CN101229602B - 热敏电阻的芯片与引线的焊接方法 - Google Patents
热敏电阻的芯片与引线的焊接方法 Download PDFInfo
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- CN101229602B CN101229602B CN2008100656405A CN200810065640A CN101229602B CN 101229602 B CN101229602 B CN 101229602B CN 2008100656405 A CN2008100656405 A CN 2008100656405A CN 200810065640 A CN200810065640 A CN 200810065640A CN 101229602 B CN101229602 B CN 101229602B
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- welding
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- 238000003466 welding Methods 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000009413 insulation Methods 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000004140 cleaning Methods 0.000 claims description 16
- 238000012802 pre-warming Methods 0.000 claims description 14
- 238000004321 preservation Methods 0.000 claims description 12
- 238000012545 processing Methods 0.000 claims description 10
- 238000013461 design Methods 0.000 claims description 6
- 230000006698 induction Effects 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 4
- 230000007306 turnover Effects 0.000 claims description 4
- 230000005856 abnormality Effects 0.000 claims description 3
- 239000012459 cleaning agent Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 238000011534 incubation Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 4
- 230000035939 shock Effects 0.000 abstract description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 4
- 238000003780 insertion Methods 0.000 abstract 1
- 230000037431 insertion Effects 0.000 abstract 1
- 230000000750 progressive effect Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 206010020843 Hyperthermia Diseases 0.000 description 1
- 241000500881 Lepisma Species 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000005347 demagnetization Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- 230000003179 granulation Effects 0.000 description 1
- 230000036031 hyperthermia Effects 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2008100656405A CN101229602B (zh) | 2008-01-24 | 2008-01-24 | 热敏电阻的芯片与引线的焊接方法 |
Applications Claiming Priority (1)
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CN2008100656405A CN101229602B (zh) | 2008-01-24 | 2008-01-24 | 热敏电阻的芯片与引线的焊接方法 |
Publications (2)
Publication Number | Publication Date |
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CN101229602A CN101229602A (zh) | 2008-07-30 |
CN101229602B true CN101229602B (zh) | 2010-06-02 |
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Application Number | Title | Priority Date | Filing Date |
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CN2008100656405A Expired - Fee Related CN101229602B (zh) | 2008-01-24 | 2008-01-24 | 热敏电阻的芯片与引线的焊接方法 |
Country Status (1)
Country | Link |
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CN (1) | CN101229602B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102513675B (zh) * | 2011-12-21 | 2014-01-22 | 电子科技大学 | 电阻绕线机的绕线焊接装置 |
CN104084659B (zh) * | 2014-07-02 | 2016-04-20 | 佛山市施翔腾科技设备有限公司 | 采用热风焊接方法制备晶体管的生产方法 |
CN104942394B (zh) * | 2015-06-03 | 2017-07-11 | 常熟市林芝电子有限责任公司 | 具有高可靠性的引线陶瓷热敏电阻器焊接方法 |
CN106684004B (zh) * | 2016-07-18 | 2019-07-05 | 浙江益中智能电气有限公司 | 一种功率器件的整体封装方法 |
CN106229306B (zh) * | 2016-07-18 | 2019-07-05 | 浙江益中智能电气有限公司 | 一种功率器件芯片的稳定化上芯方法 |
CN106304684B (zh) * | 2016-08-30 | 2019-08-30 | 无锡市同步电子制造有限公司 | 一种选择焊载具及其焊接方法 |
CN107052639A (zh) * | 2017-05-31 | 2017-08-18 | 四川望锦机械有限公司 | 一种汽车连接杆总成的焊接工艺 |
CN107790882B (zh) * | 2017-09-29 | 2020-05-22 | 西安交通大学 | 一种基于热循环调控的钼及钼合金激光焊接方法 |
CN110556432A (zh) * | 2018-06-01 | 2019-12-10 | 君泰创新(北京)科技有限公司 | 一种太阳能电池及其制备方法和焊接装置 |
CN112366154A (zh) * | 2020-11-06 | 2021-02-12 | 深圳市Tcl高新技术开发有限公司 | 芯片转移方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1150329A (zh) * | 1995-11-08 | 1997-05-21 | 三菱电机株式会社 | 零件在基体上的焊接方法及其装置 |
CN2469526Y (zh) * | 2001-01-19 | 2002-01-02 | 蔡雅凤 | 高可靠过流保护正温度系数热敏电阻器 |
-
2008
- 2008-01-24 CN CN2008100656405A patent/CN101229602B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1150329A (zh) * | 1995-11-08 | 1997-05-21 | 三菱电机株式会社 | 零件在基体上的焊接方法及其装置 |
CN2469526Y (zh) * | 2001-01-19 | 2002-01-02 | 蔡雅凤 | 高可靠过流保护正温度系数热敏电阻器 |
Non-Patent Citations (2)
Title |
---|
JP平3-216270A 1991.09.24 |
JP特开2000-235991A 2000.08.29 |
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Publication number | Publication date |
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CN101229602A (zh) | 2008-07-30 |
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Owner name: SHI KAIXUAN Free format text: FORMER OWNER: BAO FENG Effective date: 20081010 |
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Effective date of registration: 20081010 Address after: Room 5, aerospace micro motor building, North Zone, Nanshan District hi tech Industrial Park, Guangdong, Shenzhen Province, China: 518000 Applicant after: Shi Kaixuan Address before: The East China Sea Industrial Park Henggang Dakang village in Longgang District of Shenzhen City, Guangdong Province, 7 post encoding: 518000 Applicant before: Bao Feng |
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Assignee: SHENZHEN WEILIN HI-TECH CO., LTD. Assignor: Shi Kaixuan Contract record no.: 2010440001362 Denomination of invention: Method of welding thermistance chip and down lead Granted publication date: 20100602 License type: Exclusive License Open date: 20080730 Record date: 20100909 |
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Owner name: SHENZHEN WEILIN HIGH TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHI KAIXUAN Effective date: 20140213 |
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Effective date of registration: 20140213 Address after: 518000 Guangdong city of Shenzhen province Nanshan District high tech Park North Lang mountain road two Aerospace micromotor research building five floor building northeast Patentee after: SHENZHEN WEILIN HI-TECH CO., LTD. Address before: 518000, Nanshan District Shenzhen hi tech Industrial Park, North District, Guangdong Aerospace micro motor building, 5 floor Patentee before: Shi Kaixuan |
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