CN101375647A - Layered structure with printed elements - Google Patents

Abstract

The present invention incorporates electronic components into an electronic core structure that may be readily hot laminated by existing processes. The structure may include multiple desired electronic components, such as a display, battery or other power source, integrated circuits, switches, magnetic stripe emulator, antenna, smart chips or other input devices. The structure includes laminated buffer layers to bridge layers and compensate for variation in electronic component dimensions. The structure may also incorporate battery packaging as part of the core layer structure and use printed electronic circuitry as part of the electronic core layers to impart the desired characteristics. A variety of components may be incorporated in the structure.

Description

The hierarchy that has printed element

The cross reference of related application

The application requires in the priority of the U.S. Provisional Patent Application the 60/670th, 076 of submission on April 11st, 2005.

Invention field

The present invention relates to have the thin, layered structure of built-in electric function, for example display and the correlation electron device that is used to drive this display.This display and/or other function element in this structure form by typography.

Background of invention

Plastic layer stacking industry relies on heat lamination technology manufacturing credit card, identification card, loyalty card and other contain the plane token of information.This technology is to have the laminated plastics sheet stacked combination that obtains finishing stacked together of the various functions such as opaque, figure and protective layer.Each layer can be opaque or transparent, and can contain the function element such as magnetic stripe.In case each layer of expectation is assembled, this assembly just experiences hot pressing each layer is fused together to form a continuous structure.As from most of leather wallets and wallet, showing, produced more than one hundred million cards and come dealing with various requirements.Providing of card do not charged separately in many cases, so that supplier can learn its cost.

Typical assembly is by central core, the preceding graph layer that is pre-printed usually and back graph layer, magnetic stripe and gloss is provided and protects the protective clear layer of printed pattern to form.Usually in this structure, also comprise safety function part such as hologram.Smart card is then by adding microprocessor and chip is made after stacked, wherein above-mentioned interpolation is by grinding a recess and the integrated chip plate being installed and integrated circuit is realized.IC can be attached to antenna when needed, can communicate by letter via RF in contactless mode to allow IC.The preferred material that is used for existing thermosphere stacking comprises the layer made from polyvinyl chloride (PVC), polypropylene, Merlon, polyester and fusion temperature other suitable plastic between 110 ℃ to 190 ℃.

The heat lamination technology that is used for fabrication has been represented the installation card production capacity of main flow in the global range.Developed other technologies such as relying on bonding cold stacked of adhesive, but these technologies only realize in limited scope also.If any new card structure can be compatible mutually just more useful with existing heat lamination technology.

The expectation attribute of institute's complete layer stacking comprises high glaze, distortionless figure and even level and smooth surface.In addition, for financial transaction card and identification card, this structure also must be according to the ISO standard.There is the iso standard at the outpost of the tax office to define various performance requirements, such as temperature and moistureproof ability, flexibility, stacked integrality, flatness and physical size.The range of application of identification card will determine the physical characteristic of card.The physical characteristic (ID-1, ID-2 and ID-3) of card is described in ISO/IEC 7810:2003 identification card-physical characteristic to some extent.The test of card to band magnetic stripe, integrated circuit or optical memory is described in ISO/IEC 10373 identification cards-method of testing to some extent.The requirement of contact in the integrated circuit card then is suitable for the integrated circuit card of ISO/IEC 7816-1 identification card-contact-carrying.The standard of relevant protruding lettering symbol is then in ISO/IEC 7811-1:2002 identification card-record technology-part 1: provide in the type.ISO 7813 has stated the requirement that the financial transaction calorie requirement reaches.And ISO/IEC 7501 is applicable to Machine Readable Travel Documents, such as passport and visa.Another kind of identification card is the flexible thin card (TFC) that is suitable for ISO/IEC 15457.Other relevant standards are explained in appendix A.All these standards all are incorporated in this as a reference.

Can when finishing, this heat lamination technology bring great difficulty at the electronic unit of incorporating into before the heat lamination such as integrated circuit (IC), antenna, battery, display, switch and other circuit.Main difficulty is that the various thermal conduction characteristic by the various height of different parts and institute's materials used is caused.Unless the problems referred to above are fully solved, otherwise to electronic unit place in it treat stacked each layer execution heat lamination technology will cause blemish, to unacceptable distortion of internal part or damage.

RFID antenna and their chip are incorporated the thermosphere stacking in advance into.The antenna of one of copper cash, etching metal or printed silver can be connected to small IC usually, and this small IC is provided as an insert and is sandwiched in this structure as discrete layer.Heat lamination technology produces acceptable result to RFID because IC can be limited in a less zone and antenna can be done very thin.Yet more complicated structure can be difficult to produce the result that can allow the people receive owing to quantity and the vision and the ISO quality standard big or small and that will reach of each parts.

Be used for the additive method that electronic unit is incorporated in the card is related to by the mechanical means formation cavity such as grinding.A kind of in these class methods grinds card nuclear core to produce a cavity that is used for holding electronic unit.After having placed each parts, just add perfusion fluid to unnecessary milling zone so that this structure flatten.This method is relatively slow, the production cost height, and need more manufacturing process than simple laminating method.

Several different methods has been proposed in order to realize meticulousr electronic unit is incorporated into the expectation of card structure.German with reference to Patentschrift DE 19923138 C1 and Offenlegungsschrift DE 10219306 A1 teachings a kind ofly to made up the method for the isolating construction that contains electronic unit subsequently by heat lamination with the loose film of each layer of fusion by utilizing therein.This method is owing to the intrinsic changeability of original material is difficult to a large amount of realize and also need in manufacture process realizing the result that expects than stacked much more additional step.Use separation structure that each electronic unit is installed and be not enough to provide high efficiency, low cost ground to incorporate the renewable product means of electronic unit in this method of adding discrete layer subsequently.

Prior art require to be used the film that has specific thicknesses, and the thickness of these films may be not accurately mate with the thickness of each parts.In order to prevent this problem, manufacturer just need specify component thickness to mate each available film.The result that regular meeting during the manufacturing changeability of parts and film does not cause because highly match time.At last, this method is attempted the changeability of compensation individual component and film, but it does not solve the problem that the changeability introduced when using a plurality of parts in hierarchy increases.Itself then needs to consider the tolerance of die separation and placement its manufacturing process.

An appointed thickness that critical aspects is a whole card of requirement of some iso standard.The gross thickness of the card of iso standard appointment is 0.030 ± 0.002 inch.Because the common 0.005 inch every layer thick two-layer graph layer of calorie requirement, common 0.002 inch thick protective clear layer is so only leave the electronics core layer that 0.016 to 0.020 thickness can be used for incorporating into the functional electric subassembly.

This requirement has proposed special challenge to incorporating battery in blocking into.Current pre-packaged battery structure be generally 0.012 to 0.016 inch thick, such residual thickness that leaves just is not enough to embed battery pack easily and provides enough opacities to hide these parts.In addition, existing pack technology can cause higher package dimension changeability, and this must be considered in lamination process.

Specify flexible iso standard also to propose special challenge to electronic unit being incorporated into card.Circuit level is an importance of required consideration when making flexible product.Lamination process must generate the structure that can minimize each parts upper stress.And in card, can comprise various electronic units, such as IC, antenna, switch, battery pack, magnetic stripe emulator and display.Every kind of parts all may have different thickness, size and flexible, but must be encapsulated in the card again and the entire card flexibility that obtains expecting in the electric integrated level that keeps electronic circuit.

Expect very much display is incorporated into as the part of some card Electronic Packaging.Traditional display technology is unsuitable for incorporating into the card in accordance with ISO.Existing display has many restrictions inherently.For integrated display successfully, preferred display should be flexible, uses lower power to minimize the demand to battery pack, can below 3V, work minimizing required electronic unit quantity, and can be stacked with current process heat.

So just need a kind of like this electronics nuclear cored structure that have the electronic unit that is associated and comprise display, this structure can and reach the iso standard of relevant financial transaction card and/or identification card by heat lamination.More specifically, the card producing method that pays card to the user by applied customization final graphics layer needs a kind of electronics nuclear cored structure that the function that satisfies consumer demand can be provided.

Summary of the invention

The present invention relates to a kind of layering thin type structure that the lamination unit that contains multiple electronic unit is provided.The present invention is used for a kind of electronics nuclear of High-efficient Production cored structure, and this structure provides the electric function of various fiscards with other application appointments, has essential structure integrated level and allow to finish each layer that will be employed when still requiring in accordance with dimensional requirement, flexibility and other concrete physics of using by each standard and/or customer requirements appointment.In addition, because all elements of hierarchy and parts not only can be printed in the common conventional track but also can be added into this track easily, so just can be efficiently, fast and this structure of attainable generation.

This structure comprises the suitable flexible top flat that is laminated to the flexible substrate of adjacent bottom covering surfaces and is suitable for being laminated to the adjacent upper covering surfaces.The electronic unit that embeds is laminated between flexible substrate and the flexible top flat.Between above-mentioned two, can comprise various parts, such as switch, magnetic stripe emulator, antenna, display, intelligent card chip or other inputs or data processing device.

In a non-limiting example, electronics nuclear cored structure has display unit, and this display unit has and the tie point of the integrated circuit of driving display and the electric trace that leads to power supply from these tie points.Display can form by printing a plurality of pixels, and wherein these pixels are connected to display reception tie point ordinatedly or may be operably coupled to driver ic.In addition, at least one preformed parts brace be operably connected to display unit and be fixed on substrate and top flat between, wherein this parts brace has two or more surfaces and be printed with electric trace on its one or more surface.Resilient coating is placed between substrate and the top flat, and the height change of each parts in thickness difference between each parts and the display unit is made and be used to compensate to this resilient coating by formable material, thereby realize the expectation gross thickness of this hierarchy in reproducible mode.

The invention still further relates to a kind of manufacturing and have the method for the thin, layered structure of display or other electronic units, this method has attached integrated circuit and realizes in order to the display unit of driving display by flexible substrate being provided and providing, and this display is to form by the trace that printing has a plurality of pixels, the corresponding electrochemistry China ink layer of electrode and may be operably coupled to integrated circuit and each pixel.The power supply that provides electricity to may be operably coupled to integrated circuit also is provided this method, at least one cover layer that contiguous display unit inserts is provided and has one or more outsides or inner surface, each surface has the one or more printing electricity parts that may be operably coupled in said integrated circuit, power supply and the display.One deck resilient coating is combined into a lamination unit by inserting at least betwixt for substrate, electronic unit, power supply and cover layer.Form resilient coating be used for the compensate for electronic parts change in size and the scope of the total vertical dimension that is suitable for realizing that lamination unit is expected is provided with himself vertical dimension.

In another embodiment, the invention still further relates to and make a kind of thin, layered structure that has display or other electronic units, this manufacture process is to have attached integrated circuit and realize in order to the display unit of driving display by flexible substrate being provided and providing, and this display is to form by the trace that printing has a plurality of pixels, the corresponding electrochemistry China ink layer of electrode and may be operably coupled to integrated circuit and each pixel.This method comprises that also power supply that provides electricity to may be operably coupled to integrated circuit and the one or more printing electricity parts that may be operably coupled in said integrated circuit, power supply and the display by printing on one or more outsides or inner surface provide at least one cover layer that contiguous display unit inserts.One deck resilient coating is combined into a lamination unit by inserting at least betwixt for substrate, display unit, power supply and cover layer.Resilient coating is formed and the stacked so that change in size of compensated display cell, power supply and other electronic units and the scope of the total vertical dimension that is suitable for realizing that lamination unit is expected is provided with himself vertical dimension.

In an alternative embodiment of the invention that also can use in card, the interconnection circuit that is provided by hierarchy is implemented the IC number that occurs in this structure to minimize.For example, existing smart card requires to communicate with the reader structure of card structure outside, and this provides the contact chip plate or realizes by contactless antenna.Traditional smart card IC is positioned on the chip board, and comprising software provides communication protocol with reader, and carries out such as encrypting and the function of storing value calculating.Many electronic units such as display or magnetic stripe emulator require their function of IC control.The present invention allows the combination of all parts on the IC to carry out all essential controls, communication and data processing function.Communication then provide the chip board of standardization contact---to need not IC, antenna or simulator---by installation and in hierarchy, provide with this structure in be in the IC in other places interconnection circuit realize.

Resilient coating is employed with liquid state by printing technology and is fluid in lamination process filling the space and to even up this structure, realizes unified expectation thickness under the situation about changing with free size thereby flow at resilient coating.After having used resilient coating and being provided with suitable thickness, cushioning layer material is cured in order to handle and finally during cascade with each parts fix in position.Can use one or more resilient coatings.After using cushioning layer material, can use roll and/or any other print steps to realize desired size.The printing electric component can relate to the printing conductive trace on two or more outsides or inner surface, perhaps resistive or dielectric substance, and they can form the parts of expectation together with other printed layers, comprise antenna, capacitor, display or resistor.Battery pack also can be by using printing technology to form to each the battery material layer that comprises anode, negative electrode, current-collector and electrolyte.Resilient coating should be compatible mutually with the plastics as core layer, particularly in heat lamination technology.

Electronics nuclear cored structure material can form pack when using printing technology to form battery pack.Resilient coating also can form all or part of sealing to comprise the electrolyte of this battery pack before stacked final.Resilient coating can solidify have enough intensity with allow be laminated to be distributed to consumer or other people final card product before to the processing of electronics nuclear cored structure.

The accompanying drawing summary

Fig. 1 is the cross-sectional schematic side view of display unit parts.

Fig. 2 A is the cross-sectional schematic side view that has merged the structure of the present invention of display unit and battery pack.

Fig. 2 B is the schematic diagram vertical view that has merged the structure of the present invention of display unit.

Fig. 3 is the schematic, exploded that is used for a kind of structure of the present invention that has merged display unit.

Fig. 4 has merged interconnection circuit load layer 140 and 145 and the schematic plan that is used for a kind of structure of the present invention of pre-packaged battery pack.

Fig. 5 is the schematic, exploded that is used for another kind of structure of the present invention that has merged display unit and printed battery.

Fig. 6 is the exemplary cross section end view as part assembling structure of the present invention among Fig. 2 A.

Fig. 7 be have the host buffer layer that between top group piece installing layer and bottom group piece installing layer, illustrates as Fig. 2 A in the exemplary cross section exploded view of part assembling structure of the present invention.

Fig. 8 has the exemplary cross section exploded view as part assembling structure of the present invention among Fig. 2 A that the host buffer layer that is applied to top group piece installing layer is shown.

Fig. 9 is the exemplary cross section end view as package assembly of the present invention among Fig. 2 A that has merged the host buffer layer.

Figure 10 be have the host buffer layer that between this each layer of package assembly, illustrates and time resilient coating as Fig. 2 A in the exemplary cross section exploded view of part assembling structure of the present invention.

Figure 11 is the exemplary cross section end view as package assembly of the present invention among Fig. 2 A that has merged host buffer layer and time resilient coating.

Figure 12 is the schematic plan as the display unit among Fig. 2 B 160.

Figure 13 is the diagram of electrochemical cell of the present invention.

Figure 14 is the cross-sectional view of an electrochemical cell.

Figure 15 A and 15B are the diagrams of the electrochemical cell of two kinds of electrical interconnections of the present invention.

Figure 16 A is the diagram of the chip board structure of smart card routine.

Figure 16 B is being used for of using in the electronics nuclear core in one embodiment of the present invention provides the demonstration of IC parts and the schematic plan view of fixing circuit to smart card.

Figure 17 is the schematic, exploded that has merged an above battery pack and another structure of battery pack interconnection is provided in one embodiment of the present invention.

Detailed description of the present invention

Introduce

The invention provides a kind of by electronic unit is incorporated into can by existing technology easily the electronics nuclear cored structure of heat lamination overcome the solution of the various defectives of prior art.This structure comprises a kind of device, and this device comprises the electronic unit of a plurality of expectations, such as display, battery pack or other power supplys, integrated circuit, switch, magnetic stripe emulator, antenna, intelligent chip or other input equipments.This structure comprises uses the variation of each stacked resilient coating with each layer of bridge joint and compensating unit size.Also merge pack as the part of this core layer structure and use printed electronic circuit as the part of this electronics core layer to influence desired characteristics.

As mentioned above, can incorporate multiple parts into this structure.In a nonrestrictive execution mode, display can be included in this stratification structure.Yet those of ordinary skills should be realized that by the present invention and do not comprise display in a plurality of stratification structure applications that this provides.

Display unit can be used as the sub-assembly of the electronics nuclear cored structure that embeds electronic unit and can handle it by the conventional heat lamination technology of each layer with other and meets relevant iso standard.This display unit can form the focus of smart card, label or other thin type information display structures and contain various parts.Typical parts comprise the combination of IC, display, battery pack, switch, antenna and connecting circuit.

The required IC of a certain concrete electronics nuclear core depends on terminal applies.In some cases, the chip more than two or two is necessary for carrying out required function.First will generate and/or send data based on the outside input usually.For example, in a kind of card, microprocessor after the switch input on the card from then on based on pre-programmed algorithm generation Trading Authorization number.These data are sent to display driver chip subsequently, and this chip changes into display image with data flow.Alternatively, the radio frequency receiver circuit can or obtain signal and this signal is changed into data flow and offer display driving software from specific reader from broadcasts radio waves.In other cases, single chip can not only be used to generate necessary data but also can generate desired value by driving display.If display is positioned in this structure, then IC can be used for coming and reader communication by contact mat, RF image or magnetic stripe emulator.Electronics nuclear cored structure contains needs dynamic communication to the IC that blocks external equipment therein.

Challenge comes from the different parts in the structure with change in elevation, and any one parts is all because the fabrication tolerance of each parts and film and have space variance inherently.More specifically, the IC parts do not have perfect uniformity.The variation of IC height mainly contains two sources: the difference of die height and by being attached to the caused variation of substrate.The variation of die height is the result of tolerance during silicon wafer grinds and polishes.The height change that is caused by attached die becomes along with the method for being utilized.Under the situation of utilizing the wire-bonded technology, loop height and adhesive bonding method will be introduced variation.The flip-chip attachment method can change because of the variation of tube core projection and the joining technique that utilized.In the above two kinds of cases, the use of sealant all will provide significant extra the variation.The die height that is generally used for being attached to each parts is about 0.007 to 0.012 inch when no sealant.

The operable a kind of display that comprises the electrochemistry ink of the present invention discloses by in United States Patent (USP) 6.639.709 number and 6.744.549 number and U.S. Patent Publication the 2002/0171081st A1 number preceding, though scope of the present invention can also comprise other Display Techniques.Can generate each display by the conventional typography that some height change is introduced in meeting.Yet preferred display shows the significant advantage that is higher than other display technologies for this application.These advantages comprise flexibility, low-power requirements and the strong construction of standing heat lamination technology.The exemplary height of preferred display is about 0.006 inch (0.150mm).This height of display is understood slight modification by the variation of printing height and the height change of each individual components of display such as backboard film, tin indium oxide (ITO) header board film and adhesive seal pad.

Notice that this display can form with electrochemical particular ink printing.Except IC and some small-sized pad that is associated with IC and display and trace, other structures that are described on this each layer of making or assembling also can link together by laminating adhesive or the other materials of having used printing technology by printing process formation and each layer.Suitable printing process comprises screen printing, the amine benzene art of printing and intaglio art.Use these methods just can realize a large amount of, the High-efficient Production of this structure, and need not to make normally used clean of these functional structures and specific apparatus for forming thin film.That is to say, can realize to be worked into easily effective, the scalable production in enormous quantities of cost of the nuclear cored structure in the final card.

