CN101208624A - Optical device with cantilevered fiber array and method thereof - Google Patents

Abstract

A fiber alignment device comprises a base having at least one alignment groove, a stripped portion of an optical fiber positioned in the at least one alignment groove, where a terminal end of the fiber extends beyond at least one of an end face of the base, and an end face of a cover bonded to the base to secure the optical fiber between the base and the cover, where an end face of the cover and the end face of the base are substantially non- parallel.

Description

Optical devices and method with cantilever fiber array

The cross reference of related application

The application requires the U.S. Provisional Patent Application 60/693,820 of submission on June 24th, 2005; 60/693,847; 60/693, No. 851 right of priority.The whole contents of each in these applications all is incorporated into this by reference.

Technical field

The present invention relates generally to a kind of cantilever fiber array (CFA).This CFA can use with the integrated form plane waveguiding device such as planar optical waveguide (PLC).

Background technology

Optics industry is being developed one or more optical function is being attached to integrated form plane waveguiding device on the single parts at present.Problem is the method that is connected to these integrated devices/connect from these integrated devices optically.Current industrial standard is the open joint that has between seedbed alignment light fibre array and the optics.This method need be used expensive equipment and may be relatively time-consuming usually.

For example, directly the optical fiber connection can be used in and attempts to reduce assembly cost, and keeps optical transmission qualities simultaneously.Manufacturer is just attempting the optical fiber align feature directly is placed on the optical device.The conventional method that is used for the optical fiber connection comprises that " once single optical fiber " is connected with a large amount of optical fiber.

Because small size and space compactness, " once single optical fiber " method need accurately be fixed in each position, and in binding time whole optical fiber is held in place then.In addition, it will be very time-consuming handling each optical fiber.

For example, the U.S. 6,859,588,6,795, No. 634 patents and No. 2003/0142922 provisional application have been described conventional optic module (block) structure and manufacture method.

Summary of the invention

According to first exemplary embodiment, the optical fiber align device comprises the substrate with at least one alignment slot, be positioned at the part that exhumes of the optical fiber in this at least one alignment slot, wherein the terminal of optical fiber stretch out above the end face of substrate and be incorporated into substrate lid end face at least one of them, lid is in order to be fixed on optical fiber between substrate and the lid, and the end face of its middle cover and the end face of substrate are uneven basically.On the one hand, the terminal of optical fiber extends beyond the end face of substrate.On the other hand, the optical fiber align device can be configured such that the end face of lid extends beyond the end face of substrate.On the other hand, the substrate end face extends beyond the end face of lid.On the other hand, the terminal of optical fiber is extending from the end face of lid and the essentially identical distance of end face of substrate.Another aspect is provided with the space tack coat between substrate and lid.

Another aspect, optical fiber align device can also comprise and be arranged on the viscosity panel (fillet) in one of them at least that covers end face and substrate end face.On the other hand, substrate also comprises in order to support the do not exhume Support of part of optical fiber.On the other hand, lid also comprises the Support.

On the other hand, substrate also comprises isolated substantially parallel a plurality of grooves, to admit a plurality of optical fiber.On the other hand, these a plurality of optical fiber extend out from fiber ribbon connector.

On the other hand, when fiber orientation was in alignment slot, fiber body was extended above the first surface of substrate.

On the other hand, the surface that is arranged on the lid on the above-mentioned optical fiber that is positioned is the plane basically.Aspect substituting, the surface that is arranged on the lid on the above-mentioned optical fiber that is positioned comprises at least one alignment slot.

On the other hand, lid and substrate one of them comprises along the passage of the direction formation that is transverse at least one alignment slot at least.

On the other hand, substrate comprise silicon, quartz and borosilicate glass one of them.On the other hand, lid comprises quartz.Another Fang Miangai comprises the silicon dioxide of fusion.

Another aspect, at least one edge of lid is chamfering.

In yet another embodiment, the optical fiber align device comprises the substrate with at least one alignment slot, be positioned at the part that exhumes of the optical fiber at least one alignment slot, wherein the terminal of optical fiber stretches out the end face above substrate, with the lid that is connected in base substrate, lid is fixed in optical fiber between base substrate and the lid, and the end face of its middle cover extends beyond the end face of substrate.

On the other hand, the end face of lid is positioned near the end face of optical fiber.

On the other hand, the terminal of optical fiber extends beyond lid.

On the other hand, substrate also comprises the Support partly of not exhuming that is used to support at least one optical fiber.

In another embodiment of the present invention, the optical fiber align device comprises the substrate with at least one alignment slot, be positioned at the part that exhumes of the optical fiber at least one alignment slot, wherein the terminal of optical fiber stretches out the end face above substrate, with the lid on the top surface that is incorporated into base substrate, lid is in order to be fixed on optical fiber between substrate and the lid, and wherein the substrate end face extends beyond the end face of lid.

In another embodiment, what be used for the optical fiber align device comprises the substrate with at least one alignment slot at line structure, be positioned at least one alignment slot, have a part that exhumes of the optical fiber of terminal, and be incorporated into substrate, with optical fiber be fixed on substrate and the lid between lid, its middle cover and substrate one of them has a sacrificial region at least.

On the other hand, interconnection has prevented to be arranged on flowing of cementing agent between lid and the substrate.

On the other hand, at least one interconnection is arranged on the passage in lid and the substrate.

On the other hand, interconnection is substantially perpendicular to the alignment slot orientation.

On the other hand, interconnection has the cross section of V-arrangement shape.

On the other hand, interconnection has the cross section of basic rectangular shape.

On the other hand, substrate also comprises with the isolated a plurality of alignment slots of substantially parallel mode, to admit a plurality of optical fiber.On the other hand, these a plurality of optical fiber extend out from fiber ribbon connector.

On the other hand, when at least one fiber orientation was in alignment slot, fiber body was extended above the first surface of substrate.

On the other hand, the surface that is arranged on the lid on the optical fiber that is positioned is the plane basically.Aspect substituting, the surface that is arranged on the lid on the optical fiber that is positioned comprises at least one alignment slot.

On the other hand, substrate comprises one of them of silicon, quartz and borosilicate glass.On the other hand, lid comprises the silicon dioxide of fusion.

Another aspect, an edge of lid is chamfering.

In another embodiment of the present invention, the method that forms the optical fiber align device may further comprise the steps, provide and have the substrate that is formed at least one alignment slot on its first surface, lid is provided, and, form the interconnection that is transverse at least one alignment slot orientation at least on one of them of the first surface of the first surface of substrate and lid.This method also comprises: the part that exhumes of optical fiber is placed at least one alignment slot.This method also comprises: lid is incorporated in the substrate, between the first surface with the first surface that optical fiber is fixed on substrate and lid.This method also comprises: discharge (release) in the substrate at interconnection place and the part of one of them at least of lid.

On the other hand, this method also comprises the terminal of polishing fiber.On the other hand, polishing was carried out before release steps.

On the other hand, the terminal of optical fiber is one of them of polishing terminal of flat polishing terminal, the polishing terminal of taper, angled polishing terminal and wedge shape.

On the other hand, after release steps, the terminal of optical fiber extend beyond the end face of lid and substrate end face at least one of them.

On the other hand, after release steps, the terminal of optical fiber extends beyond the end face of lid and substrate.

On the other hand, release steps comprises: to the sacrificial region of the sacrificial region of substrate and lid one of them applies power at least, wherein the direction of power be transverse to the plane of substrate and lid the plane at least one of them.

On the other hand, substrate also comprises the Support on the first surface that is formed on substrate.

On the other hand, this method also comprises: to the Support adhesive stripe-coating, with at least one non-part that exhumes of fixed fiber.

On the other hand, the formation of interconnection comprises: one of them of cutting technique, etch process and grinding process.

In another embodiment, the method that forms a plurality of optical fiber align devices may further comprise the steps, and the substrate with base part array is provided, and wherein each base part all has at least one alignment slot on the first surface of substrate.This method also comprises: form interconnection in substrate, wherein interconnection is transverse at least one alignment slot orientation.This method also comprises: with peeling off at least one alignment slot that partly is placed in each base part of optical fiber.This method also comprises: lid is incorporated on the top surface of base substrate, at least one optical fiber is fixed between substrate and the lid.This method also comprises makes substrate individualized (singulating), forming a plurality of alignment devices, and removes the sacrificial region of one of them at least of substrate and lid.

On the other hand, each base part comprises that also the stress on the first surface that is formed on substrate alleviates the district.

On the other hand, this method also is included in and removes the step terminal of polishing fiber before.

On the other hand, optic fibre connector is formed by the polishing terminal of the polishing terminal of flat partially polishing terminal, taper, angled polishing terminal and wedge shape one of them.

In another embodiment, the method that forms the optical fiber align device may further comprise the steps: preparation comprises the optical cable of a plurality of optical fiber, wherein preparation process comprise the coiling optical cable one or more optical fiber, peel off one or more optical fiber of optical cable and break optical cable one or more optical fiber at least one of them.This method also comprises: the preparation substrate, in order to admit prepared optical fiber, wherein this preparation process also is included in and forms a plurality of alignment slots on the first surface of substrate.This preparation process can also be included in the substrate and to form stress and alleviate the district.This preparation process can also be included in and form interconnection in the substrate, and wherein interconnection is transverse to the alignment slot orientation.This method also comprises provides lid.Lid can comprise the inside surface on plane basically, and can comprise the interconnection in the inside surface that is formed on plane basically.

This method can also comprise the part that exhumes from the optical fiber of optical cable is placed in a plurality of alignment slots, and the non-part that exhumes of optical fiber is placed on stress alleviates the district.This method can also comprise the substrate of lid being aimed at filling optical fiber.This method can also comprise that the substrate with filling optical fiber is incorporated into lid, to be formed on linear light fibre array structure.Can be used for optical fiber being incorporated into substrate and covering by the utilization structure cementing agent.

This method can also comprise the terminal that polishes online fiber array structure or polish one of them of terminal of online fiber array structure.Polishing provide the polishing terminal of polishing terminal, taper of flat polishing terminal, the wedge shape of optical fiber or angled polishing terminal at least one of them.This method also comprises at least one of them the optical fiber of release from the sacrificial section of sacrificial section of covering and substrate.This method can also comprise the optical fiber that cleaning discharges.

In another embodiment of the present invention, optical device comprises the cantilever fiber array (CFA) that is coupled in planar optical waveguide (PLC).The cantilever fiber array comprises the substrate of a part that supports at least one optical fiber in the fiber guides passage, with the lid that is incorporated into substrate and/or at least one optical fiber, the terminal of wherein said at least one optical fiber extends beyond the end of one of them at least of substrate and lid.Planar optical waveguide comprises and is formed on on-chip slab guide that slab guide comprises waveguide core.The terminal of the optical fiber of cantilever fiber array is arranged in the alignment slot of a part that is formed at the planar optical waveguide substrate.The optics interface place of interconnection between the terminal of waveguide core and at least one optical fiber is formed in the planar optical waveguide substrate.On the one hand, the cantilever fiber array comprises a plurality of optical fiber that are arranged in can isolated substantially parallel a plurality of fiber guides passages.In this respect, planar optical waveguide comprises the waveguide with a plurality of waveguide core and is formed on a plurality of grooves in the planar optical waveguide substrate.

On the other hand, described at least one optical fiber comprises fiber ribbon connector.On the other hand, the part that exhumes of at least one optical fiber is arranged in the fiber guides groove.

On the other hand, the cantilever fiber array comprises the structural adhesive in order at least one optical fiber be incorporated into the fiber guides groove and cover.On the other hand, the substrate end face forms at a certain angle.

On the other hand, at least one interconnection is formed in lid and the substrate.

On the other hand, interconnection is formed in the lid, is substantially perpendicular to the alignment slot orientation of substrate.

On the other hand, the refractive index match cementing agent of uV curable is used for cantilever optical fiber is incorporated into planar optical waveguide.

On the other hand, the cantilever fiber array comprises the substrate with at least one alignment slot, is positioned at the part that exhumes of the optical fiber at least one alignment slot, and wherein the terminal of optical fiber stretches out the end face above substrate; And be incorporated into base substrate top surface, with optical fiber be fixed on base substrate and the lid between lid, the end face of its middle cover extends beyond the end face of substrate.On the other hand, the end face of lid is positioned near the end face of optical fiber.

In another embodiment; to be coupled in method such as the optical fiber align device of CFA such as the fiber waveguide device of PLC; may further comprise the steps: the optical fiber align device is provided, and the optical fiber align device has the lid of the cantilever terminal of the floating stretching, extension partly of at least one optical fiber of protection.This method also comprises: the exposed end subdivision of at least one optical fiber should be aimed at the lip-deep alignment characteristics of fiber waveguide device.This method also comprises the optical fiber align device is incorporated on the fiber waveguide device.

On the one hand, fiber waveguide device comprises and is formed on on-chip slab guide that slab guide comprises waveguide core.Interconnection is formed on the substrate of fiber waveguide device between the end of alignment characteristics and waveguide core first.The method that the optical fiber align device is connected in fiber waveguide device can also comprise: at least one optical fiber is arranged in the alignment characteristics, and wherein the terminal of at least one optical fiber is provided with near the on-chip interconnection that is formed at fiber waveguide device.

On the other hand, the refractive index match cementing agent of coating and curing ultraviolet curable is to be incorporated into fiber waveguide device with the cantilever fiber array.

In another embodiment, the cantilever fiber array is the parts of dismountable connector assembly, dismountable connector assembly cooperates with PLC, and PLC cooperates with female component, like this when connector cooperates with socket, optical fiber in the cantilever fiber array is inserted in the receiving channel that is integrated on the PLC, to realize the optically-coupled between optical fiber and the waveguide.

In another embodiment, the cantilever fiber array is the parts of read-out system, and read-out system is used to inquire the PLC device that constitutes sensor.In this case, the cantilever fiber array aligns with the PLC receiving channel with optical waveguide, the light signal of turnover PLC sensor so that read-out system can be coupled.

Above-mentioned general introduction of the present invention is not to want to describe embodiment or each device shown in each of the present invention.Accompanying drawing and following detailed more specifically illustrate these embodiment.

Description of drawings

Fig. 1 is the axonometric drawing that waits of exemplary cantilever fiber array.

Fig. 2 A-2F illustrates the side view of another representative configuration of cantilever fiber array.

Fig. 3 A illustrates the side view of exemplary online fiber array structure.

Fig. 3 B illustrates three examples of the structure of basement that is used for online fiber array structure.

Fig. 4 is the process flow diagram that the method for cantilever fiber array is made in explanation.

Fig. 5 A illustrates the side view of exemplary CFA-PLC device.

Fig. 5 B illustrates with the CFA of batch form manufacturing and the top view of PLC, comprises the CFA band of not section and the PLC band of not cutting into slices.

Fig. 6 is the axonometric drawing that waits of exemplary PLC.

Fig. 7 A illustrates the axonometric drawing that waits of another CFA device, Fig. 7 B illustrate Fig. 7 A another CFA device decomposition wait axonometric drawing.

Fig. 8 illustrates the axonometric drawing such as grade of the PLC device that is configured to sensor.

Fig. 9 illustrates the axonometric drawing that waits of another CFA-PLC device.

Figure 10 A and 10B illustrate another CFA plug-type element etc. axonometric drawing and decomposition view.

Figure 11 A-11E illustrates the order of connection figure of the CFA-PLC device of Fig. 9.

Though for various embodiment and alternative form, the details by illustrating by way of example in the accompanying drawings, the present invention is revisable, and will describe the present invention in detail.But those of ordinary skill in the art should be appreciated that the present invention and is not limited to described specific embodiment that opposite is that the present invention will cover its all modification, equivalent and replacement scheme.

Embodiment

In the following description will be with reference to the accompanying drawings, accompanying drawing constitutes a part of the present invention, and illustrates in the mode of graphic extension in the accompanying drawing and can realize embodiments of the invention.In this respect, the term of directivity, for example " top ", " end ", " preceding ", " back ", " front end ", " rear end " etc. " all use according to the orientation of the accompanying drawing that is described.Because the parts of the embodiment of the invention can be positioned with many different orientations, so the term of directivity is used for illustrative purposes, rather than the purpose that is used to limit.Should be appreciated that and to utilize other embodiment, and without departing from the present invention, can carry out structure and logic and change.

Embodiments of the invention relate generally to the device that is called cantilever fiber array (CFA).CFA can be used for such as the coupling of the plane waveguiding device of planar optical waveguide (PLC).The present invention also provides the method for manufacturing, assembling and polishing CFA, and CFA can provide no seedbed to carry out the mechanism that a large amount of terminals directly lead to optics.The present invention also provides the mechanism that convenience is assembled automatically and (many) wide fiber arrays are handled in processing.The present invention also provides does not have the method that PLC is coupled in the seedbed with one or more CFA.

As waiting shown in the axonometric drawing of Fig. 1, exemplary CFA 100 comprises for example from the one or more optical fiber 110 such as optical cable band 115.The part that exhumes of optical fiber is installed in substrate or substrate 120 (also being called base substrate here).Substrate 120 comprises a plurality of optical fiber guidess or the passage 125 such as V-shaped groove, and the part that exhumes of optical fiber 110 is set at wherein and therein and is directed.Lid 130 can selectively be arranged on the optical fiber of substrate/be directed, and preventing optical fiber at passage or groove intrinsic displacement, and provides additional supporting role.In addition, (for example can provide such as structural adhesive, that heat is quickened or heat-setting structural adhesive (for example bi-component epoxide-resin etc.)) cementing agent (seeing Fig. 2 A-2F) optical fiber being incorporated on substrate 120 and the guides 125, and will covering 130 and be incorporated on the substrate 120.As shown in Figure 1, relatively thin adhesive layer 140 can be formed on cover 130 and substrate 120 between.Form CFA and the method that CFA is coupled in PLC is described in detail below.

Substrate or substrate 120 partly provides a supporting role for exhume part and non-the exhuming of the optical fiber that is aligned.The material of exemplary substrate or substrate 120 is the silicon (Si) with [100] crystal orientation, and it provides the V-shaped groove that accurately forms with conventional silicon photoetching process foundation structure.Also can utilize other materials (for example silicon dioxide of quartz, fusion, borosilicate glass etc.).For example, the silicon dioxide of fusion provides and the essentially identical chemical characteristic of the optical fiber that is aligned, mechanical property and thermal characteristics.In one exemplary embodiment, utilize the telecommunication optical fiber of conventional silicon-dioxide-substrate, for example can buy from Corning Inc. (Corning, New York, United States), external diameter (OD) is the SMF-28 Photonic optical fiber of 125 μ m.It will be clear to one skilled in the art that according to the embodiments described herein, can utilize the many dissimilar conventional fiber of various outer diameter.

The material of the lid 130 of exemplary is a silica-based materials, for example silicon dioxide of fusion or quartz, and it mates chemical characteristic, mechanical property and the thermal characteristics of the optical fiber that is directed approx.And the chemical substance that is used to clean optical fiber also can be used for lid, and can not stay any kind residue on optical fiber.The lid that the silicon dioxide of fusion is made can utilize and the same equipment cutting that is used for silicon wafer.Just as in the following be described in more detail, when polishing/polishing operation, the silicon dioxide cover material of fusion is removed neatly, and can coated fiber.In addition, fused silica lid can be to ultraviolet (UV) optical transparency, and when the waveguide device that CFA is incorporated into such as PLC, this can allow the refractive index match optical bond of utilizing exemplary UV activation heat to solidify.For example, can utilize from the Daikin Industries of Osaka, Japan (Osaka), Ltd. obtain such as Optodyne ^TMThe cementing agent of UV-2100 or UV-3100.Suitable cementing agent also is described in No. 11/423,191, the unexamined U.S. Patent application of owning together, and the whole contents of this application is by with reference in conjunction with therewith.In an alternative embodiment, can be used to form such as the material of the material of silicon or other silicon-dioxide-substrates and cover 130.

In addition, adhesive layer 140 can be used structural adhesive, and for example the epoxy resin of thermosetting or heat acceleration forms.For example, the cementing agent such as 3M DP-190Scotch-Weld cementing agent that can obtain with 3M company from the Saint Paul City, State of Minnesota, US.And, according to the bonding properties and the engineering properties of the material that is suitable for substrate and lid, also can use the cementing agent of other types.

The more detailed view of a plurality of exemplary embodiments is shown with the side view form in Fig. 2 A-2F.Though an optical fiber only is shown in each exemplary embodiment, each CFA embodiment can comprise one or more optical fiber according to the purposes of hope.

The CFA 200 of Fig. 2 comprises substrate or the substrate 220 that is similar to substrate recited above or substrate 120.This substrate or substrate 220 comprise fiber support district 225 and fiber guides district 226, and fiber guides district 226 comprises the fiber guides passage such as V-shaped groove.Being positioned at the number of the V-shaped groove in fiber guides district can be identical with the quantity of the optical fiber that is aligned or more than the quantity of the optical fiber that is aligned.Fiber support district 225 supports the non-part that exhumes of optical fiber 210, and the part that exhumes of optical fiber can be arranged in the passage that is formed in the fiber guides district 226." exhuming " part 212 of optical fiber 210 is called the covering photoconduction part of fiber cores/optical fiber, and it can have one or more removed protection buffer coats, in order to the covering of glass core/optical fiber of exposing optical fiber.Optical fiber is " cantilevered fashion ", and wherein its terminal extends beyond one of them or two end faces of end face 223,233.

Cementing agent 240 such as hot setting adhesive can be arranged on substrate or the substrate 220, so that optical fiber is incorporated into the support portion.Cementing agent also is used for selectable lid 230 is incorporated into substrate or substrate 220.Though cover 230 be shown have substantitally planar/flat structure, aspect substituting, lid 220 can be configured to comprise the Support that is similar to the district 225 on substrate or the substrate 220.Structure (being described below) according to the online device that is used to form CFA 200A also is formed on cementing agent panel (fillet) 242 on the end face of substrate-substrate or lid, perhaps on both end faces.Cementing agent panel 242 can provide stress to alleviate mechanism, promptly " slow down " between substrate and lid from support/unsupported cantilever portion seldom to the transfer of complete Support.

In addition, shown in Fig. 2 A, and as below describe in detail, the end face 233 of end face of base substrate 223 and lid is uneven.And, in this structure, can be that flat polishing terminal, the polishing terminal of taper, the polishing terminal of wedge shape or the optic fibre connector of angled polishing terminal extend beyond end face 223,233.

In the embodiment of Fig. 2 A, end face 223,233 is with respect to the optical fiber that extends close mutually (that is the about same distance of terminal 213 distances of end face 223,233 and cantilever optical fiber).In the different embodiment shown in Fig. 2 B, CFA 200B comprises that end face 234 extends to the lid 230 of the terminal 213 of optical fiber.In this embodiment, the lid that extends to the terminal of optical fiber can at utmost reduce by be used for CFA be connected in PLC cementing agent internal stress and the potential site of the optical fiber that causes changes.In this embodiment, lid end face 234 can be the end face that is polished to flat, angled polishing, the taper polishing or wedge shape polishing, and substrate end face 223 is angled.

In another embodiment shown in Fig. 2 C, the lid 230 of CFA 200C is butts, makes the distance that the end face 223 of base substrate extends greater than the end face 233 of lid 230 along the distance of optic fibre extension.In another embodiment shown in Fig. 2 D, the end face 233 of the lid 230 of CFA 200D extends with the distance of extending greater than base substrate end face 223 along optical fiber.

In another embodiment shown in Fig. 2 E, lid 230 can extend beyond the terminal 213 of the optical fiber that exhumes.In another embodiment shown in Fig. 2 F, CFA comprises the substrate or the substrate 220 of the terminal 213 that extends beyond the optical fiber that exhumes.

In addition, in each embodiment of Fig. 2 A-2F, substrate end face/lid end face 223,233 all is uneven.

In the alternate embodiment (not shown),, thereby do not cover 230 because structural adhesive is used for optical fiber in groove zone 226 in conjunction with on the throne.

According to another embodiment, CFA100 and 200A-200F can be with flat-footed method manufacturings.For example, Fig. 3 A is illustrated in an example of line structure 300, and it can be used in the CFA that makes different structure.Fig. 4 illustrates the process flow diagram 400 of the method step that can be used for manufacturing process.

In step 402, preparation optical fiber.Optical fiber preparation comprises coiling, peels off, cleans and/or cuts each optical cable, perhaps cleans, peels off and/or cut each optical fiber in the fiber ribbon connector.In this step, optical cable can be cut into the certain-length of concrete application, and for example, optical fiber can cut into the length from several millimeters to hundreds of rice on length.The coiling optical cable can protect optical fiber not to be subject to processing damage during manufacture, and make fiber management more direct work as.A free end of the optical cable that winds up then, is stripped from, is cut and cleans.Optical fiber ablation can be finished with routine techniques, technology for example chemistry and/or machinery.Then, cantilever optical fiber can be cut into the length (stress that has deducted cable jacket alleviates the cover part) that length equals base substrate.As the optical fiber preparation part, before the guiding groove or V-shaped groove that optical fiber are placed on substrate, optical fiber can clean with following method: the potassium hydroxide with dilution soaks, and carries out a series of deionized water rinsing and drying then.

In step 404, can make substrate and lid substrate.Just as mentioned above, base substrate is that exhuming partly of optical fiber and the non-part that exhumes provide a supporting role.Exemplary base substrate material is the silicon (Si) with [100] crystal orientation, utilizes conventional silicon photoetching process foundation structure, and this provides the passage such as V-shaped groove that accurately forms.Also can utilize other materials (for example silicon dioxide of quartz, fusion, borosilicate glass etc.).For example, the silicon dioxide of fusion provides chemical characteristic, mechanical property and the thermal characteristics identical with the optical fiber that is aligned approx.Other substrate material (for example quartzy) can be by grinding, draw or be shaped with additive method.

When assembling,, can adopt the band of a plurality of base part or a plurality of substrates in order to reduce whole installation time.The base substrate band can comprise the base substrate part corresponding to a plurality of CFA.The thickness of base substrate can, for example, from about 100 μ m in the scope of about 500 μ m, and base widths is configured to wide be enough to support from particular fiber band cable or from the optical fiber of a plurality of fiber ribbon connectors (for example, 4 optical fiber is wide, 8 optical fiber is wide, 12 optical fiber is wide etc.).The length of base substrate be chosen as enough must be long, with the part that exhumes of non-exhume part and the optical fiber that support optical fiber.

Make with the silicon photoetching process that the produced exemplary base substrate of silicon wafer can enough routines, to form the base substrate structure of CFA.For example, shown in the decomposition side view of Fig. 3 A, online CFA structure 300 comprises underlying structure 320, and it manufactures and comprises four main region: the interconnection district 328 that stress alleviates district/fiber support district 325, fiber guides channel region 326, sacrificial section or sacrificial region 329 and is called " engaging gap " here.

