CN101394159A - LC high-pass filter circuit - Google Patents
LC high-pass filter circuit Download PDFInfo
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- CN101394159A CN101394159A CNA2008101739975A CN200810173997A CN101394159A CN 101394159 A CN101394159 A CN 101394159A CN A2008101739975 A CNA2008101739975 A CN A2008101739975A CN 200810173997 A CN200810173997 A CN 200810173997A CN 101394159 A CN101394159 A CN 101394159A
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Abstract
The present invention discloses a minitype LC high-pass filter circuit which exhibits high Q value and which excels in frequency characteristics, a laminated LC high-pass filter, a multiplexer and a wireless communication apparatus. Inductors are connected in the direction of stacking of insulating sheets (2-8) by via holes (20a, 20b) so as to define a cylindrical inductor (L3). Inductors are separately defining cylindrical inductor (L1, L2) by via holes (21, 22). The shaft directions of the cylindrical inductors (L1-L3) are vertical relative to the surface of the insulating sheets (2-8). In the high-pass filter, a capacitor (C1) and the inductor (L1) define a high-pass filter circuit (HPF1), a capacitor (C2) and the inductor (L2) defines a high-pass filter circuit (HPF2). Also, in a trap circuit, a series circuit of a capacitor (C5) and the inductor (L3) defines a trap circuit (T).
Description
The application be the applicant on October 18th, 2002 submit to, application number for " 02147310.2 ", denomination of invention divides an application for the application for a patent for invention of " LC and lamination LC high pass filter, multiplexer and radio communication device ".
Technical field
The present invention relates to employed LC circuit of high pass filter, lamination LC high pass filter, multiplexer and radio communication device in mobile communicating equipment such as portable phone etc.
Background technology
In the past, as this lamination LC high pass filter, structure as shown in Figure 16 and knowing.The logical high filter 151 of this LC is by the formations such as insulating trip 152～158 of difference equipment input and output conductor 161,162, resonance capacitor conductor 163, coil-conductor 164～169, earthing conductor 170.
After each sheet 152～158 is stacked, adopt integrally that roasting forms, become in the laminated body shown in Figure 17 175.In laminated body 175, forming input 176, output 177 and earth terminal.Connect input conductor 161 on the input 176, on output 177, connecting output conductor 162.On earth terminal G, connecting earthing conductor 170.
Coil-conductor 164～166,167～169 by being connected in series on reach through hole 171b, the 171c, 172b, the 172c that are provided with on the insulating trip 155,156 are electric respectively, constitutes inductance L 1, L2.End separately of inductance L 1, L2 electrically is connected to input conductor 161 and output conductor 162 by reach through hole 171a, the 172a that is provided with on insulating trip 154.Reach through hole 171d, the 172d of another end separately of inductance L 1, L2 by being provided with on insulating trip 157 electrically is connected to earthing conductor 170.The direction that rotates of inductance L 1, L2 is mutually in the other direction.Resonance is opposite to input and output conductor 161,162 with capacitor conductor 163 because of clamping insulating trip 153, forms resonance electricity consumption container C.
Figure 18 is the electric equivalent circuit diagram by the above-mentioned lamination LC high pass filter 151 that constitutes.Because of inductance L 1, the mutual rightabout of L2 rotate, so inductance L 1 and L2 constitute the state of decoupling.Therefore, adopt the inverse inductance coupling of inductance L 1, L2, on a M, resonance electricity consumption container C, inductance L 1, L2, also form trap circuit.
But so LC high pass filter 151 reason coil-conductors 164～166,167～169 in the past and constitute inductance L 1, L2 are the interarea of input and output conductor 161,162 and earthing conductor 170 and the magnetic line of force that is produced by inductance L 1, L2 quadrature vertically substantially.Therefore, because the magnetic line of force of inductance L 1, L2, the eddy current loss that produces in earthing conductor 170 grades is also bigger, only obtains the lower LC high pass filter 151 of Q value.And, because coil-conductor 164～166,167～169 need occupy the area of broad, so the miniaturization (small sizeization) of LC high pass filter 151 is difficult.
Also have, in the equivalent electric circuit shown in Figure 18, the attenuation pole position of trap circuit being close near the centre frequency of circuit of high pass filter is difficulty.
Summary of the invention
Therefore, the object of the present invention is to provide LC circuit of high pass filter, lamination LC high pass filter, multiplexer and the radio communication device that the Q value is higher, frequency characteristic is excellent, small-sized.
In order to reach the above object, relevant in the present invention lamination LC circuit of high pass filter comprises
(a) a pair of input/output terminal,
(b) by with respect to a pair of input/output terminal capacitor connected in series and a plurality of circuit of high pass filter that are connected in parallel with respect to a pair of input/output terminal and the inductance of ground connection is formed,
(c) by between two circuit of high pass filter of adjacency, being connected in parallel and a trap circuit end ground connection, that form by the series circuit of capacitor and inductance with respect to a pair of input/output terminal.
