CN101276083B - Display panel suitable for laser cutting technique and master panel thereof - Google Patents
Display panel suitable for laser cutting technique and master panel thereof Download PDFInfo
- Publication number
- CN101276083B CN101276083B CN2008100956946A CN200810095694A CN101276083B CN 101276083 B CN101276083 B CN 101276083B CN 2008100956946 A CN2008100956946 A CN 2008100956946A CN 200810095694 A CN200810095694 A CN 200810095694A CN 101276083 B CN101276083 B CN 101276083B
- Authority
- CN
- China
- Prior art keywords
- motherboard
- metal level
- distance
- frame glue
- inside surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention provides a display panel which is fit for laser cutting technology and its mother panel. The display panel includes two substrates which are opposite set, a frame sealant and a buffer metal layer. The frame sealant is placed between two substrates. The buffer metal layer is formed on the internal surface of at least one of the two substrates, the buffer metal layer is mounted along the frame sealant and at least partial buffer metal layer is location outside the frame sealant, the edge of the buffer metal layer to the edge of the substrate has a first distance. The invention provides the buffer metal layer to avoid that the heat energy radially dispersed from the laser to the lower of the mother panel damages the frame sealant and the organic materials near the cutting line, making the produced display panel have excellent quality, improving the product qualification ratio.
Description
Technical field
The present invention relates to a kind of display panel and motherboard thereof, and be particularly related to a kind of suitable laser cutting technique and have display panel and the motherboard thereof that cushions metal level.
Background technology
In general, the cutting technique of glass often utilizes diamond cutter, water cutter or cut.Wherein in cut, it utilizes lasing light emitter generation heat energy that the molecular binding of glass is interrupted, and by follow-up cooling device the molecule that breaks off is lowered the temperature again, by the mode of expanding with heat and contract with cold, reaches the purpose of cutting apart glass.
Please be simultaneously with reference to Figure 1A and Figure 1B, Figure 1A shows the synoptic diagram of tradition with laser cutting technique cutting motherboard of liquid crystal display, Figure 1B shows near the motherboard up and down the predetermined cuts line and the partial schematic diagram of frame glue among Figure 1A.Motherboard of liquid crystal display 10 comprises first motherboard 11 and second motherboard 13, is filled with liquid crystal between the two and with 16 pairs of groups of frame glue, first motherboard 11 and second motherboard 13 for example are respectively to have chromatic filter layer and a plurality of transistorized motherboard.Motherboard of liquid crystal display 10 can be by cut first motherboard 11 and second motherboard 13 and is formed a plurality of display panels 15.Have a viewing area 51 and circuit joint zone (IC bonding area) 53 at each display panel 15, and frame glue 16 correspondences be arranged at viewing area 51 around.Shown in Figure 1A, LASER Light Source C cuts first motherboard 11 along the predetermined cuts line 19 on first motherboard 11.
Please, generally have metal mold or resin type black matrix (resin black matrix) 17 between first motherboard 11 and the frame glue 16 with reference to Figure 1B.In the organic material layer that for example is first motherboard, 11 belows of chromatic filter layer, except resin type black matrix 17 also can comprise flatness layer (overcoat) 18.When carrying out cut, generally laser beam 30 is deformed into long ellipticity, its width D 30 is about between the 1mm to 1.4mm.Yet the distance B 16 (being shown among Figure 1A) of black matrix" 17 to predetermined cuts line 19 or frame glue 16 edges to predetermined cuts line 19 is generally between 0.3mm-0.5mm; In some special constructions, this distance possibly more be reduced to 0.2mm, so the width D 30 of laser beam 30 surpasses this distance significantly.And cut belongs to a kind of heat processing technique; These heat energy that are added in first motherboard 11 or second motherboard 13 of glass can have influence on the material of below; Comprise frame glue 16 and organic material layer (only can bear about 200 ℃ of temperature), for example resin type black matrix under first motherboard 11 shown in Figure 1B 17 and flatness layer 18.Moreover along with the development of industry, except the distance B 16 of edge to the predetermined cuts line 19 of frame glue 16 shortens gradually, the thickness of first motherboard 11 and second motherboard 13 itself is also more and more thinner.For thin more glass mother board; The heat energy that comes like radial diffusion downwards when it carries out cut is bigger for the influence that the frame glue 16, resin type black matrix 17 and the flatness layer 18 (organic material) that are close to line of cut are caused; Cause frame glue 16 with organic material thawing, cracking or peel off probably; Cause display panels 15 to produce defective, and then product percent of pass is descended.
Therefore, the heat energy that how to solve laser beam is for the problem that causes damage on sealing 16 or the motherboard near the organic material at laser cut line place, is one of direction of endeavouring of industry.
Summary of the invention
The present invention is relevant for a kind of display panel and motherboard thereof of suitable laser cutting technique; It is by the buffering metal level is set; To avoid when the cut; The heat energy that laser comes like radial diffusion to the motherboard below destroys the frame glue and the organic material of contiguous line of cut, makes the display panel of processing have good quality, promotes product percent of pass.
