CN101401204A - Method for manufacturing a microelectronic package - Google Patents
Method for manufacturing a microelectronic package Download PDFInfo
- Publication number
- CN101401204A CN101401204A CN200780009043.4A CN200780009043A CN101401204A CN 101401204 A CN101401204 A CN 101401204A CN 200780009043 A CN200780009043 A CN 200780009043A CN 101401204 A CN101401204 A CN 101401204A
- Authority
- CN
- China
- Prior art keywords
- flexible foils
- micro
- foils
- electronics
- conductive trace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/00238—Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
Abstract
The invention relates to a method of packaging an electronic microsystem (200) and further to such a packaged device. With the method a packaged electronic microsystem (200) can be manufactured using a flexible foil (80) having conductive tracks (100) on at least on side of the flexible foil. The electronic microsystem (200) and the flexible foil (80) are arranged in a way that a sealed or even hermetic package can be realized and contact pads (210) of the electronic microsystem (200) are connected to conductive tracks (100) extending to the outer surface of the packaged device after folding the flexible foil (80) in the proposed way. No vias or throughholes in the flexible foil (80) are needed.
Description
Technical field
The present invention relates to the method that a kind of manufacturing comprises the microelectronics Packaging of electronics micro-system, described electronics micro-system can be the combination of MEMS (micro electro mechanical system) (MEMS), microfluidic device, integrated circuit (IC) or at least two kinds of these devices.In addition, the present invention relates to comprise the encapsulation of described electronics micro-system.
Background technology
The electronics micro-system is configured to independent pre-packaged unit usually.Each electronics micro-system all is installed in the encapsulation, be installed in successively on the circuit board such as printed circuit board, and encapsulation electrically contacts the contact of electronics micro-system and the lead on the circuit board.Usually through hole connects the form that is used for conduction and connects the contact of electronics micro-system and the conductive trace of encapsulation.These through hole bondings are the little wires such as gold that extend to another electric contact point from an electric contact point, and major part is passed air and introduced unnecessary ghost effect.
From US2005/0233496 as can be known not with the package example of through hole bonding.In one embodiment, pile up micromodule and comprise flexible sheets, described flexible sheets has obverse and reverse and comprises at least the first plate and second plate.Second plate and first plate are adjacent one another are, and second plate is included in the terminal on the reverse side, are used to install external circuit.First plate comprises the non-molded microelectronic element of installing on it.Microelectronic element has front surface and rear surface, and wherein front surface is relative with the reverse side of first plate.In manufacture process, the folded flexible sheet forms and piles up micromodule, the rear surface of first microelectronics assembling and the positive relative of second plate and fully connection.Cause in the process that external circuit is installed subsequently second plate to keep smooth like this.Flexible sheets comprises metal level and dielectric layer, and dielectric layer comprises through hole or through hole.These through holes or through hole are etchings or be stamped to form on dielectric layer, be filled with electric conducting material and be used to electrically contact the contact of microelectronic element and the lead of metal level, realize to connect the microelectronic element contact and the purpose of circuit board such as printed circuit board (pcb).The needs of through hole or through hole have increased the complexity of flexible sheets processing, have caused higher cost.
Summary of the invention
A target of the present invention makes it firm for the electronics micro-system provides encapsulation exactly, reduces cost, is easy to make.This target realizes by a kind of manufacture method of microelectronics Packaging, described microelectronics Packaging comprises electronics micro-system and at least one flexible foils with electronics contact pad, described flexible foils is made up of separator and at least one conductive layer at least one side of described separator, and described manufacture method may further comprise the steps:
Described flexible foils is divided at least 5 parts;
Make up feasible at least one conductive trace that exists of described at least one conductive layer;
On the part of described flexible foils, place described electronics micro-system;
Folding described flexible foils make described flexible foils cover at least a portion of at least three sides of described electronics micro-system, and two parts at least of described flexible foils faces with each other;
Make in described at least one conductive trace of at least one contact pad of described electronics micro-system and described flexible foils conductive layer at least one contact with electrically conducting manner, wherein at least one conductive trace that contacts with described at least one contact pad extends to the microelectronics Packaging surface, makes described at least one conductive trace that extends to described microelectronics Packaging surface to be connected with other conductive structures that described electronics micro-system and flexible foils do not comprise.Preferably, described flexible foils is longer than another along the size of one of them dimension, forms a kind of banded structure.Division in cutting apart subsequently is perpendicular to the size of flexible foils longest edge and suitable electronics micro-system.The photo-patternable that the structure of conductive layer can utilize photoresist to pass through conductive layer realizes, is the etch step that is fit to flexible foils material and conductive subsequently.Then, structure can be realized by the method for the laser grinding (laser abrasion) of detailed description in the european patent application 05108280.8 " A method of manufacturing a microsystem; such amicrosystem; a stack of foils comprising such a microsystem, an electronicdevice comprising such a microsystem and use of the electronic device " of filing on September 9th, 2005.Folding process is based on the division of flexible foils.Each part of flexible foils all is a side of folded flexible paper tinsel at last.Each part of the flexible foils that is folded becomes about 90 ° angle with the preceding part of flexible foils and/or a back part.If two parts of flexible foils are positioned at top each other usually, then there is the interconnect portion of paper tinsel in supposition.This interconnect portion between two parts above each other becomes about 90 ° angle with a preceding part with a back part.The width of this interconnect portion can be approximated to be zero, and this width depends on the thickness of flexible foils and/or pad, between the flexible foils part of described pad above being stacked on each other, so that discharge the stress of flexible foils.In this case, being positioned at each other, two parts of top seem into about 180 ° angle.Flexible foils and micro-system can bond together by using adhesive.Adhesive also can be used for folding mutually flexible foils part.Another possibility is to use the material as the flexible foils separator, and described material is bonded micro-system and oneself by activating such as special physical condition such as heating and pressurization.Because conductive trace extends to the outer surface of encapsulation, so flexible foils does not need other through holes or through hole just can set up from the external world to the conductive trace and the direct connection of micro-system contact pad.Thereby, this special package provide a kind of method simple, with low cost to connect the electronics micro-system electric contact pad and the electric contact pad on printed circuit board or other substrates, described printed circuit board or other substrates are used to the different subelements that assemble and electrically contact an electronic system.Simplify the manufacturing of encapsulation like this, reduced cost, improved the reliability of packaging electronic micro-system.In addition, if alternatively use one or more conductive traces on the flexible foils, then do not need to make between the different contact pads of micro-system to be connected to each other by bonding.Can set up connection with low cost, reliable between the different parts of electronics micro-system.
