CN101407378A - Welding press table - Google Patents

Welding press table Download PDF

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Publication number
CN101407378A
CN101407378A CNA2008101743650A CN200810174365A CN101407378A CN 101407378 A CN101407378 A CN 101407378A CN A2008101743650 A CNA2008101743650 A CN A2008101743650A CN 200810174365 A CN200810174365 A CN 200810174365A CN 101407378 A CN101407378 A CN 101407378A
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welding
pressing
opening
pressing machine
light source
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CN101407378B (en
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王宇海
何夜泉
黄木通
汪拓
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AUO Optronics Xiamen Corp
AUO Corp
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AU Optronics Xiamen Corp
AU Optronics Corp
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Abstract

一种焊接压合机台包含光源、聚焦镜、承载盘、压合治具以及热压头。光源产生沿一光轴方向前进的光束。承载盘用来承载设有焊点的物件。压合治具设有若干个开孔,每一开孔包含上开口以及下开口,上开口靠近光源,下开口则靠近承载盘,上开口的截面积大于下开口的截面积,形成每一开孔侧壁是一斜面,斜面与光轴方向的夹角是大于或等于一默认值,其中默认值是符合聚焦镜的半径除以聚焦镜焦距的正切值。热压头用来于该光束通过该开孔而照射于物件的焊点后,以确认该焊点已置于一预设位置后,施力于该压合治具上,以压合该物件。

A welding and pressing machine table includes a light source, a focusing mirror, a carrying plate, a pressing fixture and a hot pressing head. The light source generates a light beam traveling along an optical axis. The carrying tray is used to carry objects with solder joints. The pressing fixture is provided with several openings, each opening includes an upper opening and a lower opening, the upper opening is close to the light source, and the lower opening is close to the carrier plate, the cross-sectional area of the upper opening is larger than that of the lower opening, forming each opening The side wall of the hole is an inclined plane, and the included angle between the inclined plane and the direction of the optical axis is greater than or equal to a default value, wherein the default value is the tangent value of dividing the radius of the focusing mirror by the focal length of the focusing mirror. The thermal head is used to apply force to the pressing jig to press the object after the light beam passes through the opening and irradiates the soldering point of the object to confirm that the soldering point has been placed in a preset position .

Description

焊接压合机台 Welding press machine

技术领域 technical field

本发明是关于一种焊接压合机台,尤指一种利用光束定位物件焊点位置的焊接压合机台。The invention relates to a welding and pressing machine, in particular to a welding and pressing machine which utilizes beams of light to locate the positions of welding points of objects.

背景技术 Background technique

在液晶显示装置(Liquid Crystal Display,LCD)在制造过程中,操作焊接压合机台的人员需以人工将未焊接的物件放置于承载盘(tray)上,再控制热压头施力于压合治具,以将该物件焊接压合。然而热压头的大小受限于待压合物件大小、目前加工工艺技术、以及机械空间三方面的限制,无法制作较大型的热压头。也因此,压焊制程受限于热压头大小,使得每次热压头一次只能完成2-3件物件的焊接。接下来就必须以人工的方式将已压合物件自承载盘移开,再另外放置未压合物件于承载盘上,如此周而复始反复操作。但这样操作模式需考虑以人力搬移已压合物件和待压合物件的时间,对讲求快速大量制造的生产流水线而言显然缺乏效率,导致完成每片物件压合时间过长。During the manufacturing process of Liquid Crystal Display (LCD), the personnel who operate the welding and pressing machine need to manually place the unwelded objects on the tray, and then control the thermal head to apply force to the pressing machine. Joint jig to weld and press the object. However, the size of the thermal head is limited by the size of the object to be pressed, the current processing technology, and the mechanical space, so it is impossible to make a larger thermal head. Therefore, the pressure welding process is limited by the size of the thermal head, so that each thermal head can only complete the welding of 2-3 objects at a time. Next, it is necessary to manually remove the pressed objects from the carrier tray, and then place the unpressed objects on the carrier tray, and repeat the operation again and again. However, such an operation mode needs to consider the time for manually moving the pressed and to-be-pressed items, which is obviously inefficient for a production line that emphasizes rapid mass production, resulting in a long time to complete the pressing of each piece.

