CN101414205A - Double-layer computer host - Google Patents
Double-layer computer host Download PDFInfo
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- CN101414205A CN101414205A CNA2007101632954A CN200710163295A CN101414205A CN 101414205 A CN101414205 A CN 101414205A CN A2007101632954 A CNA2007101632954 A CN A2007101632954A CN 200710163295 A CN200710163295 A CN 200710163295A CN 101414205 A CN101414205 A CN 101414205A
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- circuit board
- dividing plate
- accommodation space
- casing
- layer computer
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Abstract
A two-layer computer case comprises a chassis, a partition board, a first circuit board, a second circuit board and an electrical connection component. The partition board divides the interior of the chassis into a first containing space and a second containing space. The first circuit board and the second circuit board are respectively arranged at the two side surfaces of the partition board and respectively positioned in the first containing space and the second containing space. The electrical connection component is used for electrically connecting the first circuit board and the second circuit board, thereby leading the first circuit board and the second circuit board to commonly constitute a complete electronic circuit which is needed by the operation of the two-layer computer case.
Description
Technical field
The present invention is relevant with computer mainframe structure, particularly about a kind of two-layer computer.
Background technology
Along with the circuit design of main frame is day by day complicated, the electronic package quantity on the circuit board (referring to computer main frame panel especially) also increases gradually.Electronic package quantity just can face variety of issue after increasing.After electronic package quantity on the circuit board increases, it is quite intensive that electronic package can be arranged on motherboard, and circuit board has only a side that electronic packages such as central processing unit, internal memory, drawing chip can be set usually, and the another side need be in order to be fixed in computer housing.Arrange at this electronic package under the intensive situation of phase, the layout of circuit (Layout) just can become and quite be difficult to carry out.Simultaneously, the dense arrangement electronic package can make cooling draught be difficult for circulation, and the electronic package that is positioned at the dirty place of cooling draught simultaneously also can receive the cold air that is not heated by other assembly, and causes the uncontrollable problem of temperature.
Increase the problem that is produced in order to solve electronic package quantity, the simplest method strengthens board area exactly, but the casing of main frame also must strengthen thereupon, causes the problem that takes up room.Another kind method then is to adopt the server form of (Cluster) of gathering together that the main frame framework is set, and with the simple relatively a plurality of single main frames of circuit structure, connects the multi-section main frame with network or data line, constitutes single server and gathers together.But this mode needs the multi-section main frame, and its cost relatively increases, and the multi-section main frame has taken the space equally.
Summary of the invention
In view of above problem, the object of the invention is to provide a kind of two-layer computer, and is day by day complicated with the circuit design that solves main frame, makes electronic package quantity increase institute and faces variety of issue.
In order to reach above-mentioned purpose, the invention provides a kind of two-layer computer, it includes a casing, a dividing plate, a first circuit board, a second circuit board and an electrical connection module.Dividing plate is arranged in the casing, in order to casing inside is divided into one first accommodation space and one second accommodation space.First circuit board is arranged at a side of dividing plate, and is arranged in first accommodation space.Second circuit board is arranged at the another side of dividing plate, and is arranged in second accommodation space.Electrical connection module makes first circuit board and second circuit board constitute a complete electronic circuit system jointly in order to electrically connect first circuit board and second circuit board, and is required for the two-layer computer running.
Another embodiment of the present invention provides a kind of two-layer computer, and it includes a casing, a dividing plate, a first circuit board, reaches at least one central processing unit.Dividing plate has a perforate, and dividing plate is arranged in the casing, and casing inside is divided into one first accommodation space and one second accommodation space.First circuit board is fixed in a side of dividing plate, and is arranged in first accommodation space.Central processing unit is arranged at the side of first circuit board towards dividing plate, and is positioned at perforate.Central processing unit can independently dispel the heat in second accommodation space, effectively promotes radiating effect.
