CN101295751B - Solar cell encapsulation producing device and method for solar cell encapsulation - Google Patents
Solar cell encapsulation producing device and method for solar cell encapsulation Download PDFInfo
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- CN101295751B CN101295751B CN2008101109260A CN200810110926A CN101295751B CN 101295751 B CN101295751 B CN 101295751B CN 2008101109260 A CN2008101109260 A CN 2008101109260A CN 200810110926 A CN200810110926 A CN 200810110926A CN 101295751 B CN101295751 B CN 101295751B
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000005538 encapsulation Methods 0.000 title claims description 105
- 239000000758 substrate Substances 0.000 claims abstract description 84
- 239000010408 film Substances 0.000 claims abstract description 39
- 239000003292 glue Substances 0.000 claims abstract description 32
- 238000007747 plating Methods 0.000 claims abstract description 22
- 239000010409 thin film Substances 0.000 claims abstract description 14
- 230000000694 effects Effects 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000001179 sorption measurement Methods 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 230000003028 elevating effect Effects 0.000 claims description 7
- 230000007246 mechanism Effects 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000000498 cooling water Substances 0.000 claims description 3
- 238000007872 degassing Methods 0.000 claims description 2
- 238000002203 pretreatment Methods 0.000 claims description 2
- 238000012797 qualification Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 14
- 238000002360 preparation method Methods 0.000 abstract description 3
- 230000002411 adverse Effects 0.000 abstract description 2
- 210000003660 reticulum Anatomy 0.000 description 46
- 238000001723 curing Methods 0.000 description 10
- 238000012856 packing Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Photovoltaic Devices (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a packaging preparation device used for solar cells, in particular to thin film solar cells, which comprises a package preconditioning chamber used for preconditioning the back cover before packaging, a substrate stocker used for temporarily storing the substrate after plating film, a package working chamber used for packaging the substrate and back cover together, and a curing device used for solidifying glue. The invention also discloses a method for packaging solar cells, in particular to thin film solar cells. The packaging preparation device and packaging method for the solar cells adopted by the invention can essentially reduce bubbles formed in packaging, at the same time eliminate adverse effect of volatile matters to the devices in advance, effectively control the magnitude and evenness of the functional forces acting on the substrate and cover as well as reduce the wave character of glue thread width of the device, thus realizing excellent packaging effect.
Description
Technical field:
The present invention relates to the encapsulation producing device of a kind of encapsulation producing device of solar cell, particularly thin film solar cell.The invention still further relates to a kind of method of the solar cell encapsulation that is used for, especially thin film solar cell.
Background technology:
The preparation of solar cell, especially thin film solar cell be unable to do without encapsulation.In making the technical process of thin film solar cell, encapsulation operation is one of important link wherein, and the quality of encapsulation directly has influence on battery and hinders the ability that moisture and oxygen are invaded.Moisture that the external world enters and oxygen can destroy the proper property and the durability of the thin-film material in the thin film solar cell, thus the stability of the life-span of shortening device, reduction device.
In the prior art, the subject matter that exists in the encapsulation of solar cell has: the one, and bubble or worm hole that the sealing between cover glass and the device substrate forms are more, thus, will reduce the sealing moisture to external world and the barrier of oxygen, promptly Wai Jie moisture and oxygen pass sealing via the bubble place of worm hole or formation easily and enter package panel, thereby can influence the normal operation of battery; The 2nd, the inhomogeneous of active force that acts on substrate and the bonnet caused the fluctuation of device tree lace width excessive, influenced the effect of encapsulation; The 3rd, in the high temperature test of device, the volatile materials that contains in the sealing such as organic solvent can discharge, and it may be the gas harmful to device, and for example this volatile materials can destroy battery film material, thereby reduce the yields of device.
Summary of the invention:
At the problems referred to above, an object of the present invention is to provide a kind of encapsulation producing device that is used for solar cell, a kind of encapsulation producing device that is used for thin film solar cell particularly is provided.