According to the present invention, a kind of display panel is proposed, comprise first substrate and second substrate, a frame glue and the buffering metal level that are oppositely arranged.The frame plastic clip places between two substrates.The buffering metal level is formed at two substrates at least on one of them the inside surface, and the buffering metal level is positioned at the frame glue outside along the buffering metal level of the setting of frame glue and at least a portion, and buffering metal level outer rim to substrate edges has one first distance.
According to the present invention, reintroduce a kind of motherboard of liquid crystal display, comprise a plurality of display panels.Wherein motherboard of liquid crystal display also comprises first motherboard and second motherboard, a frame glue and a buffering metal level that is oppositely arranged.Wherein two motherboards respectively have an inside surface and outside surface respectively, and each inside surface of two motherboards is oppositely arranged, and its outside surface has a predetermined cuts line respectively.The frame plastic clip places between each inside surfaces of two motherboards and to be positioned at corresponding predetermined cuts line inboard.The buffering metal level is formed at two motherboards at least on one of them the inside surface, and the buffering metal level is positioned at the frame glue outside along the buffering metal level of the setting of frame glue and at least a portion, and buffering metal level outer rim to predetermined cuts line has one first distance.
In embodiments of the present invention, first distance of buffering metal level outer rim to substrate edges (or predetermined cuts line) is less than the second distance at resin type black matrix outer rim to a substrate (like a colored optical filtering substrates) edge.First distance has 5 μ m at least; For example between 5 μ m to the 300 μ m, between 5 μ m to the 200 μ m, or between 5 μ m to the 100 μ m; When being applied to thin substrate of cut or the very little structural design of distance between frame glue and the predetermined cuts line; First distance of buffering metal level outer rim to substrate edges can preferably be set at 5-20 μ m, the damage that avoids receiving laser heat energy with the frame glue of protecting contiguous line of cut or organic material.
For letting the foregoing of the present invention can be more obviously understandable, hereinafter is special lifts preferred embodiment, and conjunction with figs., elaborates as follows.
Description of drawings
Figure 1A shows the synoptic diagram of tradition with laser cutting technique cutting motherboard of liquid crystal display.
Figure 1B shows near motherboard up and down and the partial schematic diagram of frame glue the predetermined cuts line among Figure 1A.
Fig. 2 A shows the synoptic diagram according to the motherboard of liquid crystal display of first embodiment of the invention.
Fig. 2 B displayed map 2A is along the synoptic diagram of the section of AA ' line segment.
Fig. 3 shows the synoptic diagram according to the section of the display panel of first embodiment of the invention.
Fig. 4 shows the buffering metal level and the vertical view of frame glue on the colorized optical filtering motherboard of first embodiment of the invention.
Fig. 5 shows the buffering metal level and the vertical view of frame glue on the transistor motherboard of first embodiment of the invention.
Fig. 6 shows the synoptic diagram according near the cross section of the second embodiment of the invention motherboard of liquid crystal display predetermined cuts line.
Fig. 7 shows the cut-away section synoptic diagram of formed single display panels behind the cutting second embodiment of the invention motherboard of liquid crystal display.
And the description of reference numerals in the above-mentioned accompanying drawing is following:
10,1000,2000: motherboard of liquid crystal display
11: the first motherboards
13: the second motherboards
15: display panels
16,150: frame glue
17,750: resin type black matrix
18: flatness layer
19, L0, L1, L2, L70: predetermined cuts line
30: laser beam
51, A100: viewing area
53,130a, 330a, 530a: circuit joint zone
100,700: display panel
110,310,510,710: colored optical filtering substrates
110 ', 130 ', 700 ': the edge
111: red color area
112,132,1100 ', 1300 ', 7100 ', 7300 ': inside surface
113: green district
115: blue region
130,330,530,730: transistor base
131: transistor
133: electric capacity
150 ': a side of frame glue
170,370,570,770: the buffering metal level
170a, 170b, 770b: the subregion of buffering metal level
190: liquid crystal layer
370 ': inner side edge
790: organic sheath
790a: the subregion of organic sheath
1100,3100,7100: the colorized optical filtering motherboard
1300,3300,7300: the transistor motherboard
C: LASER Light Source
D16: distance
D170, D170 ', D770: first distance
D750, D750 ': second distance
D150, D150 ': the 3rd distance
D30: width
P0: location point
Embodiment
The present invention proposes a kind of display panel and motherboard thereof of suitable laser cutting technique.Display panel comprises two substrates, a frame glue and a buffering metal level that is oppositely arranged.The two substrates that is oppositely arranged comprises one first substrate and one second substrate.The frame plastic clip places between two substrates.The buffering metal level is formed at two substrates at least on one of them the inside surface, and the buffering metal level is positioned at the frame glue outside along the buffering metal level of the setting of frame glue and at least a portion, and buffering metal level outer rim to substrate edges has one first distance.Below each embodiment the embodiment according to display panel of the present invention and motherboard thereof will be described; Yet the content that embodiment proposed; Being merely the usefulness that the present invention illustrates, is not the usefulness as limit protection domain of the present invention, and the scope that the present invention protected is as the criterion with claim.Moreover the diagram of embodiment is also omitted unnecessary element, in order to clear demonstration technical characterstic of the present invention.