请参阅图1,图1是先前技术雷射焊接压合机台10照射待压合物件焊点的示意图。目前使用雷射焊接(Laser Soldering)压合机台10设置光源12以射出激光束。经由聚焦镜15聚焦该激光束后,会射在放置于承载盘14上的物件20的焊点22上。之后,焊接压合机台10的光传感器(图未示),例如光耦合装置(Charge Coupling Device,CCD),会依据该激光束侦测焊点22的位置。由于雷射光必须照射在焊点22前提下才能使图像被抓取,而且为了有效压合,所以压合治具16的开孔18边缘与焊点22的距离十分接近。从图1可以发觉,当激光束经过聚焦镜15之后,因为聚焦镜15的焦距F有限,所以激光束无法完全照射于焊点22上,反而有部分光线被压合治具16的边缘16a遮挡,导致激光束无法传递至焊点22,造成抓取图像对比度低以致于无法辨识。Please refer to FIG. 1 . FIG. 1 is a schematic diagram of a laser welding press machine 10 in the prior art irradiating solder joints of an object to be pressed. At present, a laser welding (Laser Soldering) pressing machine 10 is used to set a light source 12 to emit a laser beam. After the laser beam is focused by the focusing lens 15 , it will be irradiated on the welding spot 22 of the object 20 placed on the carrier plate 14 . Afterwards, the optical sensor (not shown in the figure) of the welding press machine 10 , such as a charge coupling device (CCD), will detect the position of the welding spot 22 according to the laser beam. Since the laser light must be irradiated on the welding spot 22 to capture the image, and for effective pressing, the distance between the edge of the opening 18 of the pressing jig 16 and the welding spot 22 is very close. It can be seen from FIG. 1 that after the laser beam passes through the focusing lens 15, because the focal length F of the focusing lens 15 is limited, the laser beam cannot be completely irradiated on the solder joint 22, but part of the light is blocked by the edge 16a of the pressing fixture 16. , causing the laser beam to fail to pass to the solder joint 22, resulting in a captured image with low contrast that cannot be identified.

除此之外,雷射焊接压合机台10的承载盘14可放置10-30个待压合物件20,所以常配置具有对应数量开孔18的压合治具16。因此压合治具16也占有一定的面积。一但热压头施力于压合治具16上时,因弹簧高度及形变量难以调控一致的因素,故无法保证所有物件20均被压合治具16紧密压合。一但部分物件未被压合治具16紧密压合,待焊锡熔化后便无法溢到上层软性电路板(Flexible printed circuit board,FPC)形成空虚焊。In addition, the carrier plate 14 of the laser welding press machine 10 can place 10-30 objects to be pressed 20 , so the pressing jig 16 with a corresponding number of openings 18 is often configured. Therefore, the pressing jig 16 also occupies a certain area. Once the thermal head exerts force on the pressing jig 16 , it is impossible to ensure that all the objects 20 are tightly pressed by the pressing jig 16 due to the factors that the height of the spring and the deformation are difficult to be regulated and consistent. Once some objects are not tightly pressed by the pressing jig 16, the solder cannot overflow to the upper flexible printed circuit board (FPC) after melting to form a void soldering.

由于现有的雷射焊接压合机台10有上述的缺点,因此追求生产效率的制造业中,此机台仍有改进的必要。Since the existing laser welding press machine 10 has the above-mentioned shortcomings, it is still necessary to improve this machine in the manufacturing industry in pursuit of production efficiency.

发明内容 Contents of the invention

本发明的主要目的在于提供一种焊接压合机台,其压合治具的开孔包含上开口以及下开口,该上开口是靠近该光源,该下开口是靠近该承载盘,该上开口的截面积大于该下开口的截面积,如此一来,光源射出的光束将可完整的通过该开孔,使得抓取图像达到较佳的对比度。The main purpose of the present invention is to provide a welding and pressing machine table, the opening of the pressing jig includes an upper opening and a lower opening, the upper opening is close to the light source, the lower opening is close to the carrier plate, and the upper opening The cross-sectional area is larger than the cross-sectional area of the lower opening, so that the light beam emitted by the light source can completely pass through the opening, so that the captured image can achieve better contrast.

