CN101304021A - LED encapsulation structure as well as backlight module and LCD device applying the same - Google Patents
LED encapsulation structure as well as backlight module and LCD device applying the same Download PDFInfo
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- CN101304021A CN101304021A CNA2007101028146A CN200710102814A CN101304021A CN 101304021 A CN101304021 A CN 101304021A CN A2007101028146 A CNA2007101028146 A CN A2007101028146A CN 200710102814 A CN200710102814 A CN 200710102814A CN 101304021 A CN101304021 A CN 101304021A
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Abstract
The invention discloses a light emitting diode encapsulation structure, which comprises a platform, at least two substrates, and at least two light emitting diode chips. The platform comprises at least a first assembling surface and at least a second assembling surface, wherein the first and the second assembling surfaces are not parallel to the surface of the platform. The two substrates are respectively arranged on the first and the second assembling surfaces. The two light emitting diode chips are respectively arranged on the two substrates.
Description
Technical field
The present invention relates to a kind of package structure for LED and backlight module and the liquid crystal indicator of using it, and be particularly related to a kind of backlight module and liquid crystal indicator that improves the package structure for LED of light extraction efficiency and use it.
Background technology
Backlight liquid crystal display system major part still adopts cold-cathode tube (cold cathodefluorescent lamps is CCFL) as its light source now.Because the technical development maturation and the low price of cold-cathode tube, therefore widely adopt in market.Yet cold-cathode tube itself exist color rendering not good, need high drive, mercurous (Hg), luminous frequency spectrum to contain problems such as ultraviolet light (UV) wave band, toggle speed is slow, fluorescent tube is easily broken, colourity is wayward.Thereby in backlight liquid crystal display of new generation system, can tend to develop new light sources to replace original cold-cathode tube design.
In recent years, (light emitting diode LED) has breakthrough progress to light-emitting diode aspect luminous efficiency.Light-emitting diode possesses high color rendering is arranged, driving voltage is low, the toggle speed of lighting a lamp is fast, but no mercury pollution, non-emitting ultraviolet light, solid-state encapsulation are difficult for advantages such as broken and dynamic regulation colourity, in addition, because the volume of light-emitting diode is little, the demand that can cooperate many light, thin and miniaturized application equipment, light-emitting diode thereby be regarded as the optimal selection of light source of new generation.Yet, because belonging to point-source of light and light type, concentrates light-emitting diode, when using light-emitting diode as the light source of LCD, how making its light source be dispersed evenly to whole liquid crystal panel becomes a big problem.Please refer to Fig. 1, it is the distribution map that illustrates the light type of traditional light-emitting diode.As shown in Figure 1, the light source major part of light-emitting diode 1 concentrate on axial among a small circle in, if therefore light-emitting diode 10 directly is placed in the backlight module, will cause display end, i.e. not equivalent scenario generation of liquid crystal panel 11 place's brightness disproportionations, color mixed light.For fear of above situation, often must increase backlight module thickness or increase the use of diffusion diaphragm, can cause that briliancy descends, heavy, shortcoming such as price is high.
Break up to be applicable to backlight module for the light type that will too concentrate, regular meeting sets up optical lens device on the packaging body of light-emitting diode.Please refer to Fig. 2 A～2C, Fig. 2 A is the schematic diagram that illustrates Lumileds side direction light field light-emitting diode, Fig. 2 B is the schematic diagram that the light-emitting diode that illustrates Fig. 2 A adds the light field behind the optical lens device for the light-emitting diode of Fig. 2 A does not add the schematic diagram of the light field of optical lens device, Fig. 2 C.Shown in Fig. 2 A, adjusted to by (seeing 2B figure) about-20 degree and+20 degree about-80 degree and+80 degree (seeing 2C figure) at can will be the originally high light axle of the optical lens device 8 of installing on the light-emitting diode chip for backlight unit 7, meaning is that the range of exposures of light-emitting diode chip for backlight unit 7 becomes greatly.Please refer to Fig. 3 A～3B again, it is the schematic diagram of Osram side direction light field light-emitting diode that Fig. 3 A illustrates, and Fig. 3 B is the schematic diagram of light field that illustrates the light-emitting diode of Fig. 3 A.Shown in Fig. 3 A～3B, behind installing optical lens device 18 on the light-emitting diode chip for backlight unit 17, the high light axle of light-emitting diode chip for backlight unit 17 can be displaced to the position about-70 degree and+70 degree.
