CN101340469A - Mobile phone shell and preparation method thereof - Google Patents

Mobile phone shell and preparation method thereof Download PDF

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Publication number
CN101340469A
CN101340469A CNA2007101227347A CN200710122734A CN101340469A CN 101340469 A CN101340469 A CN 101340469A CN A2007101227347 A CNA2007101227347 A CN A2007101227347A CN 200710122734 A CN200710122734 A CN 200710122734A CN 101340469 A CN101340469 A CN 101340469A
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Prior art keywords
phone housing
preparation
mobile phone
embossment
relief
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CNA2007101227347A
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Chinese (zh)
Inventor
罗文海
袁锋
谭熙伟
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BYD Co Ltd
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BYD Co Ltd
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Priority to CNA2007101227347A priority Critical patent/CN101340469A/en
Publication of CN101340469A publication Critical patent/CN101340469A/en
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Abstract

The invention provides a mobile phone housing which comprises a housing body and a relief, wherein, the housing body and the relief are an integrated structure. The invention further provides a method for preparing the mobile phone housing, and the method comprises the steps as follows: a mold with a relief pattern is prepared; after that, material of the mobile phone housing is injected and molded on the mold with the relief pattern, thereby obtaining an injection molded product with the relief; then the injection molded product with the relief is sequentially coated and spray painted, thereby obtaining the mobile phone housing with the relief. As the housing body and the relief of the mobile phone housing provided by the invention are the integrated structure, the service life of the mobile phone housing is greatly improved, and the relief with good effect further gives good appearance effect to the mobile phone housing, thereby leading the mobile phone housing provided by the invention to simultaneously have the advantages of long service life and aesthetic appearance. The method for preparing the mobile phone housing provided by the invention has high processing precision and does not use chemicals during the etching process, thereby having no environmental damage.

