CN101378626A - Ceramic circuit board and manufacturing method thereof - Google Patents
Ceramic circuit board and manufacturing method thereof Download PDFInfo
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- CN101378626A CN101378626A CNA2007101481403A CN200710148140A CN101378626A CN 101378626 A CN101378626 A CN 101378626A CN A2007101481403 A CNA2007101481403 A CN A2007101481403A CN 200710148140 A CN200710148140 A CN 200710148140A CN 101378626 A CN101378626 A CN 101378626A
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Abstract
The invention provides a ceramic circuit board and a preparation method thereof; the method comprises the steps as follows: a first blank sheet and a first ceramic thin plate are provided; the first ceramic thin plate and the first blank sheet are stacked and sintered so as to form the ceramic circuit board together. The method restrains the phenomenon of warping generated by the first blank sheet, thus gaining the ceramic thin plate without deformation problems such as contracting, torsion, warping and the like, and with good compactness, dielectric characteristic and quality characteristic; the low-temperature co-sintering ceramic (LTCC) technique sinters the ceramic thin plate and blank sheet designed for different circuits in a forming way or sinters the ceramic thin plates designed for different circuits for forming, so as to form a circuit-integrated three-dimensional structure, thus achieving the object of element micromation; furthermore, the ceramic thin plate can adopt a yellow light process, and exposure and development applicable to printing circuit board to form fine circuits, thus saving the cost and improving the integration of the ceramic circuit board.
Description
Technical field
The present invention relates to a kind of manufacture method of circuit board, especially in regard to a kind of manufacture method of ceramic circuit board.
Background technology
Along with the development towards compact, multi-functional, high-reliability and low priceization of Portable information electronic product and Mobile Communications product, high component density becomes the development trend of electronic product in recent years.Therefore, employed active element and passive component are also many in the circuit develops towards integrated, chipization and modular direction, effectively dwindles the circuit volume to reach, and then reduces cost and improve competitiveness of product.
Based on above-mentioned trend, dealer's active research LTCC is arranged recently, and (Low TemperatureCo-fired Ceramics, technology LTCC) are achieved the volume utilization raising of electronic product.It mainly reaches integrated with circuit integrated in a sandwich construction.
Please refer to shown in Figure 1ly, is slurry with ceramic material and inorganic binder mixed preparing at first, utilizes the scraper moulding to give birth to embryo sheet 11 again.Then, utilize screen printing technology, the electric conducting material printing is extremely given birth on the embryo sheet 11, and form required circuit pattern 111.Using the same method prepares another living embryo sheet 12 again, and utilizes fabrography giving birth to the required circuit pattern 121 of formation on the embryo sheet 12.At last, laminate two living embryo sheets 11,12 again, and carry out sintering being lower than under 1000 ℃ the temperature, can obtain ceramic circuit board 2.Wherein two living embryo sheets 11,12 form two ceramic thin plates 21,22 respectively, and electric conducting material forms two conductive layers 211,221.
Though LTCC Technology can be with circuit integrated in sandwich construction and reach integrated; Yet, be subject to the thickness of half tone silk thread, make the circuit of using the fabrography made, its live width has certain restriction.Generally speaking, the live width of the circuit of fabrography made is about 100 times of live width of the circuit of gold-tinted technology made.
Yet present LTCC Technology also can't cooperate gold-tinted technology to make fine circuits.Main cause is that the photo anti-corrosion agent material and the developer solution that make industry be used in printed circuit board (PCB) at present can't be applicable on the living embryo sheet owing to give birth to the organic principle prescription of embryo sheet.Though the silver paste that provides suitable living embryo sheet to expose, develop, developer solution etc. are provided in some supplier.Yet owing to silver paste, the developer solution of this class only is suitable for living embryo sheet, and price is not striking.
