CN101409272B - Ring-shaped surface adherence type conductor holder - Google Patents
Ring-shaped surface adherence type conductor holder Download PDFInfo
- Publication number
- CN101409272B CN101409272B CN 200710163806 CN200710163806A CN101409272B CN 101409272 B CN101409272 B CN 101409272B CN 200710163806 CN200710163806 CN 200710163806 CN 200710163806 A CN200710163806 A CN 200710163806A CN 101409272 B CN101409272 B CN 101409272B
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- China
- Prior art keywords
- ring
- type conductor
- shaped surface
- conductor holder
- adherence type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention discloses an adhesive lead frame with an annular surface used for supporting a plurality of luminescent wafers. The adhesive lead frame with the annular surface comprises an annular body, a plurality of pedestals and a plurality of brackets. The annular body comprises a plurality of concave parts. Each pedestal is connected with the annular body and is arranged in one of the concave parts, wherein, the luminescent wafers can be arranged on the pedestals. Each bracket is connected with the annular body and is provided with a contact surface.
Description
Technical field
The present invention is about a kind of surface adherence type conductor holder, and particularly relevant for a kind of ring-shaped surface adherence type conductor holder.
Background technology
Owing to have long, light and handy, low power consumption of life-span and do not contain advantages such as harmful substance such as mercury, semiconductor light-emitting elements, as light-emitting diode (Light emitting diode, LED), become a kind of very desirable new-type lighting source, and just flourish.
When the increase in demand of lighting area and intensity,, can also increase number of light sources and reach except increasing the luminous power of single LEDs.When the increase of LED number, corresponding circuit is complicated more, and how arranging a plurality of LED and corresponding circuit is a right problem of demand side.If a plurality of LED are arranged at individually on the circuit board in the square formation mode, except the problem of foregoing circuit complexity, desire in limited circuit board space, to vacate the also non-easy thing in space of this square formation.In addition, also inhomogeneous with the illuminating effect that light source was produced that square formation is arranged, especially the illumination of mid portion will be apparently higher than other positions.When desiring to make the effective lighting zone all reach minimal illumination, the illumination that then will make zone line is apparently higher than other positions.In other words, this arrangement mode wastes energy.
If LED and corresponding circuit can be set easily, reduce the complexity of design and assembling, and then save design time-histories and assembly cost.Therefore, the invention provides a kind of ring-shaped surface adherence type conductor holder, in order to satisfy the demand.
Summary of the invention
A purpose of the present invention is to provide a kind of ring-shaped surface adherence type conductor holder, and in order to carry a plurality of luminescent wafers, it can be provided with LED and corresponding circuit easily, reduce the complexity of design and assembling, and illuminating effect is even.
According to a specific embodiment, ring-shaped surface adherence type conductor holder comprises ring body, a plurality of pedestal and a plurality of support.Ring body comprises a plurality of depressed parts.Each pedestal is connected with ring body and is arranged at depressed part in one of them, and wherein luminescent wafer can be arranged on the pedestal.Each support is connected with ring body and has a contact-making surface.
Above-mentioned ring-shaped surface adherence type conductor holder, wherein this ring body be closed-loop, polygon or circular one of them.
Above-mentioned ring-shaped surface adherence type conductor holder, the contact-making surface of wherein said support is copline roughly.
Above-mentioned ring-shaped surface adherence type conductor holder, wherein this ring body comprises a basal surface.
Above-mentioned ring-shaped surface adherence type conductor holder, a wherein said pedestal pedestal wherein comprises one first basal surface, and this ring body comprises one second basal surface, and this first basal surface is exposed to this second basal surface.
Above-mentioned ring-shaped surface adherence type conductor holder, a wherein said pedestal pedestal wherein is connected with a described support support wherein.
The corresponding described pedestal of above-mentioned ring-shaped surface adherence type conductor holder, a wherein said support support wherein is at least two pedestals wherein.
Above-mentioned ring-shaped surface adherence type conductor holder, wherein each described luminescent wafer is a light-emitting diode or semiconductor laser.
