CN101401106A - Method of reducing electro-static discharge (esd) from conductors on insulators - Google Patents

Method of reducing electro-static discharge (esd) from conductors on insulators Download PDF

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Publication number
CN101401106A
CN101401106A CNA2006800533584A CN200680053358A CN101401106A CN 101401106 A CN101401106 A CN 101401106A CN A2006800533584 A CNA2006800533584 A CN A2006800533584A CN 200680053358 A CN200680053358 A CN 200680053358A CN 101401106 A CN101401106 A CN 101401106A
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metallization
conductive
carrier
article
section
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CN101401106B (en
Inventor
约翰·海因斯
约翰·卡万德
莉莉·奥博伊尔
森德·萨德西万
伦纳德·文斯托
赛尔瓦托·达马托
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OpSec Safety Group Limited
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American Bank Note Holographics Inc
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Priority claimed from PCT/US2006/026964 external-priority patent/WO2007097775A1/en
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Abstract

A non-conductive carrier having a conductive component comprising a plurality of sections to disrupt the conductive component's conductive path. Each section is isolated from other sections such that a charge accumulated in one section camiot combine with the charge accumulated in another section, thereby minimizing any potential electrostatic discharge from the carrier.

Description

Reduce the method for the static discharge of electric conductor on the insulator
Related application
[0001] to require all the provisional application submitted on February 24th, 2006 number be 60/776,717,60/776,720 and 60/776,718 right of priority to the application, and each application is all incorporated among the application by reference.
Background technology
[0002] a lot of methods can be set up electrostatic charge and remain on the insulator.Usual way is to make it be in contact with one another frictional electricity by moving two kinds of different materials.As shown in Figure 1, according to its contribution or catch the ability of free electron, can form opposite electric charge (positive charge+and negative charge-) on every kind of material, wherein, described free electron is owing to the friction force that is produced in two kinds of materials relatively move process obtains.The electric charge that generates on every kind of material is called as static electric charge (motionless) or static charge.According to the environment of the contact of material in electric charge maintenance process, static charge remains on material the preceding paragraph time.Contact with conductive material if having the insulator of electric charge, the static charge of being preserved will cause that conductor has electric charge, and described electric charge can and finally be transmitted to ground by described conductive discharge.
[0003] process of the static charge of release preservation is called Electrostatic Discharge.When insulator carried or comprise metallic conductor, charge stored caused equivalent and opposite electric charge on the conductor on the insulator.Electric charge that produces and/or the electric charge that directly deposits in conductor can be transmitted in another object or ground by conductor.If comprise that the charged insulator of conductor inserts or near electronic installation, the electric charge that produces in these conductors can be delivered in the electronic installation or on the electronic installation, and causes that the function of electronic installation or near electronic installation interrupts.
[0004] static discharge can produce under a variety of situations in electronic installation, for example, when CD (CD) inserted computing machine, key inserted in the electronic lock, when perhaps comprising plastic clip insertion point of sells (POS) terminal of conductive component (conducting component).The interruption amount that ESD causes in electronic installation (being the function collapse) depends on electronic installation and how to handle the electric energy that ESD brings.In a lot of situations, the manufacturer of electronic installation considers potential ESD, thereby and design electronics ESD can be not in fact or destroy the operation of electronic installation potentially.But the insulator that electronic installation needs to carry conductive component directly inserts device (as CD), as the part of apparatus function.In this case, ESD can closely go into the sensing unit of electronic installation.Manufacturer uses special circuit design and grounding technology to guide the sensing unit of ESD energy away from electronic installation.But the specific electronic devices on the market does not design fully and effectively handles ESD, and ESD is had very low tolerance.If the ESD energy is guiding correctly not, then can interrupt the operation of electronic installation.
[0005] therefore, the present invention is intended to wish to eliminate or reduces the ESD energy that the insulator that carries conductive component discharges in electronic installation, thereby minimizes or prevent the operability or the functional interruption of electronic installation.
Summary of the invention
[0006] the objective of the invention is to eliminate or the conductive component of minimizing and electronic installation, people or the contacted seal of thing on the amount of electrostatic charge of carrying or preserving.
[0007] another object of the present invention is the conductive component segmentation with seal, thereby the amount of electrostatic charge that is stored on the conductive component will be prevented from or significantly reduce with the conduction that is stored in the static charge on the conductive component, and can not discharge in electronic installation or any other discharge path.
[0008] according to embodiments of the invention, the impedance of the conduction on the non-conductive carrier (or metal) layer increases by interrupting conductive path.By the partially conductive layer is removed or conductive layer is optionally used, in conductive layer, introduced physical discontinuity.
[0009] in an embodiment of the present invention, non-conductive carrier comprises conducting element, and this conducting element is divided into a plurality of sections conducting paths that destroy conducting element.Each section separates with other sections, minimizing a stored charge in the section, and can not combine with the electric charge of accumulation in another section, to minimize any potential static discharge.Replacedly, each section separates with other sections, thereby the electric charge that accumulates in section can not combine with the electric charge of accumulation in other sections, therefore minimizes any potential electrometer discharge of the conductive component of carrier.
[0010] in the embodiments of the invention, the method for the static discharge on a kind of conductive layer that reduces non-conductive carrier may further comprise the steps: conductive layer is divided into the conductive path that a plurality of parts are interrupted conductive layer; Thereby with each section separate with miscellaneous part the electric charge that in a section, accumulates can not with the charge bonded that accumulates in the miscellaneous part, therefore minimize any potential static discharge of the conductive component of carrier.Replacedly, each section separates with other sections, minimizing a stored charge in the section, and can not combine with the stored charge in another section, thereby minimizes any potential static discharge.
[0011] according to embodiments of the invention, the method for the static discharge on a kind of conductive layer that reduces non-conductive carrier may further comprise the steps: the conductive layer that forms the segmentation that comprises a plurality of sections is to interrupt the conductive path of conductive layer; Each section and other sections are isolated so that the electric charge that in a section, accumulates can not with the charge bonded that in miscellaneous part, accumulates, thereby minimize any potential electrometer discharge of the metal parts of carrier.Replacedly, each section separates with other sections, minimizing a stored charge in the section, and can not combine with the stored charge in another section, thereby minimizes any potential static discharge.