First embodiment
Please with reference to Fig. 2 A and Fig. 2 B, Fig. 2 A shows the synoptic diagram according to the motherboard of liquid crystal display of first embodiment of the invention.Fig. 2 B displayed map 2A is along the synoptic diagram of the section of AA ' line segment.Motherboard of liquid crystal display 1000 comprises two motherboards, a frame glue 150 and a buffering metal level 170 that is oppositely arranged.Two motherboards that are oppositely arranged comprise a colorized optical filtering motherboard 1100 and a transistor motherboard 1300, and its outside surface all has predetermined cuts line L0 and L2.In addition, the outside surface of colorized optical filtering motherboard 1100 also has predetermined cuts line L1.Frame glue 150 is folded in two motherboards 1100 and 1300 and is positioned at the inboard of corresponding predetermined cuts line L0, L1 and L2.Buffering metal level 170 is formed at two motherboards 1100 and 1300 at least on one of them the inside surface 1100 ' or 1300 ', and buffering metal level 170 outer rims have one first distance B 170 to predetermined cuts line L0.
Wherein, motherboard of liquid crystal display 1000 comprises a plurality of display panels 100.Each display panel 100 is defined by predetermined cuts line L0, L1 and L2.Each display panel 100 has a viewing area A100.Frame glue 150 and buffering metal level 170 are along the outer rim setting of each viewing area A100.Further, frame glue 150 and buffering metal level 170 are between each viewing area A100 and predetermined cuts line L0, L1 and L2.In the present embodiment, the distance of each predetermined cuts line L0, L1 and the L2 of buffering metal level 170 to correspondence is all first distance B 170.The subregion 170a of buffering metal level 170 is provided with along frame glue 150, and buffering metal level 170 at least another part zone 170b be positioned at frame glue 150 outsides.
Please be simultaneously with reference to Fig. 2 A and Fig. 3, Fig. 3 shows the synoptic diagram according to the section of the display panel of first embodiment of the invention.After motherboard of liquid crystal display 1000 cuttings, form a plurality of display panels 100.Display panel 100 comprises a colored optical filtering substrates 110 and a transistor base 130 that is oppositely arranged.Colored optical filtering substrates 110 is formed by predetermined cuts line L0, L1 and the L2 cutting of colorized optical filtering motherboard 1100 along correspondence.Transistor base 130 is formed by the predetermined cuts line L0 and the L2 cutting of transistor motherboard 1300 along correspondence.Therefore, Fig. 3 is the synoptic diagram of motherboard of liquid crystal display 1000 in the cutting back along the section of BB ' line segment of Fig. 2, and colorized optical filtering motherboard 1100 defines the edge 110 ' of colored optical filtering substrates 110 among Fig. 3 along predetermined cuts line L2 cutting.
The display panel 100 that cuts out is as shown in Figure 3, and each display panel 100 has frame glue 150, buffering metal level 170 and viewing area A100.Frame glue 150 is folded in two substrates 110 and 130, in order to fixing two substrates 110 and 130.In the present embodiment, buffering metal level 170 is formed on the inside surface 112 and 132 of two substrates 110 and 130.With colored optical filtering substrates 110 is example, and buffering metal level 170 is formed on the inside surface 112 of colored optical filtering substrates 110, and between colored optical filtering substrates 110 and frame glue 150.The edge 110 ' of buffering metal level 170 outer rims to colored optical filtering substrates 110 has one first distance B 170 ', its in fact with Fig. 2 B in buffering metal level 170 outer rims identical to first distance B 170 of predetermined cuts line L2.In addition, the edge 110 ' of frame glue 150 outer rims to colored optical filtering substrates 110 has one the 3rd distance B 150 '.And first distance B 170 ' is less than the 3rd distance B 150 '.
In Fig. 3, insert and put a liquid crystal layer 190 between colored optical filtering substrates 110, transistor base 130 and the frame glue 150.The inside surface 1100 ' of colorized optical filtering motherboard 1100 (being shown among Fig. 2 B) has a chromatic filter layer, and the inside surface 1300 ' of transistor motherboard 1300 (being shown among Fig. 2 B) then has a plurality of transistors that are arrayed and a plurality of metal levels that are connected with transistor.
Therefore; The inside surface 112 of the colored optical filtering substrates 110 after the cutting has chromatic filter layer, a plurality of metal levels (not being shown among the figure) that transistor base 130 inside surfaces 132 then have a plurality of transistors 131 that are arrayed, a plurality of electric capacity 133 and are connected with transistor 131.The chromatic filter layer of colored optical filtering substrates 110 has a plurality of chromatic zoneses, for example red color area 111, green district 113 and blue region 115.Each chromatic zones of colored optical filtering substrates 110 corresponds to transistor base 130 one of them transistor 131 and an electric capacity 133.Display panel 100 is by the transistor 131 of each chromatic zones of control, with the A100 display frame in the viewing area.
Below, with doing explanation with the buffering metal level 170 that is positioned at colored optical filtering substrates 110 sides earlier.Wherein, display panel 100 comprises that also black matrix" is positioned at the inside surface 112 of colored optical filtering substrates 110, and black matrix" is in order to block the outer light of viewing area A100, and the material of black matrix" for example is metal or resin.In this embodiment, black matrix" for example is the metal mold black matrix", and the buffering metal level then can comprise this metal mold black matrix".In the present embodiment, buffering metal level 170 as shown in Figure 3 is a metal mold black matrix" of colored optical filtering substrates 110.
