CN101335129A - Surface mounting electronic member - Google Patents
Surface mounting electronic member Download PDFInfo
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- CN101335129A CN101335129A CNA2008101254781A CN200810125478A CN101335129A CN 101335129 A CN101335129 A CN 101335129A CN A2008101254781 A CNA2008101254781 A CN A2008101254781A CN 200810125478 A CN200810125478 A CN 200810125478A CN 101335129 A CN101335129 A CN 101335129A
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- lead terminal
- housing parts
- connecting portion
- mounting electronic
- electronic member
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Abstract
An inner lead terminal (2) is led out from a housing assembly (4) to a position same to a bottom surface (4a) or a position nearer to a mounting surface (11a) of a carrying base plate (11) than the bottom surface so as to be work as a connecting part (12) for a connecting disk (13) used for mounting and the connecting part is far away from the housing assembly. Furthermore, the front end of the connecting part of the lead terminal formed far away from the housing assembly is led into the inside of the housing assembly. The lead terminal is led out from the housing assembly at the position different from the bottom surface, and is bent at the connecting part to reach a position which is nearer to the mounting surfacing of the carrying base plate than the bottom surface. The connecting part of the lead terminal can change position in the height direction. Insulating resin is used for covering the main body of the electronic component and the connecting position of the main body of the electronic component and the lead terminal. Therefore, a surface mounting type electronic component, which has strong welding strength between the lead terminal and the connecting disk used for mounting and has excellent identification property of the joint status between the lead terminal and the electrode on the carrying base plate, is provided.
Description
Technical field
The present invention relates to surface mounting electronic member, relate in particular to a kind of with as backlight inverter (backlight inverter) etc. and mesohigh capacitor corresponding with mounted on surface that uses etc. is the surface mounting electronic member towards mesohigh of representative.
Background technology
As rated voltage is the electronic unit towards mesohigh more than several kV, and being extensive use of to go between is connected with the outer electrode of the former material of electronic unit, and utilizes the electronic unit of the type that outer dress resin is covered.
In the electronic unit of mesohigh,, generally can improve insulating properties and moisture-proof between terminal such by forming with adorning the former material of resin-coated electronic unit outward and exposing the structure of lead-in wire for electrical connection.
Because and the electrical connection between the installation usefulness terminal pad (electrode) on the circuit substrate, be by and described lead-in wire between welding carry out, so existing can't the problem corresponding with mounted on surface.
Therefore, a kind of electronic unit has been proposed, it will be by being contained in housing (case) with the former material of electronic unit of lead-in wire, and according to drawing lead-in wire along the bottom surface of this housing and the mode of side, and the lead-in wire of being drawn and the electrode on the circuit substrate welded, thereby and mounted on surface correspondence (with reference to patent documentation 1,2).
But, as the electronic unit of patent documentation 1 and 2, because drawing lead-in wire along the bottom surface of housing and side can be as shown in Figure 14, the lead-in wire 101 that is connected with the former material 100 of electronic unit forms with housing 102 along housing 102 and contacts, so, as Figure 15 schematically illustrates, electronic unit 110 is being carried on the mounted board 103, and under 101 situations of installation that are welded on the mounted board 103 that will go between with terminal pad (electrode) 104, scolding tin angle welding (fillet) 105 is in the state that does not center on the complete cycle of lead-in wire 101 fully, because only engage with the part of lead-in wire in 101 complete cycles, so, exist the problem that bond strength becomes not enough easily.
And the part of lead-in wire 101 extends to the bottom surface of housing 102, exists the problem of the welded condition that is difficult to this part of visuognosis.
[patent documentation 1] spy opens flat 6-333778 communique
[patent documentation 2] spy opens flat 6-251979 communique
Summary of the invention
The present invention proposes in order to solve above-mentioned problem, its purpose is, provide on a kind of lead terminal and the mounted board installation with between the terminal pad, be connected material and the bond strength that produces is big based on conductivity such as scolding tin, and the easily engagement state (for example welded condition), the surface mounting electronic member that installation reliability is high of the electrode on Visual Confirmation lead terminal and the mounted board.
In order to solve above-mentioned problem, surface mounting electronic member of the present invention, connect the installation terminal pad that material is formed on the installed surface at mounted board by mounted on surface by conductivity, possess: electronic unit element, the pair of lead wires terminal that it has element body and is electrically connected with this element body; And housing parts, it is contained in inside with this electronic unit element, has when being equipped on the described installed surface of described mounted board, with the opposed bottom surface of described installed surface;
Described lead terminal is drawn from the inside of described housing parts, and from the lead terminal that draw the inside of described housing parts, according to arriving identical or than the derivative part of mode of the position of the described installed surface of the more approaching described mounted board in bottom surface of described housing with the bottom surface of described housing, as the connecting portion performance function that is connected with terminal pad with described installation, and described connecting portion forms away from described housing parts.
In surface mounting electronic member of the present invention, the leading section of the connecting portion that forms away from housing parts of lead terminal is introduced in the inside of housing parts.
And lead terminal is drawn from housing parts in the position different with the bottom surface, is bent in connecting portion that to be processed into arrival identical with described bottom surface or than the position of the installed surface of the more close mounted board in described bottom surface.
And, can make the connecting portion of lead terminal become the shape that in the face parallel, has tortuous part with the bottom surface.
In addition, housing parts in the zone of bottom surface, be formed with recess from the side, draw lead terminal from the band step portion of one side, and the opposed the opposing party of band step portion who is incorporated into a side is with step portion.
In addition, it is outstanding downwards from described bottom surface that lead terminal is constituted its connecting portion, and from extrusion position to the scope of equal height position, bottom surface in can displacement.
And, can also the bottom surface of housing parts, by the position of the connecting portion clamping of pair of lead wires terminal, with the approximate peristome that forms abreast of connecting portion.
And the being insulated property of link position of element body and element body and lead terminal is resin-coated.
In addition, housing parts has in the receiving space of electronic unit element the pair of lead wires terminal is divided into mutually non-touching division portion.
According to surface mounting electronic member of the present invention, because according to arriving identical from the inside of housing parts or more drawing lead terminal near the mode of the position of the installed surface of mounted board than ground with the bottom surface, as with the connecting portion of installing with terminal pad, and make connecting portion away from housing parts, so, lead terminal is engaged with terminal pad with installation on the mounted board connecting material (for example scolding tin) by conductivity, when surface mounting electronic member is carried out mounted on surface, can make the complete cycle of lead terminal be connected material (scolding tin angle welding) joint (complete cycle that promptly is in connecting portion is connected the state that material (scolding tin angle welding) covers by conductivity) with conductivity at the connecting portion place, and, can Visual Confirmation away from the connecting portion of housing, the engagement state that connects material based on conductivity.
And, when the position that from the inside of housing parts lead terminal is drawn out to than the installed surface of the more close mounted board in bottom surface, owing to can install from the state that mounted board floats, so can improve patience to the deflection of the mounted board after installing with housing parts.
And, in existing surface mounting electronic member, when lead terminal is positioned at below the housing of the connecting portion of terminal pad and electronic unit with simultaneously the time with installing, if housing tilts, then a side lead terminal floats with terminal pad from installing sometimes, can not be electrically connected, but form with in the electrode part at electric capacity of the present invention, when being drawn out to than the bottom surface more near the position of the installed surface of mounted board, because can be with the state mounting shell body component that floats from mounted board, so, can prevent above-mentioned problem.
Therefore, according to the present application, can provide between the electrode on a kind of lead terminal and the mounted board, be connected material and the bond strength that produces is big based on conductivity such as scolding tin, and the Visual Confirmation height of the engagement state of the electrode on lead terminal and the mounted board (for example welded condition), the whole outstanding surface mounting electronic member of installation reliability.
In addition, be connected and in the electronic unit main body that constitutes the outer electrode that element body and lead terminal can form by the surface at element body and being electrically connected with element body at lead terminal.And element body also can expressly not possess outer electrode, and exposed division of its internal electrode etc. directly is connected with lead terminal.
And, be incorporated at leading section under the situation of inside of housing parts the connecting portion that forms away from housing parts of lead terminal, the two ends that can keep lead terminal, the intensity, the shape that improve lead terminal keep function, are connected with the stable of lead terminal thereby can realize installing with terminal pad.
