CN101345136B - Solid tantalum electrolytic capacitor and manufacturing method thereof - Google Patents

Solid tantalum electrolytic capacitor and manufacturing method thereof Download PDF

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Publication number
CN101345136B
CN101345136B CN2007100494976A CN200710049497A CN101345136B CN 101345136 B CN101345136 B CN 101345136B CN 2007100494976 A CN2007100494976 A CN 2007100494976A CN 200710049497 A CN200710049497 A CN 200710049497A CN 101345136 B CN101345136 B CN 101345136B
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China
Prior art keywords
pedestal
electrolytic capacitor
tantalum electrolytic
capacitor
solid tantalum
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Expired - Fee Related
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CN2007100494976A
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Chinese (zh)
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CN101345136A (en
Inventor
李绍荣
田明宪
孔浩
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SICHUAN DONGSHENG ELECTRONIC TECHNOLOGY Co Ltd
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SICHUAN DONGSHENG ELECTRONIC TECHNOLOGY Co Ltd
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Publication of CN101345136A publication Critical patent/CN101345136A/en
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Abstract

The invention discloses a solid Ta electrolytic capacitor; the basic structure of the solid Ta electrolytic capacitor comprises a shell, a Ta core, an insulator, an anode lead-out wire, a cathode lead-out wire, wherein, the anode lead-out wire (5) and the cathode lead-out wire (6) are respectively passed through by a thin-sheet shaped anode base (91) and a thin-sheet shaped cathode base (92); polytetrafluoroethylene washers (10) are respectively separated between the ends of two poles and the base; the ends of two poles of the capacitor and the polytetrafluoroethylene washer, and the polytetrafluoroethylene washer and the base are respectively bonded fixedly by silicon rubber; the invention also discloses a solid Ta electrolytic capacitor and a preparation method thereof; the Ta electrolytic capacitor has the advantages of small installation dimension, convenient installation, firm fixing and wider application.

Description

A kind of solid tantalum electrolytic capacitor and manufacture method thereof
Technical field
But solid tantalum electrolytic capacitor and manufacture method thereof that to the present invention relates to a kind of valve metal tantalum be anode.
Background technology
Along with electronic message unit constantly develops to miniaturization, digitlization direction, require the volume of the solid electrolyte Ta capacitor of present metallic packaging constantly to dwindle, installation dimension constantly reduces, and the product convenient fixing is reliable, to satisfy the needs of device miniaturization such as Aeronautics and Astronautics, communication.
Existing technology is:
On structure, existing product is made up of 6 parts among Fig. 1, when installing on the plate of On-line Product road, negative outside wire bends from product negative pole end face 3~5mm place, positive terminal is from sealing the bending of solder joint 5~7mm place, with positive and negative lead wires welding (as Fig. 2) in the circuit board, take directly fixing at last or soft fixedly rigidity is fixed (as Fig. 3, Fig. 4) and fixed product.There is following shortcoming in this infrastructure product in actual installation:
1. the installation dimension of product is big, and being of a size of Φ 8 * 22 (mm) product with outward appearance is example, and the length of product is 22mm, add two lead-in wire bending length, product length in the vertical is 32~34mm, in the horizontal, because adopt the rigidity geometrical clamp, its width is also at 12~16mm.
2. install inconvenient, because diameter is big at the product weight of 8mm length more than 22mm, necessarily require during installation to adopt rigidity to fix, for the strict especially circuit of volume requirement, do not have the fixed space of steel clamping, that gives product has fixedly brought great difficulty at all.
3. install and fix insecure, for the product of Φ below 8 * 22, often adopt soft fixing, and then fix with silicon rubber, when product is applied to do the equipment of satellite, guided missile or aircraft of high-speed motion, because product is fixing not firm, the shearing force that produces because of resonance is big, causes the product wire breaking easily.
Because the problem of above existence has influence on the scope of application of this product in electronic circuit.
Summary of the invention
The purpose of this invention is to provide that a kind of installation dimension is little, installing space is little, easy for installation, firm solid tantalum electrolytic capacitor.
Another object of the present invention provides a kind of manufacture method of above-mentioned solid tantalum electrolytic capacitor.
In order to achieve the above object, the present invention adopts following technical scheme: a kind of solid tantalum electrolytic capacitor, comprise shell, tantalum fuse, insulator, anode tap, cathode leg, on anode tap and cathode leg, be installed with laminar anode pedestal and negative electrode pedestal respectively, between end, capacitor the two poles of the earth and pedestal, be separated with teflon gasket respectively, paste fixing between end, capacitor the two poles of the earth and the teflon gasket, between teflon gasket and the pedestal respectively with silicon rubber.
The pedestal of above-mentioned solid tantalum electrolytic capacitor can adopt electric conducting materials such as copper, aluminium, nickel; The surface can be zinc-plated.
The top of described anode pedestal and negative electrode pedestal is identical or smaller with the shape size of end, capacitor the two poles of the earth, the bottom bending of anode pedestal and negative electrode pedestal.
Described anode tap and cathode leg are connected by soldering or plasma welding or Laser Welding mode with anode pedestal and negative electrode pedestal respectively.
All in the bending of distance capacitor case 0.2-5mm place, this bending part is laminar for described anode pedestal and negative electrode pedestal; During installation, bending part and circuit board by pedestal are connected and fixed.
The bending part of described pedestal is bending to the inside.
The described solid tantalum electrolytic capacitor of stating is connected and fixed by the soldering mode between the bending part of described pedestal and the circuit board when mounted.
The manufacture method of described solid tantalum electrolytic capacitor, undertaken by following key step:
1. make solid tantalum electrolytic capacitor basic structure: according to the manufacture method of prior art solid tantalum electrolytic capacitor, finish the moulding, formation, tunicle, impregnated graphite silver slurry, the assembly process that mainly comprise the tantalum piece, overlap the polyester Heat-Shrinkable Tubings then, after pyrocondensation is solidified, hand over next procedure;
2. mounted base: respectively put teflon gasket in end, capacitor the two poles of the earth, overlap top base then, fix, again lead-in wire is cut, with soldering or plasma welding mode pedestal and capacitor lead wire are linked together at last with silicon rubber.
Compared with prior art, the invention has the beneficial effects as follows:
Tantalum electrolytic capacitor of the present invention is drawn the alternative lead-out wire of the prior art of mount fixing structure with pedestal and drawn fixed structure, and the bending part of its pedestal employing bending to the inside, can reduce the capacitor own vol, and installation dimension is obviously reduced, and is easy for installation; And it is connected and fixed with laminated structure and circuit board, and it is big to connect area, and is fixing comparatively firm; In addition, easy for installation firm because the surface mount solid-electrolyte tantalum capa-citor installation dimension that the present invention makes is little, all right simultaneously several assemblings in parallel have been saved installing space greatly, thereby can be applied to widely in the various electronic circuits.
Description of drawings
Fig. 1 is a prior art solid tantalum electrolytic capacitor structural representation;
Fig. 2 is the scheme of installation of prior art solid tantalum electrolytic capacitor on electronic circuit;
Fig. 3 is a prior art solid tantalum electrolytic capacitor fixed form schematic diagram when mounted;
Fig. 4 is the fixed form schematic diagram of prior art solid tantalum electrolytic capacitor when installing by screw;
Fig. 5 is a solid tantalum electrolytic capacitor front view of the present invention;
Fig. 6 is the right view of Fig. 5.
Among Fig. 1-6, the 1st, shell, the 11st, polyester Heat-Shrinkable Tubings, the 2nd, the tantalum fuse, the 3rd, insulator, the 4th, seal soldered ball, the 5th, anode tap, the 6th, cathode leg, the 7th, steel folder, the 8th, fixing screw hole, the 91st, anode pedestal, the 92nd, negative electrode pedestal, the 93rd, the bending part of pedestal, the perforation of 61 anode taps, the 10th, teflon gasket.
Embodiment
The present invention is described in further detail below in conjunction with embodiment.
Embodiment 1
The basic structure of present embodiment solid tantalum electrolytic capacitor mainly by shell 1 (can be silver-colored shell or tantalum shell), tantalum fuse 2, insulator 3, seal soldered ball 4, anode tap 5, cathode leg 6, polyester Heat-Shrinkable Tubings 11 and constitute, wherein, as Fig. 5, shown in Figure 6: be installed with laminar anode pedestal 91 and negative electrode pedestal 92 on anode tap 5 and cathode leg 6 respectively, anode tap 5 and cathode leg 6 are connected by soldering or plasma welding or Laser Welding mode with anode pedestal 91 and negative electrode pedestal 92 respectively.The top of anode pedestal 91 and negative electrode pedestal 92 is identical or smaller with the shape size of end, capacitor the two poles of the earth, anode pedestal 91 and negative electrode pedestal 92 bottoms all bend at distance capacitor case 0.2-5mm place, this bending part 93 is laminar, the bending part 93 of pedestal is bending to the inside, during installation, be connected and fixed by the soldering mode between the bending part 93 of pedestal and the circuit board.Be separated with teflon gasket 10 between end, the two poles of the earth and pedestal respectively, this teflon gasket 10 also is to be through respectively on anode tap 5 and the cathode leg 6, and described pedestal adopts the outer tin coating of copper sheet to make.Be respectively equipped with anode tap perforation 51 and cathode leg perforation in the middle of the pedestal, can allow anode tap 5 and cathode leg 6 therefrom pass, between end, capacitor the two poles of the earth and the teflon gasket 10, between teflon gasket 10 and the pedestal, paste fixing respectively with silicon rubber.
Embodiment 2
Present embodiment is the manufacture method of the solid tantalum electrolytic capacitor of the foregoing description 1, comprises following key step:
1. make solid tantalum electrolytic capacitor basic structure: according to the manufacture method of prior art solid tantalum electrolytic capacitor, finish operations such as moulding, formation, tunicle, impregnated graphite silver slurry, assembling, cover polyester Heat-Shrinkable Tubings on shell is handed over next procedure after pyrocondensation is solidified then;
2. mounted base: respectively overlap the last layer teflon gasket in end, capacitor the two poles of the earth, overlap top base then, fix, again lead-in wire is cut, with soldering or laser mode pedestal and capacitor lead wire are welded together at last with silicon rubber.
The surface mount solid-electrolyte tantalum capa-citor installation dimension that the present invention makes is little, and is easy for installation firm, and installing space has been saved in all right simultaneously several assemblings in parallel greatly.

