CN101364630A - Production method for large power LED stage shape metal electron circuit board - Google Patents
Production method for large power LED stage shape metal electron circuit board Download PDFInfo
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- CN101364630A CN101364630A CNA2008101564025A CN200810156402A CN101364630A CN 101364630 A CN101364630 A CN 101364630A CN A2008101564025 A CNA2008101564025 A CN A2008101564025A CN 200810156402 A CN200810156402 A CN 200810156402A CN 101364630 A CN101364630 A CN 101364630A
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Abstract
A method for producing high-power LED step-shaped metal electronic circuit boards relates to a method for producing high-power LED step-shaped metal electronic circuit boards (PCB). The method comprises the following steps: a. lofting and die opening: the dies are divided into concave dies and convex dies, and one step of the circuit board corresponds to one convex die; b. punching planar boards: the planar electronic circuit boards which are not shaped are firstly punched; c. producing protective layers: the planar electronic circuit board is nickelled, and solder resist rings are printed; and d. punching for shaping: the planar electronic circuit board is placed in the concave die, and the circuit board is sequentially extruded towards the position of the concave die corresponding to the convex die by the convex die until the electronic circuit board is shaped. The method has the advantages that the invention provides a method for producing the high-power LED step-shaped metal electronic circuit boards, guarantees the high-power LEDs wider application in automobile lighting fitting, and ensures higher social and economical benefits.
Description
Technical field
The present invention relates to a kind of production method of electronic circuit board, in particular for the production method of the stage shape metal electron circuit board of great power LED.
Background technology
Traditional electronic circuit board generally is plating one deck copper film on the substrate of being made by epoxy resin, and its cost is low, and technology is simple, generally is used for the less demanding electronic product of common heat radiation.Along with the technology of electronic product is maked rapid progress, LED is because its optical efficiency height, energy-saving and environmental protection, obtains more and more widely application at each lighting field.As in automobile lamp, LED is long because of its luminous efficiency height, life-span, is applied to auto lamp and is more and more paid attention to by each auto vendor.But will be used as automotive lighting, this LED need use and powerfully just can meet the automotive lighting requirement.So traditional film-type electronic circuit board just is not suitable for installing great power LED, because of its radiating effect relatively poor, the heat that great power LED sends can not distribute preferably, will reduce greatly the result of use and the useful life of automobile lamp, even causes security incident.Thereby the automobile-used LED electronic circuit board all adopts metallic plate at present, is called PCB in the industry.Present PCB is flat, and its processing technology is simple, only needs promptly to can be made into by punch die of line construction, and the precision of the installing hole of LED also can guarantee after the punching out.But many automobile lamps are arranged as adopting LED, its electronic circuit board 1 is abnormally-structured (as shown in Figure 1), its irregular, big drop, not contour, trapezoidal step structure, complex structure, adopt traditional impact forming method, because metal can extend (elongation of copper is higher) in metal, then after punching out, be difficult to guarantee the precision of location hole 2, LED installing hole 3, influence the installation of LED in the postorder operation.So just influenced the popularization and application of LED in automobile lamp greatly.
Summary of the invention
The objective of the invention is at afore-mentioned, provide a kind of large power LED stage shape metal electron circuit board that is widely used in automobile lamp production method.
The technical scheme that realizes above-mentioned purpose is as follows:
The production method of large power LED stage shape metal electron circuit board comprises the steps:
A, the setting-out die sinking is made mould according to the shape of large power LED stage shape metal electron circuit board, and mould is divided into die and punch, the whole mould of die for doing according to shape, punch is for disperseing mould, i.e. wiring board corresponding punch of ladder, and a punch correspondence is pushed by a cam driven, all cams drive by a camshaft and rotate, and the center of gravity line of all cams is all not parallel at synchronization, and all punch are formed a punch set, and correspondence is arranged on the top of die;
B, the punching out flat board is made the plane electronic circuit board before the type according to the geomery of large power LED stage shape metal electron circuit board and location hole, LED installing hole subpunch;
C does protective layer, and nickel plating on plane electronic circuit board is printed the solder resist circle to prevent the random diffusion of scolding tin;
D, punch forming is a benchmark with the LED installing hole, and plane electronic circuit board is put into die, the starting cam axle drives cam, successively punch is pushed wiring board to its corresponding die position by cam, until being shaped to stage shape metal electron circuit board.
Further, in the aforementioned a step setting-out die sinking, the layout of all cams is according to making in the d step punching out process, during the one-level ladder, the not loose pressure of the punch on the previous stage ladder has only when punch is pressed onto back one-level ladder again after compacting, punch on the previous stage ladder could be pressed by pine, so circulation.
Advantage of the present invention has provided a kind of production method that is used for the special-shaped metal electron circuit board of great power LED, provides guarantee for great power LED uses in the automotive lighting light fixture widely.And the advantage of comparing with traditional lighting because of well-known LED illumination, the present invention has higher society and economy benefit.
Description of drawings
Fig. 1 automotive lighting light fixture schematic diagram of large power LED stage shape metal electron circuit board;
Fig. 2 is the structural representation of mould that can use for reference in the specific embodiment of the invention;
Fig. 3 is the structural representation of Fig. 2 cam.
Among the figure, 1 is stage shape metal electron circuit board, and 2 is die, and 3 is punch, and 4 is camshaft, and 5 is cam.
Embodiment
Below in conjunction with description of drawings the specific embodiment of the present invention:
The production method of large power LED stage shape metal electron circuit board, comprise the steps: a, the setting-out die sinking, shape according to large power LED stage shape metal electron circuit board 1 is made mould, mould is divided into die 2 and punch 3, the whole mould of die 2 for doing according to shape, punch 3 is for disperseing mould, it is corresponding punch 3 of a ladder of wiring board, punch 3 correspondences drive extruding by a cam 5, and all cams 5 drive by a camshaft 4 and rotate, and the center of gravity line of all cams 5 is all not parallel at synchronization, all punch 3 are formed a punch set, and correspondence is arranged on the top of die 2; B, the punching out flat board is made the plane electronic circuit board before the type according to the geomery of large power LED stage shape metal electron circuit board 1 and location hole, LED installing hole subpunch; C does protective layer, and nickel plating on plane electronic circuit board is printed the solder resist circle to prevent the random diffusion of scolding tin; D, punch forming is a benchmark with the LED installing hole, plane electronic circuit board is put into die 2, and starting cam axle 4 drives cam 5, successively punch 3 is pushed wiring board to its corresponding die 2 positions by cam 5, until being shaped to stage shape metal electron circuit board 1.
The layout of all cams 5 is according to making in the d step punching out process, when the back one-level ladder of compacting stage shape metal electron circuit board 1, the not loose pressure of punch 3 on the previous stage ladder, have only when punch 3 is pressed onto back one-level ladder again, punch on the previous stage ladder could be pressed by pine, and so circulation is until moulding.
Claims (2)
1, the production method of large power LED stage shape metal electron circuit board, it is characterized in that comprising the steps: a, the setting-out die sinking, shape according to large power LED stage shape metal electron circuit board is made mould, mould is divided into die and punch, the whole mould of die for doing according to shape, punch is for disperseing mould, it is corresponding punch of a ladder of wiring board, a punch correspondence is pushed by a cam driven, and all cams drive by a camshaft and rotate, and the center of gravity line of all cams is all not parallel at synchronization, all punch are formed a punch set, and correspondence is arranged on the top of die; B, the punching out flat board is made the plane electronic circuit board before the type according to the geomery of large power LED stage shape metal electron circuit board and location hole, LED installing hole subpunch; C does protective layer, and nickel plating on plane electronic circuit board is printed the solder resist circle to prevent the random diffusion of scolding tin; D, punch forming is a benchmark with the LED installing hole, and plane electronic circuit board is put into die, the starting cam axle drives cam, successively punch is pushed wiring board to its corresponding die position by cam, until being shaped to stage shape metal electron circuit board.
2, the production method of large power LED stage shape metal electron circuit board according to claim 1, it is characterized in that: in the described a step setting-out die sinking, the layout of all cams is according to making in the d step punching out process, after compacting during the one-level ladder, the not loose pressure of punch on the previous stage ladder, have only when punch is pressed onto back one-level ladder again, the punch on the previous stage ladder could be pressed by pine, so circulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2008101564025A CN100557838C (en) | 2008-10-09 | 2008-10-09 | The production method of large power LED stage shape metal electron circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2008101564025A CN100557838C (en) | 2008-10-09 | 2008-10-09 | The production method of large power LED stage shape metal electron circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101364630A true CN101364630A (en) | 2009-02-11 |
| CN100557838C CN100557838C (en) | 2009-11-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2008101564025A Active CN100557838C (en) | 2008-10-09 | 2008-10-09 | The production method of large power LED stage shape metal electron circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108571713A (en) * | 2018-02-05 | 2018-09-25 | 保定来福汽车照明集团有限公司 | A kind of LED light board positioning method and mould therefor |
| CN115003036A (en) * | 2022-07-18 | 2022-09-02 | 常州宇宙星电子制造有限公司 | Production method of high-power LED stepped metal electronic circuit board |
-
2008
- 2008-10-09 CN CNB2008101564025A patent/CN100557838C/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108571713A (en) * | 2018-02-05 | 2018-09-25 | 保定来福汽车照明集团有限公司 | A kind of LED light board positioning method and mould therefor |
| CN115003036A (en) * | 2022-07-18 | 2022-09-02 | 常州宇宙星电子制造有限公司 | Production method of high-power LED stepped metal electronic circuit board |
| CN115003036B (en) * | 2022-07-18 | 2022-10-11 | 常州宇宙星电子制造有限公司 | Production method of high-power LED stepped metal electronic circuit board |
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| Publication number | Publication date |
|---|---|
| CN100557838C (en) | 2009-11-04 |
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Owner name: CHANGZHOU TONGBAO PHOTO-ELECTRICITY MANUFACTURING Free format text: FORMER NAME: CHANGZHOU TONGBAO PHOTOELECTRICITY CO., LTD. |
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Inventor after: Liu Guoxue Inventor after: Chen Wenxiang Inventor before: Liu Guo Inventor before: Chen Baoxiang |
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Free format text: CORRECT: INVENTOR; FROM: LIU GUO CHEN BAOXIANG TO: LIU GUOXUE CHEN WENXIANG |
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Address after: 213034 Jiangsu province Changzhou Chunjiang town Xinbei Baizhang people bridge Patentee after: Changzhou Tong Bao Photoelectric Co., Ltd. Address before: 213034 Jiangsu province Changzhou Chunjiang town Xinbei Baizhang people bridge Patentee before: Changzhou Tongbao Photoelectricity Co., Ltd. |
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Address after: 213034, Peach Blossom Road, 1-1 spring town, Xinbei District, Jiangsu, Changzhou Patentee after: Changzhou Tong Bao Photoelectric Co., Ltd. Address before: 213034 Jiangsu province Changzhou Chunjiang town Xinbei Baizhang people bridge Patentee before: Changzhou Tong Bao Photoelectric Co., Ltd. |