CN101393957A - Adhering process for encapsulated LED - Google Patents
Adhering process for encapsulated LED Download PDFInfo
- Publication number
- CN101393957A CN101393957A CNA2008101586077A CN200810158607A CN101393957A CN 101393957 A CN101393957 A CN 101393957A CN A2008101586077 A CNA2008101586077 A CN A2008101586077A CN 200810158607 A CN200810158607 A CN 200810158607A CN 101393957 A CN101393957 A CN 101393957A
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- mould
- support
- epoxy resin
- bowl cup
- model
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Abstract
The invention provides a gluing technology for packaging an LED. The gluing technology comprises the following steps: (1) a model strip is pre-heated for half an hour at 130 DEG C; (2) an epoxy resin main agent and a hardening agent are mixed according to the mass ratio A:B to be 4:5, mixed uniformly and vacuumized; (3) a bracket is pre-heated for 20min at 80 DEG C; (4) a hot model particle hole of the pre-heated model strip is filled with the prepared epoxy resin; and (5) the pre-heated bracket at 80 DEG C is taken out from an oven, and lies on the outside of the model strip to enable a bowl cup to extend into the model particle hole of the pre-heated model strip until the whole bowl cup is merged into the model particle hole, and then the model strip is inserted into the bracket according to the conventional technique and baked. The invention pre-heats the model strip and the bracket, enables the epoxy resin glue to be under the condition of higher bulk temperature, allows the fluidity of epoxy resin to be similar to water, exhausts the air in the bracket bowl cup, and efficiently prevents the generation of bubbles during the gluing process; and the operation is simple and rapid; and the gluing amount is easy to control than gluing by a machine.
Description
Technical field
The present invention relates to be applicable to LED encapsulated LED adhering process, belong to the optoelectronic applications technical field.
Background technology
Semiconductor industry is fabricated into middle reaches LED encapsulation, last application as a kind of novel industry from upstream chip, formed the process route of a comparative maturity, the LED encapsulation is that led chip is fixed in the bowl cup of support, need use the mould bar, is distributed with several mould grain holes on the mould bar.But its extension and development also are nowhere near, and in encapsulation process, epoxy resin is easy to produce bubble, because the bowl cup is empty, can be easy to generate bubble when especially support is inserted in the mould bar, influence the luminous and outward appearance of LED.Therefore to carry out viscose glue to support before the encapsulation.Existing adhering process generally all is with machine operation, therefore many one procedure, and the glue amount is difficult for comparison.
Summary of the invention
The present invention is directed to the deficiency that existing LED adhering process exists, the adhering process that a kind of glue amount is easy to control, be difficult for the packaged LED of generation bubble is provided.
The adhering process of packaged LED of the present invention may further comprise the steps:
(1) the mould bar that will be distributed with mould grain hole 130 ℃ of following preheating half an hour in baking box;
(2) mix for A:B=4:5 by the mass mixing ratio example of epoxy resin, A is the host of epoxy resin, and B is a curing agent, evenly stirs, and 60 ℃ vacuumize;
(3) will be used for the support of packaged LED 80 ℃ of following preheatings of baking box 20 minutes;
(4) inject the epoxy resin for preparing in the mould grain hole of the mould bar that preheating is good while hot, the glue amount is determined according to the size of support bowl cup;
(5) will be preheating to 80 ℃ support takes out from baking box and lies in the mould bar outside, inwardly the align mould grain hole of mould bar of support bowl cup is placed on top, mould grain hole, outer ledge with mould grain hole is a fulcrum, with mentioning outside the support bowl cup is stretched in the mould grain hole, in the bowl cup all submerges mould grain hole, then with support routinely technology insert the mould bar, toast.
Step (5) is that the temperature at pre-hot-die bar and support descends and finishes under 10% the situation of being no more than.
The present invention carries out preheating to mould bar and support, make epoxide-resin glue be in a bulk temperature than under the conditions of higher, make the flowability of epoxy resin be similar to water, air in the support bowl cup is driven out of, effectively prevented the generation of bubble in the viscose glue process, simple and quick, save operation than traditional handicraft, and the glue amount is grasped easily than machine viscose glue.
Description of drawings
Accompanying drawing is a principle schematic of the present invention.
Wherein: 1, mould bar, 2, support, 3, the bowl cup, 4, mould grain hole.
Embodiment
With the mould bar of 5 millimeters of normal dias, the support of 03RD is an example, the adhering process of accompanying drawings LED of the present invention.Carry out the front end operation by LED encapsulation common process, solid crystalline substance, bonding wire carry out viscose glue after finishing according to the following steps.
(1) half an hour mould bar 1 is put into baking box in advance, temperature is set in 130 ℃ of preheatings.
(2) epoxy resin mixes (A is the host of epoxy resin, and B is a curing agent) by the mass mixing ratio example for A:B=4:5, evenly stirs, and 60 ℃ vacuumize.
Existing general technology is to mix for A:B=1:1 by the mass mixing ratio example, and this situation is easy to generate bubble, if baking is not done under the A situation how, B makes the colloid flavescence too much easily, but bubble is few, and is more suitable when mass ratio is 4:5, colloid is unlikely to jaundice, can also effectively reduce bubble.
(3) support 2 was put into baking box in 20 minutes in advance and carry out preheating at 80 ℃.A plurality of support 2 is arranged in together at a certain distance by paper tape.
(4) inject the epoxy resin for preparing in the mould grain hole 4 of the mould bar 1 that preheating is good while hot, the glue amount will be determined according to the size of support bowl cup 3;
(5) support 2 that will be preheating to 80 ℃ takes out the outside that lies in mould bar 1 from baking box, as shown in drawings, support bowl cup 3 inwardly is placed on 4 tops, mould grain hole of mould bar, and bowl cup 3 alignment mould grain holes are fulcrum with the outer ledge of mould bar 1, support 2 outsides are promoted, the bowl cup is stretched in the mould grain hole, and glue will be filled up in bowl cup inboard, in the bowl cup all submerges mould grain hole, then with support routinely technology insert the mould bar, toast.This process is that the temperature at pre-hot-die bar and support descends and finishes under 10% the situation of being no more than.
Check positive-negative polarity, whether guide pillar alignment situation is intact, 120 ℃ of bakings.
Claims (2)
1. the adhering process of a packaged LED is characterized in that: may further comprise the steps:
(1) the mould bar that will be distributed with mould grain hole 130 ℃ of following preheating half an hour in baking box;
(2) mix for A:B=4:5 by the mass mixing ratio example of epoxy resin, A is the host of epoxy resin, and B is a curing agent, evenly stirs, and 60 ℃ vacuumize;
(3) will be used for the support of packaged LED 80 ℃ of following preheatings of baking box 20 minutes;
(4) inject the epoxy resin for preparing in the mould grain hole of the mould bar that preheating is good while hot, the glue amount is determined according to the size of support bowl cup;
(5) will be preheating to 80 ℃ support takes out from baking box and lies in the mould bar outside, inwardly the align mould grain hole of mould bar of support bowl cup is placed on top, mould grain hole, outer ledge with mould grain hole is a fulcrum, with mentioning outside the support bowl cup is stretched in the mould grain hole, in the bowl cup all submerges mould grain hole, then with support routinely technology insert the mould bar, toast.
2. according to the adhering process of the described packaged LED of claim 1, it is characterized in that: described step (5) is that the temperature at pre-hot-die bar and support descends and finishes under 10% the situation of being no more than.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101586077A CN101393957B (en) | 2008-11-04 | 2008-11-04 | Adhering process for encapsulated LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101586077A CN101393957B (en) | 2008-11-04 | 2008-11-04 | Adhering process for encapsulated LED |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101393957A true CN101393957A (en) | 2009-03-25 |
| CN101393957B CN101393957B (en) | 2010-12-22 |
Family
ID=40494142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101586077A Expired - Fee Related CN101393957B (en) | 2008-11-04 | 2008-11-04 | Adhering process for encapsulated LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101393957B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101546804B (en) * | 2009-04-27 | 2011-04-13 | 隆达电子股份有限公司 | Method for packaging light emitting diode |
| CN103779455A (en) * | 2014-01-24 | 2014-05-07 | 南通苏禾车灯配件有限公司 | Sealing method for LED vehicle lamp |
-
2008
- 2008-11-04 CN CN2008101586077A patent/CN101393957B/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101546804B (en) * | 2009-04-27 | 2011-04-13 | 隆达电子股份有限公司 | Method for packaging light emitting diode |
| CN103779455A (en) * | 2014-01-24 | 2014-05-07 | 南通苏禾车灯配件有限公司 | Sealing method for LED vehicle lamp |
| CN103779455B (en) * | 2014-01-24 | 2016-08-24 | 南通苏禾车灯配件有限公司 | A kind of glue sealing method of LED car lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101393957B (en) | 2010-12-22 |
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Addressee: Cheng Fang Document name: Notification of Termination of Patent Right |
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Granted publication date: 20101222 Termination date: 20131104 |