Aforementioned two kinds of optical lens devices 8,18 all are to guide to side in order to script is concentrated on axial light, are not equal to problem to improve brightness disproportionation in the backlight module, mixed light, thereby can reduce the thickness that the diffusion diaphragm used and reduced backlight module.Yet owing to utilize optical lens device 8,18 to force light can be caused a large amount of losses of light by the axis of centres to being directed to the wide-angle direction, a lot of luminous energy can repeatedly and in the refraction reflection process of wide-angle lose, and can cause light extraction efficiency not good on the contrary.Moreover owing to optical lens device 8,18 structures of scheming as Fig. 2 A with Fig. 3 A and so on need be through quite complicated and meticulous design, its making is quite difficult and cost is very high.
Summary of the invention
In view of this, purpose of the present invention is exactly that a kind of package structure for LED and backlight module and the liquid crystal indicator of using it are being provided, light-emitting diode chip for backlight unit is attached on the platform with the angle that configures, is suitable for the side direction light field that backlight module uses most directly to create.Owing to omitted the complicated and expensive optical lens device of design, light extraction efficiency is increased, also reduced the cost of whole device.
According to purpose of the present invention, a kind of package structure for LED is proposed, comprise platform, at least two substrates and at least two light-emitting diode chip for backlight unit.Platform comprises at least the first assembling face and the second assembling face, and wherein the first assembling face is non-parallel in the surface of platform with the second assembling face.Two substrates are arranged at respectively on the first assembling face and the second assembling face, and two light-emitting diode chip for backlight unit then are arranged at respectively on two substrates.
According to purpose of the present invention, reintroduce a kind of backlight module, comprise backboard and at least one package structure for LED.Package structure for LED is arranged on the backboard, and comprises platform, at least two substrates and at least two light-emitting diode chip for backlight unit.Platform comprises at least the first assembling face and the second assembling face, and wherein the first assembling face is non-parallel in the surface of platform with the second assembling face.Two substrates are arranged at respectively on the first assembling face and the second assembling face, and two light-emitting diode chip for backlight unit then are arranged at respectively on two substrates.
According to purpose of the present invention, a kind of liquid crystal indicator is more proposed, comprise liquid crystal panel and backlight module.Backlight module is arranged at a side of liquid crystal panel, in order to provide light source to liquid crystal panel.Backlight module comprises backboard and at least one package structure for LED, and package structure for LED is arranged on the backboard.Package structure for LED comprises platform, at least two substrates and at least two light-emitting diode chip for backlight unit.Platform comprises at least the first assembling face and the second assembling face, and wherein the first assembling face is non-parallel in the surface of platform with the second assembling face.Two substrates are arranged at respectively on the first assembling face and the second assembling face, and two light-emitting diode chip for backlight unit then are arranged at respectively on two substrates.
For the present invention's above-mentioned purpose, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is the distribution map that illustrates the light type that is traditional light-emitting diode.
Fig. 2 A is the schematic diagram that illustrates Lumileds side direction light field light-emitting diode.
Fig. 2 B does not add the schematic diagram of the light field of optical lens device for the light-emitting diode of Fig. 2 A.
Fig. 2 C is the schematic diagram that the light-emitting diode that illustrates Fig. 2 A adds the light field behind the optical lens device.
Fig. 3 A is the schematic diagram that illustrates Osram side direction light field light-emitting diode.
Fig. 3 B is the schematic diagram of light field that illustrates the light-emitting diode of Fig. 3 A.
Fig. 4 A is the schematic diagram that illustrates according to the liquid crystal indicator of one embodiment of the present invention.