In one embodiment of the invention, flexible foils has 5 continuous parts, first, second portion, third part, the 4th part and the 5th part and at least one conductive trace, described trace connects electronics micro-system contact pad and extends to the surface of microelectronics Packaging, described microelectronics Packaging can be connected with other conductive structures that do not comprise electronics micro-system and flexible foils, be positioned on second of flexible foils, extend to the 5th part of flexible foils, at least to the 4th part.The electronics micro-system places first side of flexible foils first.Flexible foils is folding in one way, makes a side of flexible foils first overlay electronic micro-system, and described side is relative with micro-system one side that has contact pad.One side of the second portion overlay electronic micro-system of flexible foils, and actual in micro-system one side that is covered by flexible foils first.The third part of flexible foils is further folding, makes the end face of packaging electronic micro-system separate with electronics micro-system one side that has contact pad by the 5th part of flexible foils.Second side that is folded in flexible foils the 5th part below the flexible foils third part is relative with the contact pad of electronics micro-system, to realize electrically contacting between at least one conductive trace on electronics micro-system contact pad and flexible foils second side.At least one conductive trace that contacts with electronics micro-system contact pad extends to the 4th part of flexible foils, is not covered by the side of the wherein part of flexible foils or electronics micro-system here.If the tetrameric undersize of flexible foils, then further extends to the third part or or even second or the first of flexible foils of flexible foils with the conductive trace of contact such as printed circuit board.
In one embodiment of the invention, flexible foils has 5 continuous parts, first, second portion, third part, the 4th part and the 5th part and at least one conductive trace, described trace connects electronics micro-system contact pad and extends to the surface of microelectronics Packaging, described microelectronics Packaging can be connected with other conductive structures of described electronics micro-system and flexible foils not included, be positioned on first of flexible foils, begin to extend from the flexible foils third part at the latest, extend to the 4th part of flexible foils at least.The electronics micro-system places first side of flexible foils first.Flexible foils is folding in this manner, makes a side of flexible foils first overlay electronic micro-system, and described side is relative with micro-system one side that has contact pad, wherein the restriction that only has a contact pad micro-system in a side clear just to description.One side of the second portion overlay electronic micro-system of flexible foils, and actual in micro-system one side that is covered by flexible foils first.The third part of flexible foils is further folding, makes that first side of flexible foils third part is relative with the side that the electronics micro-system has contact pad.The 5th part of flexible foils becomes about 90 ° angle with third part is actual with the 4th part of flexible foils, and second side of flexible foils third part is relative with second side of flexible foils the 5th part.Actual at least one conductive trace that contacts with the contact pad of electronics micro-system extends to flexible foils the 4th part on flexible foils third part first side, and it is not covered by the side of the part of flexible foils or electronics micro-system here.If the tetrameric undersize of flexible foils with the conductive trace of contact such as printed circuit board, then further extends to the 5th part of flexible foils.In other structures of present embodiment, conductive trace can extend to the 4th part of flexible foils at least from first side of flexible foils first, with electrically contacting of contact pad on realization and electronics micro-system one side, described side is relative with first side of flexible foils first.In addition, do not extend to the microelectronics Packaging surface, can can be positioned on flexible foils first side with other conductive traces that other conductive structures that do not comprise electronics micro-system and flexible foils contact, extend to the flexible foils third part with the contact pad on the contact electronics micro-system bottom surface from flexible foils first, described bottom surface is relative with first side of flexible foils first, and the contact pad on the electronics micro-system end face is relative with first side of flexible foils third part.
In another embodiment, flexible foils has at least 7 parts, have two conductive layers, respectively in the both sides of flexible foils separator, comprise following additional step: make up flexible foils second conductive layer, make after placing electronics micro-system and folded flexible paper tinsel, at least one overlapping contact area is arranged between at least two conductive traces, first conductive trace is on flexible foils separator first side, second conductive trace makes at least two conductive trace contacts by at least one overlapping contact area with electrically conducting manner on second side.For example this method can be used to make be positioned at electronics micro-system one side for example the contact pad on the bottom surface and opposite side for example other contact pads on the electronics micro-system end face be connected, and make the function contact of packaging under the situation that does not have flexible foils separator through hole or through hole, extend to the encapsulation outside.In addition, can pile up, be positioned at the top of each other, and the centre there is flexible foils and different electronics micro-systems are interconnected each other more than an electronics micro-system.