Outer

Can illustrate best from Fig. 2 A, the skin of structure 100 described here is flexible substrate 150 and flexible top flat 110.These layers are made by PVC, polypropylene or other suitable thermoplastics usually.Every layer thickness all is about 1.5 Mills or 3 Mills, and preferred thickness is about 2 Mills.Shown in Fig. 2 A, outer 110 and 150 have sandwiched various electronic units in the centre, such as being based upon on the flexible circuit substrate layer 140 and comprising display 170 and the display unit 160 of IC 180, battery pack 190 and each interior layer, for example first cover layer 120 and second cover layer 130.

When being applied to financial transaction card or reach other cards of iso standard, these sheets are not the final skin that offers consumer or other people card.On the contrary, their meetings are covered by a graph layer and can be comprised the transparent PVC layer as shown in Figure 5.Just can realize graph layer and outer field combination by these figures of preprinted on skin, and this also within the scope of the invention.In the case, skin is 0.006 to 0.008 inch.Damp-proof layer can be independent film, but preferably is added as the unified coating on interior layer 110 and 150.When being applied to label, can use other devices of graphic inks or hiding each internal part to generate each graph layer.

Damp-proof layer was introduced into as each layer independently in the time spent of doing that power supply is printed and electronics nuclear core plays pack.This moisture barrier coatings is intended to keep the chemical property of battery pack and prevents that moisture content from escaping to environment from battery pack electrolyte.If there is not damp-proof layer, battery pack will lose moisture content in time, thereby causes the deterioration of battery performance.Acceptable moisture barrier coatings in this area known and comprise that metal is aluminized, paper tinsel and other specific coatings of being applied to each film.Though made reference to anti-" tide " layer, this contained that any volatile materials of preventing to can be used for the battery pack reaction and can influence the battery pack function when it is escaped overflows layer.Pre-packaged battery pack has the moisture barrier coatings of incorporating pack into, therefore need not extra moisture barrier coatings.

Display unit

An aspect of this structure is to use display unit 160, is included in display 170 and drive IC 180 in the substrate 140 for preparing.Display unit 160 is positioned on the flexible circuit layer 140 as shown in Figure 3.As shown in figure 12, typical display unit 160 comprises the copper etching flexible circuit that generates by technology known in the art on flexible circuit layer 140.The copper flexibility provides with the attached closely pad of the interval utmost point and has been attached to IC 180 necessary trace resolution.The size of the attached pad on the typical case IC can change to some extent, and interval is from having 0.005 inch 0.005 inch pad at 0.002 inch the pad that has 0.002 inch interval between each pad to each pad.The trend of semi-conductor industry is that the size of pad and the distance between each pad are all dwindled continuing.The etch copper flexible circuit is known and can generate required line at interval in this area.In addition, the etching metal sputtered film also can play the effect of required display circuit and attached die substrate.Suitable back veneer material requires minimum 2 Mill lines and trace resolution at interval, and being suitable for being bonded to IC during attach process, and resistivity should be less than 100 ohms per square Mills.

So display unit 160 is just incorporated into current that generated by each technology except that printing and as two base parts (outside membrane removal or the sheet material) of described printing and lamination process required input.First kind parts are the IC that need specific clean room production facility at present.Second class is the etch copper flexible substrates.The copper substrate that is used for display unit 160 of the present invention can generate by etching backboard shown in Figure 1 at first, and this backboard is conductivity foliation substrate known in this area and is called the copper flexibility by those of ordinary skills usually.Backboard contains pixel trace 250 as electrodes for display, is used for the attachment region of IC 180 and is used for the interconnection of pixel trace to drive IC.The input lead that is used for drive IC is brought into first edge 280 of display unit 160 for be attached to the remaining circuit element that this electronics is examined the core substrate subsequently.

" pixel " of relevant as used herein display unit 160 refers to any display element of any geometry that can independent electric control, such as display element 260 and 270.So pixel display unit can be the polygon of circular, square, elongation or can be used for forming any other shape of image characters or the icon that self comprises or the Any shape of character with other pixels.Can be to the realization of the electric control of pixel by on IC, providing special-purpose I/O or by the row and column addressing is provided, such as passive matrix or multiplex electronics design.

The display part 170 of display unit 160 is assembled on the pixel trace 250 to finish this display structure by printing electrochemistry ink, printing adhesion sealing gasket and at stacked transparency conducting layer on the backboard of patterning.Be suitable for the various technology such as flip-chip or wire-bonded technology known in this area subsequently and come attached display driver IC 180.Usually create display unit 160 in the contiguous rectangle on sheet that duplicates that contains a plurality of etch copper patterns or volume.Just by single each individual components that turns to, these parts just become the input of printing and lamination process to each display unit after having received its IC.

Can use multiple traditional printing technology to create display 170, comprise the combination in any of silk screen printing, mechanical printing, amine benzene process, notch board technology or these technologies.Preferred typography is the silk screen printing of carrying out via plate method or spinning solution.The ink that uses is at United States Patent (USP) the 6th, 879, the electrochemistry ink of describing in No. 424.The further details of relevant this display cell structure can be to find out in No. the 11/029th, 201, the U.S. Patent application that is entitled as " Universal Display Module " submitted on January 4th, 2005, and this application is incorporated in this as a reference.

One exemplary printing universal display module is shown in Figure 1 and usually identified by reference number 20.Universal display module 20 comprises backboard 25, conduction and transparent top board substrate 26, the top board conductive layer 28 that comprises at least one electrode, display 30 and a pair of inserts 32 and 34 of being formed and comprise at least one electrode by backboard substrate 22 together with patterning back plane circuitry 24.Alternatively, electrode can form on any of top board or backboard side by side spaced apartly.Universal display module 20 also comprises and being used for the adhesive seal pad (not shown) of top board 26 with backboard 24 sealings.Top board 26 and backboard 24 for example also use conductive epoxy resin (not shown) short circuit to be in the same place.

Power supply

IC chip 180 and other electronic units need power supply to carry out processing or other functions.Can examine at electricity various power supplys are provided in the cored structure, be attached on it in order to absorb rectifier by the energy of launching for the external source of each electronic component wireless energy supply such as having the RF antenna.Another kind of power supply is one or more photocells, can place them on the accessibility nuclear cored structure of the ambient light layer.Another kind of possible power supply is the battery pack 190 of embedded nuclear cored structure.In all cases, power supply usually all the power input trace place on the layer that IC chip 180 is installed on it be connected to this IC.

The battery pack that is suitable for using in smart card requires slim form factor.These battery pack are generally known in the art and common chemical property based on lithium technology or carbon zinc.An example of suitable pre-packaged lithium battery group can be buied from the Solicore company of Florida State Lakeland, and its Part No. is FP252903M002.Suitable pre-packaged battery pack based on the carbon zinc chemical property can be buied from the Thin Battery Technology of Ohio Cleveland, and its Part No. is 1-1-ZC.Other thin battery group technology also is known based on solid-state structure or other electro-chemical systems.Being used for power supply of the present invention can be made of main battery or secondary cell unit.Memory device such as ultracapacitor can be used for making up by reader and charging device.It is the electromotive forces with at least 1.5 volts, the capacity of at least 5 MAHs that the typical case who is used for the suitable power source of conventional IC and miscellaneous part requires, and to have maximum ga(u)ge be 0.016 " the nuclear cored structure.

Can incorporate electronics nuclear core of the present invention into as the battery pack that pre-packaged unit generates.The total thickness of the battery pack that generates is between 0.012 to 0.016 inch.The structure 100 between flexible substrate 150 and the flexible top flat 110 can be inserted or be embedded in to pre-packaged battery pack 190.Alternatively, the chemical constituent of battery pack 190 can comprise that conventional silk screen printing, the printing of amine benzene or intaglio are placed on the stepped construction 100 by each layer and the feature that deposition contains battery pack by various known printing technologies.

The energy of deriving from battery pack is the result of chemical reaction in the battery unit.The active volume of this battery pack and power supply greatly depends on the amount of the pack material that can be used for reacting.To a great extent, the volume that it can be regarded as material.Because Free Region is fixed mostly in card structure, so the expectation of maximum battery group material volume is corresponding to the expectation of maximization thickness.

Battery pack requires encapsulation to comprise pack material and to keep the electrolyte (may be subject to the influence of evaporation) of proper level.Under the situation with slim form factor battery pack insert structure 100, this encapsulation is the shape that encases the pre-packaged film of this material.The thickness of this encapsulating film is generally 0.003 to 0.005 inch, and changing into total battery pack thickness as the result of necessity encapsulation just is 0.006 to 0.010 inch.Be printed in battery pack 190 under the situation of structure 100, layer or film that utilization of the present invention contains electronics nuclear core encase this battery pack, rather than use conventional pack material.

In a kind of known battery pack printing process, as shown in figure 14, the parts of pre-packaged low profile flexible printed battery 301 comprise the watery electrolyte in printed anode 303, printed cathode 305, cathode collector 307, anode collector 308, separator 309 and the separator, and all these are included in the flexible thin pack shell 311.The cathode sets piece installing of carbon zinc battery unit comprises the manganese dioxide active material 305 of cathode collector 307 and electrolysis, and they are by minimum cracking or be not printed onto the cathode collector ink with having cracking and will adhere on the flexible sheets on it.Current-collector 307 uses template, silk screen or other suitable printing equipments to be deposited on the flexible sheets.The prescription of cathode collector ink can be to dispose the material of the electron transfer that interdischarge interval generates cathodic reduction from being enough to.In the carbon zinc battery unit of the manganese dioxide cathodes that uses electrolysis, cathode collector is carbon ink preferably.The gatherer of printing will experience suitable cured subsequently to guarantee enough oven dry and solvent evaporation.What as shown in figure 14, the known method of thin battery group printing still can cause accounting for battery pack thickness important proportion is encapsulation or shell 311.

In the present invention, the otherwise track that is used to examine cored structure is placed pack material during also being used in and setting up the nuclear cored structure.By using the encapsulating film that replaces pre-packaged battery pack among Figure 14 as the film of an electronics nuclear cored structure part, the whole nominal thickness that extra volume can be used for increasing battery capacity or reduces battery pack.An embodiment of the invention are to remove extra encapsulating film by at the rete assembly process pack material being built into electronics nuclear cored structure.

According to the present invention, battery pack can be printed and embed in the some steps between nuclear cored structure tectonic epochs.Figure 17 shows the constitution step 1710 to 1780 according to the embedded battery group of an execution mode shown in Figure 13.Method is in one embodiment utilized silk-screen printing technique.The first step comprises that generation is used for the current-collector of anode and negative electrode.Under the chemically treated situation of carbon zinc, cathode collector is made up of conductive carbon.Current-collector is printed on the layer 110 or 150.In step 1710, the current-collector that illustrates is printed in the basic unit 150.Anode collector is by suitable conductive coating or by using conductive foil to form.Between anode and the negative electrode and the interconnection circuit between each battery use the conductive silver ink to form in step 1720 and the printing of 1770 places, above-mentioned conductive silver ink is such as being the Spraylat XCM-015 that buys from the Spraylat company of New York Pelham.Subsequently at the height of step 1730 printed cathode material with coupling core layer 145.Form anode by placing material with the height that reaches core layer 145 at step 1740 place.In step 1750, use time resilient coating that core layer 145 is laminated to basic unit 150, followingly will make more detailed description to this time resilient coating.

To be placed on the nuclear in-core such as the electric parts of display unit 160 in step 1780, and between each electronic unit and battery pack, form electrical interconnection.If want, can increase battery capacity at the extra cathode material of step 1760 printing of this assembling.Extra cathode material should not surpass the thickness of core layer 130.In case printed the cathode height of expectation, core layer 130 just uses time resilient coating to be laminated to core layer 145.This technology is produced the printed battery that is included in the trap that is formed by each core layer effectively.This battery pack is by adding battery pack electrolyte and adding shim when needed and finish to the trap that forms.Electrolyte can inject by printing or non-printing process.Alternatively, can inject and have suitable viscous agent and make it be gelatinous water.In structure side by side, the moistening battery unit of spacer is also fixing in position electrolyte.In coplanar structure, separation function spare is not only fixed electrolyte in position but also anode and negative electrode can be separated.The pack material of placing is passed through the stacked and sealed of core layer 120 sealed cell unit subsequently.

Those of ordinary skills should be realized that the anode and the negative electrode that can use various battery unit geometries to form battery pack.It should further be appreciated that and in series to produce and to connect each battery unit to increase supply voltage.The variation of battery unit geometry can be produced the anode of geometry side by side and negative electrode or by on the opposite face that anode and negative electrode is printed on each separate layer and use shim to finish battery unit and realize with the production co-planar geometry by (on a surface of layer) between each opposite face.

Under the situation of lithium cells, anode is by forming lithium metal sputtering to the substrate 150 with intended shape.The formation of interconnection is identical with the by way of example with the conductive silver printing of suitable technology such as the silk-screen printing technique of aforementioned use.Negative electrode then use with construct core layer 130,140 with 145 to form similar the becoming layer method and be printed on the core layer 150 of electrolysis liquid trap.

In the zinc battery unit, even anode is still kept conductibility at interdischarge interval under the situation that zinc just is being consumed.The positive contact that forms negative pole end in housing exterior directly links to each other with the zinc China ink, rather than electrically contacts with the anode collector that separates.Under the situation of silk screen printing, for the ink impressionability is determined best aperture openings.Make the viscosity of size that factor that this decision need consider comprises the zinc particulate, ink and realize enough capacity necessary shear and required ink thickness under other flowing properties.The suitable source of other of zinc metal comprises zinc paper tinsel or zinc mesh, and they can be as the anode of battery pack.To can be by between the battery pack tectonic epochs, it being placed on this structure and realizing as picking up a part of placing line (pick-and-place line) such as the deposition of the material of zinc paper tinsel.

For the coplanar electrodes assembling, comprise separator 309 so that still can realize ion flow each electrode of electric insulation simultaneously." coplane " electrode is shared at each core layer apparent surface's main anode surface and the interface zone between the main cathode surface as used herein.(coplanar electrodes are different from electrode side by side, (anode adds current-collector in the main anode assembling in electrode side by side, if any) surface and main cathode are assembled (negative electrode adds current-collector, be positioned at if any) same plane substantially and be printed on directly or indirectly on the monolithic base material).Separator 309 between anode and cathode layer can be papery separator, colloid separator or printing separator.In carbon zinc execution mode, use the electrode assembling that has co-planar arrangement, the papery separator that is surrounded by brown paper can be used as separator.For the carbon zinc battery execution mode in according to the present invention, electrolyte preferably soaks into the solder(ing)acid of separator.

In printing process, can also form the contact of input trace from printed battery to the IC chip 180 that leads.(not shown) in one embodiment, the current-collector that is used for an electrode extends transversely into sealing area, and the second metallicity outer end extends into sealing area and contacts with current-collector in the sealing zone simultaneously.In this execution mode, being used for the mobile conductivity of electric current is provided by the contact of the physics between inside collector and the outer end.(not shown) in another embodiment, current-collector does not have physics to contact with outer end.On the contrary, conductivity is to be provided by the electroconductive binder or the epoxy resin that are positioned at sealing area and two structures of bridge joint to small part.Electrically contacting by the contact that extends to battery pack transverse sealing outside is provided of anode and negative electrode physically separated with electrolyte.It should be understood by one skilled in the art that the contact arrangement that also can realize other.

Anode and cathode external end or contact preferably use the conductive polymer ink based on silver to be printed on the flexible non-conductive polymer substrate.Cathode collector is printed on the external cathode contact, so that this current-collector and external contact overlap in the sealing area of battery unit encapsulation or container at least.In this way, the anode ink is printed on the external anode contact, so that this anode and external contact overlap in the sealing area of cell package or container at least.

Select the shape of cathode collector so that it can fully contact with the negative electrode ink, and can also preferably be formed on the zone that overlaps with negative contact in the sealing area.Oven dry current-collector ink, and in printed cathode ink and oven dry on current-collector subsequently.Be under the situation of co-planar arrangement at each electrode subsequently, separator 309 is placed between anode 303 and the negative electrode 305.

Can electrolyte be introduced battery pack structure by number of ways.In one embodiment, this method comprises that a kind of electrolyte with scheduled volume distributes to by the distribution system in the trap that forms of nuclear core construct.This trap is formed by the die-cut openings in basic unit 150 and each intermediate layer 145,130,120.The total height of trap depends on that each film thickness that is used for layer 145,130,120 is about 10 to 14 Mills.Resilient coating between layer 150/145,145/130 and 130/120 provides the battery pack sealing and prevents the electrolyte leakage of each interlayer.During heat lamination, the fusion that becomes of each battery pack layer and resilient coating is so that provide the sealing of high integrity for battery pack.If necessary, can use negative electrode and the moistening shim of anode that enhancing is provided.Alternatively, electrolyte enough colloid (for example, by using the suitable viscosity adjustment adhesive can not influence chemical property substantially) be printed on anode and the negative electrode by printing process to allow it such as silk screen or block printing.

Switch and other input blocks

Other electric components that can be integrated into electronics nuclear cored structure comprise switch contact shown in Figure 4 200 or provide or receive to the IC chip or to other devices of the input signal of entire circuit, such as transducer.

In many application, switch is the active electron device and opens the power supply of each parts necessary.Can use conventional diaphragm switch technology in the present invention.Can use the switch of various patterns, such as cheese, plate shaped or embossing shape switch.Under the situation of cheese switch, metal dome is placed on usually on the circuit of connecting compression.These domes can not be damaged or permanently damage by pressure each dome by heat lamination.

Alternatively, the electrical contact pad that is used for switch can be printed on layer 145 or be in other suitable layers in precalculated position and the degree of depth in the card.In case heat lamination is finished, can roll a cavity and place this dome and reseal this card with the flush switch dome.So, be non-typography though roll, can at first use critical piece electrogenesis in the next life daughter nucleus cored structure that is printed or is integrated into track.If require this application, this nuclear core just can have one subsequently and be rolled or the die-cut cavity that is used for this dome and still can benefiting from the typography at initial stage.Under the situation of dull and stereotyped switch, switch must be stacked under the situation of not destroying the pad of separating two one side of something of this circuit.Preferably the dome diameter is that 6 millimeters height are 0.018 inch.The dull and stereotyped switch that does not comprise the dome projection that is used to touch also uses the various layers except each layer shown in Figure 3 to make, and comprises flexible circuit layer, spacer layer and short circuit layer respectively.

Extraly or alternatively, each electronic unit can be included in layer of the present invention 145 place.Though each execution mode that illustrates uses display as an electronic unit, also can not deviate from scope of the present invention in conjunction with other devices such as magnetic stripe emulator, RF antenna or biology sensor.

Printed layers and interconnection

The surface of display unit 160 and each volumetric layer can be used for the necessary connecting circuit of bearing electric element.Because structure 100 can comprise multilayer, every layer the front and the back side all can be used for comprising the circuit of printable resistive, dielectric or miscellaneous part.Technology such as the through hole printing can be used for taking conducting channel to another side from the one side of layer.This method is known and by providing the via hole that runs through rete to realize, wherein this rete is electrically connected by providing the electric conducting material that runs through this via hole to realize.This circuit can adopt the form such as the conductive trace of other conductivity, resistive or dielectric substance known in printed silver or this area.Like this, except bring into as pre-assembling seldom several, all elements of stratification structure and parts can be printed on the track, also can be added into this track easily.For example, though IC 180 is current is by the explained hereafter beyond the printing, but also can carry out the part of the installation of this IC 180 as display unit 160 simultaneously in the track that is used to form these other layers of electronics nuclear cored structure, this IC can suitably be integrated into electronics nuclear cored structure thus.

Use typography just can at a high speed and produce each layer that has circuit feature spare that is used for multiple absolute construction in enormous quantities in the mode of sheet and/or volume at low cost.These have electric trace be printed on its one or two lip-deep pre-formation component layer subsequently just can be by individualized and in lamination process, be assembled between substrate and the top flat as mentioned above, and these layers have print structure and the via hole that matches on the position, to be provided between each layer and to lead to appropriately being electrically connected of display unit 160.

Known technology can be used for printing on printed layers or building various elements, comprises display pixel, conductive trace, resistor, switch, battery pack, capacitor and electroconductive binder.These elements or their parts can be printed on to be set up desired structure and is connected necessary use Fig. 2 A and Fig. 3 above-mentioned any layer top or bottom as a reference, and above-mentioned each layer comprises flexible circuit layer 140, first cover layer 120 and second cover layer 130.But these printed elements can also be printed on the extra layer not shown in Figure 3, but with realize by each additional layer more print surface is provided so that more complicated structure be connected.

For example, with reference to figure 3 and Fig. 4, can be formed for the diaphragm of switch 200 thus at first cover layer, 120 printed on top short circuit pads.As another example, can in appropriate location, second cover layer, 130 bottom, print along separate routes, be somebody's turn to do just contiguous flexible circuit layer 140 when assembling along separate routes like this, so that the circuit of expecting is skipped on the flexible circuit layer 140.Can also connect and each parts may be operably coupled to flexible circuit layer 140 to form at various other the parts of second cover layer, 130 bottoms printings, such as the electrode that is used for display 170, resistor, capacitor and antenna.In addition, the follow-up trace of printing just can form more complicated connection on same position to allow by printing transposition insulator on the each several part of expectation layer.

In another execution mode, electroconductive binder can together with non-conductive adhesive patterning in the lump be printed on the bottom of second cover layer 130 so that the electroconductive binder of patterned print can connect the expectation circuit on flexible circuit layer 140 and the layer 130.Can also realize a plurality of other printing structures, be included in the expectation layer and go up printed capacitor or resistor.The element of these printings can be installed at expectation layer upper surface alternatively.

With reference to figure 16A, existing smart card contact Cali with chip board 1610 block 1600 and and the intellignet card fetch (not shown) between form contact point.Microprocessor 1620 is attached to chip board 1610 by other the conventional attached die methods under wire-bonded, flip-chip or the chip board and traditionally by electrically and physically attached so that provide the place for data, processor and the programming that comprises on this card.In some embodiments, also provide colloid 1630 or other adhesives and holder 1640 to fix chip board 1610 and microprocessor 1620.The contact smart card is not connected to intelligent card chip the miscellaneous part in the card at present.Yet may wish this microprocessor is connected to interior other electronic units such as display or biology sensor of card.In these cases, the printed circuit on the core layer 145 can be used for providing the conducting path between intelligent card chip plate and the miscellaneous part such as IC 180.This will more at large describe following.

The battery pack interconnection

As previously mentioned, can connect and produce and connect two or more battery units to increase supply voltage.The geometry of battery unit can change, and with reference to figure 15A, in one embodiment, prints two battery pack and with side by side geometry interconnection.The anode 1550 of the anode 1540 of first battery pack and cathode collector 1560 and second battery pack and cathode collector 1570 are placed abreast and are printed.For these battery pack that are connected in series, conducting bridge 1510 is electrically connected to the anode 1540 of first battery pack to form negative pole end, and provide conducting bridge 1530 to form positive terminal, and the cathode collector 1560 of first battery pack is connected to the anode 1550 of second battery pack by conducting bridge 1520 from the cathode collector 1570 of second battery pack.

With reference to figure 15A and Figure 15 B, form the top of the conducting bridge 1510 of negative pole end as can be seen from anode 1540 guiding core layers 145.The conducting bridge 1530 that the forms positive terminal top (not shown in Figure 15 B) of core layer 145 of also leading.In order to realize running through between two batteries the interconnection of core layer 145, just on core layer 145, provide a through hole 1580.Conducting bridge 1520 bypasses are connected to the cathode collector 1560 of first battery pack under the core layer 145 by visible through hole 1580 among Figure 15 B the anode 1550 of second battery pack on the core layer 145.Similarly, provide and stretch out the cathode collector 1570 of second battery pack of conducting bridge 1530 under core layer 145 and bypass extends to the upper surface of core layer 145 to form positive terminal at these core layer 145 tops by through hole 1590.

Conducting bridge 1510,1520 and 1530 can use the conductive silver ink such as Spraylat XCM-01 to form.Referring to Figure 17, step 1720 and 1770 shows the printing of setting up these conducting bridges of a sequence part as the nuclear cored structure.Also show through hole 1580 and 1590 in the core layer 145 of Figure 17, they allow conductive ink to create the electrical connection that runs through core layer 145.

Abovely conducting bridge 1510,1520 and 1530 is described with reference to the interconnection battery pack that runs through core layer 145.Yet it will be recognized by those of ordinary skills these principles of electric conducting material guiding being crossed and running through each layer of this stepped construction and also can be applicable to other electric parts of the present invention and other layers.

Intelligent card in processing

Connecting under the electronic unit the comprised microprocessor situation of (such as, the microprocessor of driving display), the contact intelligent card chip can be removed from this structure.With reference to figure 16A, in this execution mode of the present invention, chip board 1610 is used to reader that the standard contact interface is provided at this, but does not have the back side that traditional smart card microprocessor 1620 is attached to this chip board.The microprocessor that is used to control display or miscellaneous part is served these two purposes that main memory is used for the software of element control and is usually located at the software that being used in the intelligent chip communicate by letter with external reader.

With reference to figure 16B, can use IC 180 to replace at present by the performed processing of integrated circuit in existing " smart card ".The physical structure of existing smart card is specified by iso standard 7810,7816/1 and 7816/2 usually.This structure is generally by two elements that embed in the card, and promptly printed circuit and integrated circuit (IC) chip 180 are formed.Referring to Figure 16 B, chip board 1610 is electrically connected with contact 1650, and this just allows the processing capacity of IC 180 or arrives plate 1610 from the signal of switch 1660 when chip board is positioned at standard reader.

Printed circuit shown in Figure 16 B is observed the iso standard 7816/3 that five tie points are provided for power supply and data.This chip board circuit is fixed in the groove that is provided on the card and is burned and is filled with in electric conducting material and the circuit chip by the sealing of contact projection by hermetic type.Printed circuit protective circuit chip avoids the influence of mechanical stress and static.Finish by " chip board " that comprise the contact that covers on the printed circuit with communicating by letter of chip.

Chip board is as the contact mat between card receiver equipment (CAD) or the card reader.Integrated circuit (IC) chip provides logic and function as the means of communication between card and the reader.Chip also contains suitable encipheror and other necessary security procedures.

According to the present invention, IC 180 driving displays 170.Yet also the demonstration processing capacity of IC 180 can be combined with the processing capacity of existing " smart card " integrated circuit.Two chips though in individual card, can coexist, if require smart card with such as other chip communications of display driver IC 180, then each data wire need connect by one group of trace.As mentioned above, the existing chip plate has 6 or 8 connections using for this chip, and they comprise power supply or other order wires.

For fear of the shortcoming of two independent IC, display driver IC 180 can be designed to comprise and existing intelligent card chip identical functions and memory.All programmings all can be included in the IC 180 on the intelligent card chip at present, remove second microprocessor thus.In order to realize this purpose, the chip board that meets smart card contact requirement is installed in the opening in flexible top flat 110, but is not had the IC that is associated.The processor that except IC 180, no longer needs other.Can on the surface of layer 145, second cover layer 130 and/or flexible circuit layer 140, print from the chip board to IC 180 and be connected, to allow to be used for the signal inflow and outflow IC 180 of standard intelligent card agreement with the suitable of battery pack 190.

Magnetic stripe emulator

As mentioned above, in nuclear cored structure of the present invention, can comprise multiple electric parts.A kind of suitable components can be such as at United States Patent (USP) the 4th, 701, the magnetic stripe emulator of equipment described in No. 601.Have magnetic stripe emulator card can with have in order to read and to use in the lump with the transaction terminal of the transducer that connects the magnetic stripe interface.Card can comprise the converter that generates and be coded in the corresponding variation magnetic field of information on the magnetic stripe usually.Under situation of the present invention, IC 180 extracts the transaction data that is stored in the memory and output signal is offered converter.Converter generates and the corresponding variation magnetic field of this transaction information, and wherein this transaction information is to be read by the transducer in the transaction terminal.So just generated the nuclear cored structure that comprises the magnetic stripe emulator that is used for the card application.

Biology sensor

Can be integrated into the electric parts of another kind of the present invention and be any in the various biology sensors.In one embodiment, biology sensor is to be designed for the micropressure sensor of supporting captured fingerprint image.The example of this a kind of appropriate sensor is that this transducer can embed the equipment based on microprocessor by the FidelicaImage Sensor model 3002 of the Fidelica Microsystems company production of California Milpitas.When with applicable host part when integrated, transducer allows the user to carry out multiple digital certificate safety function.Similarly, nuclear cored structure of the present invention can comprise this characteristic under the situation of card application need or expectation.

Resilient coating

Because the spatial character that different parts and film have nothing in common with each other and because each individual components and be used for the variation that the ISO requirement of gained card flatness produces in different examples, the assembling of structure 100 comprises resilient coating.These shapable layers are providing size (referring to Fig. 2 A) balanced and specific " H " that permission realizes as records to top flat 110 outsides from substrate 150 outsides in electronics nuclear cored structure among the various parts.

