CN101337447B - Preparation method of paper templet - Google Patents
Preparation method of paper templet Download PDFInfo
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- CN101337447B CN101337447B CN2008100286747A CN200810028674A CN101337447B CN 101337447 B CN101337447 B CN 101337447B CN 2008100286747 A CN2008100286747 A CN 2008100286747A CN 200810028674 A CN200810028674 A CN 200810028674A CN 101337447 B CN101337447 B CN 101337447B
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Abstract
The invention relates to the technical field of paper card boards and particularly relates to the preparation method of the paper card boards, wherein the paper card board is formed by assembling paper panels and paper legs of the paper card board, and the preparation method comprises the preparation of paper panels and the preparation of paper legs. The preparation of the paper panels comprises the following steps: preparing an upper paper plate of a plug-in frame, preparing a lower paper plate of the plug-in frame, intercrossing the upper paper plate and the lower paper plate to form a compartment of the plug-in frame, sticking an upper paper plate to the compartment, sticking a lower paper plate to the compartment, folding the paper plates to cover the six faces of the compartment, drying the compartment with microwave, and applying a water-proof wax to the compartment. The preparation of the paper legs comprises the following steps: preparing an upper paper plate of a plug-in frame, preparing a lower paper plate of the plug-in frame, intercrossing the upper paper plate and the lower paper plate to form a compartment of the plug-in frame, sticking an upper paper face plate to the compartment, sticking a lower paper face plate to the compartment, dividing the compartment into several small square compartments, sticking a lower paper face plate to the small square compartments, folding the lower paper face plate to cover the six faces of the small square compartments, drying the covered small square compartments with microwave, and applying a water-proof wax to the square compartments. The preparation method has the advantages of simple process, high efficiency, low consumption of paper raw materials, low cost, paper plate coverage after intercrossing the compartment and dividing the small square compartments, and good coverage effect.
Description
Technical field:
The present invention relates to the paper templet technical field, particularly a kind of preparation method of paper templet.
Background technology:
The papery clamp has replaced wooden clamp and plastics clamp gradually, and in the freight transportation that is widely used in importing and exporting, the structure of existing papery clamp mainly comprises the paper panel that is provided with some lattices, bonding and be provided with the paper pin of some lattices with paper panel, the paper pin is played a supporting role, and makes paper panel have good load-bearing property.The manufacture craft of paper templet is to make the lattice inner core of paper panel and paper pin earlier at present, and then the lattice inner core is bonded together singly, coat six faces of paper panel and paper pin lattice inner core again with cardboard, production process is numerous and diverse, production efficiency is low, required paperboard stock amount is big, the cost height, and covered effect is not ideal enough.
Summary of the invention:
The objective of the invention is at the deficiencies in the prior art, provide a kind of production process simple, production efficiency height, the preparation method of the paper templet that product cost is low.
For achieving the above object, the present invention adopts following technical scheme:
A kind of preparation method of paper templet comprises making and the paper panel and the bonding assembling of paper pin of paper pin of making, the paper templet of the paper panel of paper templet;
The making of A, described paper panel may further comprise the steps:
The first step: the interpolation frame lattice, on the interpolation frame under cardboard and the interpolation frame the crisscross grafting of the groove of cardboard get up, be formed with the sash of some lattices;
Second step: cardboard above bonding, insert good sash upper surface with glue bonding and sash area big or small identical above cardboard;
The 3rd step: cardboard below bonding, insert good sash lower surface with glue bonding than sash area big below cardboard;
The 4th step: following cardboard is turned down six bread cover sash, and bonding, make the paper of paper templet with glue, standby
The making of the paper pin of B, described paper templet may further comprise the steps:
The first step: the interpolation frame lattice, on the interpolation frame under cardboard and the interpolation frame the crisscross grafting of the groove of cardboard get up, be formed with the sash of some lattices;
Second step: cardboard above bonding, insert good sash upper surface with glue on bonding identical with sash area size above cardboard;
The 3rd step: cardboard below bonding, insert good sash lower surface with glue on bonding identical with sash area size below cardboard;
The 4th step: the sash of cardboard above bonding and following cardboard is carried out drying;
The 5th step: cut, dried sash is evenly cut into some lattices;
The 6th step: cardboard below bonding, on the lower surface of lattice is bonding with glue than lattice area big below cardboard;
The 7th step: following cardboard is turned down six bread cover lattice, and bonding, make the paper pin of paper templet with glue, standby;
C, with the paper pin of the paper panel of the above-mentioned paper templet of making and paper templet with the bonding assembling of glue, form paper templet.
The making of described paper panel, the sash of can also six bread covering is carried out drying, and dried sash is sprayed waterproof wax, makes the paper of paper templet, and is standby.
The making of the paper pin of described paper templet can also comprise that the lattice that six bread are covered carries out drying, and dried lattice is sprayed waterproof wax, makes the paper pin of paper templet, and is standby.
The paperboard step is under the described interpolation frame:
The first step: selection, choose the cardboard that thickness is 2～10mm;
Second step: punching, selected cardboard evenly to be punched, being shaped as of the hole of being beaten is the outside irregular cuboid that caves in of long limit midpoint;
The 3rd step: cut, the second cardboard hole that goes on foot gained is cut into two halves along the long limit of rectangle mid point, obtain two blocks of cardboards with infundibulate groove, the infundibulate groove of cardboard is placed on the positioning module up, forms cardboard under the interpolation frame, and is standby.
The paperboard step is on the described interpolation frame:
The first step: selection, choose the cardboard that thickness is 2～10mm;
Second step: punching, selected cardboard evenly to be punched, being shaped as of the hole of being beaten is the outside irregular cuboid that caves in of long limit midpoint;
The 3rd step: cut, second hole that goes on foot gained is cut into two halves along the long limit of rectangle mid point, obtain two blocks of cardboards with infundibulate groove;
The 4th step: turn to, with the cardboard that segments, upset infundibulate channel opening makes opening form cardboard on the interpolation frame down, and is standby.
Described drying is microwave drying or oven for drying.
The described cal(l)iper of choosing is 2～5mm.
Described microwave drying temperature is 120～180 ℃.
Described microwave drying temperature is 120～130 ℃.
Described outside depression be shaped as prismatic or arc.
Beneficial effect of the present invention is: a kind of preparation method of paper templet, comprise the paper panel of paper templet making, paper templet the paper pin making and, paper panel and the bonding assembling of paper pin; The making of described paper panel comprises the preparation, interpolation frame lattice of cardboard under the preparation, interpolation frame of cardboard on the interpolation frame, above the bonding sash below cardboard, the bonding sash cardboard, cardboard turn down six bread and cover sash, microwave drying sash, spray waterproof wax in sash; The making of the paper pin of described paper templet comprises the preparation, interpolation frame lattice of cardboard under the preparation, interpolation frame of cardboard on the interpolation frame, above the bonding sash below cardboard, the bonding sash cardboard, sash cut into some lattices, lattice bonding below cardboard, cardboard turn down six bread and cover lattice, coat good lattice and spray waterproof wax with microwave drying, at lattice, the paper pin of the paper of the above-mentioned paper templet of making and paper templet with the bonding assembling of glue, is formed paper templet; Adopt above-mentioned technology, operation is simple, the efficient height, and required paperboard stock is few, and cost is low, coats with cardboard behind the interpolation frame lattice and after cutting into lattice again, and covered effect is good.
Description of drawings:
Fig. 1 is a process chart of the present invention;
Fig. 2 is the structural representation in first kind of hole of the present invention;
Fig. 3 is the structural representation in second kind of hole of the present invention.
The specific embodiment:
For a better understanding of the present invention, the invention will be further elaborated below in conjunction with embodiment.
