CN101330111A - Dye sensitization solar battery - Google Patents

Dye sensitization solar battery Download PDF

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Publication number
CN101330111A
CN101330111A CN 200710109406 CN200710109406A CN101330111A CN 101330111 A CN101330111 A CN 101330111A CN 200710109406 CN200710109406 CN 200710109406 CN 200710109406 A CN200710109406 A CN 200710109406A CN 101330111 A CN101330111 A CN 101330111A
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China
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substrate
electrode
dssc
convex
concave surface
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CN 200710109406
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Chinese (zh)
Inventor
张汉宜
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Prodisc Technology Inc
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Prodisc Technology Inc
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Priority to CN 200710109406 priority Critical patent/CN101330111A/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/542Dye sensitized solar cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells

Abstract

The invention relates to a dye-sensitized solar cell, which comprises a first electrode plate, a second electrode layer and a first reaction packed layer. The first electrode plate comprises a first base plate and a first electrode layer, wherein, the first base plate comprises a first uneven surface, and the first electrode layer is arranged on the first uneven surface. The second electrode layer is arranged opposite to the first electrode layer. The first reaction packed layer is arranged between the first electrode layer and the second electrode layer. In the dye-sensitized solar cell, not only the contact area between the first electrode plate and the first electrode layer is greatly enlarged, but also the photovoltaic conversion efficiency is proportionally enhanced; in addition, because the contact area between the reaction packed layer and the electrode plate is enlarged, the size of the panel of the dye-sensitized solar cell is not required to be increased and even to be reduced, thereby the applicable range of the dye-sensitized solar cell is widened.