Fig. 4 B is the partial enlarged drawing that illustrates the backlight module of Fig. 4 A.
Fig. 5 is the schematic diagram of luminous smooth type that illustrates the package structure for LED of Fig. 4 B.
Fig. 6 A is the rough schematic that illustrates first angle, 30～45 degree of Fig. 4 B.
Fig. 6 B is the rough schematic that illustrates first angle, 70～80 degree of Fig. 4 B.
Description of reference numerals
1: light-emitting diode 2: liquid crystal indicator
7,17,27,28: light-emitting diode chip for backlight unit
8,18: optical lens device 10,20: liquid crystal panel
21: backlight module 22: backboard
23: package structure for LED 24: platform
24A: the first assembling face 24B: the second assembling face
24C: surface 25,26: substrate
29,30: cap 31: diffusing panel
32: blooming piece 33: reflector plate
2: the second angles of 1: the first included angle of φ
L1, L2: optical axis S1, S2, S3: light type
Embodiment
Please refer to Fig. 4 A～4B, Fig. 4 A is the schematic diagram that illustrates according to the liquid crystal indicator of one embodiment of the present invention, and Fig. 4 B is the partial enlarged drawing that illustrates the backlight module of Fig. 4 A.Shown in Fig. 4 A, liquid crystal indicator 2 comprises liquid crystal panel 20 and backlight module 21, and backlight module 21 is arranged at a side of liquid crystal panel 20, in order to provide light source to liquid crystal panel 20.Backlight module 21 comprises backboard 22 and at least one package structure for LED 23, and this package structure for LED 23 is arranged on the backboard 22.Shown in Fig. 4 B, package structure for LED 23 comprises platform 24, at least two substrates 25,26 and at least two light-emitting diode chip for backlight unit 27,28.Platform 24 comprises at least one first assembling face 24A and at least one second assembling face 24B, and wherein the first assembling face 24A and the second assembling face 24B are non-parallel in the surperficial 24C of platform 24.Two substrates 25,26 are arranged at respectively on the first assembling face 24A and the second assembling face 24B, and two light-emitting diode chip for backlight unit 27,28 then are arranged at respectively on two substrates 25,26.
Package structure for LED 23 also comprises at least two caps 29,30, is arranged at respectively on two substrates 25,26, and is covered on two light-emitting diode chip for backlight unit 27,28.The material of two caps 29,30 is transparent optical resin preferably, for example is epoxy resin (Epoxy).
Shown in Fig. 4 A, backlight module 21 also comprises diffusing panel 31, blooming piece 32 and reflector plate 33.Diffusing panel 31 is arranged on the backboard 22, and is positioned on the package structure for LED 23.32 of blooming pieces are arranged on the diffusing panel 31, and blooming piece 32 for example is the combination of diffuser and brightness enhancement film.Reflector plate 33 is arranged on the backboard 22, and adjacent to package structure for LED 23.The light source of backlight module 21 mainly passes diffusing panel 31 and blooming piece 32 arriving liquid crystal panel 20, and the light source that part did not directly penetrate diffusing panel 31 and blooming piece 32 then must just can reflex to diffusing panel 31 and blooming piece 32 places by reflector plate 33.
Shown in Fig. 4 B, have first included angle 1 between the surface of first assembling face 24A and platform 24, and the second assembling face 24B assembles face 24A adjacent to first, and and the surface of platform 24 between have second included angle 2.Preferably, the first assembling face 24A and the second assembling face 24B are symmetrical arranged, and first included angle 1 equals second included angle 2 in fact.Two light-emitting diode chip for backlight unit 27,28 are arranged at respectively on two substrates 25,26, preferably, can make optical axis L 1, the L2 direction of two light-emitting diode chip for backlight unit 27,28 be parallel to the first assembling face 24A and second normal direction of assembling face 24B respectively, only need to control the included angle 1 and φ 2 sizes of the first assembling face 24A, the second assembling face 24B and platform 24 thus, just can adjust the angle between the axis of centres (for example normal N) on the high light axle (for example optical axis L 1, L2) of two light-emitting diode chip for backlight unit 27,28 and the platform 24.
When assembly, normally earlier light-emitting diode chip for backlight unit 27,28 routings are packaged on the substrate 25,26, again substrate 25,26 is assembled on the platform 24 with φ 2 with the angle φ 1 that configures.Certainly, when using actually, backboard 22 can pass through the direct integrally formed output of stamping technology with platform 24, to reduce number of spare parts and number of assembling steps.
Please be simultaneously with reference to Fig. 5, it is the schematic diagram of luminous smooth type that illustrates the package structure for LED of Fig. 4 B.As shown in Figure 5, light-emitting diode chip for backlight unit 27 luminous light types for example are S1, and light-emitting diode chip for backlight unit 28 luminous light types for example are S2, because two light-emitting diode chip for backlight unit 27,28 are obliquely installed with respect to platform 24, then shown in S3, whole light emitting region increases the two light type that synthesizes.
As for the design of the first assembling face 24A and the second assembling face 24B, preferably, first included angle 1 and second included angle 2 approximate 30～45 degree in fact, or approximate 70～80 degree, the following drawings explanation.Please refer to Fig. 6 A～6B, Fig. 6 A is the rough schematic that illustrates first angle, 30～45 degree of Fig. 4 B, and Fig. 6 B is the rough schematic that illustrates first angle, 70～80 degree of Fig. 4 B.As shown in Figure 6A, when first included angle 1 (second included angle 2) 30～45 is spent, because light emitting region is less, the light that makes light-emitting diode chip for backlight unit 27,28 send can be through refraction and reflection repeatedly, therefore the light extraction efficiency height makes the light utilization rate of whole package structure for LED 23 good.In addition, shown in Fig. 6 B, when first included angle 1 (second included angle 2) 70～80 was spent, light emitting region was bigger, and the light that light-emitting diode chip for backlight unit 27,28 sends can be through refraction and reflection comparatively repeatedly, thereby its light mixed effect is preferred.
Compared to traditionally by adding the high light direction of principal axis of optical lens device (seeing Fig. 2 A, 3A) with the skew light-emitting diode, the present invention only needs first angle and second angle of assembling face are designed to 70 or 80 degree, just the high light axle of two light-emitting diode chip for backlight unit 27,28 can be fixed on the position about offset from center axle 70 or 80 is spent.Promptly can directly create the side direction light field that is suitable for backlight module 21 application in this way, and not need to install additional more any optical lens device.Certainly, the present invention also can set up easy optical lens device with fine setting light type S3 as shown in Figure 5, makes it more to be applicable to the application of backlight module 21.Owing to only need the ornaments angle of conversion light-emitting diode chip for backlight unit 27,28 just can adjust its optical axis L 1, L2 direction, to be applicable to backlight module 21 application point of view of being wanted, thereby do not need to add expensive optical lens device, just can significantly reduce the installation cost of whole backlight module 21.
Package structure for LED and backlight module and the liquid crystal indicator of using it that the above embodiment of the present invention is disclosed, earlier light-emitting diode chip for backlight unit elder generation routing is packaged on two substrates, again these two substrates are provided with on the platform on two symmetrically arranged assembling faces, thus to adjust the high light direction of principal axis of light-emitting diode chip for backlight unit.Owing to can not need to install additional any optical lens device, not only can avoid the problem of light source through the optical loss behind the optical lens device, also can reduce whole installation cost.
In sum, though the present invention discloses as above with a preferred embodiment, so it is not in order to limit the present invention.The ordinary technical staff in the technical field of the invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is as the criterion when looking appended the claim person of defining.
Claims (15)
1. package structure for LED comprises:
One platform comprises at least the first assembling face and the second assembling face, and this first assembling face is non-parallel in the surface of this platform with this second assembling face:
At least two substrates are arranged at respectively on this first assembling face and this second assembling face; And
At least two light-emitting diode chip for backlight unit are arranged at respectively on these two substrates.
2. encapsulating structure as claimed in claim 1 wherein has first angle between this first assembling face and this platform surface, and this second assembling face is adjacent to this first assembling face, and and this platform surface between have second angle.
3. encapsulating structure as claimed in claim 2, wherein this first assembling face is provided with in the face of claiming with this second assembling, and this first angle equals this second angle in fact.
4. encapsulating structure as claimed in claim 3, wherein this first angle approximates 30 degree～45 degree in fact.
5. encapsulating structure as claimed in claim 3, wherein this first angle approximates 70 degree～80 degree in fact.
6. backlight module comprises:
Backboard; And
At least one package structure for LED is arranged on this backboard, and comprises:
Platform comprises at least the first assembling face and the second assembling face, and this first assembling face is non-parallel in the surface of this platform with this second assembling face;
At least two substrates are arranged at respectively on this first assembling face and this second assembling face; And
At least two light-emitting diode chip for backlight unit are arranged at respectively on this two substrate.
7. backlight module as claimed in claim 6 wherein has first angle between this first assembling face and this platform surface, and this second assembling face is adjacent to this first assembling face, and and this platform surface between have second angle.
8. backlight module as claimed in claim 7, wherein this first assembling face is provided with in the face of claiming with this second assembling, and this first angle equals this second angle in fact.
9. backlight module as claimed in claim 8, wherein this first angle approximates 30 degree～45 degree in fact.
10. backlight module as claimed in claim 8, wherein this first angle approximates 70 degree～80 degree in fact.
11. a liquid crystal indicator comprises:
Liquid crystal panel; And
Backlight module is arranged at a side of this liquid crystal panel, and in order to provide a light source in this liquid crystal panel, this backlight module comprises a backboard and at least one package structure for LED, and this package structure for LED is arranged on this backboard, and comprises:
One platform comprises at least the first assembling face and the second assembling face, and this first assembling face is non-parallel in the surface of this platform with this second assembling face;
At least two substrates are arranged at respectively on this first assembling face and this second assembling face; And
At least two light-emitting diode chip for backlight unit are arranged at respectively on these two substrates.
12. liquid crystal indicator as claimed in claim 11 wherein has first angle between this first assembling face and this platform surface, this second assembling face is adjacent to this first assembling face, and and this platform surface between have second angle.
13. liquid crystal indicator as claimed in claim 12, wherein this first assembling face is provided with in the face of claiming with this second assembling, and this first angle equals this second angle in fact.
14. liquid crystal indicator as claimed in claim 13, wherein this first angle approximates 30 degree～45 degree in fact.
15. liquid crystal indicator as claimed in claim 13, wherein this first angle approximates 70 degree～80 degree in fact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101028146A CN101304021A (en) | 2007-05-09 | 2007-05-09 | LED encapsulation structure as well as backlight module and LCD device applying the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101028146A CN101304021A (en) | 2007-05-09 | 2007-05-09 | LED encapsulation structure as well as backlight module and LCD device applying the same |
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| Publication Number | Publication Date |
|---|---|
| CN101304021A true CN101304021A (en) | 2008-11-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101028146A Pending CN101304021A (en) | 2007-05-09 | 2007-05-09 | LED encapsulation structure as well as backlight module and LCD device applying the same |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102537761A (en) * | 2010-12-15 | 2012-07-04 | 奇美电子股份有限公司 | Direct type light-emitting diode (LED) light source |
| CN106054446A (en) * | 2016-03-09 | 2016-10-26 | 友达光电股份有限公司 | Direct type light emitting device and display |
-
2007
- 2007-05-09 CN CNA2007101028146A patent/CN101304021A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102537761A (en) * | 2010-12-15 | 2012-07-04 | 奇美电子股份有限公司 | Direct type light-emitting diode (LED) light source |
| CN106054446A (en) * | 2016-03-09 | 2016-10-26 | 友达光电股份有限公司 | Direct type light emitting device and display |
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Application publication date: 20081112 |