Embodiment 1
A kind of preparation method of paper templet sees Fig. 1, comprises making and the paper panel and the bonding assembling of paper pin of paper pin of making, the paper templet of the paper panel of paper templet;
The making of A, described paper panel may further comprise the steps:
The paperboard step is under a, the interpolation frame:
The first step: selection, choose the cardboard that thickness is 2mm;
Second step: punching, selected cardboard evenly to be punched, Fig. 2 is seen in being shaped as to the outside irregular cuboid that caves in of long limit midpoint of the hole of being beaten, the outside depression in described hole is a prismatic;
The 3rd step: cut, the second cardboard hole that goes on foot gained is cut into two halves along the long limit of rectangle mid point, obtain two blocks of cardboards with infundibulate groove, the infundibulate groove of cardboard is placed on the positioning module up, forms cardboard under the interpolation frame, and is standby;
The paperboard step is on b, the described interpolation frame:
The first step: selection, choose the cardboard that thickness is 2mm;
Second step: punching, selected cardboard evenly to be punched, Fig. 2 is seen in being shaped as to the outside irregular cuboid that caves in of long limit midpoint of the hole of being beaten, the outside depression in described hole is a prismatic;
The 3rd step: cut, second hole that goes on foot gained is cut into two halves along the long limit of rectangle mid point, obtain two blocks of cardboards with infundibulate groove;
The 4th step: turn to, with the cardboard that segments, upset infundibulate channel opening makes opening form cardboard on the interpolation frame down, and is standby;
The preparation process of c, paper templet paper panel is:
The first step: the interpolation frame lattice, the crisscross grafting of groove of cardboard under cardboard and the interpolation frame on the interpolation frame of above-mentioned preparation is got up, be formed with the sash of some lattices;
Second step: cardboard above bonding, insert good sash upper surface with glue bonding and sash area big or small identical above cardboard;
The 3rd step: cardboard below bonding, insert good sash lower surface with glue bonding than sash area big below cardboard;
The 4th step: following cardboard is turned down six bread cover sash, and bonding with glue, be specially bonding following cardboard is made progress turnover with four sides coatings of sash, and then following cardboard extension is coated the sash end face;
The 5th step: the sash microwave drying that six bread cover, described microwave drying temperature is 120 ℃;
The 6th step: the sash after the microwave drying is sprayed waterproof wax, and described waterproof wax main component is polyethylene emulsion or silicone macromolecular compound, makes the paper of paper templet, and is standby;
The making step of the paper pin of B, described paper templet is:
The paperboard step is under a, the interpolation frame:
The first step: selection, choose the cardboard that thickness is 2mm;
Second step: punching, selected cardboard evenly to be punched, Fig. 2 is seen in being shaped as to the outside irregular cuboid that caves in of long limit midpoint of the hole of being beaten, the outside depression in described hole is a prismatic;
The 3rd step: cut, the second cardboard hole that goes on foot gained is cut into two halves along the long limit of rectangle mid point, obtain two blocks of cardboards with infundibulate groove, the infundibulate groove of cardboard is placed on the positioning module up, forms cardboard under the interpolation frame, and is standby;
The paperboard step is on b, the described interpolation frame:
The first step: selection, choose the cardboard that thickness is 2mm;
Second step: punching, selected cardboard evenly to be punched, Fig. 2 is seen in being shaped as to the outside irregular cuboid that caves in of long limit midpoint of the hole of being beaten, the outside depression in described hole is a prismatic;
The 3rd step: cut, second hole that goes on foot gained is cut into two halves along the long limit of rectangle mid point, obtain two blocks of cardboards with infundibulate groove;
The 4th step: turn to, with the cardboard that segments, upset infundibulate channel opening makes opening form cardboard on the interpolation frame down, and is standby;
(c) preparation process of paper card paperboard pin is:
The first step: the interpolation frame lattice, on the interpolation frame under cardboard and the interpolation frame the crisscross grafting of the groove of cardboard get up, be formed with the sash of some lattices;
Second step: cardboard above bonding, insert good sash upper surface with glue bonding and sash area big or small identical above cardboard;
The 3rd step: cardboard below bonding, insert good sash lower surface with glue bonding with the sash area big or small identical below cardboard;
The 4th step: with the sash microwave drying of cardboard above bonding and following cardboard, described microwave drying temperature is 120 ℃;
The 5th step: cut, dried sash is evenly cut into some lattices;
The 6th step: cardboard below bonding, on the lower surface of lattice is bonding with glue than lattice area big below cardboard;
The 7th step: following cardboard is turned down six bread cover lattice, and it is bonding with glue, above-mentioned glue main component is an ECA, the facial tissue plate turn down six bread cover lattice be specially with bonding following cardboard upwards turnover four sides of lattice are coated, and then following cardboard extended the lattice end face coated;
The 8th step: with the lattice microwave drying that six bread cover, described microwave drying temperature is 120 ℃;
The 9th step: the lattice after the microwave drying is sprayed waterproof wax, and described waterproof wax main component is polyethylene emulsion or silicone macromolecular compound, makes the paper pin of paper templet, and is standby;
The preparation of C, a kind of paper templet:
The paper pin of the paper panel of the above-mentioned paper templet of making and paper templet with the bonding assembling of glue, is formed paper templet.
Embodiment 2
A kind of preparation method of paper templet sees Fig. 1, comprises making and the paper panel and the bonding assembling of paper pin of paper pin of making, the paper templet of the paper panel of paper templet;
The making of A, described paper panel may further comprise the steps:
The paperboard step is under a, the interpolation frame:
The first step: selection, choose the cardboard that thickness is 5mm;
Second step: punching, selected cardboard evenly to be punched, Fig. 3 is seen in being shaped as to the outside irregular cuboid that caves in of long limit midpoint of the hole of being beaten, the outside depression in described hole is an arc;
The 3rd step: cut, the second cardboard hole that goes on foot gained is cut into two halves along the long limit of rectangle mid point, obtain two blocks of cardboards with infundibulate groove, the infundibulate groove of cardboard is placed on the positioning module up, forms cardboard under the interpolation frame, and is standby;
The paperboard step is on b, the described interpolation frame:
The first step: selection, choose the cardboard that thickness is 5mm;
Second step: punching, selected cardboard evenly to be punched, Fig. 3 is seen in being shaped as to the outside irregular cuboid that caves in of long limit midpoint of the hole of being beaten, the outside depression in described hole is an arc;
The 3rd step: cut, second hole that goes on foot gained is cut into two halves along the long limit of rectangle mid point, obtain two blocks of cardboards with infundibulate groove;
The 4th step: turn to, with the cardboard that segments, upset infundibulate channel opening makes opening form cardboard on the interpolation frame down, and is standby;
The preparation process of c, paper templet paper panel is:
The first step: the interpolation frame lattice, the crisscross grafting of groove of cardboard under cardboard and the interpolation frame on the interpolation frame of above-mentioned preparation is got up, be formed with the sash of some lattices;
Second step: cardboard above bonding, insert good sash upper surface with glue bonding and sash area big or small identical above cardboard;
The 3rd step: cardboard below bonding, insert good sash lower surface with glue bonding than sash area big below cardboard;
The 4th step: following cardboard is turned down six bread cover sash, and bonding with glue, be specially bonding following cardboard is made progress turnover with four sides coatings of sash, and then following cardboard extension is coated the sash end face;
The 5th step: the sash microwave drying that six bread cover, described microwave drying temperature is 130 ℃;
The 6th step: the sash after the microwave drying is sprayed waterproof wax, and described waterproof wax main component is polyethylene emulsion or silicone macromolecular compound, makes the paper of paper templet, and is standby;
The making step of the paper pin of B, described paper templet is:
The paperboard step is under a, the interpolation frame:
The first step: selection, choose the cardboard that thickness is 5mm;
