CN101398393A - Silicon chip product defect analysis method and device - Google Patents
Silicon chip product defect analysis method and device Download PDFInfo
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- CN101398393A CN101398393A CNA2007100941043A CN200710094104A CN101398393A CN 101398393 A CN101398393 A CN 101398393A CN A2007100941043 A CNA2007100941043 A CN A2007100941043A CN 200710094104 A CN200710094104 A CN 200710094104A CN 101398393 A CN101398393 A CN 101398393A
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Abstract
The invention discloses a silicon product defect analysis method which is used for carrying out defect analysis for a plurality of identical silicon products; the method comprises the steps as follows: firstly, positions of one group of identical silicon products for detect analysis are adjusted; subsequently, the images of the same positions of the group of silicon products are scanned; the scanned images of the same positions of the group of the silicon products are compared and analyzed to identify the abnormality of the images; finally, according to the abnormality degree of the image of a certain silicon product, the defect situation of the silicon product is determined; the invention also discloses a silicon product defect analysis device which comprises a silicon sheet displacement device, a group of scanning lenses, a stepping motor and an image comparison and recognition system; the invention also discloses another silicon product defect analysis method which is used for carrying out defect analysis for the silicon products with repeated pattern elements. The method and the device can be used for carrying out defect analysis for large batches of silicon products.
Description
Technical field
The invention belongs to field of semiconductor manufacture, relate to the silicon chip detection technique, particularly a kind of silicon chip product defect analysis method and device.
Background technology
The silicon chip defect analysis mode of generally using on semiconductor production line as shown in Figure 1, after technological process finishes the silicon chip product taking-up, draw samples, utilize special defect analysis equipment, according to the drawbacks of the standard Study document that completes in advance, will the sample silicon chip product by piece scanning, the figure that scans and the test pattern of drawbacks of the standard Study document are compared, pick out the silicon chip defective.If there is not defective in silicon chip product, ultra-specification does not then carry out next step technology, if there is defective in silicon chip product, ultra-specification is then reported to the police, and this batch silicon chip product is checked totally and carried out carrying out next step technology again after the analysis of causes.
But this traditional defect analysis method has following shortcoming: at first it is untimely to the reaction of unusual defective, finish back a period of time in silicon chip product manufacture craft process, just begin silicon chip product is carried out defect analysis, if since the defective that causes unusually of silicon chip product making apparatus can not in time reflect; Secondly, defect analysis equipment can only be analyzed one piece of silicon chip at every turn in this defect analysis method, and production efficiency is low, for large batch of production line silicon chip product, can only carry out sample survey, and it is unusual to reflect comprehensively that silicon chip product occurs; Owing to will make test pattern earlier, the level that normative document is made is had relatively high expectations, and on the defect analysis device hardware, need to keep a large amount of normative documents, the memory space of hardware is had relatively high expectations.
Summary of the invention
The technical problem to be solved in the present invention is to carry out defect analysis to silicon chip product in enormous quantities.
For solving the problems of the technologies described above, the invention provides a kind of silicon chip product defect analysis method, the technical scheme of employing may further comprise the steps:
Step 3, the figure of the same position of described one group of silicon chip product that scanning is obtained is analyzed, and identifies unusual that figure exists;
For solving the problems of the technologies described above, a kind of silicon chip product defect analytical equipment provided by the invention comprises that silicon chip gearshift, one group of scanning lens, step motor, figure compare recognition system; The silicon chip gearshift is used to place many pieces of same piece of silicon goods to be detected, and the position of control silicon chip product; Described one group of scanning lens places between one group of silicon chip product of detection, under the control of step motor, described many pieces of silicon chip products are scanned, each scanning lens scans the same position of described silicon chip product simultaneously, figure comparison recognition system obtains the same position figure to scanning and is analyzed, output defect analysis signal.
The present invention also provides a kind of silicon chip product defect analysis method in addition, and this method is earlier to each unit scan of silicon chip product with repetitive pattern unit; Relatively scan the difference of the figure of each unit that obtains; The defective that exists according to the variance analysis silicon chip product of each unit figure.
