CN101403490B - Cooling structure, backlight module and LCD device and its assembling method - Google Patents
Cooling structure, backlight module and LCD device and its assembling method Download PDFInfo
- Publication number
- CN101403490B CN101403490B CN200810202916XA CN200810202916A CN101403490B CN 101403490 B CN101403490 B CN 101403490B CN 200810202916X A CN200810202916X A CN 200810202916XA CN 200810202916 A CN200810202916 A CN 200810202916A CN 101403490 B CN101403490 B CN 101403490B
- Authority
- CN
- China
- Prior art keywords
- base material
- heat conducting
- conducting base
- radiating block
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Liquid Crystal (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention provides a radiator structure, a backlight module and a liquid crystal display device and assembly methods thereof. The assembly method of the radiator structure comprises the following steps of: providing a radiating block; installing a heat conducting base material in the concave part of the radiating block; contacting and extruding the heat conducting base material into the concave part of the radiating block by utilizing a substrate; and holding the substrate onto the radiating block by utilizing a holder so as to form the radiator structure. The radiator structure can be applied to the backlight module and the liquid crystal display device. The radiator structure, the backlight module and the liquid crystal display device and the assembly methods thereof can increase the radiating effect.
Description
Technical field
The present invention relates to a kind of radiator structure, backlight module and liquid crystal indicator and its assemble method, particularly relate to a kind of radiator structure, backlight module and liquid crystal indicator and its assemble method that promotes radiating effect.
Background technology
In the electronic product now, heat radiation has become an important problem, with light emitting diode (Light-Emitting Diode, LED) be example, when general package structure for LED can produce considerable heat energy after long-time running or under the high-power operation, if its radiating subassembly poor effect, add the thermal resistance effect of assembly on the face of contacting with each other of package structure for LED, then in LED encapsulation body, accumulate too much heat energy easily, thereby reduce the luminous efficacy of light-emitting diode component.
One of method of this heat dissipation problem of solution is for utilizing large-area metal material to be used as radiating block at present, this heat dissipation metal piece can promote for example heat-sinking capability of electronic building brick such as package structure for LED, at this moment, this radiating block and be provided with the circuit board of light emitting diode or pedestal between have the insulating heat-conductive base material, with electrical isolation radiating block and the circuit board or the pedestal that are provided with light emitting diode.Yet the mode in conjunction with radiating block, insulating heat-conductive base material and circuit board is to utilize double faced adhesive tape to bind at present, because the heat transfer efficiency of double faced adhesive tape is not good, thereby seriously influences the transmission of heat, and then influences the integral heat sink effect.
Summary of the invention
One of purpose of the present invention is to provide a kind of radiator structure, it is characterized in that this radiator structure comprises:
Substrate;
Radiating block has recess;
Heat conducting base material has compressibility, and wherein this heat conducting base material is to be contacted with this substrate, and this substrate pushes this heat conducting base material in this recess of this radiating block; And
Support the part of pulling, push this heat conducting base material in order to support this substrate of pulling.
Two of purpose of the present invention is to provide a kind of backlight module, it is characterized in that this radiator structure comprises:
Substrate is provided with light source;
Radiating block has recess
Heat conducting base material has compressibility, and wherein this heat conducting base material is to be contacted with this substrate, and this substrate pushes this heat conducting base material in this recess of this radiating block; And
Support the part of pulling, push this heat conducting base material in order to support this substrate of pulling.
Three of purpose of the present invention is to provide a kind of liquid crystal indicator, it is characterized in that this liquid crystal indicator comprises:
As above-mentioned backlight module; And
Display panels is provided with respect to this backlight module.
Four of purpose of the present invention is to provide a kind of assemble method of radiator structure, it is characterized in that the assemble method of this radiator structure comprises:
Radiating block is provided, and wherein this radiating block has recess;
Heat conducting base material is set in this recess of this radiating block, wherein this heat conducting base material has compressibility;
Utilize substrate to contact and push this heat conducting base material in this recess of this radiating block; And
Utilize to the part of pulling to come, to push this heat conducting base material to this substrate of pulling.