Second step: punching, selected cardboard evenly to be punched, Fig. 3 is seen in being shaped as to the outside irregular cuboid that caves in of long limit midpoint of the hole of being beaten, the outside depression in described hole is an arc;
The 3rd step: cut, the second cardboard hole that goes on foot gained is cut into two halves along the long limit of rectangle mid point, obtain two blocks of cardboards with infundibulate groove, the infundibulate groove of cardboard is placed on the positioning module up, forms cardboard under the interpolation frame, and is standby;
The paperboard step is on b, the described interpolation frame:
The first step: selection, choose the cardboard that thickness is 5mm;
Second step: punching, selected cardboard evenly to be punched, Fig. 3 is seen in being shaped as to the outside irregular cuboid that caves in of long limit midpoint of the hole of being beaten, the outside depression in the hole in described hole is an arc;
The 3rd step: cut, second hole that goes on foot gained is cut into two halves along the long limit of rectangle mid point, obtain two blocks of cardboards with infundibulate groove;
The 4th step: turn to, with the cardboard that segments, upset infundibulate channel opening makes opening form cardboard on the interpolation frame down, and is standby;
(c) preparation process of paper card paperboard pin is:
The first step: the interpolation frame lattice, on the interpolation frame under cardboard and the interpolation frame the crisscross grafting of the groove of cardboard get up, be formed with the sash of some lattices;
Second step: cardboard above bonding, insert good sash upper surface with glue bonding and sash area big or small identical above cardboard;
The 3rd step: cardboard below bonding, insert good sash lower surface with glue bonding with the sash area big or small identical below cardboard;
The 4th step: with the sash microwave drying of cardboard above bonding and following cardboard, described microwave drying temperature is 130 ℃;
The 5th step: cut, dried sash is evenly cut into some lattices;
The 6th step: cardboard below bonding, on the lower surface of lattice is bonding with glue than lattice area big below cardboard;
The 7th step: following cardboard is turned down six bread cover lattice, and it is bonding with glue, above-mentioned glue main component is an ECA, the facial tissue plate turn down six bread cover lattice be specially with bonding following cardboard upwards turnover four sides of lattice are coated, and then following cardboard extended the lattice end face coated;
The 8th step: with the lattice microwave drying that six bread cover, described microwave drying temperature is 130 ℃;
The 9th step: the lattice after the microwave drying is sprayed waterproof wax, and described waterproof wax main component is polyethylene emulsion or silicone macromolecular compound, makes the paper pin of paper templet, and is standby;
The preparation of C, a kind of paper templet:
The paper pin of the paper panel of the above-mentioned paper templet of making and paper templet with the bonding assembling of glue, is formed paper templet.
Embodiment 3
This is embodiments of the invention 3, and difference from Example 1 is that selected cal(l)iper is 10mm, and described microwave drying temperature is 180 ℃, the outside depression in described hole is for being arc, see Fig. 3, other step is identical with embodiment 1 with principle, no longer repeats here.
Embodiment 4
This is embodiments of the invention 4, and difference from Example 1 is that selected cal(l)iper is 3mm, and described microwave drying temperature is 125 ℃, and other step is identical with embodiment 1 with principle, no longer repeats here.
Embodiment 5
This is embodiments of the invention 5, and difference from Example 1 is that selected cal(l)iper is 4mm, and described microwave drying temperature is 135 ℃, and other step is identical with embodiment 1 with principle, no longer repeats here.
Embodiment 6
This is embodiments of the invention 6, and difference from Example 1 is that selected cal(l)iper is 6mm, and described microwave drying temperature is 140 ℃, the outside depression in described hole is for being arc, see Fig. 3, other step is identical with embodiment 1 with principle, no longer repeats here.
Embodiment 7
This is embodiments of the invention 7, and difference from Example 1 is that selected cal(l)iper is 7mm, and described microwave drying temperature is 150 ℃, the outside depression in described hole is for being arc, see Fig. 3, other step is identical with embodiment 1 with principle, no longer repeats here.
