CN101353774B - Thermally sprayed film forming method and device - Google Patents
Thermally sprayed film forming method and device Download PDFInfo
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- CN101353774B CN101353774B CN2008101345598A CN200810134559A CN101353774B CN 101353774 B CN101353774 B CN 101353774B CN 2008101345598 A CN2008101345598 A CN 2008101345598A CN 200810134559 A CN200810134559 A CN 200810134559A CN 101353774 B CN101353774 B CN 101353774B
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Abstract
The present invention relates to thermally sprayed film forming method devices. An apparatus is provided to reduce the defect rate and decrease production yield by removing foreign objects even when the foreign objects are mixed in with the thermally sprayed film. The operation for forming thermally sprayed film on inner surface of cylinder bore is paused, and protrusions generated in the thermally sprayed film by foreign objects are detected by visual observation and removed by a manual operation. The thermal spraying operation is then performed until thermally sprayed film reaches the prescribed film thickness. After formation of the thermally sprayed film, a finishing operation is performed by means of honing.
Description
Technical field
The present invention relates to a kind of sputtered films of bismuth formation method and spraying plating membrane formation device that forms sputtered films of bismuth on the surface of workpiece.
Background technology
Improve or aspect such as small-sized, lightness is considered from the output rating of oil engine, burnup performance, exhaust performance, it is high that abolishment is used for the design requirements that the steam jacket of the cylinder hole portion of aluminium cylinder blocks carries out, a kind of as its substitute technology promotes the use of the spraying plating technology that forms the sputtered films of bismuth that is made of ferrous material at aluminium cylinder internal surface of hole.
At this moment, for example in following patent documentation 1, announced following technology:, be processed with the screw-like jog and form uneven surface at the cylinder internal surface of hole in advance in order to improve the tight joint degree of sputtered films of bismuth.
Patent documentation 1: TOHKEMY 2002-155350 communique
But, for the technology that will form above-mentioned sputtered films of bismuth is applicable to the cylinder hole portion of product and is established as the techniques of mass production, must guarantee and the existing product with steam jacket equal above quality and productivity, particularly as production technology, boosting productivity by reduction in the numbers of seconds becomes the problem that mass production is faced.
This spraying plating technology is to make multi-layer porous epithelium stacked and obtain the technology of needed leather film thickness, therefore with attached to the spraying plating substrate or to be blended into foreign matter in the spraying plating course of processing (procedure smear metal of bringing in the past, the leather diaphragm that produces in this operation, splash etc.) be nuclear and generate thrust inevitably in skin membrane.
In the next process of this thrust after spraying plating the shape of product in cylinder hole is carried out precision work (honing processing, grinding etc.) time and come off, become the reason that the thick pit (depression) of the cylinder hole surface that is equivalent to the pore in the steam jacket of in the past cast iron produces.
The size of this depression is bigger, or when having many, can produce the following problem that diminishes commodity: (1) causes oilconsumption to increase the deterioration that causes motor performance owing to oily retention volume increases, (2) owing to the stopping property of piston ring reduces the deterioration that causes the ejection of seepage gas to cause motor performance, the card extension when slide owing to piston ring (3) causes sputtered films of bismuth to be peeled off making duty of engine weather resistance deterioration etc.
But the generation source that suppresses above-mentioned defective is the generation of foreign matter self, this in manufacturing process be difficulty and only to seek countermeasure be inadequate in that the source side face takes place, in addition, generate depression back discovery defective by carrying out precision work after the spraying plating, can produce substandard products, cause the remarkable deterioration of productivity.
So, even when the objective of the invention is in the spraying plating rete, to have sneaked into foreign matter, also can remove this foreign matter and suppress fraction defective, productivity is improved.
Summary of the invention
Topmost being characterised in that of the present invention's the 1st technical scheme, at the jet surface melting material of workpiece and form sputtered films of bismuth, before precision work is carried out on the surface of sputtered films of bismuth the operation of formation sputtered films of bismuth in remove the foreign matter that is blended in the sputtered films of bismuth, spray above-mentioned melting material and form the sputtered films of bismuth of regulation thickness on above-mentioned surface.
The spraying plating membrane formation device of the 2nd technical scheme of the present invention is characterized in that, comprises spraying component and foreign substance removing member; Above-mentioned spraying component relatively moves towards the jet surface melting material of workpiece and along above-mentioned surface; Above-mentioned foreign substance removing member is utilized the rotation of this spraying component and the axial mobile foreign matter of removing in the surperficial formed sputtered films of bismuth that is blended into above-mentioned workpiece.
Adopt the present invention, can be by reaching at sputtered films of bismuth before the final regulation thickness, remove the foreign matter that is blended in the sputtered films of bismuth, in the forming process of the sputtered films of bismuth that reaches the regulation thickness, prevention produces the piece of convex in skin membrane, the depression that the coming off of the convex piece in the precision work after being suppressed at caused produces boosts productivity.
Description of drawings
Fig. 1 is the action specification figure of the sputtered films of bismuth formation method of expression the 1st embodiment of the present invention, (a) be illustrated in the state that generates thrust in the sputtered films of bismuth, (b) state that carries out spraying plating behind the thrust is removed in expression, and (c) expression is carried out accurately machined state to the sputtered films of bismuth that forms the regulation thickness.
Fig. 2 is the one-piece construction figure of spraying plating membrane formation device.
Fig. 3 represents to carry out sputtered films of bismuth is formed the sectional view that preceding cylinder internal surface of hole carries out the state of base treatment processing.
Fig. 4 is the flow chart figure of the 1st embodiment.
Fig. 5 is the accurately machined state after sputtered films of bismuth forms is carried out in expression to the cylinder hole a sectional view.
Fig. 6 is the action specification figure of state that the thrust of the present invention's the 2nd embodiment is removed in expression.
Fig. 7 is the flow chart figure of the 2nd embodiment.
(a) of Fig. 8 is the action specification figure of the sputtered films of bismuth method of formationing of expression the present invention the 3rd embodiment, and (b) of Fig. 8 is the rotational trajectory figure of the cutting tool when the spraying plating spray nozzle part of the 3rd embodiment is rotated.
Fig. 9 is the flow chart figure of the 3rd embodiment.
Figure 10 is the schema that the thrust of expression the 3rd embodiment detects and removes operation.
(a) of Figure 11 is the action specification figure of the sputtered films of bismuth method of formationing of expression the present invention the 4th embodiment, and (b) of Figure 11 is the rotational trajectory figure of the cutting tool when the spraying plating spray nozzle part of the 4th embodiment is rotated.
Embodiment
Below, with reference to the accompanying drawings embodiments of the present invention are described.
Fig. 1 is that expression the of the present invention the 1st is the action specification figure of simplification of the sputtered films of bismuth formation method of embodiment, is formed with sputtered films of bismuth 5 on the machined object as workpiece is the internal surface 3a in the cylinder hole 3 in the cylinder body 1 of engine.
Spraying plating membrane formation device for example shown in Figure 2 is used in the formation of sputtered films of bismuth 5.Spray torch 7 front corresponding with lower end side in Fig. 2 as spraying component of this spraying plating membrane formation device has spraying plating spray nozzle part 9, in this spray torch 7, the upper end of the wire 11 that is made of Ferrious material in Fig. 2 that spraying plating is used inserted and supplied to spraying plating spray nozzle part 9.
Above-mentioned rotating part 12 and spraying plating spray nozzle part 9 are the central axis rotation with the wire 11 of spray torch 7, and wire 11 can not rotate when the time comes.
In addition, this spraying plating membrane formation device has and is used to make spray torch 7 to come and go the spray torch feed mechanism 26 that moves along the vertical direction with the state of Fig. 2 in cylinder hole 3.This spray torch feed mechanism 26 can be for example to make pinion(gear) rotation by electric motor, makes the structure of the tooth bar of being located at spray torch 7 sides and the pinion of this rotation etc.This moment, spray torch 7 moved in Fig. 2 along the vertical direction along not shown guide part.This spray torch feed mechanism 26 is driven control by above-mentioned controller 25.
On above-mentioned gas tubing connection portion 13, be connected with mixed gas pipe arrangement 29 and atomizing air pipe arrangement 31 respectively; Above-mentioned mixed gas pipe arrangement 29 is supplied with the mixed gas of hydrogen and argon from gas supply source 27; Above-mentioned atomizing air pipe arrangement 31 is supplied with atomizing air (air).The mixed gas that supplies in the gas tubing connection portion 13 by mixed gas pipe arrangement 29 supplies to spraying plating spray nozzle part 9 through the not shown mixed gas path in the rotating part 12 that is formed on its underpart.Equally, the atomizing air that supplies in the gas tubing connection portion 13 by atomizing space gas pipe arrangement 31 supplies to spraying plating spray nozzle part 9 by the not shown atomizing air path in the rotating part 12 that is formed on its underpart.
Here, be necessary to be communicated with respectively not shown mixed gas path in the gas tubing connection portion 13 and atomizing air path and, with respect to not shown mixed gas path and atomizing air path in the rotating part 12 of gas tubing connection portion 13 rotations.Means of communication as this moment, for example consider the mixed gas path in the gas tubing connection portion 13 and each bottom of atomizing air path are formed annulus, the mixed gas path that the edges in the rotating part 12 extend up and down and the upper end of atomizing air path are communicated with respectively on this annulus.Thus, though rotating part 12 with respect to gas tubing connection portion 13 rotation, mixed gas path in the rotating part 12 and atomizing air path and, mixed gas path and atomizing air paths in the gas tubing connection portion 13 also are to be communicated with respectively always.
Spraying plating spray nozzle part 9 has not shown cathode electrode in inside, at this cathode electrode with become between the top 11a of wire 11 of anode electrode and apply voltage, simultaneously emit the mixed gas that supplies to spray torch 7 from gas supply source 27 from not shown mixed gas escape orifice, thereby produce not shown electric arc and light a fire, make the top 11a fusion of wire 11 by the heat of electric arc.
This moment is along with the fusion of wire 11, drives vessel side wire delivery section 39 and wire delivery section 15 and transferring metal silk 11 forwards successively.Meanwhile, to emit near the 11a of the top of wire 11 near the not shown opening that is positioned at above-mentioned mixed gas escape orifice from the atomizing air that gas supply source 27 supplies to spray torch 7, make above-mentioned wire 11 melts, be that melting material forms spraying 44 and moves towards the place ahead, adhere to after fixing, thereby form sputtered films of bismuth 5 at the internal surface 3a in cylinder hole 3.
In addition, though not shown, wire 11 is to insert movably in the upper metal silk liner of drum of the lower end of being located at rotating part 12.
The spraying plating membrane formation device of Gou Chenging also inserts it into respect to cylinder hole 3 internal rotation simultaneously by making spray torch 7 like this, is cylinder internal surface of hole 3a spraying 44 and form sputtered films of bismuth 5 shown in Fig. 1 (a) towards the surface of machined object.At this moment, spray torch 7 is moved so that sputtered films of bismuth 5 becomes the regulation thickness along repeatedly coming and going up and down.
In addition, at this, before forming sputtered films of bismuth 5, in order to improve the tight joint degree with respect to cylinder internal surface of hole 3a of sputtered films of bismuth 5, as shown in Figure 3, top periphery at the boring bar 45 of bore hole processing unit (plant) is equipped with cutting tool (cutting knife) 47, makes boring bar 45 rotations and it is moved to axial below, thereby the internal surface 3a in cylinder hole 3 is formed screw-like.
In the forming process of above-mentioned sputtered films of bismuth 5, shown in Fig. 1 (a), will be blended into foreign matter in the epithelium (smear metal that brings from last procedure, the leather diaphragm that produces in this operation, splash etc.) sometimes attached to spraying plating substrate (cylinder internal surface of hole 3a) or in spraying plating processing and in skin membrane, produce thrust 49 as foreign matter for nuclear.
Therefore, in the present embodiment, shown in the flow chart figure of Fig. 4, after spraying plating begins (S1), become at sputtered films of bismuth 5 before the thickness of regulation, temporarily stop spraying plating operation (S2).Stopping opportunity as this, spray torch 7 being come and gone when forming the regulation thickness 20 times, is to come and go 16 times time point for example.
Under the above-mentioned state that stops the spraying plating operation like that,, when having found thrust 49, utilize graver, a word silk cutter to remove thrust 49 (S4) with manual operations detecting above-mentioned thrust 49 (S3) by visual observation.
Then, after removing thrust 49, shown in Fig. 1 (b), begin the spraying plating operation again, make spray torch 7 carry out remainingly come and go moving for 4 times and making sputtered films of bismuth 5 become regulation thickness (S5).At this moment, also be attached with melting material at the position of removing thrust 49 and solidify formation and the roughly the same thickness of regulation thickness.
Afterwards, as shown in Figure 5, make periphery possess hone 55 rotations of grinding tool 53 and make its round vertically moving simultaneously, carry out precision work (S6), become the state of Fig. 1 (c) thereby grinding is carried out on the surface of sputtered films of bismuth 5 at honing head 51.
In addition, the position that has thrust 49 in sputtered films of bismuth 5, the thickness of sputtered films of bismuth 5 is thinner slightly than other position, forms small recess 57 like that shown in Fig. 1 (b).Therefore, process by above-mentioned honing and to carry out machining, become and to guarantee that the such regulation thickness ground of final cylinder hole internal diameter forms sputtered films of bismuth 5 up to the position of removing this recess 57.
To the machining of the internal surface 3a in cylinder hole 3, be implemented in the detection of defects (S7) whether the surface of sputtered films of bismuth 5 has produced depression by above-mentioned operation at last.In addition, in honing processing,, implement roughing operation, finishing step successively by changing the granularity of the grinding tool that uses.
In addition, though do not illustrate especially, periphery at above-mentioned honing head 51 has the exit air that inner diameter measurement is used, has air-gauge, add man-hour carrying out honing, from the exit air exhausted air, this air-gauge detects its outlet pressure and it is transformed into electrical signal, measure internal diameter by this air-gauge, the time point that reaches the value of regulation at this observed value finishes honing processing.
When carrying out above-mentioned precision work, remove thrust 49 in advance, therefore can suppress the generation of the pit (depression) that caused because of coming off of thrust 49, can suppress the generation of substandard products and boost productivity.
At this moment, in the present embodiment, under the state that temporarily stops the spraying plating operation, detect thrust 49 and be removed, therefore can carry out the detection of thrust 49 more accurately and remove operation by visual observation.
In addition, by suppressing the generation of depression, can solve the problem that diminishes commodity, promptly when the volume that suppresses to be detained because of oil increases the oilconsumption that is caused and increases, inhibition reduces the deterioration of the inhibition motor performance that gushes out of the seepage gas that is caused because of the stopping property of piston ring, suppress card when sliding in addition and hang peeling off of the sputtered films of bismuth that caused, suppress duty of engine weather resistance deterioration etc. because of piston ring.
And foreign matter also contains the thrust 49 that forms highlightedly on cylinder internal surface of hole 3a, therefore can utilize instruments such as graver, a word silk cutter easily to remove this thrust 49.
Fig. 6 is the action specification figure of the sputtered films of bismuth formation method of expression the 2nd embodiment of the present invention.This embodiment is shown in the flow chart figure of Fig. 7, after beginning (S1) in spraying plating, make spray torch 7 proceed to spray melting material not stopping the spraying plating operation and proceed to remove between the spraying plating operational period thrust 49, and proceed the spraying plating operation simultaneously up to making sputtered films of bismuth 5 reach regulation thickness (S10).
Particularly, as shown in Figure 6, with spraying component be the opposition side of emission direction of spraying 44 of the top periphery of spray torch 7, in other words, on the positions of 180 degree of along the circumferential direction staggering with respect to spraying 44 emission direction towards the internal surface 3a in cylinder hole 3 give prominence to be provided with and remove instrument 59 as the foreign matter of foreign substance removing member.
Above-mentioned foreign matter remove instrument 59 can be for example the spring-like tinsel, be located at the cutting tool (cutting knife) 47 etc. of the top periphery of above-mentioned boring bar 45 shown in Figure 3.In addition, spray torch 7 is being inserted under the state that carries out spraying plating in the cylinder hole 3, the top that foreign matter is removed instrument 59 is in and has the position of leaving for the surface of the sputtered films of bismuth 5 of regulation thickness of one's own, has set the clearance C of 150 μ m～200 μ m at the two.
In the 2nd embodiment, shown in the flow chart figure of Fig. 7, after spraying plating begins, produce and the same thrust 49 of the 1st embodiment, this thrust 49 from the sputtered films of bismuth 5 of stipulating thickness with the surface shown in the two dot chain line when outstanding, the top that the foreign matter of being located at the periphery of the spray torch 7 in the rotation is removed instrument 59 contacts with thrust 49 and scrapes and remove thrust 49.
At this moment, spray torch 7 begins ceaselessly to continue to carry out the spraying plating operation from spraying plating, also carries out spraying plating with respect to the internal diameter internal surface 3a that contains the recess 61 of having removed thrust 49 positions after removing thrust 49, makes whole sputtered films of bismuth become the regulation thickness.In addition, in the 2nd embodiment, when making sputtered films of bismuth 5 form the regulation thickness, spray torch 7 is is for example come and gone 20 times.
Afterwards, after similarly utilizing honing processing etc. to carry out precision work (S6), be implemented in the detection of defects (S7) whether the surface of sputtered films of bismuth 5 has produced depression with the 1st embodiment.
Like this, in the 2nd embodiment, continuing to carry out removing between the spraying plating operational period thrust 49, therefore comparing, boosting productivity with the temporary transient situation that stops the spraying plating operation as the 1st embodiment.
At this moment, in the present embodiment, being provided with foreign substance removing member at the peripheral part of spraying plating spray nozzle part 9 is that foreign matter is removed instrument 59, therefore can easily carry out removing of thrust 49 making 9 rotations of spraying plating spray nozzle part and moving vertically simultaneously and continue to carry out between the spraying plating operational period.
In addition, in the present embodiment, become at sputtered films of bismuth 5 under the state of regulation thickness, the top that foreign matter is removed instrument 59 is located at the position of leaving from the surface of sputtered films of bismuth 5, does not contact mutually, and therefore can not influence sputtered films of bismuth 5 ground only removes thrust 49.
And, in the present embodiment, foreign matter is removed instrument 59 be located at the opposite side of emission direction with the spraying 44 of spray torch 7, therefore the thrust of removing in the spraying plating operation 49 is difficult to be blended in the spraying 44 of opposition side ejection, can avoid the generation to the secondary thrust of sputtered films of bismuth 5 that is caused because of the thrust of removing 49.
In addition, in the 2nd embodiment foreign matter is removed instrument 59 integrated being located on the spray torch 7, also can outside spray torch 7, adopt boring bar 45 shown in Figure 3 that foreign substance removing member is set in addition.
At this moment, after utilizing spray torch 7 to carry out above-mentioned only 16 round spraying plating operations, with states with spray torch 73 extractions from the cylinder hole, make foreign substance removing member rotation and be inserted into cylinder hole 3 simultaneously and carry out foreign matter interiorly and remove, after removing foreign matter, under the state that foreign substance removing member is extracted out from cylinder hole 3, utilize spray torch 7 to begin the spraying plating operation again and make sputtered films of bismuth 5 become the regulation thickness.
Fig. 8 (a) is the action specification figure of the sputtered films of bismuth formation method of expression the 3rd embodiment of the present invention.This embodiment is equipped with cutting tool 65 in the top of spraying plating spray nozzle part 9 periphery, is provided with the laser sensor 69 that conduct detects the thrust detection part of thrust 67 at top end face simultaneously.
Fig. 9 is the flow chart figure of the 3rd embodiment, is provided with the laser sensor 69 that utilizes thrust 67 and detects, utilizes that cutting tool 65 carries out removes operation (S20) and utilize as the visual observation of the thrust 49 of above-mentioned the 1st embodiment shown in Figure 4 detects remove (S4) of (S3) and thrust to substitute.
The detection of this thrust 67, remove operation (S20) shown in the schema of Figure 10 of the control action of expression controller 25.Promptly, utilize as behind the above-mentioned spraying plating membrane formation device shown in Figure 2 formation sputtered films of bismuth 5, utilize cutting tool shown in Figure 8 65 to remove thrust 67, at this moment, the state that overlaps with the central axis P in cylinder hole 3 with the central axis Q with spraying plating spray nozzle part 9 makes spraying plating spray nozzle part 9 with the certain speed rotation, is inserted into simultaneously in the cylinder hole 3 and moves (S201) vertically.
The rotational trajectory 71 of the cutting tool 65 when Fig. 8 (b) expression makes 9 rotations of spraying plating spray nozzle part is for the central axis P with cylinder hole 3 is a central circular.
Towards cylinder internal surface of hole 3a ground irradiating laser, judge whether to detect thrust 67 (S202) from laser sensor 69 this moment.If detect thrust 67, make spray torch 7 integral body that contain spraying plating spray nozzle part 9 axial translational speed, be that the speed of feed (S203) of cutting tool 65 is slower than the speed of feed before detecting thrust 67.The speed of feed of cutting tool 65 of this moment is to make cutting tool 65 can not bear bigger load and utilize the cutting energy high-level efficiency to remove the speed of the degree of thrust 67.
Afterwards, whether reduced specified amount (S204) when judging the duty ratio grinding thrust 67 that cutting tool 65 bears,, then regarded as and finish removing of thrust 67 if reduced specified amount.Then, if utilize laser sensor 69 to detect the end (S205) in cylinder hole 3, regard the detection operation of thrust 67 in the entire axial length in cylinder hole 3 as and finish and the detection of end operation.
When above-mentioned steps S202 did not detect thrust 67, that transfers to above-mentioned steps S205 carried out the end detection in cylinder hole 3 by laser sensor 69.
Resistance when in addition, the detection of the 65 suffered loads of the cutting tool in above-mentioned steps S204 can be with spraying plating 9 rotations detects as the distortion of the suitable position of spraying plating for example 9.In addition, also can carry out the judgement that removing of thrust 67 finished, to substitute the detection of cutting tool 65 suffered loads according to whether having passed through the specified time.That is, rule of thumb set in advance and remove the required time of thrust 67, when surpassing this setting-up time, then be considered as removing of thrust 67 and finish.
After carrying out the detection of thrust 67 like this and removing, turn back to above-mentioned Fig. 9, spray torch 7 is come and gone once again move and make sputtered films of bismuth 5 become regulation thickness (S5) to wait and the same operation of the 1st embodiment.
In the 3rd embodiment, when detecting thrust 67, make the speed of feed of spray torch 9 more slack-off like this, utilize cutting tool 65 to remove thrust 67 than speed before this.Therefore, up to detecting thrust 67, as far as possible with spray torch 7 move axially speed setting hurry up, just after detecting, remove slack-off getting final product in the thrust 67, therefore can high-level efficiency carry out the detection of thrust 67 and remove operation.
In addition, in above-mentioned the 3rd embodiment, before the operation of removing thrust 67, make spray torch 7 carry out coming and going for 16 times mobile so repeatedly coming and going and move, after the operation of removing thrust 67, also make spray torch 7 carry out coming and going for 4 times and move so repeatedly round moving.
But, after the operation of removing this thrust 47, spray torch 7 is moved 1 time at least to a direction along the internal surface 3a in cylinder hole 3.
That is, at this moment, also can be after making spray torch 7 move to the detection operation of finishing thrust 67 bottom among Fig. 8, make from this state spray torch 7 towards above when moving 1 time only from spraying plating spray nozzle part 9 ejection melting materials.Thus, after the detection operation of thrust 67 is finished, utilize the action that spray torch 7 is extracted out in cylinder hole 3 can form sputtered films of bismuth 5, can carry out operation extremely expeditiously.
In addition, in the above-described 3rd embodiment, the speed of feed of the cutting tool 65 that slowed down, the speed of rotation of cutting tool 65 (the spraying plating spray nozzle part 9) that both can slow down, speed of feed and speed of rotation also can slow down.
Figure 11 (a) is the action specification figure of the sputtered films of bismuth formation method of expression the 4th embodiment of the present invention.This embodiment is made as roughly half with respect to as shown in Figure 8 the 3rd embodiment with the diameter (thickness) of spraying plating spray nozzle part 9, and makes the central axis P biasing of the central axis Q of spraying plating spray nozzle part 9 with respect to cylinder hole 3.
Making spraying plating spray nozzle part 9 with this state is middle heart rotation (rotation) with its central axis Q, and the integral body that makes spray torch 7 simultaneously is that the center is rotated (rotation) with the central axis P in cylinder hole 3.In addition, with the central axis Q of this moment be the center sense of rotation and, with central axis P to be that the sense of rotation at center for example is made as clockwise direction in Figure 11 (b) equidirectional, and is that the speed of rotation at center is faster than being the speed of rotation at center with central axis P with central axis Q.
In addition, in this embodiment, make the mechanism of spray torch 7 whole rotations (revolution) rather complicated, therefore making cylinder body 1 is that the center is rotated better with the central axis P in cylinder hole 3.The sense of rotation of the cylinder body 1 of this moment and the sense of rotation reverse direction each other that with central axis Q is the center.
Thereby the rotational trajectory of the cutting tool 65 when making spraying plating spray nozzle part 9 rotation of this embodiment is that the rotational trajectory 73 of the cutting tool 65 at center is the shape that the center is rotated for the central axis P with cylinder hole 3 with central axis Q shown in Figure 11 (b).
Flow chart and above-mentioned the 3rd embodiment shown in Figure 9 as above-mentioned the 4th embodiment are same, and be same at the schema of detection, the control action of removing the controller 25 in the operation and Figure 10 of the thrust 67 of Fig. 9 in addition.
Just, in the 4th embodiment, remove thrust 67 along with utilizing cutting tool 65 to grind, spraying plating spray nozzle part 9 is radially slowly moved towards the internal surface 3a in cylinder hole 3, thereby can not can make cutting tool 65 bear bigger load and high-level efficiency is removed thrust 67.
In addition, in the 4th embodiment, the external diameter of spraying plating spray nozzle part 9 (thickness) is littler than the 3rd embodiment, makes the central axis P biasing of its central axis Q with respect to cylinder hole 3, even therefore the internal diameter in cylinder hole 3 is that various occasion also can be tackled, versatility is good.
In addition, in each above-mentioned embodiment, be not only limited to the 4th embodiment of Figure 11, also can not make spray torch 7 rotations, is middle heart rotation and make cylinder body 1 with the central axis P in cylinder hole 3, in addition, spray torch 7 is moved vertically and cylinder body 1 is moved vertically.That is, spraying plating spray nozzle part 9 is relatively moved vertically with respect to cylinder hole 3 and rotate relatively simultaneously.
Claims (16)
1. sputtered films of bismuth formation method, be used for forming sputtered films of bismuth on the surface of workpiece, it is characterized in that, jet surface melting material towards above-mentioned workpiece, form above-mentioned melting material on above-mentioned surface and solidify the sputtered films of bismuth that forms, remove the foreign matter that is blended in the above-mentioned sputtered films of bismuth in the operation of the formation sputtered films of bismuth before precision work is carried out on the surface of above-mentioned sputtered films of bismuth, spray above-mentioned melting material and form the sputtered films of bismuth of regulation thickness on above-mentioned surface.
2. sputtered films of bismuth formation method according to claim 1, it is characterized in that, in forming the operation of above-mentioned sputtered films of bismuth, be included in the operation that the formation of removing the operation that is blended into the foreign matter in the above-mentioned sputtered films of bismuth under the state of the formation that temporarily stops sputtered films of bismuth, beginning sputtered films of bismuth more afterwards forms the sputtered films of bismuth of regulation thickness.
3. sputtered films of bismuth formation method according to claim 2, it is characterized in that, be included in implement before the operation of removing above-mentioned foreign matter, make the spraying component that sprays above-mentioned melting material spray above-mentioned melting material and along the surface of above-mentioned workpiece with respect to this workpiece surface carry out repeatedly coming and going the operation that moves, removing the operation of above-mentioned foreign matter after enforcement, make above-mentioned spraying component spray above-mentioned melting material in, carry out at least 1 time mobile operation to a direction with respect to this workpiece surface along the surface of above-mentioned workpiece.
4. according to any described sputtered films of bismuth formation method in the claim 1～3, it is characterized in that, the surface of above-mentioned workpiece is a cylinder inner surface, make foreign substance removing member with respect to this cylinder inner surface along axially relatively moving and rotate relatively and remove above-mentioned foreign matter in the cylinder, when removing above-mentioned foreign matter, the relative moving speed of above-mentioned foreign substance removing member and at least one of relative rotational are more slack-off than removing above-mentioned foreign matter front and back.
5. sputtered films of bismuth formation method according to claim 1, it is characterized in that, in forming the operation of above-mentioned sputtered films of bismuth, be included in and continue to spray the operation that the formation of removing the operation that is blended into the foreign matter in the above-mentioned sputtered films of bismuth during the above-mentioned melting material, beginning sputtered films of bismuth more afterwards forms the sputtered films of bismuth of regulation thickness.
6. sputtered films of bismuth formation method according to claim 1 is characterized in that, above-mentioned workpiece is the cylinder body of engine, forms above-mentioned sputtered films of bismuth on the cylinder internal surface of hole of this cylinder body.
7. sputtered films of bismuth formation method according to claim 1 is characterized in that above-mentioned foreign matter comprises the thrust on the surface that is formed on above-mentioned sputtered films of bismuth highlightedly.
8. a spraying plating membrane formation device is characterized in that, comprises spraying component and foreign substance removing member; Above-mentioned spraying component relatively moves towards the jet surface melting material of workpiece and along above-mentioned surface; Above-mentioned foreign substance removing member is utilized the rotation of this spraying component and the axial mobile foreign matter of removing in the surperficial formed sputtered films of bismuth that is blended into above-mentioned workpiece.
9. spraying plating membrane formation device according to claim 8 is characterized in that, above-mentioned foreign substance removing member is removed above-mentioned foreign matter under the state that stops above-mentioned spraying component formation sputtered films of bismuth.
10. spraying plating membrane formation device according to claim 8 is characterized in that, above-mentioned foreign substance removing member and above-mentioned spraying component are made as one, is continuing to carry out removing of above-mentioned foreign matter during this spraying component sprays melting material.
11. according to claim 9 or 10 described spraying plating membrane formation devices, it is characterized in that, the surface of above-mentioned workpiece is a cylinder inner surface, above-mentioned spraying component relatively moves while rotating vertically relatively in having the workpiece of above-mentioned cylinder inner surface, is provided with above-mentioned foreign substance removing member at the peripheral part of a side opposite with the emission direction of the melting material of above-mentioned spraying component.
12. spraying plating membrane formation device according to claim 11 is characterized in that, is set with the gap between the top of above-mentioned foreign substance removing member and the surface of above-mentioned sputtered films of bismuth.
13. spraying plating membrane formation device according to claim 11 is characterized in that, the rotation center axis of the above-mentioned spraying component cylinder center's axis with respect to above-mentioned workpiece is staggered along diametric(al).
14. spraying plating membrane formation device according to claim 11, it is characterized in that, on above-mentioned spraying component, be provided with the thrust detection part that detects above-mentioned thrust, when this thrust detection part detected above-mentioned thrust, at least one that makes the relative moving speed of above-mentioned foreign substance removing member and relative rotational was more slack-off than detecting before the above-mentioned foreign matter.
15. spraying plating membrane formation device according to claim 8 is characterized in that, above-mentioned workpiece is the cylinder body of engine, forms above-mentioned sputtered films of bismuth on the cylinder hole of cylinder body.
16. spraying plating membrane formation device according to claim 8 is characterized in that above-mentioned foreign matter comprises the thrust on the surface that is formed on above-mentioned sputtered films of bismuth highlightedly.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007195963 | 2007-07-27 | ||
| JP2007195963 | 2007-07-27 | ||
| JP2007-195963 | 2007-07-27 | ||
| JP2008-105477 | 2008-04-15 | ||
| JP2008105477A JP5266851B2 (en) | 2007-07-27 | 2008-04-15 | Thermal spray coating forming method and thermal spray coating forming apparatus |
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| CN102133561B (en) * | 2010-01-27 | 2013-11-20 | 鸿富锦精密工业（深圳）有限公司 | Coating device |
| JP5794017B2 (en) * | 2011-07-26 | 2015-10-14 | 日産自動車株式会社 | Thermal spray coating forming method and thermal spray coating forming apparatus |
| US9695497B2 (en) | 2012-03-06 | 2017-07-04 | Nissan Motor Co., Ltd. | Method for finishing work of spray-coated surface and working tool |
| CN104372282A (en) * | 2014-11-13 | 2015-02-25 | 苏州速腾电子科技有限公司 | Metal conducting ring sheet copper-plating device |
| DE102015109873A1 (en) * | 2015-06-19 | 2016-12-22 | Ks Huayu Alutech Gmbh | Thermal spraying process |
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| JP2642556B2 (en) * | 1992-02-05 | 1997-08-20 | 新日本製鐵株式会社 | Thermal spray coating formation method |
| JPH1150225A (en) * | 1997-07-29 | 1999-02-23 | Suzuki Motor Corp | Metal thermal spraying method |
| JP3780840B2 (en) * | 2000-11-16 | 2006-05-31 | 日産自動車株式会社 | Pre-spraying shape of the inner surface of a cylinder |
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