CN101226906A - Chip carrier with dams - Google Patents
Chip carrier with dams Download PDFInfo
- Publication number
- CN101226906A CN101226906A CN 200810074320 CN200810074320A CN101226906A CN 101226906 A CN101226906 A CN 101226906A CN 200810074320 CN200810074320 CN 200810074320 CN 200810074320 A CN200810074320 A CN 200810074320A CN 101226906 A CN101226906 A CN 101226906A
- Authority
- CN
- China
- Prior art keywords
- protective layer
- chip carrier
- connection gasket
- ponding
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Abstract
The invention discloses a chip carrier with a barrage, which mainly comprises a base material, a protective layer and a barrage. The base material is equipped with a plurality of first connecting pads and second connecting pads, the protective layer is formed on the surface of the base material and is equipped with a dent, a plurality of first openings and second openings, wherein the dent is equipped with a first lateral wall and a second lateral wall, the first openings and the second openings respectively expose the first connecting pads and the second connecting pads. The barrage is formed between the first lateral wall and the second lateral wall of the dent, and projects out of the protective layer. The barrage has the function of preventing the overflow of under fill polluting chip carrier. The barrage is formed in the dent of the protective layer, thereby the width and height of the barrage can be controlled, and the touching area and bond strength of the barrage and the protective layer can be increased to avoid the peeling of the barrage and the protective layer. The invention also discloses a semi-conductor structure.
Description
Technical field
The present invention relates to a kind of chip carrier, particularly a kind of chip carrier that prevents the excessive glue pollution connection gasket.
Background technology
Known substrate has a plurality of projection connection gaskets and a plurality of soldered ball connection gasket, usually to be positioned at the same plane of this substrate and this projection connection gasket and this soldered ball connection gasket be adjacent for this projection connection gasket and this soldered ball connection gasket, owing at present electronic product is all required under the compact situation, therefore the spacing of this projection connection gasket and this soldered ball connection gasket is quite little, when chip is electrically connected to this substrate with projection, and be filled between this substrate and this chip when sealing this projection with underfill, the easy overflow of this underfill is polluted this adjacent soldered ball connection gasket to this soldered ball connection gasket, causes this soldered ball connection gasket can't engage with soldered ball smoothly in follow-up technology.
Summary of the invention
Main purpose of the present invention is to provide a kind of chip carrier with ponding; protective layer is formed at the substrate surface of the base material with a plurality of first connection gaskets and a plurality of second connection gaskets; this protective layer has groove, a plurality of first opening and a plurality of second opening; wherein this groove shaped is formed between this first opening and this second opening; this groove has the first side wall and second sidewall; ponding is formed between this first side wall and this second sidewall of this groove, and protrudes from this protective layer.This ponding has and prevents that the underfill overflow from causing polluting the effect of this chip carrier; and this ponding is formed in this groove of this protective layer; so the width of this ponding of may command and height; and can increase the contact area and the bond strength of this ponding and this protective layer, peel off to avoid this ponding and this protective layer.
Mainly comprise base material according to a kind of chip carrier of the present invention with ponding; protective layer and ponding; this base material has substrate surface; a plurality of first connection gaskets and a plurality of second connection gasket; this protective layer is formed at this substrate surface of this base material; this protective layer has groove; a plurality of first openings and a plurality of second opening; wherein this groove shaped is formed between this first opening and this second opening; this groove has the first side wall and second sidewall; this first opening and this second opening appear this first connection gasket and this second connection gasket respectively; this ponding is formed between this first side wall and this second sidewall of this groove, and protrudes from this protective layer.
Description of drawings
Fig. 1 is a kind of schematic cross-section with chip carrier of ponding according to the present invention's first specific embodiment.
Fig. 2 is for having the top view of the chip carrier of ponding according to this of the present invention's first specific embodiment.
Fig. 3 is for there being the top view of the chip carrier of ponding according to the another kind of the present invention's second specific embodiment.
Fig. 4 is for there being the top view of the chip carrier of ponding according to the another kind of the present invention's the 3rd specific embodiment.
Fig. 5 is for having the top view of the chip carrier of ponding according to the another kind of the present invention's the 4th specific embodiment.