Description

A kind of phone housing and preparation method thereof
Technical field
The invention relates to a kind of phone housing and preparation method thereof.
Background technology
Phone housing adopts embossment to decorate usually, and the rete that the method that the phone housing that has embossment at present adopts the surface to fit usually will have embossment is fitted on the outer cover body by adhesive.The shortcoming of this phone housing is that to have the rete and an applying between outer cover body of embossment insecure, causes useful life of phone housing short and anaglyph is poor.
In the prior art, prepare the method that the rete with embossment adopts injection moulding usually, promptly use the method for chemical etching that mould is carried out texture processing, prepare mould with embossing pattern; Carry out injection mo(u)lding then, obtain having the rete of embossment.
For example, disclose a kind of method of forming small pattern on surface of hard object among the CN1868719A, this method comprises that processing and fabricating has the mould of definite shape die cavity; The zone that needs then to form embossed pattern in die cavity pastes a layered paper, and goes out required figure with laser processing on paster; Subsequently figure (zone that the embossed pattern forms) paster in addition that processes is removed, utilized chemical etching not have the part of paster then, form mould with embossed pattern; Use mould to carry out injection mo(u)lding at last, obtain having the hard produce product of small embossed pattern with embossed pattern.Yet the shortcoming of this method is that machining accuracy is low; And employed chemicals is very big to environmental hazard in etching process.
Summary of the invention
The objective of the invention is provides a kind of long service life and anaglyph good phone housing in order to overcome the shortcoming of short and anaglyph difference in the useful life that exists in the existing phone housing.
Another object of the present invention is the phone housing preparation method for a kind of machining accuracy height being provided and environment being safe from harm.
The invention provides a kind of phone housing, this phone housing comprises outer cover body and embossment, and wherein, described outer cover body and embossment are integrative-structures.
The invention provides a kind of preparation method of phone housing, this method comprises that preparation has the mould of embossing pattern; Subsequently the material of phone housing is carried out injection mo(u)lding having on the mould of embossing pattern, obtain having the injection moulding product of embossment; The injection moulding product with embossment that will obtain then carries out plated film successively and sprays paint, and obtains having the phone housing of embossment.
Phone housing provided by the invention, because outer cover body and embossment are integrative-structures, thereby improved the useful life of phone housing greatly, and effective embossment also gives phone housing good appearance, makes phone housing provided by the invention possess long service life and advantage attractive in appearance simultaneously.Preparation method's machining accuracy of phone housing provided by the invention is high and do not use chemicals in etching process, and environment is safe from harm.
Description of drawings
Fig. 1 is an embossing pattern;
Fig. 2 is the mould with embossing pattern;
Fig. 3 is the phone housing with embossing pattern.
Embodiment
Among the present invention, the phone housing with embossment comprises outer cover body and embossment, and wherein, described outer cover body and embossment are integrative-structures.
The material of described phone housing can be the various materials that form phone housing in the prior art, for example, can be selected from Merlon that weight average molecular weight is 20000-60000, acrylonitrile-butadiene-styrene copolymer that weight average molecular weight is 20000-150000, in the polycarbonate alloy one or more, be preferably the Merlon of weight average molecular weight 20000-50000.The material that satisfies the material layer of above-mentioned requirements can be commercially available, for example, LEXAN 141R, the 6339R of General Corporation, 121R, 161R, the Makrolon 1837,2805,2405 of EXXX0077, C1000HF, C1100HF, CI200HF and Bayer AG etc.
According to the preparation method of phone housing provided by the invention, this method comprises that preparation has the mould of embossing pattern; Subsequently the material of phone housing is carried out injection mo(u)lding having on the mould of embossing pattern, obtain having the injection moulding product of embossment; The injection moulding product with embossment that will obtain then carries out plated film successively and sprays paint, and obtains having the phone housing of embossment.
Among the present invention, can have the mould of embossing pattern, for example can be laser-induced thermal etching by the variety of way preparation.Described laser-induced thermal etching is meant by laser beam carries out the moment high temperature ablation according to the pattern-information of sequencing to mould, obtains different patterns thereby adjust etched weight by the frequency of regulating laser beam with speed, thereby, can realize meticulous 3D processing.The condition of described laser-induced thermal etching comprises that the frequency of laser beam is the 30-500 KHz, is preferably the 40-100 KHz, and the speed of laser beam is the 100-1000 mm/second, is preferably the 200-800 mm/second.
The method of described injection mo(u)lding is incorporated in the mould with embossing pattern after comprising material fusion with phone housing, and injection mo(u)lding under the injection mo(u)lding condition afterwards obtains having the injection moulding product of embossment.The condition of described injection mo(u)lding comprises that nozzle temperature is 200-300 ℃, material pipe front-end temperature is 220-320 ℃, material pipe stage casing temperature is 240-310 ℃, material pipe back segment temperature is 210-290 ℃, under the preferable case, nozzle temperature is 250-290 ℃, and material pipe front-end temperature is 250-300 ℃, material pipe stage casing temperature is 245-290 ℃, and material pipe back segment temperature is 240-280 ℃.The concrete operations of described injection mo(u)lding have been conventionally known to one of skill in the art.The material of described phone housing is first at 70-150 ℃ before fusion, and preferred 80-120 ℃ was descended dry 1-7 hour, and preferred 3-5 hour, made the material moisture content of phone housing be no more than 0.02 weight %.
Described plated film can be various film plating process well known in the art, for example, can carry out plated film by sputtering method.Described sputtering method is meant and utilizes direct current or high-frequency electric field to make inert gas generation ionization that cation and electronics that ionization produces bombard target at a high speed, and atom or molecule on the target are sputtered out, and deposit to then and form film on the workpiece.For example, base material can be Sn, and described inert gas can be argon gas.The condition of described sputtering method comprises that voltage is the 40-160 volt, and pressure is less than 10 -3Pascal feeds inert gas, and the stove internal gas pressure is controlled at 0.5-1.0 Pascal, and the time is 2-6 hour.
Described spraying paint can for example, spray on spray-painting production line for various modes well known in the art, the used paint of described spraying can be the paint of various routines, for example UV coats with lacquer, and described UV lacquer can be commercially available, for example the UV-Q220 and the UV-Y220 of the production of BYD company.
The present invention is described further below by embodiment.
Embodiment 1
Prepare the mould (Sweden ASSAB company, 8407) with embossing pattern shown in Figure 1 by YAG solid state laser (DMG company, Laser 40), concrete steps are as follows:
Embossment shown in Figure 1 is divided into six parts, and the machined parameters of embossment 1-6 part is respectively shown in operation 1-6 in the table 1; In order to obtain surface of good fineness, after operation 1-6 finishes, mould is carried out laser scanning manufacturing one time, to remove the burr that produces in the etching embossment process, concrete parameter obtains having the mould of embossing pattern shown in Figure 1 shown in operation in the table 17, this mould as shown in Figure 2.
Table 1
Figure A20071012273400061
Embodiment 2
Through being introduced in the mould with embossing pattern that obtains among the embodiment 1 after 5 hours the handset sheathing material fusion of 95 ℃ of dryings, (Fa Nake company) carries out injection mo(u)lding by the injection moulding board with in advance, and the material of phone housing is the EXXX0077 of General Corporation.
The condition of injection mo(u)lding comprises that nozzle temperature is 270 ℃, and material pipe front-end temperature is 250 ℃, and material pipe stage casing temperature is 265 ℃, and material pipe back segment temperature is 250 ℃, obtains the phone housing of injection mo(u)lding.
Phone housing to injection mo(u)lding carries out plated film successively and sprays paint.
The concrete steps of plated film are: at pressure is 8 * 10 -3Under Pascal's the condition, by-600 volts voltages argon gas is separated, cation and electronics that ionization produces bombard target Sn at a high speed, the atom sputtering of Sn is come out, deposit to then on the phone housing of injection mo(u)lding and form film, the time is 6 hours, obtains the phone housing of plated film.
The concrete steps of spraying paint are: spray UV-Q220 (BYD company) on the phone housing behind the plated film on UV lacquer spray-painting production line, had the phone housing A1 of embossment as shown in Figure 3.
Embodiment 3
According to following method the phone housing A1 with embossing pattern that is made by embodiment 2 is carried out Performance Detection, test result is as shown in table 2.
The resistance to marring test
Adopting Mitsubishi (UNI) hardness is the pencil of 2H, on sample, applies 800 gram forces by 45 ° of directions, 10 millimeters strokes, and diverse location is drawn 3 roads, and whether the observation sample outward appearance has obvious cut, as then interpret sample is qualified not have obvious cut.
The heat-resisting quantity test
Sample is put into accurate high-temperature test chamber (grand icepro HRHL45), heating is 240 hours under 85 ℃ of conditions, at room temperature placed then 2 hours, whether the observation sample outward appearance has comes off, distortion, slight crack and change color, as nothing come off, then interpret sample is qualified for distortion, slight crack and change color.
The lower temperature resistance test
Sample is put into constant temperature and moisture test machine (Taiwan celebrating sound, THS-2001) in, under-40 ℃ of conditions, placed 240 hours, at room temperature placed then 2 hours, whether the observation sample outward appearance has comes off, distortion, slight crack and change color, as nothing come off, then interpret sample is qualified for distortion, slight crack and change color.
The moisture-proof test
It is 90% that sample is put into humidity, temperature is 60 ℃ a constant temperature and moisture test machine (Taiwan celebrating sound, HTS-400) placed 96 hours in, at room temperature placed then 2 hours, whether the observation sample outward appearance has comes off, distortion, slight crack and change color, as nothing come off, then interpret sample is qualified for distortion, slight crack and change color.
The temperature shock test
Sample is put into cold shock testing machine (grand icepro HTS-400), under-40 ℃ of environment, placed 1 hour earlier, with temperature transition to 85 ℃, placed 1 hour then, be 15 seconds change-over time, does 12 circulations (24 hours) altogether.Whether the observation sample outward appearance has comes off, distortion, slight crack and change color, as nothing come off, then interpret sample is qualified for distortion, slight crack and change color.
Salt mist test
It is 30 ℃ that sample is placed on temperature, in the test chamber of humidity 〉=85% (HOLINK H-SST-90 salt spraytest machine), with the solution (solution compolision: 50 grams per liter NaCl), took out after spraying continuously 48 hours of pH=6.8; Dry up with normal temperature clear water flushing 5 minutes and with hair-dryer, at room temperature placed 1 hour, whether the observation sample outward appearance has comes off, distortion, slight crack and change color, as nothing come off, then interpret sample is qualified for distortion, slight crack and change color.
Table 1
The embodiment numbering Embodiment 3
Sample number into spectrum A1
The resistance to marring test Qualified
High temperature test Qualified
Low-temperature test Qualified
Humidity measurement Qualified
The temperature shock test Qualified
Salt mist test Qualified
As can be seen from the above table, phone housing provided by the invention is not easy to wear, has improved the useful life of phone housing, and as can be seen from Figure 3, the effect of phone housing embossment provided by the invention is fine, makes the phone housing that provides of the present invention possess long service life and advantage attractive in appearance simultaneously.Simultaneously, preparation method's machining accuracy height of phone housing provided by the invention as can be seen from Figure 3, and in etching process, do not use chemicals, environment is safe from harm.

Claims (7)

1, a kind of phone housing, this phone housing comprises outer cover body and embossment, it is characterized in that, described outer cover body and embossment are integrative-structures.
2, phone housing according to claim 1, wherein, the material of described phone housing is selected from Merlon that weight average molecular weight is 20000-60000, acrylonitrile-butadiene-styrene copolymer that weight average molecular weight is 20000-150000, in the polycarbonate alloy one or more.
3, a kind of preparation method of phone housing, this method comprise that preparation has the mould of embossing pattern; Subsequently the material of phone housing is carried out injection mo(u)lding having on the mould of embossing pattern, obtain having the injection moulding product of embossment; The injection moulding product with embossment that will obtain then carries out plated film successively and sprays paint, and obtains having the phone housing of embossment.
4, preparation method according to claim 3, wherein, the mode that described preparation has the mould of embossing pattern is laser-induced thermal etching.
5, preparation method according to claim 4, wherein, the condition of described laser-induced thermal etching comprises that the frequency of laser beam is the 30-500 KHz, the speed of laser beam is the 100-1000 mm/second.
6, preparation method according to claim 3, wherein, the condition of described injection mo(u)lding comprises that nozzle temperature is 200-300 ℃, and material pipe front-end temperature is 220-320 ℃, and material pipe stage casing temperature is 240-310 ℃, and material pipe back segment temperature is 210-290 ℃.
7, preparation method according to claim 3, wherein, the material of described phone housing is selected from Merlon that weight average molecular weight is 20000-60000, acrylonitrile-butadiene-styrene copolymer that weight average molecular weight is 20000-150000, in the polycarbonate alloy one or more.
CNA2007101227347A 2007-07-02 2007-07-02 Mobile phone shell and preparation method thereof Pending CN101340469A (en)

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2324689A1 (en) * 2008-08-28 2011-05-25 BYD Company Limited Shell for electronic device, method of forming the shell and electronic device having the same
CN102173217A (en) * 2010-12-21 2011-09-07 杭州和昇塑料制品有限公司 Manufacturing method of beverage bottle cap capable of preventing character information in cap from being identified
CN102427925A (en) * 2009-05-04 2012-04-25 厄克斯勒股份公司 Housing shell for portable electrical devices and method for the production thereof
CN102729717A (en) * 2011-04-06 2012-10-17 珠海格力电器股份有限公司 Panel and manufacturing method thereof
CN103131152A (en) * 2011-11-28 2013-06-05 比亚迪股份有限公司 Modified makrolon material, preparation method thereof, mobile telephone shell and preparation method thereof
CN104417246A (en) * 2013-09-06 2015-03-18 上海汽车集团股份有限公司 Ornament with three-dimensional metal texture drawing lines and preparation method of ornament
CN104441408A (en) * 2013-09-13 2015-03-25 联想(北京)有限公司 Shell preparation method and electronic equipment
CN105750734A (en) * 2016-04-25 2016-07-13 东莞市罗曼智能电器股份有限公司 Electric toothbrush handle laser etching process
CN105835597A (en) * 2016-03-24 2016-08-10 蚌埠翼诚玻璃有限公司 Method for producing embossment elbow-board
CN106584763A (en) * 2016-12-12 2017-04-26 东莞市广信知识产权服务有限公司 Method for forming partition groove in mobile phone battery cover through injection molding
EP3479988A1 (en) * 2017-11-06 2019-05-08 Guangdong OPPO Mobile Telecommunications Corp., Ltd. Housing, manufacturing method of the same, and electronic device with such a housing

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2324689A4 (en) * 2008-08-28 2013-07-31 Byd Co Ltd Shell for electronic device, method of forming the shell and electronic device having the same
EP2324689A1 (en) * 2008-08-28 2011-05-25 BYD Company Limited Shell for electronic device, method of forming the shell and electronic device having the same
US9028936B2 (en) 2009-05-04 2015-05-12 Oechsler Aktiengesellschaft Housing shell for portable electrical devices and method for the production thereof
CN102427925A (en) * 2009-05-04 2012-04-25 厄克斯勒股份公司 Housing shell for portable electrical devices and method for the production thereof
CN102427925B (en) * 2009-05-04 2014-08-20 裕克施乐股份公司 Housing shell for portable electrical devices and method for the production thereof
CN102173217A (en) * 2010-12-21 2011-09-07 杭州和昇塑料制品有限公司 Manufacturing method of beverage bottle cap capable of preventing character information in cap from being identified
CN102729717A (en) * 2011-04-06 2012-10-17 珠海格力电器股份有限公司 Panel and manufacturing method thereof
CN102729717B (en) * 2011-04-06 2014-12-24 珠海格力电器股份有限公司 Panel and manufacturing method thereof
CN103131152B (en) * 2011-11-28 2015-12-09 比亚迪股份有限公司 A kind of modified polycarbonate material and preparation method thereof and a kind of phone housing and preparation method thereof
CN103131152A (en) * 2011-11-28 2013-06-05 比亚迪股份有限公司 Modified makrolon material, preparation method thereof, mobile telephone shell and preparation method thereof
CN104417246A (en) * 2013-09-06 2015-03-18 上海汽车集团股份有限公司 Ornament with three-dimensional metal texture drawing lines and preparation method of ornament
CN104417246B (en) * 2013-09-06 2017-11-03 上海汽车集团股份有限公司 Gadget with stereo metal texture drawing pattern and preparation method thereof
CN104441408A (en) * 2013-09-13 2015-03-25 联想(北京)有限公司 Shell preparation method and electronic equipment
US9844903B2 (en) 2013-09-13 2017-12-19 Lenovo (Beijing) Limited Manufacturing method of housing and electronic device
CN105835597A (en) * 2016-03-24 2016-08-10 蚌埠翼诚玻璃有限公司 Method for producing embossment elbow-board
CN105750734A (en) * 2016-04-25 2016-07-13 东莞市罗曼智能电器股份有限公司 Electric toothbrush handle laser etching process
CN105750734B (en) * 2016-04-25 2018-08-31 广东罗曼智能科技股份有限公司 A kind of power toothbrush handle laser carving processing technology
CN106584763A (en) * 2016-12-12 2017-04-26 东莞市广信知识产权服务有限公司 Method for forming partition groove in mobile phone battery cover through injection molding
EP3479988A1 (en) * 2017-11-06 2019-05-08 Guangdong OPPO Mobile Telecommunications Corp., Ltd. Housing, manufacturing method of the same, and electronic device with such a housing
US10875223B2 (en) 2017-11-06 2020-12-29 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Housing, manufacturing method of the same, and electronic device

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Open date: 20090107