CN101339293A - Digital micro-reflector element - Google Patents
Digital micro-reflector element Download PDFInfo
- Publication number
- CN101339293A CN101339293A CNA2007101273928A CN200710127392A CN101339293A CN 101339293 A CN101339293 A CN 101339293A CN A2007101273928 A CNA2007101273928 A CN A2007101273928A CN 200710127392 A CN200710127392 A CN 200710127392A CN 101339293 A CN101339293 A CN 101339293A
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- China
- Prior art keywords
- digital micro
- reflector element
- conducting strip
- mirror chip
- transparent enclosure
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Abstract
The invention discloses a digital micro-mirror element, which comprises a housing, a digital micro-mirror chip, a transparent packaging element and a heat conducting plate, wherein, the digital micro-mirror chip is positioned in the housing; the transparent packaging element is positioned above the digital micro-mirror chip and is used for packing the digital micro-mirror chip, therefore, a beam outside can penetrate through the transparent packaging component and reach at the digital micro-mirror chip; and the heat conducting plate is connected with the transparent packaging component and the housing. The digital micro-mirror element of the invention adopts the heat conducting plate to connect the transparent packaging component and the housing, therefore, heat energy produced in the working process of the digital micro-mirror can be conducted to the housing by penetrating through the heat conducting plate, moreover, stray lights which are projected on the digital micro-mirror element can be absorbed.
Description
Technical field
The invention relates to the structure of a kind of digital micro-reflector element (digital micro-mirror device), and particularly relevant for a kind of structure with digital micro-reflector element of good heat radiating characteristic.
Background technology
It is when it applies on the optical projection system that the technical development of digital micro-reflector element at present faces a maximum problem, and the light of high brightness concentrates on one than the heat dissipation problem that is produced on the small size.For high-performance and long-life requirement, digital micro-reflector element must have preferred heat-sinking capability.
A kind of known digital micro-reflector element as shown in Figures 1 and 2, wherein, digital micro-reflector element 10 comprises digital micro-mirror chip 16, cloche 15, ceramic substrate 12, metal shell 13 and radiating fin 11.Digital micro-mirror chip 16 is positioned on the ceramic substrate 12, have metal shell 13 and cloche 15 on it, protect digital micro-mirror chip 16 thus, wherein cloche 15 is positioned on the position of digital micro-mirror chip 16, make light can penetrate cloche 15 thus and arrival digital micro-mirror chip 16, and radiating fin 11 is positioned at ceramic substrate 12 belows, the heat that compiles on the ceramic substrate 12 that is used for leaving fast; Wherein, cloche 15 further is provided with getter (getter) 17 with the joining place of metal shell 13, and the heat that getter 17 is converged can pass by metal shell 13, to reach the purpose of quick heat radiating.
Another known digital micro-reflector element 20, as shown in Figures 3 and 4.Digital micro-reflector element 20 comprises digital micro-mirror chip 26, instrument bezel 24, cloche 25, ceramic substrate 22, metal shell 23 and radiating fin 21, wherein, this digital micro-reflector element 20 is different with aforementioned known digital micro-reflector element be in, the digital micro-mirror chip 26 of Fig. 3 is positioned on the ceramic substrate 22, the structure that has instrument bezel 24 and cloche 25 on it, be wholy set among the metal shell 23, instrument bezel 24 further is provided with getter (getter) 27 with the joining place of cloche 25.Because the material that getter 27 is contacted is a glass, therefore can influence the radiating effect of getter 27, and the radiating fin 21 of metal shell 23 bottoms has been kept better heat radiating effect for metal shell 23, cause near the temperature difference increase of measuring temp point and the measuring temp point of the bottom of metal shell 23 getter 27, so will be above industry for the highest for example 10 ℃ the requirement of the two temperature difference.
Therefore, for satisfying the requirement of digital micro-reflector element, be necessary to provide a kind of digital micro-reflector element with good heat radiating usefulness to heat dissipation characteristics.
Summary of the invention
The invention provides a kind of structure with digital micro-reflector element of good heat radiating characteristic.
Other purposes of the present invention and advantage can be further understood from the disclosed technical characterictic of the present invention.
For reaching above-mentioned one or part or all of purpose or other purposes, one embodiment of the invention proposes a kind of digital micro-reflector element, comprises housing, digital micro-mirror chip, transparent enclosure element and conducting strip.The digital micro-mirror chip is arranged in housing; The transparent enclosure element is positioned on the digital micro-mirror chip, in order to encapsulation digital micro-mirror chip, makes an extraneous light beam can penetrate the transparent enclosure element thus to the digital micro-mirror chip; Conducting strip connects transparent enclosure element and housing.
For reaching above-mentioned one or part or all of purpose or other purposes, another embodiment of the present invention proposes a kind of digital micro-reflector element, comprises metal shell, digital micro-mirror chip, instrument bezel, sealing ring, getter and conducting strip.The digital micro-mirror chip is arranged in housing; The transparent enclosure element is positioned on the digital micro-mirror chip, in order to encapsulation digital micro-mirror chip, makes an extraneous light beam can penetrate the transparent enclosure element thus to the digital micro-mirror chip; Instrument bezel be arranged at transparent enclosure element below and be positioned at the digital micro-mirror chip around, in order to support the transparent enclosure element; Sealing ring is between metal shell and instrument bezel; Getter is arranged near instrument bezel and the transparent enclosure element joint; Conducting strip connects transparent enclosure element and housing.
Digital micro-reflector element of the present invention connects transparent enclosure element and housing because of adopting conducting strip, to reach the effective thermal energy conduction that digital micro-reflector element is produced fast in the course of work to conducting strip, see through again conducting strip with thermal energy conduction to housing, conducting strip also can absorb the parasitic light that is projected on the digital micro-reflector element.Conducting strip to housing, can reduce near the temperature difference the temperature of housing bottom and the digital micro-mirror chip with thermal energy conduction, makes between the two temperature difference less than certain numerical value (for example: 10 ℃), to guarantee the serviceable life of digital micro-reflector element.Again, when conducting strip further was connected on the optical devices housing, it also can conduct to heat on the optical devices, further reduced near the temperature of transparent enclosure element in digital micro-mirror chip forward position by the optical devices housing, so that heat is shed fast.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended diagram, be described in detail below.
Description of drawings
It is the sectional view of a known digital micro-reflector element that Fig. 1 illustrates.
Fig. 2 illustrates the part amplification profile into digital micro-reflector element shown in Figure 1.
Fig. 3 illustrates the sectional view into another known digital micro-reflector element.
Fig. 4 illustrates the part amplification profile into digital micro-reflector element shown in Figure 3.
Fig. 5 illustrates the amplification cut-away view into the embodiment of digital micro-reflector element of the present invention.
Fig. 6 illustrates the stereographic map into the embodiment of digital micro-reflector element of the present invention.
Fig. 7 illustrates the stereographic map into the embodiment of another digital micro-reflector element of the present invention, and its conducting strip outside surface has a plurality of raised structures.
Fig. 8 illustrates the stereographic map of the embodiment of a digital micro-reflector element again into the present invention.
Fig. 9 illustrates the stereographic map into the embodiment of the another digital micro-reflector element of the present invention, and its conducting strip is a plurality of strip structures.
Description of reference numerals
10,20: digital micro-reflector element
11,21: radiating fin
12,22: ceramic substrate
13,23: metal shell
24: instrument bezel
15,25: cloche
16,26: the digital micro-mirror chip
17,27: getter
100: digital micro-reflector element
102: housing
104: opening
105: the viewing area
106: the digital micro-mirror chip
107: instrument bezel
108: cloche
109: getter
110: sealing ring
112: conducting strip
114: heat radiator
120: light-absorption layer
Embodiment
Address other technologies content, characteristics and effect about before the present invention, in a DETAILED DESCRIPTION OF THE PREFERRED of following cooperation referenced in schematic, can clearly present.The direction term of being mentioned in following examples, for example: upper and lower, left and right, front or rear etc. only are the directions with reference to additional illustration.Therefore, the direction term of use is to be used for illustrating not to be to be used for limiting the present invention.
Please earlier with reference to Fig. 5 and shown in Figure 6, one embodiment of the invention provides digital micro-reflector element 100, it comprises the housing 102 with opening 104, be contained in housing 102 digital micro-mirror chip 106, be covered in cloche 108, instrument bezel 107 and sealing ring 110 on the digital micro-mirror chip 106.Wherein, sealing ring 110 is around around the cloche 108, and cloche 108 is packaged in digital micro-mirror chip 106 in the opening 104 of housing 102.Instrument bezel 107 be arranged at cloche 108 belows and be positioned at digital micro-mirror chip 106 around, in order to support glass cover 108.Cloche 108 has viewing area 105, and in 105 scopes of viewing area, light can enter to digital micro-mirror chip 106 effectively, and reflects away to digital micro-reflector element 100 from digital micro-mirror chip 106.Sealing ring 110 is between housing 102 and instrument bezel 107.Getter 109 is arranged near instrument bezel 107 and cloche 108 joints.Housing 102 is made by the good material of heat conduction, for example is metal material etc.
Digital micro-reflector element 100 further comprises conducting strip 112.Conducting strip 112 covers thereon corresponding to sealing ring 110, and around viewing area 105, preferred person, conducting strip 112 promptly is ostiolate shaped as frame for the ring rectangle, but should be as limit.Connect housing 102 around the conducting strip 112.Conducting strip 112 for example is the manufacturings of black Heat Conduction Material or other highly heat-conductive materials, as metal, and graphite or siliceous material.
Digital micro-reflector element 100 is when work, when light beam is projected to the outside surface of digital micro-reflector element 100, most of light beam is projected on the digital micro-mirror chip 106, and advance to predetermined direction by digital micro-mirror chip 106 control bundle, the spuious light beam of fraction is absorbed by conducting strip 112, and by connecting metal shell 102 with heat dissipation that it produced; Simultaneously, conducting strip 112 is arranged at the contiguous place, top of getter 109, connects cloche 108 and metal shell 102, the heat energy that it produced can be transmitted to fast on the metal shell 102; Above-mentioned heat not only can be by metal shell 102 high-termal conductivity with its quick dissipation, heat radiator 114 quick heat radiatings of metal shell 102 bottoms that also can be by being attached at digital micro-reflector element 100 belows.
Wherein, can further comprise fin shape outside surface on the conducting strip 112 or have a plurality of raised structures 116, as shown in Figure 7, fin shape outside surface or have the surface area that a plurality of raised structures 116 can effectively increase conducting strip 112, so can further improve hot transfer efficiency, also can further comprise light-absorption layer 120, coat the surface of conducting strip 112, be incident upon digital micro-reflector element 100 parasitic light all around in order to be absorbed into.In addition, conducting strip 112 not only can be set to directly be connected with metal shell 102 with cloche 108, also may extend to the peripheral (not shown) of housing 102, increases hot biography approach.In the best is implemented, conducting strip 112 only need be arranged at outside the viewing area 105 and get final product, the opening of conducting strip 112 must directly not be close to viewing area 105, and can be according to actual design requirement, be covered on the housing 102, and part connects cloche 108 to the periphery of housing 102 and gets final product (as shown in Figure 8).In other embodiments, conducting strip 112 also tolerable partly cover viewing area 105.The structure of conducting strip 112 also is not limited to around the shaped as frame around the cloche 108, it also can be set to one or more strip structures (as shown in Figure 9), around cloche 108, or be arranged on a side, both sides or three sides of cloche 108, as long as conducting strip 112 connects a part and the metal shell 102 of cloches 108, the heat of cloche 108 is conducted and can implement by metal shell 102.Again, conducting strip 112 also can directly extend to the housing (not shown) that connects the optical devices (not shown), as projection display system.In an embodiment of the present invention, cloche 108 is as the transparent enclosure element, in order to encapsulation digital micro-mirror chip 106, and transmit extraneous light beam to digital micro-mirror chip 106, but the transparent enclosure element material does not exceed with glass.
In sum, utilize the viewing area 105 that exposes a part at least at digital micro-reflector element 100 of the present invention, and a part is connected in one or more conducting strips 112 of housing 102, another part is connected in cloche 108 (transparent enclosure element), with thermal energy conduction that digital micro-reflector element 100 is produced in the course of the work to conducting strip 112, conducting strip 112 can see through housing 102 with thermal energy conduction to heat radiator 114, conducting strip 112 also can absorb the parasitic light that is projected on the digital micro-reflector element 100.Conducting strip 112 with thermal energy conduction to housing 102, effectively reduce the temperature of housing 102 bottoms and near the temperature difference the digital micro-mirror chip 106, make its between the two temperature difference less than certain numerical value (for example 10 ℃), to guarantee the serviceable life of digital micro-reflector element 100.When conducting strip 112 further was connected on the optical devices housing, it also can conduct to heat on the optical devices, and further by the optical devices housing, near the temperature the reduction digital micro-mirror chip 106 is to shed heat fast.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; any those skilled in the art; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking appended the claim person of defining.Arbitrary embodiment of the present invention in addition or claim must not reached the disclosed whole purposes of the present invention or advantage or characteristics.In addition, summary part and title only are the usefulness that is used for assisting the patent document search, are not to be used for limiting interest field of the present invention.
Claims (17)
1, a kind of digital micro-reflector element, it comprises:
Housing;
The digital micro-mirror chip is arranged in this housing;
The transparent enclosure element is positioned on this digital micro-mirror chip, in order to encapsulate this digital micro-mirror chip, makes an extraneous light beam can penetrate this transparent enclosure element thus to this digital micro-mirror chip; And
Conducting strip connects this transparent enclosure element and this housing.
2, digital micro-reflector element as claimed in claim 1, wherein this transparent enclosure element has the viewing area, in this viewing area scope, light enters to this digital micro-mirror chip effectively, and reflects away to this digital micro-reflector element from this digital micro-mirror chip.
3, digital micro-reflector element as claimed in claim 2, wherein this conducting strip is for the ring rectangle, around this viewing area.
4, digital micro-reflector element as claimed in claim 1, wherein this conducting strip is one or more strip structures, its part connects this transparent enclosure element and this housing.
5, digital micro-reflector element as claimed in claim 1, wherein this conducting strip is that the black Heat Conduction Material is made.
6, digital micro-reflector element as claimed in claim 1, wherein this conducting strip is that one of metal, graphite or siliceous material are made.
7, digital micro-reflector element as claimed in claim 6 wherein has light-absorption layer on this conducting strip.
8, digital micro-reflector element as claimed in claim 1, wherein the outside surface of this conducting strip is provided with a plurality of raised structures or fin shape structure.
9, digital micro-reflector element as claimed in claim 1, wherein this housing is the metal material manufacturing.
10, digital micro-reflector element as claimed in claim 1, wherein this transparent enclosure element is that glass is made.
11, digital micro-reflector element as claimed in claim 2, wherein this conducting strip exposes this viewing area of at least a portion.
12, a kind of digital micro-reflector element, it comprises:
Metal shell;
The digital micro-mirror chip is arranged in this metal shell;
The transparent enclosure element is positioned on this digital micro-mirror chip, in order to encapsulate this digital micro-mirror chip, makes an extraneous light beam can penetrate this transparent enclosure element thus to this digital micro-mirror chip;
Instrument bezel, be arranged at this transparent enclosure element below and be positioned at this digital micro-mirror chip around, in order to support this transparent enclosure element;
Sealing ring is between this metal shell and this instrument bezel;
Getter is arranged near this instrument bezel and this transparent enclosure element joint; And
Conducting strip connects this transparent enclosure element and this housing.
13, digital micro-reflector element as claimed in claim 12, wherein this transparent enclosure element is that glass is made.
14, digital micro-reflector element as claimed in claim 12, wherein this conducting strip is that one of metal, graphite or siliceous material are made.
15, digital micro-reflector element as claimed in claim 14 wherein has light-absorption layer on this conducting strip.
16, digital micro-reflector element as claimed in claim 12 wherein also comprises heat radiator, is connected in the bottom of this metal shell.
17, digital micro-reflector element as claimed in claim 12, wherein this transparent enclosure element has the viewing area, in this viewing area scope, light enters to this digital micro-mirror chip effectively, and reflect away to this digital micro-reflector element from this digital micro-mirror chip, and this conducting strip exposes this viewing area of at least a portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101273928A CN101339293B (en) | 2007-07-02 | 2007-07-02 | Digital micro-reflector element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101273928A CN101339293B (en) | 2007-07-02 | 2007-07-02 | Digital micro-reflector element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101339293A true CN101339293A (en) | 2009-01-07 |
| CN101339293B CN101339293B (en) | 2011-10-26 |
Family
ID=40213400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101273928A Expired - Fee Related CN101339293B (en) | 2007-07-02 | 2007-07-02 | Digital micro-reflector element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101339293B (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6295154B1 (en) * | 1998-06-05 | 2001-09-25 | Texas Instruments Incorporated | Optical switching apparatus |
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2007
- 2007-07-02 CN CN2007101273928A patent/CN101339293B/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN101339293B (en) | 2011-10-26 |
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| C14 | Grant of patent or utility model | ||
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Granted publication date: 20111026 Termination date: 20140702 |
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| EXPY | Termination of patent right or utility model |