Five of purpose of the present invention is to provide a kind of assemble method of backlight module, it is characterized in that the assemble method of this backlight module comprises:
Radiating block is provided, and wherein this radiating block has recess;
Heat conducting base material is set in this recess of this radiating block, wherein this heat conducting base material has compressibility;
Utilize substrate to contact and push this heat conducting base material in this recess of this radiating block, wherein this substrate is provided with light source; And
Utilize to the part of pulling to come, to push this heat conducting base material to this substrate of pulling.
Six of purpose of the present invention is to provide a kind of assemble method of display unit, it is characterized in that the assemble method of this display unit comprises:
Assembling backlight module, wherein this backlight module step of this assembling comprises:
Radiating block is provided, and wherein this radiating block has recess;
Heat conducting base material is set in this recess of this radiating block, wherein this heat conducting base material has compressibility;
Utilize substrate to contact and push this heat conducting base material in this recess of this radiating block, wherein this substrate is provided with light source; And
Utilize to the part of pulling to come, to push this heat conducting base material to this substrate of pulling; And display floater is set with respect to backlight module.
Radiator structure of the present invention and assemble method thereof can be applicable in the backlight module or other electronic installation of liquid crystal indicator, use the integral heat sink effect that promotes radiator structure.
For foregoing of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below:
Description of drawings
Fig. 1 shows the local schematic top plan view according to the backlight module of one embodiment of the invention;
Fig. 2 shows the generalized section according to the backlight module of one embodiment of the invention;
Fig. 3 shows the local schematic top plan view according to the backlight module of one embodiment of the invention;
Fig. 4 shows the assemble method flow chart according to the radiator structure of one embodiment of the invention;
Fig. 5 and Fig. 6 show according to the heat conducting base material of one embodiment of the invention and the schematic top plan view of radiating block;
Fig. 7 shows the schematic top plan view according to the radiator structure of another embodiment of the present invention; And
Fig. 8 A and Fig. 8 B show the generalized section according to the backlight module of another embodiment of the present invention.
The specific embodiment
Please refer to Fig. 1 and Fig. 2, Fig. 1 shows the local schematic top plan view according to the backlight module of one embodiment of the invention, and Fig. 2 shows the generalized section according to the backlight module of one embodiment of the invention.The radiator structure of present embodiment can be applicable in the electronic installation, to promote radiating efficiency.For example, this radiator structure can be applicable in the backlight module 100, and when the radiator structure of present embodiment was applied to backlight module 100, backlight module 100 can be provided with respect to a display panels (can not show), and be assembled into liquid crystal indicator (Liquid Crystal Display, LCD).At this moment, backlight module 100 comprises framework 110, substrate 120, radiating block 130, heat conducting base material 140, supports pull part 150 and at least one blooming piece 160.Framework 110 can be in order to assembling substrates 120, radiating block 130, heat conducting base material 140, support pull part 150 and blooming piece 160.Substrate 120 is provided with at least one light source 121, and can form a luminous lamp strip (Light Bar).Heat conducting base material 140 is to be arranged between substrate 120 and the radiating block 130, and directly is contacted with substrate 120 and radiating block 130.Supporting the part 150 of pulling is to push heat conducting base material 140 in order to support the substrate 120 of pulling, and uses that heat conducting base material 140 is squeezed between substrate 120 and the radiating block 130.In the present embodiment, backlight module 100 for example is a side direction type light inlet (Edge Lighting) backlight module, at this moment, supports the part 150 of pulling and can be a LGP.Because heat conducting base material 140 is directly to be contacted with substrate 120 and radiating block 130, thereby can avoid influencing integral heat sink efficient because of medium (for example double faced adhesive tape) exists.
