CN101306468A - Preparation method of conductive silver composite nano particles coated by polypyrrole - Google Patents
Preparation method of conductive silver composite nano particles coated by polypyrrole Download PDFInfo
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- CN101306468A CN101306468A CNA2007101083514A CN200710108351A CN101306468A CN 101306468 A CN101306468 A CN 101306468A CN A2007101083514 A CNA2007101083514 A CN A2007101083514A CN 200710108351 A CN200710108351 A CN 200710108351A CN 101306468 A CN101306468 A CN 101306468A
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Abstract
The invention discloses a copper-silver composite nano particle and the preparation method thereof. The preparation method includes the steps as follows: weighing a certain amount of chalcanthite solid and dissolving the chalcanthite solid in the solution containing a organic protective agent; holding a specific temperature under the condition of stirring; adding a reducing agent for reaction lasting for 12-24 hours; and slowly adding the silver nitrate solution to the solution for reaction lasting for another 12 hours. The prepared copper-silver composite nano particles encapsulated by polypyrole has good dispersity. The preparation method has the outstanding characteristics that the prepared nano particles is in a homogeneous dispersion, and is encapsulated by the conducting polypyrole on the periphery; the preparation process is comparatively easy and the experimental parameters are easy to control; compared with the single silver powder, the composite nano material has low power, good dispersity, strong stability and feasible industrialized production.
Description
Technical field
The present invention relates to a kind of preparation method of composite nanoparticle, be specifically related to a kind of preparation method of copper/silver composite nano particles of conducting polymer parcel, belong to technical field of nano material.
Background technology
In recent years, the microelectronic product industry development is very fast, develops to microminiaturized, densification direction gradually.Realize that the microminiaturization of electronic product, the key of densification are the electronic interconnection materials.Traditional electronic interconnection material is the Sn/Pb scolder, but its resolution ratio is low, high temperature heating damage components and parts easily during welding, and also lead is noxious material, can be detrimental to health.The traditional tin lead welding of conductive adhesive replacement is connected into the focus into research.Compare with traditional welding procedure, conductive adhesive can solidify under lower temperature, has avoided the fire damage to components and parts.
Obtaining the most simple method of conductive adhesive is exactly that conductive filler is incorporated in the common base-material.Conductive filler is the important component part of electronic interconnection material, and the more conductive filler of research has metal dusts such as gold, silver and copper both at home and abroad at present.Exploitation the earliest for silver is conductive filler, this type of filler has good electric conductivity and oxidative resistance, but silver is that the conductive filler cost is higher, migration also easily takes place under wet heat condition and electric conductivity is descended, and causes short circuit phenomenon.The copper powder low price, anti-transfer ability is higher than silver, good conductivity, but easily oxidized and lose electric conductivity in the preparation process.
Summary of the invention
The present invention is directed to above problem, a kind of copper silver composite nano particles and preparation method thereof is provided, and obtain a kind of copper galactic nucleus shell composite nanometer particle of polypyrrole parcel.Prepared composite nanoparticle is that particle diameter is the spherical particle of 40-100nm.The outstanding feature of this composite nano materials is a gained nano particle size homogeneous, be uniformly dispersed, and the periphery is the electric polypyrrole parcel; Preparation process is simpler, and experiment parameter is more easy to control; This composite nano materials is low than the cost of single silver powder, and stability is all good with dispersion; Be expected to replace expensive gold, silver conductive filler.
The preparation method of conducting polymer-copper silver composite nanometer particle: take by weighing a certain amount of cupric sulfate pentahydrate solid and be dissolved in the solution that contains organic protective agent, under stirring condition, keep constant temperature, temperature range can be controlled between 50～100 ℃, and the adding reducing agent, the reaction time is 12～24 hours; To wherein slowly adding liquor argenti nitratis ophthalmicus, continue reaction 12 hours again.
Description of drawings
Fig. 1 is electric polypyrrole-copper silver composite nano particles sem photograph
Fig. 2 is electric polypyrrole-copper silver composite nano particles sem photograph
The specific embodiment
Below by embodiment the present invention is specifically described.Be necessary to be pointed out that at this following examples only are used for the present invention is further specified; can not be interpreted as limiting the scope of the invention, the person skilled in the art in this field can make some nonessential improvement and adjustment to the present invention according to the foregoing invention content.
Embodiment 1, compound concentration are the CuSO of 0.2mol/L
4Solution, add in CTAB and the SDS compound surfactant, this compound surfactant concentration is respectively 5mM and 1mM, mixed liquor is placed 50 ℃ of insulating boxs, after the stirred for several minute 0.2mol/L pyrroles's solution is joined in the reactor, regulating PH with the 1mol/L hydrochloric acid solution is about 3, reacts to add AgNO again after 24 hours
3Solution, the AgNO that is added
3Solution and CuSO
4The mol ratio of solution is 1: 10.The gained mixed solution is centrifugal, washes with water three times, dries in vacuum drying oven, obtains spherical composite nanoparticle, and its particle size is 40-60nm.
Claims (3)
1, a kind of preparation method of copper silver composite nano particles of polypyrrole parcel, it is characterized in that may further comprise the steps: take by weighing a certain amount of cupric sulfate pentahydrate solid and be dissolved in the solution that contains organic protective agent, under stirring condition, keep constant temperature, temperature range can be controlled between 50～100 ℃, and the adding reducing agent, the reaction time is 12～24 hours; To wherein slowly adding liquor argenti nitratis ophthalmicus, continue reaction 12 hours again.Obtaining particle diameter is the copper silver composite nano particles of the polypyrrole parcel of 40～100nm.
2, as the preparation method of the copper silver compound particle of the described polypyrrole parcel of right 1, it is characterized in that used reducing agent is a pyrrole monomer.
3, as the preparation method of the copper silver compound particle of the described polypyrrole parcel of right 1, it is characterized in that used organic protective agent is the compound system of softex kw and lauryl sodium sulfate, or a kind of in the polyvinylpyrrolidone.
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| CNA2007101083514A CN101306468A (en) | 2007-05-19 | 2007-05-19 | Preparation method of conductive silver composite nano particles coated by polypyrrole |
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| CNA2007101083514A CN101306468A (en) | 2007-05-19 | 2007-05-19 | Preparation method of conductive silver composite nano particles coated by polypyrrole |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103381486A (en) * | 2013-05-20 | 2013-11-06 | 河南大学 | Method for preparing surface modified Cu@SiO2 nano particles adopting shell structures |
| CN103464779A (en) * | 2013-09-05 | 2013-12-25 | 天津理工大学 | Method for adopting sliver-coated nano copper composite particles to prepare conductive ink |
| CN103480858A (en) * | 2013-09-10 | 2014-01-01 | 徐志兵 | Silver nano particle preparation method using visible light to reduce silver ions |
| CN103691965A (en) * | 2013-12-20 | 2014-04-02 | 华南理工大学 | Preparation method for copper/silver heterojunction nano-particles |
| CN104607657A (en) * | 2015-03-06 | 2015-05-13 | 中国科学院上海硅酸盐研究所 | Copper-silver double-metal nanowire and preparation method thereof |
| CN105537623A (en) * | 2016-02-01 | 2016-05-04 | 中国科学院深圳先进技术研究院 | Copper and silver alloy nanosheet and preparation method thereof |
| WO2016192242A1 (en) * | 2015-05-29 | 2016-12-08 | 厦门大学 | Method of synthesizing controllable shell-isolated silver nanoparticle |
| CN107282918A (en) * | 2017-05-17 | 2017-10-24 | 宁波大学 | A kind of Silver nanorod/polymer/silver nanometer sheet core-shell nano material and its preparation method and application |
| CN107383250A (en) * | 2016-05-17 | 2017-11-24 | 鹏鼎控股(深圳)股份有限公司 | Conducting polymer and circuit board and both corresponding preparation method, composites |
| CN107685153A (en) * | 2017-09-06 | 2018-02-13 | 烟台智本知识产权运营管理有限公司 | A kind of noble metal nano composite construction is constructed |
| CN108538444A (en) * | 2018-04-16 | 2018-09-14 | 广东工业大学 | A kind of electrocondution slurry and preparation method thereof for semiconductor packages |
| CN113426425A (en) * | 2021-06-21 | 2021-09-24 | 西南科技大学 | Silver-based composite adsorbent for removing radioactive iodine and preparation method and application thereof |
| CN114799195A (en) * | 2022-03-10 | 2022-07-29 | 昆明理工大学 | Preparation method of self-assembled micro-nano structure Cu-Ag nano particles |
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2007
- 2007-05-19 CN CNA2007101083514A patent/CN101306468A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103381486A (en) * | 2013-05-20 | 2013-11-06 | 河南大学 | Method for preparing surface modified Cu@SiO2 nano particles adopting shell structures |
| CN103381486B (en) * | 2013-05-20 | 2015-08-19 | 河南大学 | A kind of nucleocapsid structure Cu@SiO of surface modification 2the preparation method of nano particle |
| CN103464779A (en) * | 2013-09-05 | 2013-12-25 | 天津理工大学 | Method for adopting sliver-coated nano copper composite particles to prepare conductive ink |
| CN103464779B (en) * | 2013-09-05 | 2015-06-03 | 天津理工大学 | Method for adopting sliver-coated nano copper composite particles to prepare conductive ink |
| CN103480858A (en) * | 2013-09-10 | 2014-01-01 | 徐志兵 | Silver nano particle preparation method using visible light to reduce silver ions |
| CN103691965A (en) * | 2013-12-20 | 2014-04-02 | 华南理工大学 | Preparation method for copper/silver heterojunction nano-particles |
| CN104607657A (en) * | 2015-03-06 | 2015-05-13 | 中国科学院上海硅酸盐研究所 | Copper-silver double-metal nanowire and preparation method thereof |
| WO2016192242A1 (en) * | 2015-05-29 | 2016-12-08 | 厦门大学 | Method of synthesizing controllable shell-isolated silver nanoparticle |
| CN105537623A (en) * | 2016-02-01 | 2016-05-04 | 中国科学院深圳先进技术研究院 | Copper and silver alloy nanosheet and preparation method thereof |
| CN105537623B (en) * | 2016-02-01 | 2018-04-17 | 中国科学院深圳先进技术研究院 | A kind of Kufil nanometer sheet and preparation method thereof |
| CN107383250A (en) * | 2016-05-17 | 2017-11-24 | 鹏鼎控股(深圳)股份有限公司 | Conducting polymer and circuit board and both corresponding preparation method, composites |
| CN107383250B (en) * | 2016-05-17 | 2020-12-15 | 鹏鼎控股(深圳)股份有限公司 | Conductive polymer, circuit board, corresponding manufacturing method of conductive polymer and circuit board, and composite material |
| CN107282918A (en) * | 2017-05-17 | 2017-10-24 | 宁波大学 | A kind of Silver nanorod/polymer/silver nanometer sheet core-shell nano material and its preparation method and application |
| CN107685153A (en) * | 2017-09-06 | 2018-02-13 | 烟台智本知识产权运营管理有限公司 | A kind of noble metal nano composite construction is constructed |
| CN108538444A (en) * | 2018-04-16 | 2018-09-14 | 广东工业大学 | A kind of electrocondution slurry and preparation method thereof for semiconductor packages |
| CN113426425A (en) * | 2021-06-21 | 2021-09-24 | 西南科技大学 | Silver-based composite adsorbent for removing radioactive iodine and preparation method and application thereof |
| CN114799195A (en) * | 2022-03-10 | 2022-07-29 | 昆明理工大学 | Preparation method of self-assembled micro-nano structure Cu-Ag nano particles |
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Open date: 20081119 |