Claims (7)

1. solid tantalum electrolytic capacitor, comprise shell, tantalum fuse, insulator, anode tap, cathode leg, it is characterized in that: on anode tap (5) and cathode leg (6), be installed with laminar anode pedestal (91) and negative electrode pedestal (92) respectively, between end, capacitor the two poles of the earth and pedestal, be separated with teflon gasket (10) respectively, paste fixing between end, capacitor the two poles of the earth and the teflon gasket (10), between teflon gasket (10) and the pedestal respectively with silicon rubber.
2. solid tantalum electrolytic capacitor according to claim 1, it is characterized in that: the top of described anode pedestal (91) and negative electrode pedestal (92) is identical or smaller with capacitor the two poles of the earth end shape size, the bottom bending of anode pedestal (91) and negative electrode pedestal (92).
3. solid tantalum electrolytic capacitor according to claim 1 is characterized in that: described anode tap (5) and cathode leg (6) are connected by soldering or plasma welding or Laser Welding mode with anode pedestal (91) and negative electrode pedestal (92) respectively.
4. solid tantalum electrolytic capacitor according to claim 2 is characterized in that: all in the bending of distance capacitor case 0.2-5mm place, this bending part (93) is laminar for described anode pedestal (91) and negative electrode pedestal (92); During installation, the bending part (93) by pedestal is connected and fixed with circuit board.
5. solid tantalum electrolytic capacitor according to claim 4 is characterized in that: the bending part of described pedestal (93) is bending to the inside.
6. according to claim 4 or 5 described solid tantalum electrolytic capacitors, it is characterized in that: when mounted, be connected and fixed by the soldering mode between bending part of described pedestal (93) and the circuit board.
7. the manufacture method as claim 1 or 2 or 3 or 4 or 5 described solid tantalum electrolytic capacitors is characterized in that, comprises following key step:
1. make solid tantalum electrolytic capacitor basic structure: according to the manufacture method of prior art solid tantalum electrolytic capacitor, finish moulding, formation, tunicle, impregnated graphite silver slurry, assembly process, overlap the polyester Heat-Shrinkable Tubings then, after pyrocondensation is solidified, hand over next procedure;
2. mounted base: respectively put teflon gasket in end, capacitor the two poles of the earth, overlap top base then, fix, again lead-in wire is cut, with soldering or plasma welding mode pedestal and capacitor lead wire are linked together at last with silicon rubber.
CN2007100494976A 2007-07-12 2007-07-12 Solid tantalum electrolytic capacitor and manufacturing method thereof Expired - Fee Related CN101345136B (en)

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Application Number Priority Date Filing Date Title
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CN101345136B true CN101345136B (en) 2010-12-22

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101840783B (en) * 2010-04-16 2012-05-02 株洲宏达电子有限公司 Lead-out method for lead-out wire of tantalum electrolytic capacitor of full tantalum shell and capacitor
CN109817461B (en) * 2019-03-08 2021-09-28 中国振华(集团)新云电子元器件有限责任公司 Welding process for positive electrode patch and negative electrode patch of non-electrolyte tantalum electrolytic capacitor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6768632B2 (en) * 2002-08-28 2004-07-27 Matsushita Electric Industrial Co., Ltd. Aluminum electrolytic capacitor and method of manufacturing the same
CN1694198A (en) * 2005-05-18 2005-11-09 中国振华(集团)新云电子元器件有限责任公司 High backward voltage resistance capacitor
CN201084556Y (en) * 2007-07-12 2008-07-09 四川东盛电子科技有限公司 A solid tantalum electro-analysis capacitor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6768632B2 (en) * 2002-08-28 2004-07-27 Matsushita Electric Industrial Co., Ltd. Aluminum electrolytic capacitor and method of manufacturing the same
CN1694198A (en) * 2005-05-18 2005-11-09 中国振华(集团)新云电子元器件有限责任公司 High backward voltage resistance capacitor
CN201084556Y (en) * 2007-07-12 2008-07-09 四川东盛电子科技有限公司 A solid tantalum electro-analysis capacitor

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