Effect of the present invention is, the casing inner area is divided into two accommodation spaces with circuit board after being divided into independently first accommodation space and second accommodation space, can be under the prerequisite that does not increase the casing size, increase the total surface area of circuit board, in order to the setting of electronic package.Or, utilize the characteristic of two each self-isolation of accommodation space, different electronic modules is scattered in the different accommodation spaces cools off, solve electronic package quantity and too much cause the not good problem of air cooling radiating effect.
Below in embodiment, be described in detail detailed features of the present invention and advantage, its content is enough to make any related art techniques person of being familiar with to understand technology contents of the present invention and implements according to this, and according to the disclosed content of this instructions, claim and graphic, any related art techniques person of being familiar with can understand purpose and the advantage that the present invention is correlated with easily.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the exploded perspective view of first embodiment of the invention;
Fig. 2 is the diagrammatic cross-section of first embodiment of the invention;
Fig. 3 is the diagrammatic cross-section of second embodiment of the invention;
Fig. 4 is the exploded perspective view of third embodiment of the invention;
Fig. 5 is the diagrammatic cross-section of third embodiment of the invention;
Fig. 6 is the diagrammatic cross-section of fourth embodiment of the invention.
Wherein, Reference numeral
110 casings
110a first accommodation space
110b second accommodation space
111 loam cakes
112 lower covers
120 dividing plates
121 perforation
122 perforates
210 first circuit boards
211 central processing units
212 memory modules
213 heat abstractors
220 second circuit boards
221 memory modules
310 electrical connection modules
311 first electric connectors
312 second electric connectors
Embodiment
For making purpose of the present invention, structure, feature and function thereof there are further understanding, cooperate embodiment to be described in detail as follows now.
See also shown in Figure 1ly, be the disclosed a kind of two-layer computer of first embodiment of the invention, this two-layer computer can be independently desktop PC, a server, can be the main frame of server architecture also, is installed in the machine box for server.This two-layer computer includes a casing 110, a dividing plate 120, a first circuit board 210, a second circuit board 220, reaches two electrical connection modules.
Consult Figure 1 and Figure 2, casing 110 in order to ccontaining first circuit board 210, second circuit board 220, electrical connection module, and form other electronic package of this two-layer computer.Dividing plate 120 is to be arranged in the casing 110, and casing 110 inside are divided into one first accommodation space 110a and one second accommodation space 110b, and dividing plate 120 have two the perforation 121, in order to the power supply coupling assembling pass.In addition, casing 110 more includes a loam cake 111 and a lower cover 112, removably is fixed in the end face and the bottom surface of casing 110 respectively, in order to seal the first accommodation space 110a and the second accommodation space 110b.Or loam cake 111 and lower cover 112 can be disassembled respectively, make the first accommodation space 110a and second accommodation space 110b opening.
Consult Figure 1 and Figure 2 again, first circuit board 210 is arranged at the upper side of dividing plate 120, and is arranged in the first accommodation space 110a.And second circuit board 220 is arranged at the downside of dividing plate 120, and is arranged in the second accommodation space 110b.Each electrical connection module comprises one first electric connector 311 and one second electric connector 312 respectively, and wherein first electric connector 311 is that to be arranged at first circuit board 210, the second electric connectors 312 be to be arranged at second circuit board 220.When first circuit board 210 and second circuit board 220 are individually fixed in the upper side of dividing plate 120 and downside, first electric connector 311 of each electrical connection module can pass its institute to deserved perforation 121, and be electrically connected at the second corresponding electric connector 312, use electrically connecting first circuit board 210 and second circuit board 220, make first circuit board 210 and second circuit board 220 form a complete electronic circuit system.With the present embodiment is example, and the electronic chip of the central processing unit 211 in the electronic circuit system, logic chip group (figure does not show), the contour heat of drawing chipset (figure does not show) can be arranged at first circuit board 210.And can send high hot memory modules 221 equally, and then can be arranged on the second circuit board 220, owing to main electronic package has been arranged on the first circuit board 210, so the area of second circuit board 220 just can be used for being provided with memory modules 221 as much as possible.Thus, just can (cross-sectional area of casing 110) under the area be set, be provided with than traditional more electronic package of main frame framework identical.Electronic package on the first circuit board 210 and the electronic package on the second circuit board 220 in addition, be to lay respectively among the first accommodation space 110a and the second accommodation space 110b, therefore can be subjected to separately independently air cooling system cooling, reduce the interference of electronic package air cooling system.