Therefore, between inductance that an end is grounded when being connected in parallel with respect to a pair of input/output terminal and an end is grounded when being connected in parallel with respect to a pair of input/output terminal the trap circuit, connecting the capacitor of circuit of high pass filter respectively.
Adopt above-mentioned formation, can the attenuation pole position of trap circuit is approaching near the passband of circuit of high pass filter.Therefore, obtain precipitous LC circuit of high pass filter.
Also have, between the intermediate connection point of the capacitor of trap circuit and inductance and input/output terminal, electrically be connected frequency band adjustment capacitor, therefore, can form the lower signal path of impedance in addition.In the lower situation of impedance,, can constitute the broad in band of LC circuit of high pass filter because the signal quantitative change of flowing through is many.
Also have, relevant in the present invention lamination LC high pass filter comprises
(d) a plurality of insulating barriers and a plurality of capacitor conductor and a plurality of coil-conductor is the stacked and laminated body that constitutes,
(e) be arranged on lip-deep a pair of input/output terminal of laminated body and earth terminal,
(f) by in laminated body with formed the 1st capacitor of capacitor conductor and a plurality of high pass filters of being constituted with formed the 1st inductance of coil-conductor,
(g) by in laminated body, being configured the trap circuit of series circuit with formed the 2nd capacitor of capacitor conductor with formed the 2nd inductance of coil-conductor,
(h) with respect to be connected in series the 1st capacitor of described high pass filter of described a pair of input/output terminal, with respect to be connected in parallel described the 1st inductance and be connected to described earth terminal of described a pair of input/output terminal,
(i) between two described circuit of high pass filter of adjacency with respect to the described a pair of input/output terminal described trap circuit that is connected in parallel, the series circuit with described the 2nd capacitor and the 2nd inductance is connected to described earth terminal simultaneously.
Here, within the coil-conductor of the coil-conductor of the 1st inductance and the 2nd inductance at least a portion be inductance can with reach through hole or helical coil conductor or spiral coil conductor.The inductance that has parallel axes with the stacked direction with respect to insulating barrier constitutes inductance with reach through hole, therefore constitutes the higher LC high pass filter of Q value or trap circuit and so on.Also have, because inductance is less with the occupied area of reach through hole, so, can constitute the small sizeization of LC high pass filter.
Also have, in the stack direction of laminated body, on different positions, dispose the coil-conductor of the 1st inductance and the coil-conductor of the 2nd inductance, make the 1st inductance and the 2nd inductance in laminated body, form sandwich construction like this.Thus, the LC high pass filter with the 1st inductance is difficult to electromagnetic coupled with the trap circuit with the 2nd inductance, prevents the deterioration of high frequency characteristics.And, obtain the lamination LC filter of small size.
Also have, in the stacked direction of insulating barrier, trap circuit is configured in that more upside is better than high pass filter.Thus, the electric field or the magnetic field quantitative change of sewing outside lamination LC high pass filter from the 1st inductance of high pass filter is few.
Also have, the inductance reach through hole that has parallel axle based on stacked direction with respect to insulating barrier, with helical coil conductor set on the surface of insulating barrier and spiral coil conductor is auxilliary, employing electrically connects both and constitutes the 1st inductance of high pass filter, can suppress to reduce the height dimension of the 1st inductance of high pass filter.
Also have, relevant in the present invention multiplexer and radio communication device are to comprise that the lamination LC high pass filter with above-mentioned feature is a feature.Thus, obtain small-sized multiplexer and radio communication device.
As can be known by above-mentioned explanation, according to the present invention, adopt two high-frequency filter circuits and in adorn a trap circuit, can be with the attenuation pole position of trap circuit near near the passband of circuit of high pass filter.Therefore, obtain precipitous LC circuit of high pass filter.The result can obtain miniaturization LC high pass filter, multiplexer and the radio communication device of low level simultaneously.In addition, employing has the inductance of parallel axle with supporting also formation inductance, higher high pass filter or the trap circuit of formation Q value with respect to the stacked direction of insulating barrier.And,, can constitute the small sizeization of lamination LC high pass filter because inductance uses the occupied area of reach through hole to reduce.
Description of drawings
Fig. 1 represents the exploded perspective view of lamination LC high pass filter the 1st example that the present invention is relevant.
The stereoscopic figure of the lamination LC high pass filter shown in Fig. 2 presentation graphs 1.
The pattern sectional view of the lamination LC high pass filter shown in Fig. 3 presentation graphs 2.
The electric equivalent circuit diagram of the lamination LC high pass filter shown in Fig. 4 presentation graphs 2.
The transmission characteristic of the lamination LC high pass filter shown in Fig. 5 presentation graphs 2 and the curve chart of reflection characteristic.
