CN101219553A - Bamboo integration plate and production method thereof - Google Patents
Bamboo integration plate and production method thereof Download PDFInfo
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- CN101219553A CN101219553A CNA2008100067699A CN200810006769A CN101219553A CN 101219553 A CN101219553 A CN 101219553A CN A2008100067699 A CNA2008100067699 A CN A2008100067699A CN 200810006769 A CN200810006769 A CN 200810006769A CN 101219553 A CN101219553 A CN 101219553A
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Abstract
The invention mainly relates to a building material, and a manufacturing method thereof, in particular to a bamboo integrated board with bamboo strips as the bottom material and the top material and laminated doped bamboo sheets in the middle, and a manufacturing method thereof. The bamboo integrated board consists of bamboo strips, and a lamination structure formed by doped bamboo and adhesive. The upper layer and the lower layer of the integrated board are respectively the top layer and the bottom layer made of the bamboo strips, while the middle layer of the integrated board is the bamboo laminated layer made of doped bamboo sheet; or the integrated board is fully made of bamboo strips. Compared with the prior art, the invention has the advantages of wide application in various furniture surface board etc., no deformation, no crack, no mildewing but high strength and good flexibility, good waterproof performance and plasticity. By adopting the method, the production technique is simplified, the cost is reduced and the product of the invention is environment friendly.
Description
Technical field
The present invention mainly relates to a kind of construction material and preparation method thereof, particularly uses the bamboo silk at the bottom of a kind of, in be mixed with bamboo integration plate of bamboo chip compacting and preparation method thereof.
Background technology
At present the most of industry of producing bamboo board, bamboo floor of China is all in flakes broken or bar is parallel or it is gluing to misplace, be overrided to form with mao bamboon.Mao bamboon broken in flakes or bar very big to the waste of mao bamboon material, and adopt the bamboo silk be mingled with bamboo chip gluing, laminate the utilization rate that has improved the mao bamboon material greatly.
Bamboo board of Xiao Shouing such as patent (200420035158 bamboo plywood) are a kind of bamboo plywoods that is formed by bamboo mat, bamboo chip hot-press gluing in the market, and the skin of bamboo plywood is a bamboo mat, and intermediate core layer is a bamboo chip, and the surface is with flooding the gummed paper veneer; The core material of bamboo plywood is a kind of blended stock of forming with the bamboo chip or the bamboo silk of suitable thickness and length, and the random distribution in bamboo plywood of bamboo chip in this blended stock or bamboo silk is crisscross, overlaps mutually and laminates, the bonding integral body that becomes.There are some problems in this bamboo board in manufacture process as can be seen: it is for bamboo mat, bamboo chip hot-press gluing, and is very low to the utilization rate of mao bamboon material, has wasted a large amount of bamboo wood material.
Summary of the invention
Use the bamboo silk at the bottom of the object of the invention is to provide a kind of, the middle bamboo chip of mixing of using carries out bamboo integration plate gluing, that be overrided to form, can solve for the very big problem of mao bamboon waste of material, thus the utilization rate of raising mao bamboon material.
For achieving the above object, the present invention adopts following technical scheme: a kind of bamboo integration plate, the layer structure that it is mixed and made into by the bamboo silk in the bamboo pole, assorted bamboo wood and sizing material, it is characterized in that: the aspect up and down of this circuit board is bamboo silk surface layer, the bamboo silk bottom that is made of for the bamboo silk material, and the intermediate layer of this circuit board is the bamboo wood interlayer that is made of for assorted bamboo chip material; Perhaps the material of this circuit board all is made of the bamboo silk; The diameter of its mao bamboon silk is between 0.5mm-5mm; A side of the bamboo wood interlayer in this bamboo integration plate is provided with the prominent tenon of connection, and the another side is provided with and the match tongue-and-groove of embedding circle of described prominent tenon; The step of its preparation method is as follows: a) be raw material with the bamboo pole, take out the bamboo silk by drawing after going blue or green table to hack earlier, carry out physics and chemistry after the tip of bamboo pole, root, assorted bamboo are hacked and handle; B) the bamboo silk causes about moisture content to 20% through drying then by desugar, degreasing, charing or dyeing, sends into infrared drier behind the impregnation again and is dried to about 10%; C) the bamboo silk is the orderly mould bottom that is tiled in is a bamboo silk bottom, and being tiled in that the bamboo chip of will mixing then is unordered is the bamboo wood interlayer above the bamboo silk, and last is bamboo silk surface layer with orderly being tiled on the assorted bamboo chip of bamboo silk again; Perhaps the material of this circuit board all is made of the bamboo silk, and directly the arrangement that the bamboo silk is orderly is tiled in the mould; D) raw material carry out precooling through after stacked the finishing under 0 ℃ of-40 ℃ of temperature, pressurize about one hour the back demoulding bamboo board is carried out hot pressing under 100 ℃ of-150 ℃ of temperature, material is 800Mpa-1200Mpa for normal pressure under the situation of assorted bamboo clappers in the bamboo wood interlayer, normal pressure is 600Mpa-1200Mpa under the situation that the material of circuit board all is made of the bamboo silk, lateral pressure is 400Mpa-800Mpa, after the pressurize 20 minutes, hot-forming bamboo board was cooled off 10-30 minute under 0 ℃ of-40 ℃ of temperature; E) constant temperature is deposited 2-5 days aftershapings then.
The present invention compared with prior art has following advantage:
1, is widely used in floor in the house ornamentation, ceiling and various furniture panels etc.
2, sawing arbitrarily, have indeformable, do not ftracture, do not go mouldy, intensity height, flexible.
3, water resistance is good, and plasticity is strong.
4, production technology is simplified, but using electricity wisely 40% less manpower 40%, and former bamboo interest rate is brought up to about 90% by original 60%, has improved the consumable quantity of full Integral bamboo veneer in the past, greatly reduces production cost.
5, the surface of bamboo board is to form with bamboo silk compacting, thereby has formed natural wood texture effect, and is not only elegant in appearance but also do not show the Green Product of joint crust.
Description of drawings
Fig. 1 is a structural representation of the present invention
Fig. 2 is a stereogram of the present invention
The specific embodiment
Embodiment 1
1) adopting bamboo pole commonly used on the market, is raw material with the bamboo pole, and taking-up bamboo silk is drawn by going blue or green table to hack the back by elder generation, carries out physics and chemistry after the tip of bamboo pole, root, assorted bamboo are hacked and handles;
2) the bamboo silk causes moisture content to 18% through drying then by desugar, degreasing, charing, sends into infrared drier behind the impregnation again and is dried to 12%;
3) the bamboo silk is the orderly mould bottom that is tiled in is a bamboo silk bottom 2, and being tiled in that the bamboo chip of will mixing then is unordered is bamboo wood interlayer 3 above the bamboo silk, and last is bamboo silk surface layer 1 with orderly being tiled on the assorted bamboo chip of bamboo silk again;
4) raw material carry out precooling through after stacked the finishing under 22 ℃ of temperature, pressurize after 55 minutes the demoulding bamboo board is carried out hot pressing under 148 ℃ of temperature, material is assorted bamboo in the bamboo wood interlayer 3, its normal pressure that gives is 1150MPA, lateral pressure is 580MPA, pressurize 22 minutes is cooled off hot-forming bamboo board 27 minutes under 19 ℃ of temperature;
5) constant temperature is deposited 4 days aftershapings then.
Embodiment 2
1) adopting bamboo pole commonly used on the market, is raw material with the bamboo pole, and taking-up bamboo silk is drawn by going blue or green table to hack the back by elder generation, carries out physics and chemistry after the tip of bamboo pole, root, assorted bamboo are hacked and handles;
2) the bamboo silk causes moisture content to 22% through drying then by desugar, degreasing, dyeing, sends into infrared drier behind the impregnation again and is dried to 8%;
3) material of this circuit board all is made of the bamboo silk, all is tiled in the bamboo silk in the mould;
4) raw material carry out precooling through after stacked the finishing under 36 ℃ of temperature, pressurize after 1 hour 10 minutes the demoulding bamboo board is carried out hot pressing under 105 ℃ of temperature, its normal pressure that gives is 680MPA, lateral pressure is 400MPA, pressurize 17 minutes is cooled off hot-forming bamboo board 12 minutes under 33 ℃ of temperature;
5) constant temperature is deposited 3 days aftershapings then.
Embodiment 3
1) adopting bamboo pole commonly used on the market, is raw material with the bamboo pole, and taking-up bamboo silk is drawn by going blue or green table to hack the back by elder generation, carries out physics and chemistry after the tip of bamboo pole, root, assorted bamboo are hacked and handles;
2) the bamboo silk causes moisture content to 17% through drying then by desugar, degreasing, degreasing, sends into infrared drier behind the impregnation again and is dried to 13%;
3) the bamboo silk is the orderly mould bottom that is tiled in is a bamboo silk bottom 2, and being tiled in that the bamboo chip of will mixing then is unordered is bamboo wood interlayer 3 above the bamboo silk, and last is bamboo silk surface layer 1 with orderly being tiled on the assorted bamboo chip of bamboo silk again;
4) raw material carry out precooling through after stacked the finishing under 5 ℃ of temperature, pressurize after 1 hour 02 minute the demoulding bamboo board is carried out hot pressing under 130 ℃ of temperature, material is assorted bamboo in the bamboo wood interlayer 3, its normal pressure that gives is 960MPA, lateral pressure is 550MPA, pressurize 20 minutes is cooled off hot-forming bamboo board 15 minutes under 7 ℃ of temperature;
5) constant temperature is deposited 2 days aftershapings then.