In addition, in sintering process, may be because of giving birth to the amount of contraction difference of embryo sheet 11,12, or solvent or binding agent easily lose and produce hole during sintering, and causing deformation problems (as shown in Figure 1) such as ceramic thin plate 21,22 shrinks, distortion, warpage, this phenomenon is more remarkable at the ceramic thin plate of making than thin.Because deformation problems makes ceramic thin plate also can't use suitable applications gold-tinted technology and makes fine circuits.
Therefore, how a kind of manufacture method of ceramic circuit board is provided, can be effectively suppressed and shrink the also ceramic thin plate of smooth no warpage, to adopt gold-tinted technology and to be applicable to that the exposure of printed circuit board (PCB), development materials form fine circuits, and then save cost and promote the integrated of ceramic circuit board, real is one of current important topic.
Summary of the invention
Because above-mentioned problem, purpose of the present invention forms fine circuits for a kind of gold-tinted technology of can using is provided on ceramic circuit board, and then saves cost and promote the manufacture method of integrated ceramic circuit board.
Therefore, for reaching above-mentioned purpose, a kind of ceramic circuit board fabrication method of the present invention comprises provides first to give birth to the embryo sheet; This first living embryo sheet is sintered into first ceramic thin plate; And pass through gold-tinted technology formation fine circuits pattern on this first ceramic thin plate.
According to a conception of the present invention, ceramic circuit board fabrication method of the present invention comprises provides first to give birth to the embryo sheet; First ceramic thin plate is provided; Pile up this first ceramic thin plate and this first living embryo sheet; And this first ceramic thin plate of sintering and this first living embryo sheet, with this ceramic circuit board of common formation.
According to another conception of the present invention, a kind of ceramic circuit board of the present invention by all one's life at least embryo sheet and at least one ceramic thin plate bonding altogether burning form, wherein this ceramic thin plate has patterned metal layer, thin metal layer or fine circuits pattern.
According to another conception more of the present invention, a kind of ceramic circuit board of the present invention is burnt altogether by a plurality of ceramic thin plate bondings and forms, and wherein these a plurality of ceramic thin plates have patterned metal layer, thin metal layer or fine circuits pattern respectively.
Description of drawings
Fig. 1 is sintered to the schematic diagram of ceramic thin plate for a kind of known living embryo sheet.
Fig. 2 is the flow chart according to the manufacture method of a kind of ceramic circuit board of the preferred embodiment of the present invention.
Fig. 3 and Fig. 4 are respectively of the present invention first and give birth to the schematic diagram that embryo sheet and second is given birth to the different configuration aspects of embryo sheet.
Fig. 5 A to Fig. 5 E is the schematic diagram that the ceramic thin plate of the preferred embodiment of the present invention carries out gold-tinted technology.Description of reference numerals
11,12: give birth to embryo sheet 111,121: circuit pattern
211,221: conductive layer 21,22: ceramic thin plate
32: the second living embryo sheets of 31: the first living embryo sheets
4: 41: the first ceramic thin plates of ceramic circuit board
42: patterned metal layer 43: the photoresist layer
51: fine circuits pattern 5: photomask
S01～S04: the step of manufacturing of ceramic circuit board
Embodiment
Hereinafter with reference to relevant indicators, the manufacture method according to a kind of ceramic circuit board of the preferred embodiment of the present invention is described.
Please refer to Fig. 2 and Fig. 3, the manufacture method of the ceramic circuit board of the preferred embodiment of the present invention comprises that step S01 is to step S04.Below will be described in detail the content of each step.
Step S01 provides at least the first sintering temperature of giving birth to embryo sheet 31 and at least two second living embryo sheets 32, the second living embryo sheets 32 to be higher than the sintering temperature of the first living embryo sheet 31.The first living embryo sheet 31 and second is given birth to embryo sheet 32 and is comprised that respectively at least one ceramic material and inorganic binder mix.Wherein this ceramic material is selected from ceramic powder, metal-oxide powder, composite metal oxide powder or its combination; Inorganic binder can be glass.