The transmission characteristic of the lamination LC high pass filter shown in Fig. 6 presentation graphs 2 and the curve chart of reflection characteristic.
The transmission characteristic of the lamination LC high pass filter shown in Fig. 7 presentation graphs 2 and the curve chart of reflection characteristic.
The transmission characteristic of the lamination LC high pass filter shown in Fig. 8 presentation graphs 2 and the curve chart of reflection characteristic.
Fig. 9 represents the detailed perspective of the 2nd example of the lamination LC high pass filter that the present invention is relevant.
Figure 10 represents the detailed perspective of the 3rd example of the lamination LC high pass filter that the present invention is relevant.
Figure 11 represents the stereoscopic figure of the lamination LC high pass filter shown in Figure 10.
Figure 12 represents the electric equivalent circuit diagram of the lamination LC high pass filter shown in Figure 11.
Figure 13 represents the transmission characteristic S21 of the lamination LC high pass filter shown in Figure 11 and the curve chart of reflection characteristic S11.
Figure 14 represents the detailed perspective of the 4th example of the lamination LC high pass filter that the present invention is relevant.
Figure 15 represents RF (radio frequency) the electric circuit block diagram partly of an example of the radio communication device that the present invention is relevant.
Figure 16 represents the exploded perspective view of lamination LC high pass filter in the past.
Figure 17 represents the stereoscopic figure of lamination LC high pass filter shown in Figure 16.
Figure 18 represents the electric equivalent circuit diagram of lamination LC high pass filter shown in Figure 17.
Label declaration
1,1A, 51,51A ... lamination LC high pass filter
2～8,7A, 8A, 52～59,75～77 ... insulating trip
13,61 ... high pass filter capacitor conductor
14,15 ... frequency band adjustment capacitor conductor
16,60 ... trap circuit capacitor conductor
17,18,66 ... earthing conductor
20a, 20b, 21,22,67a, 67b, 68a, 68b, 69a, 69b, 80a～80c ... the inductance reach through hole
25,71 ... laminated body
26,72 ... input
27,73 ... output
G, G1, G2 ... earth terminal
41,42,64,65 ... the spiral coil conductor
67,68,69 ... cylindrical inductance
79a, 79b ... the helical coil conductor
81 ... radio communication device
ANT ... antenna
DPX ... TR box
TX ... sending part
RX ... acceptance division
C1, C2 ... the high pass filter capacitor
C3 ... the trap circuit capacitor
C4, C5 ... frequency band adjustment capacitor
L1, L2 ... the high pass filter inductance
L3 ... the trap circuit inductance
HPF1, HPF2 ... circuit of high pass filter
T ... trap circuit
Concrete example
Below, describe with reference to the example of accompanying drawing the relevant LC circuit of high pass filter of the present invention, lamination LC high pass filter, multiplexer and radio communication device.
(the 1st example, Fig. 1～Fig. 8)
As shown in FIG. 1, lamination LC high pass filter 1 is by input conductor 11, output conductor 12, high pass filter capacitor conductor 13, frequency band adjustment capacitor conductor 14,15 are set respectively, trap circuit capacitor conductor 16, earthing conductor 17,18 and inductance reach through hole 20a, 20b, 21,22 insulating trip 2～8 formations such as grade.Insulating trip 2～8th, dielectric medium powder and magnetic powder adhesive etc. are mixing together, and make sheet.
Also have, inductance reach through hole 20a is set respectively.20b, 21,22 sheet 4,5,7 are set at than other sheets 2,3 and want thicker.At this moment, sheet 4,5,7 thickness will with same piece thickness such as other sheets 2, a plurality of are stacked, employing will couple together by set reach through hole in each sheet, employing will be in each sheet set reach through hole couple together guarantee might as well, use 1 thick sheet to guarantee also passable.
Inductance reach through hole 20a, 20b couples together in the stacked direction of insulating trip 2～8, constitutes cylindrical inductance L 3.Also have, inductance constitutes cylindrical inductance L 1, L2 respectively individually with reach through hole 21,22.The direction of principal axis of these cylindrical inductance L 1～L3 is vertical with respect to the surface of sheet 2～8.High pass filter with inductance L1, L2 separately an end be connected to input conductor 11 and output conductor 12, the other end is connected to earthing conductor 18.Trap circuit is connected to trap circuit capacitor conductor 16 with the end of inductance L3, and the other end is connected to high pass filter capacitor conductor 13.
Be configured in insulating trip 7 about input conductor 11 and the end separately of output conductor 12 expose on the limit, the left and right sides of sheet 7.These input and output conductors 11,12, opposed in high pass filter usefulness capacitor conductor because of clamping insulating trip 6 respectively, form high pass filter electricity consumption container C 1, C2.
