CN101340047B - Lamination-vacuum pressure pouring process of micro conductive retractor collar - Google Patents
Lamination-vacuum pressure pouring process of micro conductive retractor collar Download PDFInfo
- Publication number
- CN101340047B CN101340047B CN200810107035XA CN200810107035A CN101340047B CN 101340047 B CN101340047 B CN 101340047B CN 200810107035X A CN200810107035X A CN 200810107035XA CN 200810107035 A CN200810107035 A CN 200810107035A CN 101340047 B CN101340047 B CN 101340047B
- Authority
- CN
- China
- Prior art keywords
- conducting ring
- conducting
- ring
- vacuum pressure
- lamination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a lamination-vacuum pressure pouring technology of a microminiature conducting slip ring, which comprises the processing technology of a conducting ring, the processing technology of a brush holder and the general assembly technology of the microminiature conducting slip ring; after the conducting ring body and the brush component are inspected, the bought-in component inspection is carried out on the bought-in components such as a combination support, a flange, a dust shield, and the like; and then the conducting ring body, the brush holder component and the bought-incomponents are assembled into the microminiature conducting slip ring, and then tested and inspected; and after passing the inspections, the conducting ring body, the brush holder component and the bought-in components are packed and delivered. The lamination-vacuum pressure pouring technology of the microminiature conducting slip ring is characterized in that: after the conducting ring is manufactured and an insulating strip is processed, the conducting ring and the insulating strip are firstly laminated for assembly, epoxy resin is poured at the vacuum pressure, and then fine machining is performed on the conducting ring body. The lamination-vacuum pressure pouring technology of the microminiature conducting slip ring has the advantages that the two conducting rings are both mutually insulated and reliably connected, and rubber layers thereof can not fall off, the environmental suitability and operational reliability of the products are improved, the rate of defective products is low, and the performance of the product can correspond to that of the similar products abroad.
Description
Technical field
The present invention relates to conducting slip ring, especially relate to a kind of lamination-vacuum pressure pouring process of micro conductive retractor collar.
Background technology
Conducting slip ring is the accurate signal of telecommunication transmitting device of multi-channel electric signal (or electric current) transmission that requirement must not interfere with each other between two relative rotating mechanisms of realization.The conducting slip ring assembly is made of parts such as conduction ring body, brush assembly of electric, the sectional shelf-unit of being furnished with precision bearing, ring flange (or the corresponding interface spare) and dust covers.Its know-why is: being installed in has multiple conducting wires to link to each other with the conducting ring of a plurality of mutually insulateds of conduction on the ring body on the rotating mechanism in the sectional shelf-unit upper rotative portion of being furnished with precision bearing, brush assembly of electric then is installed in the relatively fixed part on the sectional shelf-unit and remains with conducting ring with certain pressure and contacts, each road brush wires of forming brush assembly of electric then is pressed in respectively on the corresponding conducting ring, thereby makes the multiple conducting wires on the rotating mechanism, a plurality of mutually insulateds have been formed between corresponding each road brush on each conducting ring that links to each other with lead and the brush assembly of electric, the multichannel electric current or the signalling channel of mutual shielding.Multichannel electric current or signal that spinning mechanism transmission comes will transfer to electric-control system or the signal processing unit that links to each other with brush by these electric current or signalling channels of being made up of lead → conducting ring → brush respectively, thereby precision is transmitted when realizing two multi-channel electric signals between relative rotating mechanism.
For multi-channel electric signal (or electric current) is not interfered with each other respectively by these electric currents be made up of lead → conducting ring → brush or signalling channel transmission the time, reach many signals of telecommunication and realize the purpose of high accuracy transmission simultaneously, must make mutually insulated between these electric currents formed by lead → conducting ring → brush or the signalling channel, shield mutually.For the bigger slip ring of volume, realize mutually insulated between many electric currents or the signalling channel, mutually shielding is relatively easy, and for micro conductive retractor collar, in very little space (realize mutually insulated between multichannel electric current or the signalling channel among the Φ 17mm * 48mm), shielding just has great difficulty mutually, therefore, make between a plurality of conducting rings of conduction on the ring body and realize that reliable mutually insulated then becomes its maximum key problem in technology.
The conducting slip ring body that adopts both at home and abroad mainly contains two kinds of manufacturing process at present: 1, first kind of manufacturing process is many circuits group ring vacuum pressure casting epoxy resin technology: adopt many circuits precision positioning group ring to touch the group ring, through the vacuum pressure casting epoxy resin, Precision Machining forms after the hot setting moulding.2, second kind of manufacturing process is that technology is cohered in the lamination combination: adopt the lamination combining structure, between per two copper ring sheets, press from both sides insulating trip, and glued together insulating trip and copper ring sheet, become Shooting Technique and cohere technology into lamination.