The cutting of colorized optical filtering motherboard 1100 is shown in Fig. 2 B, and predetermined cuts line L0 is the precalculated position of cut.The lasing light emitter of cut for example is carbon dioxide (CO
2) laser, its wavelength is about 10.6 μ m.This corresponds to the CO of ultrared wavelength coverage
2Laser is prone to helped the hot-working program by colorized optical filtering motherboard 1100 absorptions of glass.The cutting method of colorized optical filtering motherboard 1100 is on predetermined cuts line L0, to depict earlier an initial slight crack on the edge of.Afterwards, lasing light emitter is along this initial slight crack heating.When lasing light emitter passes through the position of colorized optical filtering motherboard 1100 corresponding predetermined cuts line L0; The molecular binding of the glass of colorized optical filtering motherboard 1100 is interrupted along predetermined cuts line L0 because of the heat energy of lasing light emitter, and the molecular binding that is disconnected then utilizes the cooling system cooling again.The position through corresponding predetermined cuts line L0 fully when lasing light emitter, and glass also lower the temperature finish after, colorized optical filtering motherboard 1100 is split into two.
In addition, shown in Fig. 2 B, frame glue 150 outer rims have one the 3rd distance B 150 to predetermined cuts line L0, and first distance B 170 is less than the 3rd distance B 150.The 3rd distance B 150 is identical in fact with the 3rd distance B 150 ' at the edge 110 ' of Fig. 3 center glue 150 outer rims to colored optical filtering substrates 110.When lasing light emitter arrives at the location point P0 of predetermined cuts line L0, the heat energy that lasing light emitter provided from location point P0 with radial mode to around transmit.Because the subregion 170b of buffering metal level 170 protrudes from frame glue 150 outsides, the regional 170b of buffering metal level 170 at first receives the heat energy that transmits via colorized optical filtering motherboard 1100 from location point P0.Because the material of buffering metal level 170 is a metal material, therefore cushioning metal level 170 has excellent thermal conductivity, and the heat energy of lasing light emitter then is passed to regional 170a via the regional 170b of buffering metal level 170.That is to say that from the heat energy that colorized optical filtering motherboard 1100 outwards transmits, wherein the overwhelming majority is all absorbed, conducts and disperseed by buffering metal level 170.Therefore buffering metal level 170 is able to bearer bar glue 150 and other organic materials, can not destroy its character because of absorbing heat energy.
Generally speaking, frame glue 150 outer rims to the 3rd distance B 150 of predetermined cuts line L0 is usually between 300 μ m to 500 μ m.In embodiments of the present invention, buffering metal level 170 outer rims to first distance B 170 of predetermined cuts line L0 has 5 μ m at least, and preferably between between 5 μ m to the 300 μ m or between 5 μ m to the 200 μ m or between 5 μ m to the 100 μ m.When the very little structural design of using between the present invention's substrate thin or frame glue 150 outer rims and the predetermined cuts line L0 of the 3rd distance B 150 with cut; First distance B 170 of buffering metal level 170 outer rims and predetermined cuts line L0 can preferably be set between 5 μ m to the 20 μ m, the damage that avoids receiving laser heat energy with the frame glue of protecting contiguous line of cut or organic material.
The buffering metal level is set on the colorized optical filtering motherboard
Relativeness between buffering metal level and the frame glue below will be described when buffering metal level and frame glue are set on the colorized optical filtering motherboard.Please with reference to Fig. 4, it shows the buffering metal level and the vertical view of frame glue on the colorized optical filtering motherboard of first embodiment of the invention.One colorized optical filtering motherboard 3100 is cut into a plurality of colored optical filtering substrates 110,310 and 510 with predetermined cuts line L0, L1 and L2.Buffering metal level on each colored optical filtering substrates 110,310 and 510 can be identical or different.For instance, in colored optical filtering substrates 110, buffering metal level 170 is a rectangular box-like metal level.Frame glue 150 is provided with along the inboard of rectangular box-like buffering metal level 170.In colored optical filtering substrates 310; Buffering metal level 370 is the metal level of four strips; It is distributed in four limits of colored optical filtering substrates 310, and the width of buffering metal level 370 is enough to cover the width of frame glue 150, and the inner side edge 370 ' of frame glue 150 inner edges and buffering metal level 370 has a distance.As for colored optical filtering substrates 510, buffering metal level 570 is the metal level of a plurality of sections, and said a plurality of metal level segments apart is provided with.The position of frame glue 150 is to be arranged in the buffering metal level 570 of these sections.Though colorized optical filtering motherboard 3100 is done explanation to be cut into different colored optical filtering substrates 110,310 and 510; Yet the present invention is not as limit; The colorized optical filtering motherboard 1100 of Fig. 2 B also can be cut into a plurality of same color optical filtering substrates 110, so that the motherboard of liquid crystal display 1000 of Fig. 2 A can be cut to a plurality of display panels 100.
