CN101404830B - 装配式穿刺连接电极 - Google Patents
装配式穿刺连接电极 Download PDFInfo
- Publication number
- CN101404830B CN101404830B CN2008102343176A CN200810234317A CN101404830B CN 101404830 B CN101404830 B CN 101404830B CN 2008102343176 A CN2008102343176 A CN 2008102343176A CN 200810234317 A CN200810234317 A CN 200810234317A CN 101404830 B CN101404830 B CN 101404830B
- Authority
- CN
- China
- Prior art keywords
- conducting metal
- conductive heating
- assembly type
- electrode
- connection electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
Claims (8)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008102343176A CN101404830B (zh) | 2008-11-11 | 2008-11-11 | 装配式穿刺连接电极 |
US12/583,822 US8304694B2 (en) | 2008-11-11 | 2009-08-26 | Electric heating material and laminate floor containing same and method for producing the laminate floor |
RU2009132130/07A RU2517178C2 (ru) | 2008-11-11 | 2009-08-27 | Способ производства электропроводящего тепловыделяющего материала, входящего в состав напольных покрытий, и электропроводящий тепловыделяющий материал |
KR1020090082091A KR20100053434A (ko) | 2008-11-11 | 2009-09-01 | 전기전도 발열재 및 전기전도 발열재를 이용한 바닥재와 그 제조방법 |
CA2677535A CA2677535A1 (en) | 2008-11-11 | 2009-09-03 | Electric heating material and laminate floor containing same and method for producing the laminate floor |
EP09011687A EP2184547A3 (en) | 2008-11-11 | 2009-09-11 | Electric heating material and laminate floor containing same and method for producing the laminate floor |
JP2009254947A JP2010118341A (ja) | 2008-11-11 | 2009-11-06 | 導電性発熱材料及び導電性発熱材料を含む床と製造法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008102343176A CN101404830B (zh) | 2008-11-11 | 2008-11-11 | 装配式穿刺连接电极 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101404830A CN101404830A (zh) | 2009-04-08 |
CN101404830B true CN101404830B (zh) | 2011-10-26 |
Family
ID=40538668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008102343176A Expired - Fee Related CN101404830B (zh) | 2008-11-11 | 2008-11-11 | 装配式穿刺连接电极 |
Country Status (1)
Country | Link |
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CN (1) | CN101404830B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103249182A (zh) * | 2013-05-06 | 2013-08-14 | 王柏泉 | 包括防脱出电极的电热板 |
CN103648193A (zh) * | 2013-11-22 | 2014-03-19 | 张正国 | 制热地板用导电金属片 |
CN114744421B (zh) * | 2022-06-09 | 2022-08-26 | 中国飞机强度研究所 | 空天飞机热强度测试用气密式高温高压导电电极封装系统 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6259260B1 (en) * | 1998-07-30 | 2001-07-10 | Intest Ip Corporation | Apparatus for coupling a test head and probe card in a wafer testing system |
CN201294643Y (zh) * | 2008-11-11 | 2009-08-19 | 王柏泉 | 装配式穿刺连接电极 |
-
2008
- 2008-11-11 CN CN2008102343176A patent/CN101404830B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6259260B1 (en) * | 1998-07-30 | 2001-07-10 | Intest Ip Corporation | Apparatus for coupling a test head and probe card in a wafer testing system |
CN201294643Y (zh) * | 2008-11-11 | 2009-08-19 | 王柏泉 | 装配式穿刺连接电极 |
Also Published As
Publication number | Publication date |
---|---|
CN101404830A (zh) | 2009-04-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI SUNLIKE NUANXIN TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: WANG BOQUAN Effective date: 20100929 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 222004 ROOM 602, UNIT 1, BUILDING 40-3, DAQING WEST ROAD, XINPU DISTRICT, LIANYUNGANG CITY, JIANGSU PROVINCE TO: 200336 ROOM 1904, NO.345, XIANXIA ROAD, SHANGHAI |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20100929 Address after: 200336 Shanghai Xianxia Road No. 345 room 1904 Applicant after: Shanghai Sunlike Warmchip Technology Co., Ltd Address before: Room 602, building 40-3, West Daqing Road, Sinpo District, Jiangsu, Lianyungang, China Applicant before: Wang Baiquan |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: SUNLIKE WARM CHIP THERMAL ENERGY TECHNOLOGY CO., LTD. Assignor: Shanghai Sunlike Warmchip Technology Co., Ltd Contract record no.: 2012320000816 Denomination of invention: Assembly type puncture connection electrode Granted publication date: 20111026 License type: Exclusive License Open date: 20090408 Record date: 20120620 |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111026 Termination date: 20121111 |