the chemical plating, an activated matrix is preheated in hot water, and the preheating temperature is higher than the normal temperature of the chemical plating. The chemical plating can be initiated quickly as soon as the hot matrix contacts a plating solution, so that an even and continuous metal film is formed on the surface of the matrix to lay a good foundation for the growth of subsequent films. The method effectively avoids the problems of uneven plating coats or even alopecia areata, and improves the adhesive force of the metal film.
Description
Technical field
The present invention relates to a kind of on porous matrix the method for chemical plating metal film, to solve the problem of the final quality of coating of the uneven influence of electroless plating initial stage matrix surface metal deposition speed.
Background technology
The metallic membrane that with the porous material is matrix has purposes widely in fields such as gas delivery, electrochemistry, electronics, and film-forming method has electroless plating, plating, physical vapor deposition, chemical vapour deposition, thermospray or the like.Electrochemical plating only are applicable to conductive substrate material, and are subjected to the restriction of base shape; Though vapour deposition process reported in a large number, cost height, metal deposition efficient are low, only are suitable for preparing extremely thin metallic membrane, and require very high to the aperture and the surface smoothness of matrix; The metallic membrane of hot spray process preparation is thicker and inhomogeneous, and the film defective is more; Electroless plating is electroless plating or autocatalytic plating again, is under the situation of no impressed current, by chemical reaction reducing metal salt, simultaneously, the metal that reaction generates can also continue this chemical reaction of catalysis, thereby the growth that realizes metal level thickens, and forms the successive metallic membrane.Electroless plating almost can be on the matrix of different shape and material plated film, it has become the prefered method of preparation metallic membrane on the porous matrix material.Porous matrix material comprises porous ceramics, porous metal, sintered glass, porous polymer materials etc.
Electroless plating generally comprises several steps such as matrix cleaning, matrix surface activation, plated film, aftertreatment.Nonmetallic surface needs to deposit the layer of metal particulate in advance equably as catalyzer, and when electroless plating, metal will be deposited on these particulates like this, forms bigger metallic particles, joins each other up to them, in flakes film forming.Good activating process can make the metal particle particle diameter of generation little, is evenly distributed, strong adhesion.Activation method has many kinds, but mostly selects the catalyzer of palladium as matrix surface for use.Chang Yong activation method is for soaking the palladium method, promptly with Sn the most
2+As reductive agent and Pd
2+Reaction forms the particulate of palladium metal, simultaneously Sn
2+And Sn
4+Hydrolysis at matrix surface also can form one deck colloid, and the particulate of palladium is played fixed action.When carrying out electroless plating, if can not form metal level at matrix surface as early as possible, this active layer may be destroyed because of the erosion of plating bath, and the result can make the thickness of metal film inequality that plates out, even the alopecia areata phenomenon occurs.Therefore, initial stage in electroless plating, should accelerate the plated film process as far as possible, in case matrix surface forms successive coating, then can stop the erosion of plating bath to active layer, the thin metal layer of Xing Chenging is that the further growth of rete is laid a good foundation at first, and follow-up need prevent that speed of response is too fast and produce precipitation and get final product.
Summary of the invention
The objective of the invention is to have proposed for the problem of improving the final quality of coating of the uneven influence of prior art electroless plating initial stage matrix surface metal deposition speed a kind of on porous matrix electroless plating prepare the method for metallic membrane.
Technical scheme of the present invention is: coating temperature is one of key factor that influences the electroless plating quality, and the high more metal deposition speed of temperature is fast more.But cause the metal deposition excessive velocities and form loose precipitation but temperature is too high, these precipitations can be deposited on matrix surface, be suspended in the plating bath or be deposited on the coating bath, cause the plated film failure.Therefore, be difficult to accelerate the plating speed at plated film initial stage by improving temperature.In actually operating, for keeping temperature of reaction, usually adopt heating in water bath, but the transfer mode of its heat is again to matrix surface from the coating bath to the plating bath, and porous matrix has certain water regain, need the regular hour to heat it, so heating in water bath is unfavorable for causing fast electroless plating, especially in cold season.
The present invention utilizes porous matrix these characteristics of heat accumulation that can absorb water, and the matrix after the activation is heated in advance, makes its temperature be higher than normal electroless plating temperature.Can place hot water to be heated porous matrix, preferred 60～100 ℃ of preheating temperature.Like this, the matrix of heat contacts with plating bath one and can cause electroless plating rapidly, thereby form even, successive thin metal layer rapidly at matrix surface, for the further growth of subsequent film is laid a good foundation, avoid uneven coating effectively even the problem of alopecia areata occurred, improved the sticking power of metal level.Though the matrix of heat can be lowered the temperature by plating bath after immersing plating bath, contained hot water has certain heat accumulation effect in the porous matrix, and these heats are enough to guarantee that the incunabulum stage of plated film is smooth.
Concrete technical scheme of the present invention is:
A kind of on porous matrix the method for chemical plating metal film, it is characterized in that the matrix after will activating before the electroless plating puts into hot water preheating 5～30min of 60～100 ℃, and then put into the plating bath plated film.
Wherein said porous matrix is porous ceramics, sintered glass, porous polymer materials or porous metal.For can heat-retaining non-porous matrix,, adopt the art of this patent that effect is preferably also arranged as bulk or heavy-walled matrix.
The temperature of preferred above-mentioned substrate preheating is higher than 40～70 ℃ of the temperature of electroless plating.
Described plating bath is the transition metal plating bath.Preferred transition metal is palladium, silver, copper, nickel or nickel-phosphorus alloy.
The present invention is consisting of of palladium plating solution more preferably: the PdCl of 2～6g/L
2, the disodium ethylene diamine tetraacetate (Na of 20～80g/L
2EDTA), the strong aqua of 100～400ml/L; The AgNO of consisting of of silver plating solution: 2～10g/L
3, the disodium ethylene diamine tetraacetate (Na of 20～50g/L
2EDTA), the strong aqua of 300～600ml/L; The NiSO of consisting of of nickel plating bath: 10～30g/L
46H
2O, the strong aqua of 200～300ml/L; The NiSO of consisting of of nickel-phosphorus alloy plating bath: 20～30g/L
46H
2O, the lactic acid of 200～450g/L, the ortho phosphorous acid sodium solution of 10～30g/L; The CuSO of consisting of of copper electrolyte: 5～15g/L
45H
2O, the Seignette salt (KNaC of 40～50g/L
4H
4O
64H
2O), the NaOH of 5～20g/L.
Beneficial effect:
In fact, coating quality problem great majority all are because the activation of matrix and plated film initial stage are caused uneven causing, therefore, though the method for this patent has only increased a simple and easy to do pre-heating step before plated film, great effect is but arranged to improving coating quality and yield rate.
Description of drawings
Fig. 1. do not adopt the silverskin photo that preheats the electroless plating preparation.
Fig. 2. adopted the silverskin photo that preheats back electroless plating preparation.
Embodiment
The present invention can carry out with reference to following examples.These embodiment only are used for illustrating the present invention, and the variation of any equivalence of being done under the situation that does not break away from spirit of the present invention all belongs to the scope of claim of the present invention.
Embodiment 1. chemical silverings
(1) porous ceramic pipe that provides of matrix adopting Nanjing JiuSi High-Tech Co.,Ltd, mean pore size is 0.2 μ m, external diameter 1.25cm, internal diameter 0.7cm, long 5cm.With commercially available liquid detergent solution, tap water, washed with de-ionized water.
(2) sensitization of matrix and activation.Sensitizing solution contains SnCl
2: 5g/L, concentrated hydrochloric acid (37%): 1ml/L; Activation solution contains PdCl
2: 0.2g/L, concentrated hydrochloric acid: 1ml/L.Matrix alternately floods in sensitizing solution and activation solution, all water flushings behind each dipping; Repeat sensitization-activation step 5 times, matrix surface is chocolate.
(3) matrix preheats.The water that vitrified pipe after the activation is put into 90 ℃ heats 10min.
(4) chemical silvering.Matrix after preheating is put into plating bath rapidly carry out electroless plating, silver plating solution consists of AgNO
3: 5g/L, strong aqua (28%): 250ml/L, disodium ethylene diamine tetraacetate (Na
2EDTA): 35g/L.Coating temperature is 20 ℃, and reductive agent is the N of 0.5mol/L
2H
4Solution.
(5) when silverskin reaches 3 μ m, take out also and use tap water and washed with de-ionized water successively, place 120 ℃ baking oven inner drying.Compare with the common process that does not carry out substrate preheating, homogeneity, density and the surface brightness of silver-plated film all have and improve (as Fig. 2), thoroughly stopped the problem of the rete inhomogeneous (as Fig. 1) that occurs in the coating process.
Embodiment 2. chemical palladium-platings
(1) with step (1), (2) of embodiment 1.
(2) with the step (3) of embodiment 1, but preheating temperature is 70 ℃, and the time is 5min.
(3) with the step (4) of embodiment 1, but plating bath changes palladium plating solution into, and it consists of PdCl
2: 5g/L, strong aqua: 250ml/L, Na
2EDTA:70g/L.The electroless plating temperature is 30 ℃, heating in water bath.
(4) with the step (5) of embodiment 1.
Embodiment 3. chemical palladium-platings
(1) with step (1), (2) of embodiment 1.But matrix is a Porous Stainless Steel, and its surface contains the ZrO of thick about 100 μ m
2Coating, mean pore size are 0.5 μ m.The long 10 μ m of matrix, external diameter 10mm, internal diameter 6mm.
(2) with the step (3) of embodiment 1, but preheating temperature is 70 ℃, and the time is 15min.
(3) with step (3), (4) of embodiment 2.
Embodiment 4. chemical nickel platings
(1) with step (1), (2) of embodiment 1.
(2) with the step (3) of embodiment 1, but preheating temperature is 100 ℃, and the time is 20min.
(3) with the step (4) of embodiment 1, but plating bath changes nickel plating bath into, and it consists of NiSO
46H
2O:30g/L, strong aqua: 250ml/L.The electroless plating temperature is 60 ℃, passes through heating in water bath.
(4) with the step (5) of embodiment 1.
Embodiment 5. chemical nickel platings-phosphorus alloy
(1) with step (1), (2) of embodiment 1.
(2) with the step (3) of embodiment 1, but preheating temperature is 100 ℃, and the time is 30min.
(3) with the step (4) of embodiment 1, but plating bath changes the nickel-phosphorus alloy plating bath into, and it consists of NiSO
46H
2O:21g/L, lactic acid: 443g/L, propionic acid: 2g/L.Reductive agent is the ortho phosphorous acid sodium solution of 23g/L.Additive is a tartrate, plating bath pH=4.7.The electroless plating temperature is 60 ℃.
(4) with the step (5) of embodiment 1.
Embodiment 6. electroless coppers
(1) with step (1), (2) of embodiment 1.
(2) with the step (3) of embodiment 1, but preheating temperature is 100 ℃, and the time is 20min.
(3) with the step (4) of embodiment 1, but plating bath changes copper electrolyte into, and it consists of CuSO
45H
2O:10g/L, Rochelle salt: 45g/L, NaOH:10g/L.Reductive agent is the formaldehyde solution of 0.2mol/L, and the electroless plating temperature is 60 ℃, passes through heating in water bath.
(4) with the step (5) of embodiment 1.
Claims (6)
1. the method for a chemical plating metal film on porous matrix is characterized in that the matrix after will activating before the electroless plating directly puts into hot water preheating 5～30min of 60～100 ℃, and then puts into the plating bath plated film.
2. method according to claim 1 is characterized in that described porous matrix is porous ceramics, sintered glass, porous polymer materials or porous metal.
3. method according to claim 1, the temperature that it is characterized in that substrate preheating are higher than 40～70 ℃ of the temperature of electroless plating.
4. method according to claim 1 is characterized in that described plating bath is the transition metal plating bath.