The present invention scans simultaneously by the same position figure to many pieces of silicon chips, or the repetitive figure of single piece of goods scanned, the difference of many block graphicses realizes defect analysis, do not need the production standard graphic file, only write down the unit figure size of every kind of goods, fully the storage space of economize on hardware.The size of the unit figure structure that provides by production system, the displacement of step motor control optical camera system, to guarantee the repeatability and the comparability of each figure that writes down, can carry out scanning analysis to a collection of goods simultaneously, notice production control system in time occurs when unusual at product, effectively improve the efficient of unusual warning.By to the figure of the same position of same article relatively, the inspection of each defective can scan each piece goods, and is higher than the accuracy of traditional sampling check.
Description of drawings
Below in conjunction with the drawings and the specific embodiments the present invention is described in further detail.
Fig. 1 is existing silicon chip product defect analysis process figure;
Fig. 2 is an embodiment of the present invention process flow diagram;
Fig. 3 is that the silicon chip gearshift carries out silicon chip aligning synoptic diagram;
Fig. 4 is that the silicon chip gearshift makes the silicon wafer horizontal displacement enlarge silicon chip spacing synoptic diagram;
Fig. 5 is that the silicon chip gearshift makes the silicon chip perpendicular displacement enlarge silicon chip spacing synoptic diagram;
Fig. 6 is silicon chip product defect analytical equipment one an embodiment synoptic diagram;
Fig. 7 is silicon chip product surface scan path one an embodiment synoptic diagram.
Embodiment
Silicon chip product defect analysis method one embodiment of the present invention as shown in Figure 2, in silicon chip product manufacture craft process, the figure of the same position of a collection of silicon chip product should be identical, one group of same piece of silicon goods (as 3 pieces to 25 pieces) are positioned on the silicon chip gearshift, make the same position of these group same piece of silicon goods corresponding, and adjust distance between each silicon chip product, so that one group of scanning lens places between this group silicon chip product, same position figure to these group same piece of silicon goods scans simultaneously, utilize the special defect analysis equipment figure that scanning obtains to the same position of these group same piece of silicon goods to compare then, the deviation of finding to exist in the figure is with unusual, promptly find out the difference of a unit figure of a certain silicon chip product in this group silicon chip product with most same position unit figures in this group silicon chip product, and carry out analysis and judgement according to the deviation and the abnormal conditions that exist, the silicon chip product that whether has ultra-specification, if exist, just provide real-time feedback signal, the notice production control system, the ultra-specification silicon chip product is carried out respective handling, if there is no, just carry out next step PROCESS FOR TREATMENT.The method that this silicon chip product defect is analyzed can be used for the mass production processes process of silicon chip product, is used for 6,8, and the silicon chip product of 12,18 inches such as grade carries out online defect analysis.
Realize an embodiment of the silicon chip product defect analytical equipment of said method, comprise a silicon chip gearshift, one group of scanning lens, step motor, figure is recognition system relatively, the silicon chip gearshift is used to place one group of silicon chip product to be detected, and the position of control silicon chip product, one group of scanning lens places between one group of silicon chip product of detection, under the control of step motor, described one group of silicon chip product is scanned, each scanning lens scans the same position of described silicon chip product simultaneously, figure comparison recognition system obtains figure to scanning and is analyzed, output defect analysis signal.The silicon chip gearshift as shown in Figure 3, comprise a silicon slice bearing boat 12, silicon chip aligning roller bearing 13, this silicon slice bearing boat 12 has a plurality of silicon chip bearing grooves to be used to place silicon chip 11, horizontal range between the described silicon chip bearing groove is adjustable, described silicon chip is aimed at roller bearing 13 diameters less than silicon chip 11 alignment notch width, in the middle of being positioned at below the described silicon slice bearing boat 12 vertically, with the distance variable of silicon slice bearing boat bottom 12; Silicon chip 11 is vertically placed in a plurality of silicon chip bearing grooves; Vertically place silicon chip 11 lower edges of silicon chip bearing groove to be pressed on the silicon chip aligning roller bearing 13, silicon chip is aimed at roller bearing 13 and is rolled, silicon chip 11 rotates thereupon, when the alignment notch of silicon chip 11 forwards silicon chip aligning roller bearing 13 to, silicon chip 11 is locked under action of gravity on the silicon chip aligning roller bearing 13 and stops operating, aim at the aligning of finishing silicon chip 11 after stopping operating on the roller bearing 13 when all silicon chips 11 all are locked in silicon chip, silicon chip is aimed at roller bearing 13 and is moved down the silicon chip that aligning has been finished in disengaging.As shown in Figure 4, can adjust the horizontal range between the silicon chip bearing groove of silicon slice bearing boat 12, distance between the silicon chip 11 is removed, made one group of optical lens group move between the one group of silicon chip product that places on the silicon chip bearing groove and to guarantee that no physics contacts between camera lens and silicon chip product; As shown in Figure 5, the silicon chip gearshift also has a mechanical arm 14 up, after silicon chip is aimed at, top mechanical arm 14 descends, pick up silicon chip at interval, odd number or even number piece are mentioned half silicon chip, make between silicon chip distance for normalized distance from twice so that one group of optical lens group can move between the one group of silicon chip product that places on the silicon chip bearing groove and guarantee that no physics contacts between camera lens and silicon chip product.As shown in Figure 6, one group of optical lens 26 is fixed on the camera lens combination mechanical arm 24 by lens bracket 25, each camera lens places between the silicon chip product to be detected 11, moving of one step motor control combination mechanical arm 24, thereby can drive this group optical lens 26 same moved further, the same position of these group same piece of silicon goods is scanned simultaneously.
In one embodiment, under the control of step motor, the path of silicon chip product surface scan as shown in Figure 7, after one group of silicon chip product to be detected being aimed at displacement by the silicon chip gearshift, one group of scanning lens is placed between this silicon chip of organizing analysis to be detected, each piece silicon chip in this group silicon chip all has the one scan camera lens corresponding, the one side of silicon chip product analysis to be detected is divided into some unit, each scanning lens is aimed at a most close upper left unit of this group silicon chip when initial, begin to scan each scanning lens of back under the control of step motor, from left to right longitudinally and laterally make a circulation scanning is finished in each unit successively.The step motor that the gated sweep camera lens moves can with production system main frame line, the kind of the silicon chip product that provides according to production system and the size of unit figure define the mobile stride of optical lens.In one embodiment of silicon chip product defect analytical equipment, the silicon chip gearshift can be placed 1～25 piece of silicon chip product, realize the adjustment of silicon pad alignment and spacing, corresponding with the silicon chip gearshift, 13 or 25 optical lens can be fixed in and form a microcosmic optical lens group on the mechanical arm, the length of optical lens is 0.5 to 1 centimetre, distance between the camera lens is 1 to 1.5 centimetre, to avoid camera lens to touch the surface of silicon chip, for example the silicon chip gearshift is provided with 25 silicon chip bearing grooves, one group of scanning lens is made up of 25 optical lens, is used for the silicon chip that carries out the horizontal shift adjustment is scanned; And for example the silicon chip gearshift is provided with 25 silicon chip bearing grooves, and one group of scanning lens is made up of 13 optical lens, is used for the silicon chip that carries out the perpendicular displacement adjustment is scanned.
Silicon chip product defect analytical equipment of the present invention can independently use, and also can be installed in the process equipment outlet or the entry position of silicon chip product being carried out batch processing, and the silicon chip product that carries out in the process treatment process is carried out real-time defect analysis.Described figure is recognition system relatively, can with the production system line, when being checked through defective in time transmission signals give the production control system main frame, report to the police to production control system when having ultra-specification defective goods, and can count the defect characteristic of various variety classes silicon chip products in the different process step, improve the analysis efficiency of defect type.
