CN101381583B - High heat conduction organosilicon dip varnish - Google Patents
High heat conduction organosilicon dip varnish Download PDFInfo
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- CN101381583B CN101381583B CN2008101433654A CN200810143365A CN101381583B CN 101381583 B CN101381583 B CN 101381583B CN 2008101433654 A CN2008101433654 A CN 2008101433654A CN 200810143365 A CN200810143365 A CN 200810143365A CN 101381583 B CN101381583 B CN 101381583B
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- organosilicon
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Abstract
The invention relates to silicone impregnating varnish with high thermal conduction. The impregnating varnish is prepared by the following steps: three aluminum nitride powder bodies which have different average particle sizes and have high thermal conductivity and high insulating property are mixed to prepare a mixed aluminum nitride powder body filler; the mixed aluminum nitride powder body filler after being mixed is added into a silicone prepolymer; a catalyst and a curing agent are added into the mixture and are subjected to the prior ball milling and even mixing to obtain the silicone impregnating varnish with high thermal conduction; and the mixture ratio of the mixed aluminum nitride powder body filler, the silicone prepolymer, the catalyst and the curing agent is as follows: 20 to 60 portions of the mixed aluminum nitride powder body filler, 40 to 80 portions of the silicone prepolymer, 0.01 to 1 portion of the catalyst and 0.01 to 1 portion of the curing agent. The mixed aluminum nitride powder body filler has three types of the average particle sizes: the particle size of a large particle is between 10 and 20 mu m, the particle size of a small particle is between 10 and50 nm; the particle size of the third particle is between the particle sizes of the large particle and the small particle; the average particle diameter is between 5 and 10 mu m; and the volumes of the large, the middle and the small particles are respectively between 30 and 55 percent, between 30 and 40 percent and between 20 and 40 percent.
Description
Technical field
The present invention relates to a kind of paint class industrial chemicals, is a kind of high heat conduction organosilicon dip varnish specifically, and the insulation impregnating that is mainly used in motor, transformer and the anti-winding coil that looses is handled.
Background technology
Impregnating varnish is a kind of of insulating material, and the insulation impregnating that is mainly used in motor, transformer and the anti-winding coil that looses is handled, and edge and the molding bonded effect of drawing last breath mainly electrifies.The electric insulation impregnating varnish includes two kinds of solvent paint and solvent-free paints.Non-solvent paint is because of containing solvent, it solidifies that fugitive constituent is higher, viscosity can accomplish very low, to the good penetrability of electric coil and winding, but the time of curing is long, have a large amount of poisonous and harmful volatile matters to occur in the workpiece mechanical electric poor-performing after curing, solidification process.Solvent-free immersion paint does not contain solvent, and is environmentally friendly, and cured article electric property excellence.
The solvent-free organic silicon impregnating varnish is a kind of impregnating varnish of excellent electrical properties.Along with the continuous progress of science and technology, people constantly make equipment such as electrical equipment and electrical develop towards large vol, miniaturization and high efficiency direction, and the heat conductivility of silicone impregnating varnish has been proposed more and more higher requirement.
Summary of the invention
Purpose of the present invention mainly is in order to solve the existing low excessively problem of silicone impregnating varnish thermal conductivity, a kind of high heat conduction organosilicon dip varnish to be provided.
The objective of the invention is to be achieved through the following technical solutions: the aluminium nitride powder that described impregnating varnish is different by three kinds of average particle size particle size, have high thermal conductivity and high insulation characterisitic again simultaneously is mixed and made into mixed nitride aluminium powder body filler, and mixed mixed nitride aluminium powder body filler joined in the organosilicon performed polymer, add catalyzer and solidifying agent again, mix through conventional ball milling and can make high heat conduction organosilicon dip varnish; The proportioning of mixed nitride aluminium powder body filler, organosilicon performed polymer, catalyzer and the solidifying agent of its described high heat conduction organosilicon dip varnish is as follows:
20～60 parts of mixed nitride aluminium powder body fillers
40～80 parts of organosilicon performed polymers
0.01～1 part of catalyzer
0.01～1 part in solidifying agent.