In addition, draw lead terminal in the position different from housing parts with the bottom surface, and become to arrive identical or during than the position of the installed surface of the more close mounted board in bottom surface with the bottom surface in connecting portion place bending machining, can increase the junction surface of lead terminal, thus obtain significantly with mounted board on installation usefulness terminal pad between bonding area.
In addition, form the shape that in the predetermined surface parallel, has the part of warpage with the bottom surface by connecting portion with lead terminal, the i.e. warpage and the shape of in this face, extending in the face of this regulation, thereby can increase with mounted board on installation with the bonding area of terminal pad, can improve the bond strength of installing with terminal pad and lead terminal.
And, when the zone to the bottom surface forms recess in the side of housing parts, draw lead terminal from the band step portion of one side, and be incorporated into when being with step portion with the opposed the opposing party of side band step portion, can be from the upper side visual confirmation recess of housing parts the installation of junction surface and mounted board with the engagement state of terminal pad, thereby can improve installation reliability.
And, when lead terminal is constituted, from the outstanding downwards connecting portion in this bottom surface can from this extrusion position to the scope of equal height position, bottom surface during displacement, can absorb the bump when installing and the form variations of lead terminal, thereby realize installing stable contact, be connected with terminal pad and the connecting portion of lead terminal.
In addition, as the method for the height and position displacement that can make connecting portion, for example can adopt predetermined gap (clearance) is set accommodates, so that can among housing parts, move freely methods such as electronic unit element along the vertical direction.
In addition, when the bottom surface of housing parts by the position of the connecting portion clamping of pair of lead wires terminal, when having formed peristome abreast, can increase the creepage distance between the connecting portion of pair of lead wires terminal, thereby can improve anti-trace (tracking) performance with connecting portion is approximate.
And, when the element body that constitutes the electronic unit element, and the being insulated property of link position of element body and lead terminal when resin-coated, the characteristic and the reliability of the electronic unit element when scolding tin engages in the time of can preventing to utilize scolding tin to connect material as conductivity reduce, and, the radial mode electronic unit that possesses lead terminal can be processed into the electronic unit of surface installing type.
And, when being constituted, housing parts in the receiving space of electronic unit element, has when the pair of lead wires terminal is divided into the division portion that is not in contact with one another, and can guarantee the high insulating properties between the lead terminal, thereby improve reliability.
Description of drawings
Fig. 1 is the stereogram of the formation of the related surface mounting electronic member of an embodiment (embodiment 1) of expression the present application.
Fig. 2 is the front cross-sectional view of the formation of the related surface mounting electronic member of the embodiment 1 of expression the present application.
Fig. 3 is the figure of electronic unit element (radially (radial) type ceramic capacitor) of the formation surface mounting electronic member of expression the present application, (a) is front view, (b) is vertical view.
Fig. 4 schematically is illustrated in the manufacturing process of the related surface mounting electronic member of the embodiment 1 of the present application, the lead terminal of electronic unit element is carried out the figure of the state of bending machining.
Fig. 5 schematically is illustrated in the manufacturing process of the related surface mounting electronic member of the embodiment 1 of the present application, the electronic unit element is arranged at the figure of the state of housing body.
Fig. 6 is in the manufacturing process of the related surface mounting electronic member of the embodiment 1 of the present application, and the electronic unit element is contained in the figure that the method for housing parts describes.
Fig. 7 is the end view that expression is installed to the embodiment 1 related surface mounting electronic member of the present application the state on the mounted board.
Fig. 8 is the front view that expression is installed to the embodiment 1 related surface mounting electronic member of the present application the state on the mounted board.
Fig. 9 is the figure of the variation 1 of the related surface mounting electronic member of the embodiment 1 of expression the present application.
Figure 10 is the figure of the variation 2 of the related surface mounting electronic member of the embodiment 1 of expression the present application.
Figure 11 is the figure of the variation 3 of the related surface mounting electronic member of the embodiment 1 of expression the present application.
Figure 12 is the figure of the variation 4 of the related surface mounting electronic member of the embodiment 1 of expression the present application.
Figure 13 is the upward view of the variation 5 of the related surface mounting electronic member of the embodiment 1 of expression the present application.
Figure 14 is that expression will possess the figure of the electronic unit element of lead terminal as the conventional example of surface mounting electronic member.
Figure 15 is the figure that is illustrated in the state that has carried existing surface mounting electronic member on the mounted board.
Among the figure: 1-element body, 2 (2a)-lead terminals, 3-electronic unit element (radial mode ceramic capacitor), 4-housing parts 4, the 4a-bottom surface, the 4b-recess, the 4c-recess-individual end face, another end face of 4d-recess, 4e-division portion, 4x-housing body, the 4y-cover, 5-scolding tin angle welding, 11-mounted board, the installed surface of 11a-mounted board, 12 (12a, 12b)-connecting portions, 13-are installed and are used terminal pad, the 15-receiving space, 16-insulative resin, 17-peristome.
Embodiment
Show embodiments of the invention below, feature of the present invention is described in more details.
[embodiment 1]
Fig. 1 is the stereogram of the formation of the surface mounting electronic member of representing that schematically the embodiment of the present application is related, and Fig. 2 is a front cross-sectional view.
Wherein, among this embodiment 1, to shown in Fig. 3 (a) and (b), after lead terminal 2 (2a, 2b) bending machining is become the shape of regulation, the radial mode ceramic capacitor (electronic unit element) 1 that two lead terminals 2 (2a, 2b) are connected with element body 1 is accommodated housing parts 4 interior surface mounting electronic members and is illustrated.
The surface mounting electronic member 10 of this embodiment possesses shown in Fig. 1～3: element body 1; Has the pair of external electrodes (not shown) that forms by surface, the electronic unit of the pair of lead wires terminal 2 that is electrically connected with element body 1 (2a, 2b) (being the radial mode ceramic capacitor in the present embodiment) 3 at element body 1; With this electronic unit element 3 is housed in inside, have when the installation of the installed surface 11a that is carried at mounted board 11 (with reference to Fig. 2,7,8) with on the terminal pad 13 time, with the housing parts 4 of the opposed bottom surface 4a of installed surface 11a.
And, in this surface mounting electronic member 10, each lead terminal 2 (2a, 2b) as shown in Figure 1 and Figure 2, draw from housing parts the position different with bottom surface 4a at housing parts 4, connecting portion 12 (12a, 12b) (with reference to Fig. 7) locate to be bent be processed into arrival than bottom surface 4a more near the position of the installed surface 11a of mounted board 11.
In addition, also can be according to circumstances, connecting portion 12 (12a, 12b) constituted with bottom surface 4a be positioned at identical position.
Connecting portion 12 (12a, 12b) is the installation that is connected mounted board 11 with the part on the terminal pad 13, in the surface mounting electronic member 10 of this embodiment 1, than bottom surface 4a near the installed surface 11a of mounted board 11 and away from the position of housing 4, form straight part with the state of level of approximation.
Promptly, in the surface mounting electronic member 10 of this embodiment 1, to the zone of bottom surface, be formed with recess 4b (Fig. 1, Fig. 2, Fig. 8) from the side of housing parts 4, draw lead terminal 2 (2a, 2b) from the band step portion 4c of one side, and be incorporated into and be with the opposed the opposing party of step portion 4c to be with step portion 4d, and be provided with connecting portion 12 (12a, 12b) halfway.
In addition, in the surface mounting electronic member 10 of this embodiment 1, constitute the element body 1 of electronic unit element 3 and the link position of element body 1 and lead terminal 2,16 linings of being insulated property resin.
In addition, the surface mounting electronic member 10 of this embodiment 1 for example can be by the method manufacturing of following explanation.
At first, as shown in Figure 4, the lead terminal 2 of radial mode ceramic capacitor (electronic unit element) 3 is carried out bending machining.
Then, as shown in Figure 5, electronic unit element 3 is arranged at the housing body 4x that constitutes housing parts 4, and, draw lead terminal 2 from the side's of the recess 4b that is formed at housing body 4x band step portion 4c, and be incorporated into opposed the opposing party's band step portion 4d.In addition, the part of the bending machining of lead terminal 2 also can be carried out at this moment.
Then, as shown in Figure 6, the cover 4y that constitutes housing parts 4 is installed, electronic unit element 3 is accommodated remain in housing parts 4.
Thus, can obtain having the surface mounting electronic member 10 of structure as shown in Figure 1, 2.
In the surface mounting electronic member 10 that constitutes as mentioned above, when the installation terminal pad 13 that lead terminal 2 is welded on the mounted board 11, when surface mounting electronic member 10 is carried out mounted on surface, shown in Fig. 7 and 8, the complete cycle of lead terminal 2 is engaged (promptly with scolding tin (scolding tin angle welding) 5, the complete cycle that is in junction surface 12 is by the state of scolding tin angle welding 5 coverings), can improve and install with terminal pad 13 and lead terminal 2 (2a, bonding strength 2b), and, can be visually observed the weld part of the recess 4b that is positioned at housing parts 4, be connecting portion 12 near, confirm welded condition.
And, shown in Fig. 7 and 8, owing to can install from the state that mounted board 11 floats with housing parts 4, so, patience can be improved to the deflection of the mounted board 11 after installing.In addition, even under the situation that has taken place to tilt at housing parts, the lead terminal that also can prevent a side floats and can not be electrically connected from installing with terminal pad, thereby can improve connection reliability.
In addition, owing to be with step portion 4c to draw the leading section of lead terminal 2 from the side of the recess 4b of the side that is formed on housing parts 4, be introduced into the opposing party's band step portion 4d, so, the two ends that can keep lead terminal 2 (2a, 2b), the intensity and the shape that improve lead terminal 2 (2a, 2b) keep function, install with the bond strength of terminal pad 13 with lead terminal 2 (2a, 2b) thereby improve.
In addition, in the surface mounting electronic member 10 of present embodiment 1, because element body 1 and element body 1 are covered with being insulated property of the link position resin 16 of lead terminal 2, so, the characteristic of electronic unit element 3 and reliability reduce in the time of not only can preventing to weld, and the radial mode ceramic capacitor that possesses lead terminal 2 can be embodied as surface installing type.
As mentioned above, according to the present invention, can increase the weld strength of the installation usefulness terminal pad 13 on lead terminal 2 and the mounted board 11, make lead terminal 2 outstanding with the welded condition visuognosis of connection pads 13, thereby can realize the whole high surface mounting electronic member 10 of installation reliability with the installation on the mounted board 11.
[variation 1]
Fig. 9 is the figure of the variation (variation 1) of the related surface mounting electronic member of expression the foregoing description 1.In the above-described embodiments, for example understand with the state of level of approximation connecting portion 12 is formed the situation of straight part, but connecting portion 12 also can become the shape of dipping and heaving bending as shown in Figure 9.
In addition, connecting portion 12 also can not be the waveform shape of the such band radian of Fig. 9, though and become and do not have special diagram not have radian and with the shape of corner angle, can also form shape of impulse wave at the joggling part of Fig. 9.
Like this, by connecting portion 12 being formed bending or crooked shape, can increase the bonding area with scolding tin, thereby can improve the bond strength of installing with terminal pad and lead terminal.
[variation 2]
Figure 10 is the figure of other variation (variation 2) of the related surface mounting electronic member of expression the foregoing description 1.In this variation 2, as shown in figure 10, connecting portion 12 is formed the shape that in the face parallel, is bent processing with the bottom surface 4a (being the installed surface of mounted board) of housing 4.Wherein, Figure 10 has carried out bending machining in the direction towards the outside in the upright projection zone of housing parts 4 to connecting portion 12, but also can be in direction towards the inboard in the upright projection zone of housing parts 4, carry out bending machining, under this situation, can avoid the increase of installing space.In addition, preferably, can carry out bending machining in the scope of Visual Confirmation connecting portion 12 when when the direction of the inboard in upright projection zone is carried out bending machining.
Like this, by in the face parallel, connecting portion 12 being formed bending or crooked shape, can increase the bonding area of installing with terminal pad and lead terminal, thereby can improve installation reliability with bottom surface 4a (being the installed surface of mounted board).
[variation 3]
In addition, Figure 11 is the figure of the major part of another variation (variation 3) of schematically representing the surface mounting electronic member 10 of the foregoing description 1.
In this variation 3, as shown in figure 11, lead terminal 2a, 2b from bottom surface 4a outstanding downwards connecting portion 12a, 12b, constitute begin from its extrusion position to the scope of 4a equal height position, bottom surface in, can be along above-below direction (direction of representing by arrow A) and horizontal direction (direction of representing by arrow B) displacement.
Under situation about so constituting, can absorb bump when installing and the form variations of lead terminal 2a, 2b, the installation that can realize mounted board with the stable contact of terminal pad and the connecting portion of lead terminal, be connected.
[variation 4]
In addition, Figure 12 is the figure of the major part of another variation (variation 4) of schematically representing the surface mounting electronic member 10 of the foregoing description 1.
As shown in figure 12, the housing body 4x that constitutes housing parts 4 possesses pair of lead wires terminal 2 (2a, 2b) is divided into the 4e of division portion that is not in contact with one another in the receiving space 15 that can accommodate electronic unit element 3 in this variation 4.Wherein, the not special restriction of the shape of the 4a of division portion can be made as different shape.
Shown in this variation 4, possess the 4e of division portion by housing parts 4, can guarantee the high insulating properties between lead terminal 2a, 2b, can improve reliability.
[variation 5]
Figure 13 is the figure of the major part of the another one variation (variation 5) of schematically representing the surface mounting electronic member 10 of the foregoing description 1.
This variation 5 as shown in figure 13, the bottom surface of housing parts 4 4a, by the position of the connecting portion 12a of pair of lead wires terminal 2a, 2b, 12b clamping, with the approximate peristome 17 that is formed with abreast of connecting portion 12a, 12b.
Shown in this variation 5, when the bottom surface of housing parts 4 4a, by the position of the connecting portion 12a of pair of lead wires terminal 2a, 2b, 12b clamping, when having formed peristome 17 abreast with connecting portion 12a, 12b are approximate, the creepage distance between connecting portion 12a, the 12b of pair of lead wires terminal 2a, 2b can be increased, thereby anti-trace (tracking) performance can be improved.
In addition, the foregoing description illustrated the electronic unit element be the situation of radial mode ceramic capacitor, but the kind of electronic unit element is not limited to this, can use the present application in possessing the various electronic units of lead terminal.
And, the foregoing description and variation illustrated utilize scolding tin to connect the situation of material as conductivity, but in the present application, can also use the electroconductive resin that in resin, disperseed electroconductive powder etc. to connect material as conductivity.
The present application is in the formation that also is not limited to the foregoing description and variation aspect other, in scope of invention, for the formation of the concrete shape at splicing ear and junction surface, housing parts, lead terminal from the extraction location of housing parts, install for the configuration mode of terminal pad and shape etc., can be in the various application of interpolation, distortion in scope of invention.
Industrial utilizability
According to the present application, can provide installation on a kind of lead terminal and the mounted board with being connected Bond strength between the dish, that form based on electric conductivity connecting materials such as scolding tin is big, and confirms easily to draw The engagement state of installation on line terminals and the mounted board between the terminal pad, the table that installation reliability is high The surface installation type electronic unit.
Therefore, the present application can be with installing with the surface of using as backlight inverter etc. Corresponding middle-and high-voltage capacitor etc. for representative, possess towards the electronic unit of the lead terminal of mesohigh Extensive use in the field.
Claims (9)
1, a kind of surface mounting electronic member connects material by the installation terminal pad that mounted on surface forms by conductivity on the installed surface at mounted board, it is characterized in that, comprises:
The electronic unit element, the pair of lead wires terminal that it has element body and is electrically connected with this element body; With
Housing parts, it is contained in inside with this electronic unit element, has when being equipped on the described installed surface of described mounted board and the opposed bottom surface of described installed surface;
Described lead terminal is drawn from the inside of described housing parts, and the lead terminal of drawing from the inside of described housing parts, according to arriving identical or than the derivative part of mode of the position of the described installed surface of the more approaching described mounted board in bottom surface of described housing with the bottom surface of described housing, as the connecting portion performance function that is connected with terminal pad with described installation, and
Described connecting portion forms away from described housing parts.
2, surface mounting electronic member according to claim 1 is characterized in that,
The leading section of the connecting portion that forms away from described housing parts of described lead terminal is introduced in the inside of described housing parts.
3, surface mounting electronic member according to claim 1 and 2 is characterized in that,
Described lead terminal is drawn from described housing parts in the position different with described bottom surface, is bent in described connecting portion that to be processed into arrival identical with described bottom surface or than the position of the described installed surface of the more close described mounted board in described bottom surface.
4, according to any described surface mounting electronic member in the claim 1～3, it is characterized in that,
Described lead terminal possesses described connecting portion has tortuous part in the predetermined surface parallel with described bottom surface shape.
5, according to any described surface mounting electronic member in the claim 2～4, it is characterized in that,
Described housing parts is being formed with the recess of depression to the inside in the zone of bottom surface from the side, draw described lead terminal from a side's of described recess band step portion, and the opposed the opposing party of band step portion who is incorporated into a described side is with step portion.
6, according to any described surface mounting electronic member in the claim 1～5, it is characterized in that,
It is outstanding downwards from described bottom surface that described lead terminal is constituted as described connecting portion, and from described extrusion position to the scope of equal height position, described bottom surface in, described connecting portion can displacement.
7, according to any described surface mounting electronic member in the claim 1～6, it is characterized in that,
The described bottom surface of described housing parts, by the position of the described connecting portion clamping of described pair of lead wires terminal, form peristome.
8, according to any described surface mounting electronic member in the claim 1～7, it is characterized in that,
Being insulated property of link position between the described element body of described electronic unit element, described element body and the described lead terminal is resin-coated.
9, according to any described surface mounting electronic member in the claim 1～8, it is characterized in that,
Described housing parts has division portion in the receiving space of described electronic unit element, this division portion is divided into described pair of lead wires terminal mutually and does not contact.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007169157A JP4396734B2 (en) | 2007-06-27 | 2007-06-27 | Surface mount electronic components |
| JP2007-169157 | 2007-06-27 | ||
| JP2007169157 | 2007-06-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101335129A true CN101335129A (en) | 2008-12-31 |
| CN101335129B CN101335129B (en) | 2011-05-11 |
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ID=40197647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101254781A Active CN101335129B (en) | 2007-06-27 | 2008-06-18 | Surface mounting electronic member |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4396734B2 (en) |
| CN (1) | CN101335129B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103700491A (en) * | 2013-12-21 | 2014-04-02 | 铜陵源丰电子有限责任公司 | Convenient-to-mount thin-film capacitor |
| CN103999174A (en) * | 2011-12-22 | 2014-08-20 | 松下电器产业株式会社 | Coil component |
| CN107210592A (en) * | 2015-02-03 | 2017-09-26 | 株式会社自动网络技术研究所 | Circuit structure |
| CN114498114A (en) * | 2020-10-23 | 2022-05-13 | 住友电装株式会社 | Connector structure |
| CN114498114B (en) * | 2020-10-23 | 2024-05-17 | 住友电装株式会社 | Connector structure |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101141447B1 (en) * | 2009-12-01 | 2012-05-15 | 삼성전기주식회사 | Chip-type electric double layer capacitor and method for manufacturing the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3175609B2 (en) * | 1996-11-19 | 2001-06-11 | 日本電気株式会社 | Chip type electronic components |
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2007
- 2007-06-27 JP JP2007169157A patent/JP4396734B2/en active Active
-
2008
- 2008-06-18 CN CN2008101254781A patent/CN101335129B/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103999174A (en) * | 2011-12-22 | 2014-08-20 | 松下电器产业株式会社 | Coil component |
| CN103999174B (en) * | 2011-12-22 | 2016-07-13 | 松下知识产权经营株式会社 | Coil component |
| US9478346B2 (en) | 2011-12-22 | 2016-10-25 | Panasonic Intellectual Property Management Co., Ltd. | Coil component |
| CN103700491A (en) * | 2013-12-21 | 2014-04-02 | 铜陵源丰电子有限责任公司 | Convenient-to-mount thin-film capacitor |
| CN107210592A (en) * | 2015-02-03 | 2017-09-26 | 株式会社自动网络技术研究所 | Circuit structure |
| CN107210592B (en) * | 2015-02-03 | 2019-12-10 | 株式会社自动网络技术研究所 | Circuit structure |
| CN114498114A (en) * | 2020-10-23 | 2022-05-13 | 住友电装株式会社 | Connector structure |
| CN114498114B (en) * | 2020-10-23 | 2024-05-17 | 住友电装株式会社 | Connector structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101335129B (en) | 2011-05-11 |
| JP4396734B2 (en) | 2010-01-13 |
| JP2009010116A (en) | 2009-01-15 |
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