As one embodiment of the invention, carry out the process equipment exit position of batch processing at a pair of silicon chip product, 18 pieces of identical silicon chip products that just pass through this PROCESS FOR TREATMENT step are placed on the silicon chip gearshift, adjusting this silicon chip gearshift aims at the same position of this group silicon chip product, then these 18 pieces of silicon chips are carried out horizontal shift, make the distance between adjacent two pieces of silicon chips can hold scanning lens; 18 optical lens of one group of optical lens of 25 optical lens compositions place between 18 pieces of silicon chip products, when goods enter process equipment, equipment can be read the lot number of these goods by the bar code code reader, piece numerical digit is put, information such as residing processing step, and check with the production system main frame, position according to the silicon chip product place of production system host acknowledgement, 18 scanning lens that are equipped with the position of silicon chip product are opened, and other 7 scanning lens that are not equipped with the position of silicon chip product are closed, to avoid interference, each optical lens of opening is aimed at the scanning starting position unit of one piece of silicon chip product analysis face to be detected, realize that one (scanning lens) is to one (silicon chip product), 25 optical lens are fixed on the mechanical arm, step motor links to each other with the production control system main frame, extract the silicon chip product product information from production control system, comprise name of product, lot number, the size of cellular construction, define the stepping amplitude of controls lens motion motor according to the unit sizes of product, controlling 18 scanning lens of mechanical hand-motion longitudinally and laterally makes a circulation to scan to 18 pieces of silicon chip products, 18 pieces of silicon chip products are scanned simultaneously, utilize image recording system, write down the figure that each step-scan of these 18 pieces of silicon chip products is arrived simultaneously, to criticize figure and reach relatively recognition system of computer graphical, carry out the comparative analysis of figure, find out the position and the size of abnormity point different in the figure with most same position unit figures, after the scanning of whole silicon wafer is finished, according to the silicon slice pattern of computer recording occur unusual, unusual size and quantity on the same silicon chip, judge the situation that exists of defective in these 18 pieces of silicon chip products, and judge whether that there is the defective of ultra-specification in silicon chip, if there is silicon chip to have the defective of ultra-specification, computing machine will notify production control system to report to the police.In the present embodiment, the silicon chip gearshift also can carry out moving of vertical direction with each 9 pieces of silicon chip of odd positions in 18 pieces of silicon chips and even number position, form two groups of strange, idols, two groups of silicon chips aim at respectively and make the silicon chip spacing can make scanning lens during move, one group of optical lens that 9 optical lens are formed places between 9 pieces of silicon chip products and respectively strange, two groups of silicon chips of idol is scanned then.
Based on the identical technical conceive of the embodiment of front, to having single piece of silicon chip product of repetitive figure, can scan the unit figure that obtains by each unit relatively to this single piece of silicon chip product, the difference that exists between the figure according to each unit that should have identical figure judges whether single piece of silicon chip product with repetitive figure exists defective.Can design a kind of silicon chip product defect analytical equipment, be used for the silicon chip product with repetitive pattern unit is carried out defect analysis, comprise relatively recognition system of scanning lens, step motor, figure, step motor gated sweep camera lens scans successively to each unit of described silicon chip product, figure comparison recognition system receives each unit figure scan and also is analyzed, the defective that exists according to the variance analysis silicon chip product of each unit figure; Step motor can link to each other with the production system main frame, and the production control system main frame is exported the stride signal to step motor according to the kind of the silicon chip product of pending defect analysis and the size of unit figure; Figure relatively recognition system output defect analysis signal can arrive the production control system main frame, when being checked through defective in time transmission signals give the production control system main frame, exist ultra-specification defective goods to report to the police to production control system, and can count the defect characteristic of various variety classes silicon chip products in the different process step, improve the analysis efficiency of defect type.
The present invention scans simultaneously by the same position figure to many pieces of silicon chips, or the repetitive figure of single piece of goods scanned, the difference of many block graphicses realizes defect analysis, do not need the production standard graphic file, only write down the unit figure size of every kind of goods, fully the storage space of economize on hardware.The size of the unit figure structure that provides by production system, the displacement of step motor control optical camera system, to guarantee the repeatability and the comparability of each figure that writes down, can carry out scanning analysis to a collection of goods simultaneously, notice production control system in time occurs when unusual at product, effectively improve the efficient of unusual warning.By to the figure of the same position of same article relatively, the inspection of each defective can scan each piece goods, and is higher than the accuracy of traditional sampling check.
Silicon chip product, processing step, the position of repeatedly defective appearance in time are transferred to production system, can help the slip-stick artist to carry out statistic of classification, search the reason that defective occurs fast.To identical product, the defect statistics of same engineering step can be found out the integrated defective of process equipment or goods, prevents and reduces similar unusual appearance.
Claims (15)
1, a kind of silicon chip product defect analysis method is used for many pieces of same piece of silicon goods are carried out defect analysis, it is characterized in that, may further comprise the steps:
Step 1 is carried out the position adjustment with one group of same piece of silicon goods of pending defect analysis;
Step 2 scans the same position figure of described one group of silicon chip product;
Step 3, the figure of the same position of described one group of silicon chip product that scanning is obtained is analyzed, and identifies unusual that figure exists;
Step 4 determines that according to the figure intensity of anomaly of a certain silicon chip product there is situation in the defective of this silicon chip product.
2, silicon chip product defect analysis method according to claim 1 is characterized in that, the number of carrying out one group of silicon chip product of defect analysis is 3 pieces to 25 pieces.
3, silicon chip product defect analysis method according to claim 1 and 2 is characterized in that, controls one group of scanning lens by step motor the same position through one group of silicon chip product of position adjustment is scanned.
4, silicon chip product defect analysis method according to claim 1 and 2 is characterized in that, carries out in batches in the process treatment process silicon chip product being carried out defect analysis at silicon chip product.
5, silicon chip product defect analysis method according to claim 4 is characterized in that, utilizes figure comparison recognition system to add up the defect characteristic of various Different Silicon sheet articles in the different process step.
6, a kind of silicon chip product defect analytical equipment is characterized in that, comprises that silicon chip gearshift, one group of scanning lens, step motor, figure compare recognition system; The silicon chip gearshift is used to place many pieces of same piece of silicon goods to be detected, and the position of control silicon chip product; Described one group of scanning lens places between one group of silicon chip product of detection, under the control of step motor, described many pieces of silicon chip products are scanned, each scanning lens scans the same position of described silicon chip product simultaneously, figure comparison recognition system obtains the same position figure to scanning and is analyzed, output defect analysis signal.
7, silicon chip product defect analytical equipment according to claim 6, it is characterized in that, the silicon chip gearshift, the aligning and the location gap thereof of many pieces of silicon chip products of control, make the same position of described many pieces of silicon chip products corresponding, one group of scanning lens can not have physics with silicon chip and contacts mobile between silicon chip product.
8, silicon chip product defect analytical equipment according to claim 7, it is characterized in that, described silicon chip gearshift, comprise a silicon slice bearing boat, silicon chip aligning roller bearing, this silicon slice bearing boat has a plurality of silicon chip bearing grooves to be used to place silicon chip, and the horizontal range between the described silicon chip bearing groove is adjustable, and described silicon chip is aimed at the roller bearing diameter less than silicon chip alignment notch width, be positioned at vertically below the described silicon slice bearing boat, with the distance variable of silicon slice bearing boat bottom; Carrying out silicon chip vertically places the silicon chip lower edge contact of silicon chip bearing groove that silicon chip is held up certain altitude and rolling to punctual silicon chip aligning roller bearing with all, silicon chip rotates thereupon, when forwarding to be locked under the action of gravity when silicon chip is aimed at roller bearing on the silicon chip aligning roller bearing, the silicon pad alignment breach stops operating, aim at and to finish silicon pad alignment after stopping operating on the roller bearing when all silicon chips all are locked in silicon chip, silicon chip is aimed at roller bearing and is moved the disengaging silicon chip.
9, silicon chip product defect analytical equipment according to claim 8, it is characterized in that described silicon chip gearshift also comprises a mechanical arm, this mechanical arm can be picked up the silicon chip of the position that is separated by, and makes the odd positions of many pieces of silicon chip products or the silicon chip product of even number position carry out moving of vertical direction.
10, silicon chip product defect analytical equipment according to claim 6 is characterized in that, described one group of scanning lens fixes by a mechanical arm, and step motor is controlled moving of mechanical arm.
11, silicon chip product defect analytical equipment according to claim 8, it is characterized in that described silicon chip gearshift is provided with 25 silicon chip bearing grooves, one group of scanning lens is made up of 25 optical lens, the length of optical lens is 0.5 centimetre, and the distance between the camera lens is 1 centimetre.
