CN101374391B - Multilayer wiring board - Google Patents
Multilayer wiring board Download PDFInfo
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- CN101374391B CN101374391B CN2008101459974A CN200810145997A CN101374391B CN 101374391 B CN101374391 B CN 101374391B CN 2008101459974 A CN2008101459974 A CN 2008101459974A CN 200810145997 A CN200810145997 A CN 200810145997A CN 101374391 B CN101374391 B CN 101374391B
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Abstract
The present invention provides a multilayer wiring board in which warpage during reflow soldering can be reduced even if there is no sufficient space for disposing a dummy pattern or if a dummy pattern cannot be disposed. A difference between the ratios of copper remaining in wiring layers causes a difference between the amounts of thermal expansion of the wiring layers. The fiber bundle content of at least one resin base material layer is made different from that of the other resin base material layers, to cause a difference between the amounts of thermal expansion of the resin base material layers. This difference between the amounts of thermal expansion of the resin base material layers is used to cancel the difference between the amounts of thermal expansion of the wiring layers. Thus, warpage of the board during reflow soldering is reduced.
Description
Technical field
The present invention relates to possess the multi-layer wire substrate of accumulation (build-up) structure of the wiring layer more than 2 layers.
Background technology
The multi-layer wire substrate of piling up structure is to be the circuit board that purpose is developed with the various electronic units of high-density installation.The multi-layer wire substrate of this accumulation structure has a plurality of wiring layers that are made of copper wiring and resin and the structure that is superimposed by a plurality of resin base material layers that resin and fibre bundle constitute, and is used in various digital devices or the mobile device.
At first, the multi-layer wire substrate for general accumulation structure describes.Figure 11 illustrates the section of the part of the multi-layer wire substrate 100g that piles up structure (below, according to circumstances be called for short " substrate ").Substrate 100g is the wiring layer (C1～Cn) and (n-1) the resin base material layer [B1～B (n-1)] of layer is stacked under the state that is superimposed of n layer (n is the integer more than 3).Below, under the situation of general name wiring layer and resin base material layer, be expressed as wiring layer C and resin base material layer B respectively.
Wiring layer C is made of the resin 103 of copper wiring 101 and insulating properties.Resin base material layer B constitutes for the resin 103 of varnished insulation in the fibre bundle 102 of shape or non woven fabric shape of weaving cotton cloth.And, in Figure 11,, schematically be illustrated in the state that has flooded resin 103 in the fibre bundle 102 as resin base material layer B.Expression similarly in the accompanying drawing afterwards.
As fibre bundle 102, usually use glass fibre or aramid fibre.In addition, as the resin 103 of insulating properties, use the resin of Thermocurables such as epoxy resin, phenolic resins, polyimides, BT resin.
Usually, the fibre bundle of wiring layer C and the resin base material layer B resin by will being impregnated with insulating properties and the Copper Foil that is formed with wiring figure replace pressurization under the overlapping state, heating forms resin solidification.Constitute the resin 103 of wiring layer C, when pressurization, heating, enter between the wiring figure by a part that is immersed in the resin in the fibre bundle and to form.
And, though not shown, be electrically connected by via (via hole) or the through hole (through hole) that in resin base material layer B, forms between each wiring layer C.In addition, for the structure of the multi-layer wire substrate of above-mentioned accumulation structure, in the specifications " the JPCA specification is piled up wiring plate (term) (test method) " that the industry of (society) NEC circuit can be made, carry out definition at length (with reference to the 2nd page structure example 3,4).
In the stacked typography of resin base material layer B when substrate is made, be divided into: basalis 104 becomes the central stratum of multi-ply construction; And accumulation horizon 105, in the stacked on top of one another of basalis 104.Resin base material for constituting basalis 104 and accumulation horizon 105 has identical situation and different situations.To this, for the resin base material of each layer of accumulation horizon 105, using the containing ratio of fibre bundle is the homogenous material of fixing.
Substrate 100g is in solder reflow process, under electronic unit is parked in state on the surface and the installed surface at the back side temporarily, being configured on reflux band (reflow belt) or the backflow carriage (reflowpallet), being warmed up to more than 220 ℃ and after the welding, cooling to normal temperature again from normal temperature.At this moment, on substrate 100g,, thereby on the thermal expansion amount between wiring layer, produce difference, play thereby produce bending thus because residual copper rate (area of copper wiring accounts for the ratio of the area of wiring layer C integral body) is different in wiring layer separately.Specifically describe the mechanism of the bending that produces substrate with reference to Figure 12.
If relatively constitute copper wiring 101 and the resin 103 of wiring layer C, then resin 103 is bigger than the coefficient of linear expansion of copper wiring 101.Therefore, the wiring layer that residual copper rate is big diminishes because of the thermal expansion amount of temperature load.Therefore, in the substrate 100h shown in Figure 12, be that the thermal expansion amount of upside on border is big with basalis 104, and the thermal expansion amount of downside is little.Therefore, in load under the situation of temperature, substrate is to the upside convex curved.
If under the state that substrate bends when solder reflow process electronic unit is installed, is then reduced the connection reliability between electronic unit and the substrate significantly.This situation becomes the big essential factor of deterioration of the electronic circuit that makes the assembling multi-layer wire substrate.