In above-mentioned two kinds of manufacturing process, the great advantage that first kind of manufacturing process is is to cohering between each conducting ring by epoxy resin, make the conducting slip ring assembly cohere into an integral body firmly, the ability of conducting slip ring assembly antivibration and opposing adverse circumstances is strong, performance is highly stable, but the main problem of its existence is: when producing the micro conductive retractor collar assembly, this technology is to rely on the vacuum pressure of epoxy resin to be poured on the conduction ring body to realize cohering between the conducting ring and insulating in the close clearance (0.2mm) between a plurality of conducting rings, pour into a mould the degree of depth big (5mm) owing to the gap between the micro conductive retractor collar assembly conducting ring is too little, epoxy resin is when carrying out vacuum pressure cast filling gap, it is being in the gap of diverse location with different in the pouring pressure of same gap diverse location, and the very little conducting ring rigidity of thickness is very low, be difficult to resist the distortion lateral pressure that the pouring pressure difference produces conducting ring, under the influence of this lateral pressure, each conducting ring all can produce the different distortion of degree, make the epoxy resin packed layer epoxy resin packed layer thickness of diverse location between the different conducting rings and same conducting ring gap between each conducting ring have very big-difference, local location even hungry area (being that epoxy resin fails to be filled into) phenomenon can occur.The position of hungry area position and epoxy resin packed layer thickness minimum will become the poorest position of insulation property between two conducting rings, therefore, when making the micro conductive retractor collar assembly with this technology between each electric current of product or the signalling channel mutually insulated performance relatively poor relatively, it is higher to produce percent defective.
The great advantage of second kind of manufacturing process is that the insulation between each conducting ring realizes that by the insulating trip of placing between the conducting ring with good insulation performance therefore, insulation property all have reliable guarantee between any two conducting rings; And insulating trip is in the same place by cohering glue glued adhesion with the conducting ring copper sheet, need not vacuum equipment, simple to operate, manufacture difficulty is little, production cost is low, but the main problem of its existence is: insulating trip is in the same place by cohering glue glued adhesion with the conducting ring copper sheet, fashionable in stack of laminations, the laminate power inconsistent generation bondline thickness serious uneven phenomenon of glue-line between the lamination during easily because of shaping, local location even the glue phenomenon can occur losing, therefore, micro conductive retractor collar assembly with this technology manufacturing is subjected to vibration effect for a long time, or it is big in the temperature difference, occur the glue-line obscission easily when working under the frequent condition of work of variations in temperature, influence the reliability of micro conductive retractor collar assembly work.
Summary of the invention
The object of the present invention is to provide between a kind of two conducting rings not only mutually insulated but also realize that reliable connection, glue-line can not come off, improve the reliability of the environmental suitability of product and work, produce the lamination-vacuum pressure pouring process of the low micro conductive retractor collar of percent defective.
The object of the present invention is achieved like this: the present invention includes the conducting ring processing technology, brush carrier processing technology and micro conductive retractor collar general assembly technology, wherein the conducting ring processing technology comprises the conducting ring manufacturing, insulating trip processing, the fine finishining of conduction ring body, conducting ring surface plating working lining and conducting ring health check-up such as test at step, the brush carrier processing technology is processed by brush carrier, cohering three steps of billon silk and brush assembly of electric check forms, through the conducting ring health check-up test with brush assembly of electric check check after, again to sectional shelf-unit, ring flange, structural members such as dust cover are tested, the conduction ring body that will process then, brush holder assemblies and sectional shelf-unit, ring flange, dust cover carries out the micro conductive retractor collar general assembly together, carry out the micro conductive retractor collar test again, check, be up to the standards at last, packing is dispatched from the factory, feature is: in the conducting ring processing technology, after having carried out the processing of conducting ring manufacturing and insulating trip, earlier conducting ring and insulating trip are carried out the lamination assembling, vacuum pressure casting epoxy resin again conducts electricity ring body fine finishining then.
Between each conducting ring, place insulating trip with good insulation performance, the area of insulating trip is 1/2 of a conducting ring area, conducting ring and insulating trip are all realized radially precision positioning by location group ring mould, carry out the vacuum pressure casting epoxy resin again by cohering glue glued adhesion after laminating curing between conducting ring and the insulating trip together.
Gap between the conducting ring is equivalent to 1/3 of conducting ring width.