The stress of the base substrate of CFA alleviates the district 325 for thicker band jacket fiber 310 provides the space so that optical fiber can be arranged in the guiding channel in zone 326 straightly, and in optical fiber without any violent bending.This space can form by stress being alleviated the recess that the district forms substrate.In addition, stress alleviates district 325 provides calmodulin binding domain CaM, so that cable jacket is bonded on the base substrate.On silica-based substrate, etching technique that can enough routines forms stress and alleviates district 325, and also etches simultaneously such as V-shaped groove, as guiding channel, and etches " engaging gap ".

CFA fiber guides channel region 326 is those parts of holding the base substrate 320 of the passage of proper number or V-shaped groove, and wherein passage or V-shaped groove are formed on the interval of suitable center to center, so that coupling is admitted the channel spacing of PLC device.The fiber section that exhumes is directed and is incorporated in the base substrate passage in this zone.For example, the isolated V-shaped groove in interval of 127 suitable μ m center to center can be used the CFA that produces compact width.According to purposes and the type of the PLC of final coupling, also can with other center to center at interval.

The shape of guiding channel and the degree of depth can be by utilizing the etching technique such as the routine of the anisotropic etching method of KOH, form by the Si3N4 layer to the pre-formation pattern of example silicon substrate.

In exemplary embodiment, the degree of depth of V-shaped groove passage can form according to the diameter that peels off optical fiber, and substrate 320 can be set and cover distance between 330.The height in substrate/lid gap (for example, between about 10 μ m and about 70 μ m, and in some cases between about 40-55 μ m) is arranged to reduce the amount of the cementing agent that is utilized, and increases the bounding force of substrate/lid simultaneously for strength of parts.Aspect preferred, the fiber guides groove is formed at such degree of depth and forms, that is: make the part of fiber body can be positioned on the top surface in fiber guides district.

The sacrificial section of CFA base substrate or sacrificial region 329 also comprise guiding channel, and sacrificial section or sacrificial region 329 are separated with one or more " engaging the gap " passage that fiber guides channel region 326 is transverse to the formation of fiber guides channel direction.Although in Fig. 3 A,, can be formed in the substrate more than one engaging gap in engaging gap 328 shown in the described online CFA structure 300.In grinding/polishing process, sacrificial section or sacrificial region 329 support the optical fiber of aiming at, and protection optical fiber, till they are " released ".Therefore, sacrificial section or sacrificial region 329 can reduce optical fiber during grinding/polishing may by cracked and/or the fracture possibility.In addition, sacrificial section or sacrificial region 329 can be used for increasing the possibility that possibility clean on the fiber end face optics has same length (tolerance in the micron order) basically with all optical fiber and has identical structure.Sacrificial section or sacrificial region 329 also provide during grinding and polishing and have prevented the optical fiber side direction and move forward and backward mobile lateral support effect, and have prevented that miscellaneous part from moving.

" the engaging gap " 328 of CFA base substrate comprises at least one passage or the slit that is transverse to the formation of optical fiber align passage." engaging gap " also with fiber guides district and sacrificial section or sacrificial region separately.Engaging clearance channel or slit 328 can form with etching when forming the fiber guides passage.As further described below, perhaps, when base substrate was cut into the several strips that comprises a plurality of CFA, engaging clearance channel or slit 328 can form by using cutting tool such as the adamas wafer dicing saw to cut in the top surface of base substrate 320 into.

" engaging gap " also can limit or stop in conjunction with the capillary action of cementing agent flow in the sacrificial section or sacrificial region 329 of base substrate.The sacrificial section of lid and base substrate or any cementing agent between the sacrificial region all can combine lid and substrate parts, thereby make that discharging optical fiber afterwards at individualized (singulation) becomes very difficult, even if if not impossible words.And, " engaging gap " 328 can provide the mechanism that separates sacrificial section or sacrificial region, so that discharge optical fiber, thus optical fiber is released into cantilever position, and therefore as described belowly provide categorical mode, when connecting, the cantilever fiber section is arranged in the guiding groove of PLC.In an exemplary embodiment, the etched or cutting forming V-shape shapes in engaging gap 328, thus single stress point is provided when release steps, and provide angled end face for the fiber guides district 326 of the base substrate 320 of ready-made CFA.The engaging gap also can form passages square configuration or other shapes.

For example, Fig. 3 B illustrates the top view of the silicon CFA base substrate of three kinds of different experiments.These substrates are all become suitable width by individualized (singulate), next CFA assembly (ready-made CFA can compare near optical fiber/V-shaped groove cut into slices) in actual applications.All experimental CFA base substrate all have eight V-shaped grooves and have different entire length: 5mm, 7.5mm and 12mm (dividing other length from top to bottom).Have the engaging gap that etching is come out at the bottom of the intermediate base, and upper and lower substrate (as shown in FIG.) has the engaging gap that cuts out with wafer dicing saw.

And, in step 404, can make and cover substrate (if in ready-made CFA, using).Fig. 3 A illustrates exemplary lid 330.In exemplary embodiment, during optical fiber lapping as described below/polishing manufacturing operation, CFA lid 330 with the fiber gripper of peeling off in the passage or V-shaped groove of the sacrificial section of substrate or sacrificial region.In addition, lid can protect optical fiber not to be subjected to too much moving during slice processing.When the CFA assembling was connected with CFA/PLC, lid can also be compressed into V-shaped groove with cantilever optical fiber.Lid can also provide certain supporting role for optical fiber/PLC interface.

Add man-hour in manufacturing, for example, a plurality of lid substrates can be cut into the wide band of a plurality of arrays, with the width of coupling substrate.According to used instrument, the cover fillet band can be cut into and be longer than the base substrate band a little, and long cover fillet band can be used in contact float equipment, so that the position of lid correctly to be set with respect to base substrate.According to the needed rigidity of concrete application, the thickness of exemplary lid can from about 500 μ m in the scope of about 1500 μ m (or bigger), but also be feasible with other lid thickness.For example, the lid 330 with thickness of increase can increase the intensity of CFA/PLC gap fiber support portion.In addition, the thickness of the lid made of the silicon dioxide of the fusion of increase can increase the intensity of the parts in the system of the mechanical property that has as optical fiber, thermal characteristics.And the rigidity of lid increases along with thickness, therefore reduces the flexibility of lid in cohesive process.

Lid 330 can have inside surface basic plane or flat (that is, the surface that contacts with base substrate), and perhaps inside surface can comprise the guiding channel corresponding to the guiding channel in the base substrate.Another substituting aspect, lid 330 can be configured to comprise and be similar to fiber support recited above district.In the exemplary embodiment, lid 330 has flat inside surface, and flat lid production cost is not too expensive.In addition, the amount of optical fiber void area has on every side been reduced in the cross section that covers the flat cover substrate that is arranged on the optical fiber in the V-shaped groove, and this has reduced the amount that can center on the cementing agent of optical fiber after combination.Too much cementing agent around the optical fiber that is provided with can influence optical property.

As the situation of base substrate, lid 330 can comprise engaging gap or passage 338.Be similar to the engaging gap of substrate, " the engaging gap " 338 of CFA lid comprises at least one passage or the slit of the optical fiber align passage formation that is transverse to substrate, and it can separate with lid sacrificial section or sacrifice region 339 mainly covering zone 336.Engaging clearance channel or slit 338 can or use the cutting tool such as diamond saw to form by etching.

In addition, according to the structure of CFA, lid 330 edge can chamfering, so that provide low stress introducing effect for optical fiber.When forming the engaging gap of lid, the chamfering at lid edge can cut out in lid.Perhaps, after slicing step, can be on the edge grinding go out the chamfering of lid.In the application's context, the chamfering of lid comprises that the edge with lid is cut into fillet, prevents that the optical fiber that exposes from directly contacting with the sharp edges of lid.Aspect exemplary, before the CFA assembling, near chamfering stress alleviates the district of the back edge of lid.

" engaging gap " 338 also can be limited or stop in conjunction with the capillary action of cementing agent ground flow the into sacrificial section or the sacrificial region 339 of lid.As mentioned above, the sacrificial section of lid and base substrate or any cementing agent between the sacrificial region all can combine lid and substrate parts, make that discharging optical fiber afterwards at individualized (singulation) becomes very difficult.And in some exemplary embodiments, " engaging gap " 338 can provide the mechanism that separates sacrificial section or sacrificial region, to discharge optical fiber.In exemplary embodiment, therefore engaging gap 338 etched or cutting forming V-shape shapes provide single stress point when release steps.According to various embodiment, the engaging gap 338 of lid can be arranged on the position identical with the engaging gap 328 of substrate along optical fiber, and perhaps the length along optical fiber is arranged on a different position.

Can clean substrate substrate and lid before step 406, so that remove chip.For example, guiding groove or V-shaped groove substrate can be cleaned, and they are checked, to guarantee to have removed particle and any chemical pollutant.Cleaning can be finished by utilizing a series of solution to soak, and for example uses the washing agent/deionized water/acetone/HFE solution of ultrasonic agitation.Can confirm to have or not the existence of chip or other pollutants with visual inspection.

With reference to figure 4, in step 406, carry out optical fiber align.In one embodiment, the end of optical fiber by the optical fiber that will exhume is placed in the fiber guides groove of base substrate and is aligned.In case all optical fiber of each optical cable all suitably are arranged in the guiding groove, then optical cable can be clamped on the throne.Optical cable can be aimed at singly and be clamped, and is positioned at all optical-fibre channel groups on the base substrate with filling.Alleviate area overlapping portion by suitable cable jacket/base substrate stress is set, can further aim at, make the end of cable jacket roughly medially be in stress and alleviate in the district.

In step 408, cover and the aiming at of the base substrate of clogging optical fiber.In one embodiment, the engaging gap 338 that covers can be aimed at the gap 338 that engages on the base substrate.Substrate and lid can pass through, and for example, anchor clamps, vacuum chuck etc. and be held in place are so be in contact with one another.For fear of the potential misalignment of optical fiber, lid is held in the fiber guides surface that makes the inside surface of lid be arranged essentially parallel to substrate.After the lid, reduce joint head, in case suitably have good positioning so that substrate, optical fiber, cap assemblies are clamped together.

In step 410, carry out combination.In one embodiment, by the stress in substrate alleviate the district 325 on the coating finish combination such as the structural adhesive of hot setting adhesive.Before adhesive stripe-coating, clamp substrate 320 and cover optical fiber between 330 can cause each optical fiber with substrate and three dotted lines between covering contact.Capillary action will cause that cementing agent flows along optical fiber/V-shaped groove and between lid and base substrate.At the collection opening part in the engaging gap of lid/substrate, capillary force will diminish, and cementing agent flows and can stop.The curing profile of cementing agent depends on cementing agent.Exemplary cementing agent comprises the 3M DP-190 Scotch-Weld cementing agent that can obtain from the 3M company of Saint Paul City, State of Minnesota, US, and wherein, this cementing agent is the bi-component epoxide-resin that heat is quickened consolidated structures.As noted earlier, also can be with other cementing agent.

In addition, in the exemplary embodiment, the fiber-aligning grooves in base substrate can be configured such that the amount of the structural adhesive of assembling is reduced to minimum near optical fiber, and at least some polymeric binder can influence the propagation of light in optical fiber in use.And when following the curing of high elastic modulus cementing agent, too much cementing agent shrinks certain vertical shortening that can cause optical fiber, and this can cause the microbend loss in optical fiber.For this reason, the interval of the center to center of passage in the fiber guides district or V-shaped groove and shapes/types can be near factors of the amount of the structural adhesive the optical fiber.

In step 412, the terminal of online CFA300 is ground and/or polishes.In this step, optic fibre connector can be polished in batches, so that the polishing terminal of flat polishing terminal, the polishing terminal of taper, angled polishing terminal and wedge shape to be provided.

In exemplary embodiment, the lid 330 of protection optical fiber when CFA300 is included in grinding/polishing in batches.When grinding/polishing, make optical fiber the front and back bending will cause optical fiber breakage, cracked or other damages.And, utilize lid on the throne 330, do not need provisionally optical fiber to be attached in passage or the V-shaped groove.

For example, can utilize such as improved Ultra-TecUltrapol ^The conventional burnishing device of grinding/polishing system grinds/polishes.Exemplary grinding/polissoir keeps quality of finish and surface smoothness, for example, and by utilizing the oscillatory type oscillating arm mechanism, to simplify fiber optic cable management.In the test of being undertaken by the researcher, oscillatory type swing wall is modified into and comprises an adjustable air supported head mechanism, still comprise simultaneously the angular adjustment feature, when changing platen or grinding film (lapping film), provide vertical polishing highly to regulate with box lunch.This adjustable air supported head can provide the grinding/polishing force of easy adjusting when keeping angle regulator.

In addition, utilize the oscillatory type oscillating arm mechanism can help to keep the orientation of CFA assembly to the rotation platen.Keep the CFA assembly to the orientation of rotation platen optical fiber can be squeezed in the V-shaped groove continuously, this makes the possible mobile degree of minimizing that reaches of optical fiber.

In exemplary embodiment, in grinding/polishing operation, the substrate of lid and substrate is prevented bending haply, because the bending of the substrate of lid or substrate can make optical fiber move along guiding channel.

The bending of the substrate of lid and substrate also can cause forming the space of assembling chip between the substrate of optical fiber and lid and substrate.These chips can change the polished angle of optical fiber, depart from the end plane angle of hope a little.In order to help to make the optical fiber in guiding channel to move the degree of minimizing that reaches when polishing, the CFA assembly can be clamped the length of approaching as far as possible end of finishing rigidly.For example, a kind of mechanism can be integrated in the anchor clamps, anchor clamps are fastened on the swing arm assembly.

In step 412, grinding/polishing abrasive media that can usage example, for example, the 3M Diamond LappingFilms that can obtain from the 3M company of Saint Paul City, State of Minnesota, US.Grinding is used for optical fiber preparation is arrived suitable length, and polishing is used to limit the shape of optic fibre connector, and is used to remove the pit that forms in the grinding stage.In test, the sample of CFA (for example carries out grinding and polishing, every is about 30 seconds), utilize the abrasive sheet that reduces the frosted size gradually, be reduced to 15 continuously from 30 microns frosted sizes, 9.0,6.0, then to 3.0 microns abrasive material (being used for grinding) and be used to polish 1.0,0.5 and 0.1 micron frosted size.Said in this example number of times can be along with the width of the size of the number of CFA in sub-component and application specifies and CFA parts and is changed.As those of ordinary skill in the art will be appreciated that, for the explanation of the present invention that provides, can be with multiple substituting grinding/burnishing device.

Above-mentioned grinding/polishing step can carry out in batches; All optical fiber of wherein single CFA or CFA band are all ground and are polished simultaneously, thereby make the minimize variations between each optical fiber.

As mentioned above, a plurality of CFA can be used as band structure, etching, assembling and a grinding/polishing in bulk to a plurality of CFA.In step 414, can carry out individualized (singulation), wherein the band of CFA is by individualized or be sliced into each single CFA.The time interval of this step is to use appointment.If a plurality of CFA are connected in same number of PLC in batches, then individualized can after the end is connected, carrying out.

For single wide mouthful of (singlewide) device, the CFA band can be sliced into suitable width with wafer slice saw or other suitable cutting tools.

In step 416, optical fiber is released from the substrate of substrate and/or lid, to form cantilever optical fiber.In the exemplary embodiment, be released in individualized carrying out afterwards.In release steps 416, the sacrificial section of substrate and/or lid substrate is disconnected, thereby exposes cantilever optical fiber.Release steps can apply suitable power (for example with hand or use instrument) by the sacrificial section to substrate and/or lid substrate and carry out.The direction that applies power preferably is transverse to the plane of substrate/lid (for example, can apply downward power to substrate, to discharge substrate).The existence in " engaging gap " makes covers sacrificial section and can be disconnected up hill and dale, and this is because " engaging gap " forms single stress point, and prevents that cementing agent from flowing to the sacrificial section of substrate and/or lid substrate.According to being used for specifically using desirable structure type (referring to, the example structure shown in Fig. 2 A-2F for example), one of them of the sacrificial section of substrate and/or lid substrate or both sacrificial section can be released.

And, with respect to the embodiment shown in Fig. 2 E and the 2F, can form other sawing mouth 227,228, to obtain than lid or the short optical fiber of substrate.Specifically, in the embodiment of Fig. 2 E, CFA is cut from the bottom surface of substrate, makes the blade of wafer dicing saw by substrate and fiber cut, and enters in the lid, to form slit 227.After forming slit, can discharge the sacrificial section of remaining substrate.Similarly process can be used to make the CFA according to Fig. 2 F, and just the sawing mouth to form slit 228, then discharges the sacrificial section of remaining lid by covering and enter substrate.

In step 418, can utilize cleaning.For example, if CFA will be connected in PLC, then cleaning can be to connect last operation before.Grinding/polishing and sectioning can form a large amount of chips or pollutant, and these chips or pollutant can stop optical fiber to be arranged on fully in the receiving channel of PLC device, and can stop correct light to be propagated.For example, can bathe with hot acid (for example sulfuric acid) and clean, removing any unnecessary structural adhesive, and with the potassium hydroxide groove that dilutes to remove particle.

In another embodiment, for a large amount of productions, whole silicon wafer can be arranged CFA so that array number maximization, perhaps may the matched waveguide device substrate the interval of center to center.Under any situation of two kinds of situations, can assemble in a large number, grind to be similar to above-described mode/polish and the clear light fibre array, reach maximum so that make output.

At last, understand that as the those of ordinary skill in field of the present invention top technology can change.For example, the layout of array substrate substrate can be designed to mate the layout of different PLC device architectures, comprises the interval of the center to center of the number of passage or V-shaped groove and passage or V-shaped groove.As mentioned above, the number that is used for the passage of each PLC or V-shaped groove can be from 1 to x, and wherein X can be any number width limitations of wafer (only by).

In the alternate embodiment shown in Fig. 7 A-7B, CFA 600 can be configured to the optical fiber in conjunction with a plurality of fiber ribbon connectors.In this exemplary embodiment, two independent fiber ribbon connectors 610,611 have been utilized.The optical fiber 612 and 614 that for example, can prepare fiber ribbon connector 610 and 611 as mentioned above.Fibre ribbon 610 and 611 can be to pile up the form setting (as shown in the figure) of setting, perhaps the form setting to be arranged side by side.Base substrate 620 can comprise a plurality of optical fiber guidess or the passage 625 such as V-shaped groove, in passage 625, optical fiber 612 and 614 exhume the part be set up and guide.In this embodiment, optical fiber 612 and 614 is interlaced and be directed on optical fiber guides or passage 625.In addition, lid 630 can comprise passage or otch 638, and when utilizing cementing agent that CFA for example is incorporated into PLC, otch 628 can stop flowing of cementing agent.

As mentioned above, in an exemplary embodiment, CFA recited above can be coupled in planar optical waveguide (PLC).The optical waveguide of PLC partly is the planar optical waveguide that can construct in every way, including, but not limited to, straight line optical waveguide (1 pair 1), optical splitter optical waveguide (1 couple of 2n), the waveguide optical grating wavelength Port Multiplier of array, thermo-optical switch, micro resonator sensor array, and cross connection formula optical waveguide.Understand that as the those of ordinary skill in field of the present invention dissimilar waveguide modes may be used to PLC.

Fig. 5 A illustrates exemplary CFA-PLC structure, optical device 500 with the form of side view.Two critical pieces of device 500 are CFA 501 and PLC 550.CFA 501 for example comprises from the one or more optical fiber 510 such as the optical cable of fiber ribbon connector.The part that exhumes of optical fiber 511 is installed in the substrate 520.Substrate 620 comprises a plurality of optical fiber guidess or passage, and such as V-shaped groove, the part that exhumes of optical fiber 510 is set at wherein and therein and is directed.Lid 530 can selectively be arranged on the optical fiber of substrate/be directed, and preventing optical fiber at passage or groove intrinsic displacement, and is used for the supporting role that provides other when being coupled in PLC 550.In addition, can provide structural adhesive 540, the structural adhesive (for example bi-component epoxide-resin) such as heat quicken to be solidified is used for optical fiber is incorporated into substrate 520 and passage or V-shaped groove, and will cover 530 and be incorporated in the substrate 520.

Because the result that the sacrificial section in above-mentioned release steps discharges, substrate end face 523 (and/or lid end face in another embodiment) can form at a certain angle.In addition, lid 530 can comprise passage or otch 538, and it can stop flowing of cementing agent.The structure of CFA 501 and manufacturing can be carried out in the mode that is similar to above-described CFA of being used for 100 and CFA 200A-200F, make CFA can be one of them in the many kinds of alternative form.For example, in alternate configurations, the orientation of CFA can reverse (for example, substrate is at optical fiber with above the lid), makes the end of base substrate extend beyond the end of lid.In this embodiment, the guiding groove of base substrate can provide vertically the supporting role of (last or following) and level (side is to side) for the cantilever optical fiber that is coupled in PLC.

PLC 550 (following describe in more detail about Fig. 6) can comprise the waveguide substrate 560 that supports waveguide core 570 (for simplicity, the waveguide clad is saved) from Fig. 5 A, and it can selectively be coupled in the output terminal of the cantilever optical fiber of CFA.Waveguide substrate 560 also comprises a plurality of alignment characteristicses, for example such as the optical fiber guides or the passage of V-shaped groove, to admit and to aim at cantilever optical fiber from CFA.The cementing agent 580 of refractive index match, for example the cementing agent of the refractive index match of UV-curable can be used for CFA is incorporated into PLC, but also can use the cementing agent of other types.

Disclose the exemplary method of example and the manufacturing PLC of PLC in U.S. Patent application 2005/0284181 A1 unexamined and that own together number in further detail, the whole contents of this patented claim is incorporated into this by reference.As shown in Figure 6, exemplary PLC can comprise slab guide assembly 20, and it has the alignment characteristics 22 of the one that is used for positioning optical waveguides 24 (for example from CFA).In this exemplary embodiment, individualized (singulated) waveguide assemblies comprises the substrate 26 with the alignment characteristics 22 that is formed on wherein.Etch stopper 28 covering substrates 26.Etch stopper 28 comprises the part (being hidden) that forms pattern in Fig. 6, this part is corresponding to the pattern of alignment characteristics 22.Waveguiding structure 32 is arranged on the etching top layer 28, wherein has only the pattern part of etch stopper 28 not covered by waveguiding structure 32, perhaps exposes.The pattern part that be not capped or that expose of etch stopper 28 can selectively be removed after forming alignment characteristics 22.Be removed even if form the part of pattern, but the part of etch stopper 28 also remains positioned between substrate 26 and the waveguiding structure 32.

In exemplary embodiment, waveguide assemblies comprises the silicon chip 26 of the alignment characteristics with a plurality of V-arrangement shapes (or other shapes) that are formed on wherein.Silicon nitride etch trapping layer 28 is covering substrate 26 between substrate 26 and waveguiding structure 32.Waveguiding structure 32 comprises a plurality of waveguide core 40 (each is corresponding to an alignment characteristics 22) that are clipped between downside clad 42 and the upside clad 44.

In addition, PLC 20 also comprises the interconnection 50 that for example forms by sawing mouth or other similar operations, it is formed on the joint of waveguide core 40 and alignment characteristics 22, removing any residue fillet, and provide in the end of waveguide core 40 and to be fit to the flat surface that cooperates with optical fiber or other optical device at joint.In order to reduce light reflection, the wall of interconnection 50 can be perpendicular to wafer surface, and is perhaps angled.When the sectioning of parts, can carry out the formation of passage.The band of waveguide chip (not shown) is from substrate 26 sections, and the end of waveguide core 40 can give other optical polish processing.The band of waveguide chip is section further, to be separated into each slab guide assembly 20.Then, individualized assembly is prepared to be used to clean and to assemble with the optical fiber from CFA.

In one embodiment, the number of the number of the number that is arranged on the on-chip optical fiber receiving channel of PLC and the waveguide core that is arranged on PLC and the optical fiber that extends out from CFA is complementary.In an alternative embodiment, the number of the optical fiber receiving channel of PLC substrate can or be arranged on the number of the waveguide core of PLC more than the number of the optical fiber that extends out from CFA.For example, because the possible symmetry difference between PLC passage and the CFA optical-fibre channel, during fabrication, aspect the silicon etching speed, has small difference (is among the silica-based embodiment for PLC substrate and CFA substrate both).Under the unmatched situation of etch process, on the PLC substrate, provide extra optical fiber to admit passage can compensate different etching speeds.In order to keep symmetry, extra optical fiber admits passage can be and definitely the duplicating of the interval of same center to center, and can be placed on the outside that Active Optical Fiber is admitted passage.Similarly, extra fiber guides passage or V-shaped groove can be added on the CFA.In addition, dummy fiber can be used to clog idle outer fibers passage.

Shown in Fig. 5 B, on top view, CFA and PLC can be with form manufacturings in batches, for example with the CFA band 501A of not section and/or 501B and the PLC band 550 of section not.These bands can be sliced into (as mentioned above) to form single CFA-PLC device, perhaps CFA-PLC-CFA device (wherein the two ends of PLC all are coupled in CFA).

The present invention also is provided for the method for a kind of accurate passive coupling CFA fast and PLC.Packaging passive alignment is favourable, has wherein reduced the needs of transmission light by the active equipment of the amplitude of luminous source optical fiber and detection and measurement output light.The intrinsic problem of active method is: have only the optically-coupled of Active Optical Fiber passage to be maximized, other optical channel is according to each fibers/waveguides lateral excursion and PLC wafer and form the warpage of fiber array substrate of skew and curvature and may have low-down output level.In addition, active coupling technique can need the initial position of operator's manual adjustments fiber array, till realizing a spot of optically-coupled at least.In most of the cases, all essential location of input and output optical fiber is also aimed at, and attempts simultaneously to realize maximum light throughput that this increases the complex nature of the problem.

Utilization when providing passive optical to aim at, has reduced some mechanical tolerance of actual optics such as CFA recited above.CFA also reduces the accuracy and the complicacy of aligning parts, but also reduces manufacturing cost.The cantilever optical fiber of CFA recited above can be allowed the center to center interval difference between each PLC light path.

In this example embodiment, can be arranged on the level and the vertical position place of cantilever optical fiber such as the alignment characteristics 22 of the V-shaped groove of PLC device.CFA is not subjected to the influence of (non-) flatness of PLC or fiber array substrate, and this is because cantilever optical fiber has vertically and the unsteady ability of level, to mate the V-shaped groove interval of the needed parts of actual packaging passive alignment.This change in depth for the V-shaped groove of the alignment characteristics of PLC also is suitable for, because can adapt to the shape of the V-shaped groove of PLC from the cantilever optical fiber of PLC.

According to embodiments of the invention, CFA is designed to be connected in manually or automatically the PLC device.Understand that as the those of ordinary skill in field of the present invention though many different mode orientations, aligning are arranged and in conjunction with CFA and PLC, this example provides a kind of one next associated methods.

In this exemplary embodiment, utilize constant force colligator (bonder), PLC be connected in CFA, wherein PLC/CFA one of them keep static with beginning, and another parts move into place, and make the cantilever optical fiber of CFA be admitted passage to admit by the optical fiber of PLC.In an example, colligator can comprise the stationary heat electrode of the vacuum cup with one, and the PLC device is held in place.Joint head can be arranged on thermode above.Joint head can be installed on the x/y complanation worktable that can vertically move.This vertical worktable can be used motor-driven, and wherein the sub-worktable control of air operated is in conjunction with pressure.Before combination, the joint head surface in contact can utilize x/y complanation worktable, is parallel to thermode and regulates.Joint head can be with quartzy structure, to allow to use the cementing agent of UV-curable.Joint head can be designed to only contact the CFA lid on the optical fiber receiving channel of PLC.Consider the atomic little difference in height of V-shaped groove height aspect, joint head can be coated with and be covered with extremely thin adaptation layer (for example Teflon adhesive tape).Colligator can also comprise the one or more microscopes that are used for visual inspection coupling situation.

During CFA/PLC connects, can cause outer peripheral being bent downwardly of covering with the too much lid width of adaptation layer.Bending moment can change over the motion that vertically adds a very little horizontal component with the pure vertical motion of joint head.This horizontal force may cause that transversal displacement takes place.In exemplary embodiment, thicker, narrower lid can reduce the possibility of these potential problems.

CFA can be clamped on the multiaxis worktable, for example 5 translational worktables (x, y, z, pitching and swing).Keep the clamp device of CFA can be clamped in that CFA goes up or optical cable on.Flexible cantilever spring can be installed on the clamp device, applies the pressure of an a small amount of with the top to CFA.Preferably, this spring only contacts CFA in stress alleviates the district, wherein cantilever optical fiber protruding towards thermode.Spring can be controlled the rotation (roll) of CFA, the degree of further translation.Cantilever spring also allow in conjunction with the time limit amount vertically move and pitching changes, and can not damage CFA or PLC.

The pitching (for example, about 2 ° the angle of pitch) that can regulate optical fiber is so that terminal directed (the more close V-shaped groove) downwards of optical fiber.Optical fiber can be positioned in the V-shaped groove side of PLC, and can regulate parallelly, and placed in the middle on V-shaped groove.Then, the end of optical fiber can be positioned on the interconnection at the interface end place that is positioned at waveguide/V-shaped groove (passage 50 for example shown in Figure 6).In case after parallel and placed in the middle, optical fiber is lowered in the V-shaped groove, up to lid/PLC gap reach minimum also parallel till.Consider thermal expansion, suitable amount (for example about 5 microns) can be arranged to by optical fiber being moved more close PLC waveguide in waveguide/optical fiber gap, and the preferred fiber terminal does not contact waveguide core.

Joint head can be placed in the middle, and be reduced to the CFA that optical fiber is pressed in the V-shaped groove of PLC device then and cover.The cementing agent of refractive index match can be coated on the fibers/waveguides interface, flows to downwards then in optical fiber/V-shaped groove space, thereby fills up the engaging gap and the CFA/PLC gap of lid.Suitable cementing agent is described in No. 11/423,191, the unexamined U.S. Patent application of owning together, and its whole contents is by with reference to being incorporated into this.Like this, the cantilever optical fiber of CFA is encapsulated and is protected by CFA, PLC substrate and used cementing agent.Aspect preferred, because lid can be with fused silica or quartz material manufacturing, thereby can apply UV light by lid, to impel the curing of UV cured binders, heating is subsequently solidified finishing.When cure cycle is finished, remove heat, and under pressure, make the assembly cooling.Perhaps, as described below, clamping means can be used to be coupled CFA and PLC.

Superincumbent in conjunction with in the example, CFA connects one at a time.Utilization is relatively simply revised colligator, single in conjunction with the cycle in, CFA can be connected to the two ends of PLC.For the combination at two ends, during the thermode cured portion of operating process, can consider the adaptation of the thermal expansion growth of PLC.

As mentioned above, the optical bond that is used for CFA is incorporated into PLC can be arranged on V-shaped groove and with respect to applying after the Waveguide end face location fully at optical fiber.This process need can prevent from the extruding cementing agent, so that do not become the obstacle of optical fiber, this is because the cementing agent that enters between optical fiber and the V-shaped groove wall can cause offset, thereby has influence on optical coupled unfriendly.

The application of wide array be can be used for such as top CFA-PLC device, passive optical splitters, wavelength Port Multiplier, optical switch, polarization controller, integrated optical laser and amplifier comprised, and optical sensor.

For example, Fig. 8 illustrates the exemplary PLC that is designed to optical sensor chip 650.This sensor chip 650 can comprise 670 the waveguide substrate 660 that supports one or more waveguides, and it can selectively be coupled in the output terminal of the cantilever optical fiber of CFA.Waveguide substrate 660 also comprises a plurality of alignment characteristicses such as optical fiber guides or passage 665, so that admittance and aligning are from the cantilever optical fiber of CFA.For example can carry out the joint at waveguide and alignment characteristics, the interconnection 668 that forms by sawing mouth or other similar operations removing any remaining fillet at joint, and provides in the end of waveguide and to be fit to the flat surface that cooperates with CFA optical fiber.In addition, sensor element can be installed on the sensor chip.In this exemplary embodiment, toroidal cavity resonator 675 is arranged on the chip 650, so as with one or more waveguide 670 optical interactions.For example, as described in No. 11/277,770, the U.S. Patent application of owning together of unexamined, can detect, the whole contents of this patented claim is by with reference to being incorporated into this.

In some applications, the permanent combination of CFA and PLC may be undesirable.For example, many telecommunications components must be accommodated in the protectiveness casing, protect them not to be subjected to the damage of machinery and environment.These parts have permanent cable length usually, perhaps are connected in their " extension line ", and they are engaged in other optical fiber, to finish light path.This causes too much cable length, and its coiling also is placed in the casing, needs added space to be used to deposit too much fiber lengths thereby often cause.Therefore, wish to have such PLC parts, it has the optical conenctor interface that is integrated in the PLC encapsulation, rather than " extension line ".As what understand, if PLC encapsulation has maintaining body,, can realize so being suitable for repeatedly connecting-disconnect attended operation round-robin attachment unit interface so that CFA optical fiber is kept aliging with the PLC alignment slot from the description here.Exemplary attachment unit interface illustrate E in Fig. 9 to Figure 11.

As shown in Figure 9, the CFA-PLC device can be configured to the plug and socket connected system.Specifically, device 700 can comprise the plug element 701 that is configured to by PLC socket or socket element 750 admittances, and wherein socket element 750 is as releasable web member.

Specifically, shown in more detail, CFA plug element 701 comprises CFA 705 as Figure 10 A and Figure 10 B, and it can construct and make to be similar to mode recited above.In this exemplary embodiment, CFA 705 can use shown in Fig. 5 A and the mode of above-described CFA 501 is constructed.In this exemplary embodiment, CFA 705 can comprise the optical fiber end 712 from fiber ribbon connector 710 of a plurality of preparations.These optical fiber can be installed on the CFA base substrate 720.Lid 730 can be protected these cantilever optical fiber.

CFA plug element 701 can comprise cover 745 and base part 740.Base part and cover can be used the injection molding manufacturing, and shape is made by 750 admittances of PLC socket element.And cover 745 can also comprise guide needle or guide hump 747, and it can engage with the admittance/guiding channel 759 in being formed on PLC socket element 750.CFA 705, particularly can be combined on the surface 746 of cover 745 as the lid 730 with reference to the surface.Selectively, fiber ribbon connector 710 also can be incorporated into the surface of cover 745.Base part 740 provides stayed surface for the base substrate 720 of CFA, and can be incorporated on the cover 745, to finish plug portion.

Shown in the order of connection of Figure 11 A-11E, CFA plug 701 can be connected in PLC socket or socket 750 with discharging.In this exemplary embodiment, in order to realize suitable coupling, CFA does not need to be incorporated into PLC.

Figure 11 A illustrates the side view of device 700, and it comprises CFA plug 701 and PLC socket or jack 750.PLC socket 750 comprises the socket main body made from injection molded material 751.PLC socket 750 also comprises waveguide mould rack 782, and it supports PLC waveguide mould 752 mounted thereto, for example above-described PLC 650, and waveguide mould rack 782 can move in PLC socket 750.In this example, can provide an elasticity/force of compression to PLC waveguide mould 752 at PLC socket retaining part 757, so that it movably is being held in place on the mould rack 782.PLC socket 750 also comprises lock pin 785, is used to finish connection procedure.In Figure 11 A-11D, lock pin 785 is shown as and is in its insertion position.PLC socket 750 also comprises locking mechanism or retaining part 755, and it keeps CFA plug 701 in opening 758.PLC socket 750 also comprises opening 753, and its permission user enters the surface of PLC, to be used for test and to analyze.In this respect, if be used for test, fluid is placed on the PLC waveguide mould, and then PLC socket retaining part 757 can be configured to prevent the connected CFA optical fiber of direction of flow PLC.