依据本发明的上述目的,本发明提供一种焊接压合机台,其包含光源、聚焦镜、承载盘、压合治具,以及热压头。该光源用来产生沿光轴方向前进的光束。该聚焦镜设置于该光轴方向。用来聚集该光束。该承载盘用来承载物件,该物件上设有焊点。该压合治具设有若干个开孔,每一开孔包含上开口以及下开口,该上开口是靠近该光源,该下开口是靠近该承载盘,该上开口的截面积大于该下开口的截面积,形成每一开孔的侧壁包含斜面,该斜面与该光轴方向的夹角是大于或等于默认值,其中该默认值是符合该聚焦镜的半径除以聚焦镜焦距的正切值(tangent)。该热压头用来于该光束通过该开孔而照射于该物件的焊点,以确认该焊点已置于一预设位置后,施力于该压合治具上,以压合该物件。According to the above purpose of the present invention, the present invention provides a welding and pressing machine table, which includes a light source, a focusing lens, a carrier plate, a pressing jig, and a thermal pressing head. The light source is used to generate a light beam traveling along the optical axis. The focusing lens is arranged in the direction of the optical axis. Used to focus the beam. The carrying plate is used to carry objects, and the objects are provided with welding spots. The pressing fixture is provided with several openings, each opening includes an upper opening and a lower opening, the upper opening is close to the light source, the lower opening is close to the carrier plate, and the cross-sectional area of the upper opening is larger than the lower opening The cross-sectional area, the side wall forming each opening contains a slope, the angle between the slope and the optical axis direction is greater than or equal to the default value, wherein the default value is the tangent of the radius of the focusing mirror divided by the focal length of the focusing mirror value (tangent). The thermal head is used to apply force to the pressing jig after the light beam passes through the opening and irradiates the welding spot of the object to confirm that the welding spot has been placed in a preset position, so as to press the welding spot object.

依据本发明的一较佳实施例,该光源用来产生激光束。该承载盘同时承载若干个该物件。该压合治具的下表面与该聚焦镜之间的距离小于该聚焦镜的焦距。该开孔的下开口紧密包裹该焊点。According to a preferred embodiment of the present invention, the light source is used to generate a laser beam. The carrying tray carries several objects at the same time. The distance between the lower surface of the pressing fixture and the focusing mirror is smaller than the focal length of the focusing mirror. The lower opening of the hole tightly wraps the solder joint.

依据本发明之一较佳实施例,本发明的焊接压合机台另包含第一缓冲件,设置于该压合治具与该物件之间,用来于该热压头施力于该压合治具时,使该第一缓冲件平均施力于该物件上。其中该第一缓冲件包含孔洞,该孔洞的面积大于该焊点面积,用来于该物件放置于该承载盘后,使得该焊点穿过该孔洞。According to a preferred embodiment of the present invention, the welding and pressing machine platform of the present invention further includes a first buffer member, which is arranged between the pressing jig and the object, and is used for applying force to the pressing head on the pressing head. When closing the jig, make the first cushioning member evenly exert force on the object. Wherein the first buffer member includes a hole, the area of the hole is larger than the area of the solder joint, and is used to make the solder joint pass through the hole after the object is placed on the carrier.

依据本发明之一较佳实施例,本发明的焊接压合机台另包含第二缓冲件,该第二缓冲件设置于该物件以及该承载盘之间,用来于该热压头施力于该压合治具时,使该第二缓冲件平均施力于该物件上。According to a preferred embodiment of the present invention, the welding and pressing machine platform of the present invention further includes a second buffer member, which is arranged between the object and the carrier plate, and is used to exert force on the thermal head When the jig is pressed, the second cushioning member is evenly applied to the object.

依据本发明之一较佳实施例,本发明的焊接压合机台另包含移动载台,用来移动该承载盘使得该物件的焊点移动至该压合治具的开孔下。According to a preferred embodiment of the present invention, the welding and pressing machine platform of the present invention further includes a moving stage, which is used to move the carrier plate so that the welding spot of the object moves under the opening of the pressing fixture.

为让本发明的上述内容能更明显易懂,下文特举一较佳实施例,并配合所附图式,作详细说明如下:In order to make the above content of the present invention more obvious and understandable, a preferred embodiment is specifically cited below, together with the accompanying drawings, and described in detail as follows:

附图说明 Description of drawings

图1是先前技术雷射焊接压合机台照射待压合物件之焊点的示意图。FIG. 1 is a schematic diagram of a prior art laser welding and pressing machine irradiating solder joints of an object to be pressed.