As depicted in figs. 1 and 2, the framework 110 of present embodiment for example is made with high-intensity metal or plastic material, its middle frame 110 is provided with chamber 111, in order to ccontaining substrate 120 with light source 121, the madial wall of chamber 111 can be coated with highly reflective material, for example: any combination that the alloy of silver, aluminium, gold, chromium, copper, indium, iridium, nickel, platinum, rhenium, rhodium, tin, tantalum, tungsten, manganese, its above-mentioned any combination, anti-yellow and heat-resisting white reflect paint vehicle or above-mentioned material, in order to reflection ray.
As depicted in figs. 1 and 2, the substrate 120 of present embodiment for example is printed circuit board (PCB) (Printed circuitboard, PCB), flexible printed wiring board (Flexible Printed Circuits, FPC) or plastic base (Plastic Substrate), in order to the luminous action of carrying and control light source 121.Substrate 120 for example is made with fluorine system (PTFE), polyphenylene oxide (PPO) or glass epoxy materials such as (FR-4), and configurable circuit is arranged, so that electrical connection path to be provided.Light source 121 is to be arranged on the side of substrate 120, light source 121 for example is light emitting diode (LED), High Power LED (High Power LED) or Organic Light Emitting Diode (Organic Light Emitting Diode, OLED), in order to backlight to be provided.In one embodiment, substrate 120 more is provided with a conducting strip (not illustrating), high heat-conducting copper sheet for example, and it is arranged on the opposite side of substrate 120, to promote the thermal conductivity of substrate 120.
As depicted in figs. 1 and 2, the radiating block 130 of present embodiment is the relative opposite side that is arranged at substrate 120, radiating block 130 is preferably made with the metal material of high-termal conductivity, for example: silver, copper, copper alloy, Kufil, aluminium, aluminium alloy and above-mentioned any alloy thereof, use the heat that distributes from substrate 120, and can increase area of dissipation, improve radiating efficiency.Radiating block 130 has a recess 131, in order to ccontaining heat conducting base material 140.In the present embodiment, the substrate 120 that is provided with light source 121 for example is to be arranged on a pair of angular direction of framework 110, uses to bring in from one of backlight module 100 to emit beam.At this moment, radiating block 130 can bulk triangular in shape, is embedded in an end of framework 110 with correspondence.In certain embodiments, radiating block 130 also can be according to the demand of radiating efficiency, and is provided with the radiating fin or the thermal column (not illustrating) of difformity or varying number.
As depicted in figs. 1 and 2, the heat conducting base material 140 of present embodiment be preferably have compressibility, the material of high-termal conductivity and high-insulativity, heat conductive silica gel or be mixed with the macromolecular material (as heat conductive insulating rubber) of high-thermal conductive metal oxide for example, in order to the heat of conductive substrate 120 to radiating block 130, and electrical isolation substrate 120 and radiating block 130.Heat conducting base material 140 is to be contacted with substrate 120, and be squeezed in by substrate 120 in the recess 131 of radiating block 130, wherein the volume of heat conducting base material 130 before being extruded is 1.2～1.3 times of its volume after being extruded, that is recess 131 degree of depth (or its volume) of radiating block 130 are 1.2～1.3 times of the thickness (or volume) of heat conducting base material 130 before being extruded.Therefore, when heat conducting base material 140 was squeezed in the recess 131 of radiating block 130, heat conducting base material 140 can closely be contacted with substrate 120 and radiating block 130 respectively, promoting heat-conducting effect, and can avoid air to sneak in the radiator structure, to promote heat-conducting effect.Moreover, because heat conducting base material 140 is the recesses 131 that closely are contacted with radiating block 130, thereby the contact area of increase and radiating block 130, and then promote heat-conducting effect.
Please refer to Fig. 3, it shows the local schematic top plan view according to the backlight module of one embodiment of the invention.In one embodiment, substrate 120a and radiating block 130a can be arranged at a side of framework 110, and at this moment, radiating block 130a can for example rectangular bulk.