Therefore; Shown in Fig. 2 B; So long as buffering metal level 170 outer rims than frame glue 150 outer rims more near predetermined cuts line L0, the heat absorption, conduction and the dispersion that produce when making buffering metal level 170 be able to bearer bar glue 150 will cut all can be used as the buffering metal level of the embodiment of the invention.And the shape of buffering metal level; And shown in the relative position between buffering metal level and the frame glue is can be like three kinds of being appeared among Fig. 4 multi-form; Yet those of ordinary skills are when can disclosing according to the embodiment of the invention when practical application; And do to modify and change, but not only limit to the implementation method among Fig. 4 according to application conditions.
The buffering metal level is set on the transistor motherboard
In addition, buffering metal level 170 as shown in Figure 3 also can be formed on the inside surface 132 of transistor base 130 except being arranged on the aforesaid colored optical filtering substrates 110, that is to say, buffering metal level 170 is between transistor base 130 and frame glue 150.Be positioned at the buffering metal level 170 of the inside surface 132 of transistor base 130, its sectional view structure and characteristic are identical with buffering metal level 170 on being formed at colored optical filtering substrates 110, omit narration at this.
Relativeness between buffering metal level and the frame glue below will be described when buffering metal level and frame glue are set on the transistor motherboard.Please with reference to Fig. 5, it shows the buffering metal level and the vertical view of frame glue on the transistor motherboard of first embodiment of the invention.Transistor motherboard 3300 can be cut into a plurality of identical or different transistor bases with predetermined cuts line L0 and L2, does explanation at this transistor motherboard 3300 to cut out different transistors substrate 130,330 and 530.Each colorized optical filtering motherboard 3100 of relative position and Fig. 4 that cushions metal level 170,370 and 570 its relative positions and frame glue 150 is identical, therefore repeats no more.
Wherein, have each corresponding electrical circuits engaging zones 130a, 330a and 530a in each transistor base 130,330 and 530.Different with the colorized optical filtering motherboard of Fig. 4 3100 is, transistor motherboard 3300 does not have the predetermined cuts line L1 of the colorized optical filtering motherboard 3100 of Fig. 4, and circuit joint zone 130a, 330a and 530a have electric connection pad and lead need be set and be electrically connected.Therefore, buffering metal level 170,370 and 570 is not in the side near circuit joint zone 130a, 330a and 530a, and promptly a side 150 ' of frame glue 150 is provided with.As shown in Figure 3, the circuit joint zone 130a of the transistor base 130 of the display panel 100 after the cutting more protrudes than colored optical filtering substrates 110.
To sum up; Described display panel of first embodiment of the invention and motherboard thereof; The subregion 170b of buffering metal level 170 is arranged at the outside of frame glue 150, and when the cut, the heat energy that lasing light emitter provided can't destroy frame glue 150 with protection motherboard of liquid crystal display 1000.Preferably, buffering metal level 170 is the metal mold black matrix" of colored optical filtering substrates 110 and transistor base 130.Buffering metal level 170 also can block unnecessary light and get into viewing area A100 except bearer bar glue 150.
Second embodiment
The display panels of second embodiment of the invention and motherboard thereof are that with the different part of first embodiment black matrix" of present embodiment is a resin type black matrix (resin black matrix).All the other and aforementioned something in common are represented with same numeral and are repeated no more.
Please with reference to Fig. 6, it shows the synoptic diagram according near the cross section of the second embodiment of the invention motherboard of liquid crystal display predetermined cuts line.Motherboard of liquid crystal display 7000 can be cut into a plurality of display panels 700.Wherein motherboard of liquid crystal display 7000 also comprises colorized optical filtering motherboard 7100, transistor motherboard 7300, frame glue 150, resin type black matrix 750 and buffering metal level 770.Colorized optical filtering motherboard 7100 has predetermined cuts line L70 respectively with transistor motherboard 7300.Frame glue 150 is folded in two motherboards 7100 and 7300 and is positioned at corresponding predetermined cuts line L70 inboard.Buffering metal level 770 outer rims have one first distance B 770 to predetermined cuts line L70.And resin type black matrix 750 is for being subject to the vitiable a kind of organic material of LASER HEAT.
In the present embodiment, metal level 770 is formed at the inside surface 7100 ' of colorized optical filtering motherboard 7100 and the inside surface 7300 ' of transistor motherboard 7300 is done explanation to cushion.Yet those of ordinary skills should know the buffering metal level and can only be arranged at one of them inside surface of two motherboards up and down, and the present invention is to this and seldom limit.
As shown in Figure 6; Please with reference to the part of colorized optical filtering motherboard 7100; Resin type black matrix 750 is positioned at the inside surface 7100 ' of colorized optical filtering motherboard 7100, and the resin type black matrix 750 that is positioned at 7100 of frame glue 150 and colorized optical filtering motherboards separates with colorized optical filtering motherboard 7100 by buffering metal level 770.The resin type black matrix 750 that is arranged at colorized optical filtering motherboard 7100 sides is in order to block the light outside display device 700 viewing areas.Wherein resin type black matrix 750 outer rims have a second distance D750 to predetermined cuts line L70, and first distance B 770 is less than second distance D750, and second distance D750 is identical in fact to the 3rd distance B 150 of predetermined cuts line L70 with frame glue 150 outer rims.The subregion 770b of buffering metal level 770 protrudes from resin type black matrix 750, and with when the cut, protection resin type black matrix 750 is unlikely the destruction that receives the heat energy that lasing light emitter provides.
In addition, motherboard of liquid crystal display 7000 comprises that also an organic sheath (like flatness layer) 790 is positioned at the inside surface 7100 ' of colorized optical filtering motherboard 7100.The subregion 790a that is positioned at organic sheath 790 of 7100 of frame glue 150 and colorized optical filtering motherboards separates with colorized optical filtering motherboard 7100 by buffering metal level 770.Buffering metal level 770 is in order to when the cut, and the subregion 790a that protects organic sheath 790 to correspond to frame glue 150 is unlikely the destruction that receives the heat energy that lasing light emitter provides.
Moreover; Structure and mutual relationships thereof such as the buffering metal level 770 at transistor motherboard 7300 places, resin type black matrix 750 and organic sheath 790; Then can be with reference to the explanation of above-mentioned colorized optical filtering motherboard 7100 parts; For example organic sheath 790 is positioned at the inside surface 7300 ' of transistor motherboard 7300, and the subregion 790a that is positioned at organic sheath 790 of 7300 of frame glue 150 and transistor motherboards separates with transistor motherboard 7300 by buffering metal level 770 ... Or the like, this no longer being described herein more.
Please be simultaneously with reference to Fig. 6 and Fig. 7.Fig. 7 shows the cut-away section synoptic diagram of formed single display panels behind the cutting second embodiment of the invention motherboard of liquid crystal display.Predetermined cuts line L70 by Fig. 6 carries out can forming a plurality of display panels 700 after the cut to motherboard of liquid crystal display 7000; And after cut; The position of the predetermined cuts line L70 of former Fig. 6 is corresponding with the 700 ' position, edge of display panel 700 among Fig. 7; Therefore the edge 700 ' of resin type black matrix 750 outer rims to display panel 700 has a second distance D750 ' (Fig. 7), and this second distance D750 ' is identical in fact to the second distance D750 (Fig. 6) of predetermined cuts line L70 with resin type black matrix 750 outer rims.Certainly; Formed each display panel 700 in cutting back has multinomial elements such as resin type black matrix 750 and organic sheath 790; And relevant between said a plurality of element is provided with position and annexation also with (please with reference to aforementioned relevant explanation) shown in Figure 6, repeats no more at this.
Described display panel of second embodiment of the invention and motherboard thereof are by being arranged on buffering metal level 770 between resin type black matrix 750 and the substrate to avoid the damage of laser heat energy to substrate below organic material (like resin type black matrix 750 and organic sheath 790).The buffering metal level 770 of present embodiment has the subregion 770b of the buffering metal level 770 that protrudes from frame glue 150 and resin type black matrix 750, and the heat energy that lasing light emitter is provided is able to absorb, conduct and disperse by buffering metal level 770.Therefore cushion the destruction that metal level 770 can protect the subregion 790a of resin type black matrix 750, frame glue 150 and organic sheath 790 corresponding frame glue 150 to avoid receiving heat energy.And buffering metal level 770 outer rims to substrate edges/predetermined cuts line first apart from also can having 5 μ m at least, for example between 5 μ m to the 300 μ m or between 5 μ m to the 200 μ m or between 5 μ m to the 100 μ m like the scope that first embodiment is proposed; Even in the application that has small distance very between the application of ultra-thin substrate or frame glue 150 outer rims and predetermined cuts line L70, buffering metal level 770 outer rims and substrate edges/predetermined cuts line first apart from can preferably being set at 5 μ m to 20 μ m.
Though disclosed display panel of the above embodiment of the present invention and motherboard thereof, with the edge of buffering metal level than frame glue more near the edge after the display panel cut, bearer bar glue is avoided being destroyed by heat energy and is done explanation.The buffering metal level also can be used for protecting other heat labile materials (like organic material).So long as the more said a plurality of heat labile materials in subregion that make the buffering metal level to absorb the purpose that heat energy reaches the thermo-labile material of protection, all belong to category of the present invention more near the predetermined cuts line of motherboard of liquid crystal display.
Moreover, if display panel structure uses the metal mold black matrix", then can combine original metallic type black matrix" technology and the present invention to cushion the notion of metal level, to reach the protection effect; If display panel structure uses resin type black matrix, then can between resin type black matrix and substrate, form buffering metal level of the present invention.
Therefore, the display panel of the above embodiment of the present invention and use its motherboard, the organic material in the buffering metal level protection display panel avoids motherboard of liquid crystal display when cutting, and its heat energy destroys organic material.Particularly when the transistor motherboard of motherboard of liquid crystal display or colorized optical filtering motherboard are more and more thinner; Or frame glue outer rim is when more and more nearer apart from the predetermined cuts line of motherboard of liquid crystal display; But buffering metal level bearer bar glue of the present invention or other organic materials are avoided being destroyed by heat energy, to improve the qualification rate of display panel.
In sum, though the present invention with preferred embodiment openly as above, yet it is not in order to limit the present invention.Those of ordinary skill in the technical field is not breaking away from the spirit and scope of the present invention, when doing various changes and retouching under the present invention.Therefore, protection scope of the present invention is as the criterion when looking the scope that claim defined of enclosing.
Claims (25)
1. display panel comprises:
Two substrates that are oppositely arranged; Comprise one first substrate and one second substrate; Wherein this first substrate and this second substrate are respectively a colored optical filtering substrates and a transistor base; The inside surface of this colored optical filtering substrates has a chromatic filter layer, and the inside surface of this transistor base then has a plurality of transistors that are arrayed and a plurality of metal levels that are connected with said a plurality of transistors;
One frame glue is folded between said two substrates; And
One buffering metal level; Wherein this buffering metal level is positioned on the inside surface of inside surface and this transistor base of this colored optical filtering substrates; This buffering metal level is positioned at this frame glue outside along this buffering metal level of this frame glue setting and at least a portion, and this buffering metal level outer rim to this substrate edges has one first distance.
2. display panel as claimed in claim 1 wherein should cushion metal level between this substrate and this frame glue.
3. display panel as claimed in claim 1, wherein this first distance is between 5 to 300 μ m.
4. display panel as claimed in claim 1, wherein this first distance is between 5 to 200 μ m.
5. display panel as claimed in claim 1, wherein this first distance is between 5 to 100 μ m.
6. display panel as claimed in claim 1, wherein this first distance is between 5 to 20 μ m.
7. display panel as claimed in claim 1, wherein this buffering metal level comprises that a metal mold black matrix" is positioned at the inside surface of this colored optical filtering substrates.
8. display panel as claimed in claim 1 comprises that also an organic material layer is positioned at the inside surface of this colored optical filtering substrates, and this organic material layer is positioned between this buffering metal level and this frame glue.
9. display panel as claimed in claim 8, wherein this organic material layer is a resin type black matrix.
10. display panel as claimed in claim 9, wherein this resin type black matrix to this colored optical filtering substrates edge has a second distance, and this first distance is less than this second distance.
11. display panel as claimed in claim 1 comprise that also an organic sheath is positioned at the inside surface of this transistor base, and this organic sheath is positioned between this buffering metal level and this frame glue.
12. display panel as claimed in claim 1, wherein this frame glue outer rim to this substrate edges has one the 3rd distance, and this first distance is less than the 3rd distance.
13. a motherboard of liquid crystal display comprises a plurality of display panels, wherein this motherboard of liquid crystal display comprises:
Two motherboards that are oppositely arranged; Comprise one first motherboard and one second motherboard; Each has an inside surface and outside surface respectively wherein said two motherboards; Respectively this inside surface of said two motherboards is oppositely arranged, and the outside surface of its said two motherboards has a predetermined cuts line respectively, and wherein this first motherboard and this second motherboard are respectively a colorized optical filtering motherboard and a transistor motherboard; The inside surface of this colorized optical filtering motherboard has a chromatic filter layer, and the inside surface of this transistor motherboard then has a plurality of transistors that are arrayed and a plurality of metal levels that are connected with said a plurality of transistors;
One frame glue is folded in respectively between this inside surface and to be positioned at corresponding said a plurality of predetermined cuts lines inboard of said two motherboards; And
One buffering metal level; And wherein this buffering metal level is positioned on the inside surface of inside surface and this transistor motherboard of this colorized optical filtering motherboard; This buffering metal level is positioned at this frame glue outside along this buffering metal level of this frame glue setting and at least a portion, and this buffering metal level outer rim to this predetermined cuts line has one first distance.
14. motherboard of liquid crystal display as claimed in claim 13 wherein should cushion metal level between said two motherboards and this frame glue.
15. motherboard of liquid crystal display as claimed in claim 13, wherein this first distance is between 5 to 300 μ m.
16. motherboard of liquid crystal display as claimed in claim 13, wherein this first distance is between 5 to 200 μ m.
17. motherboard of liquid crystal display as claimed in claim 13, wherein this first distance is between 5 to 100 μ m.
18. motherboard of liquid crystal display as claimed in claim 13, wherein this first distance is between 5 to 20 μ m.
19. motherboard of liquid crystal display as claimed in claim 13, wherein this buffering metal level comprises that a metal mold black matrix" is positioned at the inside surface of this colorized optical filtering motherboard.
20. motherboard of liquid crystal display as claimed in claim 13 comprises that also an organic material layer is positioned at the inside surface of this colorized optical filtering motherboard, and this organic sheath is positioned between this buffering metal level and this frame glue.
21. motherboard of liquid crystal display as claimed in claim 20, wherein this organic material layer is a resin type black matrix.
22. motherboard of liquid crystal display as claimed in claim 21, wherein this resin type black matrix to this predetermined cuts line has a second distance, and this first distance is less than this second distance.
23. motherboard of liquid crystal display as claimed in claim 13 comprises that also an organic sheath is positioned at the inside surface of this transistor motherboard, and this organic sheath is positioned between this buffering metal level and this this frame glue.
24. motherboard of liquid crystal display as claimed in claim 13, wherein this frame glue outer rim to this predetermined cuts line has one the 3rd distance, and this first distance is less than the 3rd distance.