Embodiment 8
This is embodiments of the invention 8, difference from Example 1 is that selected cal(l)iper is 8mm, described microwave drying temperature is 150 ℃, the outside depression in described hole is for being arc, see Fig. 3, described drying mode is an oven for drying, and other step is identical with embodiment 1 with principle, no longer repeats here.Perhaps oven for drying
Certainly, the embodiment of the above is preferred embodiment of the present invention, is not to limit the scope of the present invention, so all equivalences of doing according to described processing step of the present patent application claim and principle change or modify, and are included in the present patent application claim.
Claims (10)
1. the preparation method of a paper templet is characterized in that: comprise making and the paper panel and the bonding assembling of paper pin of paper pin of making, the paper templet of the paper panel of paper templet;
The making of A, described paper panel may further comprise the steps:
The first step: the interpolation frame lattice, on the interpolation frame under cardboard and the interpolation frame the crisscross grafting of the groove of cardboard get up, be formed with the sash of some lattices;
Second step: cardboard above bonding, insert good sash upper surface with glue bonding and sash area big or small identical above cardboard;
The 3rd step: cardboard below bonding, insert good sash lower surface with glue bonding than sash area big below cardboard;
The 4th step: following cardboard is turned down six bread cover sash, and bonding, make the paper of paper templet with glue, standby;
The making of the paper pin of B, described paper templet may further comprise the steps:
The first step: the interpolation frame lattice, on the interpolation frame under cardboard and the interpolation frame the crisscross grafting of the groove of cardboard get up, be formed with the sash of some lattices;
Second step: cardboard above bonding, insert good sash upper surface with glue on bonding identical with sash area size above cardboard;
The 3rd step: cardboard below bonding, insert good sash lower surface with glue on bonding identical with sash area size below cardboard;
The 4th step: the sash of cardboard above bonding and following cardboard is carried out drying;
The 5th step: cut, dried sash is evenly cut into some lattices;
The 6th step: cardboard below bonding, on the lower surface of lattice is bonding with glue than lattice area big below cardboard;
The 7th step: following cardboard is turned down six bread cover lattice, and bonding, make the paper pin of paper templet with glue, standby;
C, with the paper pin of the paper panel of the above-mentioned paper templet of making and paper templet with the bonding assembling of glue, form paper templet.
2. the preparation method of a kind of paper templet according to claim 1 is characterized in that: the making of described paper panel, comprise that also the sash that six bread are covered carries out drying, and dried sash is sprayed waterproof wax, makes the paper of paper templet, and is standby.
3. the preparation method of a kind of paper templet according to claim 1, it is characterized in that: the making of the paper pin of described paper templet comprises that also the lattice that six bread are covered carries out drying, and dried lattice is sprayed waterproof wax, makes the paper pin of paper templet, and is standby.
4. the preparation method of a kind of paper templet according to claim 1, it is characterized in that: the paperboard step is under the described interpolation frame:
The first step: selection, choose the cardboard that thickness is 2～10mm;
Second step: punching, selected cardboard is evenly punched the irregular cuboid that is shaped as the outside depression of long limit midpoint in the hole of being beaten;
The 3rd step: cut, the second cardboard hole that goes on foot gained is cut into two halves along the long limit of rectangle mid point, obtain two blocks of cardboards with infundibulate groove, the infundibulate groove of cardboard is placed on the positioning module up, forms cardboard under the interpolation frame, and is standby.
5. the preparation method of a kind of paper templet according to claim 1, it is characterized in that: the paperboard step is on the described interpolation frame:
The first step: selection, choose the cardboard that thickness is 2～10mm;
Second step: punching, selected cardboard is evenly punched the irregular cuboid that is shaped as the outside depression of long limit midpoint in the hole of being beaten;
The 3rd step: cut, second hole that goes on foot gained is cut into two halves along the long limit of rectangle mid point, obtain two blocks of cardboards with infundibulate groove;
The 4th step: turn to, with the cardboard that segments, upset infundibulate channel opening makes opening form cardboard on the interpolation frame down, and is standby.
6. the preparation method of a kind of paper templet according to claim 1, it is characterized in that: described drying is microwave drying or oven for drying.
7. the preparation method of a kind of paper templet according to claim 5, it is characterized in that: the described cal(l)iper of choosing is 2～5mm.
8. the preparation method of a kind of paper templet according to claim 6, it is characterized in that: described microwave drying temperature is 120～180 ℃.
9. the preparation method of a kind of paper templet according to claim 6, it is characterized in that: described microwave drying temperature is 120～130 ℃.
10. the preparation method of a kind of paper templet according to claim 5 is characterized in that: described outside depression be shaped as prismatic or arc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100286747A CN101337447B (en) | 2008-06-06 | 2008-06-06 | Preparation method of paper templet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100286747A CN101337447B (en) | 2008-06-06 | 2008-06-06 | Preparation method of paper templet |
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| Publication Number | Publication Date |
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| CN101337447A CN101337447A (en) | 2009-01-07 |
| CN101337447B true CN101337447B (en) | 2010-09-29 |
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| CN2008100286747A Expired - Fee Related CN101337447B (en) | 2008-06-06 | 2008-06-06 | Preparation method of paper templet |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102744916B (en) * | 2012-07-19 | 2013-12-04 | 中山华励包装有限公司 | Socle pressing and fixing machine of paper pallet |
| CN109228545A (en) * | 2018-10-23 | 2019-01-18 | 东莞市厚威包装科技股份有限公司 | A kind of automatic paper wrapping foot pier device and method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2419175Y (en) * | 2000-04-17 | 2001-02-14 | 海洋纸品印刷有限公司 | Paper supporting backboard |
| CN2592535Y (en) * | 2003-01-14 | 2003-12-17 | 刘继祥 | Paper stack board |
-
2008
- 2008-06-06 CN CN2008100286747A patent/CN101337447B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2419175Y (en) * | 2000-04-17 | 2001-02-14 | 海洋纸品印刷有限公司 | Paper supporting backboard |
| CN2592535Y (en) * | 2003-01-14 | 2003-12-17 | 刘继祥 | Paper stack board |
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| CN101337447A (en) | 2009-01-07 |
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Owner name: SHANGHAI CHENGYUN INDUSTRY CO., LTD. Free format text: FORMER OWNER: DONGGUAN JINXIN INTELLIGENT MACHINERY EQUIPMENT CO., LTD. Effective date: 20110930 |
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Free format text: CORRECT: ADDRESS; FROM: 523000 DONGGUAN, GUANGDONG PROVINCE TO: 201500 JINSHAN, SHANGHAI |
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Effective date of registration: 20110930 Address after: 201500, No. 7, 918 Zhong Tao Road, Zhu Jing Industrial Park, Shanghai, Jinshan District Patentee after: Shanghai Cheng Yun Industrial Co. Ltd. Address before: Wanjiang 523000 Guangdong city of Dongguan Province Wan Xing Lu Industrial Area C building in Dongguan city Jin Xin Intelligent Machinery Equipment Co Ltd Patentee before: Dongguan Jinxin Intelligent Machinery Equipment Co., Ltd. |
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Owner name: SHANGHAI BLUE DIAMOND ALUMINUM FOIL MANUFACTURING Free format text: FORMER OWNER: SHANGHAI CHENGYUN INDUSTRY CO., LTD. Effective date: 20131108 |
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Effective date of registration: 20131108 Address after: Tao road 201500 Shanghai city Jinshan District Zhujing Industrial Park No. 918 building 7 Patentee after: Shanghai blue diamond foil products Co., Ltd. Address before: 201500, No. 7, 918 Zhong Tao Road, Zhu Jing Industrial Park, Shanghai, Jinshan District Patentee before: Shanghai Cheng Yun Industrial Co. Ltd. |
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