CN101393797A - Epoxy resin enclosed capacitor - Google Patents
Epoxy resin enclosed capacitor Download PDFInfo
- Publication number
- CN101393797A CN101393797A CNA2008100228953A CN200810022895A CN101393797A CN 101393797 A CN101393797 A CN 101393797A CN A2008100228953 A CNA2008100228953 A CN A2008100228953A CN 200810022895 A CN200810022895 A CN 200810022895A CN 101393797 A CN101393797 A CN 101393797A
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- Prior art keywords
- capacitor
- epoxy resin
- core body
- anhydride
- moist
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Abstract
The invention relates to an epoxy resin coating capacitor, which comprises a core body of the capacitor, an epoxy resin coating layer, and an heat-resistant and moist-isolated epoxy resin coat, wherein the heat-resistant and moist-isolated epoxy resin coat taking an acid-anhydride material as a curing agent is applied between the epoxy resin coating layer and the core body of the capacitor; and the acid-anhydride material is methyl tetrahydrophthalic anhydride or methyl hexahydrophthalic anhydride. In the invention, the heat-resistant and moist-isolated epoxy resin coat taking the acid-anhydride material as the curing agent is applied between the epoxy resin coating layer and the core body of the capacitor, and a solid protective coating layer was formed on the surface layer of the core body of the capacitor for the purpose of preventing external moist gas from immersing the core body of the capacitor, thereby realizing the effect of preventing a metalized layer of the capacitor from being hydrolyzed and oxidized, ensuring that the capacitor can not only maintain the mechanical property of the normal epoxy resin surface coating, but also satisfy the electric property of the capacitor under high temperature and high humidity. The epoxy resin coating capacitor has the advantages of low material cost and convenient process, and is suitable for using in severe environment with high temperature and high humidity.
Description
Technical field
What the present invention relates to is a kind of epoxy resin enclosed capacitor.
Background technology
Along with the needs of green illumination and car electrics development, outdoor use electrical equipment generally uses, and requires capacitor can be fit to hot and humid severe environmental conditions and uses.85 ℃ of Test Condition Requirements temperature, humidity are more than 85%, 1000 hour.Common epoxy resin enclosed capacitor can not satisfy this test requirements document.Capacitor need carry out sealed package with plastic housing or metal-back usually, could satisfy hot and humid requirement, but cost is higher.
Summary of the invention
The purpose of this invention is to provide that a kind of to reach Test Condition Requirements through test be 85 ℃ of temperature, humidity after 85%, 1000 hour, the key property of capacitor is not changed, and still can satisfy the epoxy resin enclosed capacitor of instructions for use.
The technical solution used in the present invention is:
Epoxy resin enclosed capacitor comprises capacitor body body, epoxy coating, also scribbles the wet epoxy resin layer of high temperature resistant damp proof insulation of making curing agent with the anhydrides material between epoxy coating and capacitor body body.
Described anhydrides material is methyl tetrahydro phthalic anhydride or methyl hexahydrophthalic anhydride.
Methyl tetrahydro phthalic anhydride molecular formula of the present invention is: C
9H
10O
3, structural formula is
The methyl hexahydrophthalic anhydride molecular formula is: C
9H
12O
3, structural formula is:
The present invention adds between the ordinary epoxy resin coating of capacitor and capacitor body body and scribbles the wet epoxy resin layer of high temperature resistant damp proof insulation of making curing agent with the anhydrides material; make the protective layer of capacitor body top layer shaping one deck densification; stop external humidification gas to immerse the capacitor body body; the metal layer that reaches capacitor is not hydrolyzed the effect with oxidation; the mechanical performance that makes capacitor can keep the ordinary epoxy resin surface to seal can satisfy the electric property of capacitor under hot and humid again.
Of the present invention the cost of material is low, easy to process, is fit to hot and humid severe environmental conditions and uses.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Wherein: 1, capacitor body body, 2, do the wet epoxy resin layer of high temperature resistant damp proof insulation of curing agent, 3, epoxy coating with the anhydrides material.
Specific embodiments
As shown in Figure 1, the present invention includes capacitor body body 1, epoxy coating 3, also scribble the wet epoxy resin layer 2 of high temperature resistant damp proof insulation of making curing agent with methyl tetrahydro phthalic anhydride between epoxy coating 3 and capacitor body body 1, the high temperature resistant damp proof insulation of this material is wet.
The present invention adds between the ordinary epoxy resin coating 3 of capacitor and capacitor body body 1 and scribbles the wet epoxy coating 2 of high temperature resistant damp proof insulation of making curing agent with methyl tetrahydro phthalic anhydride or methyl hexahydrophthalic anhydride; make the protective layer of capacitor body top layer shaping one deck densification; stop external humidification gas to immerse capacitor body body 1; the metal layer that reaches capacitor is not hydrolyzed the effect with oxidation; the mechanical performance that makes capacitor can keep the ordinary epoxy resin surface to seal can satisfy the electric property of capacitor under hot and humid again.
As shown in Figure 1, the present invention includes capacitor body body 1, epoxy coating 3, also scribble the wet epoxy resin layer 2 of high temperature resistant damp proof insulation of making curing agent with methyl hexahydrophthalic anhydride between epoxy coating 3 and capacitor body body 1, the high temperature resistant damp proof insulation of this material is wet.
Claims (2)
1, epoxy resin enclosed capacitor comprises capacitor body body, epoxy coating, it is characterized in that also scribbling between epoxy coating and capacitor body body the wet epoxy resin layer of high temperature resistant damp proof insulation of making curing agent with the anhydrides material.
2, epoxy resin enclosed capacitor according to claim 1 is characterized in that described anhydrides material is methyl tetrahydro phthalic anhydride or methyl hexahydrophthalic anhydride.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2008100228953A CN101393797A (en) | 2008-11-28 | 2008-11-28 | Epoxy resin enclosed capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2008100228953A CN101393797A (en) | 2008-11-28 | 2008-11-28 | Epoxy resin enclosed capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101393797A true CN101393797A (en) | 2009-03-25 |
Family
ID=40494038
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2008100228953A Pending CN101393797A (en) | 2008-11-28 | 2008-11-28 | Epoxy resin enclosed capacitor |
Country Status (1)
Country | Link |
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CN (1) | CN101393797A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102938320A (en) * | 2011-08-16 | 2013-02-20 | 深圳塑镕电容器有限公司 | Production method of capacitor with stable capacitance |
CN111482160A (en) * | 2020-04-30 | 2020-08-04 | 杭州亨玛电力科技有限公司 | Humidity regulating tablet and preparation method thereof |
-
2008
- 2008-11-28 CN CNA2008100228953A patent/CN101393797A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102938320A (en) * | 2011-08-16 | 2013-02-20 | 深圳塑镕电容器有限公司 | Production method of capacitor with stable capacitance |
CN111482160A (en) * | 2020-04-30 | 2020-08-04 | 杭州亨玛电力科技有限公司 | Humidity regulating tablet and preparation method thereof |
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PB01 | Publication | ||
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C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090325 |