The present invention is provided with two circuit boards 210,220 in same casing 110, bear the partial function of a complete electronic circuit system on each circuit board 210,220 respectively, after seeing through the electric connection of electrical connection module, just can constitute single electronic circuit system.In present embodiment, electrical connection module comprises first electric connector 311 and second electric connector 312 that can peg graft mutually, but the effect of electrical connection module is to electrically connect two circuit boards, and its kenel is not exceeded with the disclosed kenel of first embodiment.
See also shown in Figure 3ly, be the disclosed a kind of two-layer computer of second embodiment of the invention, it includes a casing 110, a dividing plate 120, a first circuit board 210, a second circuit board 220, and at least one electrical connection module 310.Dividing plate 120 is to be arranged in the casing 110, casing 110 inside are divided into one first accommodation space 110a and one second accommodation space 110b, and dividing plate 120 has at least one perforation 121.First circuit board 210 and second circuit board 220 are arranged at the upper side and the downside of dividing plate 120 respectively, and are positioned at the first accommodation space 110a and the second accommodation space 110b.Electrical connection module 310 is signal line, pass the perforation 121 of dividing plate 120, and two ends of electrical connection module 310 are connected to first circuit board 210 and second circuit board 220, and electrically connect first circuit board 210 and second circuit board 220, make first circuit board 210 and second circuit board 220 constitute a complete electronic circuit system.
Seeing also Fig. 4 and shown in Figure 5, is the disclosed a kind of two-layer computer of third embodiment of the invention, and it comprises a casing 110, a dividing plate 120 and a first circuit board 210.Dividing plate 120 is arranged in the casing 110, casing inside is divided into one first accommodation space 110a and one second accommodation space 110b, and dividing plate 120 has a perforate 122.First circuit board 210 is fixed in the upper side of dividing plate 120, and is positioned at the first accommodation space 110a.First circuit board 210 is away from a side of dividing plate 120, the electronic package beyond capable of arranging CPU 211, for example memory modules 212, logic chip group (figure does not show), drawing chip (figure does not show) etc.211 of central processing units can be arranged at the side of first circuit board 210 towards this dividing plate 120, and are positioned at perforate 122.Establish a heat abstractor 213 on the central processing unit 211, be arranged in the second accommodation space 110b by perforate 122.Thus, by the cooling draught of the first accommodation space 110a, can be in order to the electronic package beyond the cooling central processing unit 211.And the cooling draught by the second accommodation space 110b can be concentrated cooling central processing unit 211.Two road air-flows are separated and can not interfere with each other by dividing plate 120, guarantee best cooling effect.
Seeing also shown in Figure 6ly, is the disclosed a kind of two-layer computer of fourth embodiment of the invention, and it comprises a casing 110, a dividing plate 120, a first circuit board 210, an and second circuit board 220.Dividing plate 120 is arranged in the casing 110, casing 110 inside are divided into one first accommodation space 210 and one second accommodation space 220, and dividing plate 120 has a perforate 122.First circuit board 210 is fixed in the upper side of dividing plate 120, and be positioned at the first accommodation space 110a, the two side faces of first circuit board 210 all is provided with at least one central processing unit 211, wherein a central processing unit 211 is arranged at the side of first circuit board 210 towards dividing plate 120, and be arranged in perforate 122, be located at heat abstractor 213 on this central processing unit 211 and can pass perforate 122 and protrude among the second accommodation space 110b.Another central processing unit 211 is to be arranged at the side of first circuit board 210 away from dividing plate 120, makes the heat abstractor 213 that is arranged on this central processing unit 211 be arranged in the first accommodation space 110a.