25. motherboard of liquid crystal display as claimed in claim 13, wherein this predetermined cuts line precalculated position that is cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100956946A CN101276083B (en) | 2008-05-07 | 2008-05-07 | Display panel suitable for laser cutting technique and master panel thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100956946A CN101276083B (en) | 2008-05-07 | 2008-05-07 | Display panel suitable for laser cutting technique and master panel thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101276083A CN101276083A (en) | 2008-10-01 |
| CN101276083B true CN101276083B (en) | 2012-01-18 |
Family
ID=39995664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100956946A Active CN101276083B (en) | 2008-05-07 | 2008-05-07 | Display panel suitable for laser cutting technique and master panel thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101276083B (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI419096B (en) * | 2010-11-25 | 2013-12-11 | Au Optronics Corp | Substrate structure and panel structure |
| JP5153917B2 (en) * | 2011-05-30 | 2013-02-27 | アルプス電気株式会社 | Lens driving device and method of manufacturing lens driving device |
| CN103995385B (en) * | 2014-05-09 | 2017-12-05 | 京东方科技集团股份有限公司 | Display master blank and its cutting method |
| CN104439720B (en) * | 2014-12-25 | 2016-02-24 | 京东方科技集团股份有限公司 | Laser cutting method, display base plate, display unit |
| CN104536168A (en) * | 2014-12-31 | 2015-04-22 | 深圳市华星光电技术有限公司 | Mother substrate |
| CN104868058B (en) * | 2015-03-27 | 2018-01-09 | 上海天马微电子有限公司 | A kind of display panel, display device and display panel motherboard |
| CN105137636A (en) * | 2015-09-10 | 2015-12-09 | 京东方科技集团股份有限公司 | Display base board and manufacturing method and display panel thereof |
| CN105445977A (en) * | 2016-01-21 | 2016-03-30 | 武汉华星光电技术有限公司 | Method for detecting yield of liquid crystal display panels |
| CN107621714A (en) * | 2017-09-26 | 2018-01-23 | 武汉华星光电技术有限公司 | Forming method, display panel assembly and the display device of display panel |
| CN107785505B (en) * | 2017-10-31 | 2019-08-02 | 京东方科技集团股份有限公司 | Display panel and its manufacturing method, display device |
| CN108717832B (en) | 2018-06-04 | 2020-04-24 | 京东方科技集团股份有限公司 | Display substrate mother board, preparation method and cutting method thereof, display substrate and display device |
| CN110931521B (en) | 2018-08-29 | 2022-07-12 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| CN109164622B (en) * | 2018-09-17 | 2021-01-15 | 维沃移动通信有限公司 | Terminal panel and mobile terminal |
| CN109979333B (en) * | 2019-05-17 | 2022-01-28 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| CN110297345B (en) * | 2019-06-21 | 2022-04-29 | 厦门天马微电子有限公司 | Color film substrate, display panel and display device |
| US11886063B2 (en) | 2019-11-29 | 2024-01-30 | Boe Technology Group Co., Ltd. | Display panel motherboard, cutting method and manufacturing method thereof, display panel, and display device |
| CN112987364A (en) * | 2019-12-13 | 2021-06-18 | 群创光电股份有限公司 | Electronic device and manufacturing method thereof |
-
2008
- 2008-05-07 CN CN2008100956946A patent/CN101276083B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101276083A (en) | 2008-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101276083B (en) | Display panel suitable for laser cutting technique and master panel thereof | |
| TWI421601B (en) | Display panel capable of being cut by laser, and mother substrate including the display panels thereof | |
| US6297869B1 (en) | Substrate and a liquid crystal display panel capable of being cut by using a laser and a method for manufacturing the same | |
| US9603204B2 (en) | Display device | |
| TW201500213A (en) | Display panel and manufacturing method of display panel | |
| RU2010152336A (en) | METHOD FOR MAKING A DISPLAY PANEL | |
| US20200006714A1 (en) | Display panel motherboards, display panels, and methods for manufacturing display panel | |
| US6239855B1 (en) | Method for producing a liquid crystal display panel having dummy seal particles arranged in at least two arrays | |
| US20160131944A1 (en) | Display device and manufacturing method thereof | |
| TW200912454A (en) | Liquid crystal display device and liquid crystal display panel | |
| JPH10268332A (en) | Liquid crystal display device and its manufacture | |
| US20090316081A1 (en) | Method for manufacturing a liquid crystal display device and mother substrate for manufacturing the same | |
| JP2003222904A (en) | Liquid crystal display panel | |
| JP2006227417A (en) | Substrate apparatus and its manufacturing method | |
| KR20050049656A (en) | Liquid crystal display panel and fabrication method thereof | |
| JP2010060993A (en) | Display element and manufacturing method | |
| JP2002296574A (en) | Manufacturing method for liquid crystal display panel | |
| CN102073172B (en) | Liquid crystal display panel and manufacturing method thereof | |
| JP5549065B2 (en) | Liquid crystal panel and manufacturing method thereof | |
| JP2009294601A (en) | Display device | |
| JP2006084881A (en) | Liquid crystal display panel and method for manufacturing the same | |
| TW202303547A (en) | Display device | |
| KR20070119835A (en) | Liquid crystal panel | |
| JP2005043812A (en) | Liquid crystal display device | |
| JP2001075511A (en) | Substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |