CN101312115B - Thin film pattern layer preparation method - Google Patents
Thin film pattern layer preparation method Download PDFInfo
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- CN101312115B CN101312115B CN2007101079896A CN200710107989A CN101312115B CN 101312115 B CN101312115 B CN 101312115B CN 2007101079896 A CN2007101079896 A CN 2007101079896A CN 200710107989 A CN200710107989 A CN 200710107989A CN 101312115 B CN101312115 B CN 101312115B
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Abstract
A fabrication method for film pattern includes providing a substrate, a first nozzle and a second nozzle. The substrate is equipped with a plurality of baffle walls, a plurality of containing spaces which are limited among the baffle walls and the substrate, each containing space is provided with a first side edge and a second side edge which are parallel, and the distance between the first side edge and the second side edge is b. The first nozzle moves along with a first route which is arranged between a first side edge and a second side edge of a containing space to be treated and parallel to the first side edge with a distance a, the first nozzle sprays ink to the containing space. The second nozzle moves along with a second route which is parallel to the first route, the distance between the first route and the second route meets one of the two relational expressions of 0<c<b-a and 0<c<a, and the second nozzle sprays ink to the containing space. A film pattern layer can be formed by drying and solidifying the ink in the containing spaces.
Description
Technical field
The present invention relates to a kind of manufacturing method of film pattern layer.
Background technology
At present, ink-jet method in making patterned layer on substrate more and more widely.In ink-jet method, use ink discharge device ink-jet on the glass substrate that forms barricade, dry ink forms patterned layer on substrate.
Seeing also Figure 14 and Figure 15, is the schematic diagram of a substrate 120.Have a plurality of barricades 122 on the substrate 120, described a plurality of barricades 122 limit a plurality of receiving spaces 124 with described substrate 120.Each row receiving space 124 is arranged along X-axis, and each row receiving space 124 is arranged along Y-axis, is spaced apart d between every adjacent two row receiving spaces 124.
See also Figure 16, adjacent nozzle 902 and 904 spacing are d in the ink gun 900.In the prior art, after 312 ink-jets of first route, ink gun 900 is along Y-axis negative direction displacement d at nozzle 902, thereby nozzle 904 is along the opposite direction ink-jet of first route 312.
Yet during same receiving space 124 ink-jets of nozzle 902 and 904 pairs, the twice ink-jet route in front and back is overlapping basically.So ink is difficult to even diffusion in receiving space 124, the patterned layer on substrate that forms after the ink dried is often in uneven thickness.
Summary of the invention
In view of this, be necessary to provide a kind of manufacturing method of film pattern layer that can improve the uniformity.
A kind of manufacturing method of film pattern layer, it may further comprise the steps: a substrate is provided, described substrate has a plurality of barricades, described a plurality of barricade and described substrate limit a plurality of receiving spaces, each receiving space has first side and the second side that is parallel to each other, the distance of first side and second side is b, these a plurality of receiving spaces form a plurality of row of arranging along the direction that is parallel to first side and second side, and, be spaced apart d between the first side of every adjacent two row receiving spaces along a plurality of row of arranging perpendicular to the first side direction; First nozzle and second nozzle are provided, and the line of centres of this first, second nozzle is obliquely installed this first side relatively, and the spacing between this first, second nozzle is equaling d perpendicular to the projection on the direction of first side; This first nozzle moves along first route, and this first route is between the first side and second side of a pending receiving space, and is parallel with this first side, and distance is a; This first nozzle sprays into ink to this receiving space; This second nozzle moves along second route, and this second route is opposite with this first via line parallel and direction, and the distance c of this second route and this first route meets one of following two relational expressions: 0＜c＜b-a, and 0＜c＜a; This second nozzle sprays into ink to this receiving space; The ink of dry solidification receiving space and form patterned layer on substrate.
Compared to prior art, different spray nozzles is sprayed onto the diverse location of same receiving space with ink in the above-mentioned manufacturing method of film pattern layer, thereby impels ink to distribute more equably in same receiving space, and then improves the uniformity of patterned layer on substrate.
Description of drawings
Fig. 1 to Figure 10 is the Thinfilm pattern layer manufacturing method schematic diagram of first embodiment of the invention, wherein:
Fig. 1 is the substrate vertical view;
Fig. 2 is the cutaway view of substrate shown in Figure 1 along straight line II-II;
Fig. 3 to Fig. 6 is the schematic diagram of ink-jet step;
Fig. 7 to Fig. 8 is the schematic diagram of another ink-jet step;
Fig. 9 is for forming the substrate cutaway view of color layers;
Figure 10 is for being formed with the substrate cutaway view of conductive layer;
Figure 11 is the ink-jet step schematic diagram of second embodiment of the invention;
Figure 12 is the ink-jet step schematic diagram of third embodiment of the invention;
Figure 13 is the ink-jet step schematic diagram of fourth embodiment of the invention;
Figure 14 is the vertical view of a substrate in the prior art;
Figure 15 is the cutaway view of substrate shown in Figure 14 along straight line XV-XV;
The schematic diagram of ink-jet step in Figure 16 prior art.
Embodiment
Below in conjunction with accompanying drawing the embodiment of the invention is done further detailed description.
Please consulting Fig. 1 together to Figure 10, is a kind of manufacturing method of film pattern layer schematic diagram that first embodiment of the invention provides, and the step of this method is as follows:
Step 1: provide a substrate 100, as shown in Figures 1 and 2.Have a plurality of barricades 102 on the substrate 100, described a plurality of barricades 102 limit a plurality of receiving spaces 104 with described substrate 100.Each row receiving space 104 is arranged along X-axis, each row receiving space 104 is arranged along Y-axis, every adjacent two d that are spaced apart that go between the receiving spaces 104, each receiving space 104 has first side 110 and the second side 112 that is parallel to each other, be spaced apart b between the dual-side, promptly the width of receiving space 104 on Y-axis is b.In the present embodiment, the material selection glass of substrate 100.Certainly, baseplate material also can be selected quartz glass, Silicon Wafer, metal or plastics etc. for use.
Step 2: as shown in Figure 3, an ink gun 300 is provided, ink gun 300 includes first nozzle 302 and second nozzle 304 at least, and nozzle 302 and 304 is arranged along Y-axis, and nozzle 302 and 304 projection interval in Y-axis (promptly vertical with the direction of prining direction) also are d.Be example with receiving space 104 below, 300 pairs of receiving space 104 ink jet processes of ink gun are described.Ink gun 300 moves along first route 306, and first route 306 is along the X-axis positive direction, and first route 306 is a with the distance of first side 110.When first nozzle 302 moves to the position of receiving space 104,302 pairs of receiving space 104 ink-jets of first nozzle.Ink gun 300 can be selected thermal bubble type or piezoelectric type for use.
Step 3: as Fig. 4 and shown in Figure 5, ink gun 300 continues to move along this first route 306, move to a rear flank of receiving space 104 when ink gun 300, ink gun 300 is along second route, 308 displacement c, second route 308 is along the opposite direction of Y-axis, and distance c meets one of following relational expression: d＜c＜d+b-a and d-a＜c＜d.
Certainly, if nozzle 302 and 304 is spaced apart kd (k is any natural number) on Y-axis, correspondingly, ink gun 300 should be along the second route displacement c, and this distance c should meet one of following relational expression: kd＜c＜kd+b-a and kd-a＜c＜kd (k is any natural number).
Step 4: as Fig. 5 and shown in Figure 6, ink gun 300 moves along Third Road line 310, and this Third Road line 310 is along the opposite direction of X-axis, when second nozzle 304 moves to the position of receiving space 104, and 304 pairs of receiving space 104 ink-jets of second nozzle.After the ink-jet, ink gun 300 continues to move along Third Road line 310.
When ink gun 300 displacement c were d＜c＜d+b-a, the distance c of first route and Third Road line was 0＜c＜b-a; When ink gun 300 displacement c were d-a＜c＜d, the distance c of first route and Third Road line was 0＜c＜a.
At least comprise a solvent among the ink.Preferably, this solvent is an organic solvent, and this solvent should have higher boiling point, for example, boiling point should be higher than 170 degrees centigrade (℃), boiling point be higher than 185 ℃ better.Different organic solvents has different boiling points, for example, also can be used for the present invention for the solvent of 400 ℃ of boiling points, and achieve the desired result.Like this, before second nozzle 304 sprayed into ink a receiving space 104, the ink that first nozzle 302 sprays into same receiving space 104 can not solidify.Nozzle 302 and 304 inks that successively spray into same receiving space 104 can mix mutually, and can be cured simultaneously.
As the alternative embodiment of ink-jet step, can adopt same ink gun to twice ink-jet in receiving space 104 front and back.That is to say, please consult Fig. 4 once more, when ink gun 300 when second route 308 moves to the position of Fig. 7, promptly when first nozzle 302 be centered close on the Third Road line 310 time, ink gun 300 moves along Third Road line 310.First nozzle 302 is once more to receiving space 104 ink-jets.After the ink-jet, ink gun 300 continues to move along Third Road line 310, as shown in Figure 8.
Step 5: a plurality of receiving space 104 ink inside of dry solidification and form color layers 106, as shown in Figure 9.This step is mainly by a vacuum extractor, a heater or an exposure device, the ink of a plurality of receiving spaces 104 is carried out dry solidification, perhaps adopt any two or three kinds of above-mentioned three's mode to carry out dry solidification, and exposure device comprise the ultraviolet photoetching irradiation unit.
Step 6: on this substrate 100, form the transparency conducting layer 108 that covers barricade 102 and color layers 106, as shown in figure 10.The step of this step for selecting.For example, use vacuum sputtering apparatus, form indium oxide layer tin thin film (Indium Tin Oxide Film, ITO Film).
Should be pointed out that at the foregoing description nozzle 302 and 304 and on Y-axis, be spaced apart kd (k is any natural number).Certainly, at interval can be any, as long as make the distance c of first route and Third Road line meet one of following relational expression: 0＜c＜b-a, and 0＜c＜a, thus different spray nozzles is sprayed onto ink the diverse location of same receiving space.
In the above-described embodiments, same receiving space adopts two nozzles to carry out ink-jet.Be appreciated that same receiving space also can adopt the nozzle more than three or three to carry out ink-jet, the route difference that each nozzle moves, thus ink is sprayed onto the diverse location of same receiving space.
Different spray nozzles is sprayed onto the diverse location of same receiving space with ink in the above-mentioned manufacturing method of film pattern layer, thereby impels ink to distribute more equably in same receiving space, and then improves the uniformity of patterned layer on substrate.
See also Figure 11, be the ink-jet step schematic diagram of second embodiment of the invention.The ink-jet step of this ink-jet step and aforementioned first embodiment is similar, and difference is: first nozzle 402 and second nozzle 502 lay respectively at first ink gun 400 and second ink gun 500.First ink gun 400 and second ink gun 500 can be the ink guns of same model, also can be the ink guns of different model.First ink gun 400 and second ink gun 500 can be arranged on same board, also can be arranged on different boards.In ink jet process, ink gun 400,500 is done as a whole moving.The movement locus of ink gun 400,500 is similar to the movement locus of ink gun 300, gives unnecessary details no longer one by one at this.
See also Figure 12, be the ink-jet step schematic diagram of third embodiment of the invention.The ink-jet step of this ink-jet step and aforementioned first embodiment is similar, difference is: ink gun 600 is obliquely installed with respect to first route 306, the nozzle 602 and 604 the line of centres and first route, 306 θ at an angle to each other (wherein, 0 °＜θ＜90 °, perhaps 90 °＜θ＜180 °).In the present embodiment, θ=45 °.The projection spacing of nozzle 602 and 604 on Y-axis is d.
See also Figure 13, be the ink-jet step schematic diagram of fourth embodiment of the invention.The ink-jet step of this ink-jet step and aforementioned second embodiment is similar, difference is: ink gun 700 and 800 all is obliquely installed with respect to first via line 306, the nozzle 702,802 and 804 the line of centres and first route, 306 θ at an angle to each other are (wherein, 0 °＜θ＜90 °, perhaps 90 °＜θ＜180 °).In the present embodiment, θ=45 °.
It is pointed out that the present invention's thin film pattern layer structure and manufacture method thereof are applicable to manufacturing of colored filter and organic light emitting apparatus etc.In the processing procedure of colored filter, available this processing procedure is finished the manufacturing of redgreenblue color layers, correspondingly, above-mentioned barricade can be individual layer barricade (only using black matrix as barricade), also can be multilayer barricade (comprising one or more layers material on black matrix and the black matrix).And in the manufacturing of organic light emitting apparatus, available this processing procedure is finished the conductor layer of organic light emitting apparatus, the manufacturing of luminescent layer and electronics electricity hole transport layer etc.Yet Thinfilm pattern that is formed and required ink can be different.
In addition, those skilled in the art also can do other variation in spirit of the present invention, and certainly, the variation that these are done according to spirit of the present invention all should be included within the present invention's scope required for protection.
Claims (20)
1. manufacturing method of film pattern layer, it may further comprise the steps:
A substrate is provided, described substrate has a plurality of barricades, described a plurality of barricade and described substrate are limited with a plurality of receiving spaces, each receiving space has first side and the second side that is parallel to each other, the distance of first side and second side is b, these a plurality of receiving spaces form a plurality of row of arranging along the direction that is parallel to first side and second side, and along a plurality of row of arranging perpendicular to the first side direction, are spaced apart d between the first side of every adjacent two row receiving spaces;
First nozzle and second nozzle are provided, and the line of centres of this first, second nozzle is obliquely installed this first side relatively, and the spacing between this first, second nozzle is equaling d perpendicular to the projection on the direction of first side;
This first nozzle moves and this receiving space is sprayed into ink along first route, and this first route is between the first side and second side of a pending receiving space, and is parallel with this first side, and distance is a;
This second nozzle moves and this receiving space is sprayed into ink along second route, this second route is opposite with this first via line parallel and direction, the distance c of this second route and this first route meets one of following two relational expressions: 0＜c＜b-a, and 0＜c＜a;
The ink of dry solidification receiving space and form patterned layer on substrate.
2. manufacturing method of film pattern layer as claimed in claim 1 is characterized in that this ink comprises a kind of solvent at least, and the boiling point of this solvent is higher than 170 ℃.
3. manufacturing method of film pattern layer as claimed in claim 2 is characterized in that, the boiling point of this solvent is higher than 185 ℃.
4. manufacturing method of film pattern layer as claimed in claim 1 is characterized in that described baseplate material is selected from glass, Silicon Wafer, metal or plastics.
5. manufacturing method of film pattern layer as claimed in claim 1 is characterized in that, this dry solidification step adopts at least a with in the lower device: a kind of vacuum extractor, a kind of heater and a kind of exposure device.
6. manufacturing method of film pattern layer as claimed in claim 5 is characterized in that this exposure device comprises the ultraviolet photoetching irradiation unit.
7. manufacturing method of film pattern layer as claimed in claim 1 is characterized in that, described first nozzle and second nozzle all are positioned at same ink gun.
8. manufacturing method of film pattern layer as claimed in claim 7 is characterized in that, this ink gun is thermal bubble type or piezoelectric type.
9. manufacturing method of film pattern layer as claimed in claim 1 is characterized in that, described first nozzle and second nozzle lay respectively at first ink gun and second ink gun.
10. manufacturing method of film pattern layer as claimed in claim 9 is characterized in that, described first, second ink gun is the ink gun of same model.
11. manufacturing method of film pattern layer as claimed in claim 9 is characterized in that, described first, second ink gun is the ink gun of different model.
12. manufacturing method of film pattern layer as claimed in claim 9 is characterized in that, described first, second ink gun all is arranged on the same board.
13. manufacturing method of film pattern layer as claimed in claim 9 is characterized in that, described first, second ink gun is arranged at respectively on the board of difference.
14. a manufacturing method of film pattern layer, it may further comprise the steps:
A substrate is provided, described substrate has a plurality of barricades, described a plurality of barricade and described substrate are limited with a plurality of receiving spaces, each receiving space has first side and the second side that is parallel to each other, the distance of first side and second side is b, these a plurality of receiving spaces form a plurality of row of arranging along the direction that is parallel to first side and second side, and along a plurality of row of arranging perpendicular to the first side direction, are spaced apart d between the first side of every adjacent two row receiving spaces;
An ink gun is provided, this ink gun is obliquely installed with respect to this first side, this ink gun has a plurality of nozzles, spacing between every adjacent two nozzles is equaling d perpendicular to the projection on the direction of first side, optional nozzle, this nozzle moves and this receiving space is sprayed into ink along first route, and this first route is between the first side and second side of a pending receiving space, parallel with this first side, and distance is a;
This nozzle moves and this receiving space is sprayed into ink along second route, and this second route is opposite with this first via line parallel and direction, and the distance c of this second route and this first route meets one of following two relational expressions: 0＜c＜b-a, and 0＜c＜a;
The ink of dry solidification receiving space and form patterned layer on substrate.
15. manufacturing method of film pattern layer as claimed in claim 14 is characterized in that, this ink comprises a kind of solvent at least, and the boiling point of this solvent is higher than 170 ℃.
16. manufacturing method of film pattern layer as claimed in claim 15 is characterized in that, the boiling point of this solvent is higher than 185 ℃.
17. manufacturing method of film pattern layer as claimed in claim 14 is characterized in that, described baseplate material is selected from glass, Silicon Wafer, metal or plastics.
18. manufacturing method of film pattern layer as claimed in claim 14 is characterized in that, this dry solidification step adopts at least a with in the lower device: a kind of vacuum extractor, a kind of heater and a kind of exposure device.
19. manufacturing method of film pattern layer as claimed in claim 18 is characterized in that, this exposure device comprises the ultraviolet photoetching irradiation unit.
20. manufacturing method of film pattern layer as claimed in claim 15 is characterized in that, this solvent is an organic solvent.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2007101079896A CN101312115B (en) | 2007-05-22 | 2007-05-22 | Thin film pattern layer preparation method |
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| CN2007101079896A CN101312115B (en) | 2007-05-22 | 2007-05-22 | Thin film pattern layer preparation method |
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| CN101312115A CN101312115A (en) | 2008-11-26 |
| CN101312115B true CN101312115B (en) | 2011-01-26 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1358626A (en) * | 2000-11-21 | 2002-07-17 | 精工爱普生株式会社 | Color filtering piece, liquid crystal deivce, and EL device making method and device |
| CN1739970A (en) * | 2004-07-26 | 2006-03-01 | 精工爱普生株式会社 | Method of supplying a liquid material onto a base, a droplet ejection apparatus, an electro-optic apparatus and an electronic apparatus |
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- 2007-05-22 CN CN2007101079896A patent/CN101312115B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1358626A (en) * | 2000-11-21 | 2002-07-17 | 精工爱普生株式会社 | Color filtering piece, liquid crystal deivce, and EL device making method and device |
| CN1739970A (en) * | 2004-07-26 | 2006-03-01 | 精工爱普生株式会社 | Method of supplying a liquid material onto a base, a droplet ejection apparatus, an electro-optic apparatus and an electronic apparatus |
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| CN101312115A (en) | 2008-11-26 |
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