CN101261450A - Zero position automatically adjustable focusing and leveling measuring device and its usage method - Google Patents
Zero position automatically adjustable focusing and leveling measuring device and its usage method Download PDFInfo
- Publication number
- CN101261450A CN101261450A CNA2008100359004A CN200810035900A CN101261450A CN 101261450 A CN101261450 A CN 101261450A CN A2008100359004 A CNA2008100359004 A CN A2008100359004A CN 200810035900 A CN200810035900 A CN 200810035900A CN 101261450 A CN101261450 A CN 101261450A
- Authority
- CN
- China
- Prior art keywords
- focusing
- leveling
- adjustable mechanism
- silicon chip
- automatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Automatic Focus Adjustment (AREA)
Abstract
The invention provides a focusing and leveling measurement device with the automatic adjustable zero position and the using method thereof, the focusing and leveling fine measurement device is increasedly provided with a group of automatic adjustable mechanism, and the adjustable mechanism can carry out the zero-position adjustment of the focusing and leveling measurement device. When the adjustable mechanism is positioned at the initial position, the focusing and leveling measurement device is in the fine measurement mode; when the adjustable mechanism is not positioned at the initial position, the focusing and leveling measurement device is in rough measurement mode.
Description
Technical field
The present invention relates to the focus adjustment method of lithographic equipment, particularly the focusing leveling measuring method of lithographic equipment.
Background technology
In the projection lithography device, in order to carry out high-precision measurement in the position to silicon chip surface, for fear of measurement mechanism damage silicon chip, it must be non-contact measurement that focusing and leveling is measured simultaneously, and promptly device itself does not directly contact testee.Contactless focusing leveling measuring method commonly used has three kinds: optical measuring method, capacitance measurement, barometry.In scanning projection lithographic equipment now, the optical measuring methods that use are realized the focusing and leveling measurement more, the technology of optical focusing leveling measurement apparatus varied (typical case is seen patent CN2006101119021.0, is disclosed on 05 30th, 2007), but also what time not enough ubiquity is following:
(1) mechanical-optical setup is too huge, and control structure is too complicated.Usually, the accurate measurement range of projection lithography matching requirements focusing and leveling measurement apparatus is smaller, generally about positive and negative dozens of micron.Yet the projection lithography device often requires focusing and leveling measurement apparatus to have bigger bigness scale capture range again, generally requires hundreds of individual micron capture range even higher.The two cover measuring systems independently of using ASML company scanning photoetching machine realize the accurate measurement and the bigness scale of focusing and leveling respectively, and wherein the ruddiness subsystem is used for the bigness scale of focusing and leveling, and the white light subsystem is used for the accurate measurement of focusing and leveling.The detection branch of patent CN200610119021.0 then overlaps independently submodule by two and forms, and a submodule is used for the accurate measurement of focusing and leveling, and another submodule is used for the bigness scale of focusing and leveling.Two cover measuring systems make that the mechanical-optical setup of whole focusing and leveling measurement apparatus is too huge, and control structure is also too complicated.
(2) bigness scale scope is more limited.The precision of focusing and leveling measurement apparatus bigness scale requires to reach micron even submicron order at least, uses the independently bigness scale of optical measuring technique realization focusing and leveling to be subjected to the restriction of its measuring principle, realizes relatively difficulty of bigger measurement range.
Summary of the invention
The object of the present invention is to provide a kind of focusing and leveling measurement apparatus and using method thereof of zero-bit automatic and adjustable,, and realize millimeter level even higher bigness scale scope so that system architecture is simply compact.
To achieve the above object, the invention provides a kind of focusing and leveling measurement apparatus, comprise: first reflector group, projection target, second reflector group, the 3rd reflector group, the 4th reflector group, photoelectric conversion sensor, signal processing controller, wherein, this focusing and leveling measurement apparatus also comprises automatic and adjustable mechanism.This first catoptron of measuring light process, this projection target, this second catoptron are after the silicon chip surface reflection; Via inciding on this photoelectric conversion sensor behind the 3rd catoptron, the 4th catoptron; The electric signal of this photoelectric conversion sensor output enters this signal Processing control; This automatic and adjustable mechanism is positioned at measures on the light path.This automatic and adjustable mechanism can be positioned at before this first reflector group, can be between this first reflector group and this second reflector group, can be positioned at before the 3rd reflector group, can between the 3rd reflector group and the 4th reflector group, can also be positioned at after the 4th reflector group.
This automatic and adjustable mechanism comprises a parallel deflection flat board and driving mechanism thereof.