The area of second circuit board 220 is much smaller than the cross-sectional area of casing 110 or the area of dividing plate.Second circuit board 220 is the downsides that are arranged at dividing plate 120, and does not block perforate 122, protrudes in the second accommodation space 110b in order to heat abstractor 213.Dividing plate 120 has more a perforation 121, uses for an electrical connection module 310 and passes, and to electrically connect first circuit board 210 and second circuit board 220, makes first circuit board 210 and second circuit board 220 constitute a complete electronic circuit system jointly.Using under a plurality of central processing unit situations, central processing unit 211 can be divided into the two side faces of first circuit board 110, make central processing unit 211 be scattered in the first accommodation space 110a and the second accommodation space 110b, and respectively by different cooling draught coolings, to promote cooling effectiveness.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (9)
1. two-layer computer is characterized in that it includes:
One casing;
One dividing plate is arranged in this casing, and this casing inside is divided into one first accommodation space and one second accommodation space;
One first circuit board is arranged at a side of this dividing plate, and is arranged in this first accommodation space;
One second circuit board is arranged at the another side of this dividing plate, and is arranged in this second accommodation space;
One electrical connection module electrically connects this first circuit board and this second circuit board.
2. two-layer computer as claimed in claim 1 is characterized in that wherein this dividing plate has at least one perforation, and this electrical connection module is to pass this perforation.
3. two-layer computer as claimed in claim 2, it is characterized in that, wherein this electrical connection module comprises one first electric connector and one second electric connector, this first electric connector is to be arranged at this first circuit board, this second electric connector is to be arranged at this second circuit board, and wherein this first electric connector is to pass this perforation and be electrically connected at this second electric connector.
4. two-layer computer as claimed in claim 2 is characterized in that, wherein this electrical connection module is to be a signal line, and its two end is connected to this first circuit board and this second circuit board, and this signal line is to pass this perforation.
5. two-layer computer is characterized in that it comprises:
One casing;
One dividing plate has a perforate, and this dividing plate is arranged in this casing, and this casing inside is divided into one first accommodation space and one second accommodation space;
One first circuit board is fixed in a side of this dividing plate, and is arranged in this first accommodation space;
At least one central processing unit is arranged at the side of this first circuit board towards this dividing plate, and is positioned at this perforate.
6. two-layer computer as claimed in claim 5 is characterized in that, wherein comprises a second circuit board, is arranged at the another side of this dividing plate and does not block this perforate, and this second circuit board is to be electrically connected at this first circuit board.
7. two-layer computer as claimed in claim 6 is characterized in that wherein this dividing plate has a perforation, uses for an electrical connection module and passes to electrically connect this first circuit board and this second circuit board.
8. two-layer computer as claimed in claim 5 is characterized in that, wherein comprises another central processing unit at least, is arranged at the side of this first circuit board away from this dividing plate.