5. method according to claim 4 is characterized in that described transition metal is palladium, silver, copper, nickel or nickel-phosphorus alloy.
6. method according to claim 5 is characterized in that the PdCl of consisting of of described palladium plating solution: 2～6g/L
2, the disodium ethylene diamine tetraacetate of 20～80g/L, the strong aqua of 100～400ml/L; The AgNO of consisting of of silver plating solution: 2～10g/L
3, the disodium ethylene diamine tetraacetate of 20～50g/L, the strong aqua of 300～600ml/L; The NiSO of consisting of of nickel plating bath: 10～30g/L
46H
2O, the strong aqua of 200～300ml/L; The NiSO of consisting of of nickel-phosphorus alloy plating bath: 20～30g/L
46H
2O, the lactic acid of 200～450g/L, the ortho phosphorous acid sodium solution of 10～30g/L; The CuSO of consisting of of copper electrolyte: 5～15g/L
45H
2O, the Seignette salt of 40～50g/L, the NaOH of 5～20g/L.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102447118A CN101418440B (en) | 2008-12-15 | 2008-12-15 | Method for preparing metal membrane on porous matrix by chemical plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102447118A CN101418440B (en) | 2008-12-15 | 2008-12-15 | Method for preparing metal membrane on porous matrix by chemical plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101418440A true CN101418440A (en) | 2009-04-29 |
| CN101418440B CN101418440B (en) | 2010-09-29 |
Family
ID=40629436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008102447118A Active CN101418440B (en) | 2008-12-15 | 2008-12-15 | Method for preparing metal membrane on porous matrix by chemical plating |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103898490A (en) * | 2014-04-11 | 2014-07-02 | 深圳市荣伟业电子有限公司 | High-reliability type chemical palladium plating liquor and cyanide-free chemical nickel-palladium-gold processing method |
| CN104278257A (en) * | 2014-10-30 | 2015-01-14 | 广州特种承压设备检测研究院 | Coating type chemical plating method based on high-temperature plating solution |
| CN104328392A (en) * | 2014-10-30 | 2015-02-04 | 广东电网有限责任公司电力科学研究院 | Coating type chemical plating method based on low-temperature plating liquid |
| CN107299336A (en) * | 2017-06-12 | 2017-10-27 | 南通赛可特电子有限公司 | A kind of chemical copper plating solution complexing agent and preparation method thereof |
| CN107541721A (en) * | 2017-09-28 | 2018-01-05 | 江西理工大学 | A kind of compound additive of chemical plating and the copper electrolyte being made from it |
| CN109082652A (en) * | 2018-10-31 | 2018-12-25 | 西南石油大学 | A kind of surface amorphous alloy conductive layer technology of preparing of non-conductive matrix |
-
2008
- 2008-12-15 CN CN2008102447118A patent/CN101418440B/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103898490A (en) * | 2014-04-11 | 2014-07-02 | 深圳市荣伟业电子有限公司 | High-reliability type chemical palladium plating liquor and cyanide-free chemical nickel-palladium-gold processing method |
| CN104278257A (en) * | 2014-10-30 | 2015-01-14 | 广州特种承压设备检测研究院 | Coating type chemical plating method based on high-temperature plating solution |
| CN104328392A (en) * | 2014-10-30 | 2015-02-04 | 广东电网有限责任公司电力科学研究院 | Coating type chemical plating method based on low-temperature plating liquid |
| CN107299336A (en) * | 2017-06-12 | 2017-10-27 | 南通赛可特电子有限公司 | A kind of chemical copper plating solution complexing agent and preparation method thereof |
| CN107541721A (en) * | 2017-09-28 | 2018-01-05 | 江西理工大学 | A kind of compound additive of chemical plating and the copper electrolyte being made from it |
| CN107541721B (en) * | 2017-09-28 | 2019-10-18 | 江西理工大学 | A kind of electroless copper plating solution |
| CN109082652A (en) * | 2018-10-31 | 2018-12-25 | 西南石油大学 | A kind of surface amorphous alloy conductive layer technology of preparing of non-conductive matrix |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101418440B (en) | 2010-09-29 |
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