Above-mentioned ring-shaped surface adherence type conductor holder, wherein this depressed part fills up a sealing to cover this luminescent wafer.
Above-mentioned ring-shaped surface adherence type conductor holder further comprises a control circuit, and wherein said luminescent wafer and described support electrically connect, and it is luminous to control described luminescent wafer that this control circuit is electrically connected to described support.
Above-mentioned ring-shaped surface adherence type conductor holder, one of them holds wherein three luminescent wafers of described luminescent wafer wherein said depressed part, and these three luminescent wafers send a ruddiness, a green glow and a blue light respectively.
The beneficial effect of ring-shaped surface adherence type conductor holder of the present invention is: it can be provided with a plurality of luminescent wafers, and it is luminous to control luminescent wafer respectively, has therefore reduced the complexity of design and assembling, and then saves design time-histories and assembly cost.
Compared to prior art, ring-shaped surface adherence type conductor holder of the present invention can be provided with a plurality of luminescent wafers, once be arranged on the circuit board, reduced the complexity of design and assembling, and then save design time-histories and assembly cost, and avoid being provided with in the prior art a plurality of single LEDs and produce problems such as processing procedure instability (repeating to place LED) and circuit layout degree of difficulty.In addition, ring-shaped surface adherence type conductor holder of the present invention adopts annular design can reach with a small amount of luminescent wafer can satisfy required illumination, does not have the too high and phenomenon that wastes energy of local illumination.And nonocclusive ring body designs applicable more polymorphic circuit arrangement, increases the applicable situation of ring-shaped surface adherence type conductor holder of the present invention.In addition, a plurality of luminescent wafers of launching different colours light can be set in single depressed part, it is luminous to control indivedual luminescent wafers by control circuit, makes single depressed part can launch the light of different colours, increases illumination functions.
Can be about the advantages and spirit of the present invention by following detailed Description Of The Invention and appended graphic being further understood.
Description of drawings
Figure 1A: be vertical view according to the ring-shaped surface adherence type conductor holder of first embodiment of the invention.
Figure 1B: be the profile of Figure 1A along the X-X line.
Fig. 2: be profile according to the ring-shaped surface adherence type conductor holder of second embodiment of the invention.
Fig. 3: be vertical view according to the ring-shaped surface adherence type conductor holder of third embodiment of the invention.
Fig. 4: be vertical view according to the ring-shaped surface adherence type conductor holder of fourth embodiment of the invention.
Embodiment
See also Figure 1A and Figure 1B.Figure 1A system illustrates the vertical view according to the ring-shaped surface adherence type conductor holder 1 of first embodiment of the invention.Figure 1B system illustrates the profile of figure one A along the X-X line.Shown in Figure 1A and Figure 1B, ring-shaped surface adherence type conductor holder 1 and comprises ring body 10, a plurality of pedestal 12 and a plurality of support 14 in order to carrying luminescent wafer 3.
According to first specific embodiment, ring body 10 comprises a plurality of depressed parts 100.Each pedestal 12 is connected in support 14 one of them and ring body 10, and is arranged at depressed part 100 in one of them, and wherein luminescent wafer 3 can be arranged on the pedestal 12.Each support 14 has a contact-making surface 140, and contact-making surface 140 copline roughly.In another embodiment, ring body 10 comprises basal surface 102, and basal surface 102 and contact-making surface 140 be copline roughly.Therefore, ring-shaped surface adherence type conductor holder 1 can more stably be positioned on the circuit board (not shown), increases the stability with the circuit board welding.
What remark additionally is, though the plane that most of situation contact-making surface 140 forms is lower than the basal surface 102 of ring body 10, shown in Figure 1B, in the actual design, the plane that contact-making surface 140 forms also may be higher than the basal surface 102 of ring body 10, and this should decide on the actual product demand.