图2是本发明焊接压合机台照射待压合物件之焊点的示意图。Fig. 2 is a schematic diagram of the welding spot of the object to be pressed irradiated by the welding and pressing machine of the present invention.

具体实施方式 Detailed ways

以下各实施例的说明是参考附加的图式,用以例示本发明可用以实施之特定实施例。本发明所提到的方向用语,例如「上」、「下」、「前」、「后」、「左」、「右」、「侧面」等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本发明,而非用以限制本发明。The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be practiced. The directional terms mentioned in the present invention, such as "upper", "lower", "front", "rear", "left", "right", "side", etc., are only referring to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

请参照图2,图2是本发明焊接压合机台40照射待压合物件60之焊点62的示意图。焊接(Laser Soldering)压合机台40包含光源42、承载盘44、聚焦镜45、压合治具46、移动载台50以及热压头56。承载盘44是设置于移动载台50上,而承载盘44可承载若干个设置有焊点62的物件60。在本实施例中,压合治具46包含若干个开孔48,而每一开孔48对应到一个聚焦镜45,为求图面简洁,以下的实施例说明仅绘示聚焦镜45以及开孔48。光源42用来产生沿光轴方向422前进之光束。在较佳实施例中,光源42可以是雷射光源,用来产生激光束。经由设置于光轴方向422的聚焦镜45所聚焦的激光束,会穿过压合治具46的开孔48而射在放置于承载盘44上的物件60的焊点62上。之后,焊接压合机台40的光传感器(图未示),例如光耦合装置(Charge Coupling Device,CCD),会依据该激光束侦测焊点62的位置。举例来说,如果焊点62完全的置于开孔48底下,则该光传感器会侦测到具有预定亮度的面积。反之,倘若焊点62稍有偏差并没有完全的置于开孔48底下,导致有部份激光束会射到承载盘44上,所以该光传感器会侦测到的预定亮度的面积较小,这表示焊点并没有放置于准确的预定位置。为避免稍后的压合效果受到影响,这时移动载台50会稍加移动承载盘44,直到焊点62准确置于预设位置为止。当焊点62位置对齐后,热压头56会施力于压合治具46上,以压合物件60。Please refer to FIG. 2 . FIG. 2 is a schematic diagram of the welding and pressing machine 40 of the present invention irradiating the welding spot 62 of the object 60 to be pressed. The welding (Laser Soldering) pressing machine table 40 includes a light source 42 , a carrier plate 44 , a focusing lens 45 , a pressing fixture 46 , a moving stage 50 and a thermal head 56 . The carrying tray 44 is disposed on the moving platform 50 , and the carrying tray 44 can carry a plurality of objects 60 provided with solder joints 62 . In this embodiment, the pressing fixture 46 includes several openings 48, and each opening 48 corresponds to a focusing lens 45. For the sake of simplicity in the drawings, only the focusing lens 45 and the opening are shown in the following embodiments. Hole 48. The light source 42 is used to generate light beams traveling along the optical axis direction 422 . In a preferred embodiment, the light source 42 may be a laser light source for generating a laser beam. The laser beam focused by the focusing lens 45 disposed in the optical axis direction 422 passes through the opening 48 of the bonding jig 46 and strikes the solder spot 62 of the object 60 placed on the carrier plate 44 . Afterwards, the optical sensor (not shown in the figure) of the welding press machine 40 , such as a charge coupling device (CCD), detects the position of the welding spot 62 according to the laser beam. For example, if the solder joint 62 is completely placed under the opening 48, the light sensor will detect an area with a predetermined brightness. On the contrary, if the welding spot 62 has a slight deviation and is not completely placed under the opening 48, part of the laser beam will be shot on the carrier plate 44, so the area of the predetermined brightness detected by the light sensor is relatively small, This indicates that the solder joints were not placed in the exact intended location. In order to avoid affecting the lamination effect later, the moving stage 50 will slightly move the carrier plate 44 until the solder joint 62 is accurately placed at the preset position. When the positions of the welding points 62 are aligned, the thermal head 56 will exert force on the pressing jig 46 to press the object 60 .