Shown in Figure 11 B, CFA plug 701 can insert in the PLC socket 750 by opening 758.Retaining part 755 can bend to the outside in CFA plug 701 paths.Figure 11 C illustrates the form that CFA plug 701 inserts PLC socket 750 about 75%.Shown in Figure 11 D, CFA plug 701 about 100% inserts in the PLC socket 750.CFA retaining part 755 back bends to its normal condition, and prevents that CFA plug 701 from skidding off socket 750.In addition, the part of PLC socket main body (being shown as part 756 among Figure 11 D) applies downward power to CFA cover 745, thereby forces cantilever optical fiber to enter in the receiving channel of this PLC substrate.Receiving channel can selectively comprise the refractive index match fluid.

In exemplary embodiment, move the PLC mould by the further optical fiber of CFA towards locking, make waveguide and the optically-coupled more optimally of CFA optical fiber.Shown in Figure 11 E, lock pin 785 can be along the direction rotation of arrow 789.When lock pin 785 moved, the part of mould rack 782 was extended part 786 and engages, and wherein extension 786 promotes mould rack 782 towards the terminal of CFA optical fiber.After the rotation, lock pin 785 can be locked on the throne by the latch mechanism such as the latch (not shown) provisionally.Therefore, opposite with bond material, mechanical system can be finished being connected of waveguide of CFA optical fiber and PLC.In addition, by discharging retaining part 755, and plug 701 is skidded off PLC opening 758, the CFA plug portion can disassemble from PLC socket 750.

As mentioned above, PLC can be configured to carry out the parts of the sensing device of optical detection.This sensor can be the disposable apparatus that is used for biofluid is carried out the medical science test.In this exemplary embodiment, sensor chip can be configured to discard after once using.In above-mentioned example, opposite with permanent combination, PLC mould 752 utilizes pressure to keep.Therefore, CFA can be used as the interim optical interface between the disposable PLC chip that comprises read-out system and the relatively more expensive optics (for example LASER Light Source, spectrometer, power meter) and is introduced in the read-out system.

Though it is shown here and described specific embodiment for the purpose of describing preferred embodiment, but those skilled in the art is to be understood that, be used to realize the various alternative of same purpose and be equal to all alternative shown and described specific embodiment of embodiment, and can not depart from the scope of the present invention.The technician of machinery, electricity, chemistry and optical field is readily appreciated that the present invention can realize with various embodiment.The application is intended to cover any modifications and variations of various embodiment discussed herein.

Claims (23)

1. optical fiber align device comprises:

Substrate with at least one alignment slot;

Be arranged on the part that exhumes of the optical fiber in described at least one alignment slot; With

Lid, wherein the terminal of optical fiber stretch out above the end face of the end face of substrate and lid at least one of them, wherein said lid is connected in described substrate, optical fiber is fixed between substrate and the lid, the described end face of the end face of its middle cover and substrate is not parallel substantially.

2. according to the optical fiber align device of claim 1, wherein the terminal of optical fiber stretches out the described end face above substrate.

3. according to the optical fiber align device of claim 1, wherein the optical fiber align device construction becomes to make that the end face of lid extends beyond the described end face of substrate.

4. according to the optical fiber align device of claim 1, wherein the described end face of substrate extends beyond the described end face of lid.

5. according to the optical fiber align device of claim 1, its middle cover and substrate one of them comprises the Support at least, in order to support the non-part that exhumes of optical fiber.

6. according to the optical fiber align device of claim 1, wherein substrate also comprises isolated substantially parallel a plurality of grooves, in order to admit a plurality of optical fiber.

7. according to the optical fiber align device of claim 1, its middle cover and substrate one of them comprises the passage that forms along the direction that is transverse to described at least one alignment slot at least.

8. according to the optical fiber align device of claim 1, wherein substrate comprises one of them of the inferior glass of silicon, quartz and borosilicic acid, and its middle cover comprises the silicon dioxide or the quartz of fusion, and at least one edge of its middle cover is chamfering.

9. according to the optical fiber align device of claim 1, the described end face of its middle cover is positioned near the end face of optical fiber.

10. an optical fiber align device comprises;

Substrate with at least one alignment slot;

Be arranged in described at least one alignment slot and have terminal optical fiber exhume part and

Be connected in the lid of substrate, optical fiber is fixed between substrate and the lid, its middle cover and substrate one of them has at least one interconnection that is transverse to described at least one alignment slot orientation at least, and this lid and this substrate one of them has at least one sacrificial region at least.

11. an optical device comprises the cantilever fiber array that is coupled in planar optical waveguide,

Wherein the cantilever fiber array comprises that at least a portion with described at least one optical fiber is supported on the substrate in the fiber guides passage, with the lid that is incorporated into substrate and/or described at least one optical fiber, the terminal of wherein said at least one optical fiber extends beyond the end of one of them at least of substrate and lid

Wherein planar optical waveguide comprises and is formed on on-chip slab guide, and described slab guide comprises waveguide core, and wherein the terminal of the optical fiber of cantilever fiber array is set in the alignment slot in the part of the substrate that is formed at described planar optical waveguide.

12. according to the optical device of claim 11, wherein the planar optical waveguide optics interface place that is included in the terminal of described waveguide core and described at least one optical fiber is formed on the on-chip interconnection of described planar optical waveguide.

13. optical device according to claim 11, wherein the cantilever fiber array comprise be arranged in a plurality of fiber-aligning grooves, isolated a plurality of optical fiber substantially parallel, wherein said planar optical waveguide comprises the waveguide with a plurality of waveguide core and is formed on the on-chip a plurality of grooves of described planar optical waveguide.

14. according to the optical device of claim 11, also comprise the refractive index match cementing agent of uv-curable, so that cantilever optical fiber is incorporated into planar optical waveguide.

15. optical device according to claim 11, wherein planar optical waveguide comprises and is formed on on-chip slab guide, described slab guide comprises waveguide core, and is formed on the on-chip interconnection of described planar optical waveguide between alignment characteristics and described waveguide core first.

16. optical device according to claim 15, wherein the cantilever fiber array is the parts of dismountable connector assembly, described connector assembly cooperates with planar optical waveguide, described planar optical waveguide cooperates with female component, wherein said dismountable connector assembly and described female component coupling, and the optical fiber of cantilever fiber array inserts in the V-shaped groove that is integrated on the described planar optical waveguide, to provide optical coupled between optical fiber and waveguide.

17. optical device according to claim 15, wherein the cantilever fiber array is the parts of read-out system, described read-out system is used to inquire the planar optical waveguide device that constitutes sensor, wherein the cantilever fiber array aligns with the V-shaped groove and the waveguide of described planar optical waveguide device, the optical signalling of the described plane light wave derivative sensor of turnover so that read-out system can be coupled.

18. a method that forms the optical fiber align device may further comprise the steps:

Substrate is provided, and described substrate has at least one alignment slot that is formed in its first surface;

Lid is provided;

In at least in one of them of the first surface of the described first surface of substrate and lid, form the interconnection that is transverse to described at least one alignment slot orientation;

The part that exhumes of optical fiber is placed in described at least one alignment slot;

Lid is connected in the substrate, between the described first surface with the described first surface that optical fiber is fixed on substrate and lid; And

Be released in the substrate at interconnection place and the part of one of them at least of lid.

19. the method according to claim 18 also comprises: before release steps, the terminal of polishing fiber.

20. according to the method for claim 18, wherein after release steps, the terminal of optical fiber extend beyond the end face of lid and substrate end face at least one of them.

21. according to the method for claim 18, wherein release steps comprises: to the sacrificial region of the sacrificial region of substrate and lid one of them applies power at least, the direction of wherein said power be transverse to the plane of substrate and lid the plane at least one of them.

22. a method that forms a plurality of optical fiber align devices may further comprise the steps:

Substrate with base part array is provided, and wherein each base part all has at least one alignment slot in the first surface of the substrate of being formed on;

Form interconnection in substrate, wherein interconnection is transverse to described at least one alignment slot orientation;

The part that exhumes of optical fiber is placed in described at least one alignment slot in each base part;

Lid is incorporated on the top surface of base substrate, described at least one optical fiber is fixed between substrate and the lid;

Make substrate individualized, to form described alignment device; And

Remove the sacrificial section of one of them at least of substrate and lid.

23. a method that forms the optical fiber align device may further comprise the steps:

Preparation comprises the optical cable of a plurality of optical fiber, and wherein preparation process comprises: one or more optical fiber of one or more optical fiber of coiling optical cable, one or more optical fiber of peeling off optical cable and the optical cable of riving at least one of them;

The preparation substrate, to admit prepared optical fiber, wherein preparation process also is included in and forms a plurality of alignment slots on the first surface of substrate;

Lid is provided, and its middle cover can comprise flat basically inside surface and be formed on interconnection in the described flat basically inside surface;

Prepared optical fiber is placed in the alignment slot, and

Lid is incorporated on the top surface of base substrate, prepared optical fiber is fixed between substrate and the lid.

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