CN101404280A - 带有集成控制电路的功率电子设备 - Google Patents
带有集成控制电路的功率电子设备 Download PDFInfo
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Abstract
本发明涉及带有集成控制电路的功率电子设备。功率转换设备包括基板;安装在基板上并包括用于高功率,交流马达应用的功率电子电路的半导体芯片;安装在基板上并与半导体芯片上的功率电子电路电气耦合的栅极驱动电路;以及安装在基板上并与栅极驱动电路电气耦合的控制电路。
Description
相关申请的交叉引用
本申请要求了序列号60/952778的美国临时专利申请的优先权,该申请在2007年7月30日提出,其全部内容作为参考结合在此。
技术领域
本发明主要涉及功率电子设备,尤其是涉及带有集成控制电路的功率电子设备。
背景技术
近年来,技术的进步,以及风格的品位发展,已经导致了在汽车设计中本质上的变革。这些改变之一包括汽车内电气系统的复杂化,尤其是可替代燃料车辆,例如混合动力,电动和燃料电池车辆。典型的,这种可替代燃料的车辆使用一个或多个电动马达,也可能结合另一个致动器,以驱动车轮。另外,这种汽车可能还包括其它马达,以及其它的高压元件,从而操纵车内其它各种系统,例如空调。
由于可替代燃料汽车典型的仅仅包括直流(DC)电源的事实,因此直流到交流(DC/AC)逆变器(或功率逆变器)被提供用来将直流功率转换为马达通常所需要的交流功率。这种车辆,尤其是燃料电池车辆,也经常使用两个独立的电压源,例如蓄电池和燃料电池,给驱动车轮的电动马达供电。因此,功率变换器,例如直流到直流(DC/DC)变换器,典型的也被提供用来管理和转换来自两个电压源的功率。
随着可替代燃料车辆上的电气系统的功率需求持续增长,对于这种系统的效率和可靠性最大化的需求也不断增长。此外,为了最小化车辆的总体成本和重量,减少电气系统内元件所需的成本和空间需求的要求也长期存在。成本增加的一个特定根源在于许多功率逆变器传统所需的直接敷铜基板。
因此,需要提供一种功率电子设备,尤其是具有低成本,大电流以及紧凑设计特性的逆变器。更进一步的,结合附图,前述技术领域以及背景技术,本发明其它所需的特征与特点都将通过接下来的详细说明和所附的权利要求书而变得显而易见。
发明内容
根据典型实施例,功率转换设备包括基板;安装在基板上并且包括用于高功率交流马达应用的功率电子电路的半导体芯片;安装在基板上并且与半导体芯片上的功率电子电路电气耦合的栅极驱动电路;以及安装在基板上并且与所述栅极驱动电路电气耦合的控制电路。
根据另一个典型实施例,汽车驱动系统包括电动马达;与该电动马达耦合的直流(DC)电源;与该电动马达和直流电源耦合的功率逆变器组件,其接收来自直流电源的直流功率,且为所述电动马达提供交流(AC)功率;该功率逆变器组件包括基板;安装在基板上并且包括用于将直流功率转换为交流功率的功率电子电路的半导体芯片;安装在基板上并且与半导体芯片上的功率电子电路电气耦合的栅极驱动电路;以及安装在基板上并且与所述栅极驱动电路电气耦合的控制电路。
根据另一个典型实施例,功率转换设备包括带有第一面和第二面的印刷电路板(PCB)基板;安装在基板第一面上的多个半导体芯片,该半导体芯片包括用于高功率交流马达应用的绝缘栅双极晶体管(IGBT);安装在所述基板第一面并且与所述半导体芯片的IGBT电气耦合的栅极驱动电路;安装在所述基板的第二面并且通过形成于基板过孔内的互相连接件与所述栅极驱动电路电气耦合的控制电路;以及形成于基板内以将控制电路从所述半导体芯片隔离开来的电磁干扰屏蔽件。
附图说明
接下来将结合以下附图对本发明进行描述,其中同样的元件采用同样的标号,其中:
图1是根据本发明的一个实施例的典型汽车的示意图;
图2是图1的汽车的逆变器组件的功率转换设备的典型布局。
具体实施方式
以下详细叙述本质上仅仅是示例,并不旨在限制本发明或本申请以及本发明的应用。更进一步的,其不通过在前的技术领域、背景技术、发明内容或以下的详细说明中提出的明示或暗示的理论来限制。
概括的说,这里描述的典型实施例提供了更为紧凑和更低成本的功率电子设备。更为特别的是,典型实施例提供了具有安装在相对低成本基板上的半导体芯片,栅极驱动电路以及控制电路的逆变器组件。
以下叙述涉及被“连接”或“耦合”在一起的元件或部件。正如这里所使用的,“连接”可能指的是一个元件/部件机械结合到(或直接连通)另一个元件/部件,并且不是必须为直接的。同样的,“耦合”可能指一个元件/部件直接或间接的结合到(或直接或间接的连通)另一个元件/部件,并且不必是机械的。然而,其应该被理解为尽管在一个实施例中,两个元件以下被描述为“连接”,在替代的实施例里相似的元件可能为“耦合”,反之亦然。因此,尽管在此所示的示意图描述了元件的示例性布置,但附加的中间元件、设备、部件或构件仍然可能在一个实际的实施例中存在。
另外,在此描述的各种元件和部件可能涉及使用特定的数字描述符,例如第一,第二,第三等等,以及使用位置和/或角度描述符,例如水平和垂直。然而,这类描述符仅仅出于涉及附图的描述性的目的而被使用,不应该被解释为限制,因为各种元件在其它实施例中可能被重新布置。其也应该被理解为图1和图2仅仅是例证性的,而可能不是按比例绘制的。
图1描述了根据本发明的一个实施例的汽车(或“汽车驱动系统”)10。该汽车10包括底盘12,车身14,多个车轮16,以及电控系统18。车身14被布置于底盘12上,并且基本上包围汽车10的其它元件。车身14和底盘12可以联合形成车架,每个车轮16在车身14的各个角附近可转动地与底盘12相耦合。
汽车10可以为许多不同类型汽车中的任意一个,例如,轿车,货车,卡车,或者运动型多功能车(SUV),以及可能是两轮驱动(2WD)(即,后轮驱动或前轮驱动),四轮驱动(4WD)或者全轮驱动(AWD)。汽车10也可能包括许多不同类型的发动机中的任何一个,或是包括这些发动机的组合,例如,汽油或柴油燃料的内燃机,“柔性燃料汽车”(FFV)发动机(即,使用汽油和酒精的混合物),气态化合物(例如,氢气和/或天然气)燃料的发动机,燃料/电动马达混合发动机,以及电动马达。
在如图1所示的典型实施例中,汽车10是混合动力车辆,并且进一步包括致动器组件20,蓄电池(或直流(DC)电源)22,功率电子设备24,以及散热器26。在该典型实施例中,功率电子设备24是逆变器组件,以下将以此作为指代称呼。致动器组件20包括燃烧发动机28和电动马达/发电机(或马达)30。正如本领域技术人员应该知道的是,电动马达30包括其中的变速器,尽管没有图示,还包括定子组件(包括传导线圈),转子组件(包括铁磁铁芯),以及冷却流体(即,冷却剂)。电动马达30内的定子组件和/或转子组件可以包括多个电磁磁极(例如,16个磁极),这正如我们通常所理解的。
仍然参考图1,在一个实施例中,燃烧发动机28和电动马达30被集成以便两者通过一个或多个驱动轴32机械耦合到至少一些车轮16上。散热器26与车架在其外部连接,尽管没有详细图示,但其包括多个容纳冷却流体(即,冷却剂)的冷却通道,例如水和/或乙二醇(即,“防冻液”),并且与发动机28和逆变器组件24耦合。
在工作期间,车辆10通过以燃烧发动机28和电动马达30交替的方式和/或燃烧发动机28与电动马达30同时的方式给车轮16提供动力而被操纵。为了给电动马达30供电,直流功率被从蓄电池22提供给逆变器组件24,这样在功率送入电动马达30之前,就将直流功率转换为了交流功率。正如本领域技术人员所知道的,在以下将参考附图2作说明,直流功率到交流功率的转换通过操纵(即,反复的转换)逆变器组件24的功率转换器内的晶体管电路基本上实现。
参考图2,逆变器组件24内的功率转换装置100的典型布置被更详细的示出。一般的,一个或多个功率转换装置100形成了逆变器组件24。该功率转换装置100和更大的逆变器组件24各自都被认为是“功率电子”设备。通常,功率电子学是与电功率以静态方式从其可用输入形式到所需电输出形式的有效转换、控制和调节相联系的技术。这种转换是采用半导体转换设备如二极管、闸流管和晶体管执行的,同时大量的电能被处理。相反,其它电子系统与信号和数据的传输与处理相关联,不处理大量的能量。
功率转换设备100尤其包括安装于基板110上并封闭于外壳120内的半导体芯片105。该半导体芯片105可以被焊接在基板110上,尽管其它布置也是可能的。半导体芯片105可以包括具有形成于其上的集成电路的半导体基板(例如,硅基板),该集成电路包括单独的半导体设备形式的一个或多个转换器,例如绝缘栅双极晶体管(IGBT),正如通常所了解的。在一个实施例中,半导体芯片100通常包括与马达30和蓄电池22耦合的三相电路(图1)。
在一个实施例中,基板110是相对低成本的基板,例如印刷电路板(PCB)。例如,该基板可能是环氧树脂/玻璃纤维材料,尽管其它材料也可能被使用。标准的PCB技术可以被用来在基板110上安装和互连各种元件。通常,功率转换设备100不需要直接,或双面敷铜(DBC)的基板或具有高热导率的其它类型的基板。尽管单个的基板110被示出具有两块半导体芯片105,但附加的或更少的半导体芯片,以及其他的形成例如转换模块的基板可以被提供。
栅极驱动电路130形成于基板110上。一般的,栅极驱动电路130将逻辑电平控制信号转换为合适的电压与电流,用于功率转换设备100,尤其是半导体芯片105上形成IGBT的电路的有效、可靠的转换。在传统的功率转换器里,栅极驱动电路设置于独立的基板上。
功率转换设备100还包括许多将半导体芯片105互连到各种形成于基板110内或其上的导体元件的引线接合件140,以便该半导体芯片105与栅极驱动电路130电气耦合,同时栅极驱动电路130能够与功率转换设备100外部的元件相耦合。
典型实施例提供了具有集成栅极驱动电路130的功率转换设备100,与传统组件相比,其需要更少的互连件。例如,独立的栅极驱动电路板不是必须的。
在一个典型实施例中,控制电路150能附加安装在基板110上。该控制电路150能包括或被耦合到各种传感器和汽车控制模块,或电控单元(ECU)上,例如逆变器控制模块和车辆控制器,以及至少一个处理器和/或包括存储于其上(或另一计算机可读介质里)的用于执行逆变器组件24过程的指令的存储器。通常,控制电路150产生脉冲宽度调制(PWM)信号用于控制半导体芯片105上的电路的转换动作,于其然后将PWM信号转换成调制的电压波形,用于操纵马达30(图1)。
在典型的描述的实施例中,控制电路150被安装在相对于半导体芯片105和栅极驱动电路130的基板110的相反侧面上,尽管在其他实施例中,控制电路150可以被安装在与半导体芯片105和栅极驱动电路130相同的基板110的侧面上。将控制电路150安装在相对于半导体芯片105和栅极驱动电路130相反的侧面上尤其提供了由形成于基板110内的电磁干扰屏蔽件160的隔离。这种隔离能使半导体芯片105上相对高压的电路与控制电路150的相对低压的元件无相互干扰的工作。EMI屏蔽件160例如可以为基板110内一层接地、导电的材料。在传统的功率转换器中,栅极驱动电路设置于独立的基板上。
控制电路150可以通过基板110使用例如过孔175内的互连件170与栅极驱动电路130耦合。过孔175例如能够通过激光钻孔或冲孔形成,并且在一个实施例中,通过厚膜技术进行填充。厚膜是一种技术,该技术用一种或多种未燃烧的陶瓷材料和金属粉末的浆状物或糊状物对过孔175进行填充,所述金属粉末经常为金粉,然后烧制浆状物或糊状物,产生互连件170。
典型实施例提供了具有集成控制电路150的逆变器组件24的功率转换设备100,与传统组件相比,其需要更少的互连件。例如,独立的控制电路板不是必须的。这能使电气设计中的附加的灵活性和创造性成为可能。
如上所述,功率转换设备100还包括封装半导体芯片105,基板110和相关电路的外壳120。外壳34可以由模制塑料材料或其它任何合适的材料制成。
在工作期间,半导体芯片105产生热量。在一个实施例里,半导体芯片105产生至少10W/cm2的热通量密度,而在另一个实施例里,产生至少20W/cm2的热通量密度。为了从半导体芯片105消除热量,散热器26内的流体通过泵32(图1)循环到功率转换设备100内部的一个或多个喷嘴180。流体通过喷嘴180喷在半导体芯片105上。来自半导体芯片105的热量在流体流出以前传导到流体上。然后流体可以被收集,通过泵32返回散热器26,并在散热器26(图1)的冷却通道内被冷却。冷却剂流体优选为介电液体。正如本领域人员所清楚的,特定的介电液体的选择将依赖于设备的化学性质和应用。合适的介电液体可能包括,但不限于碳氟化合物、硅树脂油以及聚α烯烃。在该典型实施例中,功率转换设备100和/或逆变器组件24不包括散热片。其它热消除的例子包括喷雾器和其它冷却机构。
在前的详细叙述中至少一个典型实施例被介绍,但应该认识到存在大量的变形。同时也应该认识到典型的一个或多个实施例仅仅是示例,并不意味着要以任何方式限制本发明的范围,适用性或构成。更合适的说,在前的详细叙述为本领域技术人员提供了实施所述典型的一个或多个实施例的便捷路线图。应该理解在没有偏离本由所附权利要求书以及法定的等同替代所提出的范围的情况下,元件的功能和布置上可以进行各种改变。
Claims (20)
1、功率转换设备,其包含:
基板;
安装在所述基板上并包含用于高功率、交流马达应用的功率电子电路的半导体芯片;
安装在所述基板上并与所述半导体芯片上的所述功率电子电路电气耦合的栅极驱动电路;以及
安装在所述基板上并与所述栅极驱动电路电气耦合的控制电路。
2、如权利要求1所述的功率转换设备,其中,所述基板是印刷电路板(PCB)。
3、如权利要求1所述的功率转换设备,其中,所述功率电子电路包括绝缘栅双极晶体管(IGBT)。
4、如权利要求1所述的功率转换设备,其中,所述半导体芯片焊接安装在所述基板上。
5、如权利要求1所述的功率转换设备,其中,所述栅极驱动电路被配置用来从所述控制电路接收逻辑电平控制信号,并将所述控制信号转换为用于所述功率电子电路的转换控制的合适的电压与电流。
6、如权利要求1所述的功率转换设备,进一步包含用于将所述栅极驱动电路和所述半导体芯片上的所述功率电子电路电气耦合的引线接合线。
7、如权利要求5所述的功率转换设备,其中,所述半导体芯片为第一半导体芯片,逆变器组件进一步包含安装在所述基板上的第二半导体芯片。
8、如权利要求1所述的功率转换设备,进一步包含用于封闭所述基板和所述半导体芯片的外壳。
9、如权利要求8所述的功率转换设备,进一步包含与外壳耦合用于将冷却流体输送到所述半导体芯片上的喷嘴。
10、如权利要求1所述的功率转换设备,其中,所述基板具有第一侧面和第二侧面,所述半导体芯片安装在第一侧面上,而控制电路安装在第二侧面上。
11、如权利要求10所述的功率转换设备,其中所述栅极驱动电路安装在所述第一侧面上。
12、如权利要求11所述的功率转换设备,进一步包含形成于所述基板内以将所述控制电路与所述半导体芯片隔离的电磁干扰屏蔽件。
13、如权利要求11所述的功率转换设备,其中,所述栅极驱动电路通过形成于穿过所述基板的过孔里的互连件与所述控制电路电气耦合。
14、汽车驱动系统,其包括:
电动马达;
与所述电动马达耦合的直流(DC)电源;
与所述电动马达和所述直流电源耦合的功率转换设备,用于接收来自所述直流电源的直流功率,并为所述电动马达提供交流(AC)功率,所述功率转换设备包括:
基板;
安装在所述基板上并包含用于将所述直流功率转换为交流功率的功率电子电路的半导体芯片;
安装在所述基板上并与所述半导体芯片上的所述功率电子电路电气耦合的栅极驱动电路;以及
安装在所述基板上并与所述栅极驱动电路电气耦合的控制电路。
15、如权利要求14的汽车驱动系统,其中,所述基板是印刷电路板(PCB)。
16、如权利要求14的汽车驱动系统,其中,所述功率电子电路包括绝缘栅双极晶体管(IGBT)。
17、如权利要求14的汽车驱动系统,其中,所述基板具有第一侧面和第二侧面,所述半导体芯片安装在所述第一侧面上,所述控制电路安装在所述第二侧面上。
18、如权利要求17的汽车驱动系统,其中,所述栅极驱动电路安装在所述第一侧面上。
19、如权利要求18的汽车驱动系统,进一步包含形成于所述基板内以将所述控制电路与所述半导体芯片隔离的电磁干扰屏蔽件。
20、功率转换设备,其包含:
具有第一侧面和第二侧面的印刷电路板(PCB)基板;
多个安装在所述基板的所述第一侧面上的半导体芯片,所述半导体芯片包括用于高功率、交流马达应用的绝缘栅双极晶体管(IGBT);
安装在所述基板的所述第一侧面上并与所述半导体芯片的所述IGBT电气耦合的栅极驱动电路;
安装在所述基板的所述第二侧面上并通过形成于穿过所述基板的过孔里的互连件与所述栅极驱动电路电气耦合的控制电路;以及
形成于所述基板内以将所述控制电路与所述半导体芯片隔离的电磁干扰屏蔽件。
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- 2008-07-29 DE DE102008035228.4A patent/DE102008035228B4/de active Active
- 2008-07-30 CN CN200810215455.XA patent/CN101404280B/zh active Active
Cited By (4)
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CN101931365A (zh) * | 2009-06-17 | 2010-12-29 | 通用汽车环球科技运作公司 | 具有宽带隙功率晶体管的机动车功率电子器件 |
CN108878411A (zh) * | 2017-05-11 | 2018-11-23 | 奥迪股份公司 | 用于机动车的功率半导体模块和机动车 |
CN107393886A (zh) * | 2017-08-24 | 2017-11-24 | 广东美的制冷设备有限公司 | 智能功率模块及其制造方法 |
CN112072895A (zh) * | 2020-09-18 | 2020-12-11 | 威海新佳电子有限公司 | 智能功率模块 |
Also Published As
Publication number | Publication date |
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DE102008035228B4 (de) | 2019-07-11 |
US20090033410A1 (en) | 2009-02-05 |
DE102008035228A1 (de) | 2009-04-09 |
CN101404280B (zh) | 2014-08-20 |
US8139371B2 (en) | 2012-03-20 |
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