As depicted in figs. 1 and 2, when supporting of present embodiment pulled part 150 during for example for LGP, LGP (supporting the part 150 of pulling) can directly be connected to the light source 121 of substrate 120, thereby when substrate 120, radiating block 130, heat conducting base material 140 and when supporting the part 150 of pulling and being assembled in the framework 110, LGP can support the substrate 120 of pulling push heat conducting base material 140 in the recess 131 of radiating block 130, and the light that can guide light source 121 comes bright dipping.LGP (supporting the part 150 of pulling) is a side that is arranged at substrate 120, with the guiding bright dipping, LGP for example is to utilize the mode of ejection formation to make disk construction or clapboard structure, and its material for example is photo-hardening type resin, propylene or polymethyl methacrylate (PMMA).And LGP can be provided with light guide structure (not illustrating), and for example successional v-shaped structure (that is V-Cut structure), cloudy surface structure or scattering point structure are come the forward bright dipping with directing light on the light reflection surface (bottom surface) of LGP.Wherein, the bearing surface of LGP and light source 121 (that is incidence surface of LGP) can have for example v-shaped structure (V-Cut), S shape wave structure or surface roughening processing (not illustrating), uses the incident efficient and the coupling efficiency that promote light.
As depicted in figs. 1 and 2, the blooming piece 160 of present embodiment for example is: diffusion sheet, prismatic lens, inverse edge eyeglass (Turning Prism Sheet), brightness enhancement film (Brightness Enhancement Film, BEF), reflective brightness enhancement film (Dual Brightness Enhancement Film, DBEF), non-multilayer membrane type reflective polarizers (Diffused Reflective Polarizer Film, DRPF) or above-mentioned any combination, it is arranged at the top of LGP (supporting the part 150 of pulling), in order to improve optical effect.
Please refer to Fig. 4, Fig. 5 and Fig. 6, Fig. 4 shows the assemble method flow chart according to the radiator structure of one embodiment of the invention, and Fig. 5 and Fig. 6 show according to the heat conducting base material of one embodiment of the invention and the schematic top plan view of radiating block.When assembling the radiator structure (as backlight module 100) of present embodiment, at first, as shown in Figure 5, radiating block 130 (step S201) is provided, then, as shown in Figure 6, heat conducting base material 140 is set in the recess 131 of radiating block 130 (step S202), then, utilize substrate 120 to contact and push heat conducting base material 140 in the recess 131 of radiating block 130 (step S203), then, utilize and support the next substrate 120 (step S204) of pulling that supports of the part 150 (for example LGP) of pulling, use making substrate 120 extruding heat conducting base material 140, thereby form the radiator structure of present embodiment.
Therefore, the radiator structure of present embodiment and assemble method thereof can closely push heat conducting base material 140 between substrate 120 and radiating block 130, thereby promote the heat-conducting effect of heat conducting base material 140, and then promote the integral heat sink effect.
Please refer to Fig. 7, it shows the schematic top plan view according to the radiator structure of another embodiment of the present invention.In another embodiment, the part 150b that pulls that supports of radiator structure for example is locked assembly (as screw), and it can lock substrate 120b on radiating block 130b, thereby supports the substrate 120b that pulls and push heat conducting base material 140 in the recess 131 of radiating block 130b.
Please refer to Fig. 8 A and Fig. 8 B, it shows the generalized section according to the backlight module of another embodiment of the present invention.In another embodiment, support pull part 150c, the 150d of radiator structure for example are the framework of backlight module 100c, 100d, at this moment, backlight module can be side direction type light inlet or straight-down negative light inlet (BottomLighting), and framework (supporting pull part 150c, 150d) can be provided with blocking part 151c, 151d, pushes heat conducting base material 140 in order to support pull substrate 120c, 120d.Shown in Fig. 8 A, when backlight module 100c is that side direction type is gone into the light time, blocking part 151c can be arranged between LGP 170c and the substrate 120c, to support the substrate 120c that pulls in a side of framework (supporting the part 150c that pulls), at this moment, LGP 170c can select not to be connected to the light source 121 of substrate 120c.Shown in Fig. 8 B, when backlight module 100d is that straight-down negative is gone into the light time, blocking part 151d can be convexly set on the madial wall of framework (supporting the part 150d that pulls), pulls substrate 120d in the bottom of framework to support.