The bending of the substrate when preventing solder reflow process in the past, was adopted the countermeasure shown in the TOHKEMY 2000-151015 communique.Promptly, as as shown in Figure 11 above-mentioned, in order to make the difference that in each wiring layer C, does not produce the thermal expansion amount that causes because of residual copper rate difference as far as possible, form on wiring layer C and the original copper that the constitutes electronic circuit 101 different illusory figures (dummypattern) 108 that connect up, the residual copper rate that makes each wiring layer C as far as possible.
But on the substrate that the miniaturized electronics that requires the electronic circuit high-density installation is used, the area occupied that electronic unit is installed the weld zone (land) of usefulness increases, and can not guarantee to be provided with enough spaces of illusory figure.In addition, when on substrate, carrying the parts with high-frequency work,, then become the reason that noise takes place, therefore have the restricted problem of illusory figure that is provided with if form illusory figure.In the countermeasure in the past of illusory figure is set, in the bending that reduces substrate, the limit is arranged like this.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of multi-layer wire substrate, under the situation in enough spaces that illusory figure is not set on the wiring layer, perhaps can not be provided with under the situation of illusory figure, also can reduce bending.
In order to achieve the above object, the multi-layer wire substrate that the present invention relates to is characterized in that,
This multi-layer wire substrate serve as reasons n (n is the integer the 4 or more) layer that the resin of the wiring that comprises electric conducting material and insulating properties constitutes wiring layer and to be impregnated with the resin base material layer of (n-1) layer of resin of insulating properties in fibre bundle stacked under the state that is superimposed, wherein
At least 1 layer fibre bundle containing ratio among the resin base material layer of above-mentioned (n-1) layer is different with the fibre bundle containing ratio of other layers.
The multi-layer wire substrate that the present invention relates to is different from the cellulose containing ratio of other resin base material layer by the fibre bundle containing ratio that makes at least 1 layer resin base material layer, produces difference thereby make between the resin base material layer on thermal expansion amount.That is, utilize the difference of the thermal expansion amount of resin base material interlayer to offset difference, thereby can reduce the bending of the substrate in the reflow soldering owing to the thermal expansion amount between the different wiring layers that produce of residual copper rate of separately wiring layer.
Description of drawings
Fig. 1 is the profile that the structure of the multi-layer wire substrate that embodiments of the present invention relate to is shown.
Fig. 2 is the profile that other structures of the multi-layer wire substrate that embodiments of the present invention relate to are shown.
Fig. 3 is the figure of crooked Simulation result that the multi-layer wire substrate of Fig. 2 is shown.
Fig. 4 is the profile that other structures of the multi-layer wire substrate that embodiments of the present invention relate to are shown.
Fig. 5 is the figure of crooked Simulation result that the multi-layer wire substrate of Fig. 4 is shown.
Fig. 6 is the profile that other other structures of the multi-layer wire substrate that embodiments of the present invention relate to are shown.
Fig. 7 is the figure of crooked Simulation result that the multi-layer wire substrate of Fig. 6 is shown.
Fig. 8 is the profile that other other structures of the multi-layer wire substrate that embodiments of the present invention relate to are shown.
Fig. 9 is the figure of crooked Simulation result that the multi-layer wire substrate of Fig. 8 is shown.
Figure 10 is the profile that other other structures of the multi-layer wire substrate that embodiments of the present invention relate to are shown.
Figure 11 is the profile that the basic structure of the multi-layer wire substrate of piling up structure is shown.
Figure 12 is the profile that the structure of multi-layer wire substrate in the past is shown.
Figure 13 is the figure of crooked Simulation result that the multi-layer wire substrate of Figure 12 is shown.
Embodiment
Below, describe for the multi-layer wire substrate that embodiments of the present invention relate to reference to accompanying drawing.Before the structure of the multi-layer wire substrate that relates to for present embodiment describes, the principle of the bending that is used to reduce multi-layer wire substrate is described.
Fig. 1 illustrates the section of the part of the multi-layer wire substrate 100a that the present invention relates to.Substrate 100a is the wiring layer (C1～Cn) and (n-1) the resin base material layer [B1～B (n-1)] of layer is stacked under the state that is superimposed of n layer (n is the integer more than 3).Wiring layer C is made of the resin 103 of copper wiring 101 and insulating properties.Resin base material layer B is made of the resin 103 of varnished insulation in the fibre bundle 102 of shape or non woven fabric shape of weaving cotton cloth in addition.These structures are identical with the structure of the substrate shown in above-mentioned Figure 11, also not change of the function of each structural element in addition.In the explanation afterwards too.
In the multi-layer wire substrate that the present invention relates to, make the fibre bundle containing ratio of at least 1 layer resin base material layer (B1 among Fig. 1) be different from the fibre bundle containing ratio of other resin base material layer.The resin base material layer is because of fibre bundle containing ratio thermal expansion amount difference, and the big more thermal expansion amount of fibre bundle containing ratio is more little.Therefore, if adjust the value of the fibre bundle containing ratio of each resin base material layer, then can utilize difference, offset difference because of the thermal expansion amount between the different wiring layers that produce of residual copper rate of each wiring layer because of the thermal expansion amount of the different resin base material interlayers that produce of fibre bundle containing ratio.
Below, for when being the heat load of representative with the reflow soldering, the bending moment that substrate is bent describes.Shown in the right side of the profile of Fig. 1, establishing the thickness that end face (being the upper surface among Fig. 1) from the side of substrate 100a begins the wiring layer (wiring layer k layer) of several k layers is t
k(mm), the mid point f from the mid point FC of the stacked direction of substrate 100a to the stacked direction of wiring layer k layer
kDistance be r
k(mm), the thickness that begins the resin base material layer (resin base material layer k layer) of several k layers from the side's of substrate 100a end face is T
k(mm), the mid point F of stacked direction from mid point FC to resin base material layer k layer
kDistance be R
k(mm).
Formula (1) illustrates the bending moment of multi-layer wire substrate 100a.The left side of formula (1) be each wiring layer (bending moment the when unit temperature in C1～Cn) and each resin base material layer [B1～B (n-1)] changes and, the C on the right is the value that the amount of bow by the limit that electronic unit can be installed on substrate determines.The 1st on the left side of formula (1) is that (summation of the bending moment the when unit temperature of C1～Cn) changes, the 2nd on the left side are the summations of the bending moment of the unit temperature of each resin base material layer [B1～B (n-1)] when changing to each wiring layer in addition.As shown in Equation (1), the bending moment of multi-layer wire substrate 100a must be less than value C.
And, usually, bending moment with wiring layer and resin base material the face internal cause position of folded direction quadrature or direction and be worth different layer by layer, but at this, be set in wiring layer and resin base material layer, with even matter on characteristic all in the face of stacked direction quadrature, the key element of eliminating position or direction from formula (1).
[formula (1)]
On the left side of formula (1) in the 1st, a
kThe equivalent lines coefficient of expansion of expression wiring layer k layer, and in formula (2) by assignment.And, the equivalent lines coefficient of expansion be supposition with the face of the stacked direction quadrature of above-mentioned substrate in have even matter characteristic wiring layer the time coefficient of linear expansion.
[formula (2)]
At this, e
CuBe the vertical coefficient of elasticity of copper wiring, a
CuBe the coefficient of linear expansion of copper wiring, V
CukBe the residual copper rate of wiring layer k layer, E
PpBe the vertical coefficient of elasticity of resin, A
PpIt is the coefficient of linear expansion of resin.
On the left side of formula (1) in the 1st, e
kThe vertical coefficient of elasticity of equivalence of expression wiring layer k layer, and in formula (3) by assignment.And, coefficient of elasticity of equal value vertical be supposition with the face of the stacked direction quadrature of above-mentioned substrate in have even matter characteristic wiring layer the time vertical coefficient of elasticity.
[formula (3)]
e
k＝e
CuV
Cuk+E
PP(1-V
Cuk) ---(3)
At this, identical with formula (2), e
CuBe the vertical coefficient of elasticity of copper wiring, V
CukBe the residual copper rate of wiring layer k layer, E
PpIt is the vertical coefficient of elasticity of resin.
In addition on the left side of formula (1) in the 2nd, A
kThe equivalent lines coefficient of expansion of expression resin base material layer k layer, and in formula (4) by assignment.And the meaning of the equivalent lines coefficient of expansion is identical with the middle explanation of formula (2).
[formula (4)]
At this, E
FBe the vertical coefficient of elasticity of fibre bundle, A
FBe the coefficient of linear expansion of fibre bundle, V
FkBe the fibre bundle containing ratio of resin base material layer k layer, E
PpIdentical with formula (2) is the vertical coefficient of elasticity of resin, A
PpIdentical with formula (2) is the coefficient of linear expansion of resin.
On the left side of formula (1) in the 2nd, E
kThe vertical coefficient of elasticity of equivalence of expression resin base material layer k layer, and in formula (5) by assignment.And the meaning of vertical coefficient of elasticity of equal value is identical with the middle explanation of formula (3).
[formula (5)]
E
k＝E
FV
Fk+E
PP(1-V
Fk) ---(5)
At this, identical with formula (4), E
FBe the vertical coefficient of elasticity of fibre bundle, V
FkBe the fibre bundle containing ratio of resin base material layer k layer, E
PpIt is the vertical coefficient of elasticity of resin.
In the present invention, bending moment when the unit temperature that the difference because of the fibre bundle containing ratio of each resin base material layer [B1～B (n-1)] that illustrates by the 2nd on the left side with formula (1) causes changes, offset that the 1st on the left side of formula (1) illustrates because of each wiring layer (bending moment the when unit temperature that the difference of the residual copper rate among the C1～Cn) causes changes, thus formula (1) is set up.
The value C of formula (1) is according to the value decision of the bending of being allowed on the substrate.In addition from formula (2) to formula (5), the vertical coefficient of elasticity e of copper wiring
Cu, copper wiring coefficient of linear expansion a
Cu, resin vertical coefficient of elasticity E
Pp, resin coefficient of linear expansion A
Pp, fibre bundle vertical coefficient of elasticity E
FAnd the coefficient of linear expansion A of fibre bundle
FIt is known value.The residual copper rate V of wiring layer k layer in addition
CukCan be from substrate CAD (computer-aided design: extract Computer Aided Design).