Description

DSSC
Technical field
The present invention relates to a kind of solar cell, particularly relate to a kind of DSSC.
Background technology
Surging along with the exhaustion crisis of the expendable energy and global environmental consciousness effectively utilizes the various renewable energy resources to become very important now problem.Because solar energy is to be one of the most conspicuous renewable energy resources in the life, therefore, solar battery technology also becomes one of dealer's development priority now.According to the kind of solar cell then can be divided into Silicon Wafer formula solar cell (silicon wafer-basedsolar cells), thin-film type solar cell (thin-film solar cell) and DSSC (Dye-Sensitized Solar Cells, DSSC).Wherein, DSSC because have that cost is low, processing procedure reaches flexible easily and characteristic such as bends, and also becomes one of market mainstream gradually.
See also shown in Figure 1ly, existing known DSSC 1 comprises one first electrode base board 11, a reaction lamination 12 and one second electrode base board 13, wherein reacts lamination 12 and is arranged between first electrode base board 11 and second electrode base board 13.First electrode base board 11 has one first substrate 111, and one first electrode layer 112 and a metal level 113 are set on it in regular turn.Reaction lamination 12 then comprises a dielectric substrate 121, a dye coating 122 and a metal oxide layer 123, and the three is arranged on the metal level 113 in regular turn.13 of second electrode base boards comprise a second electrode lay 131 and one second substrate 132, and both are arranged on the metal oxide layer 123 in regular turn.
After light L is incident to DSSC 1, dyestuff in the dye coating 122 can absorb light L and produce electronics, electronics via metal oxide layer 123 as conductive layer, and mat the second electrode lay 131 as negative electrode with electronic guide to external circuit C1, and be connected to form a complete loops with the anode of first electrode base board 11.In addition, the dye coating 122 that loses electronics can obtain electronics by dielectric substrate 121, and the electronics of dielectric substrate 121 then produces redox reaction by metal level in first electrode base board 11 113 and dielectric substrate 121.Therefore, first electrode base board 11 is bigger with the contact area of dielectric substrate 121, then the metal level in first electrode base board 11 113 and dielectric substrate 121 produce redox reactions number of times also the more, so can influence the photoelectric conversion efficiency of DSSC 1.
And the surface that first electrode base board 11 contacts with dielectric substrate 121 in the existing known techniques is to be a flat surfaces, therefore, under the situation that incident ray L fixes, if desire by improving the efficient of first electrode base board 11 with the redox reaction of dielectric substrate 121, promote the photoelectric conversion efficiency of DSSC 1, then certainly will will increase the size of first electrode base board 11.Thus, then can cause the raising of cost of manufacture, and range of application such as is restricted at shortcoming.
This shows that above-mentioned existing DSSC obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of novel size that need not increase DSSC, and can promote the DSSC of photoelectric conversion efficiency, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing DSSC exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of novel DSSC, can improve general existing DSSC, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Main purpose of the present invention is, overcome the defective that existing DSSC exists, and a kind of novel DSSC, technical problem to be solved are provided is to make it need not increase dyestuff and can promote photoelectric conversion efficiency, is very suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of DSSC according to the present invention's proposition, this solar cell comprises: one first electrode base board, be to have one first substrate and one first electrode layer, this first substrate has one first convex-concave surface, and this first electrode layer is arranged on this first convex-concave surface; One the second electrode lay is and this first electrode layer subtend setting; And one first the reaction lamination, be to be arranged between this first electrode layer and this second electrode lay.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid DSSC, the recess of wherein said first convex-concave surface and the difference in height of protuberance are for more than 10 nanometers.
Aforesaid DSSC is characterized in that wherein said first substrate is to be rigid substrates, flexible base, board, glass substrate or plastic substrate.
Aforesaid DSSC, wherein said first electrode base board has more a first metal layer, and this first metal layer is to be arranged between this first reaction lamination and this first electrode layer.
Aforesaid DSSC, the wherein said first reaction lamination is to have one first dielectric substrate, one first dye coating and one first metal oxide layer.
Aforesaid DSSC is characterized in that it more comprises: one second substrate, wherein this second electrode lay is to be located between this second substrate and this first reaction lamination.
Aforesaid DSSC, wherein said second substrate are to be rigid substrates, flexible base, board, glass substrate or plastic substrate.
Aforesaid DSSC, wherein said second substrate are to have one second convex-concave surface, and this second electrode lay is to be arranged on this second convex-concave surface.
Aforesaid DSSC, the recess of wherein said second convex-concave surface and the difference in height of protuberance are for more than 10 nanometers.
Aforesaid DSSC, it more comprises: a target substrate, it is to be located between this first reaction lamination and this second electrode lay.
Aforesaid DSSC, wherein said target substrate is to have an Intermediate substrate, a third electrode layer, one the 4th electrode layer and one second metal level, this third electrode layer is to be located between this Intermediate substrate and this first reaction lamination, the 4th electrode layer is to be located between this Intermediate substrate and this second metal level, and this second metal level is in the face of this second electrode lay.
Aforesaid DSSC, wherein said Intermediate substrate are to have one the 3rd relative convex-concave surface and one the 4th convex-concave surface, and the 3rd convex-concave surface is in the face of this third electrode layer.
Aforesaid DSSC, the recess of wherein said the 3rd convex-concave surface and the difference in height of protuberance are for more than 10 nanometers.
Aforesaid DSSC, the recess of wherein said the 4th convex-concave surface and the difference in height of protuberance are for more than 10 nanometers.
Aforesaid DSSC, wherein said Intermediate substrate are to be rigid substrates, flexible base, board, glass substrate or plastic substrate.
Aforesaid DSSC, it more comprises: one second reaction lamination, it is to be located between this target substrate and this second electrode lay.
Aforesaid DSSC, the wherein said second reaction lamination is to have one second dielectric substrate, one second dye coating and one second metal oxide layer.
The present invention compared with prior art has tangible advantage and beneficial effect.By technique scheme, DSSC of the present invention has following advantage and beneficial effect at least: from the above, because of according to DSSC of the present invention being forms a convex-concave surface on first electrode base board, the contact area of first electrode base board and the first reaction lamination is increased.Compare with existing known techniques, the DSSC of the present invention not only contact area of first electrode base board and the first reaction lamination greatly increases, and photoelectric conversion efficiency also can be promoted accordingly.Again, because the contact area increase of reaction lamination and electrode base board, the panel size size of DSSC of the present invention does not only need to increase again, but even the reduction face board size, thereby increase range of application of the present invention.
In sum, the invention relates to that a kind of DSSC comprises one first electrode base board, a second electrode lay and one first reaction lamination.First electrode base board is to have one first substrate and one first electrode layer, and first substrate has one first convex-concave surface, and first electrode layer is arranged on first convex-concave surface.The second electrode lay is and the first electrode layer subtend setting.The first reaction lamination is to be arranged between first electrode layer and the second electrode lay.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing DSSC has the multinomial effect of enhancement, thereby being suitable for practicality more, and having the extensive value of industry, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is existing known DSSC schematic diagram;
Fig. 2 is the DSSC schematic diagram of first embodiment of the invention;
Fig. 3 A to Fig. 3 D is the substrate surface shape schematic diagram of DSSC of the present invention;
Fig. 4 is the DSSC schematic diagram of second embodiment of the invention; And
Fig. 5 is the DSSC schematic diagram of third embodiment of the invention.
1,2,3,4: DSSC
11,21,31,41: the first electrode base boards
111,211,311: the first substrate 211a, 311a: first convex-concave surface
112,212,312: the first electrode layers 113: metal level
213,313: the first metal layer 12: the reaction lamination
121: dielectric substrate 122: dye coating
123: metal oxide layer 22,32,42: the first reaction laminations
221,321,421: the first dielectric substrates 222,322,422: the first dye coatings
223,323,423: the first metal oxide layers
13,33,43: the second electrode base boards 131,231,331,431: the second electrode lay
132,332,432: the second substrate 332a: second convex-concave surface
44: target substrate 441: the third electrode layer
442: 443: the four electrode layers of Intermediate substrate
444: the second metal levels reaction in 45: the second lamination
452: the second dye coatings of 451: the second dielectric substrates
453: the second metal oxide layer L: light
C1, C2: external circuit
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of DSSC, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
First embodiment
See also shown in Figure 2ly, DSSC 2 comprises one first electrode base board 21, one first a reaction lamination 22 and a second electrode lay 231.
First electrode base board 21 comprises one first substrate 211, one first electrode layer 212 and a first metal layer 213.Wherein, first substrate 211 for example is rigid substrates, flexible base, board, glass substrate or plastic substrate, first substrate 211 that cooperates unlike material, can utilize as Mould Machining, template or the different technology of processing or the like after grinding, on first substrate 211, be processed to form one first convex-concave surface 211a, and the difference in height of recess on the first convex-concave surface 211a and protuberance is more than 10 nanometers.
In addition, see also shown in Fig. 2 and Fig. 3 A to Fig. 3 D, the first convex-concave surface 211a except that can as among Fig. 2 by erose recess and protuberance are constituted at random, the cross sectional shape of recess or protuberance can utilize as semicircle (as shown in Figure 3A), triangle (shown in Fig. 3 B), chevron (shown in Fig. 3 C), rectangle, trapezoidal, polygon and other various geometries, form with single shape repeated combination, or the difformity combination cooperates the recess and the protuberance of periodicity (shown in Fig. 3 D) or no periodic array to constitute.
First electrode layer 212 is to be arranged on the first convex-concave surface 211a, the optional autoxidation indium of the material of first electrode layer 212 tin (indium tin oxide, ITO), indium zinc oxide (indium zinc oxide, IZO) and aluminum zinc oxide (aluminum zinc oxide, AZO) group that is constituted at least one of them.In addition, the material of the first metal layer 213 then is a platinum (Pt), and the first metal layer 23 is arranged on the first reaction lamination 22.Because the present invention's first substrate 211 is provided with the first convex-concave surface 211a, therefore also form a convex-concave surface along first electrode layer 212 of first convex-concave surface 211a setting and the surface of the first metal layer 213, the existing known techniques of surface area of the electrode base board 21 of winning is more increased.
The first reaction lamination 22 has one first dielectric substrate 221, one first dye coating 222 and one first metal oxide layer 223.The three is arranged on the first metal layer 213 in regular turn again.Wherein, the material of first dielectric substrate 221 for example is dissolved in the organic solvent by iodide ion (I--/I3+) and is formed, and is used for absorbing the aitiogenic dyestuff of light in first dye coating 222 and then can utilizes organic material, inorganic material or organic-inorganic composite material.The material of first metal oxide layer 223 then can for example be titanium dioxide (TiO2).231 of the second electrode lays are arranged on first metal oxide layer 223, and it is to utilize the material identical with first electrode layer 212.
Therefore, when light L is incident to DSSC 2, after the valence electron of dye molecule is subjected to optical excitation in first dye coating 222, rise to high energy rank attitude and become free electron, again via first metal oxide layer 223 as conductive layer, and mat the second electrode lay 231 causes external circuit C2 as negative electrode with electronics, is connected to form a complete loops with first electrode base board 21 again.The dye molecule that loses electronics in first dye coating 222 then provides electronics via first dielectric substrate 221, and 221 of first dielectric substrates form a cyclic process by producing the redox reaction electron gains with the first metal layer 213 as anode with this.
And among the present invention, because the contact surface of first electrode base board 21 and first dielectric substrate 221 is a convex-concave surface, therefore, the existing known techniques of both contacts area has significantly to be increased, also can increase by first dielectric substrate 221 by this and produce the efficient of redox reaction, and then promote whole photoelectric conversion efficiency with the first metal layer 213.
Second embodiment
See also shown in Figure 4ly, the DSSC 3 of second embodiment of the invention comprises one first electrode base board 31, one first reaction lamination 32, a second electrode lay 331 and one second substrate 332.Wherein, first electrode base board 31, the first reaction lamination 32 and the second electrode lay 331 are to have identical structure and effect with first electrode base board 21, the first reaction lamination 22 and the second electrode lay 231 of first embodiment, do not repeat them here.And the difference of the present embodiment and first embodiment is: the DSSC 3 of present embodiment has more second substrate 332, and it is arranged on the second electrode lay 331, and the material of second substrate 332 can be identical with first substrate 311.In addition, second substrate 332 also can utilize with first substrate, 311 same way as and form one second convex-concave surface 332a, and the difference in height of the recess of the second convex-concave surface 332a and protuberance is for more than 10 nanometers in the face of the surface of the second electrode lay 331.In addition, the second convex-concave surface 332a can have identical or different concave-convex surface shape styles with the first convex-concave surface 311a according to different demands.
Setting by the second convex-concave surface 332a, produce many different refraction angles after can making light L incident, and then make dye coating 322 receive more uniform incident light, reduce the problem that can't receive incident light because of light L incident angle generation part dye coating 322.Therefore, the whole photoelectric conversion efficiency of the DSSC 3 of present embodiment also can more promote.
The 3rd embodiment
See also shown in Figure 5ly, the DSSC 4 of third embodiment of the invention comprises one first electrode base board 41, one first reaction lamination 42, one second electrode base board 43 (comprising a second electrode lay 431 and one second substrate 432), a target substrate 44 and one second reaction lamination 45.Wherein, target substrate 44 has a third electrode layer 441, Intermediate substrate 442, the 4th electrode layer 443 and second metal level 444, and it is to be arranged in regular turn on first electrode base board 41.The second reaction lamination 45 then has one second dielectric substrate 451, one second dye coating 452 and one second metal oxide layer 453, and it is to be arranged in regular turn on the target substrate 44.Second electrode base board 43 then is arranged on the second reaction lamination 45.Wherein, first electrode base board 41, the first reaction lamination 42, second electrode base board 43 are to have identical structure and material with first electrode base board 31, the first reaction lamination 32, second electrode base board 33 of previous embodiment, do not repeat them here.
The difference of second embodiment of present embodiment and Fig. 4 is: utilize Intermediate substrate 44 and increase by the second reaction lamination 45 to form the iterative structure with plural DSSC.And by the selection of dye coating 422,452 different materials in each the first reaction lamination 42 and the second reaction lamination 45, can make the DSSC 4 of present embodiment can receive the light L of different wave length simultaneously, and generation opto-electronic conversion reaction, increase the utilance of incident ray L, also can promote whole photoelectric conversion efficiency.Present embodiment is to be superimposed as example with two solar cells, so also can superimposed plural solar cell according to the actual product demand.
In sum, because of being to be used in a convex-concave surface is set on first electrode base board, the contact area of first electrode base board and the first reaction lamination is increased according to a kind of DSSC of the present invention.Compare with existing known techniques, DSSC of the present invention not only can be by the contact area that increases by first electrode base board and the first reaction lamination, promote photoelectric conversion efficiency, also can be used on second electrode base board convex-concave surface is set, make incident ray more even, increase the incident light utilization.What is more, can the solar cell of a plurality of analog structures is superimposed, by the selection of different dyes, make each solar cell absorb different wave length light, and produce the opto-electronic conversion reaction, so more can greatly promote photoelectric conversion efficiency of the present invention.Again, because the contact area increase of reaction lamination and electrode base board, the panel size size of DSSC of the present invention does not only need to increase again, but even the reduction face board size, thereby increase range of application of the present invention.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.

Claims (17)

1, a kind of DSSC is characterized in that this solar cell comprises:
One first electrode base board is to have one first substrate and one first electrode layer, and this first substrate has one first convex-concave surface, and this first electrode layer is arranged on this first convex-concave surface;
One the second electrode lay is and this first electrode layer subtend setting; And
One first reaction lamination is to be arranged between this first electrode layer and this second electrode lay.
2, DSSC according to claim 1 is characterized in that the recess of wherein said first convex-concave surface and the difference in height of protuberance are for more than 10 nanometers.
3, DSSC according to claim 1 is characterized in that wherein said first substrate is to be rigid substrates, flexible base, board, glass substrate or plastic substrate.
4, DSSC according to claim 1 is characterized in that wherein said first electrode base board has more a first metal layer, and this first metal layer is to be arranged between this first reaction lamination and this first electrode layer.
5, DSSC according to claim 1 is characterized in that the wherein said first reaction lamination is to have one first dielectric substrate, one first dye coating and one first metal oxide layer.
6, DSSC according to claim 1 is characterized in that it more comprises:
One second substrate, wherein this second electrode lay is to be located between this second substrate and this first reaction lamination.
7, DSSC according to claim 6 is characterized in that wherein said second substrate is to be rigid substrates, flexible base, board, glass substrate or plastic substrate.
8, DSSC according to claim 6 is characterized in that wherein said second substrate is to have one second convex-concave surface, and this second electrode lay is to be arranged on this second convex-concave surface.
9, DSSC according to claim 8 is characterized in that the recess of wherein said second convex-concave surface and the difference in height of protuberance are for more than 10 nanometers.
10, DSSC according to claim 1 is characterized in that it more comprises:
One target substrate, it is to be located between this first reaction lamination and this second electrode lay.
11, DSSC according to claim 10, it is characterized in that wherein said target substrate is to have an Intermediate substrate, a third electrode layer, one the 4th electrode layer and one second metal level, this third electrode layer is to be located between this Intermediate substrate and this first reaction lamination, the 4th electrode layer is to be located between this Intermediate substrate and this second metal level, and this second metal level is in the face of this second electrode lay.
12, DSSC according to claim 11 is characterized in that wherein said Intermediate substrate is to have one the 3rd relative convex-concave surface and one the 4th convex-concave surface, and the 3rd convex-concave surface is in the face of this third electrode layer.
13, DSSC according to claim 12 is characterized in that the recess of wherein said the 3rd convex-concave surface and the difference in height of protuberance are for more than 10 nanometers.
14, DSSC according to claim 12 is characterized in that the recess of wherein said the 4th convex-concave surface and the difference in height of protuberance are for more than 10 nanometers.
15, DSSC according to claim 11 is characterized in that wherein said Intermediate substrate is to be rigid substrates, flexible base, board, glass substrate or plastic substrate.
16, DSSC according to claim 11 is characterized in that it more comprises:
One second reaction lamination, it is to be located between this target substrate and this second electrode lay.
17, DSSC according to claim 16 is characterized in that the wherein said second reaction lamination is to have one second dielectric substrate, one second dye coating and one second metal oxide layer.
CN 200710109406 2007-06-18 2007-06-18 Dye sensitization solar battery Pending CN101330111A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102194573A (en) * 2010-03-04 2011-09-21 卡西欧计算机株式会社 Dye-sensitized solar cell
CN102460822A (en) * 2009-04-30 2012-05-16 株式会社普利司通 Semiconductor electrode, solar cell using semiconductor electrode, and method for producing semiconductor electrode
CN102473748A (en) * 2009-07-01 2012-05-23 三菱电机株式会社 Thin-film solar battery and method for producing the same
CN109950666A (en) * 2019-03-18 2019-06-28 北京科技大学 A kind of deformable lithium-air battery and its assemble method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102460822A (en) * 2009-04-30 2012-05-16 株式会社普利司通 Semiconductor electrode, solar cell using semiconductor electrode, and method for producing semiconductor electrode
CN102473748A (en) * 2009-07-01 2012-05-23 三菱电机株式会社 Thin-film solar battery and method for producing the same
CN102473748B (en) * 2009-07-01 2014-08-20 三菱电机株式会社 Thin-film solar battery and method for producing the same
CN102194573A (en) * 2010-03-04 2011-09-21 卡西欧计算机株式会社 Dye-sensitized solar cell
CN109950666A (en) * 2019-03-18 2019-06-28 北京科技大学 A kind of deformable lithium-air battery and its assemble method

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