9. two-layer computer as claimed in claim 5 is characterized in that, wherein comprises a heat abstractor, is arranged on this central processing unit, and protrudes in this second accommodation space by this perforate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101632954A CN101414205B (en) | 2007-10-19 | 2007-10-19 | Double-layer computer host |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101632954A CN101414205B (en) | 2007-10-19 | 2007-10-19 | Double-layer computer host |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101414205A true CN101414205A (en) | 2009-04-22 |
| CN101414205B CN101414205B (en) | 2010-10-06 |
Family
ID=40594762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101632954A Expired - Fee Related CN101414205B (en) | 2007-10-19 | 2007-10-19 | Double-layer computer host |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101414205B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103901976A (en) * | 2014-04-10 | 2014-07-02 | 华为技术有限公司 | Eight-processor system and server |
| WO2016110129A1 (en) * | 2015-01-08 | 2016-07-14 | 中兴通讯股份有限公司 | Customer premise equipment |
| CN107006136A (en) * | 2016-09-26 | 2017-08-01 | 深圳市大疆创新科技有限公司 | Cooling mechanism and electron speed regulator, electronic installation with the cooling mechanism |
| CN107872937A (en) * | 2017-12-11 | 2018-04-03 | 珠海格力节能环保制冷技术研究中心有限公司 | A kind of driver |
| CN108205366A (en) * | 2016-12-19 | 2018-06-26 | 研祥智能科技股份有限公司 | Micro embedded industrial control computer |
| CN110248513A (en) * | 2018-03-07 | 2019-09-17 | 广东美的生活电器制造有限公司 | For the power panel component of food processor and with its food processor |
| CN110718960A (en) * | 2019-11-08 | 2020-01-21 | 广州视源电子科技股份有限公司 | Uninterrupted power supply complete machine |
| US11974698B2 (en) | 2018-03-07 | 2024-05-07 | Guangdong Midea Consumer Electric Manufacturing Co., Ltd. | Food processor, and power supply board assembly and base for food processor |
| WO2024125003A1 (en) * | 2022-12-15 | 2024-06-20 | 超聚变数字技术有限公司 | Computing node, computing device, and preparation method for computing node motherboard |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2380955Y (en) * | 1999-07-22 | 2000-05-31 | 海尔集团公司 | Isolation-type host housing of computer |
| CN2650453Y (en) * | 2003-08-30 | 2004-10-20 | 华为技术有限公司 | Cabinet |
| CN2909353Y (en) * | 2006-03-24 | 2007-06-06 | 保锐科技股份有限公司 | Computer envelope with partition set-up structure |
-
2007
- 2007-10-19 CN CN2007101632954A patent/CN101414205B/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103901976A (en) * | 2014-04-10 | 2014-07-02 | 华为技术有限公司 | Eight-processor system and server |
| CN103901976B (en) * | 2014-04-10 | 2017-07-28 | 华为技术有限公司 | A kind of eight processor system and server |
| WO2016110129A1 (en) * | 2015-01-08 | 2016-07-14 | 中兴通讯股份有限公司 | Customer premise equipment |
| CN107006136A (en) * | 2016-09-26 | 2017-08-01 | 深圳市大疆创新科技有限公司 | Cooling mechanism and electron speed regulator, electronic installation with the cooling mechanism |
| CN107006136B (en) * | 2016-09-26 | 2021-11-23 | 深圳市大疆创新科技有限公司 | Heat dissipation mechanism and electronic speed regulator and electronic device with same |
| CN108205366A (en) * | 2016-12-19 | 2018-06-26 | 研祥智能科技股份有限公司 | Micro embedded industrial control computer |
| CN107872937A (en) * | 2017-12-11 | 2018-04-03 | 珠海格力节能环保制冷技术研究中心有限公司 | A kind of driver |
| CN110248513A (en) * | 2018-03-07 | 2019-09-17 | 广东美的生活电器制造有限公司 | For the power panel component of food processor and with its food processor |
| US11974698B2 (en) | 2018-03-07 | 2024-05-07 | Guangdong Midea Consumer Electric Manufacturing Co., Ltd. | Food processor, and power supply board assembly and base for food processor |
| CN110718960A (en) * | 2019-11-08 | 2020-01-21 | 广州视源电子科技股份有限公司 | Uninterrupted power supply complete machine |
| WO2024125003A1 (en) * | 2022-12-15 | 2024-06-20 | 超聚变数字技术有限公司 | Computing node, computing device, and preparation method for computing node motherboard |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101414205B (en) | 2010-10-06 |
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| C14 | Grant of patent or utility model | ||
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Granted publication date: 20101006 Termination date: 20161019 |