CN101331618A - 产生期望色点的光的半导体光源和方法 - Google Patents
产生期望色点的光的半导体光源和方法 Download PDFInfo
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- CN101331618A CN101331618A CNA200680047002XA CN200680047002A CN101331618A CN 101331618 A CN101331618 A CN 101331618A CN A200680047002X A CNA200680047002X A CN A200680047002XA CN 200680047002 A CN200680047002 A CN 200680047002A CN 101331618 A CN101331618 A CN 101331618A
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- 238000000034 method Methods 0.000 claims description 11
- 230000005284 excitation Effects 0.000 abstract description 39
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- 229910002601 GaN Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
Landscapes
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05112091.3 | 2005-12-14 | ||
EP05112091 | 2005-12-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101331618A true CN101331618A (zh) | 2008-12-24 |
Family
ID=38042599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA200680047002XA Pending CN101331618A (zh) | 2005-12-14 | 2006-12-07 | 产生期望色点的光的半导体光源和方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080315217A1 (zh) |
EP (1) | EP1964184A2 (zh) |
JP (1) | JP2009519598A (zh) |
KR (1) | KR20080080171A (zh) |
CN (1) | CN101331618A (zh) |
TW (1) | TW200733429A (zh) |
WO (1) | WO2007069148A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103311412A (zh) * | 2012-03-13 | 2013-09-18 | 东芝照明技术株式会社 | 照明装置 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006015117A1 (de) | 2006-03-31 | 2007-10-04 | Osram Opto Semiconductors Gmbh | Optoelektronischer Scheinwerfer, Verfahren zum Herstellen eines optoelektronischen Scheinwerfers und Lumineszenzdiodenchip |
DE102006024165A1 (de) * | 2006-05-23 | 2007-11-29 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Optoelektronischer Halbleiterchip mit einem Wellenlängenkonversionsstoff sowie optoelektronisches Halbleiterbauelement mit einem solchen Halbleiterchip und Verfahren zur Herstellung des optoelektronischen Halbleiterchips |
KR101154758B1 (ko) | 2008-11-18 | 2012-06-08 | 엘지이노텍 주식회사 | 반도체 발광소자 및 이를 구비한 발광소자 패키지 |
US8604498B2 (en) * | 2010-03-26 | 2013-12-10 | Tsmc Solid State Lighting Ltd. | Single phosphor layer photonic device for generating white light or color lights |
JP2012155907A (ja) * | 2011-01-24 | 2012-08-16 | Panasonic Corp | 照明装置 |
TWI505524B (zh) * | 2011-05-20 | 2015-10-21 | Au Optronics Corp | 有機電激發光光源 |
US9541242B2 (en) * | 2012-03-01 | 2017-01-10 | Koninklijke Philips N.V. | LED lighting arrangement |
US11273324B2 (en) | 2015-07-14 | 2022-03-15 | Illumipure Corp | LED structure and luminaire for continuous disinfection |
US20170014538A1 (en) * | 2015-07-14 | 2017-01-19 | Juha Rantala | LED structure and luminaire for continuous disinfection |
CN113109968A (zh) * | 2020-01-13 | 2021-07-13 | 海信视像科技股份有限公司 | 一种显示装置及其色温调节方法 |
US11499707B2 (en) | 2020-04-13 | 2022-11-15 | Calyxpure, Inc. | Light fixture having a fan and ultraviolet sterilization functionality |
US11759540B2 (en) | 2021-05-11 | 2023-09-19 | Calyxpure, Inc. | Portable disinfection unit |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2248663B1 (zh) * | 1972-12-13 | 1978-08-11 | Radiotechnique Compelec | |
JP3680395B2 (ja) * | 1995-12-20 | 2005-08-10 | 日亜化学工業株式会社 | 面状発光装置及びその駆動方法 |
US5952681A (en) * | 1997-11-24 | 1999-09-14 | Chen; Hsing | Light emitting diode emitting red, green and blue light |
JP3400958B2 (ja) * | 1999-07-07 | 2003-04-28 | 株式会社シチズン電子 | 多色発光ダイオード |
JP2002057376A (ja) * | 2000-05-31 | 2002-02-22 | Matsushita Electric Ind Co Ltd | Ledランプ |
US6577073B2 (en) * | 2000-05-31 | 2003-06-10 | Matsushita Electric Industrial Co., Ltd. | Led lamp |
US6737801B2 (en) * | 2000-06-28 | 2004-05-18 | The Fox Group, Inc. | Integrated color LED chip |
US6547249B2 (en) * | 2001-03-29 | 2003-04-15 | Lumileds Lighting U.S., Llc | Monolithic series/parallel led arrays formed on highly resistive substrates |
US7005679B2 (en) * | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
EP1670875B1 (de) * | 2003-09-24 | 2019-08-14 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Hocheffizientes beleuchtungssystem auf led-basis mit verbesserter farbwiedergabe |
JP2005216898A (ja) * | 2004-01-27 | 2005-08-11 | Matsushita Electric Ind Co Ltd | 波長変換素子、光源及び光源の製造方法 |
-
2006
- 2006-12-07 EP EP06832134A patent/EP1964184A2/en not_active Withdrawn
- 2006-12-07 JP JP2008545179A patent/JP2009519598A/ja active Pending
- 2006-12-07 US US12/097,083 patent/US20080315217A1/en not_active Abandoned
- 2006-12-07 KR KR1020087016900A patent/KR20080080171A/ko not_active Application Discontinuation
- 2006-12-07 WO PCT/IB2006/054652 patent/WO2007069148A2/en active Application Filing
- 2006-12-07 CN CNA200680047002XA patent/CN101331618A/zh active Pending
- 2006-12-11 TW TW095146326A patent/TW200733429A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103311412A (zh) * | 2012-03-13 | 2013-09-18 | 东芝照明技术株式会社 | 照明装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2009519598A (ja) | 2009-05-14 |
WO2007069148A3 (en) | 2007-09-27 |
TW200733429A (en) | 2007-09-01 |
EP1964184A2 (en) | 2008-09-03 |
KR20080080171A (ko) | 2008-09-02 |
WO2007069148A2 (en) | 2007-06-21 |
US20080315217A1 (en) | 2008-12-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: EC-OPTICS INC. Free format text: FORMER OWNER: KONINKLIJKE PHILIPS ELECTRONICS N.V. Effective date: 20100504 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: EINDHOVEN, NETHERLANDS TO: MIAOLI COUNTY, TAIWAN PROVINCE, CHINA |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20100504 Address after: Miaoli County, Taiwan Province, China Applicant after: Tongbao Optoelectronics Co., Ltd. Address before: Holland Ian Deho Finn Applicant before: Koninklijke Philips Electronics N.V. |
|
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20081224 |