Embodiment 4
1) adopting bamboo pole commonly used on the market, is raw material with the bamboo pole, and taking-up bamboo silk is drawn by going blue or green table to hack the back by elder generation, carries out physics and chemistry after the tip of bamboo pole, root, assorted bamboo are hacked and handles;
2) the bamboo silk causes moisture content to 23% through drying then by desugar, degreasing, degreasing, sends into infrared drier behind the impregnation again and is dried to 9%;
3) material of this circuit board all is made of the bamboo silk, all is tiled in the bamboo silk in the mould;
4) raw material carry out precooling through after stacked the finishing under 12 ℃ of temperature, pressurize after 1 hour 6 minutes the demoulding bamboo board is carried out hot pressing under 128 ℃ of temperature, the material of this circuit board all is made of the bamboo silk, its normal pressure that gives is 860MPA, lateral pressure is 500MPA, pressurize 24 minutes is cooled off hot-forming bamboo board 18 minutes under 15 ℃ of temperature;
5) constant temperature is deposited 5 days aftershapings then.
Claims (4)
1. bamboo integration plate, the layer structure that it is mixed and made into by the bamboo silk in the bamboo pole, assorted bamboo wood and sizing material, it is characterized in that: the aspect up and down of this circuit board is bamboo silk surface layer (1), the bamboo silk bottom (2) that is made of for the bamboo silk material, and the intermediate layer of this circuit board is the bamboo wood interlayer (3) that is made of for assorted bamboo chip material; Perhaps the material of this circuit board all is made of the bamboo silk.
2. bamboo integration plate according to claim 1, the diameter of its mao bamboon silk are between 0.5mm-5mm.
3. bamboo integration plate according to claim 1 is characterized in that: a side of the bamboo wood interlayer (3) in this bamboo integration plate is provided with the prominent tenon (4) of connection, and the another side is provided with and the match tongue-and-groove (5) of embedding circle of described prominent tenon (4).
4. bamboo integration plate according to claim 1, its preparation method is characterised in that:
A) with the bamboo pole be raw material, take out the bamboo silk by drawing after going blue or green table to hack earlier, carry out physics and chemistry after the tip of bamboo pole, root, assorted bamboo are hacked and handle;
B) the bamboo silk causes about moisture content to 20% through drying then by desugar, degreasing, charing or dyeing, sends into infrared drier behind the impregnation again and is dried to about 10%;
C) the bamboo silk is the orderly mould bottom that is tiled in is a bamboo silk bottom (2), and being tiled in that the bamboo chip of will mixing then is unordered is bamboo wood interlayer (3) above the bamboo silk, and last is bamboo silk surface layer (1) with orderly being tiled on the assorted bamboo chip of bamboo silk again; Perhaps the material of this circuit board all is made of the bamboo silk, and directly the arrangement that the bamboo silk is orderly is tiled in the mould;
D) raw material carry out precooling through after stacked the finishing under 0 ℃ of-40 ℃ of temperature, pressurize about one hour the back demoulding bamboo board is carried out hot pressing under 100 ℃ of-150 ℃ of temperature, material is 800Mpa-1200Mpa for normal pressure under the situation of assorted bamboo clappers in the bamboo wood interlayer (3), normal pressure is 600Mpa-1200Mpa under the situation that the material of circuit board all is made of the bamboo silk, lateral pressure is 400Mpa-800Mpa, after the pressurize 20 minutes, hot-forming bamboo board was cooled off 10-30 minute under 0 ℃ of-40 ℃ of temperature;
E) constant temperature is deposited 2-5 days aftershapings then.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100067699A CN101219553A (en) | 2008-01-31 | 2008-01-31 | Bamboo integration plate and production method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100067699A CN101219553A (en) | 2008-01-31 | 2008-01-31 | Bamboo integration plate and production method thereof |
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| CN101219553A true CN101219553A (en) | 2008-07-16 |
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| CNA2008100067699A Pending CN101219553A (en) | 2008-01-31 | 2008-01-31 | Bamboo integration plate and production method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102773901A (en) * | 2012-08-10 | 2012-11-14 | 浙江九川竹木有限公司 | Bamboo filament composite board and method for processing same |
| CN101863065B (en) * | 2009-04-14 | 2014-11-05 | 上海缘竹实业有限公司 | Process for manufacturing large-breadth plates by using all-bamboo modified material |
| CN111605284A (en) * | 2020-05-26 | 2020-09-01 | 戴武军 | Preparation method of novel bamboo leaf filament woven composite material |
-
2008
- 2008-01-31 CN CNA2008100067699A patent/CN101219553A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101863065B (en) * | 2009-04-14 | 2014-11-05 | 上海缘竹实业有限公司 | Process for manufacturing large-breadth plates by using all-bamboo modified material |
| CN102773901A (en) * | 2012-08-10 | 2012-11-14 | 浙江九川竹木有限公司 | Bamboo filament composite board and method for processing same |
| CN102773901B (en) * | 2012-08-10 | 2014-09-24 | 浙江九川竹木有限公司 | Bamboo filament composite board and method for processing same |
| CN111605284A (en) * | 2020-05-26 | 2020-09-01 | 戴武军 | Preparation method of novel bamboo leaf filament woven composite material |
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