从图2可以发觉,压合治具46的侧壁462是丨斜面。换句话说,每一开孔48包含上开口482以及下开口484。上开口482靠近光源42,而下开口484是靠近承载盘44,而上开口482的截面积大于下开口484的截面积。为了达到较佳的压合效果,开孔48之下开口482紧密包裹焊点62。此外,压合治具46的下表面与聚焦镜45之间的距离小于聚焦镜45的焦距F。It can be found from FIG. 2 that the side wall 462 of the pressing fixture 46 is an inclined plane. In other words, each opening 48 includes an upper opening 482 and a lower opening 484 . The upper opening 482 is close to the light source 42 , and the lower opening 484 is close to the carrier plate 44 , and the cross-sectional area of the upper opening 482 is larger than that of the lower opening 484 . In order to achieve a better pressing effect, the opening 482 under the opening 48 tightly wraps the solder joint 62 . In addition, the distance between the lower surface of the pressing fixture 46 and the focusing lens 45 is smaller than the focal length F of the focusing lens 45 .

请注意,斜面462与光轴方向422之夹角B是大于或等于默认值,默认值是符合聚焦镜45的半径D除以聚焦镜焦距F的正切值(tangent)。也就是说, tan B ≥ tan A = D F . 这样的配置就能确保激光束经过聚焦镜45聚焦后,能完整的投射于压合治具46的开孔48中,而不会被遮挡。Please note that the angle B between the inclined plane 462 and the optical axis direction 422 is greater than or equal to a default value, which corresponds to the tangent of the radius D of the focusing mirror 45 divided by the focal length F of the focusing mirror. That is to say, the tan B &Greater Equal; the tan A = D. f . Such a configuration can ensure that the laser beam can be completely projected into the opening 48 of the pressing fixture 46 after being focused by the focusing lens 45 without being blocked.

焊接压合机台40另包含第一缓冲件52。第一缓冲件52设置于压合治具46与物件60之间。第一缓冲件52包含孔洞,孔洞的面积大于焊点62之面积,用来于物件60放置于承载盘44后,使得物件60上的焊点62穿过该孔洞。为了让热压头56施力于压合治具46时,物件60能更均匀受力,所以放置压合治具46与物件60之间的第一缓冲件52的功能即是让来自热压头56的力量均匀施力于物件60上。The welding and pressing machine table 40 further includes a first buffer member 52 . The first buffer member 52 is disposed between the pressing jig 46 and the object 60 . The first buffer member 52 includes a hole, the area of which is larger than that of the solder joint 62 , and is used for allowing the solder joint 62 on the object 60 to pass through the hole after the object 60 is placed on the carrier plate 44 . In order to allow the thermal head 56 to exert force on the pressing fixture 46, the object 60 can be more evenly stressed, so the function of the first buffer member 52 placed between the pressing fixture 46 and the object 60 is to let the pressure from the heat press The force of the head 56 is evenly applied to the object 60 .

除了第一缓冲件52之外,焊接压合机台40另可包含第二缓冲件54,第二缓冲件54设置于物件60以及承载盘44之间,其用途与第一缓冲件52类似,也就是用来于热压头56施力于压合治具46时,让来自热压头56的力量透过第二缓冲件均匀施力于物件60上。为了增加生产效率,承载盘44上承载若干个物件60,所以利用第一缓冲件52以及第二缓冲件54的配置,即可解决热压头56施力于压合治具46上时,因弹簧高度及形变量而导致分布在承载盘44上若干个物件60因分布不均而导致部份物件60无法被压合治具46紧密压合的问题。In addition to the first buffer 52, the welding and pressing machine table 40 may further include a second buffer 54, the second buffer 54 is disposed between the object 60 and the carrier plate 44, and its purpose is similar to that of the first buffer 52, That is, when the thermal head 56 exerts force on the bonding jig 46 , the force from the thermal head 56 can be evenly applied to the object 60 through the second buffer member. In order to increase the production efficiency, several objects 60 are carried on the carrier plate 44, so the arrangement of the first buffer member 52 and the second buffer member 54 can solve the problem of the hot pressing head 56 exerting force on the pressing fixture 46 due to Due to the spring height and deformation, some objects 60 distributed on the carrier plate 44 cannot be tightly pressed by the pressing jig 46 due to the uneven distribution of some objects 60 .

焊接压合机台40的移动载台50用来自动移动承载盘44使得物件60之焊点62移动至压合治具46之开孔48下。这么丨来,在物件60压合完毕后,移动载台50可将承载盘44朝箭头C的方向移动,使得下一批的物件60自动地移动至对应开孔48下。此外,前一批已压合的物件也不需再从承载盘44取出焊接,故可省却人力搬移的步骤。The moving stage 50 of the welding and pressing machine 40 is used to automatically move the carrier plate 44 so that the welding spot 62 of the object 60 moves under the opening 48 of the pressing fixture 46 . In this way, after the pressing of the objects 60 is completed, the moving stage 50 can move the carrier plate 44 in the direction of the arrow C, so that the next batch of objects 60 will automatically move to the corresponding opening 48. In addition, the previous batch of pressed objects does not need to be taken out from the carrier plate 44 for welding, so the steps of manual handling can be saved.

相较于先前技术,本发明的焊接压合机台设置有移动载台可自动移动承载盘。在物件压合完毕后,无需将物件从承载盘取出再焊接。而是自动移动至光源下方,故可省却人力搬移已压合物件的步骤。此外,压合治具开孔设计为倾斜状(也就是上开口大,下开口小)。这么一来,既保证光线能有效通过开孔照射在焊点上,又能保证下开口紧密包裹在焊点附近,而达到较佳的压合效果。而压合治具下表面或承载盘上表面增加具有一定厚度的第一缓冲件或是第二缓冲件,可以克服因弹簧高度不一致或压缩量不一致造成的各弹簧不能全部有效压合点的情况。Compared with the prior art, the welding and pressing machine platform of the present invention is provided with a moving platform that can automatically move the carrying plate. After the objects are pressed together, there is no need to take out the objects from the carrier plate and weld them again. Instead, it automatically moves to the bottom of the light source, so the steps of manpower moving the pressed objects can be saved. In addition, the opening of the pressing fixture is designed to be inclined (that is, the upper opening is large and the lower opening is small). In this way, it is ensured that the light can be effectively irradiated on the solder joint through the opening, and it is also ensured that the lower opening is tightly wrapped around the solder joint, so as to achieve a better pressing effect. Adding a first or second buffer with a certain thickness to the lower surface of the pressing jig or the upper surface of the bearing plate can overcome the situation that all springs cannot be effectively pressed together due to inconsistent spring height or inconsistent compression.

综上所述,本发明确已符合发明专利之要件,爰依法提出专利申请。惟,本发明已以较佳实施例揭露如上,然其并非用以限定本发明,任何所属技术领域中具有通常知识者,在不脱离本发明之精神和范围内,当可作些许之更动与润饰,因此本发明之保护范围当视后附的权利要求所界定者为准。另外,本发明的任一实施例或权利要求不须达成本发明所揭露之全部目的或优点或特点。此外,摘要部分和标题仅是用来辅助专利档搜寻之用,并非用来限制本发明之权利范围。To sum up, the present invention clearly meets the requirements of an invention patent, and a patent application is filed in accordance with the law. However, the present invention has been disclosed above with a preferred embodiment, but it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes without departing from the spirit and scope of the present invention. and modification, so the scope of protection of the present invention shall prevail as defined by the appended claims. In addition, any embodiment or claims of the present invention need not achieve all the objects or advantages or features disclosed in the present invention. In addition, the abstract and the title are only used to assist in the search of patent documents, and are not used to limit the scope of rights of the present invention.

Claims (9)

1.一种焊接压合机台,其包含:1. A welding and pressing machine platform, which comprises: 一光源,用来产生沿一光轴方向前进的一光束;a light source for generating a light beam advancing along an optical axis; 一聚焦镜,设置于所述光轴方向,用来聚集所述光束;A focusing mirror, arranged in the direction of the optical axis, is used to gather the light beam; 一承载盘,用来承载一物件,该物件上设有一焊点;其特征在于:所述焊接压合机台包含:A carrying plate is used to carry an object, and the object is provided with a welding spot; it is characterized in that: the welding press machine includes: 一压合治具,其设有若干个开孔,每一开孔包含一上开口以及一下开口,该上开口靠近所述光源,所述下开口靠近该承载盘,所述上开口的截面积大于所述下开口的截面积,形成每一开孔的侧壁包含一斜面,所述斜面与该光轴方向的夹角大于或等于一默认值,其中所述默认值是符合该聚焦镜的半径除以聚焦镜焦距的正切值;以及A pressing fixture, which is provided with several openings, each opening includes an upper opening and a lower opening, the upper opening is close to the light source, the lower opening is close to the carrier plate, and the cross-sectional area of the upper opening is Greater than the cross-sectional area of the lower opening, the side wall forming each opening includes a slope, and the angle between the slope and the optical axis direction is greater than or equal to a default value, wherein the default value is in line with the focusing lens the tangent of the radius divided by the focal length of the focusing mirror; and 一热压头,用来于所述光束通过该开孔而照射于该物件的焊点,以确认所述焊点已置于一预设位置后,施力于所述压合治具上,以压合所述物件。a thermal pressure head, used to apply force on the pressing jig after the light beam passes through the opening and irradiates the soldering point of the object to confirm that the soldering point has been placed in a preset position, to press the object. 2.如权利要求第1项所述的焊接压合机台,其特征在于:所述焊接压合机台另包含一第一缓冲件,设置于所述压合治具与该物件之间,用来于所述热压头施力于所述压合治具时,使所述第一缓冲件平均施力于所述物件上。2. The welding and pressing machine table according to claim 1, characterized in that: the welding and pressing machine table further comprises a first buffer member, which is arranged between the pressing fixture and the object, It is used to make the first cushioning member evenly exert force on the object when the thermal pressure head exerts force on the pressing fixture. 3.如权利要求第2项所述的焊接压合机台,其特征在于:所述第一缓冲件包含一孔洞,所述孔洞的面积大于所述焊点面积,用来于所述物件放置于所述承载盘后,使得该焊点穿过所述孔洞。3. The welding and pressing machine according to claim 2, wherein the first buffer member includes a hole, and the area of the hole is larger than the area of the solder joint, and is used for placing the object Behind the carrier pad, make the solder joint go through the hole. 4.如权利要求第1项所述的焊接压合机台,其特征在于:所述焊接压合机台另包含第二缓冲件,所述第二缓冲件设置于所述物件以及所述承载盘之间,用来于所述热压头施力于所述压合治具时,使所述第二缓冲件平均施力于所述物件上。4. The welding and pressing machine table according to claim 1, characterized in that: the welding and pressing machine table further comprises a second buffer, and the second buffer is arranged on the object and the bearing Between the discs, when the thermal pressure head applies force to the pressing jig, the second buffer member exerts force on the object evenly. 5.如权利要求第1项所述的焊接压合机台,其特征在于:所述开孔的下开口紧密包裹所述焊点。5. The welding and pressing machine according to claim 1, characterized in that: the lower opening of the hole tightly wraps the welding spot. 6.如权利要求第1项所述的焊接压合机台,其特征在于:所述光源用来产生一激光束。6. The welding press machine as claimed in claim 1, wherein the light source is used to generate a laser beam. 7.如权利要求第1项所述的焊接压合机台,其特征在于:所述焊接压合机台另包含一移动载台,用来移动所述承载盘使得所述物件的焊点移动至所述压合治具的开孔下。7. The welding and pressing machine according to claim 1, characterized in that: the welding and pressing machine further comprises a moving stage, which is used to move the carrier plate so that the solder joints of the objects move to the opening of the pressing jig. 8.如权利要求第1项所述的焊接压合机台,其特征在于:所述承载盘同时承载若干个该物件。8 . The welding and pressing machine according to claim 1 , wherein the carrying plate carries several objects at the same time. 9.如权利要求第1项所述的焊接压合机台,其特征在于:所述压合治具的一下表面与所述聚焦镜之间的距离小于所述聚焦镜的焦距。9. The welding and pressing machine according to claim 1, wherein the distance between the lower surface of the pressing jig and the focusing mirror is smaller than the focal length of the focusing mirror.
CN2008101743650A 2008-10-31 2008-10-31 Welding press table Expired - Fee Related CN101407378B (en)

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CN201040423Y (en) * 2007-06-06 2008-03-26 上海市激光技术研究所 Three-dimensional laser plastic welding pressure device
CN101239418B (en) * 2008-02-19 2011-07-06 江苏大学 A flyer-driven laser micro-welding method and device

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* Cited by examiner, † Cited by third party
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WO2023083087A1 (en) * 2021-11-10 2023-05-19 华为技术有限公司 Welding apparatus and welding method

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