Below further specify first and give birth to the preparation process that embryo sheet 31 and second is given birth to embryo sheet 32.At first, ceramic material and the inorganic binder mixed preparing with lower sintering temperature is slurry respectively, is slurry with the ceramic material and the inorganic binder mixed preparing of higher sintering temperature.It can reduce the temperature of sintering by for example adding low-melting glass, and promotes follow-up sintering by the liquid phase of glass, to reach the density of sintering.In addition, the slurry for the allotment proper viscosity more can add polymer-binder, plasticiser or organic solvent; Afterwards, utilize scraper again and the difference moulding first living embryo sheet 31 and the second living embryo sheet 32.
Step S02 gives birth to embryo sheet 31 and these second living embryo sheets 32 for piling up first, and the first living embryo sheet 31 is folded between these second living embryo sheets 32.As shown in Figure 3, relative two surfaces of embryo sheet 31 are given birth in two second living embryo sheet 32 complete coverings first, can give birth to embryo sheet 31 in sintering process generation warpage in order to suppress first.What must illustrate is that these second living embryo sheets 32 not necessarily need identical.
In addition, what need pay special attention to is that the three layers of living embryo sheet that pile up that present embodiment is narrated only are illustrative, but not is limited to this.Can be according to the demand of reality, with first give birth to embryo sheet 31 and second give birth to embryo sheet 32 staggered stacked increase life embryo sheet pile up the number of plies (as shown in Figure 4), reach the purpose of for example making the ceramic thin plate of a plurality of identical or different thickness simultaneously.
After step S02, manufacture method can comprise also that pressing piles up first and give birth to embryo sheet 31 and second give birth to embryo sheet 32 with these.Promptly reach and all press the mode pressing, and prevent that these living embryo sheets from the follow-up sintering process warping phenomenon taking place so that these laminations of giving birth to the embryo sheets are finer and close with hot pressing mode.
Step S03 is for carrying out sintering with first sintering temperature of giving birth to embryo sheet 31, make the first living embryo sheet 31 be sintered into first ceramic thin plate, promptly have first of lower sintering temperature and give birth to embryo sheet 31 and be sintered to first ceramic thin plate, these with higher sintering temperature second are given birth to then sintering not of embryo sheets 32.At this, these second are given birth to embryo sheets 32 stress are provided, and suppressing first warpage of giving birth to embryo sheet 31, and unsintered these second holes of giving birth to embryo sheets 32 also can provide the dissipation through hole of giving birth to embryo sheet 31 gas in sintering process as first.
After step S03, manufacture method can also comprise removes these second living embryo sheets 32, and obtains first ceramic thin plate 41 (as shown in Figure 3) carefully thin, smooth and that density is high.In the present embodiment, first ceramic thin plate 41 finished of sintering is LTCC (LTCC) thin plate.In addition, manufacture method can also comprise the characteristic of testing first ceramic thin plate 41, for example utilizes the dielectric constant (ε) and quality factor (Q) of instrument test first ceramic thin plate, obtains first ceramic thin plate of requirement up to specification thus.
As mentioned above, can obtain not having deformation problems such as contraction, distortion, warpage, and have first ceramic thin plate 41 of good density, dielectric property and quality characteristic.Then, can carry out step S04, it forms the fine circuits pattern on first ceramic thin plate 41 by gold-tinted technology.
Before carrying out gold-tinted technology, can on first ceramic thin plate 41, form patterned metal layer earlier.Patterned metal layer can form on formation on first ceramic thin plate 41 that obtains behind the sintering or the first living embryo sheet 21 before sintering by fabrography; Also can be formed on first ceramic thin plate by film deposition techniques.