The electronics micro-system comprises at least a from MEMS device, microfluidic device or the IC group.Particularly, if the assembled package of MEMS device and IC assembled package or microfluidic device and IC or the encapsulation of three kinds of combination of devices, can be used to the to interconnect electric contact pad of different components of the conductive trace on flexible foils.The through hole that does not need to add connects, and has reduced ghost effect on the one hand, has reduced cost on the other hand.In addition, owing to avoided responsive through hole to connect, improved reliability.
In another embodiment, the electronics micro-system comprises MEMS device or the microfluidic device of being made up of the flexible foils of identical type, is used for microelectronics Packaging.MEMS device or microfluidic device comprise the structure paper tinsel and pile up paper tinsel, as the description in the european patent application of submitting on September 9th, 2,005 05108280.8 " A method of manufacturing a microsystem; such a microsystem; a stack of foils comprising such a microsystem, an electronic devicecomprising such a microsystem and use of the electronic device ".In this patent application, described in a large number by structure paper tinsel and the MEMS device and the microfluidic device that pile up the paper tinsel realization.With the similar paper tinsel of describing in detail in the above-mentioned patent application be used for benefit of the present invention be microelectronic component can be encapsulated in same technology and finish.The flexible foils that is used to encapsulate and the structure stack of foils that is used for microelectronic component are together.In another step procedure of processing, use the folding paper tinsel that is used to encapsulate of the mode identical with said method, set up the paper tinsel that is used to encapsulate simultaneously and be used for MEMS or the paper tinsel of microfluidic device on conduction between the conductive trace connect.Be used to set up a kind of selection that conduction connects and be to use the structural conductive adhesive.In addition, adhesive linkage can bonding MEMS or microfluidic device and the paper tinsel that is used to encapsulate with sealed package.Can reduce the mechanical stress of the paper tinsel that is used to encapsulate by pad, described pad is formed by piling up of each layer paper tinsel on the paper tinsel that is used to encapsulate.IC reads or drives the signal of MEMS or microfluidic device if desired, and then it can be integrated in the groove that forms in the multilayer foil construction with MEMS device or microfluidic device.Be used to the paper tinsel that encapsulates and structural conductive layer then conductive interconnection between MEMS device or microfluidic device and the IC can be provided.
If the combination of MEMS device, microfluidic device, IC or IC and MEMS device or microfluidic device is made up of compatible material, then can contact (under the situation above conductive trace is positioned at each other) by the permanent conduction that heating and pressurization are set up between the combination of flexible foils and MEMS device, microfluidic device, IC or IC and MEMS device or microfluidic device.Particularly, if use above-mentioned similar flexible foils that is used to encapsulate and structure assembling, encapsulation process can be finished in low-cost integrating process.In this embodiment, if heating or pressurization, flexible foils or more accurate be flexible foils separator both with another separator of another flexible foils, the structural conductive layer with another flexible foils closely bonds again.By heating the material, the particularly material of flexible foils separator that the temperature that will reach depends on flexible foils.In addition, temperature also needs to be suitable for the material (for example welding material) that the microelectronic component contact pad is electrically connected with the conductive trace that is used to encapsulate flexible foils structural conductive layer.Maximum temperature depends on the fusing point of flexible foils.Pressure vertically puts on the flexible foils plane.Pressure is selected to depend on the material, the particularly material of flexible foils separator that flexible foils is used, and can form reliable permanent contact to such an extent as to pressure is very high.Required more details about heating and pressurization are asked for an interview above-cited patent application.
The method of describing in the previous section can be actually used in generation sealing or air-tight packaging by making up at least one flexible foils conductive layer, on at least one surface of the micro-system that contacts with flexible foils, make up at least one zone and link to each other with air tight manner and structural flexibility paper tinsel and arrange at least one zone as around the last sealing ring in every other zone at least one surface of the micro-system that contact with flexible foils, wherein flexible foils, at least one structural conductive layer and micro-system are continuous with non-air tight manner.Direct between the separator of a flexible foils and the separator of another flexible foils contact or the conductive layer of the separator of a flexible foils and another flexible foils between directly contact the tight contact that causes between two flexible foils.Utilize this characteristic; around other zones such as two conductive layers around sealing ring (enough conduction contact but be not airtight) toward each other, stop the contact moisture to realize vacuum or protective gas on every side with the reliability that improves packaging or at MEMS device movable part.If electronics micro-system surface not necessarily flexible foils then can utilize identical principle still but have the characteristic identical with flexible foils aspect flexible foils is bonding.
Preferably, be characterised in that according to the method for the invention the material of described conductive layer comprises coming in the group of free aluminium, platinum, silver, gold, copper and tin indium oxide composition.Select material in fact requirement by conductivity and/or reliability aspect (corrosion) to determine from this group.
Preferably, be characterised in that according to the method for the invention the material of the separator that is used for described flexible foils comprises coming the material of the group of free polyphenylene sulfide (PPS) and polyethylene terephthalate (PET) composition.