The in-house measuring system that has servo feedback of this automatic and adjustable, simultaneously this automatic and adjustable mechanism can accept the focusing and leveling measurement apparatus electric signal handle obtain with the linear corresponding voltage value in silicon chip surface position as its servo-controlled feedback.
The present invention also provides a kind of method of using this focusing and leveling measurement apparatus, comprises the steps:
(1) during the focusing and leveling initialization, its initial position returns in this automatic and adjustable mechanism;
(2) this automatic and adjustable mechanism is locked, enter the accurate measurement pattern of acquiescence;
(3) obtain the electric signal that this photoelectric conversion sensor is exported;
(4) carrying out electric signal handles;
(5) obtain and the linear corresponding voltage value in silicon chip surface position;
(6) relatively be somebody's turn to do and linear corresponding voltage value in silicon chip surface position and smart bigness scale critical region threshold voltage, if the current and linear corresponding voltage value in silicon chip surface position is less than or equal to smart bigness scale critical region threshold voltage, then produce the accurate measurement measurement result through interpolation/links such as demarcation/match; If current and the linear corresponding voltage value in silicon chip surface position are greater than smart bigness scale critical region threshold voltage, this automatic and adjustable mechanism enters the servocontrol state;
(7) produce the bigness scale measurement result.
During initialization, the initial position that this automatic and adjustable mechanism is got back to can be the physics zero-bit of this automatic and adjustable mechanism self, also certain certain location.
After this automatic and adjustable mechanism enters this servocontrol state, according to the current reading of self measuring system of this automatic and adjustable mechanism, and the focusing and leveling measurement apparatus electric signal handle obtain produce the bigness scale measurement result of focusing and leveling jointly with the linear corresponding voltage value in silicon chip surface position.
Compare with traditional focusing and leveling measurement apparatus, this measurement mechanism has following advantage and technique effect:
1) simple and compact for structure.Focusing and leveling measurement apparatus involved in the present invention only has a cover measuring system, and is simple and compact for structure.
2) bigness scale scope is bigger.Use existing ripe high-end product can realize millimeter level even higher bigness scale capture range as the automatic motion platform of the zero-bit adjustment of focusing and leveling measuring system.
Description of drawings
Fig. 1 is an optical exposure system plane principle schematic;
Fig. 2 is the general structure synoptic diagram of device involved in the present invention;
Fig. 3 is the overall procedure of the signal Processing of traditional focusing and leveling measurement apparatus;
Fig. 4 is the workflow of the measurement mechanism that the present invention relates to;
Fig. 5 is the control structure synoptic diagram of automatic and adjustable mechanism.
In the accompanying drawing: 100, illuminator; 210, mask platform; 220, mask; The supporting of 300 projection objectives; 310, projection objective; 410, work stage; 420, silicon chip; 430, focusing and leveling actuator; 500, silicon slice focusing and leveling measurement apparatus; 510, measuring light; 520, first catoptron; 525, projection target; 530, second catoptron; 540, the 3rd catoptron; 550, adjustable mechanism; 550a, motion controller; 550b, transport function; 550c, feedback unit; The 550d feedback unit; 550e, measuring system switch control unit; 555, driving mechanism; 560, the 4th catoptron; 590, silicon chip surface position control system; 570, photoelectric sensor; 580, signal Processing control.
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is further described.
Fig. 1 is an optical exposure system plane principle schematic.Under the irradiation of illuminator 100, light source exposes the image projection on the mask 220 to silicon chip 420 by projection objective 310.Mask 220 is by mask platform 210, and silicon chip 420 is by work stage 410 supportings.Among Fig. 2, a silicon slice focusing and leveling measurement apparatus 500 is arranged between projection objective 310 and silicon chip 420, rigid attachment is carried out in this device and projection objective 310 or projection objective supporting 300, be used for the positional information on silicon chip 420 surfaces is measured, measurement result is sent to silicon chip surface position control system 590, after the calculating through signal Processing and focusing and leveling amount, the position that drives 430 pairs of work stage 410 of focusing and leveling actuator is adjusted, and finishes the focusing and leveling of silicon chip 420.
Below in conjunction with other accompanying drawing specific embodiments of the invention are further described.
