CN101369550A - Gold thread break detection apparatus of full-automatic lead bonding machine - Google Patents
Gold thread break detection apparatus of full-automatic lead bonding machine Download PDFInfo
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Abstract
The invention relates to a device for detecting gold lead breakage of a full automatic lead bonding machine, which is suitable for the device of omnidistance on-line detecting in the course of automatically welding lead of the full automatic lead bonding machine and so on semiconductor devices. The invention is composed of a central processing unit, an IO interface circuit, a RS422 interface circuit, a signal source generator, a programmable voltage source, a buffer amplifier BF1, a sample circuit, a differential amplifier, a linear rectification circuit, a comparator, a buffer BF2, a digital processing circuit, a short circuit detecting circuit. The invention can automatically detecting whether the problems of lead break, poor bonding strength, over short lead end and so on which do not satisfy bonding process requirements are found, in order to remind operator to find problems in time, thereby modifying the process parameters to satisfy the process requirements.
Description
Technical field
The present invention relates to a kind of gold thread break detection apparatus of full-automatic lead bonding machine, be applicable to the equipment of omnidistance online detection in the automatic bonding wire processes of semiconductor equipment such as full-automatic lead bonding machine.
Background technology
Full-automatic lead bonding machine is to adopt fine wire line (general gold thread diameter is between 25 microns to 50 microns) gold thread to be connected (being called first solder joint) with chip bonding pad, gold thread is connected the semiconductor manufacturing equipment of (being called second solder joint) with lead frame again.Broken thread detector is a very crucial technology wherein, and the company of several in the world families production wire bonder all is used as a secret to this technology and is played up as a big characteristic on the description of product.By retrieval, up to the present do not find the technical data identical as yet with the application.
The burn out detection technical characterstic and the difficult point of full-automatic lead bonding machine are: the dispersion of chip is very big, vary, some chip bonding pad and resistance substrate are bigger, some is less, some insulate, and certain contact resistance even loose contact are arranged between metal framework and the band to band transfer module, machine bigger electrical noise itself arranged, in very big noise background, extract useful signal and have bigger difficulty.In addition, because full-automatic lead bonding machine speed is very fast, the fastest bonding wire speed is in 12 line/seconds, therefore broken wire detection system must be finished in the extremely short time (1～3 millisecond), and its detection sequential and bonding head motion sequential are closely related, and any point problem all can cause and detect inaccurate or false detective.Secondly, burn out detection and bonding head, wire clamp, electronic striking, supersonic generator could para-linkage intensity quality, gold thread line tail lacks etc. and to make accurate judgment on sequential during close fit.Therefore, broken wire detection system has very big influence to reliability, the bonding quality of complete machine, is an indispensable important step in whole bonding technology.
Summary of the invention
Technical problem to be solved by this invention provides and a kind ofly can detect the gold thread break detection apparatus of full-automatic lead bonding machine that whether has problems such as broken string, bond strength is poor, the line tail is too short automatically.
The present invention adopts following technical scheme:
The present invention is made up of CPU, IO interface circuit, RS422 interface circuit, signal source generator, programmable voltage source, buffer amplifier BF1, sample circuit, differential amplifier, linear rectification circuit, comparator, buffer BF2, digitized processing circuit, short-circuit detecting circuit; Described CPU is connected with the RS422 interface circuit is two-way with the IO interface circuit respectively, the input of the output termination programmable voltage source of described signal source generator, programmable voltage source is connected with CPU is two-way, the first via output of programmable voltage source is the input that AC signal voltage meets buffer amplifier BF1, the road output of buffer amplifier BF1 connects an input of differential amplifier through over-sampling circuit, another road output of buffer amplifier BF1 directly connects another input of differential amplifier, described sample circuit successively with the wire clamp of bonding machine, gold thread, be bonded chip, material bar clamping band to band transfer module forms current circuit;
The output of described differential amplifier connects an input of described comparator through linear rectification circuit, and the second tunnel output of programmable voltage source is another input that connects described comparator with reference to benchmark voltage able to programme; The output of described comparator connects the input of described digitized processing circuit through described buffer BF2, the input of the output termination CPU of digitized processing circuit, and the function control output of CPU connects the control end of digitized processing circuit;
Another road output of described sample circuit connects an input of CPU through short-circuit detecting circuit.
Operation principle of the present invention is as follows:
CPU is finished functions such as all logic controls, algorithm, communications of system; Signal source generator provides three kinds of alternative waveforms, i.e. square wave, triangle, sine wave, and the application of AC signal can reduce the damage to measured device; AC signal is through programmable voltage source, be added in behind the buffer amplifier on leakage current sample circuit and the tested device and (pass through wire clamp, gold thread is to chip, then from the chip to the chip substrate, arrive material bar clamping band to band transfer module by lead frame at last) the formation loop, when gold thread is bonded on the chip bonding pad point in good condition, form a loop circuit, otherwise be one and open the loop, the loop circuit is with to open the electric current of loop stream on sampling resistor different, pressure drop difference on the sampling resistor is just different, this voltage is through differential amplifier, linear rectification circuit becomes the direct current signal of a pulsation, compares with it from the programmable reference benchmark voltage on another road.The variation of the amplitude size reaction leakage current of the direct current signal of pulsation, when the signal amplitude that detects during greater than reference voltage, comparator output set of pulses string, when signal amplitude during less than reference voltage, fixed level of comparator output, processing by the digitized processing circuit is input to CPU, and what pulses software has produced by the time period of calculating how long will know the size of leakage current, and then judges current gold thread and chip and framework connection state.
Linear rectification circuit carries out rectification to measuring the next signal of circuit feedback, its objective is and also can guarantee to carry out normal rectification and do not have the dead band voltage signal less than general diode dead band voltage (being about about 0.5V), even can also can carry out rectification well, and then the signal of an alternation is become the direct current signal of pulsation to the signal about 10mV; Comparator, digitized processing circuit are finished the comparison of the direct current signal amplitude of reference voltage and pulsation, carry out the corresponding square-wave pulse signal sequence that produces after the digitized processing.
This device is applied to measuring-signal on the wire clamp by sample circuit, when gold thread is connected with chip or lead frame, can form a closed-loop path, have a spot of leakage current to pass through, otherwise, when not connecting or connect when bad, may cause open circuit and do not have electric current to flow through.Calculate the electric current that flows through wherein by the pressure drop difference that detects on the sampling resistor, the size of pressure drop is proportional with the electric current that flows through in the device.
Good effect of the present invention be can detect automatically whether have broken string, bond strength is poor, the line tail is too short etc. does not meet the problem that bonding technology requires and occur, so that remind operating personnel in time to pinpoint the problems, thereby technological parameter made amendment to reach technological requirement.
Description of drawings
Fig. 1 is a theory diagram of the present invention.
Fig. 2,3 is circuit theory diagrams of the present invention.
In Fig. 2: EN-STICK, enable burn out detection, CLR-START, removing starting state, SYSTEM RST, system reset, SET TEST PAD1, test first solder joint is set, SET TEST PAD2, test second solder joint is set, SET POLARTY, polarity is set, EROR, rub-out signal, ACK, recall signal, OUTP STATE, output state, REAL STATE, real-time status; CLR, removing start indicator light, SRST, system restoration indicator light, ER, rub-out signal indicator light, ACK, recall signal indicator light.
Embodiment
By the embodiment shown in Fig. 1-3 as can be known, present embodiment is made up of CPU, IO interface circuit, RS422 interface circuit, signal source generator, programmable voltage source, buffer amplifier BF1, sample circuit, differential amplifier, linear rectification circuit, comparator, buffer BF2, digitized processing circuit, short-circuit detecting circuit; Described CPU is connected with the RS422 interface circuit is two-way with the IO interface circuit respectively, the input of the output termination programmable voltage source of described signal source generator, programmable voltage source is connected with CPU is two-way, the first via output of programmable voltage source is the input that AC signal voltage meets buffer amplifier BF1, the road output of buffer amplifier BF1 connects an input of differential amplifier through over-sampling circuit, another road output of buffer amplifier BF1 directly connects another input of differential amplifier, described sample circuit successively with the wire clamp of bonding machine, gold thread, be bonded chip, material bar clamping band to band transfer module forms current circuit;
The output of described differential amplifier connects an input of described comparator through linear rectification circuit, and the second tunnel output of programmable voltage source is another input that connects described comparator with reference to benchmark voltage able to programme; The output of described comparator connects the input of described digitized processing circuit through described buffer BF2, the input of the output termination CPU of digitized processing circuit, and the function control output of CPU connects the control end of digitized processing circuit;
Another road output of described sample circuit connects an input of CPU through short-circuit detecting circuit.
Described CPU includes single-chip microcomputer U7 and peripheral cell product oscillation body device Y1, capacitor C 1-C2;
Described IO interface circuit is made up of integrated package U2B-U2F, the interface plug XS1 of photoisolator U1, photoisolator U3-U6 and peripheral cell resistance R 1-R19, light-emitting diode CLR, light-emitting diode SRST, light-emitting diode ER, light-emitting diode ACK, anti-tampering usefulness; 3 pin of interface plug SX1,11 pin connect 2 pin, 3 pin of photoelectricity every device U1 respectively, and 7 pin of photoisolator U1,6 pin connect 16 pin, 17 pin of single-chip microcomputer U7 respectively through integrated package U2B, U2C; Light-emitting diode EN be connected between 7 pin of VCC and photoisolator U1 after resistance R 5 is connected; Light-emitting diode CLR be connected between 6 pin of VCC and photoisolator U1 after resistance R 6 is connected;
4 pin of interface plug XS1,12 pin connect 2 pin, 3 pin of photoisolator U3 respectively, and 7 pin of photoisolator U3 connect 9 pin of single-chip microcomputer U7, and 6 pin of photoisolator U3 connect 40 pin of single-chip microcomputer U7 through integrated package U2D; Light-emitting diode SRST be connected between 7 pin of VCC and photoisolator U3 after resistance R 11 is connected;
5 pin of interface plug SX1,13 pin connect 2 pin, 3 pin of photoisolator U4 respectively, and 7 pin of photoisolator U4,6 pin connect 39 pin, 38 pin of single-chip microcomputer respectively through integrated package U2E, U2F;
1 pin of interface plug SX1,9 pin connect 7 pin, 6 pin of photoisolator U5 respectively, and 2 pin of photoisolator U5,3 pin connect 4 pin, 5 pin of single-chip microcomputer U7 respectively through light-emitting diode ER, light-emitting diode ACK;
2 pin of interface plug XS1,10 pin connect 7 pin, 6 pin of photoisolator U6 respectively, and 2 pin of photoisolator U6,3 pin connect 6 pin, 7 pin of single-chip microcomputer U7 respectively;
Described RS422 interface circuit is made up of photoisolator U9-U10, bus driver U8 and peripheral cell resistance R 20-R24, interface plug SX2, power supply jumper wire device JP1; 5 pin-8 pin of bus driver U8 is 5 pin, 9 pin, 4 pin, 8 pin of connection interface plug SX2 respectively, 2 pin of bus driver U8,3 pin connect 2 pin of photoisolator U9,7 pin of photoisolator U10 respectively, 7 pin of photoisolator U9 connect 14 pin of single-chip microcomputer U7, and 2 pin of photoisolator U10 connect 15 pin of single-chip microcomputer U7.
Described signal source generator is made up of integrated package U18 and peripheral cell resistance R 57-R59, resistance R 61, capacitor C 12-C14, selector switch S1, potentiometer RP1, buffer amplifier U16A and peripheral cell resistance R 60 thereof; Output 19 pin of integrated package U18 connect input 3 pin of buffer amplifier U16A; 1 pin of selector switch S1,2 pin connect 3 pin, 4 pin of integrated package U18 respectively, and 3 pin of selector switch S1,4 pin are ground connection respectively;
Described programmable voltage source is made up of integrated package U11 and peripheral cell resistance R 25-R26 thereof; Input 7 pin of integrated package U11 are in parallel with 6 pin after resistance R 60 connects output 1 pin of the buffer amplifier U16A in the signal source generator, and 9 pin of integrated package U11,14 pin connect 23 pin, 22 pin of single-chip microcomputer U7 respectively.
Described buffer amplifier BF1 is made up of integrated package U12 and peripheral cell resistance R 31 thereof, resistance R 34, resistance R 37, capacitor C 5; Output 8 pin that input 6 pin of integrated package U12B meet the integrated package U11 of programmable voltage source are the AC signal voltage output end, and output 7 pin of integrated package U12B connect input 3 pin of integrated package U12A by resistance R 31.
Described sample circuit is made up of resistance R 27-R29, resistance R 35, selector switch S2; Head end B after resistance R 27-R29 connects successively connects output 1 pin of the integrated package U12A in the described buffer amplifier, its tail end C successively through wire clamp CLAM, the gold thread of bonding machine, be bonded chip DIE, material bar clamping band to band transfer module WORKHOLDER, resistance R 35 ground connection; Be connected on after 1 pin of selector switch S2, the 2 pin parallel connections on the node of resistance R 28 and resistance R 29,4 pin of selector switch S2 are connected on the node of resistance R 27 and resistance R 28, the end points C of the 3 pin connecting resistance R29 of selector switch S2;
Described differential amplifier is made up of integrated package U13-U14, integrated package U16B and peripheral cell resistance R 32-R33 thereof, resistance R 36, resistance R 41-R46; Input 3 pin of integrated package U13A are described AC signal voltage output through output 1 pin that resistance R 32 meets the integrated package U12A in the described buffer amplifier, and input 5 pin of integrated package U13B are described sampled signal output through the C end that resistance R 36 connects the resistance R 29 in the sample circuit; Output 7 pin of integrated package U13B connect input 5 pin of integrated package U16B successively through integrated package U14B, resistance R 45; Output 1 pin of integrated package U13A connects input 6 pin of integrated package U16B successively through integrated package U14A, resistance R 41;
Described linear rectification circuit is made up of integrated package U17 and peripheral cell resistance R 47-R54, high-frequency rectification diode D1-D2, capacitor C 6; Input 2 pin of integrated package U17A connect output 7 pin of the integrated package U16B in the differential amplifier through resistance R 52, behind high-frequency rectification diode D1 and the high-frequency rectification diode D2 reverse parallel connection again with input 6 pin of output 1 pin that is connected on integrated package U17A after resistance R 51 is connected and integrated package U17B between, the positive pole of high-frequency rectification diode D1 connects output 1 pin of integrated package U17A, be connected on after resistance R 50 and resistance R 49 are in parallel between 2 pin of the negative pole of high-frequency rectification diode D1 and integrated package U17A, integrated package U17B input 6 pin connect output 7 pin of the integrated package U16B in the differential amplifier through resistance R 47.
Described comparator is made up of integrated package U19A and peripheral cell resistance R 55-R56 thereof, resistance R 62, capacitor C 7; Output 1 pin that output 7 pin of the integrated package U17B of positive input 5 pin of integrated package U19A in resistance R 55 wiring rectifiers, negative input 4 pin of integrated package U19A meet integrated package U11 in the programmable voltage source is able to programme with reference to the benchmark voltage output end.
Described buffer BF2 is made up of integrated package U2A and peripheral cell capacitor C 8-C10 thereof; Integrated package U2A input 1 pin connects output 2 pin of the integrated package U19A in the comparator.
Described digitized processing circuit is made up of integrated package U20 and peripheral cell resistance R 63-R65 thereof, capacitor C 11; Input 2 pin of integrated package U20 connect output 15 pin of the integrated package U12A among the buffer BF2, and 1 pin of integrated package U20,2 pin, 11 pin-15 pin connect 34 pin, 1 pin, 21 pin-18 pin, 3 pin of single-chip microcomputer U7 respectively.
Described short-circuit detecting circuit is made up of integrated package U15A and U19B and peripheral cell resistance R 30 thereof, resistance R 38-R40; Input 3 pin of integrated package U15A are held through the C that resistance R 30 connects the resistance R 29 in the sample circuit, and output 1 pin of integrated package U15A connects input 7 pin of integrated package U19B, and output 1 pin of integrated package U19B connects 37 pin of single-chip microcomputer U7.
In Fig. 1-3, the Action Specification of each several part is as follows:
The IO interface circuit detects the signal that startup, testing result output etc. need real-time control for the user provides.The IO interface circuit is by photoelectrical coupler and external isolation, and U1, U3, U4, U5, U6 are the high speed optoelectronic isolator, and R1～R19 is peripheral build-out resistor; U2B-U2F is a preventing jittering circuit, and main purpose is eliminate to disturb the misoperation to system of the burst pulse that produced; Four light-emitting diode EN, CLR, SRST, ER, ACK indicate as indication of user job state and equipment debugging state respectively.
The RS422 interface circuit provides the hardware supports of technology download more easily for the user, and the user can download to this device with various with technological parameter burn out detection by the operation interface of oneself, confirms best test parameter by the reality debugging.Also by high speed optoelectronic isolator U9, U10 and external isolation, R21～R24 is the photoisolator build-out resistor to the RS422 interface circuit, and serial data sends, receives by TXD and RXD and arrive CPU U7; R20 receives build-out resistor for bus driver U8.
Only as the buffering enlarging function, it outputs to the U11 in the programmable voltage source to U16A in the signal source generator.Three kinds of preference patterns can be provided, i.e. square wave, triangular wave, sine wave, S1 selects by selector switch, and the application of AC signal can reduce the damage to measured device; The RP1 potentiometer is adjusted its concussion frequency, and this device frequency setting is at 2KHZ.
Communicating by letter between the U11 in the programmable voltage source and the central processing unit adopted I
2C communication protocol, the resistance variations by U11 inside changes the gain in operational amplifier loop, and the output of finishing programmable voltage source changes by the requirement of setting; Programmable voltage source also can provide programmable reference benchmark voltage, and this voltage is difference owing to the difference of chip parameter, and U11 is a band I
2The circuit of C interface, its internal data changes and is all undertaken by CPU.
The effect of buffer amplifier BF1 is impedance matching and improves output loading capability.
4 kinds of combinations of the S2 of sample circuit provide different sampling resistors match to adapt to different chips.
Differential amplifier mainly amplifies the Weak current that flows through tested chip, when electric current hour, the pressure drop that is created on the sampling resistor is less, when electric current is big, the pressure drop that is created on the sampling resistor is bigger, this small variation is amplified by differential amplifier, outputs to linear rectification circuit.
The linear rectification circuit main purpose is to carry out rectification for the voltage waveform less than diode dead band voltage, even also can rectification to several millivolts small voltage, there is not the dead band influence, and then converts the AC signal of sampling the processing of pulsating direct current signal to for subsequent conditioning circuit.
The purpose of short circuit detector is that the short circuit phenomenon that the measured device two ends may be caused is made detection, and the judgement of another kind of situation " short circuit " phenomenon except that " open circuit ", " loading " is provided.
The purpose of comparator is to convert Transistor-Transistor Logic level to when converting digital pulse signal to linear rectification circuit output ripple direct current signal and greater than the part of reference level to handle for follow-up digital circuit.
The effect of buffer BF2 is that the pulse signal less than the certain hour width is carried out filtering, shaping amplification, improves anti-interference.
The purpose of digitized processing circuit is in order to improve the speed of test, directly pass through the pulse train of made of hardware circuits which process buffer output, and how many umber of pulses that collects in each time period (greatly about 1～3 millisecond, by the main frame programmed settings) be directly inputted to CPU.
Claims (10)
1. gold thread break detection apparatus of full-automatic lead bonding machine is characterized in that it is made up of CPU, IO interface circuit, RS422 interface circuit, signal source generator, programmable voltage source, buffer amplifier BF1, sample circuit, differential amplifier, linear rectification circuit, comparator, buffer BF2, digitized processing circuit, short-circuit detecting circuit; Described CPU is connected with the RS422 interface circuit is two-way with the IO interface circuit respectively, the input of the output termination programmable voltage source of described signal source generator, programmable voltage source is connected with CPU is two-way, the first via output of programmable voltage source is the input that AC signal voltage meets buffer amplifier BF1, the road output of buffer amplifier BF1 connects an input of differential amplifier through over-sampling circuit, another road output of buffer amplifier BF1 directly connects another input of differential amplifier, described sample circuit successively with the wire clamp of bonding machine, gold thread, be bonded chip, material bar clamping band to band transfer module forms current circuit;
The output of described differential amplifier connects an input of described comparator through linear rectification circuit, and the second tunnel output of programmable voltage source is another input that connects described comparator with reference to benchmark voltage able to programme; The output of described comparator connects the input of described digitized processing circuit through described buffer BF2, the input of the output termination CPU of digitized processing circuit, and the function control output of CPU connects the control end of digitized processing circuit;
Another road output of described sample circuit connects an input of CPU through short-circuit detecting circuit.
2. gold thread break detection apparatus of full-automatic lead bonding machine according to claim 1 is characterized in that described CPU includes single-chip microcomputer U7 and peripheral cell crystal oscillator Y1, capacitor C 1-C2;
Described IO interface circuit is made up of integrated package U2B-U2F, the interface plug XS1 of photoisolator U1, photoisolator U3-U6 and peripheral cell resistance R 1-R19, light-emitting diode CLR, light-emitting diode SRST, light-emitting diode ER, light-emitting diode ACK, anti-tampering usefulness; 3 pin of interface plug SX1,11 pin connect 2 pin, 3 pin of photoelectricity every device U1 respectively, and 7 pin of photoisolator U1,6 pin connect 16 pin, 17 pin of single-chip microcomputer U7 respectively through integrated package U2B, U2C; Light-emitting diode EN be connected between 7 pin of VCC and photoisolator U1 after resistance R 5 is connected; Light-emitting diode CLR be connected between 6 pin of VCC and photoisolator U1 after resistance R 6 is connected;
4 pin of interface plug XS1,12 pin connect 2 pin, 3 pin of photoisolator U3 respectively, and 7 pin of photoisolator U3 connect 9 pin of single-chip microcomputer U7, and 6 pin of photoisolator U3 connect 40 pin of single-chip microcomputer U7 through integrated package U2D; Light-emitting diode SRST be connected between 7 pin of VCC and photoisolator U3 after resistance R 11 is connected;
5 pin of interface plug SX1,13 pin connect 2 pin, 3 pin of photoisolator U4 respectively, and 7 pin of photoisolator U4,6 pin connect 39 pin, 38 pin of single-chip microcomputer respectively through integrated package U2E, U2F;
1 pin of interface plug SX1,9 pin connect 7 pin, 6 pin of photoisolator U5 respectively, and 2 pin of photoisolator U5,3 pin connect 4 pin, 5 pin of single-chip microcomputer U7 respectively through light-emitting diode ER, light-emitting diode ACK;
2 pin of interface plug XS1,10 pin connect 7 pin, 6 pin of photoisolator U6 respectively, and 2 pin of photoisolator U6,3 pin connect 6 pin, 7 pin of single-chip microcomputer U7 respectively;
Described RS422 interface circuit is made up of photoisolator U9-U10, bus driver U8 and peripheral cell resistance R 20-R24, interface plug SX2, power supply jumper wire device JP1; 5 pin-8 pin of bus driver U8 is 5 pin, 9 pin, 4 pin, 8 pin of connection interface plug SX2 respectively, 2 pin of bus driver U8,3 pin connect 2 pin of photoisolator U9,7 pin of photoisolator U10 respectively, 7 pin of photoisolator U9 connect 14 pin of single-chip microcomputer U7, and 2 pin of photoisolator U10 connect 15 pin of single-chip microcomputer U7.
3. gold thread break detection apparatus of full-automatic lead bonding machine according to claim 2 is characterized in that described signal source generator is made up of integrated package U18 and peripheral cell resistance R 57-R59, resistance R 61, capacitor C 12-C14, selector switch S1, potentiometer RP1, buffer amplifier U16A and peripheral cell resistance R 60 thereof; Output 19 pin of integrated package U18 connect input 3 pin of buffer amplifier U16A; 1 pin of selector switch S1,2 pin connect 3 pin, 4 pin of integrated package U18 respectively, and 3 pin of selector switch S1,4 pin are ground connection respectively.
4. gold thread break detection apparatus of full-automatic lead bonding machine according to claim 3 is characterized in that described programmable voltage source is made up of integrated package U11 and peripheral cell resistance R 25-R26 thereof; Input 7 pin of integrated package U11 are in parallel with 6 pin after resistance R 60 connects output 1 pin of the buffer amplifier U16A in the signal source generator, and 9 pin of integrated package U11,14 pin connect 23 pin, 22 pin of single-chip microcomputer U7 respectively.
5. gold thread break detection apparatus of full-automatic lead bonding machine according to claim 4 is characterized in that described buffer amplifier BF1 is made up of integrated package U12 and peripheral cell resistance R 31 thereof, resistance R 34, resistance R 37, capacitor C 5; Output 8 pin that input 6 pin of integrated package U12B meet the integrated package U11 of programmable voltage source are the AC signal voltage output end, and output 7 pin of integrated package U12B connect input 3 pin of integrated package U12A by resistance R 31.
6. gold thread break detection apparatus of full-automatic lead bonding machine according to claim 5 is characterized in that described sample circuit is made up of resistance R 27-R29, resistance R 35, selector switch S2; Head end B after resistance R 27-R29 connects successively connects output 1 pin of the integrated package U12A in the described buffer amplifier, its tail end C successively through wire clamp CLAM, the gold thread of bonding machine, be bonded chip DIE, material bar clamping band to band transfer module WORKHOLDER, resistance R 35 ground connection; Be connected on after 1 pin of selector switch S2, the 2 pin parallel connections on the node of resistance R 28 and resistance R 29,4 pin of selector switch S2 are connected on the node of resistance R 27 and resistance R 28, the end points C of the 3 pin connecting resistance R29 of selector switch S2;
Described differential amplifier is made up of integrated package U13-U14, integrated package U16B and peripheral cell resistance R 32-R33 thereof, resistance R 36, resistance R 41-R46; Input 3 pin of integrated package U13A are described AC signal voltage output through output 1 pin that resistance R 32 meets the integrated package U12A in the described buffer amplifier, and input 5 pin of integrated package U13B are described sampled signal output through the C end that resistance R 36 connects the resistance R 29 in the sample circuit; Output 7 pin of integrated package U13B connect input 5 pin of integrated package U16B successively through integrated package U14B, resistance R 45; Output 1 pin of integrated package U13A connects input 6 pin of integrated package U16B successively through integrated package U14A, resistance R 41;
Described linear rectification circuit is made up of integrated package U17 and peripheral cell resistance R 47-R54, high-frequency rectification diode D1-D2, capacitor C 6; Input 2 pin of integrated package U17A connect output 7 pin of the integrated package U16B in the differential amplifier through resistance R 52, behind high-frequency rectification diode D1 and the high-frequency rectification diode D2 reverse parallel connection again with input 6 pin of output 1 pin that is connected on integrated package U17A after resistance R 51 is connected and integrated package U17B between, the positive pole of high-frequency rectification diode D1 connects output 1 pin of integrated package U17A, be connected on after resistance R 50 and resistance R 49 are in parallel between 2 pin of the negative pole of high-frequency rectification diode D1 and integrated package U17A, integrated package U17B input 6 pin connect output 7 pin of the integrated package U16B in the differential amplifier through resistance R 47.
7. gold thread break detection apparatus of full-automatic lead bonding machine according to claim 6 is characterized in that described comparator is made up of integrated package U19A and peripheral cell resistance R 55-R56 thereof, resistance R 62, capacitor C 7; Output 1 pin that output 7 pin of the integrated package U17B of positive input 5 pin of integrated package U19A in resistance R 55 wiring rectifiers, negative input 4 pin of integrated package U19A meet integrated package U11 in the programmable voltage source is able to programme with reference to the benchmark voltage output end.
8. gold thread break detection apparatus of full-automatic lead bonding machine according to claim 7 is characterized in that described buffer BF2 is made up of integrated package U2A and peripheral cell capacitor C 8-C10 thereof; Integrated package U2A input 1 pin connects output 2 pin of the integrated package U19A in the comparator.
9. gold thread break detection apparatus of full-automatic lead bonding machine according to claim 8 is characterized in that described digitized processing circuit is made up of integrated package U20 and peripheral cell resistance R 63-R65 thereof, capacitor C 11; Input 2 pin of integrated package U20 connect output 15 pin of the integrated package U12A among the buffer BF2, and 1 pin of integrated package U20,2 pin, 11 pin-15 pin connect 34 pin, 1 pin, 21 pin-18 pin, 3 pin of single-chip microcomputer U7 respectively.
10. gold thread break detection apparatus of full-automatic lead bonding machine according to claim 9 is characterized in that described short-circuit detecting circuit is made up of integrated package U15A and U19B and peripheral cell resistance R 30 thereof, resistance R 38-R40; Input 3 pin of integrated package U15A are held through the C that resistance R 30 connects the resistance R 29 in the sample circuit, and output 1 pin of integrated package U15A connects input 7 pin of integrated package U19B, and output 1 pin of integrated package U19B connects 37 pin of single-chip microcomputer U7.
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| CN2008100555616A CN101369550B (en) | 2008-08-12 | 2008-08-12 | Gold thread break detection apparatus of full-automatic lead bonding machine |
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| CN2008100555616A CN101369550B (en) | 2008-08-12 | 2008-08-12 | Gold thread break detection apparatus of full-automatic lead bonding machine |
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Assignee: CETC BEIJING ELECTRONIC EQUIPMENT Co.,Ltd. Assignor: THE 45TH Research Institute OF CETC Contract fulfillment period: 2008.10.10 to 2014.12.29 Contract record no.: 2009990000524 Denomination of invention: Gold thread break detection apparatus of full-automatic lead bonding machine License type: Exclusive license Record date: 20090518 |
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