To be applied to such as the flowed padded coaming of adhesive in the structure 100 between the two-layer or multilayer.Variation as described below, that buffer layer conditions occurs in any production batch of every kind of parts and film.For example, the height of IC 180 may be skimble-scamble or be positioned at the nominal dimension of expectation, but this variation can be compensated by resilient coating.The height dimension H of expectation can realize by the buffering at the multilayer place; Because the size that size that all as described below being laminated in together of each layer of structure 100, flowable adhesive phase are each absorption of various parts and layer to be surpassed and filling do not reach.The roll that uses after buffering is used helps to set up desired size.Cavity in the grid of each die-cut layer absorbs the flowed adhesive from the over dimensioning element.These cavitys are designed to even up each element usually.Such as IC, battery pack and display unit.Because each cavity may not be formed the size of accurate each component variation of adaptation, so some can cause the areola of each component ambient to their size a little greatly.These padded coamings that can flow are filled these cavitys and unified structure are provided.

During heat lamination, be used to form the epoxy resin of examining each rete of cored structure and also flow.Can fill by the epoxy resin that in heat lamination technology, flows at the cavity that each component ambient forms.Because this epoxy resin is filled by the cavity that preformed cavity caused, so the possibility of result is owing to the VOLUME LOSS in the flow process causes the unacceptable blemish of card face, such as crack, crackle or depression.So just use the padded coaming that can flow to be filled in the cavity that produces in the nuclear core forming process in advance, removal can cause the volume of these defectives to lack thus.

Following two resilient coatings will be described, host buffer layer and time resilient coating.These resilient coatings can have the thickness of 1.0 to 3.0 Mills and the thickness of 0.25 to 1.0 Mill respectively.The preferred thickness of host buffer layer is 2.5 Mills and the preferred thickness of inferior resilient coating is 0.5 to 1.0 Mill.

The host buffer layer is at first described.With reference to figure 6, in the assembling process of structure 100, flexible top flat 110 is laminated to first cover layer 120 and first cover layer 120 is laminated to second cover layer 130, form top assembled layers 210 thus.Base assembled layers 220 by with all as shown in Figure 6 substrate 150, have display 170 and IC 180 display unit 160 and so on a plurality of elements and stack formation layer by layer.Use conventional lamination techniques that these element layers are stacked, and use roll to realize the expectation thickness of top assembled layers 210 and basic assembled layers 220.

Just as discussed, undesirable change in size can occur in the superimposed elements in these layers.Referring to Fig. 7, host buffer layer 230 is placed between top assembled layers 210 and the basic assembled layers 220 to even up basically and respectively changes and realize acceptable size.The host buffer layer can be used in the laminating adhesive that flows on the top assembled layers 210 as shown in Figure 8 and form.Host buffer layer 230 can by comprise silk screen, cut blocks for printing, the whole bag of tricks of impression or aniline printing is applied to top assembled layers 210.These typographies are used with top assembled layers 210 profiles and are finished as the plate of mirror image profile.Corresponding position is complementary on this plate and the top assembled layers 210, so that the abundant covering of adhesive to top assembled layers 210 grooves is provided.So, though Fig. 7 is in the resilient coating 230 that simple and clear consideration only shows unified thickness.But will have the pattern of material thickness and volume by this layer that said method is used, this pattern is selected to provide more material in order to the position that moves into cavity to a large amount of flowable materials of needs.The host buffer layer provides sufficient padded coaming to guarantee that formed size difference is compensated for and fills with the cavity during the nuclear core forms.

Referring to Fig. 9, top assembled layers 210 and basic assembled layers 220 are merged, and the size that surpasses in host buffer layer 230 each parts of absorption of patterning and the size of lack of fill, fill up height change thus to finish by the determined Desired Height size of roll.Allow any unnecessary padded coaming to ooze out and be trimmed to form the shape of expectation subsequently from the edge of emulsion sheet.

Use resilient coating that the mechanical strength of expectation can also be provided for the electronics nuclear cored structure that obtains at last.Assemble various elements and cavity by providing substantially for the structure of solid, the nuclear cored structure that obtains at last will present very gratifying hardness and mechanical integrity.In addition, use resilient coating each layer to be locked together the electric integrality that has increased the interconnection electronic circuit.Suitable cushioning layer material should have suitable viscosity or other physical characteristics are applied to typography to allow it, and it should flow and curable, thereby helps each nuclear cored structure layer is combined.Yet padded coaming needs not to be permanent adhesives.Cushioning layer material can also mix mutually with PVC or other layers and any extra printing material in the heat lamination process, so that the resin of each rete of this padded coaming and molten state and electric parts is compatible mutually.Multiple material family all is suitable for as padded coaming, such as acrylates, polyurethane rubber, plastisol, polyester or have suitable viscosity to realize other similar materials of printing and cured strength.

Except the host buffer layer 230 that adheres to flexible circuit layer 140, can also be shown in as Figure 10 and 11 and flow between other each layers and adhere to resilient coating 240 a plurality of times.Realize the height dimension expected by the compensation buffering of the multilayer place in structure 100 like this.Inferior resilient coating also is used for during manufacture each layer being bonded together.At last, inferior resilient coating and central roll make to be placed on base top or bottom by the renewable place of production to fixed structure and are separated by on the position of known distance.This expects to use milling or other technology will be very important under with the situation that connects any element in the embedded nuclear cored structure the terminal use.

Except can balanced each parts and the height dimension of layer, host buffer layer 230 and time resilient coating 240 can also be corrected other dimensional problem.For example, want stacked layer punched with the situation that is applicable to IC 180 under, may need " crossing cutting " to allow this light in structure to change places and hold IC." crossing cutting " of appearing in the nuclear of the electronics one by one cored structure changes different with the variation of IC size.Though can form the IC shape with acceptable size, their placement meetings on structure 100 change to some extent, and this will cause the change in location of needs compensation.Therefore, be mounted to this structure and after having used die-cut layer around it, may around it, form cavity at a chip.In the case, resilient coating not only will be filled up the height change of IC as shown in figure 11, also will fill IC 180 cavity volume 290 on every side.

The placement of embodiment 1-separating component and the circuit that becomes multilayer

Consistent with above-mentioned teaching, now shown in the structure that has two synthetic layers, these two layers are shown in Figure 6 to be basic unit 220 and cover layer 210 in the present invention, and they are laminated in subsequently together to form electronics nuclear cored structure.

Electronics nuclear core is constructed by place necessary parts with the suitable configurations that is used for part placement on substrate 150.Substrate can be to pass through heat lamination technology and stacked PVC or other films of each exterior layer.The preferred range of substrate thickness is between 0.001 to 0.005 inch, and preferred thickness is 0.002 inch.Use contact adhesive with each parts fix in position.

The parts that are placed on the substrate 150 comprise diaphragm switch dome, battery pack and display unit.Initial parts are placed and have been determined to alleviate the interval in district (relief area) and the various height that need even up.Expectation but do not require pre-stacked die-cut layer 145 is so that be complementary with the substrate thickness of display unit and battery pack joint.The surface of substrate can comprise and will place the switch base circuit of dome thereon.

Preferential laminating method is to use by UV irradiation, EB irradiation or the permanent laminating adhesive that is heating and curing.Basic unit is stacked can pressurize by the point (nippoint) of nipping that this layer height is set and reduces the potential height change of this layer.

Nuclear core now by at grade and supine display unit contact, battery pack joint and switch contact form.Dome can be placed on the switch and use adhering technique known in this area bonding.So just finished and to be stacked to the basic unit 220 of cover layer 210 in subsequent layer.

Cover layer 210 is printed with required whole connecting circuits in its bottom, and these circuit will be fastened on electrically contacting of switch, battery pack and display unit in the basic unit 220.Cover layer is designed the profile in order to coupling height of display, chipset, battery pack and switch dome.Cover layer is set up with three dimensional form with the film of coupling basic unit or " component layer " with die-cut by stacked.Cover layer has the subgrade of minimal amount based on being placed on parts numbers highly different in the basic unit.Cover layer can be constructed by transparent membrane, thereby the display of permission embedded nuclear core as seen.

Last number of assembling steps is to use stacked basic unit 220 of permanent laminating adhesive and cover layer 210.The adhesive that can flow is that 0.001 to 0.002 inch resilient coating 230 is used for cover layer is bonded to basic unit, and total was nipped a little by the solid that is arranged on 0.018 inch place before hot-melt adhesive.This adhesive can apply by any method in silk screen printing, impression, distribution or the spraying.Three-dimensional structure should be covered the electric contact area adhesive that then do not have fully.

Last laminating adhesive is nonvolatil and can selects from the irradiation setting adhesive family such as UV or EB of solidifying by transparent covering layer.Alternatively, can be applied to a permanent hot-melt object cold when nipping.This hot-melt object is finished the additional benefit that has backflow during the heat lamination step of card in production.All resilient coatings all should be by not disturbing the adhesive of heat lamination technology to form by avoiding the permanent fusion of each layer, and the card that finally obtains must pass through the ISO standard.A kind of adhesive that is suitable for this application is Radcure UV-170-SP.

The material of substrate 150 and teleblem 110 is made of PVC or other plastics of being suitable for heat lamination.Alternatively, the heat seal such as polyvinyl alcohol (PVA) or other commercial heat seal coating can be applied on the outermost surface to guarantee finishing the appropriately bonding of surface during the heat lamination.

Embodiment 2-planar circuit and electrical connection

In another embodiment, the structure of basic unit 220 is modified by the whole connecting circuit of printing on this structure top, and this connecting circuit will match with the tie point of display unit and battery pack parts and contain the pedestal that is useful on switch.Electrical connection between connecting circuit and parts distributes (needle dispensing) to provide by the syringe needle that conducting path is provided to each connection subsequently.It is identical with embodiment 1 that remaining structure keeps.

Embodiment 1 and 2 shows the intrinsic flexibility at electronics nuclear in-core printed circuit.Electronics nuclear core has 5 to 7 discrete surface in order to printed component part before final assembling usually.This execution mode of the present invention provides at nuclear in-core each circuit of stratification and has used all usable surface to be fit to the ability of necessary circuit.This must contain in can be used for the zone of smart card under the situation made from extra care circuit of great use.This execution mode can effectively provide 5 to 7 times capacity compared with the single surface of routine.

Electrical connection between nuclear core each layer can be obtained by the independent via hole that introducing runs through each layer.This practice runs through each expectation layer and aims at the hole of the circuit that will connect and fill these holes with conductive epoxy resin or other materials and realize so that the via hole circuit paths to be provided by getting out or going out.

Embodiment 3-embedded carbon/zinc battery group

As mentioned above, be suitable for the interior battery pack of using of smart card and have 0.012 to 0.016 gross thickness usually.In this gross thickness, form by the encapsulating film that is used to seal this battery pack by 0.006 to 0.010 inch.This embodiment for example understand to use core layer as the part of pack with the gross thickness of saving this nuclear core and reduce its complexity.

This structure is based on the described basic unit of Fig. 1 220/ cover layer 210.In basic unit, battery anode and current-collector are deposited on the top of the second film PVC layer 150.On with one deck, negative electrode and current-collector have also been printed respectively.The gross thickness of battery pack layer is 0.006 inch that is complementary with height of display.The battery that needs two separations is with the required 3V voltage of realization system.Adhere to circuit battery pack is connected to other elements.

Structural overburden 210 has the emptying district that is positioned on the battery set electrode alleviating when providing stacked.Final stacked before, battery pack electrolyte is added in the trap to finish the battery pack structure.In case stacked, electrolyte with regard to moistening each battery unit to activate each battery unit.

Embodiment 4-embedded lithium battery group

Use lithium battery group chemical property to have the advantage of every battery unit 2.8V voltage, thereby can simplify the structure of nuclear core.Yet, because this chemical property that lithium can react with water, thereby require assembled battery in the hothouse environment.

Therefore, this just need be pre-formed the battery pack parts before being integrated into the nuclear cored structure.This can be stacked on thick about 0.010 inch nuclear core film with the Copper Foil current collector layer that forms anode on it in preceding sputter and be accomplished by having the lithium metal.This nuclear core film is die-cut into the shape of battery pack and forms a trap.This trap is filled and is sealed with the Copper Foil that forms cathode collector with electrolyte and cathode material subsequently.The structural thickness that obtains at last is 0.010 inch and is that the battery of 0.014 inch separation has bigger capacity than gross thickness.

Have the anode connection on the present one surface of above-mentioned battery pack layer and on its opposite side, have the negative electrode connection.Electrical connection to bottom electrode produces by taking circuit to bottom electrode.Electrical connection to top electrodes produces by the via hole that runs through this film being provided and using via hole technical battery to be connected to backboard.

The same with other embodiment, use the resilient coating of 0.001 to 0.002 inch adhesive as described in example 1 above to come stacked cover layer and basic unit.

Embodiment 5-PVC layer

The nuclear cored structure can use various films to construct.By selecting suitable laminating adhesive, successful heat lamination does not require that all layers all reach the fusing point of this film during lamination process.Alternatively, each layer can be made of the film of wherein selecting reaches fusing point and fusion during lamination process each film.Such as polyvinyl chloride and polyacrylic suitable film is known in this area.This lamination process remains unchanged, except laminating adhesive is printed as magnificent husband (waffle) pattern or is printed as other suitable patterns to allow each laminar flow moving and provide suitable surface is used to fuse into.This lamination process also is used to even up each layer, but the main purpose of adhesive is before stacked each layer to be combined.Under the situation of printed battery, the resilient coating adhesive is printed as around the pantostrat of this battery pack to guarantee forming the sealing gasket that comprises battery electrolyte final before stacked.Even this printing is used for also can carrying out under other regional situations of card at pattern.

Conclusion

Described embodiment for example understands of the present invention being printed and the scope and the flexibility of stacked structure.More specifically, the present invention can be used for producing effectively a kind of electronics nuclear cored structure that the electric function that various fiscards and other use appointments is provided, and this structure has required structural intergrity and keeping dimensional requirement, flexibility and other physics with by the concrete application of standard and/or customer requirements appointment to require corresponding to each layer that allows application to finish simultaneously.It will be recognized by those of ordinary skills the parts that to put into practice other and structure and they still are located within the scope of the present invention.

Appendix A

Smart card specification

ISO 7810-is used for being described in identification card characteristic that definition clause defines and this one of the series of standards used in the international exchange that is stuck in.International standard specifies the physical characteristic of identification card to comprise the size of four kinds of sizes of card material, structure, characteristic and card.The nominal dimension that is used for bank card comprises that the edge deburring is no more than each standard of 0.008mm (0.003 inch), surface deflections and signature strip.

ISO/IEC 7811-1 identification card-record technology-part 1: type.This part of ISO/IEC 7811 is to be used for being described in identification card parameter that definition clause defines and this one of the series of standards used in the international exchange that is stuck in.This part of ISO/IEC 7811 has been specified the requirement that is used for identification card epirelief lettering symbol.Protruding lettering symbol is intended to transmit data by using printing machine or reading by vision or machine.It has been considered people and two aspects of machine and has stated minimum requirements.

ISO/IEC 7811-3 identification card-record technology-Di 3 parts: the position of ID-1 card epirelief lettering symbol

ISO 7812 ﹠amp; The position of 7814-magnetic strip material and surface profile

ISO 7813 identification cards-financial transaction card.The shell sizes of appointment financial transaction card should be thick for 0.76 ± 0.08mm (0.030 ± 0003 inch), wide and 54.03mm (2.127 inches) height of 85.47mm (3.375 inches).

Integrated circuit card-the part 1 of ISO 7816-1 identification card-contact-carrying: physical characteristic.Specify the physical characteristic of the integrated circuit card of contact-carrying.It is applicable to that American National Standard is the identification card of the ID-1 card type that possible include type and/or magnetic stripe of identification appointment

Integrated circuit card-the part 2 of ISO/IEC 7816-2 information technology-contact-carrying: the size of contact and position.Be each contact finger sizing, position and the distribution on the integrated circuit card of ID-1 card type.To use in conjunction with ISO/IEC 7816-1.

Integrated circuit card-Di 3 parts of ISO/IEC 7816-3 information technology-contact-carrying: electronic signal and host-host protocol.Specified power and signal structure, and integrated circuit card and such as the information exchange between the interface equipment of terminal.It also covered signal rate, voltage level, current values, odd even conversion, operating process, transmission mechanism and with the communicating by letter of card.

The evolution standard of ISO 14443-1 identification card-proximity (RF) integrated circuit card.-part 1: physical characteristic.Specify the physical characteristic of proximity card (PICC).It is applicable to the identification card of the card type ID-1 that works near Coupling device, this standard should be used in conjunction with ISO/IEC 14443 subsequent sections.The electronics original text can obtain from following: Global Engineering Documents, Inc, http://www.global.ihs.com.

The evolution standard of ISO14443-2 identification card-proximity integrated circuit card.-part 2: radio frequency interface and parameter.The electrical characteristics of two kinds of contactless interfaces between proximity card and the proximity Coupling device have been described.In addition, also comprise power and two-way communication.Appointment is provided for the electromagnetic nature of the two-way communication between power and proximity Coupling device (PCD) and the proximity card (PICC).ISO/IEC 14443 these parts should be used in conjunction with ISO/IEC 14443 other parts.ISO/IEC 14443 these parts are not specified the approach that generates coupled electromagnetic field, and also not specifying can be with the approach of observing electromagnetic radiation and human exposure rule of country's variation.

The evolution standard of ISO 14443-3 identification card-proximity integrated circuit card.-Di 3 parts: electronic signal and host-host protocol

The evolution standard of ISO 14443-3 identification card-proximity integrated circuit card.-Di 4 parts: security feature.The poll that (a) enters the proximity card (PICC) of proximity Coupling device (PCD) electromagnetic field is described; (b) employed byte format of the starting stage of between PCD and PICC, communicating by letter, frame and timing; (c) initial request and to the answer of request command content; (d) method (anticollision) that among each PICC, detects a PICC and communicate with; (e) other parameters that signal post needs between initialization PICC and the PCD; And (f) based on using the optional approach that criterion is come facility and quicken to select a PICC among each PICC.

ISO/IEC 10373 identification cards-method of testing

Integrated circuit card-Di 4 parts of ISO/IEC 7816-4 information technology-identification card-contact-carrying: order between the industry that is used to exchange.Appointment is the half-duplex packet transmission protocol of feature with the specific needs of contactless environment.ISO/IEC 14443 these parts are intended to use and can be used in conjunction with ISO/IEC 14443 other parts the proximity card of type A and type B.

Integrated circuit card-Di 5 parts of ISO/IEC 7816-5 identification card-contact-carrying: the numbering system and the enrollment process that are used to use identification person

Integrated circuit card-Di 6 parts of ISO/IEC 7816-6 identification card-contact-carrying: data element between industry

The ISO 8583:1987 bank card originating information-standard that exchanges messages-the be used for content of financial transaction

Originating information-ISO 8583:1993 financial transaction card exchanges messages standard

ISO/IEC8825-1 information technology-ASN.1 coding rule: the standard of Basic Encoding Rules (BER), classical coding rule (CER) and differentiation coding rule (DER)

ISO/IEC8859 information technology-8 bit byte coded graphics character set

ISO 9362 bankings-bank wire information-bank identification number

Online PIN handles in ISO 9564-1 banking-PIN management and secret-part 1: ATM and the POS system basic principle and requirement

The requirement that off-line PIN handles in ISO 9564-3 banking-PIN management and maintain secrecy the-the 3rd part: ATM and the POS system

ISO/IEC 9796-2:2002 information technology-secrecy technology-have the digital signature scheme-part 2 of message recovery function: based on the mechanism of integer factor decomposition

ISO/IEC 9797-1 information technology-secrecy technology-text authentication code-part 1: the mechanism of using block cipher

The operator scheme of ISO/IEC 10116 information technologies-secrecy technology-n bit groupings cryptographic algorithm

ISO/IEC 10118-3 information technology-secrecy technology-hash function-Di 3 parts: special-purpose hash function

ISO 11568-2:1994 banking-key management equipment (retail)-part 2: the secret key administrative skill of symmetric cryptography

ISO 13491-1 banking-safety encipher equipment (retail)-part 1: notion, requirement and appraisal procedure

ISO 13616 bankings and relevant financial service-International Banks number of the account (IBAN)

The message authentication requirement of ISO 16609 bankings-symmetrical technology of use

Indication code-the part 1 of ISO 639-1 languages title: Alpha-2 sign indicating number.Attention: this standard is brought in constant renewal in by ISO.Additional/change to ISO 639-1:1988: the indication code of languages title can obtain from this network address: http://lcweb.loc.gov/standards/iso639-2/codechanges.html

ISO 3166 country and regional title indication codes thereof

The indication code of ISO 4217 expression currency and fund

FIPS 180-2 secure Hash standard

Claims (31)

1. cored structure is examined in a slim layering, described slim layering nuclear cored structure provides display and is used to drive described display in lamination unit related electronic devices, and described slim layering nuclear cored structure comprises:

But the basic unit of stacking material and top layer;

Display unit has the tie point that links to each other with integrated circuit components, and has the electric trace that is used to be connected to power supply, and described integrated circuit components is used to drive at least one display unit;

At least one preformed parts articulamentum has and is printed on its one or more lip-deep electric traces, and described at least one preformed parts articulamentum operationally is electrically connected to display unit and is fixed between described basic unit and the top layer; And

Resilient coating, be configured between described basic unit and the top layer, described resilient coating is made by formable material, and described formable material compensation thickness between the parts between described basic unit and the top layer is poor, and the expectation gross thickness that allows to be used for described layering nuclear cored structure is implemented.

2. hierarchy as claimed in claim 1 is characterized in that, described at least one display unit forms by printing a plurality of pixels, and described a plurality of pixels operationally are electrically connected to described integrated circuit components.

3. hierarchy as claimed in claim 2 is characterized in that, described a plurality of pixels are connected to display ordinatedly and receive tie point.

4. hierarchy as claimed in claim 1 is characterized in that, described basic unit is suitable for being laminated to adjacent following covering surfaces.

5. hierarchy as claimed in claim 1 is characterized in that, described top layer is suitable for being laminated to adjacent last covering surfaces.

6. hierarchy as claimed in claim 1, it is characterized in that, the chip contact plate is installed in the described nuclear cored structure at least in part, and the electric trace of described hierarchy inside operationally is electrically connected to described chip board the described integrated circuit components that leaves the horizontal placement of described chip board.

7. hierarchy as claimed in claim 6 is characterized in that, described chip contact plate is the contact plate that is used for smart card, and described integrated circuit components is configured in order to carry out the function of smart card.

8. hierarchy as claimed in claim 1 is characterized in that, described parts articulamentum is pre-formed porose, in order to holding each parts, and helps to compensate the thickness difference between the parts between described basic unit and the top layer.

9. hierarchy as claimed in claim 1, it is characterized in that, described parts articulamentum is pre-formed porose, in order to hold each parts, and help to compensate thickness difference between the parts between described basic unit and the top layer, and the described resilient coating cavity that can be shaped and be associated with described hole to fill.

10. hierarchy as claimed in claim 1 is characterized in that, described parts articulamentum has the electric trace that is printed thereon surface and lower surface.

11. a method that is used to make the slim layering nuclear cored structure that has display comprises:

Provide and be suitable for stacked basic unit;

Provide and have attached integrated circuit components in order to drive the display unit of at least one display unit, described display unit forms by printing at least one pixel, the trace that described at least one pixel has corresponding electrochemistry China ink layer and operationally is electrically connected described at least one pixel and described integrated circuit components;

Provide power supply unit, in order to operationally to be electrically connected to described integrated circuit components;

At least one cover layer is provided, be inserted into contiguous described display unit, and the electric parts that have printing on its at least one surface, the electric parts of wherein said printing are operably connected to one or more in described integrated circuit components, described power supply unit and the described display unit; And

By inserting at least one deck resilient coating betwixt and described basic unit, display unit, power supply unit and cover layer are combined into a lamination unit, described resilient coating is shapable, and used variantly, thereby compensate the gauge difference of described parts between described basic unit and the cover layer, and provide the thickness range that is enough to realize being used for the desired total vertical dimension of described lamination unit with himself vertical dimension.

12. method as claimed in claim 11 is characterized in that, the described step of printing at least one pixel comprises that printing operationally is electrically connected to a plurality of pixels of described integrated circuit components.

13. method as claimed in claim 12, it is characterized in that, the described step of printing at least one pixel comprises that printing is connected to a plurality of pixels of described integrated circuit components by electronics operationally, takes this described a plurality of pixel and is connected to display ordinatedly and receives tie point.

14. method as claimed in claim 11, it is characterized in that, also comprise the chip contact plate that is installed at least in part in the described nuclear cored structure is provided, and the electric trace that operationally described chip board is electrically connected to the described hierarchy inside of the described integrated circuit components that is disposed in the position of laterally leaving described chip board.

15. method as claimed in claim 14 is characterized in that, described chip contact plate is the contact plate that is used for smart card, and comprises that the described integrated circuit components of configuration is to carry out the function of smart card.

16. the method for claim 1 is characterized in that, provide tectal described step to comprise to provide be pre-formed porose to hold parts and to help to compensate the layer of the thickness difference between the parts between described basic unit and the top layer.

17. method as claimed in claim 16, it is characterized in that, provide tectal described step to comprise to provide be pre-formed porose, to hold parts and to help to compensate the layer of thickness difference between the parts between described basic unit and the top layer, and described cover layer and described resilient coating are shapable, to fill the cavity that is associated with described hole.

18. method as claimed in claim 17 is characterized in that, describedly is pre-formed porose layer and has the electric trace that is printed thereon on surface and the lower surface.

19. a method that is used to make the slim layering nuclear cored structure that has display comprises:

Provide and be suitable for stacked basic unit;

Provide and have attached integrated circuit components in order to drive the display unit of described display, described display unit forms by printing a plurality of pixels, the trace that described a plurality of pixels have corresponding electrochemistry China ink layer and operationally are electrically connected described pixel and described integrated circuit components;

Provide in order to operationally to be electrically connected with the power supply of power delivery to described integrated circuit;

By at least one tectal more than one on the outside or inner surface printing operationally be electrically connected to one or more electric parts in described integrated circuit components, described power supply unit and the described display unit, provide contiguous described display unit to be inserted into described cover layer; And

By inserting one deck resilient coating at least betwixt, and described basic unit, display unit, power supply unit and cover layer are combined into a lamination unit, described resilient coating can be shaped and be stacked, in order to compensating the size difference of the thickness of described display unit and miscellaneous part between described basic unit and the described cover layer outer surface, and provide the thickness range that is enough to realize being used for the desired total vertical dimension of described lamination unit with himself vertical dimension.

20. method as claimed in claim 19 is characterized in that, described at least one resilient coating is applied by printing technology.

21. method as claimed in claim 19 is characterized in that, described resilient coating becomes in stacked and can flow with cavity filling, thereby and is uniform thickness because the described change in size of the described thickness compensation of described resilient coating allows described structure evened up.

22. method as claimed in claim 19 is characterized in that, a plurality of resilient coatings are printed and flow.

23. method as claimed in claim 19 is characterized in that, uses roll to realize desired size after applying described cushioning layer material.

24. method as claimed in claim 19, it is characterized in that, described on two or more outsides or inner surface the printing electric parts comprise printing conductive trace or resistive or dielectric substance, in order to form the described expectation parts that comprise antenna, resistor and capacitor with other printed layers.

25. method as claimed in claim 19 is characterized in that, also comprises by using printing technology to apply each layer forming the battery pack parts that comprise described anode, negative electrode, current-collector and electrolyte volume.

26. a slim layering nuclear cored structure, described slim layering nuclear cored structure is provided for one or more electronic units of information processing in lamination unit, and described slim layering nuclear cored structure comprises:

But the basic unit of stacking material and top layer;

At least one electronic unit, described at least one electronic unit has tie point and has the electric trace that is used to be connected to power supply unit;

Have at least one the preformed parts articulamentum that is printed on its one or more lip-deep electric traces, described at least one preformed parts articulamentum operationally is electrically connected to described at least one electronic unit and is fixed between described basic unit and the top layer; And

Be configured in the resilient coating between described basic unit and the top layer, described resilient coating is made by formable material and is used to compensate thickness difference between the parts between described basic unit and the top layer, and the expectation gross thickness that allows to be used for described hierarchy is implemented.

27. hierarchy as claimed in claim 26 is characterized in that, described at least one electronic unit is an integrated circuit components.

28. hierarchy as claimed in claim 26 is characterized in that, described at least one electronic unit is a magnetic stripe emulator.

29. hierarchy as claimed in claim 26 is characterized in that, described at least one electronic unit is a biology sensor.

30. hierarchy as claimed in claim 26, it is characterized in that, the chip contact plate is installed in the described nuclear cored structure at least in part, and the electric trace in the described hierarchy operationally is connected to described chip board electronics the described integrated circuit components that leaves the horizontal placement of described chip board.

31. hierarchy as claimed in claim 30 is characterized in that, described chip contact plate is the contact plate that is used for smart card, and described integrated circuit components is configured in order to carry out the function of smart card.

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