Owing to cohered fixing between conducting ring and the insulating trip, the conducting ring rigidity greatly strengthens, and very shallow gap (degree of depth that is equivalent to conducting ring width 1/3) casting epoxy resin is only arranged between the conducting ring, it is easier to be full of these gaps, epoxy resin packed layer thickness is more even, this has not only ensured between any two conducting rings all have the good insulation performance performance, also make the micro conductive retractor collar assembly of manufacturing combine closely into an integral body, successfully having solved between the conducting ring should mutually insulated, realize the reliable technical barrier that connects again, even be subjected to vibration effect for a long time, or it is big in the temperature difference, loosening or obscission can not occur when working under the frequent condition of work of variations in temperature yet, improve the environmental suitability of product and the reliability of work.The present invention has realized the combination of two kinds of existing manufacturing process advantages, and avoided both weakness dexterously, use the conducting ring assembly of lamination-vacuum pressure pouring process manufacturing both to have good whole, improve its antivibration, resisting temperature variation and impact capacity, ensured the consistency of insulation property between the conducting ring and the reliability of work again.
It is bigger to The present invention be directed to the conducting ring mutually insulated performance difference that exists when adopting at present both at home and abroad many circuits group ring vacuum pressure casting epoxy resin technology to make miniature conducting slip ring, produce the percent defective problem of higher and adopt the lamination combination to cohere between the conducting ring that exists when technology is made miniature conducting slip ring and the insulating trip and easily come unstuck, the problem of product functional reliability difference, on the basis of carrying out a large amount of process test research, initiative lamination-vacuum pressure pouring process, successfully overcome the problem that above-mentioned two kinds of technologies exist, thereby the present invention has between two conducting rings not only mutually insulated but also realizes reliable connection, glue-line can not come off, the environmental suitability of product and the reliability of work have been improved, produce the low advantage of percent defective, properties of product are suitable with external like product.
Description of drawings
Fig. 1 is a process flow diagram of the present invention.
Embodiment
Below in conjunction with embodiment and contrast accompanying drawing the present invention is described in further detail.、
The present invention includes the conducting ring processing technology, brush carrier processing technology and micro conductive retractor collar general assembly technology, wherein the conducting ring processing technology comprises the conducting ring manufacturing, insulating trip processing, the fine finishining of conduction ring body, conducting ring surface plating working lining and conducting ring health check-up such as test at step, the brush carrier processing technology is processed by brush carrier, cohering three steps of billon silk and brush assembly of electric check forms, through the conducting ring health check-up test with brush assembly of electric check check after, again to sectional shelf-unit, ring flange, structural members such as dust cover are tested, the conduction ring body that will process then, brush holder assemblies and sectional shelf-unit, ring flange, dust cover carries out the micro conductive retractor collar general assembly together, carry out the micro conductive retractor collar test again, check is up to the standards at last, packing is dispatched from the factory; Wherein, in the conducting ring processing technology, after having carried out the processing of conducting ring manufacturing and insulating trip, earlier conducting ring and insulating trip are carried out lamination and assemble, vacuum pressure casting epoxy resin again conducts electricity ring body fine finishining then.
Between each conducting ring, place insulating trip with good insulation performance, the area of insulating trip is 1/2 of a conducting ring area, conducting ring and insulating trip are all realized radially precision positioning by location group ring mould, carry out the vacuum pressure casting epoxy resin again by cohering glue glued adhesion after laminating curing between conducting ring and the insulating trip together.
Gap between the conducting ring is equivalent to 1/3 of conducting ring width.
Claims (2)
1. the lamination-vacuum pressure pouring process of a micro conductive retractor collar, comprise the conducting ring processing technology, brush carrier processing technology and micro conductive retractor collar general assembly technology, wherein the conducting ring processing technology comprises the conducting ring manufacturing, insulating trip processing, the fine finishining of conduction ring body, step is tested in conducting ring surface plating working lining and conducting ring health check-up, the brush carrier processing technology is processed by brush carrier, cohering three steps of billon silk and brush assembly of electric check forms, through the conducting ring health check-up test with the brush assembly of electric check after, again to sectional shelf-unit, ring flange, dust cover structure spare is tested, the conduction ring body that will process then, brush holder assemblies and sectional shelf-unit, ring flange, dust cover carries out the micro conductive retractor collar general assembly together, carry out the micro conductive retractor collar test again, check, be up to the standards at last, packing is dispatched from the factory, it is characterized in that: in the conducting ring processing technology, after having carried out the processing of conducting ring manufacturing and insulating trip, earlier conducting ring and insulating trip are carried out the lamination assembling, vacuum pressure casting epoxy resin again, promptly between each conducting ring, place insulating trip with good insulation performance, the area of insulating trip is 1/2 of a conducting ring area, conducting ring and insulating trip are all realized radially precision positioning by location group ring mould, after laminating curing, carry out the vacuum pressure casting epoxy resin again by cohering glue glued adhesion between conducting ring and the insulating trip together, epoxy resin can be poured in the shallow gap between the conducting ring, conducts electricity ring body fine finishining then.
2. the lamination-vacuum pressure pouring process of micro conductive retractor collar as claimed in claim 1, it is characterized in that: the gap between the conducting ring is equivalent to 1/3 of conducting ring width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810107035XA CN101340047B (en) | 2008-08-28 | 2008-08-28 | Lamination-vacuum pressure pouring process of micro conductive retractor collar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810107035XA CN101340047B (en) | 2008-08-28 | 2008-08-28 | Lamination-vacuum pressure pouring process of micro conductive retractor collar |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101340047A CN101340047A (en) | 2009-01-07 |
| CN101340047B true CN101340047B (en) | 2011-03-30 |
Family
ID=40214049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810107035XA Expired - Fee Related CN101340047B (en) | 2008-08-28 | 2008-08-28 | Lamination-vacuum pressure pouring process of micro conductive retractor collar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101340047B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109396761A (en) * | 2018-11-05 | 2019-03-01 | 北京翠铂林有色金属技术开发中心有限公司 | A kind of production method of major diameter silver-bearing copper nickel alloy conducting ring |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102520267B (en) * | 2011-11-15 | 2013-11-13 | 浙江大学 | Method for testing signal transmission performance of electric conductive slip ring |
| CN106253024A (en) * | 2016-08-01 | 2016-12-21 | 安徽贝莱电子科技有限公司 | A kind of processing technique of radar collector ring |
| CN106199292A (en) * | 2016-08-29 | 2016-12-07 | 九江精达检测技术有限公司 | A kind of Portable precise conducting slip ring detecting system and detection method thereof |
| CN107064760B (en) * | 2017-04-28 | 2019-07-12 | 北京航天控制仪器研究所 | A kind of accurate device for quick testing of high integration conducting ring assemblies conducting insulation |
| CN107732629A (en) * | 2017-11-14 | 2018-02-23 | 九江精达检测技术有限公司 | A kind of hook weldering formula welding method of micro conductive retractor collar |
| CN109119856B (en) * | 2018-09-04 | 2019-11-26 | 九江汉唐光电传输技术有限公司 | A kind of ultrahigh speed conducting slip ring electrical feedthrough and preparation method based on circulation oil-cooling technology |
| CN114142313A (en) * | 2020-09-04 | 2022-03-04 | 江西百宏光电科技有限公司 | Electric slip ring convenient to produce and production method of electric slip ring |
-
2008
- 2008-08-28 CN CN200810107035XA patent/CN101340047B/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109396761A (en) * | 2018-11-05 | 2019-03-01 | 北京翠铂林有色金属技术开发中心有限公司 | A kind of production method of major diameter silver-bearing copper nickel alloy conducting ring |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101340047A (en) | 2009-01-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101340047B (en) | Lamination-vacuum pressure pouring process of micro conductive retractor collar | |
| CN103487176B (en) | Structure and method for packaging pressure sensor | |
| CN103443918B (en) | The manufacture method of semiconductor device | |
| US7852186B2 (en) | Coil transducer with reduced arcing and improved high voltage breakdown performance characteristics | |
| CN101373761B (en) | Multi-chip module package | |
| JP2001186725A (en) | Press-molded v-shape groove pancake type slip ring | |
| CN102893632B (en) | There is electric device and the manufacture method of planar design | |
| JP5603489B2 (en) | Sealed control module for automobile | |
| CN103247541A (en) | Semiconductor device and method of manufacturing thereof | |
| CN104916377A (en) | Insulating bush made of thermoplastic material and production method thereof | |
| CN109935521B (en) | Packaging substrate manufacturing process, packaging substrate and chip packaging structure | |
| CN106304611A (en) | Circuit board and manufacture method thereof, apply the electronic installation of this circuit board | |
| CN203231865U (en) | Dielectric isolation pressure sensor based on backside metallization process | |
| CN206584922U (en) | It is pre-packaged without wire electrodepositable lead-frame packages structure | |
| CN103138072A (en) | Connector structure and manufacture method thereof | |
| CN203519214U (en) | Packaging structure of pressure sensor | |
| CN101202259B (en) | Chip stack encapsulation structure, inner embedded type chip packaging structure and method of manufacture | |
| CN106976247B (en) | A kind of Differential Slip-Ring silver-bearing copper vanadium electrical contact sliding block bonding forming is processed into round method | |
| CN208159004U (en) | Component-mounted substrate | |
| CN204315865U (en) | A kind of laminated bus bar structure | |
| CN110366329A (en) | A kind of manufacturing method and multilager base plate of multilager base plate | |
| CN206293231U (en) | A kind of potentiometer | |
| CN204859739U (en) | Multilayer flexible circuit board | |
| CN104952839A (en) | Packaging device and manufacturing method therefor | |
| CN103199021A (en) | Semiconductor wafer plating bus and molding method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110330 Termination date: 20180828 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |