CN100353582C - Organic planar light-emitting device and transparent electrode board manufacturing method - Google Patents
Organic planar light-emitting device and transparent electrode board manufacturing method Download PDFInfo
- Publication number
- CN100353582C CN100353582C CNB021578451A CN02157845A CN100353582C CN 100353582 C CN100353582 C CN 100353582C CN B021578451 A CNB021578451 A CN B021578451A CN 02157845 A CN02157845 A CN 02157845A CN 100353582 C CN100353582 C CN 100353582C
- Authority
- CN
- China
- Prior art keywords
- insulating barrier
- electroluminescent device
- plane
- transparent
- manufacture method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to a manufacturing method for an organic plane luminous device which comprises a transparent electrode board, an organic electric exciting light layer and a metal cathode. The manufacturing method comprises a step of forming a transparent electrode base board, a step of forming an insulating layer, a solidifying step, a step of forming the organic electric exciting light layer and a step of forming the metal cathode, wherein in the step of forming the transparent electrode base board, a plurality of transparent anodes of mutual separation are formed on the transparent base board; in the step of forming an insulating layer, an insulating layer is formed on the periphery of the transparent anodes in an ink jetting printing mode; in the solidifying step, the insulating layer is solidified to form the transparent electrode board; in the step of forming the organic electric exciting light layer, the organic electric exciting light layer is formed on the transparent electrode board with the transparent anodes and the insulating layer; in the step of forming the metal cathode, the metal cathode is coated on the organic electric exciting light layer. In addition, the present invention also provides a manufacturing method for the transparent electrode board.
Description
Technical field
The present invention relates to a kind of organic planar emission apparatus and transparency electrode board fabrication method, particularly utilize ink jet printing to make the organic planar emission apparatus and the transparency electrode board fabrication method of insulating barrier in organic planar emission apparatus and the transparent electrode plate.
Background technology
Luminescence component is towards high brightness, complanation, the frivolous and trend development of economizing the energy in recent years, in view of this, Organic Light Emitting Diode (OLED) or organic planar emission apparatus become utmost point desire research and development in the present opto-electronics direction one.
Please refer to Fig. 1, the basic structure of general organic planar emission apparatus 2 comprises a transparent electrode plate 21, an organic electro luminescent layer 22 and a metallic cathode 23.Wherein, transparent electrode plate 21 more comprises a transparency carrier 211, a plurality of transparent anode 212, an insulating barrier (isolationlayer) 213.The manufacture method of transparent electrode plate 21 is shown in Fig. 2 A to Fig. 2 C at present.In Fig. 2 A, a transparency carrier 211 at first is provided, on this transparency carrier 211, plate a transparent anode layer 212.Then, utilize little shadow (lithography) mode to produce anode pattern (shown in Fig. 2 B).Get off again, be used as the insulating layer material rotary coating thereon, produce insulating barrier 213 patterns (shown in Fig. 2 C) in little shadow mode more at last to have high-resistance macromolecular material.And when carrying out micro-photographing process, must use photoresistance and organic solution, for example developer solution (developer) and removing photoresistance agent (stripper) cause environmental pollution easily when handling.
Again further, the main structure fabrication mode of insulating barrier has three kinds, first kind is to use the Polymer Solution of photoresistance type to be used as insulating layer material, on transparency carrier, make insulating layer of thin-film with rotary coating, roasting mode, then produce insulation layer structure with exposure, baking, development and baking in regular turn.Second kind is to use the Polymer Solution of non-photoresistance type to be used as insulating layer material, on transparency carrier, make insulating layer of thin-film with rotary coating, roasting mode, then remove and toast and produce insulation layer structure with photoresistance coating, baking, exposure, development, insulating barrier etching, photoresistance in regular turn.The third then is used as insulating layer material for the Polymer Solution that uses screen painting mode and photosensitive type/non-photosensitive type sclerosis, its method is that the half tone that will have specific pattern places on the substrate, produces insulation layer structure with mode of printing and curing (exposure/heating) mode.Hence one can see that, the first two processing procedure of planting insulating barrier make the manufacture method step of present transparent electrode plate complicated consuming time, use the numerous costlinesses of machine kind, insulating layer material utilization rate extremely low (＜10%), and in processing procedure, use a large amount of organic solvents, on environmental protection is considered, handle difficult; Though yet the third processing procedure is simple, manufacture method is quick, the resolution of its insulation layer structure not good (＞150m), the insulating layer material utilization rate is on the low side (20%-50%), more need use a large amount of organic solvents to clean half tone, environmental protection consider handle difficult.
Yet, with regard to whole organic planar emission apparatus, numerous costlinesses of employed machine kind in the whole processing procedure, and fabrication steps is complicated consuming time, on cost is considered cost very high, a large amount of organic solvents that use and photoresistance are handled in environmental protection and also are not easy.In addition, the making of light shield or half tone more increases the manufacturing cycle and the cost of product.
Summary of the invention
From the above, the purpose of this invention is to provide organic planar emission apparatus and the transparency electrode board fabrication method that a kind of cost is low, processing procedure is simple fast, the manufacturing cycle is short and reduce environmental pollution.
For reaching above-mentioned purpose, the invention provides a kind of organic planar emission apparatus manufacture method, wherein organic planar emission apparatus comprises a transparent electrode plate, an organic electro luminescent layer and a metallic cathode.This organic planar emission apparatus manufacture method comprises the following step: a transparent electrode substrate forms step, an insulating barrier forms step, a curing schedule, organic electro luminescent layer formation step and a metallic cathode and forms step.Wherein, form in the step, on transparency carrier, form a plurality of transparent anodes that are separated from each other at transparent electrode substrate; Form in the step at insulating barrier, around this transparent anode, form insulating barrier with ink jet printing mode; In curing schedule, insulating barrier is solidified, to form transparent electrode plate; Form in the step in organic electro luminescent layer, on the transparent electrode plate that is formed with transparent anode and insulating barrier, form an organic electro luminescent layer; And in metallic cathode formation step, on organic electro luminescent layer, plate metallic cathode.
Compared with prior art, the present invention utilizes ink jet printing mode to form insulating barrier on the transparent electrode plate, to form organic planar emission apparatus.Insulating material only need be aimed at, be printed to ink jet printing mode on the specific region of transparency carrier and three steps such as curing, not only can reduce the step on the processing procedure, also need not use expensive complicated machine, can save production cost and time.Moreover, need not carry out micro-photographing process, promptly need not use developer and removing photoresistance agent, can avoid producing environmental issue.In addition, need not use light shield or half tone, not only can significantly shorten manufacturing cycle and manufacturing cost, more can make the pattern variation of light-emitting zone, meet the product pattern demand of seeking change and innovation.
In addition, the invention provides a kind of transparency electrode board fabrication method, wherein, transparent electrode plate comprises a transparency carrier, a plurality of transparent anode and an insulating barrier, and the manufacture method of this transparent electrode plate comprises the following step: a transparent anode forms step, an insulating barrier forms a step and a curing schedule.Wherein, form in the step, on transparency carrier, form a plurality of transparent anodes that are separated from each other at transparent anode; Form in the step at insulating barrier, around transparent anode, form insulating barrier with ink jet printing mode; And in curing schedule, insulating barrier is solidified, form transparent electrode plate according to this.
Compared with prior art, mainly utilize ink jet printing on transparency carrier, to form an insulating barrier in the present invention, it reduces fabrication steps, need not use light shield or half tone, reduction manufacturing time and cost, and need not utilize developer (developer) and removing photoresistance agent organic solvents such as (stripper), the environmental issue that can reduce in the processing procedure to be produced.Detailed is compared as follows shown in the table.
| Project | First method | Second method | The third method | The present invention |
| Manufacture method | Little shadow | Little shadow | Screen painting | Ink jet printing |
| Light shield/half tone | Use | Use | Use | Do not use |
| Exposure, development | Use | Use | Do not use | Do not use |
| Solidify | Use | Use | Use | Use |
| Use equipment | Many | Many | Few | Few |
| The material utilization rate | Low | Low | In | High |
| Manufacturing cycle | Long | Long | Short | Short |
| Environmental issue | Greatly | Greatly | Greatly | Little |
| Manufacturing cost | High | High | Low | Low |
Description of drawings
Fig. 1 is the schematic diagram of the structure of existing organic planar emission apparatus;
Fig. 2 A～2C is the schematic illustration of existing transparency electrode board fabrication method;
Fig. 3 is the calcspar of organic planar emission apparatus manufacture method of the present invention;
Fig. 4 A and Fig. 4 B form the schematic diagram of step for the present embodiment transparent electrode substrate;
Fig. 5 A and Fig. 5 B form the schematic diagram of step for the present embodiment insulating barrier;
Fig. 6 is the schematic diagram of present embodiment curing schedule;
Fig. 7 forms the schematic diagram of step for the present embodiment organic electro luminescent layer;
Fig. 8 forms the schematic diagram of step for the present embodiment metallic cathode;
Fig. 9 is the schematic diagram of the curing schedule of another embodiment of the present invention;
Figure 10 is the calcspar of transparency electrode board fabrication method of the present invention.
Symbol description among the figure
1 organic planar emission apparatus
11 transparent electrode plates
111 transparency carriers
112 transparent anodes
113 insulating barriers
12 organic electro luminescent layer
13 metallic cathodes
2 organic planar emission apparatus
21 transparent electrode plates
22 organic electro luminescent layer
23 metallic cathodes
211 transparency carriers
212 transparent anodes
213 insulating barriers
Embodiment
Hereinafter with reference to relevant drawings organic planar emission apparatus manufacture method according to the embodiment of the invention is described.Wherein identical assembly will be represented with identical reference marks.
Please refer to Fig. 3 and shown in Figure 8, the manufacture method of a kind of organic planar emission apparatus 1 of present embodiment, it comprises the following step: a transparent electrode substrate forms step (S01), an insulating barrier forms step (S02), a curing schedule (S03), organic electro luminescent layer formation step (S04) and a metallic cathode and forms step (S05).Wherein, form in the step, on transparency carrier 111, form a plurality of transparent anodes that are separated from each other 112 at transparent electrode substrate; Form in the step at insulating barrier, around this transparent anode 112, form insulating barrier 113 with ink jet printing mode; In curing schedule, insulating barrier 113 is solidified, to form transparent electrode plate 11; Form in the step in organic electro luminescent layer, on the transparent electrode plate 11 that is formed with transparent anode 112 and insulating barrier 113, form an organic electro luminescent layer 12; And in metallic cathode formation step, on organic electro luminescent layer 12, plate metallic cathode 13.
Shown in Fig. 4 A, step S01 makes a plurality of transparent anodes 112 on transparency carrier 111.At this, transparency carrier 111 can be a glass substrate, plastics (plastic) substrate and a flexibility (flexible) substrate.Wherein, plastic base and flexible base, board can be a Merlon (polycarbonate, PC) substrate, a polyester (polyester, PET) substrate, a cyclenes copolymer (cyclic olefin copolymer, COC) substrate and a crome metal compound base material one cyclenes copolymer (metal locene-based cyclic olefincopolymer, mCOC) substrate.Those transparent anodes 112 are formed on the transparency carrier 111 with the sputter (sputtering) or the mode of ion plating (ionplating), then form the transparent anode pattern in little shadow mode, simultaneously, those transparency electrodes 112 also can be the strip transparent anode 112 that is separated from each other, shown in Fig. 4 B.And the material of transparent anode 112 can be tin indium oxide (ITO) or aluminum zinc oxide (AZO), and its thickness is more than 500 .
Shown in Fig. 5 A, in step S02, it is to form insulating barrier 113 around the transparent anode 112 that is being separated from each other with ink jet printing mode on the transparent base version 111 that insulating barrier forms step.Ink jet printing mode in insulating barrier formation step is after aiming at those transparent anode 112 peripheral regions, uses more than one ink gun ejection insulating material, and form an insulating barrier 113 around those transparent anodes 112.
Please refer to Fig. 5 B, ink jet printing of the present invention also can be used for insulating barrier is printed as the arbitrary graphic pattern of realistic demand, as literal or irregular figure or the like, its advantage is need not use light shield or half tone, only need carry out simple ink-jet step, and need not carry out as complicated step of the prior art, can reach identical effect.
Wherein, insulating barrier 113 is formed with the high molecular insulating material of photosensitive type, and it is big or small and regional in order to the definition light source region, and is used for avoiding transparent anode 112 edges to produce uneven electric field, and has influence on the useful life of assembly.At this, the thickness of insulating barrier 113 is greater than 0.05 micron, and its volume resistance value is 10
6More than the Ω, and its characteristic size (live width/line-spacing) is more than 20 microns.
Moreover the size of ink gun and its shape are along with the character of the pattern magnitude of required printing and the insulating material loaded, and be different as solution viscosity, granular size etc.Employed alignment so also changes along with the required precision of insulating layer pattern, and for example: it aims at precision more than 50 microns mechanical registeration, and its aligning precision of optical alignment is more than 1 micron.
In the present embodiment, the high molecular insulating material of photosensitive type can be sensing optical activity Polyimide (photosensitive polyimide, PSPl), it imports the sensitization base in the agent structure of Polyimide, allow Polyimide have the characteristic of insulating barrier and photoresistance simultaneously.The sensing optical activity Polyimide can be divided into PSPI (RingOpened Negative Type PSPl), the PSPI (Ring Closed NegativeType PSPI) of endless loop minus, the PSPI (Ring Opened Positive Type PSPl) of open loop eurymeric and the PSPI (Ring Close Posit ive Type PSPl) of endless loop eurymeric of open loop minus according to its molecular structure and response style, in processing procedure, use the step that PSPI can shorten processing procedure, and save photoresist and photoresistance processing procedure, for promoting process rate and reducing cost all helpful.
Again, as shown in Figure 6, in step S03 in order to solidify insulating barrier 113.Because insulating material has sensing optical activity, solidifies with the light Exposure mode when carrying out the insulating barrier curing schedule.Wherein, utilize suitable light (as UV light etc.) and suitable dose irradiation to be solidified insulating barrier 113, to form transparent electrode plate 11.
Please refer to Fig. 7 again, step S04 organic electro luminescent layer forms in the step, in be formed with transparent anode 112 and insulating barrier 113 transparent electrode plate 11 on form an organic electro luminescent layer 12.Wherein, organic electro luminescent layer 12 is formed with vapour deposition method, method of spin coating, ink-jet method or print process, the light that this organic electro luminescent layer 12 is launched is blue light, green glow, ruddiness, white light or other monochromatic light, and the thickness of organic electro luminescent layer 12 is about 500 to 3000 .
As shown in Figure 8, in step S05, metallic cathode forms step and form a metallic cathode 13 on organic electro luminescent layer 12.Wherein, metallic cathode 13 forms with vapour deposition method or sputtering method, and its material can be aluminium, aluminium/lithium, calcium, magnesium: silver-colored or silver-colored, its thickness is about 500 to 5000 .
Below be another embodiment of the present invention, except insulating barrier 113 formed with the high molecular insulating material of non-photosensitive type, remaining assembly and feature were all identical with first embodiment.As shown in Figure 9, because insulating barrier 113 is the high molecular insulating material of a non-photosensitive type, when carrying out the insulating barrier curing schedule, solidify with mode of heating.Wherein, utilize be heating and curing insulating barrier 113 and form transparent electrode plate 11 of suitable temperature and time, to form organic planar emission apparatus 1.
Ink jet printing mode can not used light shield or half tone, with one step very small amount of liquid material is produced required pattern on substrate, as square pattern, literal and irregular pattern, therefore can reduce product effectively and make the required cycle from being designed into.The present invention is based on this feature, utilize ink jet printing mode to form insulating barrier on the transparent base version, and then make organic planar emission apparatus.Compared with prior art, utilize ink jet printing to make insulating barrier, not only reduce production costs and the time, more need not use developer and removing photoresistance agent, can avoid causing the pollution of environment.
Hereinafter with reference to Figure 10 transparency electrode board fabrication method according to the embodiment of the invention is described.Wherein identical assembly will be represented with identical reference marks, and be that the detailed description of avoiding giving unnecessary details same steps as will be omitted.
As shown in figure 10, comprise a transparent anode according to transparency electrode board fabrication method of the present invention and form step S01, insulating barrier formation step S02 and a curing schedule S03.Wherein, form in the step at transparent anode, on transparency carrier 111, form a plurality of transparent anodes that are separated from each other 112, in insulating barrier formation step, around transparent anode 112, form insulating barrier 113 with ink jet printing mode, and in curing schedule, insulating barrier 113 is solidified, form transparent electrode plate 11 according to this.
From the above, the present invention utilizes ink jet printing mode to form insulating barrier on transparency carrier, only need aim at, ink jet printing and solidify three simple steps, can form the insulating barrier of transparent electrode plate, and need not use developer and removing photoresistance agent in the micro-photographing process, can reduce the generation of environmental issue; Again, ink jet printing mode can be made insulating barrier actual required arbitrary graphic pattern, as square pattern, literal and irregular pattern, need not carry out complicated fabrication steps, also can reduce production costs and the time.
Above-mentioned only is illustrative, but not is restricted.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the scope of claims its equivalent modifications of carrying out or change.
Claims (31)
1. plane Organnic electroluminescent device manufacture method, its midplane Organnic electroluminescent device comprises a transparent electrode plate, an organic electro luminescent layer and a metallic cathode, it is characterized in that this plane Organnic electroluminescent device manufacture method comprises the following step:
One transparent electrode substrate forms step, forms a plurality of transparent anodes that are separated from each other on a transparency carrier;
One insulating barrier forms step, forms this insulating barrier with ink jet printing mode around this transparent anode;
One curing schedule solidifies this insulating barrier, to form this transparent electrode plate;
One organic electro luminescent layer forms step, is formed with formation one organic electro luminescent layer on the transparent electrode plate of transparent anode and this insulating barrier in this; And
One metallic cathode forms step, plates a metallic cathode on this organic electro luminescent layer.
2. plane as claimed in claim 1 Organnic electroluminescent device manufacture method, it is characterized in that, ink jet printing mode in this insulating barrier formation step, after aiming at those transparent anode peripheral regions, use more than one ink gun ejection insulating material, and around those transparent anodes, form an insulating barrier.
3. plane as claimed in claim 1 Organnic electroluminescent device manufacture method is characterized in that this transparency carrier is a glass substrate.
4. plane as claimed in claim 1 Organnic electroluminescent device manufacture method is characterized in that this transparency carrier is a plastic base.
5. plane as claimed in claim 1 Organnic electroluminescent device manufacture method is characterized in that this transparency carrier is a flexible base, board.
6. plane as claimed in claim 1 Organnic electroluminescent device manufacture method is characterized in that, those transparent anodes are the metal oxide anode of conduction.
7. plane as claimed in claim 1 Organnic electroluminescent device manufacture method is characterized in that the thickness of those transparent anodes is more than 500 .
8. plane as claimed in claim 1 Organnic electroluminescent device manufacture method is characterized in that this insulating barrier is a photosensitive type macromolecule, and solidifies with the light Exposure mode in this curing schedule.
9. plane as claimed in claim 1 Organnic electroluminescent device manufacture method is characterized in that, this insulating barrier is a non-photosensitive type macromolecule, and solidifies with mode of heating in this curing schedule.
10. plane as claimed in claim 1 Organnic electroluminescent device manufacture method is characterized in that the thickness of this insulating barrier is more than 0.05 micron.
11. plane as claimed in claim 1 Organnic electroluminescent device manufacture method is characterized in that the volume resistance value of this insulating barrier is 10
6More than the Ω.
12. plane as claimed in claim 1 Organnic electroluminescent device manufacture method is characterized in that the live width of this insulating barrier or line-spacing are more than 20 microns.
13. plane as claimed in claim 2 Organnic electroluminescent device manufacture method is characterized in that this is aligned to mechanical registeration, it aims at precision more than 50 microns.
14. plane as claimed in claim 2 Organnic electroluminescent device manufacture method is characterized in that this is aligned to optical alignment, it aims at precision more than 1 micron.
15. plane as claimed in claim 2 Organnic electroluminescent device manufacture method is characterized in that this ink gun comprises more than one ink nozzle.
16. plane as claimed in claim 1 Organnic electroluminescent device manufacture method is characterized in that, the thickness of this organic electro luminescent layer is that 500 are to 5000 .
17. plane as claimed in claim 1 Organnic electroluminescent device manufacture method is characterized in that, the thickness of this metallic cathode is that 500 are to 5000 .
18. a transparency electrode board fabrication method, wherein transparent electrode plate comprises a transparency carrier, a plurality of transparent anode and an insulating barrier, it is characterized in that, this transparency electrode board fabrication method comprises the following step:
One transparent anode forms step, forms a plurality of transparent anodes that are separated from each other on this transparency carrier;
One insulating barrier forms step, forms this insulating barrier with ink jet printing mode around this transparent anode; And
One curing schedule solidifies this insulating barrier, forms a transparent electrode plate according to this.
19. transparency electrode board fabrication method as claimed in claim 18, it is characterized in that, ink jet printing mode in this insulating barrier formation step, after the aligned pattern of aiming at those transparent anode peripheral regions or substrate ad-hoc location, use more than one ink gun ejection insulating material, and around those transparent anodes, form an insulating barrier.
20. transparency electrode board fabrication method as claimed in claim 18 is characterized in that, this transparency carrier is a glass substrate.
21. transparency electrode board fabrication method as claimed in claim 18 is characterized in that, this transparency carrier is a plastic base.
22. transparency electrode board fabrication method as claimed in claim 18 is characterized in that, this transparency carrier is a flexible base, board.
23. transparency electrode board fabrication method as claimed in claim 18 is characterized in that, those transparent anodes are the metal oxide anode of conduction.
24. transparency electrode board fabrication method as claimed in claim 18 is characterized in that, the material of this insulating barrier is a photosensitive type macromolecule, and solidifies with the light Exposure mode in this curing schedule.
25. transparency electrode board fabrication method as claimed in claim 18 is characterized in that, the material of this insulating barrier is a non-photosensitive type macromolecule, and solidifies with mode of heating in this curing schedule.
26. transparency electrode board fabrication method as claimed in claim 18 is characterized in that, the thickness of this insulating barrier is more than 0.05 micron.
27. transparency electrode board fabrication method as claimed in claim 18 is characterized in that, the volume resistance value of this insulating barrier is 10
6More than the Ω.
28. transparency electrode board fabrication method as claimed in claim 18 is characterized in that, the live width of this insulating barrier or line-spacing are more than 20 microns.
29. transparency electrode board fabrication method as claimed in claim 19 is characterized in that this is aligned to mechanical registeration, it aims at precision more than 50 microns.
30. transparency electrode board fabrication method as claimed in claim 19 is characterized in that this is aligned to optical alignment, it aims at precision more than 1 micron.
31. transparency electrode board fabrication method as claimed in claim 19 is characterized in that this ink gun comprises more than one ink nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021578451A CN100353582C (en) | 2002-12-20 | 2002-12-20 | Organic planar light-emitting device and transparent electrode board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021578451A CN100353582C (en) | 2002-12-20 | 2002-12-20 | Organic planar light-emitting device and transparent electrode board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1509124A CN1509124A (en) | 2004-06-30 |
| CN100353582C true CN100353582C (en) | 2007-12-05 |
Family
ID=34236724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021578451A Expired - Fee Related CN100353582C (en) | 2002-12-20 | 2002-12-20 | Organic planar light-emitting device and transparent electrode board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100353582C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101740726B (en) * | 2008-11-25 | 2012-09-19 | 京东方科技集团股份有限公司 | Organic electroluminescent device and manufacturing method thereof |
| JP2011034711A (en) * | 2009-07-30 | 2011-02-17 | Sumitomo Chemical Co Ltd | Organic electroluminescence element |
| CN114236334B (en) * | 2021-11-05 | 2023-10-10 | 严群 | Light excitation enhanced current injection LED electroluminescent performance detection system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07211459A (en) * | 1994-01-26 | 1995-08-11 | Nec Kansai Ltd | Electroluminescent lamp |
| US5742322A (en) * | 1993-08-20 | 1998-04-21 | Ultra Silicon Technology(Uk) Limited | AC thin film electroluminescent device |
| WO2001010571A1 (en) * | 1999-08-11 | 2001-02-15 | Add-Vision, Inc. | Printable electroluminescent lamps having efficient material usage and simplified manufacture technique |
-
2002
- 2002-12-20 CN CNB021578451A patent/CN100353582C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5742322A (en) * | 1993-08-20 | 1998-04-21 | Ultra Silicon Technology(Uk) Limited | AC thin film electroluminescent device |
| JPH07211459A (en) * | 1994-01-26 | 1995-08-11 | Nec Kansai Ltd | Electroluminescent lamp |
| WO2001010571A1 (en) * | 1999-08-11 | 2001-02-15 | Add-Vision, Inc. | Printable electroluminescent lamps having efficient material usage and simplified manufacture technique |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1509124A (en) | 2004-06-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9282648B2 (en) | Composite electrode and method of manufacture thereof | |
| CN102960068B (en) | Organic EL display panel and manufacture method thereof | |
| CN100431196C (en) | Patterning of electrodes in OLED devices | |
| JP2020534656A (en) | Whole solution OLED device and its manufacturing method | |
| GB2439636A (en) | Organic devices | |
| JP2007527106A (en) | Thin film electronic component manufacturing method and manufacturing apparatus, and thin film electronic component | |
| CN108428719B (en) | Manufacturing method of pixel defining layer, display substrate and manufacturing method thereof, and display device | |
| KR20020042401A (en) | Organic electro luminescence device, its production metho and liquid crystal display device using it | |
| CN1795571A (en) | Method for producing organic light-emitting diodes (oled's) | |
| US10319793B2 (en) | Method for manufacturing a display substrate by peeling an organic layer | |
| CN102668704A (en) | Donor substrate, patterning method, and method for producing device | |
| CN103346123A (en) | Pixel defining layer, manufacturing method thereof, display substrate and display device | |
| US20200083488A1 (en) | Manufacturing method of oled display and oled display | |
| CN111509145B (en) | Display panel, manufacturing method thereof and display device | |
| US10153333B1 (en) | Method for manufacturing an OLED backplate and method for manufacturing an OLED panel | |
| CN107275513B (en) | Manufacturing method of O L ED device cathode and display panel, display panel and display device | |
| CN100353582C (en) | Organic planar light-emitting device and transparent electrode board manufacturing method | |
| CN105374852B (en) | A kind of printed form active display and preparation method thereof of no pixel bank | |
| CN107346776A (en) | Typographical display device and preparation method thereof and application | |
| CN110164931B (en) | Organic electroluminescent device, method of manufacturing the same, and display apparatus | |
| KR102016465B1 (en) | Method for Manufacturing of Organic light Emitting Display Device | |
| JP2012204202A (en) | Organic electroluminescent panel and method for manufacturing the same | |
| US20090294157A1 (en) | Electro-optic device and method for manufacturing the same | |
| US20050032453A1 (en) | Method for fabricating organic el element | |
| CN110622317A (en) | Display substrate, method of manufacturing the same, and display apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071205 Termination date: 20121220 |