Be configured in insulating trip 5 about the frequency band adjustment expose on the limit, the left and right sides of sheet 5 with the end separately of capacitor conductor 14,15.These frequency band adjustment usefulness capacitor conductors 14,15 are opposed in trap circuit usefulness capacitor conductor 16 because of clamping insulating trip 4 respectively, form frequency band and adjust electricity consumption container C 3, C4.And trap circuit is opposed in earthing conductor 17 because of clamping insulating trip 3 with capacitor conductor 16, forms trap circuit electricity consumption container C 5.
Each sheet 2～8 adopts stacked, and roasting integrally forms, and is formed in the laminated body 25 shown in Fig. 2 and Fig. 3.End face forms input 26,27 respectively in the left and right sides of laminated body 25, forms earth terminal G in front on the side of side and depth side.These ends 26,27 adopt methods such as sputtering method, evaporation, rubbing method, print process to form, by Ag-Pd, and Ag, Pd, Cu, materials such as Cu Jin Jin are formed.
On input 26, input conductor 11 and frequency band adjustment are electrically connecting with capacitor conductor 14.On output 27, output conductor 12 electrically is being connected with capacitor conductor 15 with the frequency band adjustment.On earth terminal G, earthing conductor 17,18 is connecting.
Fig. 4 is the electric equivalent circuit diagram of the lamination LC high pass filter 1 that obtains like this.High pass filter electricity consumption container C 1 and high pass filter inductance L1 constitute input side circuit of high pass filter HPF1.Equally, high pass filter electricity consumption container C 2 and high pass filter constitute outlet side circuit of high pass filter HPF2 with inductance L2.Also have, trap circuit electricity consumption container C 5 and trap circuit constitute the LC series resonant circuit with inductance L3, form trap circuit T.
Circuit of high pass filter HPF1, the capacitor C1 of HPF2, C2 is being connected in series with respect to input/output terminal 26,27.Circuit of high pass filter HPF1, the inductance L 1 of HPF2, L2 connects in parallel with respect to input/ output terminal 26,27, and the one end is connected to earth terminal simultaneously.Trap circuit T is connected in parallel with respect to input/ output terminal 26,27 between the HPF2 at circuit of high pass filter HPF1, and the one end is connected to earth terminal G.
Also have, frequency band is adjusted between the intermediate connection point and input 26 that electricity consumption container C 3 is connected the capacitor C5 of trap circuit T and inductance L 3.Frequency band is adjusted between the intermediate connection point and output 27 that electricity consumption container C 4 is connected the capacitor of trap circuit T and inductance L 3.Frequency band is adjusted electricity consumption container C 3, and C4 helps the broad in band of LC high pass filter 1.
Like this, lamination LC high pass filter 1 can be approaching at circuit of high pass filter HPF1, near the passband of HPF2 with the attenuation pole position of trap circuit because have at the trap circuit T shown in Fig. 3.Therefore, obtain precipitous LC high pass filter 1.
Also have, the bandwidth of general filter because of the semaphore that flows through between input/output terminal more after, become broadband.Because frequency band is adjusted electricity consumption container C 3, C4, after the additional electrostatic capacitance, frequency band is adjusted electricity consumption container C 3 between input 26 and output 27, and C4 acts on as by-pass capacitor.Thus, form the Low ESR signal path in addition.In the lower situation of impedance,, can make the bandwidth of LC high pass filter 1 carry out broad in band because the signal quantitative change of flowing through is many.
Fig. 5～Fig. 8 represents the transmission characteristic S21 of LC high pass filter 1 and the curve chart of input reflection characteristic S11 when the electrostatic capacitance of various change trap circuit electricity consumption container C 5.Wherein, inductance L 1, L2 is respectively 0.67nH, high pass filter electricity consumption container C 1, C2 and frequency band are adjusted electricity consumption container C 3, and C4 is respectively 3pF, and inductance L 3 is 0.8nH, inductance L 1, the mutual coupling factor of L2 is 0.2.
According to Fig. 5～Fig. 8, know after the value of the electrostatic capacitance that reduces trap circuit electricity consumption container C 5, the position of attenuation pole more can be approached the passband of LC high pass filter 1.Also have, after the value of the electrostatic capacitance of increase trap circuit electricity consumption container C 5, know the position that can make attenuation pole slightly away from the passband of LC high pass filter 1, is got a little attenuations more.Therefore, according to the purposes of LC high pass filter 1,, obtain desired characteristic to adjust the value of trap circuit electricity consumption container C 5.Also have, make the value of direct capacitance of trap circuit electricity consumption container C 5 excessive little after because in the passband of LC high pass filter 1, can form attenuation pole, so in the example shown in Fig. 5～Fig. 8, the value of trap circuit electricity consumption container C 5 is preferably in more than the 4pF.
More than the lamination 1C high pass filter 1 of Gou Chenging is with circuit of high pass filter HPF1, the inductance L 3 of the inductance L 1 of HPF2, L2 and trap circuit T is main, and the stacked direction with respect to insulating trip 2～8 connects inductance reach through hole 21,22 or the 20a with parallel axle respectively, 20b constitutes like this.Therefore, the interarea of capacitor conductor 13,16 and earthing conductor 18 etc. constitutes parallel with electricity in the magnetic line of force that inductance L 1～L3 produces.In a word, at conductor 13,16, the eddy current loss that takes place in 18 grades diminishes according to the magnetic line of force of inductance L 1～L3, and the Q value also is difficult to worsen.As a result, can constitute Q value higher circuit of high pass filter HPF1, HPF2 and trap circuit T.
And, because inductance reach through hole 20a, 20b, 21,22 occupied area is less, so can realize the small sizeization of lamination LC high pass filter 1.And, in the stacked direction of insulating trip 2～8, with circuit of high pass filter HPF1, the inductance L 1 of HPF2, the inductance L 3 of L2 and trap circuit T is configured in different layers, is further to reach small sizeization.Like this, lamination LC high pass filter 1 can carry out miniaturization by filter in the past, is of a size of length 2.0mm, width 1.25mm, height 1.05mm (representative value).
And, in the present invention's the 1st example, with the inductance L 3 of trap circuit T, the inductance L 1 of circuit of high pass filter HPF1 and HPF2, L2 is configured in the stacked direction of laminated body 25 up and down.Thus, can suppress inductance L 1, the magnetic couplings between L2 and the inductance L 3.For this reason, flow through circuit of high pass filter HPG1, the signal of HPG2 is difficult to flow in the inductance L 3 of trap circuit T, can be with circuit of high pass filter HPF1, and HPF2 and trap circuit T be independent design each other mutually, makes design more convenient like this.Also have, because flow through circuit of high pass filter HPF1, the signal of HPF2 is difficult to flow to the ground connection place through trap circuit T, and described input impedance has uprised.For this reason, can prevent the deterioration of high frequency characteristics (particularly input reflection characteristic S11).Also have, even circuit of high pass filter HPF1, inductance L 1 and the mutual magnetic couplings of L2 of HPF2 also influence high frequency characteristics hardly.
And, because of with circuit of high pass filter HPF1, the inductance L 1 of HPF2, the inductance L 3 of L2 and trap circuit T is configured in the different layers, can make the space that efficiently utilizes in the lamination Lc high pass filter 1, constitute the structure of the small sizeization that is suitable for lamination LC high pass filter 1.And inductance set in same insulating trip 7 also can be set widelyer with the interval of reach through hole 21 and 22.Why, be to tail off because of the number of formed inductance in one deck with reach through hole.As a result, can obtain the lamination LC high pass filter 1 that area is little and mechanical strength is stronger.
Also have, in the stacked direction of insulating trip 2～8, trap circuit T is in than circuit of high pass filter HOPF1, HPF2 is the position of upside more, so with trap circuit T is configured in than circuit of high pass filter HPF1, HPF2 wants the situation of downside to compare, earthing conductor 17,18 aperture opening ratio reduces, and has suppressed from the electric field of peristome and the leakage in magnetic field.
(second example, Fig. 9)
As shown in FIG. 9, the lamination LC high pass filter 1A of the 2nd example stays insulating trip 7A, and 8A is identical with the lamination LC high pass filter of above-mentioned the 1st example.
On the surface of insulating trip 8A, forming roughly spiral-shaped coil-conductor 41,42.Coil-conductor 41 be configured in sheet 8A cardinal principle left side half, its lead division be exposed to sheet 8A the area side the face that keeps left and be connected to earth terminal G.Coil-conductor 42 be configured in sheet 8A the cardinal principle right side half, its lead division be exposed to sheet 8A in face of side the face of keeping right and be connected to earth terminal G.
The inductance that is provided with on insulating trip 7A electrically is connected in series to coil-conductor 41 with reach through hole 21, constitutes the inductance L 1 with desirable inductance value with coil-conductor 41.Inductance set on insulating trip 7A electrically is connected in series to coil-conductor 42 with reach through hole 22, constitutes the inductance L 2 with desired inductance value with coil-conductor 42.
The circuit of high pass filter HPF1 of the LC high pass filter 1A of above-mentioned formation, formed coil- conductor 41,42 constitutes a part of reason of HPF2 on the surface of insulating trip 8A, so can shorten the length dimension of inductance with reach through hole 21,22.Therefore, thickness that can attenuate insulating trip 7A is compared with the LC high pass filter 1 of above-mentioned the 1st example, can obtain the lamination LC high pass filter 1A of low clearance.
(the 3rd example, Figure 10～Figure 13)
The lamination LC high pass filter of the 3rd example of the present invention is compared with the lamination LC high pass filter 1 of the present invention's the 1st example, is omitting two frequency bands adjustment electricity consumption container C 3, and the C4 part is different.As the 1st example and the 2nd example, in order to make every effort to broad in band, preferably connect frequency band and adjust electricity consumption container C 3, C4, special in the situation that does not need broad in band, frequency band is adjusted electricity consumption container C 3, also can even C4 omits.This situation also LC high pass filter 1 with the 1st form of implementation is identical, can near the passband of HPF2, can obtain precipitous LC high pass filter with attenuation pole near at circuit of high pass filter HPF1.Also have, omit frequency band and adjust electricity consumption container C 3, after the C4, be used to constitute frequency band adjustment electricity consumption container C 3 because of omitting, the capacitor conductor of C4 is so can make lamination LC high pass filter 51 carry out miniaturization.
As shown in Figure 10, the lamination LC high pass filter 51 of the present invention's the 3rd example is by the insulating trip 52 that earthing conductor 66 is arranged on the surface, trap circuit is arranged on the insulating trip 53 on surface with capacitor conductor 60, the insulating trip 54 of inductance with reach through hole 67b is set, high pass filter is arranged on the insulating trip 55 on surface with capacitor conductor 61, with input and output conductor 62,63 are arranged on the insulating trip 56 on surface, inductance reach through hole 68b is set, the insulating trip 57 of 69b, spiral coil conductor 64,65 is arranged on insulating trip 58 formations such as grade on surface.
Inductance reach through hole 68a, 68b, 69a, 69b couple together in the stacked direction of insulating trip 52-59 respectively and form cylindrical inductance 68,69.The direction of principal axis of cylindrical inductance 68,69 is vertical with respect to the surface of insulating trip 52～59.After flowing through electric current in the cylinder table inductance 68,69, cylindrical inductance 68,69 separately around produce with respect to the direction of principal axis of cylindrical inductance 68,69 around the magnetic field of vertical plane.(reach through hole 68a 69a) is connected to input and output conductor 62,63 in an end separately of cylindrical inductance 68,69.(reach through hole 68b 69b) is connected to spiral coil conductor 64,65 in the other end separately of cylindrical inductance 68,69.
And, on cylindrical inductance 68 and spiral coil conductor 65, form high pass filter inductance L2.Only the not enough available spiral coil conductor 64,65 of electric strong point (inductance value) compensates on cylindrical inductance 68,69.Therefore, the space in the lamination LC filter 51 can be effectively utilized, lamination LC filter 51 further miniaturization can be carried out.
Trap circuit is opposed in connecing conductor 66 because of clamping insulating trip 52 with capacitor conductor 60.Form trap circuit electricity consumption container C 5.Inductance reach through hole 67a, 67b couple together in the stacked direction of insulating trip 52～59 and form cylindrical inductance 67.One end of cylindrical inductance 67 (reach through hole 67a) is connected to trap circuit capacitor conductor 60, and the other end (reach through hole 67b) is connected to high pass filter capacitor conductor 61.Cylindrical inductance 67 forms trap circuit inductance L3 separately.
Insulating trip 54,57 can be adjusted (increase) inductance value with the formed cylindrical inductance 67～69 of inductance reach through hole owing to strengthen its gauge.Also have, insulating trip 54 even 57 use the thick sheet of part also passable, gathers into folds also passable with insulating trip 56 and so on thin slice polylith.
Insulating trip 52～58 is stacked, and configuration protection is with insulating trip 59 in the above, and integral roasting forms.Thus, become in the laminated body shown in Figure 11 71.On the end face of the left and right sides of laminated body 71, form input 72 respectively, output 73.The side of side and depth side forms earth terminal G1, G2 in face of laminated body 71.On input 72, connecting the lead division 62a of input conductor 62.The lead division 63a that on output 73, is connecting output conductor 63.The lead division 64a that is connecting spiral turns conductor 64,65 on earth terminal G1, an end of 65a and earthing conductor 66 is connecting another end of earthing conductor 66 on earth terminal G2.
Figure 12 is the electric equivalent circuit diagram of the lamination LC high pass filter 51 that obtains like this.High pass filter electricity consumption container C 1 and high pass filter constitute input side circuit of high pass filter HPF1 with inductance L1.Equally, high pass filter electricity consumption container C 2 and high pass filter constitute outlet side circuit of high pass filter HPF2 with inductance L2.Also have, trap circuit electricity consumption container C and trap circuit constitute the LC series resonant circuit with inductance, form trap circuit T.
Circuit of high pass filter HPF1, the capacitor C1 of HPF2, C2 is connected in series with respect to input/ output terminal 72,73.
Circuit of high pass filter HPF1, the inductance L 1 of HPF2, L2 is connected in parallel with respect to input/ output terminal 72,73, and the one end is connected to earth terminal G1 simultaneously.Trap circuit T, is connected in parallel with respect to input/ output terminal 72,73 between the HPF2 at circuit of high pass filter kHPF1, and the one end is connected to earth terminal G1, G2.
Can obtain being suitable for the narrow-band design like this, miniaturization is the lamination LC high pass filter 51 of low level simultaneously.
And, in the 3rd form of implementation of the present invention, with the inductance L 3 of trap circuit T, circuit of high pass filter HPF1, the inductance L 1 of HPF2, L2 is configured to configuration up and down in the stacked direction of laminated body 71.Thus, can suppress inductance L 1, the magnetic couplings between L2 and the inductance L 3.For this reason, flow through circuit of high pass filter JPF1, the signal of HPF2 is difficult to flow into 3 li of the inductance L of trap circuit T, makes circuit of high pass filter HPF1, and HPF2 and trap circuit T design independently of each other, are designed to more convenient.Also have, owing to flow through circuit of high pass filter HPF1, the signal of HPF2 is difficult to flow to the ground connection place through trap circuit, so input impedance uprises.For this reason, can prevent the deterioration of high frequency characteristics (particularly input reflection characteristic S11).Also have, even circuit of high pass filter HPF1, inductance L 1 and the mutual magnetic couplings of L2 of HPF2 also influence high frequency characteristics hardly.
And, because of with high pass filter HPF1, the inductance L 1 of HPF2, the inductance L 3 of L2 and trap circuit T is configured in the different layers, so can efficiently utilize the space in the lamination LC high pass filter 51, becomes the small sizeization that is suitable for lamination LC high pass filter 51.And set inductance is used the interval of reach through hole 68a and 69a on same insulating trip 56, and set inductance also can be set widelyer with the interval of reach through hole 58b and 69b on same insulating trip 57.Why, be the decreased number of using reach through hole because of formed inductance in one deck.As a result, can obtain the stronger lamination LC high pass filter 51 of small size and mechanical strength.
Also have, because the inductance reach through hole 67a that is coupled together in the stacked direction of insulating trip 52～59,67b constitutes the inductance L 3 of trap circuit T, thus the interarea of capacitor conductor 60,61 conductors such as grade become with owing to the magnetic force Yi nationality of inductance L 3 generations is parallel.Therefore, according to the magnetic line of force of inductance L 3, the eddy current loss that is produced in capacitor conductor 60,61 conductors such as grade diminishes, so the Q value is difficult to worsen.Also have, because of increasing the sectional area of inductance L 3, the Q value becomes better.As a result, constitute the higher trap circuit T of Q value, obtain the bigger trap circuit T of attenuation observantly.
Also have, circuit of high pass filter HPF1, the inductance L 1 of HPF2, the part of L2 is made of formed spiral coil conductor 64,65 on the surface of insulating trip 58, inductance L 1, the height dimension of L2 inductance no better than can lower inductance L 1, the height dimension of L2 with the combined length (the perhaps combined length of 69a and 69b) of reach through hole 68a and 68b.
Also have,, obtain bigger inductance L 1, L2 because on the surface of insulating trip 58, can form spiral coil conductor 64,65.On the other hand, circuit of high pass filter HPF1, the inductance L 1 of HPF2, L2 be need be bigger inductance, so the inductance L 3 of trap circuit T just can be much of that because of less inductance.For example, at the smart condition of the lamination LC of 2.4GHz frequency band high pass filter 51, L1=L2=1.5nH, C1=C2=2.54pF, L3=1.0nH, C5=9.56pF.
, adopt inductance L 1, L2 and inductance L 3 are configured in the structure of different layers, can shorten the length of the inductance L 3 of trap circuit T for this reason.Also have, the centre frequency of trap circuit T with (LC)
1/2Inversely proportional.Therefore, reduce the situation of the inductance of inductance L 3,, need add the electrostatic capacitance of large capacitor C5 if will guarantee same centre frequency., because the thickness of capacitor C5 attenuate insulating trip 52 can strengthen electrostatic capacitance easily, it is no problem.Therefore, even stack inductance L 1 in the stack direction of laminated body 71, L2 and inductance L 3 also can obtain the lamination LC high pass filter 51 of low clearance.
Also have, because inductance L 1, the whole of the part of L2 and inductance L 3 are made of the higher cylindrical inductance 67,68,69 of Q value, so obtain the lamination LC high pass filter 51 of high frequency characteristics excellence.Especially, constitute inductance L 3 whole of trap circuit T by cylindrical inductance 67, can be at high pass filter inductance HPF1, form the utmost point of high decay near the passband of HPF2, can realize precipitous filter characteristic.In Figure 13, the transmission characteristic S21 and the reflection characteristic S11 of table lamination LC high pass filter 51.
(the 4th example, Figure 14)
Also have, inductance L 1～L3, its part is made of also passable the helical coil conductor at least.For example, as shown in Figure 14, the inductance L 3 of trap circuit T is by at insulating trip 75,76, on 77 set inductance with reach through hole (cylindrical inductance) 80a, 80b, 80c and helical coil conductor 79a, 79b constitute also can.Because of helical coil conductor 79a, the Q value of 79b and cylindrical inductance 80a～80c is higher, can realize having the lamination LC high pass filter 51A of precipitous filter characteristic.
(the 5th example, Figure 15)
And, as with these laminations LC high pass filter 1,1A, 51,51A combine and multiplexer such as the antenna duplexer (duplexer) that constitutes and three-way device such, the present invention adorns a plurality of filters in comprising in a laminated body.And the present invention also comprises the radio communication device that uses such multiplexer.
For example, as shown in Figure 15, the DPX of the duplexer that uses two above-mentioned lamination LC high pass filters 1 is arranged, and use its radio communication device 81.Duplexer DPX is electrically connected lamination LC high pass filter 1, and (1a 1b) constitutes, and possesses three port P1, P2, P3.The port P1 of duplexer DPX forms on the end of lamination LC high pass filter 1a, and is connected to sending part TX.The port P2 of the DPX of duplexer forms on the end of lamination LC high pass filter 1b, and is connected to acceptance division RX.And the port P3 of duplexer DPX forms on the other end of the other end of lamination LC high pass filter 1a and lamination LC high pass filter 1b, and is connected to antenna ANT place.
Above-mentioned and so on formation can be used lamination LC high pass filter 1 as duplexer.Therefore, can obtain the miniaturization duplexer of low level simultaneously.Similarly, be lamination LC high pass filter 1 can be used in the multiplexer of three-way device corresponding with three frequencies etc.Again, in above-mentioned form of implementation, duplexer DPX is made of two lamination LC high pass filters 1, also can wait other filters to constitute by 1, one surface elasticity filter of a lamination LC high pass filter (SAW filter).
(other examples)
Also have, relevant in the present invention LC circuit of high pass filter, lamination LC high pass filter, multiplexer and radio communication device are not limited to above-mentioned example, can carry out various changes in it wants point range.
Also have, the present invention also comprises for example at the RF diode switch, transmitter-receiver spare, in the high frequency composite elements of RF module etc., the article that LC circuit of high pass filter relevant with the present invention and lamination LC high pass filter structure are suitable in the part of these parts.
Again, above-mentioned example is that integral roasting forms after the insulating trip that forms conductor and reach through hole respectively is stacked, may not be defined in this.Insulating trip uses burn till in advance also passable.Also have, also can adopt the manufacture method of following explanation to make lamination LC high pass filter.Adopt methods such as printing, after pasty state insulating material formation insulating barrier, coating oar pasty state conductive material forms conductor and reach through hole on the surface of its insulating barrier.Then, with the starchiness insulating material from last coating as insulating barrier.Similarly, overlapping successively coating obtains having the LC high pass filter of laminated construction.
Claims (3)
1. a LC circuit of high pass filter is characterized in that, comprising:
A pair of input/output terminal,
Comprise and be connected in series in the capacitor between the described a pair of input/output terminal and be connected in parallel between the described a pair of input/output terminal and at least two circuit of high pass filter of the inductance of ground connection,
Between two described circuit of high pass filter of adjacency, be connected in parallel between the described a pair of input/output terminal and a trap circuit end ground connection, that constitute by the series circuit of capacitor and inductance.
2. LC circuit of high pass filter as claimed in claim 1 is characterized in that,
Between described capacitor in described trap circuit and the tie point of described inductance and the described input/output terminal, electrically connect frequency band adjustment capacitor.
3. LC circuit of high pass filter as claimed in claim 1 is characterized in that,
Be connected in parallel between a pair of input/output terminal and the described inductance of an end ground connection and be connected in parallel between a pair of input/output terminal and between the described trap circuit of an end ground connection, connect the capacitor of described circuit of high pass filter respectively.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001320854 | 2001-10-18 | ||
| JP2001320854 | 2001-10-18 | ||
| JP2002276045 | 2002-09-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021473102A Division CN100452902C (en) | 2001-10-18 | 2002-10-18 | LC and laminated high-pass filter, multiplexer and radio communication device |
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| CN101394159A true CN101394159A (en) | 2009-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2008101739975A Pending CN101394159A (en) | 2001-10-18 | 2002-10-18 | LC high-pass filter circuit |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110556805A (en) * | 2019-09-26 | 2019-12-10 | 深圳市速联技术有限公司 | Ultra-wideband radio frequency coaxial lightning electromagnetic pulse protection method and device |
| CN112736382A (en) * | 2020-12-25 | 2021-04-30 | 电子科技大学 | Switchable reconfigurable duplexer/band-pass filter |
-
2002
- 2002-10-18 CN CNA2008101739975A patent/CN101394159A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110556805A (en) * | 2019-09-26 | 2019-12-10 | 深圳市速联技术有限公司 | Ultra-wideband radio frequency coaxial lightning electromagnetic pulse protection method and device |
| CN112736382A (en) * | 2020-12-25 | 2021-04-30 | 电子科技大学 | Switchable reconfigurable duplexer/band-pass filter |
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