Another object of the present invention provides a kind of method that adopts above-mentioned encapsulation producing device to come solar cell encapsulation, and a kind of method for packing that is used for thin film solar cell particularly is provided.
Above-mentioned packaging system and method for packing can fundamentally be avoided bubble or the worm hole that sealing forms in the encapsulation process, solve the relatively poor problem of tree lace width uniformity, and eliminate the volatile materials in the sealing, thereby improve the yields of device.
According to the present invention, a kind of encapsulation producing device that is used for solar cell, this solar cell comprises bonnet and substrate, this bonnet and substrate combine by glue, it is characterized in that this encapsulation producing device comprises: encapsulation pretreatment chamber is used for before encapsulation described bonnet being carried out preliminary treatment; The substrate temporary room is used for the substrate behind the temporary plated film; The encapsulation work chamber is used for described substrate and described bonnet are packaged together; And the curing system that is used for solidified glue; Wherein, the described operation that encapsulates between pretreatment chamber, described substrate temporary room, described encapsulation work chamber and the described curing system is undertaken by manipulator; Described encapsulation pretreatment chamber comprises: housing is used to limit a seal operation environment; Be used for carrying the pulley assembly of bonnet thereon; Be used to heat glue is carried out the heating component of degasification; Be used to make the elevating mechanism of bonnet lifting; And the cooling package that is used to cool off bonnet; Wherein, described pulley assembly, described heating component, described elevating mechanism and described cooling package are operated in described seal operation environment; Described encapsulation work chamber comprises: housing is used to limit a seal operation environment; The upper cover plate that is used for carrying substrates, described upper cover plate have a smooth adsorption plane, are formed with the vacuum tank that is used to adsorb substrate on this adsorption plane, and described upper cover plate comprises the exhaust tube that at least one is communicated with described vacuum tank; Be used to carry the base of bonnet, described base has a plummer that is used to carry bonnet, described upper cover plate can mutually closed the seal chamber that is limited be connected with a vacuum pump at least to limit the cavity of a sealing with described base, is used for seal chamber is bled and inflated; Guide locating device provided, the substrate and the cover plate that are used for transmission is entered the encapsulation work chamber position; Be used to make the lowering or hoisting gear of upper cover plate lifting; And the lowering or hoisting gear that is used to make the base lifting; Wherein, described upper cover plate, described base, described guide locating device provided, the described lowering or hoisting gear that is used for making the upper cover plate lifting and describedly be used to make the lowering or hoisting gear of base lifting to operate at described seal operation environment.
Described heating component is preferably the infrared heating assembly, and described cooling package preferably adopts cooling water to reach cooling effect.
Described substrate temporary room comprises a housing, this housing is used to limit a seal operation environment, have the pulley assembly that is used to carry film plating substrate in described substrate temporary room, wherein this pulley assembly contacts with the non-plated film district of substrate, and this pulley assembly is operated in described seal operation environment.
Preferably, the surface of the mutual closure of described upper cover plate and described base is provided with sealing ring and guide pillar that is used to locate and mark post.
Described base can comprise bedframe and quartz glass, and described quartz glass is fixed on the bedframe, and its periphery seals by sealing ring.
Described curing system be arranged on the encapsulation work chamber base under, it sees through quartz glass glue is cured.
Described glue is preferably UV glue, and described curing system mainly is made up of the UV light source.
According to a further aspect in the invention, a kind ofly adopt above-mentioned encapsulation producing device to come solar cell encapsulation, especially the method for thin film solar cell comprises the steps:
A) preliminary treatment before the encapsulation: the bonnet that is scribbled encapsulation glue is sent in the encapsulation pretreatment chamber by the pulley assembly that encapsulates pretreatment chamber and carries out preliminary treatment, promptly under vacuum environment bonnet is heated to eliminate bubble and the volatile materials in the glue; Cool off this cover plate by cooling package then, prevent distortion, and play the effect of stability; Wherein, bonnet scribbles one of glue and faces up.
B) location of film plating substrate (contraposition): film plating substrate is sent in the film plating substrate temporary room by the roll wheel assembly of temporary room, by manipulator it is delivered to the mark post place of encapsulation work chamber then, then by the guide pillar of alignment device it is located; After the location finished, the vacuum tank of the adsorption plane by upper cover plate was adsorbed on it on upper cover plate and rises to certain position; Wherein, substrate is coated with one of film and faces down, and pulley assembly contacts with the non-plated film district of substrate with manipulator.
C) location of bonnet: through pretreated bonnet, be sent to the mark post place of encapsulation work chamber, then it located by the guide pillar of alignment device by manipulator; After the location finishes, place it on the base plummer of encapsulation work chamber.
D) pressing of bonnet and substrate encapsulation: bonnet and substrate are after contraposition, by the elevating mechanism in the encapsulation work chamber they are delivered to position contacting soon, then, in seal chamber, inflate, bonnet is pressed together under ambient pressure with substrate, and glue is evenly pushed; Wherein, whole encapsulation process is to carry out under the environment of inert gas, and to reduce moisture and the oxygen content in the seal chamber, bonnet and substrate are by before the pressing, and the distance between two surfaces of bonnet and substrate is greater than 0.02mm.
E) use curing system that glue is cured, finish curing after, open seal chamber, take out packaged device.
In the pre-treatment step before described encapsulation, the vacuum degree of vacuum environment is preferably 10
-3Torr, heating-up temperature is preferably less than 200 ℃.
Described inert gas is nitrogen normally.
The present invention can obtain such technique effect: as mentioned above, employing is according to the method for packing and the encapsulation producing device thereof of solar cell of the present invention, under vacuum environment, the glue on the bonnet is carried out bake out by encapsulation pretreatment chamber earlier, fundamentally reduced the possibility of sealing formation bubble, also can eliminate the adverse effect of volatile materials in advance simultaneously device.The pressing encapsulation is carried out in encapsulation work chamber under inert gas (being generally nitrogen) environment, by guide locating device provided to substrate and bonnet accurately behind the location, adjust position before substrate and bonnet encapsulate pressing by lowering or hoisting gear that can accurate regulation and control rising or falling speed then, at last by realize the encapsulation pressing of substrate and bonnet with air pressure to the seal chamber inflation, so effectively control action is in the size and the uniformity of the active force of substrate and cover plate, reduce the fluctuation of device tree lace width, thereby reached good packaging effect.
Description of drawings:
Encapsulation producing device by solar cell of the present invention and be used for the detailed description of preferred, non-limiting example of the method for solar cell encapsulation, other features and advantages of the present invention will be more obvious, with reference to the accompanying drawings, will describe non-limiting example of the present invention below, wherein:
Fig. 1 is the flow chart that is used for the method for solar cell encapsulation of the present invention;
Fig. 2 is the cutaway view according to the substrate temporary room of the encapsulation producing device of solar cell of the present invention.Wherein Fig. 2 (b) is the vertical view of Fig. 2 (a);
Fig. 3 is the cutaway view according to the encapsulation pretreatment chamber of the encapsulation producing device of solar cell of the present invention;
Fig. 4 is according to the encapsulation work chamber of the encapsulation producing device of solar cell of the present invention and the cutaway view of UV solidification equipment.
Embodiment:
Hereinafter with reference to relevant drawings, the encapsulation producing device of thin film solar cell according to a preferred embodiment of the invention is described.
Packaging system provided by the invention comprises substrate temporary room 100 (Fig. 2), encapsulation pretreatment chamber 200 (Fig. 3), encapsulation work chamber 300 (Fig. 4) and curing system 22 (Fig. 4).
Wherein, as Fig. 2, especially shown in Fig. 2 (a), substrate temporary room bag 100 comprises: housing 3 is used to form the seal operation environment; Roll wheel assembly 2 is used for carrying and transmission film plating substrate 1.Shown in Fig. 2 (b), this film plating substrate 1 comprises non-plated film district 4 and plated film district 5 (being shown as plated film among the figure faces down).