12, silicon chip product defect analytical equipment according to claim 9, it is characterized in that described silicon chip gearshift is provided with 25 silicon chip product bearing grooves, one group of scanning lens is made up of 13 optical lens, the length of optical lens is 0.5 centimetre, and the distance between the camera lens is 1 centimetre.
13, silicon chip product defect analytical equipment according to claim 6 is characterized in that, figure relatively recognition system is exported the defect analysis signal to the production control system main frame.
14, silicon chip product defect analytical equipment according to claim 6, it is characterized in that, step motor links to each other with the production system main frame, and the production control system main frame is exported the stride signal to step motor according to the kind of the silicon chip product of pending defect analysis and the size of unit figure.
15, a kind of silicon chip product defect analysis method is used for the silicon chip product with repetitive pattern unit is carried out defect analysis, it is characterized in that, to each unit scan of silicon chip product with repetitive pattern unit; Relatively scan the difference of each unit figure that obtains; The defective that exists according to the variance analysis silicon chip product of each unit figure.
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| CN101923060A (en) * | 2009-06-04 | 2010-12-22 | 松下电器产业株式会社 | Shooting check method |
| CN101587078B (en) * | 2009-06-18 | 2011-05-04 | 周乔治 | Rapid detection method of silicon chip |
| CN103187343A (en) * | 2011-12-28 | 2013-07-03 | 敖翔科技股份有限公司 | Intelligent defect diagnosis method |
| CN104198495A (en) * | 2014-09-02 | 2014-12-10 | 上海华力微电子有限公司 | Method for detecting step evolution abnormality of semiconductor substrate |
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| CN101923060A (en) * | 2009-06-04 | 2010-12-22 | 松下电器产业株式会社 | Shooting check method |
| CN101587078B (en) * | 2009-06-18 | 2011-05-04 | 周乔治 | Rapid detection method of silicon chip |
| CN103187343A (en) * | 2011-12-28 | 2013-07-03 | 敖翔科技股份有限公司 | Intelligent defect diagnosis method |
| CN103187343B (en) * | 2011-12-28 | 2016-06-08 | 敖翔科技股份有限公司 | Intelligent defect diagnostic method |
| CN105917453A (en) * | 2013-12-22 | 2016-08-31 | 应用材料公司 | Monitoring system for deposition and method of operation thereof |
| CN104198495A (en) * | 2014-09-02 | 2014-12-10 | 上海华力微电子有限公司 | Method for detecting step evolution abnormality of semiconductor substrate |
| US10522375B2 (en) | 2014-12-19 | 2019-12-31 | Applied Materials, Inc. | Monitoring system for deposition and method of operation thereof |
| CN106290390B (en) * | 2015-05-24 | 2019-11-26 | 上海微电子装备（集团）股份有限公司 | Defect detecting device and method |
| CN106290390A (en) * | 2015-05-24 | 2017-01-04 | 上海微电子装备有限公司 | Defect detecting device and method |
| CN107345914A (en) * | 2016-05-04 | 2017-11-14 | 住华科技股份有限公司 | Automatic checkout system and apply its automatic testing method |
| CN106442562A (en) * | 2016-08-31 | 2017-02-22 | 上海华力微电子有限公司 | Method for breaking through detection limit of apparent defect drilling crew |
| CN107093566A (en) * | 2017-04-28 | 2017-08-25 | 苏州商信宝信息科技有限公司 | A kind of silicon chip automatic detection sorting device and its control method |
| CN107093566B (en) * | 2017-04-28 | 2019-11-22 | 连江县维佳工业设计有限公司 | A kind of silicon wafer automatic detection sorting device and its control method |
| CN107689335A (en) * | 2017-09-26 | 2018-02-13 | 中航（重庆）微电子有限公司 | The analysis method of one kind of multiple product wafer defects |
| CN108878329A (en) * | 2018-07-19 | 2018-11-23 | 深圳市捷佳伟创新能源装备股份有限公司 | For detecting the detection device, silicon wafer processing system and detection method of position of silicon wafer |
| CN109211917A (en) * | 2018-08-20 | 2019-01-15 | 苏州富鑫林光电科技有限公司 | A kind of general complex surface defect inspection method |
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