Fig. 6 is for being applied to the schematic cross-section of semiconductor structure according to this chip carrier with ponding of the present invention's first specific embodiment.
Description of reference numerals
100 chip carriers, 110 base materials
111 substrate surfaces, 112 first connection gaskets
113 second connection gaskets, 120 protective layers
121 groove 121a the first side walls
121b second sidewall 122 first openings
123 second openings, 124 protective layer surfaces
130 pondings, 140 line layers
200 semiconductor structures, 210 chip carriers
211 base materials, 212 protective layers
213 pondings, 214 first connection gaskets
215 second connection gaskets, 216 grooves
216a the first side wall 216b second sidewall
217 first openings, 218 second openings
219 protective layers surface, 220 chips
221 projections, 230 underfills
Embodiment
See also Fig. 1; disclose a kind of chip carrier 100 according to a specific embodiment of the present invention with ponding; it consists predominantly of base material 110; protective layer 120 and ponding 130; this base material 110 can be selected from chip; chip or circuit board; this base material 110 has substrate surface 111; a plurality of first connection gaskets 112 and a plurality of second connection gasket 113; this first connection gasket 112 is formed at this substrate surface 111 with this second connection gasket 113; in addition; this chip carrier 100 includes line layer 140 in addition; this line layer 140; this first connection gasket 112 can be by forming after the patterned step of metal level with this second connection gasket 113; in the present embodiment; this base material 110 is a printed circuit board (PCB), and this protective layer 120 is a welding resisting layer, as green lacquer; this first connection gasket 112 is the projection connection gasket, and this second connection gasket 113 is the soldered ball connection gasket.This protective layer 120 is formed on this substrate surface 111 of this base material 110; and this protective layer 120 covers this line layer 140; this protective layer 120 has groove 121; a plurality of first openings 122 and a plurality of second opening 123; wherein this groove 121 is formed between this first opening 122 and this second opening 123; this groove 121 has the first side wall 121a and the second sidewall 121b; this groove 121 can manifest this line layer 140; perhaps; this groove 121 does not appear this line layer 140 in other embodiments; the shape of this groove 121 can be selected from " mouth " shape; " ㄇ " shape; " I " shape or " L " shape; see also the 2nd and 3 figure; this groove 121 can be continuous " mouth " shape; " ㄇ " shape; " I " shape or " L " shape; perhaps; see also the 4th and 5 figure; this groove 121 also can be discontinuous " mouth " shape; " ㄇ " shape; " I " shape or " L " shape; please consult Fig. 1 again; this first opening 122 appears this first connection gasket 112 and this second connection gasket 113 respectively with this second opening 123; this ponding 130 is formed between this first side wall 121a and this second sidewall 121b of this groove 121; and this ponding 130 protrudes from this protective layer 120; the material of this ponding 130 is selected from metal or resin; the formation method of this ponding 130 is selected from plating; printing or rubbing method; in the present embodiment; this the first side wall 121a and this second sidewall 121b of these ponding 130 these grooves 121 of contact; and this ponding 130 protrudes from the protective layer surface 124 of this protective layer 120; perhaps in another embodiment, this protective layer surface 124 of these ponding 130 these protective layers 120 of extensible contact.Because this ponding 130 is formed in this groove 121 of this protective layer 120; so the width of this ponding 130 of may command and height; and because this first side wall 121a and this second sidewall 121b of these ponding 130 these grooves 121 of contact; therefore can increase the contact area and the bond strength of this ponding 130 and this protective layer 120; peel off with this protective layer 120 to avoid this ponding 130; this chip carrier 100 of the present invention can apply in the semiconductor structure; in chip stack structure or semiconductor package, cause polluting this chip carrier 100 to prevent the underfill overflow.
See also Fig. 6, a kind of semiconductor structure 200 of using above-mentioned chip carrier, this semiconductor structure 200 can be chip stack structure or semiconductor package, and it comprises chip carrier 210, chip 220 and underfill 230.This chip carrier 210 includes base material 211; protective layer 212 and ponding 213; this base material 211 is a circuit board in the present embodiment; this protective layer 212 is a welding resisting layer; as green lacquer; this base material 211 has a plurality of first connection gaskets 214 and a plurality of second connection gasket 215; this protective layer 212 is formed on this base material 211 and has groove 216; a plurality of first openings 217 and a plurality of second opening 218; wherein this groove 216 is formed between this first opening 217 and this second opening 218; this groove 216 has the first side wall 216a and the second sidewall 216b; this first opening 217 appears this first connection gasket 214 and this second connection gasket 215 respectively with this second opening 218; this ponding 213 is formed between this first side wall 216a and this second sidewall 216b of this groove 216; and this ponding 213 protrudes from the protective layer surface 219 of this protective layer 212; in the present embodiment; this the first side wall 216a and this second sidewall 216b of these ponding 213 these grooves 216 of contact; this chip 220 has a plurality of projections 221; these chip 220 flip chip bondings are engaged in this first connection gasket 214 of these projection 221 these chip carriers 210 of electric connection of this chip carrier 210 and this chip 220; in the present embodiment; this first connection gasket 214 is the projection connection gasket; this second connection gasket 215 is the soldered ball connection gasket; this underfill 230 is formed between this chip 220 and this chip carrier 210 to seal this projection 221; in the present embodiment; this ponding 213 is formed in this groove 216; and protrude from this protective layer 212; the height of this ponding 213 is less than the height of this projection 221; perhaps; in other embodiment, the height of this ponding 213 can be equal to or greater than the height of this projection 221.A plurality of soldered balls (figure does not draw) are set before this second connection gasket 215 at this chip carrier 210; this underfill 230 is formed at earlier between this chip carrier 210 and this chip 220 with this projection 221 of seal protection; this underfill 230 can be limited between this projection 221 and this ponding 213 by this ponding 213; pollute this second connection gasket 215 to prevent these underfill 230 overflows to this second connection gasket 215; be formed in this groove 216 of this protective layer 212 owing to this ponding 213 in addition; so the width of this ponding 213 of may command and height; pollute this first connection gasket 214 and this second connection gasket 215 to avoid diffusion when forming this ponding 213; and because this first side wall 216a and this second sidewall 216b of these ponding 213 these grooves 216 of contact; therefore can increase the contact area and the bond strength of this ponding 213 and this protective layer 212; or this ponding 213 does not contact this first side wall 216a and this second sidewall 216b of this groove 216 in another embodiment.
Protection scope of the present invention is when looking being as the criterion that accompanying Claim defines, and any variation and modification that those skilled in the art are done without departing from the spirit and scope of the present invention all belong to protection scope of the present invention.
Claims (11)
1. chip carrier with ponding, it comprises:
Base material, it has substrate surface, a plurality of first connection gasket and a plurality of second connection gasket, and this first connection gasket and this second connection gasket are formed at this substrate surface;
Protective layer, it is formed at this substrate surface of this base material, this protective layer has groove, a plurality of first opening and a plurality of second opening, wherein this groove shaped is formed between this first opening and this second opening and this groove has the first side wall and second sidewall, and this first opening and this second opening appear this first connection gasket and this second connection gasket respectively; And
Ponding, it is formed between this first side wall and this second sidewall of this groove, and protrudes from this protective layer.
2. chip carrier as claimed in claim 1, wherein this ponding contacts this first side wall and this second sidewall of this groove.
3. chip carrier as claimed in claim 1, wherein this groove is continuous " mouth " shape, " ㄇ " shape, " I " shape or " L " shape.
4. chip carrier as claimed in claim 1, wherein this groove is discontinuous " mouth " shape, " ㄇ " shape, " I " shape or " L " shape.
5. chip carrier as claimed in claim 1, wherein this protective layer has the protective layer surface, and this ponding extends contact this protective layer surface to this protective layer.
6. chip carrier as claimed in claim 1, it includes line layer in addition, and this protective layer covers this line layer.
7. chip carrier as claimed in claim 6, wherein this groove appears this line layer.
8. chip carrier as claimed in claim 1, wherein this first connection gasket is the projection connection gasket, this second connection gasket is the soldered ball connection gasket.
9. chip carrier as claimed in claim 8, wherein this projection connection gasket is used to electrically connect a flip-chip.
10. chip carrier as claimed in claim 9 wherein more comprises a primer and is filled between this flip-chip and this chip carrier.
11. chip carrier as claimed in claim 1, wherein the formation method of this ponding is selected from plating, printing or rubbing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810074320 CN101226906A (en) | 2008-02-15 | 2008-02-15 | Chip carrier with dams |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810074320 CN101226906A (en) | 2008-02-15 | 2008-02-15 | Chip carrier with dams |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101226906A true CN101226906A (en) | 2008-07-23 |
Family
ID=39858794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810074320 Pending CN101226906A (en) | 2008-02-15 | 2008-02-15 | Chip carrier with dams |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101226906A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104681499A (en) * | 2013-11-29 | 2015-06-03 | 矽品精密工业股份有限公司 | Package stack structure and method for fabricating the same |
| CN107546189A (en) * | 2016-06-27 | 2018-01-05 | 矽品精密工业股份有限公司 | Encapsulate stacking structure |
| CN109037163A (en) * | 2017-06-09 | 2018-12-18 | 日月光半导体制造股份有限公司 | Semiconductor device packages |
| CN109075233A (en) * | 2016-03-03 | 2018-12-21 | 奥斯兰姆奥普托半导体有限责任公司 | Photoelectron lighting device, carrier and photoelectron lighting system for opto-electronic semiconductor chip |
| CN111092064A (en) * | 2018-10-23 | 2020-05-01 | 矽品精密工业股份有限公司 | Electronic package |
| CN111146322A (en) * | 2018-11-05 | 2020-05-12 | 光宝电子(广州)有限公司 | Semiconductor light emitting device and method for manufacturing the same |
| CN111354649A (en) * | 2018-12-21 | 2020-06-30 | 台湾积体电路制造股份有限公司 | Package structure and method for forming the same |
| CN113038698A (en) * | 2021-03-08 | 2021-06-25 | 京东方科技集团股份有限公司 | Flexible circuit board, display panel, preparation method and display device |
-
2008
- 2008-02-15 CN CN 200810074320 patent/CN101226906A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104681499A (en) * | 2013-11-29 | 2015-06-03 | 矽品精密工业股份有限公司 | Package stack structure and method for fabricating the same |
| CN109075233A (en) * | 2016-03-03 | 2018-12-21 | 奥斯兰姆奥普托半导体有限责任公司 | Photoelectron lighting device, carrier and photoelectron lighting system for opto-electronic semiconductor chip |
| DE112017001125B4 (en) | 2016-03-03 | 2022-10-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelectronic lighting device, manufacturing method and optoelectronic lighting system |
| CN107546189A (en) * | 2016-06-27 | 2018-01-05 | 矽品精密工业股份有限公司 | Encapsulate stacking structure |
| CN107546189B (en) * | 2016-06-27 | 2019-11-01 | 矽品精密工业股份有限公司 | Encapsulate stacking structure |
| CN109037163A (en) * | 2017-06-09 | 2018-12-18 | 日月光半导体制造股份有限公司 | Semiconductor device packages |
| CN109037163B (en) * | 2017-06-09 | 2020-08-07 | 日月光半导体制造股份有限公司 | Semiconductor device package |
| CN111092064B (en) * | 2018-10-23 | 2021-10-22 | 矽品精密工业股份有限公司 | Electronic package |
| CN111092064A (en) * | 2018-10-23 | 2020-05-01 | 矽品精密工业股份有限公司 | Electronic package |
| CN111146322A (en) * | 2018-11-05 | 2020-05-12 | 光宝电子(广州)有限公司 | Semiconductor light emitting device and method for manufacturing the same |
| CN111146322B (en) * | 2018-11-05 | 2021-04-06 | 光宝电子(广州)有限公司 | Semiconductor light emitting device and method for manufacturing the same |
| CN111354649A (en) * | 2018-12-21 | 2020-06-30 | 台湾积体电路制造股份有限公司 | Package structure and method for forming the same |
| CN113038698A (en) * | 2021-03-08 | 2021-06-25 | 京东方科技集团股份有限公司 | Flexible circuit board, display panel, preparation method and display device |
| CN113038698B (en) * | 2021-03-08 | 2022-09-09 | 京东方科技集团股份有限公司 | Flexible circuit board, display panel, preparation method and display device |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20080723 |