Referring to Fig. 3, encapsulation pretreatment chamber 200 comprises: housing 7 is used to form the seal operation environment; Roll wheel assembly 10 is used to transmit bonnet 9; Lowering or hoisting gear 11, be used for bonnet 9 hold up to from heating component 8 suitable distances so that heat; Heating component 8 is used for the glue of coating on the bonnet 9 is heated so that remove bubble and volatile materials; Cooling package 6, it can use cooling water that bonnet 9 is cooled off, and the distortion of stable bonnet.Under vacuum environment, carry out in the whole heating and cooling process.
Referring to Fig. 4, encapsulation work chamber 300 comprises: housing 18 is used to form the seal operation environment; Upper cover plate 16, be used to carry the substrate behind the plated film, upper cover plate has adsorption plane 17 (being generally the plane), on this adsorption plane 17, be formed with the vacuum tank that is used to adsorb substrate, be formed with the exhaust tube that is communicated with described vacuum tank on the upper cover plate 16, this exhaust tube is connected with vacuum pump, is used to produce negative pressure and adsorbs substrate; Be used to carry the base of bonnet, this base has a plummer 20 that is used to carry bonnet, and base comprises bedframe and quartz glass, and this quartz glass is fixed on the bottom of base frames, and it is peripheral with for example sealing ring sealing; Guide locating device provided, be arranged between upper cover plate and the base, comprise the guide pillar 19 and the mark post that are fixed on the base; Lowering or hoisting gear 13,14, the plummer that is respectively applied for lifting upper cover plate and base is adjusted the distance of film plating substrate and bonnet, is used for realizing the preceding position processing of pressing encapsulation of film plating substrate and bonnet simultaneously.Described upper cover plate can mutually closed formed seal chamber be connected with a vacuum pump at least to limit the cavity of a sealing with described base, is used for seal chamber is bled and inflated
Still referring to Fig. 4, curing system 22 be installed in encapsulation work chamber 300 base below, generally form by the UV light source, be used for solidified glue, UV light is realized curing to glue by quartz glass.
Method and process that the above-mentioned packaging system of employing of the present invention comes solar cell encapsulation are described below.
How to realize with reference to the packaging technology that illustrates shown in Figure 1.Fig. 1 shows overall encapsulation flow chart.At first, manipulator takes out film plating substrate 1 and is sent to encapsulation work chamber 300 from substrate temporary room 100; Then, manipulator takes out bonnet 9 and is sent to encapsulation work chamber 300 from encapsulation pretreatment chamber 200, and substrate 1 and bonnet 9 are realized the pressing encapsulation in encapsulation work chamber 300 then; Be cured by 22 pairs of glue of UV curing system at last, manipulator takes out device and is exported by the finished product delivery outlet from the encapsulation work chamber.
The contraposition (location) in the encapsulation work chamber below in conjunction with operation that describes the substrate temporary room in method for packing of the present invention and the packaging system shown in Fig. 2,4 particularly in detail and film plating substrate.The ventricumbent film plating substrate 1 of plated film is sent to by roll wheel assembly 2 in the housing 3 of substrate temporary room, and wherein the zone of roll wheel assembly 2 contact substrates is non-plated film district 4, and the rete in plated film district 5 that does not touch substrate is with the plated film district of protection substrate 1; Then film plating substrate 1 is sent on the support 21 in the housing 18 of encapsulation work chamber 300 by manipulator; By 19 pairs of film plating substrate contrapositions of the guide pillar in the positioner, after contraposition finishes, upper cover plate 16 is being with upper cover plate 16 to descend by upper cover plate lifting assembly 13 under the control of motor, during contact plating film substrate 1, begin to bleed such as vacuum pump by air extractor, under the effect of negative pressure, the draw frame machine 15 of adsorption plane 17 is adsorbing film plating substrate 1, then rises to certain position by elevating mechanism 13 again.
Contraposition and the encapsulation stitching operation in the encapsulation work chamber in conjunction with operation that specifies encapsulation pretreatment chamber shown in Fig. 3,4 and bonnet.The bonnet 9 (glue faces up) of applied glue is sent in the housing 7 of encapsulation pretreatment chamber by roll wheel assembly 10, then driving push rods by lifting assembly 11 rises to bonnet 9 from the suitable position of heating component 8, close the gate valve 12 of housing then, pretreatment chamber vacuumizes to encapsulation, when vacuum degree reaches the 10-3Torr left and right sides, open 8 pairs of bonnets of heating component 9 and carry out bake out, temperature is controlled at below 200 ℃, stop heating after a few minutes, then open 9 coolings of 6 pairs of bonnets of cooling package.
After equitemperature cools down, pretreatment chamber 200 charges into inertia (normally nitrogen) gas to encapsulation, bonnet 9 is sent on the support 21 in the housing 18 of encapsulation work chamber 300 by manipulator then, then the guide pillar 19 by alignment device carries out being positioned on the base plummer 20 after the contraposition (location) to it; Then, be with bonnet 9 to rise to certain position, making the relative distance of bonnet 9 and substrate 1 between 2mm but be not limited thereto distance by plummer lifting assembly 14.At this moment, bonnet is parked in this position, and upper cover plate lifting assembly 13 is being with film plating substrate 1 to descend once more, make when film plating substrate 1 is about to contact with bonnet 9 distance about 0.02mm but be not limited thereto distance, stop to descend, close air extractor then (such as vacuum pump, not shown), and open the aerating device (not shown) and inflate via the vacuum tank of the adsorption plane of upper cover plate, this moment is by upper cover plate and base closure and air pressure in the seal chamber that limits rises gradually mutually, and the air pressure of device inside can't rise, and Nei Wai pressure difference forces substrate 1 and bonnet 9 close adhesion like this, and tree lace is pressed off gradually.
At last, turn on the UV lamp assembly 22 of curing system, solidified glue takes out device by the output of finished product delivery outlet, as shown in Figure 1 through manipulator.
Although with reference to the accompanying drawings, the structure and the method for packing of packaging system of the present invention is illustrated, above-mentioned disclosure only is in order to understand the present invention better, rather than limits the scope of claim by any way.So all equivalences of doing according to the described structure of patent claim of the present invention, feature and principle change or modify, and are included in protection scope of the present invention.
Claims (12)
1. encapsulation producing device that is used for solar cell, this solar cell comprises bonnet and substrate, and this bonnet and substrate combine by glue, it is characterized in that, and this encapsulation producing device comprises:
Encapsulation pretreatment chamber is used for before encapsulation described bonnet being carried out preliminary treatment;
The substrate temporary room is used for the substrate behind the temporary plated film;
The encapsulation work chamber is used for described substrate and described bonnet are packaged together; And
The curing system that is used for solidified glue;
Wherein, the described operation that encapsulates between pretreatment chamber, described substrate temporary room, described encapsulation work chamber and the described curing system is undertaken by manipulator;
Described encapsulation pretreatment chamber comprises:
Housing is used to limit a seal operation environment;
Be used for carrying the pulley assembly of bonnet thereon;
Be used to heat glue is carried out the heating component of degasification;
Be used to make the elevating mechanism of bonnet lifting; And
Be used to cool off the cooling package of bonnet;
Wherein, described pulley assembly, described heating component, described elevating mechanism and described cooling package are operated in described seal operation environment;
Described encapsulation work chamber comprises:
Housing is used to limit a seal operation environment;
The upper cover plate that is used for carrying substrates, described upper cover plate have a smooth adsorption plane, are formed with the vacuum tank that is used to adsorb substrate on this adsorption plane, and described upper cover plate comprises the exhaust tube that at least one is communicated with described vacuum tank;
Be used to carry the base of bonnet, described base has a plummer that is used to carry bonnet, described upper cover plate can mutually closed the seal chamber that is limited be connected with a vacuum pump at least to limit the cavity of a sealing with described base, is used for seal chamber is bled and inflated;
Guide locating device provided, the substrate and the cover plate that are used for transmission is entered the encapsulation work chamber position;
Be used to make the lowering or hoisting gear of upper cover plate lifting; And
Be used to make the lowering or hoisting gear of base lifting;
Wherein, described upper cover plate, described base, described guide locating device provided, the described lowering or hoisting gear that is used for making the upper cover plate lifting and describedly be used to make the lowering or hoisting gear of base lifting to operate at described seal operation environment.
2. encapsulation producing device according to claim 1 is characterized in that: described heating component is the infrared heating assembly, and described cooling package adopts cooling water to reach cooling effect.
3. encapsulation producing device according to claim 1, it is characterized in that: described substrate temporary room comprises a housing, this housing is used to limit a seal operation environment, in described substrate temporary room, has the pulley assembly that is used to carry film plating substrate, wherein this pulley assembly contacts with the non-plated film district of substrate, and this pulley assembly is operated in described seal operation environment.
4. encapsulation producing device according to claim 1 is characterized in that: the surface of the mutual closure of described upper cover plate and described base is provided with sealing ring and guide pillar that is used to locate and mark post.
5. according to claim 1 or 4 described encapsulation producing devices, it is characterized in that: described base comprises bedframe and quartz glass, and described quartz glass is fixed on the bedframe, and its periphery seals by sealing ring.
6. according to claim 1 or 4 described encapsulation producing devices, it is characterized in that: described curing system be arranged on the encapsulation work chamber base under, it sees through quartz glass glue is cured.
7. encapsulation producing device according to claim 6 is characterized in that: described glue is UV glue, and described curing system mainly is made up of the UV light source.
8. according to each described encapsulation producing device among the claim 1-4, it is characterized in that: described solar cell is a thin film solar cell.
9. the method that the encapsulation producing device that adopts each qualification among the aforesaid right requirement 1-8 comes solar cell encapsulation comprises the steps:
A) preliminary treatment before the encapsulation: the bonnet that is scribbled encapsulation glue is sent in the encapsulation pretreatment chamber by the pulley assembly that encapsulates pretreatment chamber and carries out preliminary treatment, promptly under vacuum environment bonnet is heated to eliminate bubble and the volatile materials in the glue; Cool off this cover plate by cooling package then, prevent distortion, and play the effect of stability; Wherein, bonnet scribbles one of glue and faces up,
B) location of film plating substrate: film plating substrate is sent in the film plating substrate temporary room by the roll wheel assembly of temporary room, by manipulator it is delivered to the mark post place of encapsulation work chamber then, then by the guide pillar of positioner it is located; After the location finished, the vacuum tank of the adsorption plane by upper cover plate was adsorbed on it on upper cover plate and rises to certain position; Wherein, substrate is coated with one of film and faces down, and pulley assembly contacts with the non-plated film district of substrate with manipulator,
C) location of bonnet: through pretreated bonnet, be sent to the mark post place of encapsulation work chamber, then it located by the guide pillar of positioner by manipulator; After the location finishes, place it on the base plummer of encapsulation work chamber,
D) pressing of bonnet and substrate encapsulation: bonnet and substrate are after contraposition, by the elevating mechanism in the encapsulation work chamber they are delivered to position contacting soon, then, in seal chamber, inflate, bonnet is pressed together under ambient pressure with substrate, and glue is evenly pushed; Wherein, whole encapsulation process is to carry out under the environment of inert gas, and to reduce moisture and the oxygen content in the seal chamber, bonnet and substrate are by before the pressing, and the distance between two surfaces of bonnet and substrate is greater than 0.02mm,
E) use curing system that glue is cured, finish curing after, open seal chamber, take out packaged device.
10. according to the method described in the claim 9, it is characterized in that: in the pre-treatment step before described encapsulation, the vacuum degree of vacuum environment is 10
-3Torr, heating-up temperature is less than 200 ℃.
11. the method according to described in claim 9 or 10 is characterized in that: described inert gas is nitrogen normally.