Please refer to Fig. 5 A to Fig. 5 E and how to use gold-tinted technology to be made into ceramic circuit board 4 with first ceramic thin plate 41 of explanation present embodiment.Wherein this first ceramic thin plate 41 is provided with patterned metal layer 42.At first painting photoresist layer 43 is on patterned metal layer 42, shown in Fig. 5 A.The photomask 5 that then will have corresponding to these fine circuits pattern 51 shapes is arranged on the photoresist layer 43, shown in Fig. 5 B; Then, see through 5 pairs of photoresist layers 43 of photomask and expose and develops, the part removal that so just photoresist layer 43 can be exposed, and then make 51 transfer printings of fine circuits pattern on photoresist layer 43, shown in Fig. 5 C; Then, again patterned metal layer 42 is carried out etching, remove with the part that patterned metal layer 42 is not subjected to 43 protection of photoresist layer, shown in Fig. 5 D; At last, cause resist liquid again to deluster remaining photoresist layer 43 is removed, can on first ceramic thin plate 41, obtain fine circuits pattern 51, shown in Fig. 5 E.
Because photoresist has the differentiation of positive photoresist and negative photoresist, so the exposure imaging of gold-tinted technology is not limited in the above-mentioned practice.
From the above, patterned metal layer 42 is changed into fine circuits pattern 51 by gold-tinted technology.By gold-tinted technology, the circuit width of the fine circuits pattern 51 of present embodiment can even can be less than 35 microns less than 125 microns.It should be noted that in addition, the fine circuits pattern 51 in graphic, its shape is only for for example, and unrestricted the present invention.The shape of the fine circuits pattern 51 of present embodiment can design according to need.
In addition, the ceramic circuit board 4 of present embodiment also can be the ceramic circuit board of sandwich construction.Be the ceramic circuit board of preparation sandwich construction, the manufacture method of present embodiment can also comprise: second ceramic thin plate is provided; Pile up first ceramic thin plate 41 and second ceramic thin plate; Sintering first ceramic thin plate 41 and second ceramic thin plate are with common formation ceramic circuit board.For making first ceramic thin plate 41 and the tightr binding of second ceramic thin plate, binding agent can be set between first ceramic thin plate 41 and second ceramic thin plate.Binding agent can be inorganic binder or polymer-binder.Wherein inorganic binder for example can be glass, and polymer-binder for example can be polyethylene glycol (PEG), polyvinyl butyral (PVB) or polyvinyl alcohol (PVA).
In the present embodiment, the preparation of second ceramic thin plate can be continued to use the preparation method of first ceramic thin plate 41, so repeat no more.In addition, also can form patterned metal layer on second ceramic thin plate by fabrography; Or by gold-tinted technology to form another fine circuits pattern.
In addition, combine and form the ceramic circuit board of sandwich construction with other ceramic thin plates, but also sintering first ceramic thin plate 41 is given birth to embryo sheets with other and obtained the ceramic circuit board of sandwich construction except making first ceramic thin plate 41.At this, manufacture method also comprises: three lives embryo sheet is provided; Pile up first ceramic thin plate 41 and three lives embryo sheet; Sintering first ceramic thin plate 41 and three lives embryo sheet are with common formation ceramic circuit board.
The preparation of three lives embryo sheet can be continued to use first and be given birth to the preparation method of the embryo sheet 31 or the second living embryo sheet 32, so repeat no more.In addition, the embryo sheet also can form patterned metal layer by fabrography the three lives.And behind sintering, more can this patterned metal layer be changed into another fine circuits pattern by gold-tinted technology.
In sum, ceramic circuit board fabrication method of the present invention has second of higher sintering temperature by two and gives birth to the embryo sheet and insert and put one and have first of lower sintering temperature and give birth to the embryo sheet, and carry out sintering with lower sintering temperature, make to have first of lower sintering temperature and give birth to the embryo sheet and then be sintered into ceramic thin plate, have second of higher sintering temperature and give birth to then sintering not of embryo sheet.Wherein this second living embryo sheet provides relative two surfaces of pressurization in the first living embryo sheet in sintering process, give birth to the phenomenon that the embryo sheet produces warpage to suppress first, and then obtain not having contraction, deformation problems such as distortion, warpage, and have the ceramic thin plate of good density, dielectric property and quality characteristic.