According to first specific embodiment, ring-shaped surface adherence type conductor holder 1 further comprises control circuit 16 (being represented by dotted lines) in Figure 1A, and wherein luminescent wafer 3 electrically connects with support 14, and it is luminous with control luminescent wafer 3 that control circuit 16 is electrically connected to support 14.Control circuit 16 can directly be embedded in the ring body 10, makes it to become one, and is convenient to install.Supplementary notes, control circuit 16 have control pin 162 and circuit board to electrically connect in addition.In addition, control circuit 16 also can be positioned on the circuit board (not shown) except being positioned at ring body 10 (shown in Figure 1A).
Because ring-shaped surface adherence type conductor holder 1 can carry a plurality of luminescent wafers 3, and control circuit 16 can to distinguish independent control luminescent wafer 3 luminous, therefore can reach various lighting demands.For example, only some luminescent wafer 3 is luminous allows integrated light source not have only illumination functions to form the indicator type light source in control, also can have deixis.Especially when depressed part 100 holds a plurality of luminescent wafer 3 (not being shown among the figure), by control circuit 16 controls, single depressed part 100 can send the light of different colours.For example, single depressed part 100 comprises three luminescent wafers 3, can send red, green glow and blue light respectively.By the mixed light effect, this depressed part 100 can provide multiple coloured light.Wherein luminescent wafer 3 can be light-emitting diode or semiconductor laser.
In addition, depressed part 100 is can fill up sealing (not being shown among the figure) to cover luminescent wafer 3, to finish encapsulation procedure.Each pedestal 12 all is connected with a support 14, can conduct to connected support 14 dissipations via pedestal 12 by luminescent wafer 3 heat of being produced in running and go out.
See also Fig. 2, Fig. 2 system illustrates the profile according to the ring-shaped surface adherence type conductor holder 2 of second embodiment of the invention.The profile position of Fig. 2 can be with reference to the Y-Y line of Fig. 1.As Figure 1B and shown in Figure 2, second embodiment and the first embodiment main difference part are that pedestal 22 is exposed to ring body 20.One of them comprises first basal surface 220 pedestal 22.Ring body 20 comprises second basal surface, 202, the first basal surfaces 220 and is exposed to second basal surface 202.Therefore, pedestal 22 can directly contact with the heat conducting element that is arranged at the circuit board (not shown), and wherein heat conducting element can belong to circuit board itself, also can be extra element and embeds circuit board or be equipped with (for example circuit board hollow out) with circuit board.In general situation, when luminescent wafer 5 directly dispelled the heat by other heat conducting elements via pedestal 22, pedestal 22 no longer was connected with support 24 usually, but the present invention is not as limit.As long as can get rid of the construction geometry restriction and the problem that is electrically insulated in principle, pedestal 22 also can connect support 24 simultaneously so that luminescent wafer 5 can obtain bigger rate of heat dissipation.
Shown in Figure 1A, ring body 10 is a round sealed ring.Certainly, ring body 10 also can be polygon and circle, and also can be non-closed-loop.See also Fig. 3, Fig. 3 system illustrates the vertical view according to the ring-shaped surface adherence type conductor holder 4 of third embodiment of the invention.As shown in Figure 3, ring body 40 is a non-closed-loop.But the setting of other elements on the opening adaptive circuit plate of ring body 40 is avoided producing interference with other elements in configuration, makes ring-shaped surface adherence type conductor holder of the present invention that the bigger scope of application can be arranged.
See also Fig. 4, Fig. 4 illustrates the vertical view according to the ring-shaped surface adherence type conductor holder 6 of fourth embodiment of the invention.In this embodiment, a support 64 can at least two pedestals of correspondence 62.For instance, if it is luminous that 6 needs of ring-shaped surface adherence type conductor holder are controlled a plurality of luminescent wafer 7 regionally, and it is luminous not need to control individually each luminescent wafer 7, a plurality of pedestals 62 can be connected with same support 64 (as shown in Figure 4, support 64 is connected with two pedestals 62).Therefore, the quantity of support 64 reduces the pad that can simplify the control circuit (not shown) and reduce ring-shaped surface adherence type conductor holder 6 and circuit board (not shown).And then, only need to control under the luminous situation of luminescent wafer 7 regionally, can simplify processing procedure time and complexity.
By the above detailed description of preferred embodiments, be that hope can be known description feature of the present invention and spirit more, and be not to come category of the present invention is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain in the category of claim of being arranged in of various changes and tool equality institute of the present invention desire application.Therefore, the category of the claim that the present invention applied for should be done the broadest explanation according to above-mentioned explanation, contains the arrangement of all possible change and tool equality to cause it.
Claims (11)
1. a ring-shaped surface adherence type conductor holder in order to carry a plurality of luminescent wafers, is characterized in that, this ring-shaped surface adherence type conductor holder comprises:
One ring body comprises a plurality of depressed parts;
A plurality of pedestals, each described pedestal are connected with this ring body and are arranged at described depressed part in one of them, and wherein said luminescent wafer is arranged on the described pedestal; And
A plurality of supports, each described support are connected with this ring body and have a contact-making surface.
2. ring-shaped surface adherence type conductor holder as claimed in claim 1 is characterized in that, wherein this ring body be closed-loop, polygon or circular one of them.
3. ring-shaped surface adherence type conductor holder as claimed in claim 1 is characterized in that, the contact-making surface copline of wherein said support.
4. ring-shaped surface adherence type conductor holder as claimed in claim 1 is characterized in that wherein this ring body comprises a basal surface.
5. ring-shaped surface adherence type conductor holder as claimed in claim 1 is characterized in that, a wherein said pedestal pedestal wherein comprises one first basal surface, and this ring body comprises one second basal surface, this first basal surface and this second basal surface copline.
6. ring-shaped surface adherence type conductor holder as claimed in claim 1 is characterized in that, a wherein said pedestal pedestal wherein is connected with a described support support wherein.
7. ring-shaped surface adherence type conductor holder as claimed in claim 1 is characterized in that, the corresponding described pedestal of a wherein said support support wherein is at least two pedestals wherein.
8. ring-shaped surface adherence type conductor holder as claimed in claim 1 is characterized in that, wherein each described luminescent wafer is a light-emitting diode or semiconductor laser.
9. ring-shaped surface adherence type conductor holder as claimed in claim 1 is characterized in that, wherein this depressed part fills up a sealing to cover this luminescent wafer.
10. ring-shaped surface adherence type conductor holder as claimed in claim 1, it is characterized in that, further comprise a control circuit, wherein said luminescent wafer and described support electrically connect, and it is luminous to control described luminescent wafer that this control circuit is electrically connected to described support.
11. ring-shaped surface adherence type conductor holder as claimed in claim 1 is characterized in that, one of them holds wherein three luminescent wafers of described luminescent wafer wherein said depressed part, and these three luminescent wafers send a ruddiness, a green glow and a blue light respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710163806 CN101409272B (en) | 2007-10-09 | 2007-10-09 | Ring-shaped surface adherence type conductor holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710163806 CN101409272B (en) | 2007-10-09 | 2007-10-09 | Ring-shaped surface adherence type conductor holder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101409272A CN101409272A (en) | 2009-04-15 |
| CN101409272B true CN101409272B (en) | 2010-08-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710163806 Expired - Fee Related CN101409272B (en) | 2007-10-09 | 2007-10-09 | Ring-shaped surface adherence type conductor holder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101409272B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104810461B (en) * | 2015-03-03 | 2017-11-07 | 深圳市华星光电技术有限公司 | Light-emitting element package part and display |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2628856Y (en) * | 2003-06-05 | 2004-07-28 | 樊邦弘 | LED table lamp |
| CN2796104Y (en) * | 2005-04-19 | 2006-07-12 | 王文峰 | High brightness light emitting diode packaging structure |
-
2007
- 2007-10-09 CN CN 200710163806 patent/CN101409272B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2628856Y (en) * | 2003-06-05 | 2004-07-28 | 樊邦弘 | LED table lamp |
| CN2796104Y (en) * | 2005-04-19 | 2006-07-12 | 王文峰 | High brightness light emitting diode packaging structure |
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| Publication number | Publication date |
|---|---|
| CN101409272A (en) | 2009-04-15 |
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Granted publication date: 20100811 Termination date: 20101009 |