It should be noted that the above embodiments are to illustrate with backlight module, so be not limited thereto that radiator structure of the present invention for example can be applicable in other circuit board or other electronic installation that is provided with semiconductor chip or integrated circuit (IC).
By the embodiment of the invention described above as can be known, radiator structure of the present invention and assemble method thereof can be applicable in the backlight module or other electronic installation of liquid crystal indicator, use promoting the heat-conducting effect of heat conducting base material between substrate and radiating block, and then promote the integral heat sink effect of radiator structure.
In sum; though the present invention discloses as above with preferred embodiment; but the preferred embodiment is not in order to restriction the present invention; the those of ordinary skill in this field; without departing from the spirit and scope of the present invention; all can do various changes and retouching, so protection scope of the present invention is as the criterion with the scope that claim defines.
Claims (12)
1. radiator structure is characterized in that this radiator structure comprises:
Substrate;
Radiating block has recess;
Heat conducting base material has compressibility, and wherein this heat conducting base material is to be contacted with this substrate, and this substrate pushes this heat conducting base material in this recess of this radiating block; And
Support the part of pulling, push this heat conducting base material in order to support this substrate of pulling, wherein the volume of this heat conducting base material before being extruded is 1.2～1.3 times of the volume of this heat conducting base material after being extruded, and the volume of this heat conducting base material before being extruded is the volume greater than this recess of this radiating block.
2. radiator structure according to claim 1 is characterized in that: this substrate is a circuit board, and this circuit board is provided with light source.
3. backlight module is characterized in that this backlight module comprises:
Substrate is provided with light source;
Radiating block has recess;
Heat conducting base material has compressibility, and wherein this heat conducting base material is to be contacted with this substrate, and this substrate pushes this heat conducting base material in this recess of this radiating block; And
Support the part of pulling, push this heat conducting base material in order to support this substrate of pulling, wherein the volume of this heat conducting base material before being extruded is 1.2～1.3 times of the volume of this heat conducting base material after being extruded, and the volume of this heat conducting base material before being extruded is the volume greater than this recess of this radiating block.
4. backlight module according to claim 3 is characterized in that: this heat conducting base material has high-termal conductivity and high-insulativity.
5. backlight module according to claim 3 is characterized in that: this light source is a light emitting diode.
6. backlight module according to claim 3 is characterized in that: should support the part of pulling is LGP.
7. backlight module according to claim 3 is characterized in that: should support the part of pulling is framework.
8. backlight module according to claim 3 is characterized in that: should support the part of pulling is locked assembly.
9. liquid crystal indicator is characterized in that this liquid crystal indicator comprises:
Backlight module as claimed in claim 3; And
Display panels is provided with respect to this backlight module.
10. the assemble method of a radiator structure is characterized in that the assemble method of this radiator structure comprises:
Radiating block is provided, and wherein this radiating block has recess;
Heat conducting base material is set in this recess of this radiating block, wherein this heat conducting base material has compressibility;
Utilize substrate to contact and push this heat conducting base material in this recess of this radiating block; And
Utilize to the part of pulling to come to this substrate of pulling, to push this heat conducting base material, wherein the volume of this heat conducting base material before being extruded is 1.2～1.3 times of the volume of this heat conducting base material after being extruded, and the volume of this heat conducting base material before being extruded is the volume greater than this recess of this radiating block.
