CN101329946A

CN101329946A - LAM type chip-shaped solid electrolytic capacitor

Info

Publication number: CN101329946A
Application number: CNA2008100230879A
Authority: CN
Inventors: 邱继皓; 陈明宗; 李铭诚
Original assignee: YUBANG ELECTRONIC (WUXI) CO Ltd
Current assignee: YUBANG ELECTRONIC (WUXI) CO Ltd
Priority date: 2008-07-14
Filing date: 2008-07-14
Publication date: 2008-12-24
Anticipated expiration: 2028-07-14
Also published as: CN101329946B

Abstract

The invention provides a laminated and chip type solid electrolytic capacitor. The performance of the electrolytic capacitor of the invention can no be affected by the layers stacked with each other of the chip type solid electrolytic capacitor and has good stability. The electrolytic capacitor of the invention comprises an overlapped and stacked chip type solid electrolytic capacitor; cathodes of all chip type solid electrolytic capacitors are connected through a conductive paste arranged externally; an insulated separating area is arranged between the cathode and anode of the chip type solid electrolytic capacitor; the lower ends of the cathode and anode are respectively provided with a pair of lead frames broken over externally; the features of the invention lie in that an electrical connection structure which can ensure that the anode end of the chip type solid electrolytic capacitor keeps horizontal is arranged outside the anode and the lead frame of the anode.

Description

A kind of LAM type chip-shaped solid electrolytic capacitor

(1) technical field

The present invention relates to chip-shaped solid electrolytic capacitor, be specially a kind of LAM type chip-shaped solid electrolytic capacitor.

(2) background technology

Common solid electrolytic capacitor as shown in Figure 1, this solid electrolytic capacitor 1, include anode portion 4 and negative pole part 2, the central authorities of negative pole part 2 are porousness aluminum metallic foil 6, and the outside of porousness aluminum metallic foil 6 is aluminum oxide dielectric layer 5, conductive polymer layer 7, carbon paste layer 8, elargol layer 9 in regular turn; Isolate with an insulating barrier 3 between anode portion 4 and the negative pole part 2.In recent years, for the trend in response to existing electronic product high power capacity demand, the LAM type solid electrolytic capacitor is to be developed.This LAM type solid electrolytic capacitor is seen Fig. 2, Fig. 3, be the U.S. 6,421, the disclosed LAM type solid electrolytic capacitor of 227B2 case, this LAM type solid electrolytic capacitor 1 is formed with a plurality of solid electrolytic capacitor 1 mutual storehouses, when most solid electrolytic capacitor 1 mutual storehouses together the time, the negative pole part 2 of each solid electrolytic capacitor 1 is to be connected to each other by silver conductive adhesive 9, and the negative pole part 2 of the bottom also is linked to lead frame 11 with silver conductive adhesive 9.Anode portion 4 ends of each solid electrolytic capacitor 1 then utilize modes such as resistance welded or laser welding to be soldered to lead frame 12.

When the anode portion 4 of laminated mutually a plurality of solid electrolytic capacitors 1 was soldered to lead frame 12 jointly, each anode portion 4 can present the phenomenon (as shown in Figure 4) of bending and distortion when welding with lead frame 12.

In order to reduce the deflection of anode portion 4, though can a majority solid electrolytic capacitor be divided into laminated solid electrolyte capacitor 1a reach laminated solid electrolyte capacitor 1b down as shown in Figure 3; But, anode portion 4 can be delivered on the negative pole part 2 of each solid electrolyte capacitor for distortion or the crooked stress that is caused that is bonded to lead frame 12 and is done, dielectric layer in the target portion 2 damages, make the usefulness variation (be leakage current LC increase) of this solid electrolytic capacitor, and, along with the increase of laminated quantity, the degree of destruction is bigger.

(3) summary of the invention

At the problems referred to above, the invention provides a kind of LAM type chip-shaped solid electrolytic capacitor, the number of plies that its performance can not be subjected to the mutual storehouse of chip-shaped solid electrolytic capacitor influences good stability.

Its technical scheme is such: it comprises the chip-shaped solid electrolytic capacitor of the storehouse that superposes, each chip-shaped solid electrolytic capacitor cathode interconnects by its outside conducting resinl, between the anode bodies of chip-shaped solid electrolytic capacitor and the cathode and be provided with insulating barrier and separate, respectively be provided with the lead frame of an external conducting in the lower end of anode bodies and cathode; It is characterized in that: the electric connection structure that keeps level at the anode tap of the guaranteed described chip-shaped solid electrolytic capacitor of outer setting of described anode bodies and anode conducting frame.

It is further characterized in that: described electric connection structure is silver coating or silver alloy glue coating layer; Described electric connection structure is tin coating layer and ashbury metal cream coating layer; Described silver coating, silver alloy glue coating layer, tin coating layer or ashbury metal cream coating layer directly are coated on the outside of the anode tap and the anode conducting frame of chip-shaped solid electrolytic capacitor; The anode tap of described chip-shaped solid electrolytic capacitor is provided with porose; Described coating layer infiltrates described hole when being coated on described anode tap; Described hole is circular port, square opening.

In the said structure of the present invention, conductive coating has been realized being connected of each chip capacitor anode tap and positive wire frame, when coating with each anode tap horizontal positioned, can guarantee being electrically connected between each anode tap and the leading truck like this, the bending of having avoided each anode tap is arranged simultaneously, when integral body during, can avoid the destruction that causes the cathode oxidation film layer because of the transmission of stress, the stability and the useful life of having guaranteed each capacitor with resin-encapsulated.

(4) description of drawings

The section diagrammatic sketch of Fig. 1 LAM type solid state electrolysis electricity capacitor;

Fig. 2, Fig. 3, Fig. 4 are respectively the section diagrammatic sketch of existing LAM type solid state electrolysis electricity capacitor;

Fig. 5, Fig. 6, Fig. 7 are respectively the structural representation of various embodiments of the present invention.

(5) execution mode

See Fig. 5, the present invention includes the chip-shaped solid

electrolytic capacitor

2,3,4 of stack storehouse, chip-shaped solid

electrolytic capacitor

2,3,4 cathodes 5 interconnect by its outside conducting resinl 6, between the anode bodies 7 of chip-shaped solid electrolytic capacitor and the cathode 5 and be provided with insulating barrier 8 and separate, respectively be provided with the

lead frame

9,10 of an external conducting in the lower end of anode bodies 7 and cathode 5; The electric connection structure that keeps level at the anode tap of the guaranteed chip-shaped solid electrolytic capacitor of outer setting of anode bodies 7 and anode conducting frame 9.Electric connection structure is the electric conductor of solid, shaped or inserts therebetween and then the conducting resinl of sclerosis; See Fig. 6, electric connection structure is silver coating, silver alloy glue coating layer, tin coating layer and ashbury metal cream coating layer; Utilize elargol 11 that each anode tap 7 of chip-shaped solid

electrolytic capacitor

2,3,4 is coated during enforcement and horizontal zone every; Also can utilize the mode of impregnation (Dipping) that the anode tap 7 of most chip-shaped solid

electrolytic capacitors

2,3,4 has been covered after the elargol, utilize fetching device (pick ﹠amp again; Place) carry out cohering on the importing point friendship machine with the conducting resinl of lead frame.Also can be before existing processing procedure welds, utilize point gum machine to go up tin or its alloy of tin in anode place's point, because about 170 ~ 250 ℃ of the molten point of tin or its alloy of tin, use lower bonding power stress can be reduced, can lower the destruction of high heat to equivalent series resistance (ESR) thus, the setting of its alloy gluing layer of tin or tin is equivalent to electric connection structure, can reduce the destruction of leakage current LC, also help the welding of anode, avoid the generation of dry joint.Because the space of anode is very little, cause leakage current to rise or short circuit for fear of in the process of a glue and welding, striding across negative electrode, also can take the notion of general multi-layer sheet perforation (through-hole), shown in the 7th figure, the anode tap of chip-shaped solid electrolytic capacitor is provided with porose; When being coated on anode tap, coating layer infiltrates described hole; Directly put to the perforation 12 of anode during point glue, and owing to take the mode of perforation (through-hole), conductive surface is long-pending can to heighten, and will help to reduce the effect of equivalent series resistance (ESR).And the perforation 12 of being located at anode portion is square opening, circular port, diamond hole or other shape hole, and hole count then must be a hole, two holes or most individual.

Claims

1, a kind of LAM type chip-shaped solid electrolytic capacitor, it comprises the chip-shaped solid electrolytic capacitor of the storehouse that superposes, each chip-shaped solid electrolytic capacitor cathode interconnects by its outside conducting resinl, between the anode bodies of chip-shaped solid electrolytic capacitor and the cathode and be provided with insulating barrier and separate, respectively be provided with the lead frame of an external conducting in the lower end of anode bodies and cathode; It is characterized in that: the electric connection structure that keeps level at the anode tap of the guaranteed described chip-shaped solid electrolytic capacitor of outer setting of described anode bodies and anode conducting frame.

2, according to the described a kind of LAM type chip-shaped solid electrolytic capacitor of claim 1, it is characterized in that: described electric connection structure is silver coating or silver alloy glue coating layer.

3, according to the described a kind of LAM type chip-shaped solid electrolytic capacitor of claim 2, it is characterized in that: described electric connection structure is tin coating layer and ashbury metal cream coating layer.

4, according to the described a kind of LAM type chip-shaped solid electrolytic capacitor of claim 3, it is characterized in that: described silver coating, silver alloy glue coating layer, tin coating layer or ashbury metal cream coating layer directly are coated on the outside of the anode tap and the anode conducting frame of chip-shaped solid electrolytic capacitor.

5, according to the described a kind of LAM type chip-shaped solid electrolytic capacitor of claim 4, it is characterized in that: the anode tap of described chip-shaped solid electrolytic capacitor is provided with porose.

6, according to the described a kind of LAM type chip-shaped solid electrolytic capacitor of claim 5, it is characterized in that: described coating layer infiltrates described hole when being coated on described anode tap.

7, according to the described a kind of LAM type chip-shaped solid electrolytic capacitor of claim 6, it is characterized in that: described hole is a circular port.

8, according to the described a kind of LAM type chip-shaped solid electrolytic capacitor of claim 6, it is characterized in that: described hole is a square opening.