12. the method according to described in claim 9 or 10 is characterized in that: described solar cell is a thin film solar cell.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101109260A CN101295751B (en) | 2008-06-16 | 2008-06-16 | Solar cell encapsulation producing device and method for solar cell encapsulation |
| PCT/CN2008/073436 WO2009152672A1 (en) | 2008-06-16 | 2008-12-10 | Encapsulating apparatus for solar cells and encapsulating method for solar cells |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101109260A CN101295751B (en) | 2008-06-16 | 2008-06-16 | Solar cell encapsulation producing device and method for solar cell encapsulation |
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| Publication Number | Publication Date |
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| CN101295751A CN101295751A (en) | 2008-10-29 |
| CN101295751B true CN101295751B (en) | 2010-06-09 |
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| CN2008101109260A Expired - Fee Related CN101295751B (en) | 2008-06-16 | 2008-06-16 | Solar cell encapsulation producing device and method for solar cell encapsulation |
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| CN (1) | CN101295751B (en) |
| WO (1) | WO2009152672A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101295751B (en) * | 2008-06-16 | 2010-06-09 | 东莞宏威数码机械有限公司 | Solar cell encapsulation producing device and method for solar cell encapsulation |
| CN101859809B (en) * | 2009-04-09 | 2012-08-15 | 中国科学院物理研究所 | Solar cell encapsulation structure and preparation method thereof |
| CN101882669A (en) * | 2010-03-23 | 2010-11-10 | 东莞宏威数码机械有限公司 | Back-end process encapsulating component of organic light-emitting display and encapsulating method |
| CN104538564B (en) * | 2015-01-30 | 2017-02-15 | 合肥京东方光电科技有限公司 | Packaging device |
| WO2016169018A1 (en) * | 2015-04-23 | 2016-10-27 | 华为技术有限公司 | Lamination device and method |
| CN105522806B (en) * | 2016-01-27 | 2017-07-28 | 宁波维真显示科技股份有限公司 | Optics binding device and method |
| CN109378287A (en) * | 2018-11-15 | 2019-02-22 | 中芯长电半导体（江阴）有限公司 | Semiconductor encapsulation device |
| CN109524555B (en) * | 2018-11-26 | 2020-08-18 | 西安交通大学 | Moisture and oxygen removing packaging device for perovskite/silicon laminated solar cell module |
| CN110534665B (en) * | 2019-07-16 | 2022-04-05 | 福建华佳彩有限公司 | Substrate arrangement caching device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201222508Y (en) * | 2008-06-16 | 2009-04-15 | 东莞宏威数码机械有限公司 | Encapsulation preparation device for solar battery |
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| DE3238187C2 (en) * | 1982-10-15 | 1984-08-09 | Messerschmitt-Bölkow-Blohm GmbH, 8000 München | Process for the manufacture of solar generators |
| CA2141946A1 (en) * | 1993-06-11 | 1994-12-22 | Johann Falk | Process and device for manufacturing photovoltaic modules |
| US5993582A (en) * | 1996-08-13 | 1999-11-30 | Canon Kabushiki Kaisha | Continuous vacuum lamination treatment system and vacuum lamination apparatus |
| JP2000236104A (en) * | 1999-02-15 | 2000-08-29 | Canon Inc | Manufacturing method of laminate |
| CN1209823C (en) * | 2003-06-05 | 2005-07-06 | 上海交通大学 | Automatic solar battery packaging mechanism |
| GB0315846D0 (en) * | 2003-07-07 | 2003-08-13 | Dow Corning | Solar cells and encapsulation thereof |
| CN101295751B (en) * | 2008-06-16 | 2010-06-09 | 东莞宏威数码机械有限公司 | Solar cell encapsulation producing device and method for solar cell encapsulation |
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| CN201222508Y (en) * | 2008-06-16 | 2009-04-15 | 东莞宏威数码机械有限公司 | Encapsulation preparation device for solar battery |
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| CN101295751A (en) | 2008-10-29 |
| WO2009152672A1 (en) | 2009-12-23 |
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