11. the assemble method of a backlight module is characterized in that the assemble method of this backlight module comprises:
Radiating block is provided, and wherein this radiating block has recess;
Heat conducting base material is set in this recess of this radiating block, wherein this heat conducting base material has compressibility;
Utilize substrate to contact and push this heat conducting base material in this recess of this radiating block, wherein this substrate is provided with light source; And
Utilize to the part of pulling to come to this substrate of pulling, to push this heat conducting base material, wherein the volume of this heat conducting base material before being extruded is 1.2～1.3 times of the volume of this heat conducting base material after being extruded, and the volume of this heat conducting base material before being extruded is the volume greater than this recess of this radiating block.
12. the assemble method of a display unit is characterized in that the assemble method of this display unit comprises:
Assembling backlight module, wherein this backlight module step of this assembling comprises:
Radiating block is provided, and wherein this radiating block has recess;
Heat conducting base material is set in this recess of this radiating block, wherein this heat conducting base material has compressibility;
Utilize substrate to contact and push this heat conducting base material in this recess of this radiating block, wherein this substrate is provided with light source; And
Utilize to the part of pulling to come to this substrate of pulling, to push this heat conducting base material, wherein the volume of this heat conducting base material before being extruded is 1.2～1.3 times of the volume of this heat conducting base material after being extruded, and the volume of this heat conducting base material before being extruded is the volume greater than this recess of this radiating block; And
Display floater is set with respect to backlight module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810202916XA CN101403490B (en) | 2008-11-14 | 2008-11-14 | Cooling structure, backlight module and LCD device and its assembling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810202916XA CN101403490B (en) | 2008-11-14 | 2008-11-14 | Cooling structure, backlight module and LCD device and its assembling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101403490A CN101403490A (en) | 2009-04-08 |
| CN101403490B true CN101403490B (en) | 2011-01-19 |
Family
ID=40537584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810202916XA Expired - Fee Related CN101403490B (en) | 2008-11-14 | 2008-11-14 | Cooling structure, backlight module and LCD device and its assembling method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101403490B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108730855A (en) * | 2018-08-31 | 2018-11-02 | 李文星 | High-voltage LED panel light |
| TWI675228B (en) | 2018-12-05 | 2019-10-21 | 友達光電股份有限公司 | Backlight module |
-
2008
- 2008-11-14 CN CN200810202916XA patent/CN101403490B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101403490A (en) | 2009-04-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101546741B1 (en) | Light emitting module and display apparatus having the same | |
| KR101777527B1 (en) | Backlight module and liquid crystal display module using same | |
| CN101988648B (en) | Backlight unit and liquid crystal display using the same | |
| TWI333580B (en) | Backlight module and liquid crystal display using the same | |
| US20150268410A1 (en) | Liquid crystal display device | |
| US8777437B2 (en) | Light-emitting module | |
| JP2011119218A (en) | Backlight assembly | |
| JP2006011242A (en) | Liquid crystal display device | |
| CN102679275A (en) | Heat-dissipation aluminium extruding structure and corresponding backlight module | |
| US9229155B2 (en) | Side-edge backlight module | |
| US20110007521A1 (en) | Backlight module with a heat conductive block | |
| US20160246105A1 (en) | Liquid crystal module and heat dissipation structure therefore | |
| CN101988663A (en) | Backlight module and display device | |
| WO2014067173A1 (en) | Led lamp bar and backlight module using same | |
| US20230326421A1 (en) | Light-emitting assembly | |
| US8523418B2 (en) | LED light bar and backlight module of liquid crystal display device | |
| CN101403490B (en) | Cooling structure, backlight module and LCD device and its assembling method | |
| US9028092B2 (en) | LED light bar and backlight module using the LED light bar | |
| TW200811531A (en) | Backlight module | |
| WO2013078728A1 (en) | Led light strip and backlight module of liquid crystal display device | |
| US9389354B2 (en) | Backlight module | |
| US11221443B2 (en) | Backlight module | |
| JP2006039341A (en) | Liquid crystal display device | |
| US20140198522A1 (en) | Side-Edge Backlight Module | |
| WO2016037376A1 (en) | Side-incident type backlight module and liquid crystal display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110119 Termination date: 20201114 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |