CN101327574A - Grinding head for chemical mechanical polishing and method for producing the same - Google Patents
Grinding head for chemical mechanical polishing and method for producing the same Download PDFInfo
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- CN101327574A CN101327574A CNA2007101101828A CN200710110182A CN101327574A CN 101327574 A CN101327574 A CN 101327574A CN A2007101101828 A CNA2007101101828 A CN A2007101101828A CN 200710110182 A CN200710110182 A CN 200710110182A CN 101327574 A CN101327574 A CN 101327574A
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Abstract
The present invention relates to a chemical mechanical polishing grinding head, which comprises a film-supporting base and a film. The film-supporting base is shaped like a disk, which has a circle center and a radius (R). The film-supporting base is provided with at least one venthole positioned within a central area no more than (2/3) R from the circle center and at least one flow-guiding opening positioned within a peripheral area (2/3) R to R from the circle center. The film comprises a main disk-shaped body arranged on the first surface of the film-supporting base and an annular wrapping part wrapping the annular lateral wall of the film-supporting base.
Description
Technical field
The present invention relates to grinding head of a kind of chemically mechanical polishing and preparation method thereof, relate in particular to the grinding head and preparation method thereof that a kind of surrounding zone at the film support seat is provided with the chemically mechanical polishing of water conservancy diversion opening.
Background technology
(chemical mechanical polishing is to be used for the surface of integrated circuit of planarization semiconductor wafer CMP), makes and can make the multi-layer conductor leads line on the surface of planarization, and form highdensity circuit connection in chemically mechanical polishing.Generally speaking, chemically mechanical polishing mainly be used in the lead interlayer dielectric layer (inter-layer dielectric, ILD), attachment plug (plug), shallow isolating trough (shallowtrench isolation, STI) with the making of mosaic texture on.
Please refer to Fig. 1.Fig. 1 is the schematic diagram of a known chemical-mechanical polishing mathing platform.As shown in Figure 1, the chemical-mechanical polishing mathing platform include a rotatable platform (platen) 10, a grinding pad (polish pad) 12 be attached at rotatable platform 10 the surface and can with rotatable platform 10 do rotation synchronously, a ground slurry supply (slurry supply) 14 in order to supply ground slurry 16 to grinding pad 12, and a grinding head (head) 20 is in order to fix a wafer 18.
When carrying out chemically mechanical polishing, wafer 18 is to be placed between grinding head 20 and the grinding pad 12, rotate the effect that produces mechanical lapping between wafer 18 and the grinding pad 12 that makes and grinding head 20 meetings be exerted pressure to wafer 18 and drive wafer 18, and simultaneously ground slurry 16 also can be desired the effect of the material layer generation chemical action generation chemical grinding of planarization with institute on the wafer 18, carries out chemically mechanical polishing thus.
Please continue with reference to figure 2, and please in the lump with reference to figure 1.Fig. 2 is the schematic diagram of the grinding head 20 of known chemical machine glazed finish.As shown in Figure 2, the grinding head 20 of known chemical machine glazed finish includes that a film (membrane) 22 is positioned on the wafer 18, a film support seat (membrane support) 24, one supporting pad 26 is located between film 22 and the film support seat 24, and one restrains the periphery that ring (retaining ring) 28 is surrounded on film 22, supporting pad 26, film support seat 24 and wafer 18.Film support seat 24 is provided with a plurality of passages 30 and also has corresponding hole 32 on the supporting pad 26, passes through to allow gas.
Please refer to Fig. 3.Fig. 3 is the schematic diagram of grinding head 20 when carrying out chemically mechanical polishing of known chemical machine glazed finish.As shown in Figure 3, when carrying out chemically mechanical polishing, gas is injected in the grinding heads 20 via the passage 30 of film support seat 24 and the hole 32 of supporting pad 26, the film 22 that be made of elastomeric material this moment can be subjected to the pressure of gas and push and extension downwards, and the wafer 18 that is positioned under it is exerted pressure.
For chemically mechanical polishing, the uniformity of the material layer reliability that the yield of subsequent technique and desire are made element that concerns, and wherein in the process of chemically mechanical polishing grinding head 20 can apply the important key of balanced pressure to wafer 18 for the decision uniformity.
On the structural design of known grinding head 20, because the position of the passage 30 of film support seat 24 is the central areas that are arranged at film support seat 24, and be not provided with any opening in its surrounding zone, therefore the collision frequency of the specific region of gas molecule in the surrounding zone of film 22 of injection grinding head 20 is regional for high, so can produce bigger pressure (as the regional A that Fig. 3 indicated) than other when carrying out chemically mechanical polishing.In case the situation of above-mentioned pressure inequality produces, can make the grinding rate skewness of chemically mechanical polishing, and cause the uniformity not good.
Please refer to Fig. 4.Fig. 4 has shown the thickness distribution figure that a material layer is measured on the grinding head planarization wafer that utilizes known chemical machine glazed finish, wherein be that to be positioned at thickness on 8 cun wafers with one be that the oxide layer of 11000 dusts is an object in this test, carry out the thickness distribution situation that is obtained after 60 seconds the chemically mechanical polishing.As shown in Figure 4, after the experience chemically mechanical polishing, thickness of oxide layer roughly is reduced to the 7300 Izod right sides by 11000 dusts in the central area on wafer, show that chemically mechanical polishing has good uniformity at central area, but thickness of oxide layer approaches (about the zone of 8 cun wafers apart from circle centre position 70-95 millimeter) significantly in the surrounding zone of wafer, the grinding rate that is presented at the surrounding zone is very fast herein, the phenomenon of this overmastication is commonly referred to as fast band effect, is problem common in the chemically mechanical polishing.
Because fast band effect can make that the uniformity of surrounding zone of wafer is not good, and influence the reliability of the yield and the follow-up making element of chemically mechanical polishing, therefore how avoiding the generation of fast band effect, is an important topic in the flatening process with the yield that promotes chemically mechanical polishing.
Summary of the invention
One of purpose of the present invention is to provide a kind of grinding head of chemically mechanical polishing, to promote the uniformity of chemically mechanical polishing.
For reaching above-mentioned purpose, the invention provides a kind of grinding head of chemically mechanical polishing, include a film support seat and a film.The film support seat is a video disc shape, and it has a first surface, the ring-side wall of a second surface and between this first surface and this second surface, and has at least one passage and at least one water conservancy diversion opening in addition.Above-mentioned film support seat has a center of circle and a radius R, and the film support seat include a central area be positioned at distance of center circle from (2/3) R with the zone, and one the surrounding zone be positioned at the zone of (2/3) R to R apart from the center of circle, and passage is to be positioned at central area, and the water conservancy diversion opening is to be positioned within the surrounding zone.
Because the grinding head of chemically mechanical polishing of the present invention has the design of water conservancy diversion opening, the gas pressure that injects grinding head is evenly distributed, and then promote the uniformity of chemically mechanical polishing.
In order to make those skilled in the art a nearlyer step understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing.Yet accompanying drawing is only for reference and aid illustration usefulness, is not to be used for the present invention is limited.
Description of drawings
Fig. 1 is the schematic diagram of a known chemical-mechanical polishing mathing platform.
Fig. 2 is the schematic diagram of the grinding head 20 of known chemical machine glazed finish.
Fig. 3 is the schematic diagram of grinding head when carrying out chemically mechanical polishing of known chemical machine glazed finish.
Fig. 4 has shown the thickness distribution figure that a material layer is measured on the grinding head planarization wafer that utilizes known chemical machine glazed finish.
Fig. 5 and Fig. 6 are the schematic diagram of the grinding head of one embodiment of the invention chemically mechanical polishing.
Fig. 7 is the schematic diagram of grinding head when carrying out chemically mechanical polishing of present embodiment.
Fig. 8 to Figure 14 has shown the schematic diagram of other embodiment of grinding head of the present invention.
Figure 15 and Figure 16 are the schematic diagrames of the grinding head of another embodiment of the present invention chemically mechanical polishing.
Figure 17 is the schematic diagram of the grinding head of further embodiment of this invention chemically mechanical polishing.
Figure 18 is the schematic diagram of another embodiment of cmp head of the present invention.
Figure 19 has shown another sample attitude of the grinding head of Figure 18.
Figure 20 has shown and utilizes grinding head of the present invention to carry out the thickness distribution figure that a material layer is measured on the wafer after the chemically mechanical polishing.
The main element symbol description
10 rotatable platforms, 12 grinding pads
14 ground slurry supplies, 16 ground slurries
18 wafers, 20 grinding heads
22 films, 24 film support seats
26 supporting pads 28 are restrained ring
30 passages, 32 holes
50 film support seat 50a first surfaces
50b second surface 50c ring-side wall
52 central areas, 54 surrounding zones
56 buckling grooves, 58 passages
60 water conservancy diversion openings, 62 screw holes
70 films, 72 video disc shape main parts
74 ring-type coating portions 76 fasten flange
80 supporting pads, 82 holes
90 film support seat 90a first surfaces
90b second surface 92 supports dish
94 supporting side walls 94a, first support component
The 94b second support component 94c the 3rd support component
94d the 4th support component 96 passages
98 water conservancy diversion openings, 100 screw holes
110 films, 112 video disc shape main parts
114 ring-type coating portions, 116 buckling parts
120 supporting pads, 122 holes
The specific embodiment
Please refer to Fig. 5 and Fig. 6.Fig. 5 and Fig. 6 are the schematic diagram of the grinding head of one embodiment of the invention chemically mechanical polishing, and wherein Fig. 5 is a top view, and Fig. 6 is a generalized section.As Fig. 5 and shown in Figure 6, the grinding head of the chemically mechanical polishing of this enforcement mainly includes a film support seat 50, a film 70 and is located at the supporting pad 80 that is used for compensator or trimmer pressure between film support seat 50 and the film 70.Film support seat 50 is one by being essentially video disc shape (disk-shaped) structure that rigid material constitutes, and it has a first surface 50a, a second surface 50b and the one ring-side wall 50c between first surface 50a and second surface 50b.Film support seat 50 also has a center of circle O and a radius R, and wherein center of circle O is defined as central area 52 with the border circular areas of (2/3) R, and the annular region of (2/3) R to R is defined as surrounding zone 54.The second surface 50b of film support seat 50 has a buckling groove 56, allows the fastening of film 70.Film support seat 50 has at least one passage 58, at least one water conservancy diversion opening (diversionopening) 60 and a plurality of screw holes 62 in addition, supporting pad 80 then has corresponding to passage 58 hole 82 with water conservancy diversion opening 60, wherein passage 58 be positioned within the central area 52, water conservancy diversion opening 60 is to be positioned within the surrounding zone 54 with screw hole 62.Passage 58 is to use so that the gas of injection grinding head passes through, when carrying out chemically mechanical polishing, to strut film 70, the effect of water conservancy diversion opening 60 be change gas molecule in the surrounding zone 54 collision mode, the collision frequency of avoiding gas molecule and surrounding zone 54 is too high and produce fast band effect, screw hole 62 then be with so that screw (figure does not show) other member of grinding head can be combined with film support seat 50.
On the other hand, film 70 is to be made of elastomeric material, it includes a dishful of sheet-shaped main body portion 72, be arranged at the first surface 50a of film support seat 50, the ring-side wall 50c that a ring-type coating portion 74 coats film support seat 50, and one fasten flange 76, be located at the second surface 50b of film support seat 50 and be embedded within the buckling groove 56, thus film 70 unlikely coming off when carrying out chemically mechanical polishing.
Please refer to Fig. 7.Fig. 7 is the schematic diagram of grinding head when carrying out chemically mechanical polishing of present embodiment.As shown in Figure 7, gas can pour into passage 58 and water conservancy diversion opening 60, and gas molecule can make flexible film 70 expansions of tool to push wafer (figure does not show), and can form a space this moment between film support seat 50 and film 70.Because the film support seat 50 of present embodiment 54 is provided with water conservancy diversion opening 60 in the surrounding zone, therefore the gas flow path can change to some extent, make gas molecule 54 can not concentrate collision area A in the surrounding zone, and the collision that the portion gas molecule is arranged is passed to area B, and the pressure that is subjected to when carrying out chemically mechanical polishing of film 70 will be than can be evenly thus.Because the pressure that film 70 is subjected to is more even, makes the uniformity of wafer also can promote to some extent.
In the present embodiment, 54 thickness is thickness greater than central area 52 to film support seat 50 in the surrounding zone, and the annular region apart from center of circle O (4/3) R to R serves as preferred in the surrounding zone 54 to be located in the position of water conservancy diversion opening 60, but is not limited thereto.In addition, the water conservancy diversion opening 60 of present embodiment is a circular open, and runs through film support seat 50 with the direction of vertical first surface 50a, but its shape, size, position, arranging density is set and runs through parameters such as direction and can be changed according to actual state.
Please continue with reference to figure 8 to Figure 14.Fig. 8 to Figure 14 has shown the schematic diagram of other embodiment of grinding head of the present invention.Wherein for ease of comparing the similarities and differences of each embodiment, the similar elements of the following example and the foregoing description is used components identical symbol mark, and only describes at different place, and no longer same section is given unnecessary details.
Fig. 8 and Fig. 9 have shown that the shape of water conservancy diversion opening 60 also can be slit-shaped openings or polygonal-shaped openings such as hexagonal apertures, and the shape of water conservancy diversion opening 60 still visual effect be other Any shape, do not limited by the various embodiments described above.
Figure 10 has shown that direction that water conservancy diversion opening 60 runs through film support seat 50 is not limited to the direction into vertical first surface 50a, runs through direction and also can be with first surface 50a tilts, as outward-dipping or intilted direction.
Figure 11 and Figure 12 have shown that water conservancy diversion opening 60 is not defined as the enclosed shape opening, also can be the breach (notch) of the surrounding zone 54 that is formed at film support seat 50, and the shape of breach can be different shape such as triangle or quadrangle, makes film support seat 50 have as jagged circumference.
Embodiment and Figure 12 of Figure 13 are similar, and its difference is that the water conservancy diversion opening 60 of Figure 13 is long breach, and the degree of depth of each breach has reached the intersection of central area 52 and surrounding zone 54.
Figure 14 has shown that the shaped design of water conservancy diversion opening 60 also is not limited to use identical patterns, uses different design and can mix.
Please refer to Figure 15 and Figure 16.Figure 15 and Figure 16 are the schematic diagrames for the grinding head of another embodiment of the present invention chemically mechanical polishing, and wherein Figure 15 is a top view, and Figure 16 is a generalized section.Be that with the previous embodiment difference grinding head of present embodiment is not provided with the water conservancy diversion opening, but between the ring-type coating portion 74 of the ring-side wall 50c of film support seat 50 and film 70, form a gap, ring-side wall 50c and ring-type coating portion 74 are not contacted with each other.Thus, ring-side wall 50c and ring-type coating portion 74 can form a diversion space 84, and it also can be brought into play guide functions and change the collision mode of gas molecule.
Above-mentioned two main embodiment are to utilize the mode of water conservancy diversion opening and diversion space to change the travel path of gas molecule respectively, and the two is not limited to independent utility and can use simultaneously according to circumstances.Please refer to Figure 17, Figure 17 is the schematic diagram of the grinding head of further embodiment of this invention chemically mechanical polishing.As shown in figure 17, the grinding head of present embodiment has been used the design of water conservancy diversion opening 60 with diversion space 84 simultaneously.
Please refer to Figure 18.Figure 18 is the schematic diagram of another embodiment of chemically mechanical polishing head of the present invention.As shown in figure 18, grinding head includes a film support seat 90, the supporting pad 120 of a film 110 and between film support seat 90 and film 110.Film support seat 90 includes one and supports dish (support disk) 92, and it has a first surface 90a and a second surface 90b, and a supporting side walls (support wall) 94, around the periphery of supporting dish 92.The section of supporting side walls 94 is L types, it includes one first support component 94a, and to be linked to the second surface 92b that supports dish 92 peripheral and vertical in essence with second surface 92b, and one second support component 94b be linked to the first support component 94a, and the second support component 94b is that direction is extended and be parallel in essence with the second surface 92b that supports dish 92 to the inside.Support dish 92 has at least one passage 96 in addition and runs through support dish 92 with at least one water conservancy diversion opening 98, and water conservancy diversion opening 98 is to be positioned at the position of supporting the second support component 94b of corresponding supporting side walls 94 on the dish 92.The second support component 94b of supporting side walls 94 includes a plurality of screw holes 100 in addition, and supporting pad 120 also includes the hole 122 of corresponding passage 96 and water conservancy diversion opening 98.
The grinding head of present embodiment is provided with water conservancy diversion opening 98 in the position of supporting the second support component 94b of corresponding supporting side walls 94 on the dish 92, therefore gas pressure is evenly distributed, to promote the uniformity of chemically mechanical polishing.What deserves to be explained is water conservancy diversion opening 98 shape, size, position, arranging density are set and run through parameter such as direction that also embodiment is described as described above does necessary variation, to reach the uniformity of preferredization.
Please refer to Figure 19.Figure 19 has shown another sample attitude of the grinding head of Figure 18.As shown in figure 19, be in different with the grinding head of Figure 18 includes one the 3rd support component 94c in addition in the supporting side walls 94 of Figure 19 and is linked on the second support component 94b, and one the 4th support component 94d is linked on the 3rd support component 94c.The 3rd support component 94c is vertical in essence with the second support component 94b, and the 4th support component 94d is that direction is extended and be vertical with the 3rd support component 94c in essence laterally.In addition, the position of screw hole 100 then is to be located on the 4th support component 94d of supporting side walls 94, but not on the second support component 94b.
The present invention also provides a kind of method of making the grinding head of chemically mechanical polishing.Refer again to Fig. 5 and Fig. 6.As Fig. 5 and shown in Figure 6, one film support seat 50 is provided, wherein film support seat 50 is a video disc shape, and it has a center of circle O and a radius R, and film support seat 50 includes a central area 52 and is positioned at center of circle O and the zone of (2/3) R apart from the center of circle, and a periphery 54 districts are positioned at apart from the zone of (2/3) R to R of center of circle O.Then in the central area 52 of film support seat 50, form at least one passage 58, and in surrounding zone 54, form at least one water conservancy diversion opening 60.Go up in the first surface 50a of film support seat 50 more subsequently and attach a supporting pad 80, again film 70 is combined with film support seat 50, and make the grinding head that further combination can be produced chemically mechanical polishing with other necessary element.
Please refer to Figure 20.Figure 20 has shown and utilizes grinding head of the present invention to carry out the thickness distribution figure that a material layer is measured on the wafer after the chemically mechanical polishing.This test is that to be positioned at thickness on 8 cun wafers with one be that the oxide layer of 11000 dusts is an object, utilizes five kinds of different grinding head designs to carry out the thickness distribution situation that is obtained after 60 seconds the chemically mechanical polishing respectively, and wherein five kinds of grinding heads include:
Reference data: known grinding head;
First kind of grinding head: the diversion space that tool is 1 millimeter;
Second kind of grinding head: have the water conservancy diversion opening in the edge of central area, the diameter of water conservancy diversion opening is 3 millimeters;
The third grinding head: have the water conservancy diversion opening in the surrounding zone, the diameter of water conservancy diversion opening is 6 millimeters;
The 4th kind of grinding head: diversion space with 3 millimeters.
As shown in figure 20, compare with the reference data of using known grinding head, comprise that first kind of grinding head, the third grinding head and the 4th kind of grinding head all can effectively promote the thickness evenness of oxide layer after the experience chemically mechanical polishing in the surrounding zone of wafer, shown that grinding head of the present invention can improve the fastband effect really, and promoted the uniformity of chemically mechanical polishing.Test structure has also shown and the water conservancy diversion opening has been located at central area but not second kind of grinding head in the surrounding zone can't promote the uniformity of chemically mechanical polishing on the other hand.
In sum, the grinding head of chemically mechanical polishing of the present invention utilizes the design of water conservancy diversion opening or diversion space, can effectively promote the uniformity of chemically mechanical polishing.What deserves to be explained is that grinding head of the present invention is not limited to be applied in the chemically mechanical polishing of specified material layer or ad hoc structure, and can be widely used in the making of making lead interlayer dielectric layer, attachment plug, shallow isolating trough, mosaic texture or other structure.
The above only is the preferred embodiments of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (42)
1. the grinding head of a chemically mechanical polishing includes:
The film support seat, this film support seat is roughly video disc shape, it has first surface, second surface and the ring-side wall between this first surface and this second surface, and this film support seat has at least one passage and at least one water conservancy diversion opening in addition, wherein this film support seat has the center of circle and radius R, and this film support seat include central area be positioned at this distance of center circle from (2/3) R with border circular areas, and the surrounding zone is positioned at the annular region of (2/3) R to R apart from this center of circle, and this passage is to be positioned at this central area, and this water conservancy diversion opening is to be positioned within this surrounding zone; And
Film is supported by this film support seat.
2. grinding head as claimed in claim 1, wherein this water conservancy diversion opening comprises circular open.
3. grinding head as claimed in claim 1, wherein this water conservancy diversion opening comprises polygonal-shaped openings.
4. grinding head as claimed in claim 1, wherein this water conservancy diversion opening comprises slit-shaped openings.
5. grinding head as claimed in claim 1, wherein this water conservancy diversion opening comprises the breach at this edge, surrounding zone of this film support seat.
6. grinding head as claimed in claim 1, wherein this water conservancy diversion opening is to run through this film support seat.
7. grinding head as claimed in claim 6, wherein this water conservancy diversion opening direction of running through this film support seat is vertical with this first surface.
8. grinding head as claimed in claim 6, wherein this water conservancy diversion opening direction of running through this film support seat is and this first surface tilts.
9. grinding head as claimed in claim 1, wherein this water conservancy diversion opening is the annular region that further is positioned at (3/4) R to R apart from this center of circle.
10. grinding head as claimed in claim 1, other has a plurality of water conservancy diversion openings and is positioned within this surrounding zone, and those water conservancy diversion openings have different shapes.
11. grinding head as claimed in claim 1, other has a plurality of screw holes and is positioned within this surrounding zone.
12. grinding head as claimed in claim 1, other includes supporting pad between this film support seat and this film, and this supporting pad has a plurality of holes corresponding to this passage and this water conservancy diversion opening.
13. grinding head as claimed in claim 1, wherein this film support seat in the thickness of this surrounding zone greater than its thickness in this central area.
14. grinding head as claimed in claim 1, wherein this second surface has buckling groove in addition, and this film includes:
Video disc shape main part is arranged at this first surface of this film support seat;
Ring-type coating portion coats this ring-side wall of this film support seat; And
Fastening flange is embedded within this buckling groove.
15. grinding head as claimed in claim 14 wherein is formed with the gap between this ring-side wall of this film coating portion of this film and this film support seat, makes this film coating portion not contact with this ring-side wall.
16. the grinding head of a chemically mechanical polishing includes:
The film support seat, in order to support film, this film support seat is roughly video disc shape, it has first surface, second surface and the ring-side wall between this first surface and this second surface, and this film support seat has at least one passage in addition, at least one water conservancy diversion opening and a plurality of screw hole, wherein this film support seat includes central area, and the surrounding zone is around this central area, this passage is to be positioned at this central area, and this water conservancy diversion opening and those screw holes are to be positioned within this surrounding zone, and this film support seat in the thickness of this surrounding zone greater than its thickness in this central area.
17. grinding head as claimed in claim 16, wherein this water conservancy diversion opening comprises circular open.
18. grinding head as claimed in claim 16, wherein this water conservancy diversion opening comprises polygonal-shaped openings.
19. grinding head as claimed in claim 16, wherein this water conservancy diversion opening comprises slit-shaped openings.
20. grinding head as claimed in claim 16, wherein this water conservancy diversion opening comprises the breach at this edge, surrounding zone of this film support seat.
21. grinding head as claimed in claim 16, wherein this water conservancy diversion opening is to run through this film support seat.
22. grinding head as claimed in claim 21, wherein this water conservancy diversion opening direction of running through this film support seat is vertical with this first surface.
23. grinding head as claimed in claim 21, wherein this water conservancy diversion opening direction of running through this film support seat is and this first surface tilts.
24. grinding head as claimed in claim 16, other has a plurality of water conservancy diversion openings and is positioned within this surrounding zone, and those water conservancy diversion openings have different shapes.
25. grinding head as claimed in claim 16, other includes film, and this film includes:
Video disc shape main part is arranged at this first surface of this film support seat;
Ring-type coating portion coats this ring-side wall of this film support seat; And
Fasten flange;
Wherein this second surface of this film support seat has buckling groove in addition, and is chimeric for this fastening flange thus.
26. grinding head as claimed in claim 25, other includes supporting pad between this film support seat and this film, and this supporting pad has a plurality of holes corresponding to this passage and this water conservancy diversion opening.
27. grinding head as claimed in claim 25 wherein is formed with the gap between this ring-side wall of this film coating portion of this film and this film support seat, makes this film coating portion not contact with this ring-side wall.
28. the grinding head of a chemically mechanical polishing includes:
The film support seat, this film support seat includes:
Support dish, it has first surface and second surface; And
Supporting side walls, support the periphery of dish around this, the section of this supporting side walls is the L type, it includes this second surface periphery and vertical in essence with this second surface that first support component is linked to this support dish, and second support component be linked to this first support component, this second support component is that direction is extended and be parallel in essence with this second surface of this support dish to the inside, wherein this support dish has at least one passage and at least one water conservancy diversion opening runs through this support dish in addition, and this water conservancy diversion opening is the position that is positioned on this support dish this second support component that should supporting side walls; And
Film is supported by this film support seat.
29. grinding head as claimed in claim 28, wherein this water conservancy diversion opening comprises circular open.
30. grinding head as claimed in claim 28, wherein this water conservancy diversion opening comprises polygonal-shaped openings.
31. grinding head as claimed in claim 28, wherein this water conservancy diversion opening comprises slit-shaped openings.
32. grinding head as claimed in claim 28, wherein this water conservancy diversion opening direction of running through this support dish is vertical with this first surface.
33. grinding head as claimed in claim 28, wherein this water conservancy diversion opening direction of running through this support dish is and this first surface tilts.
34. grinding head as claimed in claim 28, wherein this support dish has the position of a plurality of water conservancy diversion openings to this second support component that should supporting side walls in addition, and those water conservancy diversion openings have different shapes.
35. grinding head as claimed in claim 28, other has a plurality of screw holes and is positioned on this second support component of this supporting side walls.
36. grinding head as claimed in claim 28, wherein this supporting side walls includes in addition that the 3rd support component is linked on this second support component and is vertical in essence with this second support component, and the 4th support component be linked on the 3rd support component, the 4th support component is that direction is extended and be vertical with the 3rd support component in essence laterally.
37. grinding head as claimed in claim 36, other has a plurality of screw holes and is positioned on the 4th support component of this supporting side walls.
38. grinding head as claimed in claim 28, wherein this film includes:
Video disc shape main part is arranged at this first surface of this support dish;
Ring-type coating portion coats this first support component of this supporting side walls; And
Buckling parts is fastened on this supporting side walls.
39. grinding head as claimed in claim 28, other includes supporting pad between this support dish and this film, and this supporting pad has a plurality of holes corresponding to this passage and this water conservancy diversion opening.
40. the grinding head of a chemically mechanical polishing includes:
The film support seat, this film support seat is roughly video disc shape, and it has first surface, second surface and the ring-side wall between this first surface and this second surface; And
Film, this film includes:
Video disc shape main part is arranged at this first surface of this film support seat; And
Ring-type coating portion coats this ring-side wall of this film support seat;
Wherein be formed with the gap between this ring-side wall of this film coating portion of this film and this film support seat, make this film coating portion not contact with this ring-side wall.
41. grinding head as claimed in claim 40, wherein this second surface has buckling groove in addition, and this film includes in addition and fastens flange and be embedded within this buckling groove.
42. a method of making the grinding head of chemically mechanical polishing includes:
The film support seat is provided, wherein this film support seat is roughly video disc shape, and it has the center of circle and radius R, and this film support seat include central area be positioned at apart from the border circular areas of this center of circle (2/3) R, and the surrounding zone is positioned at the annular region of (2/3) R to R apart from this center of circle; And
In this central area of this film support seat, form at least one passage, and in this surrounding zone, form at least one water conservancy diversion opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101101828A CN101327574A (en) | 2007-06-18 | 2007-06-18 | Grinding head for chemical mechanical polishing and method for producing the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101101828A CN101327574A (en) | 2007-06-18 | 2007-06-18 | Grinding head for chemical mechanical polishing and method for producing the same |
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|---|---|
| CN101327574A true CN101327574A (en) | 2008-12-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2007101101828A Pending CN101327574A (en) | 2007-06-18 | 2007-06-18 | Grinding head for chemical mechanical polishing and method for producing the same |
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| CN (1) | CN101327574A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106903563A (en) * | 2017-04-10 | 2017-06-30 | 遵义顺峰汽车零部件制造有限公司 | For the sanding apparatus of automobile sleeve lining |
-
2007
- 2007-06-18 CN CNA2007101101828A patent/CN101327574A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106903563A (en) * | 2017-04-10 | 2017-06-30 | 遵义顺峰汽车零部件制造有限公司 | For the sanding apparatus of automobile sleeve lining |
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