That is, in formula (2)～formula (5), the value that can change has only fibre bundle containing ratio V
FkTherefore, for example shown in Figure 1, if in other layers except that the 1st layer of B1 among resin base material layer [B1～B (n-1)], use fibre bundle containing ratio V
FkBe known resin base material layer, then obtain the fibre bundle containing ratio of the 1st layer of B1 that satisfies formula (1).
Usually, when making substrate, study substrate is all carrying out estimating amount of bow, redesigns, studies substrate once more and estimating amount of bow repeatedly under the big situation of amount of bow operation at every turn.But, before making substrate,, then needn't carry out studying of substrate repeatedly as if the structure (concrete is the value of fibre bundle containing ratio) of obtaining the resin base material layer that satisfies above-mentioned formula (1) according to the design data of substrate CAD.
Carry out the design of substrate if apply flexibly formula (1) like this, then the value (being the value on the 1st on formula (1) left side) of the bending moment of wiring layer is diminished because of the change of electric circuit design, the summation of the bending moment of substrate is diminished, can reduce the bending of substrate simply.
And, above-mentioned formula (1) with the central authorities at substrate exist basalis 104 situation, be that wiring layer is that the situation of even number is a prerequisite.But, reduce the principle of the bending of substrate according to formula (1) being used to of illustrating, though what are different for the content of formula, the central authorities that also are applicable to substrate do not have basalis 104 situation, be that wiring layer is the situation of odd number.
Then, with the substrate of resin base material layer for example, the structure of the multi-layer wire substrate of the condition that satisfies above-mentioned formula (1) is described with 6 layers wiring layer and 5 layers.Fig. 2 illustrates the structure of the multi-layer wire substrate 100b that present embodiment relates to.Substrate 100b has 6 layers the wiring layer of C1～C6 successively from top, have 5 layers the resin base material layer of B1, B2 (all being accumulation horizon 105), B3 (basalis 104), B4, B5 (all being accumulation horizon 105) between each wiring layer successively from top.It is 32%, 28%, 37%, 46%, 52%, 54% successively that the residual copper rate of each wiring layer begins from C1.Extract in the residual copper rate of each wiring layer C that residual copper rate comprises from the data of substrate CAD.
As mentioned above, to begin from C1 be 32%, 28%, 37%, 46%, 52%, 54% to the residual copper rate of each wiring layer of substrate 100b successively.If calculating with basalis 104 is that ((mean value of the residual copper rate of C4～C6) then is respectively 32% and 51% to each wiring layer of C1～C3) and downside, and the mean value of residual copper rate is that the downside of basalis 104 is bigger for each wiring layer of the upside on border.
As described above, the big more thermal expansion amount of residual copper rate of wiring layer C is more little.The big more thermal expansion amount of the fibre bundle containing ratio of resin base material layer B is more little in addition.Therefore, utilize following arbitrary method, can both reduce the bending of substrate 100b.
(1) at least 1 layer among the accumulation horizon 105 (resin base material layer B4 and B5) of the downside of basalis 104, uses the fibre bundle containing ratio resin base material layer littler than the fibre bundle containing ratio of other accumulation horizons 105.
(2) at least 1 layer among the accumulation horizon 105 (resin base material layer B1 and B2) of the upside of basalis 104, use the fibre bundle containing ratio resin base material layer bigger than the fibre bundle containing ratio of other accumulation horizons 105.
In above-mentioned arbitrary method, the crooked power that raises up for each the wiring layer C that acts on substrate can both produce the power that makes the downward convex curved of each resin base material layer B, is effective to the bending that reduces substrate.
And, in above-mentioned method, make up the minimizing of the bending that realizes substrate 100b by making 2 kinds of different resin base material layers of fibre bundle containing ratio.As method in addition, also can consider the resin base material layer that uses the fibre bundle containing ratio different separately.But the sort of situation when the manufacturing of substrate, must be prepared the different various kinds of resin substrate layer of fibre bundle containing ratio.
The situation of the fibre bundle of the shape of weaving cotton cloth is for example made in the manufacturing of the resin base material layer that the fibre bundle containing ratio is different, and by changing adjacent interfibrous interval, or the thickness of change fiber itself is carried out.But, owing to make the different fibre bundle of thickness of interfibrous like this interval or fiber, become the essential factor that the manufacturing cost that makes substrate significantly promotes, therefore not preferred.Therefore, prepare 2 kinds of different resin base material layers of fibre bundle containing ratio as described above, it is real according to the degree of the bending of substrate 2 kinds of resin base material layers being used in combination.
Below, the structure of the substrate 100b that relates to for present embodiment specifically describes.In the present embodiment, using the fibre bundle containing ratio among B1, the B2 among 5 layers resin base material layer, B3, the B5 is 75% base material, and having only B4 (giving the ※ mark among Fig. 2) to use the fibre bundle containing ratio is 63% base material.
At first, the manufacture method for substrate 100b describes.At first, make 2 kinds of different resin base material layers of fibre bundle containing ratio.As fibre bundle, use the glass fibre of major radius 25 μ m, the short radius 10 μ m of section fibre bundle with the braiding of cloth shape, as the resin of insulating properties, use epoxy resin.When making fibre bundle, 2 kinds of different fibre bundles of density are made at the interval of change braided fiber.
Then, impregnating resin in the fibre bundle of the cloth shape of making like this generates 2 kinds of different resin base material layers of fibre bundle containing ratio.And, when generating the different resin base material layer of fibre bundle containing ratio,, then become and distinguish easily if in resin, add not the color that the pigment of the degree that insulating properties etc. is impacted changes a side resin base material layer.Its result can prevent that the different resin base material layer of fibre bundle containing ratio is configured in wrong locational situation, contributes to productive raising.
Then, on the position of the regulation of the resin base material layer that generates like this,,, fill the electroconductive resin constituent that has mixed metal powder and heat-curing resin in order on this hole, to form inner via hole by perforates such as laser processings.Then, be used in the two sides of 2 pieces of release film covering resin substrate layers that are formed with wiring figure on a side the face after, under the state of pressurization, heat, make resin solidification and wiring figure be fixed on the resin base material layer.Release film from resin base material layer peeled off thereafter.And, for the formation of wiring figure also can adopt the two sides of resin base material layer covered with Copper Foil after, form the method for wiring figure by etching.
On the 1st layer that obtains like this resin base material layer, the release film of placing the resin base material layer and be formed with wiring figure on a side face behind method formation inner via hole same as described above, pressurizes, heats.By the folded 2 kinds of different resin base material layers of fibre bundle containing ratio of the sequential pile lamination shown in Fig. 2, carry out above-mentioned processing repeatedly, the final substrate 100b that makes the wiring layer C of resin base material layer B with 5 layers and 6 layers.
The thickness of each layer of the wiring layer C of the substrate 100b of manufacturing is roughly 10 μ m, and the thickness of each layer of resin base material layer B is roughly 30 μ m.The substrate 100b that makes like this is cut to the size of 50mm * 50mm, in load under the situation of 260 ℃ of maximum temperatures when refluxing, be bent into 1.21mm.
As a comparative example, use the substrate 100h that makes the structure shown in Figure 12 with same fibre bundle of substrate 100b and resin, and cut out size into 50mm * 50mm.Substrate 100b and substrate 100h difference are that the fibre bundle containing ratio of resin base material layer B4 is 63% in substrate 100b, and the same with other resin base material layers in substrate 100h be 75%.For substrate 100h in load under the situation of 260 ℃ of maximum temperatures when refluxing, be bent into 1.51mm.
Then, the bending for the substrate of the situation of the fibre bundle containing ratio that changes 1 layer the accumulation horizon (resin base material layer B1, B2, B4 and B5's is some) among 4 layers the accumulation horizon 105 respectively describes.In fact, if make the substrate of the fibre bundle containing ratio of the resin base material layer that changes 1 layer, the additional expenses of wholesale (1,000,000 yen are unit) must be arranged then.Therefore, in the following description, be that analytic modell analytical modelization carry out in the basis with above-mentioned formula (1), the state that uses its analytic modell analytical model to illustrate bending carries out Simulation result.And, when making analytic modell analytical model, formulate the parameter of calculating formula so that analog result becomes the roughly the same value of value of the bending of surveying with use substrate 100b and 100h.
(the 1st crooked simulation)
At first, structure for the substrate 100b of the present embodiment shown in Fig. 2, promptly using the fibre bundle containing ratio among B1, the B2 among 5 layers resin base material layer, B3, the B5 is 75% base material, and having only B4 to use the fibre bundle containing ratio is that the situation of 63% base material is simulated.It is 32%, 28%, 37%, 46%, 52%, 54% successively that the residual copper rate of each wiring layer begins from C1.The thickness of each layer of wiring layer C is 10 μ m, and the thickness of each layer of each resin base material layer B is 30 μ m.The size of substrate is 50mm * 50mm in addition.
And in this bending simulation, for the physical parameter of each member of substrate, making the vertical coefficient of elasticity of copper wiring 101 is that 50000 (MPa), coefficient of linear expansion are 17 * 10
-6The vertical coefficient of elasticity of (1/ ℃), resin 103 is that 8000 (MPa), coefficient of linear expansion are 60 * 10
-6The vertical coefficient of elasticity of (1/ ℃), fibre bundle 102 is that 70000 (MPa), coefficient of linear expansion are 5 * 10
-6(1/ ℃).
Fig. 3 is that the curved shape with the analog result of substrate 100b carries out patterned figure.Fig. 3 illustrates the state of seeing substrate 100b from oblique upper, and represented in the drawings a plurality of annulars illustrate contour.From the amount of bow of substrate 100b is shown with the formed plane, 4 summits of the tetragonal substrate distance till the central part T of the annular of central authorities.The amount of bow of analog result (numeral in the figure bracket) is the value identical with measured value 1.21mm.
(the 2nd crooked simulation)
Then, for the substrate 100h in the past shown in Figure 12 crooked Simulation result is described.In substrate 100h in the past, (using the fibre bundle containing ratio among the B1～B5) is 75% base material at 5 layers resin base material layers.The residual copper rate of each wiring layer is identical with above-mentioned example, and promptly beginning from wiring layer C1 shown in Figure 12 is 32%, 28%, 37%, 46%, 52%, 54% successively.Size (the 50mm * 50mm) all identical of thickness (30 μ m) of each layer of the thickness of each layer of each wiring layer C (10 μ m), each resin base material layer B and substrate with above-mentioned example.In addition, for the physical parameter of each member of the substrate in the bending simulation, also identical with above-mentioned example.
Figure 13 illustrates the curved shape of the analog result of substrate 100h in the past.The amount of bow of simulation is the value identical with measured value 1.51mm.If the result of more above-mentioned Fig. 3 and the result of Figure 13 as can be known with respect to the amount of bow that presents 1.21mm in Fig. 3 (substrate 100b), present the amount of bow of 1.51mm in Figure 13 (substrate 100h), adopt the crooked minimizing of the present invention roughly 20%.
Shown in Figure 12, the fibre bundle containing ratio of resin base material layer B is among the substrate 100h that all layer is the same, and the bending during temperature load is because of residual copper rate among each wiring layer C different differences that cause, thermal expansion amount between each wiring layer produce.The situation of substrate 100h, it is 32%, 28%, 37%, 46%, 52%, 54% successively that residual copper rate begins from wiring layer C1, therefore downside becomes high more more, in 6 layers wiring layer C, is acting on the substrate 100h crooked power that raises up that makes.
Relative therewith, in the substrate 100b shown in Fig. 3, the fibre bundle containing ratio (63%) of resin base material layer B4 is different from the fibre bundle containing ratio (75%) of other accumulation horizons, have only resin base material layer B4 bigger, therefore in 5 layers resin base material layer B, acting on the power that makes the downward convex curved of substrate than the thermal expansion amount of other resin base material layers.Therefore, for the crooked power that raises up that acts on each wiring layer C, the power that acts on the downward convex curved of each resin base material layer B has negative function, reduces crooked.
(the 3rd crooked simulation)
Fig. 4 illustrates the structure of substrate 100c.Substrate 100c has 6 layers the wiring layer of C1～C6 successively from top, between each wiring layer C, have 5 layers the resin base material layer of B1, B2 (all being accumulation horizon 105), B3 (basalis 104), B4, B5 (all being accumulation horizon 105) successively from top.To begin from wiring layer C1 be 32%, 28%, 37%, 46%, 52%, 54% to the residual copper rate of each wiring layer C successively in addition.These configurations and structure are identical with aforesaid substrate 100b.
The substrate 100c of Fig. 4 uses the fibre bundle containing ratio in resin base material layer B1, B2, B3, B4 be 75% base material, and it is 63% base material that the outermost resin base material layer B5 (Fig. 4 gives the ※ mark) that only is arranged in downside uses the fibre bundle containing ratio.
Structure except that above-mentioned, promptly the size of thickness of each layer of the thickness of each layer of each wiring layer C, each resin base material layer B and substrate is identical with substrate 100b.In addition, for the physical parameter of each member of the substrate in the bending simulation, also identical with above-mentioned example.
Crooked Simulation result under the situation that maximum temperature during backflow that Fig. 5 has been illustrated in load is 260 ℃.If the result of Fig. 5 and the result of Figure 13 are compared, as can be known with respect to the amount of bow that in Fig. 5 (substrate 100c), presents 0.84mm, in Figure 13 (substrate 100h), present the amount of bow of 1.51mm, adopt the crooked minimizing about 44% of the present invention.
In the substrate 100c shown in Fig. 4, the fibre bundle containing ratio (63%) of resin base material layer B5 is different from the fibre bundle containing ratio (75%) of other accumulation horizons, have only resin base material layer B5 bigger, therefore in 5 layers resin base material layer B, acting on the power that makes the downward convex curved of substrate 100c than the thermal expansion amount of other resin base material layers.Therefore, for the crooked power that raises up that acts on each wiring layer C, the power that acts on the downward convex curved of each resin base material layer B has negative function, reduces crooked.
(the 4th crooked simulation)
Fig. 6 illustrates the structure of substrate 100d.Substrate 100d has 6 layers the wiring layer of C1～C6 successively from top, between each wiring layer, have 5 layers the resin base material layer of B1, B2 (all being accumulation horizon 105), B3 (basalis 104), B4, B5 (all being accumulation horizon 105) successively from top.To begin from C1 be 32%, 28%, 37%, 46%, 52%, 54% to the residual copper rate of each wiring layer successively in addition.These configurations and structure are identical with aforesaid substrate 100b.
The substrate 100d of Fig. 6 uses the fibre bundle containing ratio in resin base material layer B1, B3, B4, B5 be 75% base material, is that to use the fibre bundle containing ratio be 81% base material for resin base material layer B2 (Fig. 6 gives the ※ mark) that the border is arranged in upside with basalis 104 only.
Structure except that above-mentioned, promptly the size of thickness of each layer of the thickness of each layer of each wiring layer C, each resin base material layer B and substrate is identical with substrate 100b.In addition, for the physical parameter of each member of the substrate in the bending simulation, also identical with above-mentioned example.
Crooked Simulation result under the situation that maximum temperature during backflow that Fig. 7 has been illustrated in load is 260 ℃.If the result of Fig. 7 and the result of Figure 13 are compared, as can be known with respect to the amount of bow that in Fig. 7 (substrate 100d), presents 1.30mm, in Figure 13 (substrate 100h), present the amount of bow of 1.51mm, adopt the crooked minimizing about 13% of the present invention.
In the substrate 100d shown in Fig. 7, the fibre bundle containing ratio (81%) of resin base material layer B2 is different from the fibre bundle containing ratio (75%) of other resin base material layers, have only resin base material layer B2 littler, therefore in 5 layers resin base material layer B, acting on the power that makes the downward convex curved of substrate than the thermal expansion amount of other resin base material layers.Therefore, for the crooked power that raises up that acts on each wiring layer C, the power that acts on the downward convex curved of each resin base material layer B has negative function, reduces crooked.
(the 5th crooked simulation)
Fig. 8 illustrates the structure of substrate 100e.Substrate 100e has 6 layers the wiring layer of C1～C6 successively from top, between each wiring layer, have 5 layers the resin base material layer of B1, B2 (all being accumulation horizon 105), B3 (basalis 104), B4, B5 (all being accumulation horizon 105) successively from top.It is 32%, 28%, 37%, 46%, 52%, 54% successively that the residual copper rate of each wiring layer C begins from wiring layer C1.These configurations and structure are identical with aforesaid substrate 100b.
The substrate 100e of Fig. 8 uses the fibre bundle containing ratio in resin base material layer B2, B3, B4, B5 be 75% base material, and it is 81% base material that the outermost resin base material layer B1 (Fig. 8 gives the ※ mark) that only is arranged in upside uses the fibre bundle containing ratio.
Structure except that above-mentioned, promptly the size of thickness of each layer of the thickness of each layer of each wiring layer C, each resin base material layer B and substrate is identical with substrate 100b.In addition, for the physical parameter of each member of the substrate in the bending simulation, also identical with above-mentioned example.
Crooked Simulation result under the situation that maximum temperature during backflow that Fig. 9 has been illustrated in load is 260 ℃.If the result of Fig. 9 and the result of Figure 13 are compared, as can be known with respect to the amount of bow that in Fig. 9 (substrate 100e), presents 1.19mm, in Figure 13 (substrate 100h), present the amount of bow of 1.51mm, adopt the crooked minimizing about 21% of the present invention.
In the substrate 100e shown in Fig. 8, the fibre bundle containing ratio (81%) of resin base material layer B1 is different from the fibre bundle containing ratio (75%) of other resin base material layers, have only resin base material layer B1 littler, therefore in 5 layers resin base material layer B, acting on the power that makes the downward convex curved of substrate than the thermal expansion amount of other resin base material layers.Therefore, with respect to the crooked power that raises up that acts on each wiring layer C, the power that acts on the downward convex curved of each resin base material layer B has negative function, reduces crooked.
Table 1 is the list of above-mentioned the 1st～the 5th crooked Simulation result.In each row of table, representing by each simulation each wiring layer numbering, substrate (C1～residual copper rate (%) C6), resin base material layer (B1～fibre bundle containing ratio (%) B5) and the degree of bending.
[table 1]
As the above-mentioned method that makes the bending minimizing of substrate like that, have in 1 layer among the resin base material layer and to use the fibre bundle containing ratio less than using the method (the 4th, 5 simulation) of fibre bundle containing ratio in the method (the 1st, 3 simulation) of the resin base material layer of the fibre bundle containing ratio of other resin base material layers and among the resin base material layer 1 layer greater than the resin base material layer of the fibre bundle containing ratio of other accumulation horizons.As the clear demonstration of crooked Simulation result, in these arbitrary methods, the crooked power that raises up for each the wiring layer C that acts on substrate produces the power that makes the downward convex curved of each resin base material layer B, can reduce the bending of substrate.
And, in the present embodiment, be illustrated for substrate, but the present invention is not limited thereto with resin base material layer of 5 layers.In addition in the present embodiment, have the situation of basalis 104 for the central authorities at substrate, promptly wiring layer is that the situation of even number is illustrated, but the present invention is not limited thereto.The present invention does not have basalis 104 for the central authorities at substrate as Figure 10 illustrates, the situation that substrate 100f only is made of accumulation horizon 105, and promptly wiring layer is the situation of odd number, also can bring into play the effect identical with above-mentioned execution mode.
For example, remove wiring layer, than the also big situation of mean value, utilize following arbitrary method can reduce the bending of substrate in the residual copper rate of the wiring layer of upside at the mean value of the residual copper rate of the wiring layer of the downside of substrate in the central authorities of substrate.
(1) at least 1 layer among the accumulation horizon 105 of the downside of substrate, uses the fibre bundle containing ratio resin base material layer littler than the fibre bundle containing ratio of other accumulation horizons 105.
(2) at least 1 layer among the accumulation horizon 105 of the upside of substrate, use the fibre bundle containing ratio resin base material layer bigger than the fibre bundle containing ratio of other accumulation horizons 105.
In addition in the present embodiment, other the situation of fibre bundle containing ratio of resin base material layer that is different from except that this layer for the fibre bundle containing ratio that makes 1 layer resin base material layer is illustrated, but is not limited thereto.The present invention also is suitable for the fibre bundle containing ratio make the resin base material layer more than 2 layers and is different from other the situation of fibre bundle containing ratio of resin base material layer except that those layers.
Multi-layer wire substrate of the present invention can be applied to purposes widely as in order to form the circuit board that carries with the electronic circuit of digital mobile commodity headed by the portable electric appts etc.
Claims (7)
1. multi-layer wire substrate, it is characterized in that, this multi-layer wire substrate is laminated under alternately successively superimposed state by wiring layer and resin base material layer, this wiring layer is made of the resin of wiring that comprises electric conducting material and insulating properties, and this resin base material layer forms by the resin of varnished insulation in fibre bundle;
Above-mentioned wiring layer amounts to the n layer, and above-mentioned resin base material layer amounts to the n-1 layer;
At least 1 layer fibre bundle containing ratio among the resin base material layer of said n-1 layer is different with the fibre bundle containing ratio of other layers.
2. according to the multi-layer wire substrate of claim 1 record, it is characterized in that,
N is an even number,
And be the border with the above-mentioned resin base material layer of n/2 layer, since a side installed surface number, the mean value of the residual copper rate of above-mentioned wiring layer from the 1st layer to the n/2 layer, bigger than the mean value of the residual copper rate of above-mentioned wiring layer from the n/2+1 layer to the n layer,
At least 1 layer fibre bundle containing ratio among the above-mentioned resin base material layer from the 1st layer to the n/2-1 layer is all littler than the fibre bundle containing ratio of above-mentioned other layers.
3. according to the multi-layer wire substrate of claim 2 record, it is characterized in that,
The fibre bundle containing ratio of above-mentioned the 1st layer resin base material layer is all littler than the fibre bundle containing ratio of above-mentioned other layers.
4. according to the multi-layer wire substrate of claim 1 record, it is characterized in that,
N is an odd number,
And be the border with the above-mentioned wiring layer of (n+1)/2 layer, installed surface number since a side, from the mean value of the residual copper rate of the 1st layer of above-mentioned wiring layer to (n-1)/2 layer, than the mean value to the residual copper rate of the above-mentioned wiring layer of n layer is big from (n+3)/2 layer
At least 1 layer fibre bundle containing ratio among the above-mentioned resin base material layer from the 1st layer to (n-1)/2 layer is all littler than the fibre bundle containing ratio of above-mentioned other layers.
5. according to the multi-layer wire substrate of claim 1 record, it is characterized in that,
N is an even number,
And be the border with the above-mentioned resin base material layer of n/2 layer, since a side installed surface number, the mean value of the residual copper rate of above-mentioned wiring layer from the 1st layer to the n/2 layer, littler than the mean value of the residual copper rate of above-mentioned wiring layer from the n/2+1 layer to the n layer,
At least 1 layer fibre bundle containing ratio among the above-mentioned resin base material layer from the 1st layer to the n/2-1 layer is all bigger than the fibre bundle containing ratio of above-mentioned other layers.
6. according to the multi-layer wire substrate of claim 5 record, it is characterized in that,
The fibre bundle containing ratio of above-mentioned the 1st layer resin base material layer is all bigger than the fibre bundle containing ratio of above-mentioned other layers.
7. according to the multi-layer wire substrate of claim 1 record, it is characterized in that,
N is an odd number,
And be the border with the above-mentioned wiring layer of (n+1)/2 layer, installed surface number since a side, from the mean value of the residual copper rate of the 1st layer of above-mentioned wiring layer to (n-1)/2 layer, than the mean value to the residual copper rate of the above-mentioned wiring layer of n layer is little from (n+3)/2 layer
At least 1 layer fibre bundle containing ratio among the above-mentioned resin base material layer from the 1st layer to (n-1)/2 layer is all bigger than the fibre bundle containing ratio of above-mentioned other layers.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
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| JP217041/2007 | 2007-08-23 | ||
| JP2007217041A JP2009054621A (en) | 2007-08-23 | 2007-08-23 | Mulilayer wiring board |
| JP2008108890A JP5225734B2 (en) | 2008-04-18 | 2008-04-18 | Multilayer wiring board |
| JP108890/2008 | 2008-04-18 |
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| CN101374391A CN101374391A (en) | 2009-02-25 |
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| JP5497334B2 (en) * | 2009-05-19 | 2014-05-21 | パナソニック株式会社 | Multilayer wiring board |
| KR101053141B1 (en) | 2009-06-08 | 2011-08-02 | 서울과학기술대학교 산학협력단 | Dummy pattern design method to suppress warpage of printed circuit board |
| CN104302097B (en) * | 2014-10-16 | 2017-07-21 | 深圳市华星光电技术有限公司 | A kind of multilayer board |
| CN104470251A (en) * | 2014-10-31 | 2015-03-25 | 镇江华印电路板有限公司 | Manufacturing method of soft and hard combined board |
| JP6581886B2 (en) * | 2015-11-24 | 2019-09-25 | スタンレー電気株式会社 | Semiconductor device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1336789A (en) * | 2000-06-14 | 2002-02-20 | 松下电器产业株式会社 | Printed circuit plate and its mfg. method |
| KR20090030139A (en) * | 2007-09-19 | 2009-03-24 | 삼성전기주식회사 | Multi-layer printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1336789A (en) * | 2000-06-14 | 2002-02-20 | 松下电器产业株式会社 | Printed circuit plate and its mfg. method |
| KR20090030139A (en) * | 2007-09-19 | 2009-03-24 | 삼성전기주식회사 | Multi-layer printed circuit board |
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