In addition, LTCC of the present invention (LTCC) technology with the ceramic thin plate of different circuit design with give birth to the embryo sheet and burn till type altogether or the ceramic thin plate of different circuit design is burnt till type altogether, to form the three-dimensional structure of circuit integration, to reach the purpose of element microminiaturization.Moreover, can adopt gold-tinted technology and be applicable to that the exposure of printed circuit board (PCB), development materials form fine circuits by ceramic thin plate of the present invention, and then save cost and promote the integrated of ceramic circuit board.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the appended claim its equivalent modifications of carrying out or change.
Claims (23)
1, a kind of manufacture method of ceramic circuit board comprises:
Provide first to give birth to the embryo sheet;
This first living embryo sheet is sintered into first ceramic thin plate; And
Form the fine circuits pattern on this first ceramic thin plate.
2, manufacture method as claimed in claim 1, wherein before this first living embryo sheet was sintered into this first ceramic thin plate, wire mark patterned metal layer or thin metal layer were on this first living embryo sheet.
3, manufacture method as claimed in claim 2 wherein by gold-tinted technology, changes over the metal level with this fine circuits pattern with this patterned metal layer or thin metal layer.
4, manufacture method as claimed in claim 3, wherein this gold-tinted technology comprises that step is:
The painting photoresist layer is on this patterned metal layer or thin metal layer;
The photomask that will have corresponding to this fine circuits pattern is arranged on this photoresist layer;
Seeing through this photomask exposes to this photoresist layer and develops;
This patterned metal layer or thin metal layer are carried out etching; And
This photoresist layer delustered cause resist to obtain this fine circuits pattern.
5, manufacture method as claimed in claim 1 wherein before this first living embryo sheet is sintered into this first ceramic thin plate, comprises that also step is:
At least two second living embryo sheets are provided, and this second sintering temperature of giving birth to the embryo sheet is higher than the sintering temperature of this first living embryo sheet; And
This first living embryo sheet is folded between these second living embryo sheets.
6, manufacture method as claimed in claim 1, wherein the circuit width of this fine circuits pattern is less than 125 microns.
7, manufacture method as claimed in claim 1, it comprises that also step is:
Second ceramic thin plate is provided;
Pile up this first ceramic thin plate and this second ceramic thin plate; And
This first ceramic thin plate of sintering and this second ceramic thin plate are with this ceramic circuit board of common formation.
8, manufacture method as claimed in claim 7, it comprises that also step is:
Three lives embryo sheet is provided, is stacked and placed between this first ceramic thin plate and this second ceramic thin plate; And
This three lives embryo sheet of sintering, this first ceramic thin plate and this second ceramic thin plate are with this ceramic circuit board of common formation.
9, manufacture method as claimed in claim 1, it comprises that also step is:
Three lives embryo sheet is provided;
Pile up this first ceramic thin plate and this three lives embryo sheet; And
This first ceramic thin plate of sintering and this three lives embryo sheet are with this ceramic circuit board of common formation.
10, a kind of manufacture method of ceramic circuit board comprises:
Provide first to give birth to the embryo sheet and first ceramic thin plate;
Pile up this first ceramic thin plate and this first living embryo sheet; And
This first ceramic thin plate of sintering and this first living embryo sheet are with this ceramic circuit board of common formation.
11, manufacture method as claimed in claim 10, wherein before this first living embryo sheet of sintering and this first ceramic thin plate, binding agent is set between this first living embryo sheet and this first ceramic thin plate, wherein this binding agent is glass, polyethylene glycol, polyvinyl butyral, polyvinyl alcohol, inorganic binder or polymer-binder.
12, manufacture method as claimed in claim 10, it comprises that also step is:
Second ceramic thin plate is provided;
Pile up this first living embryo sheet, this first ceramic thin plate, this second ceramic thin plate; And
This first living embryo sheet of sintering, this first ceramic thin plate and this second ceramic thin plate are with this ceramic circuit board of common formation.
13, a kind of manufacture method of ceramic circuit board comprises:
A plurality of ceramic thin plates are provided;
Pile up this a plurality of ceramic thin plates; And
Bonding is burnt these a plurality of ceramic thin plates altogether, with this ceramic circuit board of common formation.
14, manufacture method as claimed in claim 13, wherein this ceramic thin plate has patterned metal layer, thin metal layer or fine circuits pattern.
15, manufacture method as claimed in claim 13, wherein this ceramic thin plate is the LTCC thin plate.
16, manufacture method as claimed in claim 13, it also comprises provides embryo sheet at least throughout one's life, is total to burning and forms this ceramic circuit board with these a plurality of ceramic thin plates bondings.
17, a kind of ceramic circuit board, its by all one's life at least embryo sheet and at least one ceramic thin plate bonding altogether burning form.
18, ceramic circuit board as claimed in claim 17 wherein bonds by glass, polyethylene glycol, polyvinyl butyral, polyvinyl alcohol, inorganic binder or polymer-binder between this ceramic thin plate and this living embryo sheet.
19, a kind of ceramic circuit board, it is burnt altogether by a plurality of ceramic thin plate bondings and forms.
20, as claim 17 or 19 described ceramic circuit boards, wherein this ceramic thin plate has patterned metal layer, thin metal layer or fine circuits pattern.
21, as claim 17 or 19 described ceramic circuit boards, wherein this ceramic thin plate is the LTCC thin plate.
22, ceramic circuit board as claimed in claim 19, wherein these a plurality of ceramic thin plates are by glass, polyethylene glycol, polyvinyl butyral, polyvinyl alcohol, inorganic binder or polymer-binder bonding.
23, ceramic circuit board as claimed in claim 19, it also comprises embryo sheet at least throughout one's life, is total to burning and forms this ceramic circuit board with these a plurality of ceramic thin plates bondings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101481403A CN101378626A (en) | 2007-08-28 | 2007-08-28 | Ceramic circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101481403A CN101378626A (en) | 2007-08-28 | 2007-08-28 | Ceramic circuit board and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN101378626A true CN101378626A (en) | 2009-03-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101481403A Pending CN101378626A (en) | 2007-08-28 | 2007-08-28 | Ceramic circuit board and manufacturing method thereof |
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| CN (1) | CN101378626A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103295914A (en) * | 2012-02-29 | 2013-09-11 | 深圳光启创新技术有限公司 | Metamaterial based on ceramic substrates and preparation method thereof |
| CN105430125A (en) * | 2015-11-13 | 2016-03-23 | 深圳百工精艺材料技术有限公司 | Functional mobile phone back shell and preparation method thereof |
| CN108735707A (en) * | 2018-04-18 | 2018-11-02 | 华为技术有限公司 | The preparation method and power module of a kind of ceramic substrate, ceramic substrate |
-
2007
- 2007-08-28 CN CNA2007101481403A patent/CN101378626A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103295914A (en) * | 2012-02-29 | 2013-09-11 | 深圳光启创新技术有限公司 | Metamaterial based on ceramic substrates and preparation method thereof |
| CN103295914B (en) * | 2012-02-29 | 2018-01-16 | 深圳光启高等理工研究院 | A kind of Meta Materials based on ceramic substrate and preparation method thereof |
| CN105430125A (en) * | 2015-11-13 | 2016-03-23 | 深圳百工精艺材料技术有限公司 | Functional mobile phone back shell and preparation method thereof |
| CN108735707A (en) * | 2018-04-18 | 2018-11-02 | 华为技术有限公司 | The preparation method and power module of a kind of ceramic substrate, ceramic substrate |
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Open date: 20090304 |