Preferably, be characterised in that according to the method for the invention the thickness of paper tinsel is between 1 μ m to 100 μ m.If flexible foils is used to encapsulate monolithic electronics micro-system, then the thickness of paper tinsel can improve reliability between 20 μ m to 100 μ m, and this just means that the electronics micro-system uses and encapsulate the assembling of different technology.If the MEMS device comprises above-mentioned composition paper tinsel and piles up paper tinsel, then preferably flexible foils thickness is between 1 μ m to the 5 μ m, because the thickness of flexible foils has determined and the vertical available resolution in plane that is made up by described flexible foils that described flexible foils is used to make up the structure of MEMS or microfluidic device.
The invention still further relates to the described microelectronics Packaging of microelectronics Packaging and comprise the electronics micro-system that has the electronics contact pad and at least one flexible foils, described flexible foils comprises at least one conductive layer at least one side of separator and described separator.Wherein:
Flexible foils has 5 parts at least;
Conductive layer comprises at least one conductive trace;
The flexible foils that is folded covers at least a portion of three sides of described electronics micro-system, and flexible foils two parts at least faces with each other;
Make at least one contact pad of described electronics micro-system contact with electrically conducting manner with at least one conductive trace of flexible foils conductive layer, wherein at least one conductive trace that contacts with described at least one contact pad extends to the surface of microelectronics Packaging, makes at least one conductive trace that extends to described microelectronics Packaging surface to contact with other conductive structures that described electronics micro-system and flexible foils do not comprise.
Description of drawings
To be described in detail with reference to the attached drawings the present invention, wherein similar parts are represented with similar reference number:
Fig. 1 a and Fig. 1 b show first and second sides of the flexible foils that has 5 different pieces;
Fig. 2 shows the cross section of an embodiment of encapsulation micro-system;
Fig. 3 a and Fig. 3 b show first and second sides of another flexible foils that has 5 different pieces;
Fig. 4 shows the cross section of encapsulation micro-system second embodiment;
Fig. 5 shows second side of the flexible foils that has 7 parts and conductive trace;
Fig. 6 shows the cross section of encapsulation micro-system the 3rd embodiment;
Fig. 7 a and Fig. 7 b show first and second sides of another flexible foils that has 7 different pieces;
Fig. 8 shows the cross section of encapsulation micro-system the 4th embodiment;
Fig. 9 shows the embodiment of the invention before folding with the flexible foils micro-system;
Figure 10 shows the part encapsulation step of flexible foils micro-system.
Embodiment
Fig. 1 a and Fig. 1 b show two sides of flexible foils 80, and described flexible foils has 5 parts 10,20,30,40 and 50 that are used for the packaging electronic micro-system.First face of the flexible foils 80 shown in Fig. 1 a does not have conductive layer or patterning conductive trace in the present embodiment, but this is not restriction in principle just for clarity.Shown in Fig. 1 b second wears the conductive trace 100 and 120 such as composition copper layer etc.Conductive trace 100 extends to part 50 from the part 30 of flexible foils 80.100 of conductive traces are positioned on the part 30 of flexible foils 80.
Fig. 2 shows the end view of electronics micro-system 200, and described system is with 80 encapsulation of the flexible foils that has 5 parts shown in Fig. 1 a and Fig. 1 b.The electronics micro-system is positioned on first of flexible foils 80 firsts 10.The folded flexible paper tinsel 80 then, make at least a portion of 200 1 sides of second portion 20 overlay electronic micro-systems, and described micro-system is not positioned in the first 10 of flexible foils 80.Continue folded flexible paper tinsel 80, the conductive trace 100 on feasible flexible foils 80 second sides shown in Fig. 1 b can contact with the electronics contact pad 210 of electronics micro-system 80 and first side of flexible foils 80 the 5th part 50 places the top, first side of flexible foils 80 third parts 30 also to contact with it.Be defined as the length of flexible foils 80 the 4th part 40 of size, as shown in Figure 2, the thickness that depends on flexible foils 80 or one or two pad (not shown), described pad are positioned on first side of the third part 30 of first side of first side of third part 30 or the 5th part 50 or flexible foils 80 and the 5th part 50.Pad can be that one or two have certain thickness rectangular block, for example is made of plastics.To a kind of special pad 300 be discussed in conjunction with Fig. 9 and Figure 10.Conductive trace 100 on flexible foils 80 second sides extends to the 4th part 40 of flexible foils 80 from the 5th part 50 of flexible foils 80, but it or they also can shown in Fig. 1 b, extend to third part 30 even farther like that so that realize be positioned at printed circuit board on the conduction of outside contact pad be connected.For simplicity not at can be used to the to interconnect different contact pads 210 of electronics micro-system 200 of the one or more conductive traces 120 shown in the end view shown in Figure 2.Can make in this way when electronics micro-system 200 comprises different parts, for example MEMS device and IC need interconnect to obtain required function.In this case, comparing conductive trace 120 with bonding line is to select preferably, because the latter makes easily and be less sensitive.Contact between conductive welding disk 210 and the conductive trace 100,120 for example can realize that solder ball places on the contact pad or conductive adhesive and other similar materials of electronics micro-system 200 by welding.Reliable contact between electronics micro-system 200 and the flexible foils 80 and place each other the partially flexible paper tinsel of top to realize by the mode of adhesive linkage, if perhaps the surface of electronics micro-system 200 contacts with flexible foils 80, and the separator of flexible foils 80 can be made up of by bonding mutually material by pressurization and heating those.The enforcement of this embodiment will be discussed in conjunction with Fig. 9 and Figure 10.
Fig. 3 a, Fig. 3 b and Fig. 4 show an alternative embodiment of the invention.Fig. 3 a shows first of the flexible foils 80 that has 5 parts 10,20,30,40 and 50.Conductive trace 110 extends to the 5th part 50 and extends to the 5th part 50 from the third part 30 of flexible foils 80 from the first 10 of flexible foils 80.Another conductive trace 130 extends to third part 30 from the first 10 of flexible foils 80.80 second of flexible foils shown in Fig. 3 b do not have conductive trace.As shown in Figure 4, the contact pad 210 of electronics micro-system 200 is positioned at bottom surface and end face in the present embodiment.Electronics micro-system 200 is positioned in the first 10 on 80 first of the flexible foils.The folded flexible paper tinsel 80 then, make part 20 cover the part of electronics micro-system 200 1 sides at least, and described side is not positioned at following Figure 80 first 10 tops.Further folded flexible paper tinsel 80 makes first second face near electronics micro-system 200 and the 5th part 50 of flexible foils third part 30 be positioned at second last and contact with it of flexible foils 80 third parts 30.Conductive trace on 80 first of flexible foils contacts with the contact pad 210 on electronics micro-system 200 bottom surfaces and/or end face, extend to the 5th part 50 of flexible foils 80, realize under the situation that does not have through hole or through hole on flexible foils 80 separators with such as printed circuit board above the conduction of outside contact pad be connected.Unshowned conductive trace 130 can be used to interconnect contact pad 210 on electronics micro-system 200 bottom surfaces and the contact pad 210 on electronics micro-system 200 end faces among Fig. 4.Electronics micro-system 200 can comprise two kinds of different components above being positioned at each other, for example MEMS device and IC.
Fig. 5 and Fig. 6 show an alternative embodiment of the invention.Flexible foils 80 has 7 parts.Fig. 5 shows second of flexible foils 80, and conductive trace 100 is arranged on it.Conductive trace 100 extends to the 7th part 70 from the 5th part 50.As shown in Figure 6, electronics micro-system 200 is positioned on second of flexible foils 80 firsts 10.Compare with embodiment shown in Figure 2, flexible foils is folding once, and first face of first 10 places first of flexible foils 80 third parts 30 to go up and contact with it.At least a portion of 200 1 sides of the 4th part 40 overlay electronic micro-systems, described micro-system is not positioned in the first 10 of flexible foils 80.Folding the 5th part 50 and the 7th part 70 also place top each other, make first face of the 7th part 70 place the top of 50 first of the 5th parts and contact with it, be positioned at conductive trace 100 on 80 second of the flexible foils and can directly contact and extend to flexible foils the 5th part 50 from the 7th part 70 with the contact pad 210 of electronics micro-system 200, under the situation that does not have through hole or through hole on flexible foils 80 separators with printed circuit board etc. on outside contact pad realize that conduction is connected.
Fig. 7 a, Fig. 7 b and Fig. 8 show another embodiment together.Fig. 7 shows first of the flexible foils 80 that has 7 parts, and Fig. 7 b shows second of flexible foils 80.On first of flexible foils 80, conductive trace 110 is arranged.Conductive trace can be realized by the conductive layer the copper of composition on being deposited on 80 first of flexible foils, and extend to third part 30 from the first 10 of flexible foils 80.The conductive trace 100 that is positioned on 80 second of the flexible foils extends to the 7th part 70 from the 4th part 40 of flexible foils 80.Fig. 6 shows first top that electronics micro-system 200 is positioned at flexible foils 80 firsts 10, makes at least one contact pad 210 of electronics micro-system 200 link to each other with at least one conductive trace 110 with the form of conducting electricity.Folded flexible paper tinsel 80 makes at least a portion of second portion 20 overlay electronic micro-systems 200 1 sides, shown in the electronics micro-system be not positioned at the top of flexible foils 80 firsts 10.Further folded flexible paper tinsel 80, make the 7th part 70 be clipped between flexible foils 80 third parts 30 and the 5th part 50, the part that flexible foils 80 the 5th part is 50 second and a side contacts of electronics micro-system 200, and in fact parallel with this side of electronics micro-system 200, described electronics micro-system is positioned at the top of 10 first of flexible foils 80 firsts.Conductive trace 100 on 70 second of flexible foils 80 the 7th parts has the overlapping region, and can link to each other with conductive adhesive by welding or electrically conducting manner such as bonding.The conductive trace 100 that contacts with conductive trace 110 extends to second of the 4th part 50 from second face of flexible foils 80 the 7th part 70 in this way, so as under the situation that does not have through hole or through hole on the flexible foils with place printed circuit board on outside contact pad realize that conduction contacts.In addition, the method for packing of describing in the present embodiment can be used for making other contact pads 210 on as shown in Figure 6 electronics micro-system 200 bottom surfaces to contact with contact pad on unshowned electronics micro-system 200 end faces of Fig. 6.If electronics micro-system 200 comprise be positioned at each other the top such as the combination of MEMS device and IC or need other electronic devices combinations of top each other that place of conductive interconnections, then this method has advantage.
Fig. 9 and Figure 10 show an alternative embodiment of the invention.Two end views that illustrate with Fig. 2 similar flexible paper tinsel and electronic system.Flexible foils comprises separator and conductive layer, and the described conductive layer that utilizes thin copper layer to realize can be by carrying out composition such as etching technics, and what be is whole 5 parts 10,20,30,40 and 50 that a conductive trace extends through flexible foils 80.In flexible foils first 10, other paper tinsels that extend through whole 5 parts pile up each other, and the used material of described paper tinsel and flexible foils is identical.These pile up paper tinsel can all have conductive layer at a side even the bilateral of separator.Paper tinsel itself and conductive layer are all patterned and pile up, make and make up MEMS device 220 according to the method for describing in detail in the european patent application 05108280.8 " A method of manufacturing amicrosystem; such a microsystem; a stack of foils comprising such amicrosystem, an electronic device comprising such a microsystem and use ofthe electronic device " of filing on September 9th, 2005.In addition, there is groove 240 in this embodiment, wherein is placed with IC 230.The groove 240 and the IC 230 that are made up by the composition stack of foils are optional.On third part 30 that makes up by stack of foils and the 5th part 50, pad 300 is arranged.Between the stack of foils of pad 300 and structure electronic system 200, there are space 310 and 320, have only flexible foils to exist and to realize the folding of flexible foils 80.The height of pad 300 and the height of stack of foils, described stack of foils has made up the electronic system that comprises MEMS device 220, groove 240 and IC 230, in fact determined the length of flexible foils second portion 20 and the 4th part 40, can find out in more detail from Figure 10.Figure 10 also shows method folded flexible paper tinsel 80 same as shown in Figure 2.Pad 300 places top each other, make conductive trace 100 directly to contact with the contact pad 210 of MEMS device or IC by welding, first of flexible foils the 5th part 50 in packaging inside, therefore first outer surface at packaging of flexible foils the 4th part 40 and third part 30, the conductive trace 100 that extends to part 10 from flexible foils the 5th part 50 in this case can contact with the contact pad on the printed circuit board.This conductive trace extends to the extension mode of flexible foils first 10 as just an example, directly reliably contact with external circuit as long as can realize packaging, the extension of any mode of 40,30,20 or 10 all is fine from the 5th part 50 to part.In addition, compare with the conductive trace 120 shown in Fig. 1 b, one or more conductive trace (Fig. 9 is not shown with Figure 10) can make one or more contact pad of MEMS device directly contact with one or more contact pad of IC.Be connected to each other by pressurization and heating after folding step with electronics micro-system separated portions 10 and with pad 300 separated portions 30 and 50, as shown in figure 10.Depend on the selection and the metallization of foil material, encapsulation step can produce sealing or air-tight packaging.Application vacuum or protective gas can be realized air-tight packaging in folding and bonding step.
As can be seen, the present invention can be used for making encapsulation micro-system such as MEMS device and microfluidic device in a kind of cheap mode from example disclosed by the invention.Cited embodiment is exhaustive absolutely not.Utilization both can be used for consumption electronic product according to the product that method of the present invention makes, and also can be used for medical applications, and wherein the cooperation between electronic system and the environment is absolutely necessary.Can be used as disposable products to such an extent as to the cost of these products is very low.List many concrete application of the present invention below:
The MEMS microphone is used for mobile phone and PDA
Micro pump and fluid therapy are used for chemical analysis system; And
Pressure sensor is used for tire.
As for the selection of foil material, many materials can be selected for use, for example polyvinyl chloride (PVC), polyimides (PI), polyethylene terephthalate (PET), PEN
(PEN), polystyrene (PS), polymethyl methacrylate (PMMA), polypropylene, poly-
Ethene, polyurethane, glassine paper, polyester, Parylene etc.In fact be equivalent to any symbol
Closing the material of many standards can select for use.Should be noted that:
The thickness of paper tinsel has determined vertical resolution;
Paper tinsel as basis material, must be easy to handle, preferably on spool;
Paper tinsel can metallize;
Metallized paper tinsel can preliminary treatment, preferably utilizes laser treatment;
Paper tinsel can pile up bonding afterwards, preferably utilizes the method for heating and pressurization;
Material can be in " low " temperature (less than 300 degree) fusing down; And
Stack of foils, pile up with bonding after, have the needed characteristic of micro-system.
The bonding that this aspect the important point is a paper tinsel preferably occur under the temperature that just is lower than the foil material fusing point.For example, if polyethylene terephthalate (PET) will be used 220 ℃ of these temperature as foil material (fusing point is 255 ℃).
More particularly, foil material must be selected based on the needed characteristic of application problem, i.e. temperature stability, forming stability, anti-pressure ability, optics and chemical characteristic.
At last, can use the inorganic insulation paper tinsel, for example mica.
Can describe the present invention according to specific embodiment and with reference to a certain accompanying drawing, but the invention is not restricted to, and only limit to claim in this.Any reference number in the claim all can not be considered to the restriction to scope.Accompanying drawing only is schematic diagram and is unrestriced.In the accompanying drawings, for illustrative purposes, may exaggerate some size of component, proportionally draw.The term that occurs in description of the present invention and claim " comprises ", does not get rid of other elements or step.Used indefiniteness or limited article when mentioning singular noun, for example " a " or " an ", " the " are unless specified otherwise all comprises the plural number of this noun.
In addition, describe and claim in first, second, third or similarly term be used to distinguish like, be not to describe a kind of front and back in proper order or time sequencing.Should be appreciated that the term of Shi Yonging in appropriate circumstances can mutual alternative like this, and the embodiment of the invention described herein can by with describe or illustrate that different orders realizes.
Also have, describe and claim in top, bottom, first, second or similar term are used for purpose of description, are not the description relative position.Should be appreciated that the term of Shi Yonging in appropriate circumstances can mutual alternative like this, and the embodiment of the invention described herein can by with describe or illustrate that different orders realizes.
Claims (14)
1. method of making microelectronics Packaging, described microelectronics Packaging comprises electronics micro-system (200) and at least one flexible foils (80) with electronics contact pad (210), described flexible foils is made up of separator and at least one conductive layer at least one side of described separator, said method comprising the steps of:
Described flexible foils is divided at least 5 parts (10,20,30,40,50);
Make up feasible at least one conductive trace (100) that exists of described at least one conductive layer;
On the part of described flexible foils (80), place described electronics micro-system (200);
Folding described flexible foils (80) make described flexible foils (80) cover at least a portion of (200) at least three sides of described electronics micro-system, and two parts at least of described flexible foils (80) (30,50) faces with each other;
Make in described at least one conductive trace (100) of at least one contact pad (210) of described electronics micro-system (200) and described flexible foils (80) conductive layer at least one contact with electrically conducting manner, wherein at least one conductive trace (100) that contacts with described at least one contact pad (210) extends to the microelectronics Packaging surface, makes described at least one conductive trace (100) that extends to described microelectronics Packaging surface to contact with other conductive structures that flexible foils (80) does not comprise with described electronics micro-system (200).
2. according to the method described in the claim 1, said method comprising the steps of:
Described flexible foils (80) is divided into 5 continuous parts, first, second portion, third part, the 4th part and the 5th part
On second side of described flexible foils (80), make up at least one conductive trace (100), make described at least one conductive trace (100) extend to the 4th part of described flexible foils (80) at least from the 5th part of described flexible foils (80); And
Described electronics micro-system (200) is positioned on first side of described flexible foils (80) first.
3. according to the method described in the claim 1, said method comprising the steps of:
Described flexible foils (80) is divided into 5 continuous parts, first, second portion, third part, the 4th part and the 5th part;
On first side of described flexible foils (80), make up at least one conductive trace (100), make described at least one conductive trace (100) extend to the 4th part of flexible foils (80) at least from the third part of flexible foils (80); And
Electronics micro-system (200) is positioned on first of flexible foils (80) first.
4. according to the method described in the claim 1, wherein said flexible foils (80) comprises at least 7 parts (10,20,30,40,50,60,70) with two conductive layers, a conductive layer is respectively arranged on the both sides of described flexible foils separator, and described method comprises following additional step:
Make up second conductive layer of described flexible foils, make and placing described electronics micro-system (200) and folding described flexible foils (80) afterwards, have at least one overlapping contact area between at least two conductive traces (100,110), first conductive trace (100) and second conductive trace (110) are respectively on first and second sides of described flexible foils (80) separator;
By described at least one overlapping contact area, contact described at least two conductive traces (100,110) according to the mode of conducting electricity.
5. according to the method described in the claim 1,2,3 or 4, wherein said electronics micro-system (200) comprises from MEMS (micro electro mechanical system) (MEMS), microfluidic device and integrated circuit (IC) group at least one.
6. according to the method described in the claim 1,2,3 or 4, described method also comprises following additional step: make described electronics micro-system (200) by piling up the flexible foils that is used for microelectronics Packaging, thereby described electronics micro-system (200) comprises at least a MEMS device (220) or microfluidic device.
7. according to the method described in the claim 6, described method comprises following additional step:
In the lamination of the paper tinsel that makes up described electronics micro-system (200), make up groove (240); And
Place at least one IC (230) in the described groove (240) that in described electronics micro-system (200), forms.
8. according to the method described in aforementioned arbitrary claim, described method comprises following additional step: exert pressure at elevated temperatures so that described electronics micro-system (200) and described flexible foils (80) combination, and set up the conduction contact between described conductive trace (100,110,120) and described contact pad (210).
9. the method described in according to Claim 8, described method comprises following additional step: described at least one conductive layer that makes up described flexible foils (80), make and go up at least one zone of structure at least one surface of the described micro-system (200) that contacts with described flexible foils (80), described zone can be airtight mode link to each other with described flexible foils (80), and with described at least one area configurations as going up the sealing ring in every other zone around at least one surface of the described micro-system (200) that contacts with described flexible foils (80), the flexible foils (80) and the micro-system (200) that wherein have at least one constructed conductive layer link to each other with non-air tight manner.
10. according to the method described in aforementioned arbitrary claim, wherein said conductive is to select from the group of being made up of aluminium, platinum, silver, gold, copper and tin indium oxide.
11. according to the method described in aforementioned arbitrary claim, the separator of wherein said flexible foils (80) is to select from the group of being made up of polyphenylene sulfide (PPS) and polyethylene terephthalate (PET).
12. according to the method described in aforementioned arbitrary claim, the thickness of wherein said flexible foils (80) is between 1 μ m to 100 μ m.
13. according to the described method of arbitrary claim in the claim 5 to 10, the thickness of wherein said flexible foils (80) is between 1 μ m to 5 μ m.
14. a microelectronics Packaging comprises electronics micro-system (200) and at least one flexible foils (80) with electronics contact pad (210), described flexible foils is made up of separator and at least one conductive layer at least one side of described separator, wherein:
Described flexible foils (80) has at least 5 parts (10,20,30,40,50);
Described conductive layer comprises at least one conductive trace (100);
The flexible foils that is folded (80) covers at least a portion of (200) at least three sides of described electronics micro-system, and two parts at least of described flexible foils (80) (30,50) face with each other;
Make in described at least one conductive trace (100) of at least one contact pad (210) and described flexible foils (80) conductive layer of described electronics micro-system (200) at least one contact with electrically conducting manner, wherein at least one conductive trace (100) that contacts with described at least one contact pad (210) extends to the surface of microelectronics Packaging, makes described at least one conductive trace (100) that extends to described microelectronics Packaging surface to contact with other conductive structures that flexible foils (80) does not comprise with described electronics micro-system (200).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06111124.1 | 2006-03-14 | ||
| EP06111124 | 2006-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101401204A true CN101401204A (en) | 2009-04-01 |
Family
ID=38461194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200780009043.4A Pending CN101401204A (en) | 2006-03-14 | 2007-03-09 | Method for manufacturing a microelectronic package |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20090045494A1 (en) |
| EP (1) | EP1997141A2 (en) |
| JP (1) | JP2009530805A (en) |
| CN (1) | CN101401204A (en) |
| WO (1) | WO2007105158A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104039686A (en) * | 2011-11-11 | 2014-09-10 | 高通股份有限公司 | Method and apparatus for wafer-level solder hermetic seal encapsulation of mems devices |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130320465A1 (en) * | 2012-05-30 | 2013-12-05 | Merry Electronics Co., Ltd. | Thin mems microphone module |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4231154A (en) * | 1979-01-10 | 1980-11-04 | International Business Machines Corporation | Electronic package assembly method |
| DE69226492T2 (en) * | 1991-05-15 | 1999-01-21 | Idemitsu Kosan Co | LIQUID CRYSTAL MODULE |
| US5386339A (en) * | 1993-07-29 | 1995-01-31 | Hughes Aircraft Company | Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink |
| JP2664878B2 (en) * | 1994-01-31 | 1997-10-22 | インターナショナル・ビジネス・マシーンズ・コーポレイション | Semiconductor chip package and method of manufacturing the same |
| US6940158B2 (en) * | 2003-05-30 | 2005-09-06 | Tessera, Inc. | Assemblies having stacked semiconductor chips and methods of making same |
| US7408253B2 (en) * | 2005-03-30 | 2008-08-05 | Lin Paul T | Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density |
-
2007
- 2007-03-09 JP JP2008558962A patent/JP2009530805A/en not_active Withdrawn
- 2007-03-09 WO PCT/IB2007/050790 patent/WO2007105158A2/en active Application Filing
- 2007-03-09 US US12/282,481 patent/US20090045494A1/en not_active Abandoned
- 2007-03-09 CN CN200780009043.4A patent/CN101401204A/en active Pending
- 2007-03-09 EP EP07713230A patent/EP1997141A2/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104039686A (en) * | 2011-11-11 | 2014-09-10 | 高通股份有限公司 | Method and apparatus for wafer-level solder hermetic seal encapsulation of mems devices |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009530805A (en) | 2009-08-27 |
| WO2007105158A3 (en) | 2007-12-13 |
| EP1997141A2 (en) | 2008-12-03 |
| WO2007105158A2 (en) | 2007-09-20 |
| US20090045494A1 (en) | 2009-02-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101285907B1 (en) | Electronic interface apparatus and method and system for manufacturing same | |
| US7843021B2 (en) | Double-side mountable MEMS package | |
| CN101436571B (en) | Electrical device and method | |
| JP4716038B2 (en) | Electronic component and manufacturing method thereof | |
| CN101341593B (en) | Multiple die integrated circuit package | |
| WO2006027981A1 (en) | Stereoscopic electronic circuit device, electronic device using the same, and method for manufacturing the same | |
| US20100232119A1 (en) | Method for producing an electronic module | |
| TWI236759B (en) | Semiconductor device, and laminated semiconductor device | |
| CN103052011B (en) | Micromechanics functional device, especially speaker unit and corresponding manufacturing method | |
| JP2015503850A5 (en) | ||
| CN103130176A (en) | Micromechanical functional apparatus, particularly a loudspeaker apparatus, and appropriate method of manufacture | |
| JP4361567B2 (en) | Sealing MEMS devices using liquid crystal polymers | |
| CN102867786A (en) | Chip-stacked semiconductor package | |
| CN109638149A (en) | Semiconductor packaging device | |
| JP4285339B2 (en) | Circuit module and method of manufacturing circuit module | |
| CN101401204A (en) | Method for manufacturing a microelectronic package | |
| EP2333831B1 (en) | Method for packaging an electronic device | |
| JP2008113894A (en) | Semiconductor device and electronic equipment | |
| JP5034827B2 (en) | Semiconductor device and manufacturing method thereof | |
| EP3339243B1 (en) | Interconnected layer stack with vertically aligned mems and assigned chip | |
| CN101421177A (en) | Inter-layer connection for foil MEMS technology | |
| KR101015709B1 (en) | Ceramic elements module and the manufacturing method | |
| KR101221869B1 (en) | Semiconductor package and the method of fabricating the same | |
| JP6605971B2 (en) | Sensor package and sensor device | |
| JP2009094168A (en) | Circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090401 |