[0012] according to embodiments of the invention, metallized object is divided into a plurality of sections conductive paths that interrupt metalized article.Each section separates with other sections, minimizing the electric charge that accumulates in the section, and can not combine with the electric charge of accumulation in another section, thereby minimizes any potential static discharge.Preferably, metalized article comprises that the non-conductive back of the body supports, and it is the metalized article part of the whole that this non-conductive back of the body supports.
[0013] other purposes, advantage and the feature that the present invention is different from the following detailed description will be more clear, and novel characteristics is clearly pointed out in the appended claims.
Description of drawings
[0014] will better understand following embodiment in conjunction with the accompanying drawings, embodiment is that the mode with embodiment provides, but is not limited to the present invention, wherein:
[0015] Fig. 1 is when swiping the card in card reader, such as the synoptic diagram of the triboelectric charge that produces on the conductive layer on the such exemplary non-conductive carrier of the metallization on the PVC card/conduction magnetic stripe;
[0016] Fig. 2 A-B is according to an exemplary embodiment of the present, such as the synoptic diagram of the holographic magnetic stripe on the such substrate of non-conductive/insulator PVC card;
[0017] Fig. 3 shows the synoptic diagram from the conductive layer on the exemplary non-conductive carrier to the exemplary static discharge of electronic installation;
[0018] Fig. 4 shows the human finger and holds the card back synoptic diagram that extra triboelectric charge produces on the conductive layer on the exemplary non-conductive carrier;
[0019] Fig. 5 A-B is the synoptic diagram that the exemplary conductive layer section of being divided into of exemplary embodiment of the present has been described;
[0020] Fig. 6 A-B is the synoptic diagram with the process of the exemplary conductive layer section of being divided into that exemplary embodiment of the present has been described;
[0021] Fig. 7 be illustrated exemplary embodiment of the present pass through exemplary conductive layer be divided into two metals simplify (reduced) section example (left side lines and the right dot pattern), reduce or eliminate the synoptic diagram of the static discharge of exemplary conductive layer;
[0022] Fig. 8 has illustrated that the exemplary conductive layer of exemplary embodiment of the present is divided into the synoptic diagram of two sections;
[0023] Fig. 9 A-B illustrates the synoptic diagram with the demetalization process of the conductive layer section of being divided into of exemplary embodiment of the present;
[0024] Figure 10 illustrates the demetallated figure of line segment of the metal film of exemplary embodiment of the present;
[0025] Figure 11 shows the synoptic diagram that the demetalization of dot pattern of the metal film of exemplary embodiment of the present is amplified;
[0026] Figure 12-the 13rd has the exemplary papery of metalized holographic line (or ribbon) and metalized holographic patch or the figure of plastic note.
Embodiment
[0027] example of the seal that much carries chargeable and the conductive component that discharges then in electronic installation is arranged.The present invention can be used for reducing or eliminating the ESD of the conductive component 110 on the insulator 100.Now referring to Fig. 1, the inventive method is described as being applied to Polyvinylchloride (PVC) plastic clip (insulator) 100, has the magnetic stripe (metal parts) 110 that metallic conduction applies, and reduces the ESD from the metal parts on the insulator 100 110.The PVC plastic clip 100 that carries metalized magnetic stripe (" mag stripe ") 110 is inserted in the magnetic stripe card card reader 200, for example point of sells (POS) terminal 200, and wherein the ESD300 of metalized magnetic stripe 110 insertion POS terminals 200 can interrupt the operation of POS terminal 200.If following description has been described charged conductor 110 and contacted when placing with non-conductive carrier 100 insertion electronic installations 200 or with electronic installation 200, how conductor on the non-conductive carrier 100 or conductive layer 110 keep interrupting the electric charge of electronic installation 200.
[0028] plastic clip, such as credit card, ATM (Automatic Teller Machine) (ATM) card, debit card, farecard, phonecard, stored value card, Gift Card and debit card are typically to be made by the PVC plastics that can produce triboelectricity.The characteristic of the frictional electricity of PVC produces electric charge when rubbing with other plastics such as acrylonitrile-butadiene-styrene (ABS) (ABS).Magnetic stripe reader in the POS terminal 200 (MSR) 210 is made by ABS plastic usually.When brush PVC card 100 in MSR210, can produce triboelectric charge between ABS and the PVC card 100.PVC card 100 leaves positive charge or negative charge, and leaves opposite positive charge of equivalent or negative charge on the body of MSR.The example of the frictional static that 100 the friction force of swiping the card causes as shown in Figure 1, wherein the negative friction static charge produces in the magnetic of MSR210 is swiped the card the ABS plastic in zone.The electric field line 215 of the fricting static charge generation that the magnetic of MSR210 is swiped the card regional causes positive charge in the top of metallized magnetic stripe 110, and causes opposite negative charge at the bottom margin of metallized magnetic stripe 110.
[0029] electric charge that on card 100, produces, when it moves through MSR210, can be on 14.3 square inches surface area of standard ISO standard plastic clip (front surface of card and rear surface) reach and surpass 1000 to 3000 volts voltage.This has been illustrated in has the above total electrical charge of 2-3 millimicro enclosed pasture on the card 100, convert the electric capacity of 1-3 micromicrofarad on PVC card 100 to.PVC card 100 and metallized magnetic stripe 110 picture capacitors, and the ground connection of charge stored can being discharged when having an opportunity is the low-resistance electric current.When as shown in Figure 1, this chance metalized magnetic stripe 110 that can appear at PVC card 100 is run into metal magnetic read head 220 among the MSR210.
[0030] metal read head 220 is by metal shell with metal-coredly constitute, and this is metal-cored catches magnetic flux of coming from magnetic stripe 110 emissions of coding, and can convert the magnetic flux of catching to electric pulse.Along with the time changes, the magnetic flux of magnetic stripe 110 arrives the metal-cored read coil of read head 220, the variation of magnetic flux converts electric signal to by read coil, and this electric signal can be by the motherboard decoding of reading solid-state chip in the circuit or POS terminal 200 of MSR210.
[0031] if when metal read head 220 is run into charged PVC card 100, the electric charge on the metalized magnetic stripe 110 on the card 100 can discharge into the metal read head 220 of POS terminal 200 from metalized magnetic stripe 110.If the tolerance of 200 couples of ESD of POS terminal is low, then this will interrupt the function of POS terminal 200.Electric charge arrives the various electronic units of ground or POS terminal 200 then, such as solid-state chip.The conduction that charge stored is left conductive layer or metalized magnetic stripe 110 is the function of the resistance coefficient of the conductive layer of PVC card 100 or magnetic stripe 110.Electric charge on the metalized magnetic stripe 110 generally flows and leaves metalized magnetic stripe 110, and flows to read head 220.When magnetic stripe 110 contacts with the metal read head 220 of POS terminal 200, can discharge in the magnetic read head 220 of MSR210 along the ABS of MSR210 100 triboelectric charges that produce and be stored on the card 100 of swiping the card.Decoding circuit in MSR210 and the POS terminal 200 typically designs handles this produce and the discharge that be stored in the electric charge on the card 100 of frictional movement of being passed MSR210 by card 100.But the specific POS terminal 200 on the market does not fully design the ESD (promptly the tolerance to ESD is low) that handles effectively on the metalized magnetic stripe 110.Therefore, according to an exemplary embodiment of the present, insulator 100 carries discontinuous metal parts 110 (metal parts 110 that perhaps has physical rupture therein), reduces the wherein accumulative total of electric charge, thereby reduces any potential ESD.That is, for example, PVC card 100 has discontinuous metal layer on magnetic stripe 110, adapts to the existing P OS terminal 200 low to the ESD tolerance.Therefore, the present invention is intended to wish by conductive component 110 being divided into the ESD energy that a plurality of sections insulators of eliminating or reduce to carry metal or conductive component 110 or non-conductive carrier 100 can discharge into electronic installation 200.This has just advantageously minimized or has prevented operation or the functional interruption to electronic installation 200 owing to ESD.
[0032] the example washing on the PVC card 100 or metalized magnetic stripe 110 is a holographic magnetic stripe 120 shown in Fig. 2 A.The sectional view of exemplary holographic stripe 120 has been shown among Fig. 2 B.Holographic magnetic stripe 120 comprises conducting metal part (as vacuum deposited aluminum, copper, aluminium/evanohm etc.), and the conditioned reflex that need check hologram image in holographic magnetic stripe 120 is provided.The metal part of magnetic stripe 110 typically has the resistance value from 50ohm to several thousand ohm.As shown in Figure 3, typically, the conductive path that the triboelectric charge on the card 100 is provided is enough hanged down in the impedance of the metal of magnetic stripe 110 part, pass magnetic read head 220 and discharge in the electronics or the grounding path of POS terminal 200 on.
[0033] in read head 220, can cause the insulator of ESD or block 100 and metalized magnetic stripe 110 on the storage static charge, separate sources can be arranged.Card 100 can produce triboelectric charge with the lip-deep abrasive action of magnetic stripe reader 210.As shown in Figure 1, typically, the main areas of magnetic stripe reader 210 comprises ABS plastic.Human body is another source that produces triboelectric charge.Human body can produce triboelectric charges by various friction force, for example stroll, card taking etc. from wallet.The example that produces this triboelectric charge from human body as shown in Figure 4, wherein, when people's health held when for example moving carpet and in 100 processes of swiping the card, the friction force of the mobile generation of health caused people's finger 300 positively chargeds.The electric field that positive charge on the finger forms has caused more negative charge and positive charge on the metallized magnetic stripe 110, thereby increases or reduced the charge separation on the metallized magnetic stripe 110.In addition, the front card static charge that the reads generation magnetic that can stay terminal 200 zone of swiping the card.And the piezoelectric charge that is generally trapped charge on the new lamination PVC card 100 can cause the free charge in the metal magnetic stripe 110.
[0034] source of all these electric charges (plus or minus) can cause that static charge discharges at electric or electronic installation 200 (in POS terminal 200).The static discharge of the metal parts from metalized magnetic stripe 110 to magnetic read head 220 is that this ESD (being electric current) provides the conductive path the various circuit that enter POS terminal 200.This can temporarily make does not work to the POS terminal 200 of the low tolerance of ESD, need restart terminal 200 or more badly, and the circuit in the terminal can short circuit, thereby causes terminal fault.
[0035] owing to the electric capacity of conductive layer 110 and insulator or non-conductive layer, electric charge can be stored on metal or the conductive layer 110.This electric capacity is defined as that institute can charge stored amount q on the capacitor of given voltage.Electric capacity (C) is for given electric potential difference that occurs between two plates or voltage (V), is stored in the measured value of the quantity of electric charge (q) on each plate:
C=q/V
[0036] directly the area with plate that keeps electric charge or surface is relevant for capacitance.The area of plate is big more, and more electric charge can be retained on this zone, thereby has increased electric capacity:
C ≈ ϵA d ; A>>d 2
Wherein A is the area of electric capacity, and d is the distance between two metal parts of capacitor, and ε is the specific inductive capacity of any material between the metal parts.
[0037] size of the energy of storing on the capacitor and electric capacity or be stored in the square relevant of electric charge (Q) on the capacitor.
E stored = 1 2 CV 2 ⇔ E srored = 1 2 Q 2 C
[0038] when capacitors in series, total capacitance reduces, and voltage distributes between a plurality of capacitors.The total capacitance of two series capacitors and magnitude of the stored charge are less than the electric capacity and the magnitude of the stored charge of single capacitor.That is, the electric capacity of capacitor can reduce by capacitor is connected with other capacitors in series with magnitude of the stored charge.
Figure A200680053358D00113
1 C eq = 1 C 1 + 1 C 2 + · · · + 1 C n
If all capacitors are the C of equidimension, then Ceg=C/n.
[0039] therefore, for example the present invention utilizes this feature of capacitor to reduce charge stored on the conductive component 110 of insulator 100, thereby reduces the energy that is stored in storage on the conductive component 110.This with regard to favourable minimizing contact in the electronic installations 200 or with electronic installation 200 and makes discharge ground connection or when discharging into electronic installation 200 of the electric charge (electric capacity) that is stored on the conductive component 110 when the insulator 100 that comprises conductive component 110 inserts, discharge into the quantity of electric charge and energy in the electronic installation 200.According to embodiments of the invention, less and parts approximately equivalent size provide discontinuous conductive component by conductive component 110 being divided into a lot, reduce the total capacitance of conductive component 110.These parts are served as a plurality of capacitors (as the capacitor of n equivalent size) of series connection in fact, thereby reduce the total capacitance of conductive component 110.The effective capacitance of conductive component 110 that is divided into n equal segments of series connection is C/n, and wherein C is the electric capacity of the conductive component 110 of original continuous.This total electrical charge and energy that just advantageously will be stored on the conductive component 110 has reduced n doubly, thereby has reduced the possibility that ESD on the conductive component 110 of insulator 100 interrupts the electronic unit of electronic installation 200 widely.
[0040] according to an exemplary embodiment of the present, the electric capacity of metal layer 110 (as holographic magnetic stripe 120) reduces by metal layer 110 being divided into a plurality of sections (perhaps a plurality of electric capacity).That is, metal layer 110 is divided into a lot of less and electric capacity approximately equivalent size (as the electric capacity of n equidimension) of series connection, thereby reduces the total capacitance of metal layer 110.Owing to the effective capacitance of metal layer 110 has reduced n doubly, this total electrical charge and energy that just advantageously will be stored on the metal layer 110 reduces n doubly, thereby reduced the static charge grade of storage on the metal layer 110, the invention enables the insulator 100 that comprises metal layer 110 on any electronic installation 200, to use, even on the electronic installation 200 low, use the ESD tolerance.
[0041] and, because the area of each metalized section has reduced, the electric capacity of the metalized portion that each is disconnected is lower than the total capacitance of metal layer widely, thereby has reduced the magnitude of the stored charge of metal layer 110.
[0042] because the conductor 100 on the non-conductive carrier 100 can keep the electric charge of infringement electronic installation 200 (especially static discharge being hanged down the electronic installation of tolerance), conductive layer 110 of the present invention is configured to discontinuous conductive layer 110, eliminate or reduce static discharge widely, thereby minimize or eliminate any potential ESD infringement electronic installation 200.According to embodiments of the invention, the conductor 110 on the non-conductive carrier 100 is divided into the section of n approximately equal or unequal-area, and these sections are used for preventing or reduce in the n section any one or a plurality of discharge (ESD) of going up the electric charges of accumulation.Should be appreciated that non-conductive carrier 100 comprises a plurality of conductors 110, each conductor can be divided into the section of different approximately equal or unequal area.Each section can be straight line, point, irregularly shaped point (as bird shape or corporate logo) or other disconnected shapes etc.
[0043] existing referring to Figure 12 and 13, the plastics or the paper banknote 1200 that comprise metalized holographic line or ribbon 1210 or metalized holographic patch 1220 are used for illustrating the method that the present invention is divided into conductive layer 110 (be metalized holographic line 12] 0) n section at this.Metallic holographic line 1210 on the non-conductive carrier (being banknote 1200) or metalized holographic patch 1220 (being the current-carrying part of banknote) are divided into n section, stop or reduce on banknote 1200 static charge of accumulation, the static charge of accumulation is when running into electronic installation at banknote 1200 or discharging during by electronics process.Be divided into n section by conductive segment (being metalized holographic line 1210 or metalized holographic patch 1220) with non-conductive carrier (being banknote 1200), wherein each section separates with other sections, can prevent that the electric charge that conductor segment (being metalized holographic line 1210 or metallic holographic paster 1220) is carried from discharging in electronic installation 200 when current-carrying part contacts with electronic installation 200.This situation will appear when banknote 1200 is handled by classifier or counting machine.
[0044] according to an exemplary embodiment of the present, the metal magnetic stripe 110 of plastic clip 100 (perhaps holographic magnetic stripe 120) is divided into n section, stops or reduce the accumulation of the static charge on the plastic clip, and the static charge of accumulation is discharge when card contacts with POS terminal 200.In holographic magnetic stripe 120, the holography of carrying on the holographic magnetic stripe 120 typically by the aluminum metal layer in the holographic magnetic stripe 120 as seen.Be divided into n section by current-carrying part (being the aluminum metal layer of holographic magnetic stripe 120) with non-conductive carrier (being plastic clip 100), each of aluminum metal layer section is that other sections with aluminum metal layer separate, the electric charge that can prevent to carry on each conductive segment discharges in POS terminal 200 when card 100 is swiped the card in POS terminal 200 or inserted.Replacedly, as long as when the section of each connection does not produce greater than the tolerant ESD of POS terminal, each section can couple together.As pointed at this, because the total capacitance of conductive segment has reduced n doubly, and each conductive segment has lower electric capacity, when card 100 contacts with POS terminal 200, the electric charge be not enough to discharge (perhaps the ESD of each conductive segment is enough low, and electronic installation is not had material injury) of accumulation on each section.
[0045] can use any known method that the current-carrying part 110 (being metal level) of non-conductive carrier 100 is divided into the n section, stop or reduce ESD.In the exemplary embodiment of the present, the method that reduces static discharge is included in laser ablation or engraving lines in metal or the conductive layer 110 (as aluminium in holographic magnetic stripe 120 or the metalized holographic line 1210 or metal level (as copper, aluminium/evanohm etc.)), thereby conductive layer 110 is divided into n the section that equates x width (as about 0.10 inch).
[0046] according to the embodiment of the invention, use laser engraving pattern (as vertical bar) on metal level 110, come metal or conductive layer 100 from the non-conductive carrier 100 to remove metal.For example, use laser on metal level 110, to carve vertical bar, the aluminium lamination of the metal level of metalized holographic line 1210, holographic magnetic stripe 120 or metalized holographic patch 1220 shown in Fig. 5-8 and 10-11, thus metal level is divided into n of wide x section 140.
[0047] by with metal (for example aluminium, copper, aluminium/evanohm, Deng) but be evaporated to the polyester layer that there are releasing layer and embossed layers (embossable layer) in the back side on grid, aluminium or other metals are added holographic magnetic stripe, to make up the holographic magnetic stripe of exemplary embodiment of the present.Metallization (perhaps calorize) stratum reticulare is placed on the front of the laser of the infrared or ultraviolet portion that is adjusted to spectrum then, and this laser is according to burning metal (perhaps aluminium) by laser beam or conductive contact pin engraving (conductivestylus engraving) default lines or pattern.
[0048] shown in Fig. 5-8, the position of lines (perhaps figure) is set to make continuous metal (perhaps aluminium, copper, aluminium/evanohm etc.) layer or magnetic stripe 110 splits into short and small section 140 by laser cut line, and the space 130 between the metal segments 140 of magnetic stripe 110 does not have metal (perhaps aluminium, copper, aluminium/evanohm).The length x of these metal segments 140 should be enough little, thereby the total capacitance of each section 140 is enough hanged down the accumulation that limits or prevent electric charge on each section 140, and enough brightness is still arranged.
[0049] if the electric charge q in each section 140 (q=C x V, the wherein electric capacity of the C section of being, and V are the voltage of the charge generation in this section) is enough low, the static discharge in the electronic installation 200 is enough little, can not influence the functional of this electronic installation 200.Any section 140 maximum length and width (area) are to go up the maximum charge that accumulates by non-conductive carrier 100 (being PVC card 100) to limit, thus can be with having electronic installation 200 operations low to the ESD tolerance.Be to be understood that maximum charge is the function of electric capacity, triboelectricity, humidity and the surface area condition of non-conductive carrier 100.
[0050] the laser engraving figure can comprise vertical bar, and is perpendicular to the length direction of the magnetic stripe shown in Fig. 5 A 110, perhaps angled with the magnetic stripe direction as shown in Fig. 5 B and 8.Be to be understood that, electric conductivity aluminium or bonding jumper 110 the section between the laser engraving lines or the space in space 130 must enough widely suppress to skip space 130 by the driven electric charge, and continue to be transmitted to bonding jumper 110 and enter with bonding jumper 110 contacting electronic devices 200 in ability.Therefore, the width-adjustable in the size of metal segments 140 and space 130 is put in order and is satisfied specific design.For example, these two parameters can adjust provide have minimum metal section 140 (as, width is about 0.10 inch at least) hologram image, but by there being enough brightness that holographic enough visibilities are provided.
[0051] this is according to inventive embodiments, as Fig. 6 B, 8 and 9A-B as shown in, the section of metal magnetic stripe or layer 110 comes chemical etching to remove metal segments (as aluminium, copper, aluminium/evanohm etc.) by use acid etching or alkaline dilution (being the demetalization process).The zone of the metal magnetic stripe 110 that need not remove is being protected by chemical impedance coating 150, shown in Fig. 5 b, can utilize gravure cylinder printing or other available printing processes to be printed on the metal magnetic stripe 110.Gravure cylinder is etched into pattern, is used for protecting the online aluminium (being metal) of structure that comprises aluminium lamination.
[0052] shown in Fig. 9 A-9B, use process for demetalizating in the exemplary embodiment of the present, come from the hologram layer of specific pattern, optionally to remove metal (being aluminium), produce discontinuous conductive layer (being holographic metal level).In step 900, use the roll of aluminum metallization holographic embossing image.In the step 910, gravure cylinder (perhaps other comparable printing processes) prints chemical corrosion-resisting pattern (promptly or other how much corrosion-resisting patterns) on the roll aluminized film, in order to optionally protection and keep the aluminium section on stratum reticulare, prevents alkaline rinse.Gravure cylinder is printed on the zone that those need keep the aluminized film of aluminium with chemical resist (resist), and in those zones that remove aluminium, does not print any chemical resist.In the step 920, aluminized film or the roll that is printed with the stratum reticulare of chemical resist pattern with gravure cylinder are put into aluminium then and are removed chemical bath (as NaOH (sodium hydroxide)) or can will not have aluminium on the zone of chemical resist to remove and can keep the pickling (acid wash) of the aluminium of chemical resist protection.
[0053] in step 930, alkaline chemical solution washes the de-metallization stratum reticulare.Magnetic and other coatings are applied on the de-metallization stratum reticulare then.The lines of aluminized film are separated metallized example as shown in Fig. 7 and 10, and the point ﹠ figure chart case is separated the example of metal process shown in Fig. 7 and 11.Line image as shown in Figure 7 comprises the parallel lines or the section of the aluminium of particular space and width.Point ﹠ figure chart case as shown in Figure 7 comprises the different shape point of (as oval or circular).Bright segment table shows the section 140 of aluminium island (aluminum islands) or metal level, and black segment table shows space 130, and after the chemical resist protection of aluminium island by the selectivity application, aluminium has been bathed by alkali electroless and removed herein.
[0054] should be noted that, although demetalization process described here relates to use using basic washing lotion behind using basic mask against corrosion, but demetalization that other are known or other technologies also can be used in the present invention, produce segmentation or discontinuous conducting stratum or surface.According to the exemplary embodiment of invention, the conductive layer of segmentation can use process for demetalizating to produce, and this process for demetalizating directly is applied in etchant on metallization or the conductive surface, washes with cleaning solution then.Replacedly, according to an exemplary embodiment of the present, the conductive layer of segmentation can be by following generation: water-soluble material is applied on the non-metallic holographic surface, with holographic surface metalation, and handles the metalized holographic surface with dissolving water-soluble material and washing with washing lotion.
[0055] process for demetalizating of the present invention is used for producing discontinuous aluminium or other metal levels, thereby the electric conductivity of metal level and electric capacity change widely.Be stored in the continuous metal level much less of ESD energy/charge ratio of each independent section 140 of aluminium lamination.Each section 140 (perhaps aluminium island) separately increased electrical impedance, become difficult thereby make the electric charge of accumulation in section 130 in electronic installation 200, discharge.
[0056] needs careful control to separate metal process, thereby do not have metal residual in the space 130 between metal segments 140.The alkaline rinse that this just needs the enough aluminium with between the corrosion-resisting pattern of use to etch away.Metal material in any space of staying between the metal segments 140 130 can connect metal segments 140, thereby enough paths that produces the ESD conduction in electronic installation 200 are provided.But, if alkaline solution is used too much, then will destroy the metallic region of corrosion-resisting pattern protection, and reduce the aluminium zones (perhaps metal segments 140) that desire will keep.This will reduce the brightness and the picture quality of hologram image.
[0057] according to an exemplary embodiment of the present, this method has the dot pattern (as halftone pattern halftone pattern) of de-metallization (perhaps selective metallization) of sufficiently high dot density to produce discontinuous metal level by generation, this high dot density is in order to rebuilding hologram image, but is unlikely to high to making half tone dot " connection ".That is, as shown in figure 11, dot density is enough hanged down and is prevented half tone dot " connection ".For example, when dot density promptly with respect to the percentage of coverage of the metal " point " of the total area of conductive component greater than 50% the time, hologram image can be rebuild and do not caused that half tone dot connects.For specific application, dot density or cover can or should be about 70% increases the brightness of hologram image.According to embodiments of the invention, the halftone dot pattern technology is used to produce and has peak density and the discontinuous metal level of connectionless point.
[0058] removes the method that metal segments produces discontinuous metal level by selectivity from the metal level of holographic magnetic stripe, utilize to reduce electric capacity, be stored in the quantity of electric charge on any one or a plurality of aluminium section, and the impedance that increases metal level, reduced or prevented the sensitive element of ESD arrival electronic installation, for example the magnetic read head.
[0059] according to the embodiment of the invention, discontinuous metal level 110 can produce by optionally discontinuous metal pattern being applied on non-conductive carrier or the substrate 100.Discontinuous metal pattern comprises the metal segments of separating of limited area, prevents or be minimized in the accumulation of the electric charge in the given area.Each section 140 separates with enough distances with adjacent section, thereby the electric charge of accumulation can not be crossed space 130 to another section 140 in a section 140.
[0060] the present invention on the non-conductive substrate 100 by the continuous metal level 110 from the non-conductive carrier 100 on the selective removal metal, perhaps optionally metal is applied on the non-conductive carrier 100, has produced discontinuous metal level 110 (being little metal isolation range).Various metal removals, operplate printing or deposition technique can make in the present invention and be used for producing and another metal among a small circle (being discontinuous metal level) of fully separating of metal among a small circle, prevent the ESD in any electronic installation 200, comprise those electronic installations the low tolerance of ESD.
[0061] according to the embodiment of the invention, the metal removal of fixed pattern should satisfy two standards with the metal addition method: 1) minimum accumulative total electric charge (promptly the metal of the minimum area that the brightness of image of carrying with metallic region is consistent covers); 2) prevent that metal segments 140 is connected with other sections, thereby can not combine discharge with other metal segments 140 by the whole bag of tricks, produce ESD break current or voltage electronic installation device 200 at the electric charge of each section 140 accumulative totals.
[0062] charge migration that should be appreciated that reality is regulated by embedded conductive layer 110 to the path of point of discharge, and electrical impedance is to be determined by the globality of metal level 110.The impedance of metal level 110 depends on the segmentation of metal.The electrical impedance of metal level 110 increases along with metal segments (being discontinuous metal pattern), and this metal segments has reduced the propagation of the charges accumulated on the conductive layer 110.Now referring to Fig. 1 and 4, wherein charges accumulated is passed the width of bonding jumper 110 from right to left along the guiding of card 100 vertical (top) limit propagation, the present invention can adopt any method that causes the interruption of conductive path, prevents to comprise along border that any magnetic stripe exposes or static discharge that the body of magnetic stripe takes place.
[0063] according to an exemplary embodiment of the present, use machine printed, follow the distortion of typical holographic pre-metallization aluminium foil and break, come the etched diffraction element of insert depth in hologram image, interrupt metal level 110 or conductive path.Small interruption in the metal level 110 has stoped charge propagation effectively, produces static discharge thereby reduce or prevented along the border of any exposure of any non-conductive carrier 100.
[0064] the present invention can be applicable to any non-conductive carrier with the current-carrying part of electronic installation, human body or object interfaces.Conductive segment or combination of elements are on the conductive carrier or in conductive carrier, and conducting element keeps static charge potentially, and when the combination of carrier and conductor contacts with electronic installation, in electronic installation with the charge discharge that accumulates.According to the embodiment of the invention, with the current-carrying part segmentation or be divided into less section and reduced the electric charge that on each zone, accumulates, and these sections are separated the electric charge that has prevented any potential accumulative total in electronic installation, discharge.It below is the illustrative example of various application of the present invention.
[0065] metalized magnetic stripe itself can be carried metal level and non-conductive carrier, can produce the polyester backing layer of ESD during such as the metallization bar that is not installed in or is attached to auxiliary non-conductive carrier when using with the magnetic stripe read/write device.When the metalized portion of magnetic stripe is divided when the method described by the embodiment of the invention, will prevent when using or handle metalized magnetic stripe on the non-conductive magnetic stripe back side ESD formation and in any device, human body or system, discharging.
[0066] electric charge that metallized holographic line 1210 on papery or the plastic note 1200 or metalized holographic patch 1220 portabilities can potential discharges in the banknote receiver.According to an exemplary embodiment of the present, the metal level sectional of holographic bar 1210 or holographic patch 1220 or be divided into the little metal segments that separates, reduce or eliminate the potential ESD that exists in any banknote receiver, and keep holography with 1210 or the visual performance of holographic patch 1220.
[0067] be not that holography on the plastic clip of one section of magnetic stripe typically is used for design on visual security and a lot of Payment Cards.If the metal level in the holography is enough big or small, and is in correct position, this also can increase electric charge accumulation of triboelectric charge and pass through magnetic read head, grounding path or chip reader potential discharge in the POS terminal.According to an exemplary embodiment of the present, the metal level in the holography can be by the segmentation or the section of being divided into, and reduces or minimizes any potential ESD in the POS terminal.
[0068] metal battery in the plastic clip is used to provide the power supply that is used for RF-ID card and display.According to an exemplary embodiment of the present, the surface of battery is by segmentation or be divided into less metal segments and reduce or minimize any potential ESD in the card reader.
[0069] contact mat on the smart card is a metal, and with the circuit interface that reads of intelligent card reader.According to an exemplary embodiment of the present, contact mat is by segmentation or be divided into less metal segments, minimizes or reduces any potential ESD in the intelligent card reader, and still keep simultaneously and block electrically contacting of big pin connector that chips communicates by letter.
[0070] further, there are a lot of other application can advantageously reduce or eliminate any potential ESD from a device to another device or human body.For example, the metal medical devices in the hyperoxia atmosphere can benefit from the metal surface on the insulator, and this metal level is divided into a lot of less low capacitance sections.Pacemaker benefit territory on the human heart is divided in the metal shell of little metal segments in being encapsulated in the surface, reduces any potential harm that electromagnetic induction or ESD cause.
[0071] although the present invention and its advantage are described in detail, should be appreciated that under not breaking away from and to make various changes, substitutions and modifications as the spirit and scope of the present invention defined in the appended claims.And the application's scope is not limited to the specific embodiment of process described here, machinery, manufacturing and material composition, mechanism, method and step.Can recognize from disclosed in this invention as those skilled in the art, can use according to the present invention existing or with produced afterwards, with the corresponding embodiment that describes in this article carry out in fact identical function or, realize identical in fact result's process, machinery, manufacturing, material composition, means, method or step.Therefore, appended claim is intended in the process of being included in, machinery, manufacturing, material composition, means, method or these scopes of step.

Claims (53)

1, a kind of non-conductive carrier with conductive component, it comprises a plurality of sections conductive paths that interrupt described conductive component, each section separates with other sections, to minimize a stored charge in the section, and can not combine, thereby minimize any potential static discharge of described carrier with the stored charge in another section.
2, carrier as claimed in claim 1, wherein, described section of described conductive component has enough density so that the brightness maximization.
3, carrier as claimed in claim 1, wherein, described a plurality of sections of described conductive component form by continuous conductive component is divided into described section.
4, carrier as claimed in claim 1, wherein, described conductive component described a plurality of sections by utilizing lines or dot pattern to come the described conductive component of selective metallization to form.
5, carrier as claimed in claim 4, wherein, described dot pattern is with high dot density and do not have tie point or shape produces described a plurality of sections of described conductive component.
6, carrier as claimed in claim 5, wherein, described point is oval or circular.
7, carrier as claimed in claim 5, wherein said point is a rectangular shape.
8, carrier as claimed in claim 5, wherein said point are erose point or shape.
9, carrier as claimed in claim 3, wherein, described continuous conductive component is divided by optionally removing part from described continuous conductive component.
10, carrier as claimed in claim 9, wherein, described current-carrying part is optionally to remove by process for demetalizating.
11, carrier as claimed in claim 9, wherein, described current-carrying part is to carve default lines or pattern optionally removes by laser beam or conductive contact pin.
12, carrier as claimed in claim 1, wherein, described carrier is the PVC card, and wherein said conductive component is the metal layer that comprises on the described a plurality of sections described PVC card.
13, carrier as claimed in claim 12, wherein, described metal layer comprises metallized hologram image.
14, carrier as claimed in claim 12, wherein, described metal layer comprises that the non-conductive back of the body supports, it is a part of described metal layer integral body that the described back of the body supports.
15, carrier as claimed in claim 1, wherein, described carrier is plastics or paper banknote, and wherein said conductive component is metallized holographic line, band or paster.
16, carrier as claimed in claim 1, wherein, the described electric charge that in a section, accumulates can not with the charge bonded of accumulation in another section, minimize any potential static discharge of described carrier.
17, carrier as claimed in claim 1, wherein, described carrier is a Payment Card, and wherein said conductive component is the metallized magnetosphere in the described Payment Card, described magnetosphere is divided into described a plurality of sections.
18, carrier as claimed in claim 17, wherein, described Payment Card is one of following: credit card, ATM (Automatic Teller Machine) atm card, farecard, phonecard, rechargeable card, stored value card, gift card or debit card.
19, a kind of method that reduces the conductive layer static discharge on the non-conductive carrier, it may further comprise the steps:
Described conductive layer is divided into a plurality of sections conductive paths that interrupt described conductive layer; With
Each section and other sections are separated, minimizing a stored charge in the section, and can not combine, thereby minimize any potential static discharge of described carrier with the stored charge in another section.
20, method as claimed in claim 19, wherein, described partiting step may further comprise the steps: described conductive layer is divided into enough sections and has enough coverings maximize brightness.
21, method as claimed in claim 19, wherein, described partiting step may further comprise the steps: optionally remove the metal part from continuous metal level.
22, method as claimed in claim 19, wherein, described partiting step may further comprise the steps: use the demetalization process optionally to remove the metal part from continuous metal level.
23, method as claimed in claim 19, wherein, described partiting step may further comprise the steps: use carves default lines by laser beam or conductive contact pin or pattern optionally removes the metal part from continuous metal level.
24, method as claimed in claim 19, wherein, described partiting step is divided into a plurality of sections with the metallization magnetosphere on the PVC card, described metallized magnetospheric conductive path is interrupted, to reduce any potential static discharge of described card.
25, method as claimed in claim 19, wherein, the described partiting step of described conductive layer may further comprise the steps: the holographic magnetosphere on the PVC card is divided into a plurality of sections, interrupts the magnetospheric conductive path of described holography to reduce any potential static discharge of described card.
26, method as claimed in claim 19, wherein, described partiting step may further comprise the steps: metallized holographic line, band or paster in plastics or the paper banknote are divided into a plurality of sections, interrupt described metal wire or holographic conductive path, to reduce any potential static discharge of described banknote.
27, method as claimed in claim 19, wherein, the described step that separates each section separates described each section from other sections, thus the electric charge that in a section, accumulates not can with the charge bonded of accumulation in another section, minimize any potential static discharge of described carrier.
28, a kind of method that reduces the static discharge of the conductive layer on the non-conductive carrier may further comprise the steps:
Formation comprises that the conductive layer of a plurality of sections division interrupts the conductive path of described conductive layer; With
Each section is separated from other sections, minimizing a stored charge in the section, and can not combine, thereby minimize any potential static discharge of described carrier with the stored charge in another section.
29, method as claimed in claim 28, wherein, described formation step may further comprise the steps, and uses the dot pattern selective metallization to form the conductive layer of described division.
30, method as claimed in claim 29, wherein, the step of described selective metallization is with high dot density and do not have tie point or shape forms the conductive layer of described division.
31, method as claimed in claim 30, wherein, described metallized step forms the conductive layer of the described division that has ellipse or circular point.
32, method as claimed in claim 30, wherein, described metallized step forms the conductive layer of the described division that has rectangular dots.
33, method as claimed in claim 30, wherein, described metallized step forms the conductive layer of the described division that has irregularly shaped point or shape.
34, method as claimed in claim 33, wherein, the conductive layer of the described division that described metallized step forms has the shape of erose point or bird shape or corporate logo form.
35, method as claimed in claim 28, wherein, the described step that each section separated separates described each section from other sections, thus the electric charge that in a section, accumulates can not with the charge bonded of accumulation described in another section, minimize any potential static discharge of described carrier.
36, a kind of metallization article, it comprises a plurality of sections conductive paths that interrupt described metallization article, and each section is isolated from other sections, to minimize a stored charge in the section, and can not combine, thereby minimize any potential static discharge with the stored charge in another section.
37, metallization article as claimed in claim 36, wherein, described section of described metallization article has sufficient density and covering to maximize brightness.
38, metallization article as claimed in claim 36, wherein, described a plurality of sections of described metallization article is to form by continuous metallization article are divided into described section.
39, metallization article as claimed in claim 36, wherein, described a plurality of sections of described metallization article is by utilizing lines or dot pattern optionally the described a plurality of sections metallization of described metallization article to be formed.
40, metallization article as claimed in claim 36, wherein, described dot pattern produces and has high dot density and do not have tie point or described a plurality of sections of the described metallization article of shape.
41, metallization article as claimed in claim 40, wherein, described bright spot is oval or circular.
42, metallization article as claimed in claim 40, wherein, described point is a rectangle.
43, metallization article as claimed in claim 40, wherein, described point is erose point or shape.
44, metallization article as claimed in claim 38, wherein, described continuous metal is divided by optionally remove part from described continuous metallization article.
45, metallization article as claimed in claim 44, wherein, described metalized portion optionally removes by the de-metallization method.
46, metallization article as claimed in claim 44, wherein, described metalized portion carves default lines by laser beam or conductive contact pin or pattern comes selective removal.
47, metallization article as claimed in claim 36, wherein, described metallization article comprise metalized holographic line, band, paster or image.
48, metallization article as claimed in claim 36, it is used for Payment Card.
49, metallization article as claimed in claim 48, wherein, described Payment Card is following a kind of: credit card, ATM (Automatic Teller Machine) atm card, farecard, phonecard, rechargeable card, stored value card, gift card or debit card.
50, metallization article as claimed in claim 36, wherein, the electric charge that accumulates described in the section can not with described in another section the accumulation charge bonded, to minimize any potential static discharge.
51, metallization article as claimed in claim 36 also comprise magnetosphere, and described magnetosphere is a part of the integral body of described metallization article.
52, metallization article as claimed in claim 51 comprise that also the non-conductive back of the body supports, and the described non-conductive back of the body supports a part of the integral body that is described metallization article.
53, metallization article as claimed in claim 47 comprise that also the non-conductive back of the body supports, and the described non-conductive back of the body supports a part of the integral body that is described metallization article, is used for plastics or paper banknote.
CN2006800533584A 2006-02-24 2006-07-11 Method of reducing electro-static discharge (esd) from conductors on insulators Expired - Fee Related CN101401106B (en)

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US60/776,718 2006-02-24
US60/776,717 2006-02-24
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Cited By (2)

* Cited by examiner, † Cited by third party
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CN106104583A (en) * 2013-11-05 2016-11-09 伊利诺斯工具制品有限公司 For forming laminated board component and the manufacture method thereof of multiple individual card
CN109657762A (en) * 2018-12-10 2019-04-19 天津博苑高新材料有限公司 A kind of fabrication substrate, preparation method and IC card or electronic tag containing it

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5336871A (en) * 1992-02-07 1994-08-09 American Bank Note Holographics, Incorporated Holographic enhancement of card security
DE19901384A1 (en) * 1999-01-15 2000-07-27 Siemens Ag Electronic component and use of a protective structure contained therein

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106104583A (en) * 2013-11-05 2016-11-09 伊利诺斯工具制品有限公司 For forming laminated board component and the manufacture method thereof of multiple individual card
US10336125B2 (en) 2013-11-05 2019-07-02 Illinois Tool Works Inc. Composite laminate assembly used to form plural individual cards and method of manufacturing the same
CN106104583B (en) * 2013-11-05 2020-01-07 伊利诺斯工具制品有限公司 Composite laminate assembly for forming a plurality of individual cards and method of making same
CN109657762A (en) * 2018-12-10 2019-04-19 天津博苑高新材料有限公司 A kind of fabrication substrate, preparation method and IC card or electronic tag containing it

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