Described organosilicon performed polymer is for containing two kinds of group: Si-CH=CH
2The base and the organosilicon performed polymer of Si-H base, organosilicon performed polymer can be under the acting in conjunction of catalyzer and solidifying agent addition curing.
Described three kinds of average particle size particle size aluminium nitride powder different, that have high thermal conductivity and high insulation characterisitic simultaneously again is, macrobead is 10～20 μ m, small-particle is 10～50nm, the third is between large and small particle, its median size is 5～10 μ m, and large, medium and small particle volume is respectively 30～55%, 30～40%, 15～40% of mixed nitride aluminium powder body filler total amount.
Described catalyzer is the platinic compound of catalyzing addition reaction of silicon with hydrogen, is specially Platinic chloride, platinum alkene complex, platinum vinylsiloxane complex compound, platinum phosphorus complex, platinum alcohol complex or platinum black.The chemical general formula of described solidifying agent is (R)
3-Si-O-[Si-(R)
2-O]
n-Si-(R)
3, wherein R is organic group, necessarily comprises hydrogen in described organic group, and remaining in organic group be in methyl, phenyl, ethyl, the oxyethyl group one or more, n represents 5～500 positive number.
The invention has the advantages that: the particle diameter difference of the filler aluminium nitride that is adopted, be convenient to form maximum degree of piling up between filler, thereby form effective passage of heat, improve the heat conductivility of matrix material; And this product does not contain any organic solvent, and cured article has good mechanical performance and electric property, the especially outstanding heat conductivility with excellence.
Embodiment
Below the present invention is further illustrated by specific embodiment, but the present invention not merely is defined in these embodiment, and umber is by mass among the embodiment simultaneously.
Embodiment one
Take by weighing median size and be 4 parts of the aluminium nitride that 10 parts of the aluminium nitride of 11 μ m, 6 parts of aluminium nitride that median size is 5 μ m and median size be 20nm, after mixing, the aluminium nitride filler joined in 40 parts the organosilicon performed polymer; Described organosilicon performed polymer is for containing two kinds of group: Si-CH=CH
2The base and the organosilicon performed polymer of Si-H base, organosilicon performed polymer can be under the acting in conjunction of catalyzer and solidifying agent addition curing; Add 0.1 part catalyzer and 0.3 part solidifying agent again, mix, can obtain a kind of high heat conduction organosilicon dip varnish through ball milling.
Described catalyzer is the platinic compound of catalyzing addition reaction of silicon with hydrogen, is specially Platinic chloride, platinum alkene complex, platinum vinylsiloxane complex compound, platinum phosphorus complex, platinum alcohol complex or platinum black.
Described solidifying agent is the used solidifying agent of conventional impregnating varnish, and the chemical general formula of its best solidifying agent is (R)
3-Si-O-[Si-(R)
2-O]
n-Si-(R)
3, wherein R is organic group, necessarily comprises hydrogen in described organic group, and remaining in organic group be in methyl, phenyl, ethyl, the oxyethyl group one or more, n=5.
Embodiment two
Take by weighing median size and be 11.7 parts of the aluminium nitride that 11.8 parts of the aluminium nitride of 11 μ m, 15.5 parts of aluminium nitride that median size is 5 μ m and median size be 20nm, after mixing, the aluminium nitride filler joined in 60 parts the organosilicon performed polymer; Described organosilicon performed polymer is for containing two kinds of group: Si-CH=CH
2The base and the organosilicon performed polymer of Si-H base, organosilicon performed polymer can be under the acting in conjunction of catalyzer and solidifying agent addition curing; Add 0.5 part catalyzer and 0.1 part solidifying agent again, mix, can obtain a kind of high heat conduction organosilicon dip varnish through ball milling.
Described catalyzer is the platinic compound of catalyzing addition reaction of silicon with hydrogen, is specially Platinic chloride, platinum alkene complex, platinum vinylsiloxane complex compound, platinum phosphorus complex, platinum alcohol complex or platinum black.
Described solidifying agent is the used solidifying agent of conventional impregnating varnish, and the chemical general formula of its best solidifying agent is (R)
3-Si-O-[Si-(R)
2-O]
n-Si-(R)
3, wherein R is organic group, necessarily comprises hydrogen in described organic group, and remaining in organic group be in methyl, phenyl, ethyl, the oxyethyl group one or more, n represents 5=150.
Embodiment three
Take by weighing median size and be 15 parts of the aluminium nitride that 25 parts of the aluminium nitride of 11 μ m, 20 parts of aluminium nitride that median size is 5 μ m and median size be 20nm, after mixing, the aluminium nitride filler joined in 80 parts the organosilicon performed polymer; Described organosilicon performed polymer is for containing two kinds of group: Si-CH=CH
2The base and the organosilicon performed polymer of Si-H base, organosilicon performed polymer can be under the acting in conjunction of catalyzer and solidifying agent addition curing; Add 1.0 parts catalyzer and 1.0 parts solidifying agent again, mix, can obtain a kind of high heat conduction organosilicon dip varnish through ball milling.
Described catalyzer is the platinic compound of catalyzing addition reaction of silicon with hydrogen, is specially Platinic chloride, platinum alkene complex, platinum vinylsiloxane complex compound, platinum phosphorus complex, platinum alcohol complex or platinum black.
Described solidifying agent is the used solidifying agent of conventional impregnating varnish, and the chemical general formula of its best solidifying agent is (R)
3-Si-O-[Si-(R)
2-O]
n-Si-(R)
3, wherein R is organic group, necessarily comprises hydrogen in described organic group, and remaining in organic group be in methyl, phenyl, ethyl, the oxyethyl group one or more, n=500.
Embodiment four
Take by weighing median size and be 20 parts of the aluminium nitride that 15 parts of the aluminium nitride of 11 μ m, 15 parts of aluminium nitride that median size is 5 μ m and median size be 20nm, after mixing, the aluminium nitride filler joined in 70 parts the organosilicon performed polymer; Described organosilicon performed polymer is for containing two kinds of group: Si-CH=CH
2The base and the organosilicon performed polymer of Si-H base, organosilicon performed polymer can be under the acting in conjunction of catalyzer and solidifying agent addition curing; Add 0.5 part catalyzer and 0.5 part solidifying agent again, mix, can obtain a kind of high heat conduction organosilicon dip varnish through ball milling.
Described catalyzer is the platinic compound of catalyzing addition reaction of silicon with hydrogen, is specially Platinic chloride, platinum alkene complex, platinum vinylsiloxane complex compound, platinum phosphorus complex, platinum alcohol complex or platinum black.
Described solidifying agent is the used solidifying agent of conventional impregnating varnish, and the chemical general formula of its best solidifying agent is (R)
3-Si-O-[Si-(R)
2-O]
n-Si-(R)
3, wherein R is organic group, necessarily comprises hydrogen in described organic group, and remaining in organic group be in methyl, phenyl, ethyl, the oxyethyl group one or more, n=300.
Leading indicator is analyzed:
Table 1 leading indicator
| Sequence number | Thermal conductivity [W/ (mK)] |
| Embodiment one | 0.386 |
| Embodiment two | 0.437 |
| Embodiment three | 0.502 |
| Embodiment four | 0.412 |
Claims (4)
1. high heat conduction organosilicon dip varnish, it is characterized in that: the aluminium nitride powder that described impregnating varnish is different by three kinds of average particle size particle size, have high thermal conductivity and high insulation characterisitic again simultaneously is mixed and made into mixed nitride aluminium powder body filler, and mixed mixed nitride aluminium powder body filler joined in the organosilicon performed polymer, add catalyzer and solidifying agent again, mix through conventional ball milling and make high heat conduction organosilicon dip varnish; The proportioning of mixed nitride aluminium powder body filler, organosilicon performed polymer, catalyzer and the solidifying agent of its described high heat conduction organosilicon dip varnish is as follows:
20～60 parts of mixed nitride aluminium powder body fillers;
40～80 parts of organosilicon performed polymers;
0.01～1 part of catalyzer;
0.01～1 part in solidifying agent;
Described three kinds of average particle size particle size aluminium nitride powder different, that have high thermal conductivity and high insulation characterisitic simultaneously again is, macrobead is 10～20 μ m, small-particle is 10～50nm, the third is between large and small particle, its median size is 5～10 μ m, and large, medium and small particle volume is respectively 30～55%, 30～40%, 15～40% of mixed nitride aluminium powder body filler total amount.
2. according to said a kind of high heat conduction organosilicon dip varnish in the claim 1, it is characterized in that: described organosilicon performed polymer is for containing two kinds of group: Si-CH=CH
2The base and the organosilicon performed polymer of Si-H base, organosilicon performed polymer can be under the acting in conjunction of catalyzer and solidifying agent addition curing.
3. a kind of high heat conduction organosilicon dip varnish according to claim 1, it is characterized in that: described catalyzer is the platinic compound of catalyzing addition reaction of silicon with hydrogen, is specially Platinic chloride, platinum alkene complex, platinum vinylsiloxane complex compound, platinum phosphorus complex, platinum alcohol complex or platinum black.
4. a kind of high heat conduction organosilicon dip varnish according to claim 1 is characterized in that: the chemical general formula of described solidifying agent is (R)
3-Si-O-[Si-(R)
2-O]
n-Si-(R)
3, wherein R is an organic group, necessarily comprises hydrogen in described organic group, and remaining in the organic group be in methyl, phenyl, ethyl, the oxyethyl group one or more, n represents 5～500 positive number.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101433654A CN101381583B (en) | 2008-10-20 | 2008-10-20 | High heat conduction organosilicon dip varnish |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101433654A CN101381583B (en) | 2008-10-20 | 2008-10-20 | High heat conduction organosilicon dip varnish |
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| CN101381583A CN101381583A (en) | 2009-03-11 |
| CN101381583B true CN101381583B (en) | 2011-09-28 |
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|---|---|---|---|
| CN2008101433654A Expired - Fee Related CN101381583B (en) | 2008-10-20 | 2008-10-20 | High heat conduction organosilicon dip varnish |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101768404B (en) * | 2009-12-25 | 2012-04-25 | 艾伦塔斯电气绝缘材料(珠海)有限公司 | Impregnated insulating paint and preparation method thereof |
| CN102676059A (en) * | 2012-05-26 | 2012-09-19 | 西北有色金属研究院 | Insulated paint used for surface insulation of MgB2 wires and tapes and insulation processing method |
| CN103382366B (en) * | 2013-06-27 | 2016-05-04 | 马鞍山采石矶涂料有限公司 | A kind of high-temperature resistant silicone impregnating varnish and preparation method thereof |
| CN103382367B (en) * | 2013-06-27 | 2016-05-04 | 马鞍山采石矶涂料有限公司 | A kind of organic silicon insulation impregnating varnish and preparation method thereof |
| CN103555023A (en) * | 2013-10-25 | 2014-02-05 | 安徽文峰电子科技集团有限公司 | High-temperature yellowing resistant impregnating varnish and preparation method thereof |
| CN104387775B (en) * | 2014-12-16 | 2016-11-23 | 东莞市一品硅胶电子材料有限公司 | A kind of preparation method of environmental protection flame retardant complex spherical aluminium nitride film |
| CN104592831B (en) * | 2015-01-13 | 2017-01-18 | 苏州环明电子科技有限公司 | Heat-conducting coating and preparation method of heat-conducting film |
| CN105255361B (en) * | 2015-11-03 | 2017-12-12 | 株洲时代新材料科技股份有限公司 | A kind of silicone impregnating varnish and its preparation method and application |
| CN106433421A (en) * | 2016-10-26 | 2017-02-22 | 安徽飞达电气科技有限公司 | Oily heat dissipation coating for thin-film capacitor casing and preparation method of heat dissipation coating |
| CN110016205B (en) * | 2019-03-07 | 2021-10-15 | 全球能源互联网研究院有限公司 | Epoxy resin heat-conducting insulating material and preparation method thereof |
| CN110305581B (en) * | 2019-06-28 | 2021-12-10 | 蚌埠金实科技有限公司 | Organic silicon impregnating varnish and preparation method and application thereof |
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