Fig. 2 is the general structure synoptic diagram of device involved in the present invention.Measuring light 510 will look like to become on silicon chip surface 420 after through first catoptron 520, projection target 525, second catoptron 530.After silicon chip surface 420 reflections, the measuring light that has the silicon chip surface positional information is successively via inciding on the photoelectric conversion sensor 570 the electric signal entering signal processing controls 580 of photoelectric conversion sensor 570 outputs behind the 3rd catoptron 540, the 4th catoptron 560.Signal Processing control 580 obtains the accurate measurement measurement result or the bigness scale measurement result of focusing and leveling through signal and adjustable mechanism 550 are further handled.Present embodiment has been placed a parallel deflection flat board 550 between the 3rd catoptron 540 and the 4th catoptron 560, parallel deflection flat board 550 is driven by driving mechanism 555.When measuring object is positioned at outside the accurate measurement measurement range of focusing and leveling measurement apparatus, parallel deflection dull and stereotyped 550 can be automatically to the adjusting of focusing and leveling measurement apparatus zero-bit, thereby focusing and leveling measurement apparatus can produce the bigness scale measurement result.Concrete workflow and control method are elaborated in the back extended meeting.
Fig. 3 is the overall procedure of traditional focusing and leveling measurement apparatus signal Processing.This overall procedure mainly by opto-electronic conversion S1, obtain electric signal S2, electric signal treatment S 3, generation and the linear corresponding voltage value S4 in silicon chip surface position, interpolation/demarcation/match S5 and produce these six steps of measurement result S6.
The present invention makes full use of the adjustable mechanism 550 among Fig. 2, has formulated the new workflow of focusing and leveling measurement apparatus, as shown in Figure 4.This workflow mainly comprises following several steps:
(S10) when the focusing and leveling measurement apparatus initialization, adjustable mechanism 550 is got back to its initial position Po earlier, and this initial position can be the zero-bit of adjustable mechanism 550, also can be certain certain location.
(S11) locked adjustable mechanism 550.
(S12) obtain the electric signal that photoelectric conversion sensor 570 is exported.
(S13a～S13b) carry out electric signal to handle, and generation and the linear corresponding voltage value Vo in silicon chip surface position.
(S14a～S14e) relatively be somebody's turn to do and linear corresponding voltage value Vo in silicon chip surface position and smart bigness scale critical region threshold voltage Vp, if the current and linear corresponding voltage value Vo in silicon chip surface position is less than or equal to smart bigness scale critical region threshold voltage Vp, then produce the accurate measurement measurement result through interpolation/links such as demarcation/match; If current and the linear corresponding voltage value Vo in silicon chip surface position are greater than smart bigness scale critical region threshold voltage Vp, 550 of adjustable mechanisms enter the servocontrol state.
(S15) produce the bigness scale measurement result.
In order to realize above-mentioned workflow, 550 control structures that satisfy as shown in Figure 5 of adjustable mechanism.When current and the linear corresponding voltage value Vo in silicon chip surface position were less than or equal to smart bigness scale critical region threshold voltage Vp, motor 555 was servo by its internal measurement system feedback, and the setting value Ps of adjustable mechanism 550 is its initial position Po.And as current and the linear corresponding voltage value Vo in silicon chip surface position during greater than smart bigness scale critical region threshold voltage Vp, adjustable mechanism 550 by focusing and leveling measurement apparatus current with the linear corresponding voltage value Vo feedback servo in silicon chip surface position.550a is the motion controller of drive motor 550, and there is the measuring system of servo feedback in drive motor 550 inside, its real-time Pp that is output as.Pp produces the feedback parameter of drive motor 550 internal measurement systems via feedback unit 550c.The motion process of adjustable mechanism 550 is by behind the transport function 550b, making that focusing and leveling measurement apparatus is current changes with the linear corresponding voltage value Vo in silicon chip surface position, current and the linear corresponding voltage value Vo in silicon chip surface position produce the feedback parameter of the externally measured system of drive motor (with the linear corresponding voltage value Vo in silicon chip surface position) equally via its feedback unit 550d.Measuring system switch control unit 550e then switches the servo-controlled feedback measuring system of participation adjustable mechanism according to the relation between current and linear corresponding voltage value Vo in silicon chip surface position and the smart bigness scale critical region threshold voltage Vp in real time, and produces servo feedback parameter Sb.
When the focusing and leveling measurement feed into the bigness scale pattern, its output result is by the current reading Pp of the internal measurement system of zero-bit adjusting mechanism 550, and the focusing and leveling measurement apparatus electric signal is handled producing jointly with the linear corresponding voltage value Vo in silicon chip surface position of obtaining, i.e. Mc=f (Vo)+g (Pp).
Claims (7)
1, a kind of focusing and leveling measurement apparatus, comprise first reflector group, projection target, second reflector group, the 3rd reflector group, the 4th reflector group, photoelectric conversion sensor, signal processing controller, it is characterized in that described focusing and leveling measurement apparatus also comprises automatic and adjustable mechanism; Described first catoptron of measuring light process, described projection target, described second catoptron are after the silicon chip surface reflection, via inciding on the described photoelectric conversion sensor behind described the 3rd catoptron, described the 4th catoptron, the electric signal of described photoelectric conversion sensor output enters described signal Processing control, and described automatic and adjustable mechanism is positioned at measures on the light path.
2, focusing and leveling measurement apparatus according to claim 1, it is characterized in that: described automatic and adjustable mechanism can be positioned at before described first reflector group, can be between described first reflector group and described second reflector group, can be positioned at before described the 3rd reflector group, can between described the 3rd reflector group and described the 4th reflector group, can also be positioned at after described the 4th reflector group.
3, focusing and leveling measurement apparatus according to claim 1 is characterized in that: described automatic and adjustable mechanism comprises a parallel deflection flat board and driving mechanism thereof.
4, focusing and leveling measurement apparatus according to claim 1, it is characterized in that: the in-house measuring system that has servo feedback of described automatic and adjustable, simultaneously this automatic and adjustable mechanism can accept the focusing and leveling measurement apparatus electric signal handle obtain with the linear corresponding voltage value in silicon chip surface position as its servo-controlled feedback.
5, a kind of method of using the described focusing and leveling measurement apparatus of claim 1 is characterized in that: comprise the steps:
(1) during the focusing and leveling initialization, its initial position returns in described automatic and adjustable mechanism;
(2) described automatic and adjustable mechanism is locked, enter the accurate measurement pattern of acquiescence;
(3) obtain the electric signal that described photoelectric conversion sensor is exported;
(4) carrying out electric signal handles;
(5) obtain and the linear corresponding voltage value in silicon chip surface position;
(6) more described and linear corresponding voltage value in silicon chip surface position and smart bigness scale critical region threshold voltage, if the current and linear corresponding voltage value in silicon chip surface position is less than or equal to smart bigness scale critical region threshold voltage, then produce the accurate measurement measurement result through interpolation/demarcation/match link; If current and the linear corresponding voltage value in silicon chip surface position be greater than smart bigness scale critical region threshold voltage, described automatic and adjustable mechanism enters the servocontrol state;
(7) produce the bigness scale measurement result.
6, method according to claim 5 is characterized in that: during described initialization, the initial position that described automatic and adjustable mechanism is got back to can be the physics zero-bit of described automatic and adjustable mechanism self, also certain certain location.
7, method according to claim 5, it is characterized in that: after described automatic and adjustable mechanism enters described servocontrol state, according to the current reading of self measuring system of described automatic and adjustable mechanism, and the focusing and leveling measurement apparatus electric signal handle obtain produce the bigness scale measurement result of focusing and leveling jointly with the linear corresponding voltage value in silicon chip surface position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100359004A CN101261450B (en) | 2008-04-10 | 2008-04-10 | Zero position automatically adjustable focusing and leveling measuring device and its usage method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100359004A CN101261450B (en) | 2008-04-10 | 2008-04-10 | Zero position automatically adjustable focusing and leveling measuring device and its usage method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101261450A true CN101261450A (en) | 2008-09-10 |
| CN101261450B CN101261450B (en) | 2010-06-02 |
Family
ID=39961983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100359004A Active CN101261450B (en) | 2008-04-10 | 2008-04-10 | Zero position automatically adjustable focusing and leveling measuring device and its usage method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101261450B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102252606A (en) * | 2010-05-21 | 2011-11-23 | 上海微电子装备有限公司 | Zero adjusting device for focusing and leveling measurement system |
| CN102768469A (en) * | 2011-05-03 | 2012-11-07 | 上海微电子装备有限公司 | Focusing and bisecting system and adjustment method thereof |
| CN102043352B (en) * | 2009-10-13 | 2012-11-14 | 上海微电子装备有限公司 | Focusing and leveling detection device |
| CN102789135A (en) * | 2011-05-18 | 2012-11-21 | 上海微电子装备有限公司 | Focusing and leveling measure device |
| CN103091990A (en) * | 2011-10-28 | 2013-05-08 | 上海微电子装备有限公司 | Mechanism and method for adjusting light spot horizontal position in focusing and leveling system |
| CN103091990B (en) * | 2011-10-28 | 2016-12-14 | 上海微电子装备有限公司 | Light spot horizontal position guiding mechanism and method in a kind of focusing and leveling system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4650983A (en) * | 1983-11-07 | 1987-03-17 | Nippon Kogaku K. K. | Focusing apparatus for projection optical system |
| NL9100410A (en) * | 1991-03-07 | 1992-10-01 | Asm Lithography Bv | IMAGE DEVICE EQUIPPED WITH A FOCUS ERROR AND / OR TILT DETECTION DEVICE. |
| CN100559278C (en) * | 2006-12-01 | 2009-11-11 | 上海微电子装备有限公司 | A kind of optical system of focusing and leveling sensor |
-
2008
- 2008-04-10 CN CN2008100359004A patent/CN101261450B/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102043352B (en) * | 2009-10-13 | 2012-11-14 | 上海微电子装备有限公司 | Focusing and leveling detection device |
| CN102252606A (en) * | 2010-05-21 | 2011-11-23 | 上海微电子装备有限公司 | Zero adjusting device for focusing and leveling measurement system |
| CN102252606B (en) * | 2010-05-21 | 2014-05-21 | 上海微电子装备有限公司 | Zero adjusting device for focusing and leveling measurement system |
| CN102768469A (en) * | 2011-05-03 | 2012-11-07 | 上海微电子装备有限公司 | Focusing and bisecting system and adjustment method thereof |
| CN102768469B (en) * | 2011-05-03 | 2014-11-12 | 上海微电子装备有限公司 | Focusing and bisecting system and adjustment method thereof |
| CN102789135A (en) * | 2011-05-18 | 2012-11-21 | 上海微电子装备有限公司 | Focusing and leveling measure device |
| CN102789135B (en) * | 2011-05-18 | 2015-02-11 | 上海微电子装备有限公司 | Focusing and leveling measure device |
| CN103091990A (en) * | 2011-10-28 | 2013-05-08 | 上海微电子装备有限公司 | Mechanism and method for adjusting light spot horizontal position in focusing and leveling system |
| CN103091990B (en) * | 2011-10-28 | 2016-12-14 | 上海微电子装备有限公司 | Light spot horizontal position guiding mechanism and method in a kind of focusing and leveling system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101261450B (en) | 2010-06-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103744271B (en) | A kind of laser direct writing system and photoetching method | |
| TWI656979B (en) | A computer to screen equipment based on laser direct imaging and its exposuring process | |
| CN109074000B (en) | Method and device for generating illuminating radiation | |
| CN101261450B (en) | Zero position automatically adjustable focusing and leveling measuring device and its usage method | |
| CN109974583B (en) | Non-contact optical element surface shape measuring device and method | |
| KR20190074316A (en) | Lighting sources for inspection equipment, inspection equipment and inspection methods | |
| CN105467772B (en) | Exposure device, exposure method and device manufacturing method | |
| CN111037106B (en) | Z-axis motion control system and method of laser processing equipment | |
| KR20140050562A (en) | Detection device, exposure apparatus, and device manufacturing method using same | |
| CN110837036A (en) | Circuit board fault automatic detection system | |
| WO2018082892A1 (en) | Height sensor, lithographic apparatus and method for manufacturing devices | |
| CN112213331A (en) | Surface wave long-level point defect characterization device and method based on machine vision | |
| CN115769682A (en) | System and method for laser-to-droplet alignment | |
| JP2006118867A (en) | Scanning probe microscope and measuring method using it | |
| CN115576075B (en) | Automatic focusing system and method | |
| CN201760804U (en) | Non-contact three-dimensional optical measuring head used for online measurement of digit control machine tool | |
| CN204347331U (en) | A kind of closed-loop control focal length adjustment device | |
| CN100474123C (en) | Self-adapting technique changing method for self-adapting focusing and leveling adjustment sensor system | |
| CN203076787U (en) | Processing device by using laser direct imaging technology | |
| KR102395738B1 (en) | Measuring apparatus, lithography apparatus, method of manufacturing article, and measuring method | |
| CN103028842B (en) | Device and method for processing laser direct imaging | |
| CN101320218B (en) | Three scanning type silicon slice focusing and leveling measurement apparatus, system and method | |
| CN220526185U (en) | Wafer direct-writing machining device | |
| CN101398635B (en) | Auto gain link closed-loop feedback control method in self-adapting focusing and leveling sensor system | |
| CN101609264B (en) | Method for improving focusing and leveling measurement accuracy |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder |