CN101206973A - Bistable microcomputer electric relay - Google Patents
Bistable microcomputer electric relay Download PDFInfo
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- CN101206973A CN101206973A CNA2007100929499A CN200710092949A CN101206973A CN 101206973 A CN101206973 A CN 101206973A CN A2007100929499 A CNA2007100929499 A CN A2007100929499A CN 200710092949 A CN200710092949 A CN 200710092949A CN 101206973 A CN101206973 A CN 101206973A
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Abstract
The invention relates to a bistable micro-electromechanical relay, in particular to a micro miniature relay with state maintaining function, which is mainly applied to systems of power supply management, instruments and meters, automatic control and wide band communication, etc. The relay comprises a packaging cover, a base pin, a movable diaphragm, micro balloons and an electromagnetic base plate; wherein, the movable diaphragm and the micro balloons are positioned in a hollow cavity formed after the packaging cover, and the electromagnetic base plate are fixedly connected, upper electrodes opposite to the lower electrodes at the left end and the right end of the upper surface of the electromagnetic base plate are respectively arranged at the two ends of the movable diaphragm, round holes are distributed along the longitudinal symmetric axis of the movable diaphragm, and are movably positioned on the corresponding micro balloons, and the microballoons are movably positioned on the round holes of a microballoon base seat on the electromagnetic base plate. The integration level of the relay is high, bistable electromagnetic driving and state locking are realized, the driving energy consumption and the working loss are reduced while the response speed and the service life of the relay are obviously improved, the response time is short, the insulating strength and the compression strength are high, and the work is stable.
Description
Technical field
The present invention relates to a kind of microminiaturized electromechanical relay that state keeps function that has, be mainly used in power management, instrument and meter, system such as control and broadband communications automatically.
Background technology
Microminiature relay as a kind of basic electromechanical compo at power management, instrument and meter, have a wide range of applications in control and the communication system automatically.Typical application wide bandwidth (DC-10GHz), wide load (DC10mV10mA-2A50V) circuit switched, the radio-frequency communication of low insertion loss, high-isolation, low energy consumption, the fast Electromechanical Control of response and electromechanical relay consumption are many or require place microminiaturized, array, as switch in the communication and extension wire switched system, the control system on the automobile etc.These use the demands for higher performance to microminiature relay.
The operation principle of electromechanical relay is the adhesive and the switch or the switching that disconnect the realization circuit by metal electrode.This relay has excellent electric switch performance, and conduction impedance is little when promptly closed, and isolation is very high when turn-offing, and these performances are in that very wide frequency ranges and loading range are all effective simultaneously.But because relay needs Mechanical Contact, its response speed is slower, and working life is shorter.The response time of the existing small-sized signal relay in market, working life only 1,000,000 times was as OmronLG6H-2 and NaisLATQ209 relay greater than 0.005 second.
Existing minicomputer electrical relay is structure because employing pivot, torsion beam or salient point support type vert, and machinery and electric property all are subjected to certain limitation, is difficult for microminiaturized and exists endwisely slipping as pivot; Torsion beam is subjected to the restriction of support strength and fatigue life, and rotation sensitivity is lower, and is subject to influences such as internal stress, thermal stress and creep; And the salient point support type verts structure because the single-point contact easily causes points wear and slip, and positioning accuracy and life-span are restricted, and the high accuracy microscopic bumps requires very high to material and process technology.In addition, above-mentioned pivot structure makes the rotation sensitivity of movable member lower, forces relay to adopt bigger actuating force, and this has reduced the energy efficiency of relay again, and the gouging abrasion of movable member and duration of oscillation are increased, influence the response time and the working life of relay.
The main path that improves the electromechanical relay performance is exactly microminiaturized and integrated, promptly reduce the size and the quality of moving component, thereby reduce movement inertia and collision impact power, make internal circuit integrated by integrated technology simultaneously, reduce joint and be connected distance, improve uniformity and reliability.Existing microcomputer electric relay adopts usually based on integrated technology on the sheet of multilayer technique and sacrificial layer technology, there is significant limitation in this technology, making as high efficiency coil and permanent magnet is difficult, the physical dimension of contact electrode and little with flying height, generally in micron dimension, the surface adhesion effect is relatively more outstanding etc., and the performance of microcomputer electric relay and price can not be met the need of market.
US4223290, " Electromagnetic Device of The Flat Package Tape " (flat packaging type electromagnetic device) proposed a kind of flat pack style calutron that can be used for electromagnetic relay, and this device uses the permanent magnet of two parallel placements to realize that bistable state drives.
US6492887B1, " Miniaturized flat spool relay " (microminiaturized flat winding relay) proposed the flat winding relay of a kind of microminiaturization, this relay adopts two sections permanent magnet and flatwise coil winding formations of polarization in opposite directions, utilizes symmetrical dicyclo magnetostatic field and antisymmetry dicyclo electromagnetic field to realize that bistable electromagnetic drives.
US6608539B2, " Electromagnetic driving apparatus and electromagnetic relay " (electromagnetic driver and electromagnetic relay) have proposed one and have utilized asymmetric electromagnetic actuator device and the relay of realizing that monostable drives that be provided with of permanent magnet.
Chinese invention patent application publication number CN1452202, its invention and created name are " bistable electromagnetic type microdrive and preparation method thereof ", and this driver utilizes plane thread pipeline circle to carry out Electromagnetic Drive, adopt the tiliting axis of torsion beam as moving plate.
Summary of the invention
The object of the present invention is to provide a kind of bistable microcomputer electric relay, make this relay microminiaturized and integrated, realize that bistable electromagnetic drives and the state locking, the energy efficiency and the time efficiency of this relay are improved, thereby in response speed that significantly improves this relay and working life, reduce to drive energy consumption and working loss, and guarantee the stability that works long hours.
In order to realize the foregoing invention purpose, its technical scheme is:
The present invention includes cap 3, but dynamic diaphragm 1, microballoon 2, electromagnetism substrate 4 and pin, cap 3 is fixedlyed connected with electromagnetism substrate 4, but dynamic diaphragm 1 is long 1-30mm, wide 1-20mm, the permeability alloys sheet of thick 0.05-1mm, but the two ends of dynamic diaphragm 1 respectively for electromagnetism substrate 4 upper surfaces, one end and the other end on bottom electrode relatively and have a top electrode of identical elastic construction, but along being distributed with the circular hole that diameter is 0.04-0.97mm on vertical symmetry axis of dynamic diaphragm 1, the microballoon that with the diameter is 0.05-1mm is as bearing, place versatilely on the circular hole of the microballoon pedestal 4-3 on the electromagnetism substrate 4, this microballoon adopts sphericity greater than 80% to 100% glass microsphere or metallic microspheres or ceramic microsphere or plastic microsphere, but each circular hole in the dynamic diaphragm 1 is positioned at respectively on the corresponding microballoon 2 versatilely, but dynamic diaphragm 1 and microballoon 2 are positioned at cap 3 and fixedly connected the rear enclosed cavity with electromagnetism substrate 4, but at the bottom of the lid of cap 3 and the spacing distance between the dynamic diaphragm 1 when being in level be 0.05-0.5mm, but the magnetic circuit on dynamic diaphragm 1 and the electromagnetism substrate 4 constitutes symmetrical parallel circuits, magnet is arranged in this symmetry parallel circuits, and in this symmetry parallel circuits, forming magnetostatic field, described pin is fixed on the lead-in wire port of substrate 4-1 lower surface of electromagnetism substrate 4; The electromagnetism substrate mainly contains four kinds of electromagnetism substrates: electromagnetism substrate 41, electromagnetism substrate 42, electromagnetism substrate 43 and electromagnetism substrate 44.Wherein electromagnetism substrate 41 comprises substrate 4-1, microballoon pedestal 4-3, two identical magnetic core 4-5,4-9, two couples of identical planar spiral winding 4-4,4-8, bottom electrode 4-2,4-6, magnetic conduction substrate 4-7, lead-in wire port 4-13 to 4-18, draw lead, the microballoon pedestal 4-3 that adopts hard magnetic material or permanent magnetism magnetic material to make is fixed on the longitudinal axis of substrate 4-1, the thickness of microballoon pedestal 4-3 is identical with substrate 4-1 thickness or many 0.05-1mm than substrate 4-1 thickness, but be distributed with the round tube hole that and diameter relative with round tube hole 1-1 in the dynamic diaphragm 1 is 0.04-0.97mm in the microballoon pedestal 4-3, two magnetic core 4-5,4-9 and respectively around the planar spiral winding 4-4 of these two magnetic cores, 4-8 is a symmetry axis with the longitudinal centre line of microballoon pedestal 4-3, be printed on symmetrically on the adjacent substrate 4-1 upper and lower surface in two ends, the microballoon pedestal 4-3 left and right sides, constitute two pairs of identical planar spiral windings, be positioned at two planar spiral winding 4-4 on the substrate 4-1 upper and lower surface, the top of 4-8 respectively with two magnetic core 4-5, the upper and lower side of 4-9 is fixedly connected, the end that is positioned at two planar spiral windings on the substrate 4-1 upper surface is corresponding fixedly connected with two lead-in wire ports on the substrate 4-1 upper surface by drawing lead respectively, two planar spiral winding series connection on the substrate 4-1 lower surface, these two lead-in wire ports are drawn outside the substrate 4-1 by the pin on these two the lead-in wire ports and are connected with drive circuit, each magnetic core adopts the good magnetic material of magnetic property, two magnetic cores are respectively the filler and the magnetic channels of the air core coil inside of correspondence, also can constitute the electrical connection between the lattice coil, each magnetic core all is communicated with the magnetic conduction substrate, constitute low reluctance magnetic circuit, magnetic conduction substrate 4-7 is made of the Hard Magnetic or the soft magnetic material of magnetic conduction, bottom electrode 4-2,4-6 generally is made of electrical conductivity alloy, bottom electrode 4-2, but 4-6 is arranged on respectively on the substrate 4-1 upper surface two ends of below, dynamic diaphragm 1 two ends symmetrically, the magnetic core of substrate 4-1 one end and the other end and lay respectively at bottom electrode 4-2 on substrate 4-1 one end and the other end around the pair of planar helical coil of substrate 4-1 two ends magnetic core respectively, between 4-6 and the microballoon pedestal 4-3, bottom electrode 4-2 on the substrate 4-1 two ends, the lead-in wire port that 4-6 is corresponding with the substrate two ends respectively is fixedly connected, and the lower surface of this lead-in wire port is fixedlyed connected with pin.Electromagnetism substrate 42 comprises substrate 4-1, microballoon pedestal 4-3, two identical magnetic core 4-5,4-9, two couples of identical planar spiral winding 4-4,4-8, bottom electrode 4-2, magnetic conduction substrate 4-7, lead-in wire port 4-13 to 4-18 and draw lead.Electromagnetism substrate 42 is with the difference of electromagnetism substrate 41: microballoon pedestal 4-3 adopts soft magnetic material to make, and magnetic conduction substrate 4-7 adopts hard magnetic material or permanent magnetic material to make, and electromagnetism substrate 42 remainders are identical with shape, the structure of electromagnetism substrate 41.Electromagnetism substrate 43 comprises substrate 4-1, microballoon pedestal 4-3, two magnetic core 4-5,4-9,1 couple of planar spiral winding 4-10, bottom electrode 4-2,4-6, magnetic conduction substrate 4-7, lead-in wire port 4-13 to 4-18 and draws lead.Electromagnetism substrate 43 is with the difference of electromagnetism substrate 42: coil is 1 couple of planar spiral winding 4-10, this to coil on the two ends up and down of microballoon pedestal 4-3, microballoon pedestal 4-3 had both supported microballoon 2 versatilely, be this magnetic core simultaneously to coil, this to coil electricity after the magnetic line of force in magnetic circuit be the symmetric double annular, shape, the structure of electromagnetism substrate 43 remainders and electromagnetism substrate 42 are basic identical.Electromagnetism substrate 44 comprises substrate 4-1, microballoon pedestal 4-3, two plane thread pipeline circle 4-19,4-20, bottom electrode 4-2,4-6, magnetic conduction substrate 4-7, lead-in wire port 4-13 to 4-18 and draws lead; Electromagnetism substrate 44 is with the difference of electromagnetism substrate 42: the ground floor lead of two plane thread pipeline circle 4-19,4-20 distributes on the upper surface of substrate 4-1 symmetrically, the second layer arrangement of conductors of these two plane thread pipeline circle 4-19,4-20 is on the dielectric film 4-12 of magnetic conduction substrate 4-7 upper surface and front-back, first and second layer conductor correspondence is fixedly connected, magnetic conduction substrate 4-7 is the magnetic core of these two plane thread pipeline circle 4-19,4-20, and magnetic conduction substrate 4-7 is fixed on the upper surface of substrate 4-1; Microballoon pedestal 4-3 is fixed on the longitudinal axis of the magnetic conduction substrate 4-7 upper surface between the second layer lead of two plane thread pipeline circle 4-19,4-20, and electromagnetism substrate 44 remainders and electromagnetism substrate 42 are basic identical.
But dynamic diaphragm, microballoon pedestal, magnetic core, magnetic conduction substrate constitute symmetrical parallel circuits, and one or more Hard Magnetics or permanent magnet are arranged in this magnetic circuit, are permanent magnet but can select dynamic diaphragm, microballoon pedestal or magnetic conduction substrate arbitrarily, and this magnet makes and forms magnetostatic field in the magnetic circuit.Certainly, but any one position in the parallel circuits that dynamic diaphragm, microballoon pedestal, magnetic core, magnetic conduction substrate and magnetic core constitute of the coil encircling in this magnetic circuit, but in order to realize the bistable state of this relay symmetry, coil should symmetry be provided with.
The magnetic line of force of magnet and hot-wire coil forms symmetrical dicyclo or antisymmetry dicyclo, when selecting the magnet magnetic line of force to be symmetrical dicyclo, the magnetic line of force of hot-wire coil is the antisymmetry dicyclo, and when selecting the magnet magnetic line of force to be the antisymmetry dicyclo, the magnetic line of force of hot-wire coil is symmetrical dicyclo.
When this relay is in initial condition, no current in the coil of electromagnetism substrate 4, but dynamic diaphragm 1 is under the magnetostatic field effect that magnet provides, but dynamic diaphragm 1 is around microballoon 2 deflection one ends and by this end magnetic force adhesive, but the bottom electrode conducting on top electrode on dynamic diaphragm 1 one ends and electromagnetism substrate 4 upper surfaces one end; When coil is led to the 5-500mA electric current, electromagnetic field in the magnetic circuit in the symmetrical parallel circuits of this relay is opposite with the magnetostatic field polarity that magnet provides, and the electromagnetic field in another magnetic circuit in should the symmetry parallel circuits is identical with the magnetostatic field polarity that magnet provides, but be subjected to clockwise moment loading on the dynamic diaphragm 1, around microballoon 2 to clockwise direction deflection and by the adhesive of other end magnetic force, but the bottom electrode conducting on the top electrode on dynamic diaphragm 1 other end and the electromagnetism substrate 4 upper surface other ends; Behind coil blackout, but dynamic diaphragm 1 under the magnetostatic field effect that magnet provides, but dynamic diaphragm 1 other end is kept attracting state, but the bottom electrode conducting of the top electrode on dynamic diaphragm 1 other end end and the electromagnetism substrate 4 upper surface other ends; When coil is led to reverse current, make the electromagnetic field in another magnetic circuit in the symmetrical parallel circuits of relay opposite with the magnetostatic field polarity that magnet provides, and the electromagnetic field in the one magnetic circuit is identical with the magnetostatic field polarity that magnet provides, but be subjected to anticlockwise moment loading on the dynamic diaphragm 1, around microballoon 2 to counter clockwise direction deflection by an end magnetic force adhesive, but the bottom electrode conducting of top electrode on dynamic diaphragm 1 one ends and electromagnetism substrate 4 upper surfaces one end; Behind coil blackout, but dynamic diaphragm 1 under the magnetostatic field effect that magnet provides, but dynamic diaphragm 1 one ends are kept attracting state, but the bottom electrode conducting of top electrode on dynamic diaphragm 1 one ends and electromagnetism substrate 4 upper surfaces one end, this relay is got back to initial condition.This shows that this relay can keep two states for a long time under the currentless situation of coil, the mutual conversion that can realize under the situation of electric current between two states is arranged at coil, thereby be a kind of bistable relay.
The present invention has following technique effect:
1, this relay has improved the movable member bearing load greatly when keeping high sensitivity and positioning accuracy.
2, no matter low-speed motion or high-speed motion, the friction and wear of this relay is very little, has reduced driving energy consumption and working loss, the significantly high working life of this relay.
Above-mentioned technique effect is to have adopted high efficiency microballoon inclining rotary mechanism institute extremely because of the present invention.
3, the flying height of movable matrix lower surface and microballoon frame upper surface is 0.05-1mm, therefore can realize higher dielectric voltage withstand intensity.
4, dicyclo type parallel circuits structure can realize high efficiency Electromagnetic Drive and symmetric double stable state, by the balance of demagnetization and demagnetization, has guaranteed the stability that this relay works long hours.
5, owing to adopt the Elastic Contact electrode, bring very big improvement for the electric property of this relay, guaranteed the parallel contact of face electrode on the one hand; Can effectively overcome the spring effect of Mechanical Contact on the other hand.
6, this relay integrated level height, the response time is short.
The bistable microcomputer electric relay of being manufactured experimently is through " Chongqing City's electronic product quality monitoring testing station " test, and the conducting resistance of this relay is lower than 0.3 Ω, and dielectric voltage withstand intensity is greater than 500V.The dynamic test of this relay is seen shown in Figure 9, and experiment adopts signal generator as driving power, with DC power supply+5V and the output of 0V voltage are as the input signal of this relay, and the output signal of observing drive signal and switching with oscilloscope.Experimental result is seen shown in Figure 10: this relay output signal is a square-wave signal, response time is less than 1ms, response time comprises rise time and fall time, the spring effect of top electrode almost can be ignored, the spring amplitude is less than 10% of the square wave amplitude, bounce time is less than 1ms, and this relay continuous operation is 200,000 times in the test, and its performance does not obviously descend.These test results show: the electric property of this relay and market existing minicomputer electrical relay electric property is suitable, and job stability and response speed then obviously are better than existing minicomputer electrical relay.
Bistable microcomputer electric relay can be made into switch arrays, this switch arrays can be applicable to signal exchange system or the router in the communication, when access function device in switch arrays, then this array constitutes a functional network, the realization network signal is handled, as network attenuator, network frequency converter or network phase shifter etc.
Description of drawings:
Fig. 1 is a structural representation of the present invention, and Fig. 2 is a fundamental diagram of the present invention,
Fig. 2 (a) represents initial condition figure of the present invention,
Fig. 2 (b) but represent that the online loop current of the dynamic diaphragm of this relay drives down around clockwise direction deflection figure,
Fig. 2 (c) but represent the stable diagram of dynamic diaphragm after clockwise direction deflection of this relay,
Fig. 2 (d) but represent that the online circle reverse current of the dynamic diaphragm of this relay drives down around counter clockwise direction deflection figure,
Fig. 3 is the main cutaway view of amplification of 4 kinds of structures of bistable microcomputer electric relay,
Fig. 3 (a) is the main cutaway view of bistable microcomputer electric relay 1,2 structures,
Fig. 3 (b) is the main cutaway view of bistable microcomputer electric relay 3 structures,
Fig. 3 (c) is the main cutaway view of bistable microcomputer electric relay 4 structures,
Fig. 4 is the concrete structure enlarged drawing of electromagnetism substrate in the bistable microcomputer electric relay 1,2,
Fig. 4 (a) is the A-A profile among Fig. 4 (b),
Fig. 4 (b) is the electromagnetism substrate vertical view in the bistable microcomputer electric relay 1,2,
Fig. 4 (c) is the upward view of the electromagnetism substrate in the bistable microcomputer electric relay 1,2,
Fig. 5 is respectively the shape and structure enlarged drawing of movable matrix and cap,
Fig. 5 (a) is the B-B profile among Fig. 5 (b), and Fig. 5 (b) is the vertical view of movable matrix,
Fig. 5 (c) is the C-C profile among Fig. 5 (d), and Fig. 5 (d) is the upward view of cap,
Fig. 6 is the concrete structure enlarged drawing of bistable microcomputer electric relay 3 electromagnetism substrates,
Fig. 6 (a) is the D-D profile among Fig. 6 (b),
Fig. 6 (b) is the electromagnetism substrate vertical view in the bistable microcomputer electric relay 3,
Fig. 6 (c) is the upward view of the electromagnetism substrate in the bistable microcomputer electric relay 3,
Fig. 7 is the concrete structure enlarged drawing of bistable microcomputer electric relay 4 electromagnetism substrates,
Fig. 7 (a) is the E-E profile among Fig. 7 (b),
Fig. 7 (b) is the electromagnetism substrate vertical view in the bistable microcomputer electric relay 4,
Fig. 7 (c) is the upward view of the electromagnetism substrate in the bistable microcomputer electric relay 4,
But Fig. 8 is resiliently mounted dynamic diaphragm vertical view, and Fig. 9 is this relay dynamic test lab diagram,
Figure 10 is that oscilloscope shows The result of dynamic test figure, and Figure 10 (a) is drive signal and switching signal figure,
Figure 10 (b) is switching signal rising edge figure, and Figure 10 (c) is switching signal trailing edge figure.
In Fig. 1, Fig. 3 to Fig. 8:
But 1 dynamic diaphragm 1-1, round tube hole 1-2, top electrode 1-3, top electrode
1-4, spring beam 1-5, anchor point 2, microballoon 3, cap
3-1, fin 3-2, salient point 3-3, salient point 4, electromagnetism substrate
4-1, substrate 4-2, bottom electrode 4-3, microballoon pedestal 4-4, planar spiral winding
4-5, magnetic core 4-6, bottom electrode 4-7, magnetic conduction substrate 4-8, planar spiral winding
4-9, magnetic core 4-10 planar spiral winding 4-11, round tube hole 4-12, dielectric film
4-13, lead-in wire port 4-14, lead-in wire port 4-15, lead-in wire port 4-16, lead-in wire port
4-17, lead-in wire port 4-18, lead-in wire port 4-19, plane thread pipeline circle
4-20, plane thread pipeline circle 5, pin 6, pin
In Fig. 2:
φ represents the magnetic line of force dicyclo that forms in the symmetrical parallel circuits, H
MThe magnetic field H of expression permanent magnet
ERepresent the formed electromagnetic field of electric current in two coils.
Embodiment:
Respectively four kinds of bistable microcomputer electric relays are described in detail below in conjunction with accompanying drawing:
1, bistable microcomputer electric relay 1
Bistable microcomputer electric relay 1 is used for power management and control automatically.
At Fig. 3 (a), among Fig. 4 (a) and (b), (c) and Fig. 5 (a) and (b), (c), (d), but bistable microcomputer electric relay 1 comprises cap 3 dynamic diaphragms 1, microballoon 2, electromagnetism substrate 41 and pin.
At Fig. 5 (c), (d) in, cap 3 usefulness ceramic materials are grown up by mould compacting and sintering, wide, height is respectively 10mm, 6mm, 0.6mm cuboid, in the cap 3 length is arranged, wide, height is respectively 9mm, 4mm, 0.4mm blind hole, the long fin 3-1 of 3mm that is is arranged on the longitudinal axis of cap 3 bottoms relative with microballoon 2, but leave the distance of microballoon 2 with restriction dynamic diaphragm 1, the cross section of this fin 3-1 is wide by top, height is respectively 0.2mm, 0.1mm rectangle and the bottom is protruding downwards and radius is that the circular arc of 0.1mm constitutes, the distance between the upper surface when but this fin 3-1 lower surface and dynamic diaphragm 1 are in level is 0.05mm, but make microballoon 2 all the time between the round tube hole 4-11 in the round tube hole 1-1 in dynamic diaphragm 1 and the microballoon pedestal 4-3, before and after on cap 3 bottom surfaces relative, three salient points are arranged respectively with the round tube hole of lead-in wire port 4-13 to 4-18 on the substrate 4-1, so that cap 3 is aimed at automatically with electromagnetism substrate 4 and is embedded in the round tube hole of the lead-in wire port 4-13 to 4-18 on the substrate 4-1, cap 3 and electromagnetism substrate 4 are combined by bonding or welding.
In Fig. 5 (a) and (b), but dynamic diaphragm 1 usefulness magnetically soft alloy or semi-hard magnetic alloy material, as 1J21, make the rectangular pieces that length is respectively 8.6mm, 3.8mm, 0.1mm, but an end of dynamic diaphragm 1 and the other end are respectively with being laser-cut into symmetrical T type top electrode 1-2 and the 1-3 relative with 4-6 with bottom electrode 4-2.But when the T type top electrode 1-2 on dynamic diaphragm 1 one ends when two bottom electrode 4-2 on substrate 4-1 one end contact, two the bottom electrode 4-2 conducting on substrate 4-1 one end, two bottom electrode 4-6 on the substrate 4-1 other end disconnect; But when the T type top electrode 1-3 on dynamic diaphragm 1 other end when two bottom electrode 4-6 on the substrate 4-1 other end contact, two the bottom electrode 4-6 conducting on the substrate 4-1 other end, two bottom electrode 4-2 on substrate 4-1 one end disconnect.But on vertical symmetry axis of dynamic diaphragm 1, go out diameter and be 0.3mm and center line two symmetrical round tube hole 1-1 at a distance of 2.4mm with laser processing.It is on 95% the glass microsphere 2 that but two symmetrical round tube hole 1-1 in the dynamic diaphragm 1 place two diameters to be 0.32mm and sphericity respectively.
Glass microsphere or ceramic microsphere have better insulating properties and resistance to wear, and metallic microspheres has conductivity and magnetic conductivity.
In Fig. 4 (a) and (b), (c), electromagnetism substrate 41 comprises substrate 4-1, bottom electrode 4-2,4-6, microballoon pedestal 4-3, two couples of identical planar spiral winding 4-4,4-8, two magnetic core 4-5,4-9, magnetic conduction substrate 4-7, lead-in wire port 4-13 to 4-18 and draw lead, electromagnetism substrate 41 adopts the thick film integrated circuit fabrication techniques.Substrate 4-1 makes the rectangular slab that length is respectively 10mm, 6mm, 0.5mm with ceramic material; On the longitudinal axis of this substrate, print hard magnetic material or permanent magnetic material, as NdFeB or FeCrCo, make length, wide, height is respectively 4mm, 1mm, 0.7mm the microballoon pedestal 4-3 of cuboid, the cross section of microballoon pedestal 4-3 is I-shaped, the thickness of this I-shaped upper and lower side is 0.1mm, this the I-shaped vertical section width that is positioned at substrate through-hole is 0.5mm, by microballoon pedestal 4-3 being heat-treated or ceramic post sintering acquisition permanent magnet, this permanent magnet magnetizes after the electromagnetism substrate manufacture is finished again, make microballoon pedestal 4-3 provide magnetostatic field for magnetic circuit, the magnetic line of force of this magnetostatic field is that symmetric double is ring-like, but have two diameters to be the round tube hole 4-11 of 0.3mm in the microballoon pedestal 4-3 relative with two round tube hole 1-1 on the dynamic diaphragm 1, two glass microspheres 2 place respectively on the round tube hole 4-11 in the microballoon pedestal 4-3; Symmetry is printed two magnetic core 4-5,4-9 on substrate 4-1, two couples of planar spiral winding 4-4,4-8, and lead-in wire port 4-13 to 4-18 prints bottom electrode 4-2,4-6 in the upper surface symmetry of substrate 4-1.Two magnetic core 4-5,4-9 are symmetry axis with the longitudinal axis of substrate 4-1, be distributed in symmetrically with the longitudinal axis of substrate 4-1 on the transverse axis of the substrate 4-1 of 2.9mm, two inside and outside diameters of magnetic core 4-5,4-9 and the high hollow cylinder that is 0.3mm, 0.5mm, 0.7mm respectively, two couples of planar spiral winding 4-4,4-8 all adopt resistivity less than 1 * 10
-7Ω .m and permeability greater than 0.5 permalloy lead, to improve the electromagnetic efficiency of planar coil, can adopt technology such as PCB, thick film integrated circuit or LIGA to process greater than 100mH/m and depth-to-width ratio, and magnetic core and planar spiral winding are combined together.Two magnetic core 4-5, the upper and lower side of 4-9 respectively be positioned at substrate 4-1 upper and lower surface on two couples of corresponding planar spiral winding 4-4, the end of 4-8 is fixedly connected, be positioned at two planar spiral winding 4-4 on the substrate 4-1 upper surface, the other end of 4-8 by draw lead respectively with microballoon pedestal 4-3 upper surface rear and front end the lead-in wire port 4-14 on the right substrate 4-1,4-17 is fixedly connected, the other end that is positioned at two planar spiral windings on the substrate 4-1 lower surface links together by drawing lead, each circle in each planar spiral winding is 0.05mm at the printing width of substrate 4-1 upper and lower surface, the spacing distance that each circle is adjacent circle is 0.025mm, every pair of planar spiral winding number of turn is 40 * 2, and promptly being positioned at planar spiral winding relative on the substrate 4-1 upper and lower surface respectively is 40 circles; Be positioned at the bottom electrode 4-2 on substrate (4-1) the upper surface two ends, 4-6 be four long, wide, height is 1.8mm, 0.8mm, 0.1mm the cuboid electrode, these four bottom electrode 4-2, but 4-6 respectively with dynamic diaphragm 1 one ends and the other end on T type top electrode 1-2, the 1-3 end respectively relatively, and respectively with substrate 4-1 upper surface one end and the other end on lead-in wire port 4-15,4-16 and 4-13, the 4-18 symmetry is fixedly connected, the center of three go between port 4-13 to 4-15 and 4-16 to 4-18 of substrate 4-1 front and back end lays respectively on the same straight line, the length of each lead-in wire port, wide, height is respectively 0.8mm, 0.8mm, 0.7mm rectangular body, the cross section of each lead-in wire port is I-shaped, this I-shaped vertical section width, highly be 0.5mm, it is the round tube hole of 0.3mm that there is a diameter at the middle part of each lead-in wire port.Two magnetic core 4-5,4-9, two couples of planar spiral winding 4-4,4-8, bottom electrode 4-2,4-6 and lead-in wire port 4-13 to 4-18 all make with the good soft magnetic material of magnetic property, as permalloy, and at two magnetic core 4-5,4-9, two couples of planar spiral winding 4-4,4-8, it is that 0.025mm and resistivity are less than 1 * 10 that the surface of bottom electrode 4-2,4-6 and lead-in wire port 4-13 to 4-18 plates thickness
-7The alloy firm of Ω .m, as billon, thereby can either conduct electricity well and magnetic conduction well, in the scope that substrate 4-1 lower surface lead-in wire port 4-13 to 4-18 is enclosed, print long, wide, thickness is respectively 8.8mm, 3.9mm, 0.05mm dielectric film 4-12, make the planar spiral winding 4-4 on this dielectric film covered substrate 4-1 lower surface, 4-8 and microballoon pedestal 4-3, go up printing length at dielectric film (4-12) and substrate (4-1), wide, the thick 9.0mm that is respectively, 4.0mm, 0.1mm the rectangle soft magnetic film as magnetic conduction substrate 7, this soft magnetic film is permalloy or Ferrite Material.
Weld diameter is the metal ball shaped bulb pin of 0.8mm respectively on the lead-in wire port 4-13 to 4-18 on the substrate 4-1 lower surface.
2, bistable microcomputer electric relay 2
Bistable microcomputer electric relay 2 is a signal relay, is used for communication and instrument.
In Fig. 3 (a), Fig. 4 (a) and (b), (c) and Fig. 5 (a) and (b), (c), (d), but bistable microcomputer electric relay 2 comprises cap 3 dynamic diaphragms 1, microballoon 2, electromagnetism substrate 42 and pin.Bistable microcomputer electric relay 2 both can adopt the thick film integrated circuit fabrication techniques, also can adopt printed-board technology to make.Bistable microcomputer electric relay 2 is compared with bistable microcomputer electric relay 1: it is different only to be that the material of the parts on the electromagnetism substrate of bistable microcomputer electric relay 2 and making is gone up: microballoon pedestal 4-3 adopts soft magnetic material to make, this soft magnetic material is permalloy or ferrite, and magnetic conduction substrate 4-7 adopts hard magnetic material or permanent magnetic material to make, this hard magnetic material is the magnetically hard alloy sheet, as FeCrCo, magnetic conduction substrate 4-7 adopts surface mounting technology to mount on electromagnetism substrate 42 lower surfaces, the magnetic circuit that is on the electromagnetism substrate 42 provides magnetostatic field, and the magnetic line of force of this magnetostatic field is an antisymmetry dicyclo type; The substrate 4-1 of electromagnetism substrate 42 adopts the polymeric printing circuit board.Cap 3 adopts polymeric material by the pressure sintering moulding, adopts polymeric material can realize cap 3 and the coupling of electromagnetism substrate on coefficient of thermal expansion, to reduce thermal stress; Bistable microcomputer electric relay 2 remaining technical characterictic are identical with bistable microcomputer electric relay 1 with specification requirement.
3, bistable microcomputer electric relay 3
Bistable microcomputer electric relay 3 is the communication relay.
At Fig. 3 (b), Fig. 6 (a) (b) in (c), but bistable microcomputer electric relay 3 comprises cap 3 dynamic diaphragms 1, microballoon 2, electromagnetism substrate 43 and pin.
Bistable microcomputer electric relay 3 both can adopt the thick film integrated circuit fabrication techniques, also can adopt printed-board technology to make.Bistable microcomputer electric relay 3 is compared with bistable microcomputer electric relay 2, difference is: bistable microcomputer electric relay 3 is a magnetic core with microballoon pedestal 4-3, on the substrate 4-1 of electromagnetism substrate 43 upper and lower surface, print planar spiral winding 4-10 around microballoon pedestal 4-3 symmetry respectively, the planar spiral winding that is positioned on the substrate 4-1 upper and lower surface respectively is 30～100 circles, present embodiment respectively is 40 circles, spacing between the lead of this coil wide and lead and the adjacent wires is 0.015mm, this coil the magnetic line of force be the symmetric double annular; The length of substrate 4-1, wide, height is respectively 8mm, 8mm, 0.5mm, microballoon pedestal 4-3 adopts permalloy to make length, wide, height is respectively 2mm, 0.5mm, 0.7mm cuboid and be positioned on the longitudinal axis of substrate 4-1, along there being two diameters to be 0.3mm on the longitudinal axis of microballoon pedestal 4-3, centre distance is the round tube hole 4-11 of 1.5mm, it is that 95% glass microsphere 2 is positioned at respectively on the round tube hole (4-11) of microballoon pedestal 4-3 versatilely that two diameters are 0.32mm and sphericity, fixedly connected with the end of planar spiral winding 4-10 on being positioned at substrate 4-1 upper surface in the upper surface rear end of microballoon pedestal 4-3, the upper surface rear end of the other end that is positioned at the snail line coil 4-10 on the substrate 4-1 upper surface by drawing lead and microballoon pedestal 4-3 the lead-in wire port 4-17 on the right substrate 4-1 fixedly connected, the lower surface front end of microballoon pedestal 4-3 connects with an end that is positioned at the planar spiral winding 4-10 on the substrate 4-1 lower surface is fixing, the other end that is positioned at the snail line coil 4-10 on the substrate 4-1 lower surface and the lower surface front end of microballoon pedestal 4-3 the lead-in wire port 4-14 on the right substrate fixedly connected.Two magnetic core 4-5,4-9 all adopt permalloy or ferrite to make length and are the cuboid of 5.0mm, 1.5mm, 0.7mm and its middle part diameter is all arranged is the 0.3mm round tube hole, the cross section of each magnetic core is I-shaped, this I-shaped upper and lower side is thick respectively to be 0.1mm, this I-shaped middle part vertically section height and width is 0.5mm, two magnetic core 4-5,4-9 be positioned at the center line of the parallel symmetry of microballoon pedestal 4-3 and two magnetic core 4-5,4-9 all with the center line of microballoon pedestal 4-3 apart on the transverse axis of 2.3mm; Bottom electrode 4-2,4-6 makes four identical square electrodes with permalloy, one right-angle side of each square electrode is long, another right angle length of side, wide, the thick 0.6mm that respectively is, 0.6mm, 0.4mm, 0.1mm, but a right angle end of these four square electrodes respectively with dynamic diaphragm 1 one ends and the other end on T type top electrode 1-2, each two lead-in wires of 1-3 end opposing substrates 4-1 upper surface one end and other end port 4-15,4-16 and 4-13, the 4-18 symmetry is fixedly connected, makes another right angle end of the square electrode before and after substrate 4-1 upper surface one end and the other end relative; Two magnetic core 4-5,4-9, microballoon pedestal 4-3, planar spiral winding 4-10, bottom electrode 4-2,4-6 all adopts permalloy to make with lead-in wire port 4-13 to 4-18 and its surface is coated with the high conductivity alloy firm that thickness is 0.025 mm, on substrate 4-1 lower surface, print long, wide, the thick 6.4mm that is respectively, 5.4mm, 0.05mm dielectric film 4-12, make microballoon pedestal 4-3 and planar spiral winding 4-10 on this dielectric film covered substrate 4-1 lower surface, in six lead-in wire scopes that port enclosed of substrate 4-1 lower surface, print long, wide, the thick 7.0mm that is, 6.0mm, 0.1mm the rectangle permanent magnet film as magnetic conduction substrate 4-7, make two magnetic core 4-5 on the magnetic conduction substrate 4-7 covered substrate 4-1 lower surface, 4-9 and dielectric film 4-12, cap 3 is for long, wide, the thick 8mm that is respectively, 8mm, 0.6mm square, in this cap 3 length is arranged, wide, be respectively 7.0mm deeply, 6.0mm, 0.4mm blind hole, the fin 3-1 that long 5mm is arranged on the longitudinal axis of cap 3 bottoms relative with microballoon 2, before and after on relative with round tube hole in the lead-in wire port 4-13 to 4-18 of substrate 4-1 again cap 3 bottom surfaces three salient points are arranged respectively, but the length of dynamic diaphragm 1, wide, height is respectively 6.8mm, 5.8mm, 0.1mm, but have diameter to be 0.3mm and center two symmetrical round tube hole 1-1 at a distance of 1.5mm on vertical symmetry axis of dynamic diaphragm 1, weld diameter is the metal ball shaped pin of 0.8mm respectively on the lead-in wire port 4-13 to 4-18 of substrate 4-1 lower surface.Bistable microcomputer electric relay 3 remaining technical characterictic are identical with bistable microcomputer electric relay 2 with specification requirement.
4, bistable microcomputer electric relay 4
Bistable microcomputer electric relay 4 is a signal relay.
At Fig. 3 (c), Fig. 7 (a) (b) in (c), but bistable microcomputer electric relay 4 comprises cap 3 dynamic diaphragms 1, microballoon 2, electromagnetism substrate 44 and pin.Bistable microcomputer electric relay 4 both can adopt the thick film integrated circuit fabrication techniques, also can adopt printed-board technology to make.Describe with thick film integrated circuit fabrication techniques bistable microcomputer electric relay 4 below.
But but the dynamic diaphragm 1 in the bistable microcomputer electric relay 4 is compared with cap 3 with the dynamic diaphragm 1 in the bistable microcomputer electric relay 2 with cap 3, its difference is: the length of cap 3, wide, height is respectively 6mm, 4mm, 0.6mm cuboid, in the cap 3 length is arranged, wide, height is respectively 5.6mm, 3.6mm, 0.4mm blind hole, the long fin 3-1 of 2.5mm that is is arranged on the longitudinal axis of cap 3 bottoms relative with microballoon 2, but leave the distance of microballoon 2 with restriction dynamic diaphragm 1, the cross section of this fin 3-1 is wide by top, height is respectively 0.2mm, 0.1mm rectangle and the bottom is protruding downwards and radius is that the circular arc of 0.1mm constitutes, the distance between the upper surface when but this fin 3-1 lower surface and dynamic diaphragm 1 are in level is 0.05mm, but the length of dynamic diaphragm 1, wide, height is respectively 5.4mm, 3.4mm, 0.1mm rectangular sheet, be 0.27mm and center line two symmetrical round tube hole 1-1 at a distance of 2.2mm but go out diameter with laser processing on the longitudinal axis of dynamic diaphragm 1, it is on two metallic microspheres 2 of 95% that these two round tube hole 1-1 place diameter to be 0.28mm and sphericity respectively.
Bistable microcomputer electric relay 4 is compared with bistable microcomputer electric relay 2, main difference is: adopt two plane thread pipeline circle 4-19,4-20 on the substrate 4-1 upper surface in the electromagnetism substrate in the bistable microcomputer electric relay 4, magnetic conduction substrate 4-7 is the magnetic core of these two plane thread pipeline circle 4-19,4-20.In Fig. 7 (a) and (b), (c), electromagnetism substrate 44 comprises substrate 4-1, microballoon pedestal 4-3, two plane thread pipeline circle 4-19,4-20, bottom electrode 4-2,4-6, magnetic conduction substrate 4-7, lead-in wire port 4-13 to 4-18.Substrate 4-1 makes the rectangular slab that length is respectively 6mm, 4mm, 0.3mm with ceramic material; Symmetry is printed two plane thread pipeline circle 4-19 on substrate 4-1 upper surface, the ground floor lead of 4-20, this conductor width is 0.025mm, distance between lead and the adjacent wires is 0.025mm, with substrate 4-1 upper surface transverse axis is symmetry axis, on substrate 4-1 upper surface and ground floor lead, print long with FeCrCo hard magnetic material or permanent magnetic material, wide, height is respectively 5.4mm, 3.3mm, 0.1mm cuboid magnetic conduction substrate 4-7,4-7 heat-treats to the magnetic conduction substrate, so that obtain good hard magnetic property, magnetic conduction substrate 4-7 provides magnetostatic field for whole magnetic circuit, magnetostatic field is the antisymmetry Crossed Circle, it is the dielectric film 4-12 of 0.05mm that thickness is arranged on the outer surface of magnetic conduction substrate 4-7, symmetry is printed two plane thread pipeline circle 4-19 on the upper surface of this dielectric film and front and rear surfaces, the second layer lead of 4-20, lead in each plane thread pipeline circle is 0.8 ° around the helical angle of magnetic conduction substrate 4-7, the ground floor lead of substrate 4-1 upper surface is fixedlyed connected with the second layer lead correspondence on the front and rear surfaces with the upper surface of dielectric film 4-12, on magnetic conduction substrate 4-7, constitute two plane thread pipeline circle 4-19 that are 50 circles, 4-20, two plane thread pipeline circle 4-19, the lead head end of 4-20 connects by lead fixed, two plane thread pipeline circle 4-19, the wire end of 4-20 respectively by draw microballoon pedestal 4-3 front and back end on lead and the substrate 4-1 right lead-in wire port 4-14,4-17 is fixedly connected, at two plane thread pipeline circle 4-19, print long with permalloy or ferrite on the dielectric film 4-12 longitudinal axis of the magnetic conduction substrate 4-7 upper surface between the 4-20, wide, height is respectively 3.4mm, 0.8mm, 0.1mm cuboid microballoon pedestal 4-3, by this microballoon pedestal 4-3 being heat-treated the soft magnetic bodies that obtains magnetic conduction, but have two diameters to be the round tube hole 4-11 of 0.27mm in the microballoon pedestal 4-3 relative with two round tube hole 1-1 on the dynamic diaphragm 1, the metallic microspheres 2 that two diameters are 0.28mm places respectively on two round tube hole 4-11 in the microballoon pedestal 4-3 versatilely; Print lead-in wire port 4-13 in the upper and lower surface symmetry of substrate 4-1 one end and the other end, 4-18 and 4-15,4-16, bottom electrode 4-2,4-6 is four identical square electrodes, the length of each square electrode sections, height is respectively 0.25mm, 0.1mm, the two right angle length of sides of each square electrode are 0.5mm, but a right angle end of these four electrodes respectively with dynamic diaphragm 1 one ends and the other end on T type top electrode 1-2, four lead-in wire port 4-15 before and after 1-3 end opposing substrates 4-1 upper surface one end and the other end, 4-16 and 4-13, the 4-18 symmetry is fixedly connected, another right angle end of these four electrodes is positioned on the dielectric film 4-12 of magnetic conduction substrate 4-7 upper surface, three of substrate front and back end lead-in wire port 4-13 to 4-15 and 4-16 to 4-18 lay respectively on the same straight line, the length of each lead-in wire port, wide, height is respectively 0.6mm, 0.6mm, 0.5mm I-shaped square body, the width that this is I-shaped vertical section, highly be 0.4mm, it is the round tube hole of 0.27mm that there is a diameter at the middle part of each lead-in wire port.
The assembling process of bistable microcomputer electric relay 4 is the same with bistable microcomputer electric relay 2.
But the dynamic diaphragm 1 in the above-mentioned bistable microcomputer electric relay 1,2,3,4 also can adopt the spring beam among Fig. 8 to carry out flexible fastening, but the benefit of flexible fastening dynamic diaphragm is: but can make dynamic diaphragm fixing more firm, can not adopt permanent magnet yet and realize bistable state.But a T-shaped spring beam 1-4 is arranged respectively on dynamic diaphragm 1 front and back sides center line, each T-shaped spring beam 1-4 comprise length and width, the thick 1-30mm of being respectively, 0.3-3mm, 0.05-1mm the rectangle crossbeam and with the square longeron of this beam vertical and length and width, the thick 0.1-1mm of being respectively, 0.1-1mm, 0.05-1mm, have in the rectangle crossbeam one with this rectangle crossbeam area than the rectangular through holes that is 30%, on the rectangle crossbeam lower surface longitudinal axis, respectively have one with the resiliently mounted anchor point 1-5 of substrate 4-1.When having initial elastic potential energy among this spring beam 1-4, then this elastic potential energy on the one hand with movable pressing diaphragm on microballoon, but also make dynamic diaphragm 1 be in bistable state on the other hand.
Claims (6)
1. bistable microcomputer electric relay, comprise cap (3) and pin, it is characterized in that but this relay also comprises dynamic diaphragm (1), microballoon (2), electromagnetism substrate (4), described cap (3) is fixedlyed connected with electromagnetism substrate (4), but dynamic diaphragm (1) is long 1-30mm, wide 1-20mm, the permeability alloys sheet of thick 0.05-1mm, but the two ends of dynamic diaphragm (1) respectively for electromagnetism substrate (4) upper surface one end and the other end on bottom electrode relatively and have a top electrode of identical elastic construction, but along being distributed with the circular hole that diameter is 0.04-0.97mm on vertical symmetry axis of dynamic diaphragm (1), the microballoon (2) that with the diameter is 0.05-1mm is as bearing, place versatilely on the circular hole of the microballoon pedestal (4-3) on the electromagnetism substrate (4), this microballoon adopts sphericity greater than 80% to 100% glass microsphere or metallic microspheres or ceramic microsphere or plastic microsphere, but each circular hole in the dynamic diaphragm (1) is positioned at respectively on the corresponding microballoon (2) versatilely, but dynamic diaphragm (1) and microballoon (2) are positioned at cap (3) and fixedly connected the rear enclosed cavity with electromagnetism substrate (4), cap (3) but lid at the bottom of and the spacing distance between the dynamic diaphragm (1) when being in level be 0.05-0.5mm, but the magnetic circuit on dynamic diaphragm (1) and the electromagnetism substrate (4) constitutes symmetrical parallel circuits, magnet is arranged in this symmetry parallel circuits, and in this symmetry parallel circuits, forming magnetostatic field, described pin is fixed on the lead-in wire port of substrate (4-1) lower surface of electromagnetism substrate (4); When this relay is in initial condition, no current in the coil on the electromagnetism substrate (4), but dynamic diaphragm (1) is under the magnetostatic field effect that magnet provides, but dynamic diaphragm (1) is around microballoon (2) deflection one end and by this end magnetic force adhesive, but the bottom electrode conducting on top electrode on dynamic diaphragm (1) one end and electromagnetism substrate (4) upper surface one end; When coil is led to the 5-500mA electric current, electromagnetic field in the magnetic circuit in the symmetrical parallel circuits of this relay is opposite with the magnetostatic field polarity that magnet provides, and the electromagnetic field in another magnetic circuit in the symmetrical parallel circuits is identical with the magnetostatic field polarity that magnet provides, but dynamic diaphragm is subjected to clockwise moment loading on (1), around microballoon (2) to clockwise direction deflection and by the adhesive of other end magnetic force, but the bottom electrode conducting on the top electrode on dynamic diaphragm (1) other end and electromagnetism substrate (4) the upper surface other end; Behind coil blackout, but dynamic diaphragm (1) under the magnetostatic field effect that magnet provides, but dynamic diaphragm (1) other end is kept attracting state, but the bottom electrode conducting of the top electrode on dynamic diaphragm (1) other end and electromagnetism substrate (4) the upper surface other end; When coil is led to reverse current, make the electromagnetic field in another magnetic circuit in the symmetrical parallel circuits of relay opposite with the magnetostatic field polarity that magnet provides, and the electromagnetic field in its left magnetic circuit is identical with the magnetostatic field polarity that magnet provides, but dynamic diaphragm is subjected to anticlockwise moment loading on (1), around microballoon (2) to counter clockwise direction deflection and by an end magnetic force adhesive, but the bottom electrode conducting of top electrode on dynamic diaphragm (1) one end and electromagnetism substrate (4) upper surface one end; Behind coil blackout, but dynamic diaphragm (1) under the magnetostatic field effect that magnet provides, but dynamic diaphragm (1) one end is kept attracting state, but the bottom electrode conducting of top electrode on dynamic diaphragm (1) one end and electromagnetism substrate (4) upper surface one end; This relay is got back to initial condition.
2. bistable microcomputer electric relay according to claim 1, it is characterized in that the cap (3) in the bistable microcomputer electric relay 1 grows up by mould compacting and sintering with ceramic material, wide, height is respectively 10mm, 6mm, 0.6mm cuboid, cap has length in (3), wide, height is respectively 9mm, 4mm, 0.4mm blind hole, on the longitudinal axis of cap (3) bottom relative, the long fin of 3mm (3-1) that is is arranged with microballoon (2), the cross section of this fin (3-1) is wide by top, height is respectively 0.2mm, 0.1mm square and bottom downwards protruding and radius be that the circular arc of 0.1mm constitutes, the distance of this fin (3-1) lower surface between the upper surface of movable matrix (1) when being in level is 0.05mm, make microballoon (2) but be positioned at the round tube hole (1-1) of dynamic diaphragm (1) all the time and the round tube hole (4-11) of microballoon pedestal (4-3) between, with substrate (4-1) on lead-in wire port (4-13) three salient points are respectively arranged before and after to the relative cap of the round tube hole of (4-18) (3) bottom surface, so that cap (3) is aimed at automatically with electromagnetism substrate (41) and is embedded into lead-in wire port (4-13) on the substrate (4-1) to the round tube hole of (4-18), cap (3) and electromagnetism substrate (41) are combined by bonding or welding; But dynamic diaphragm (1) is made length with magnetically soft alloy or semi-hard magnetic alloy material, wide, height is respectively 8.6mm, 3.8mm, 0.1mm rectangular pieces, but an end of dynamic diaphragm (1) and the other end are respectively with being laser-cut into and bottom electrode (4-2), (4-6) the T type top electrode (1-2) of relative symmetry, (1-3), but two bottom electrodes (4-2) on the T type top electrode (1-2) on dynamic diaphragm (1) one end and substrate (4-1) end are when contacting, two bottom electrodes (4-2) conducting on substrate (4-1) end, two bottom electrodes (4-6) on substrate (4-1) other end disconnect; But two on the T type top electrode (1-3) on dynamic diaphragm (1) other end and substrate (4-1) other end connect bottom electrode (4-2) when contacting, two bottom electrodes (4-6) conducting on substrate (4-1) other end, two bottom electrodes (4-2) on substrate (4-1) end disconnect, being 0.3mm and center line two the symmetrical round tube holes (1-1) at a distance of 2.4mm but go out diameter with laser processing on vertical symmetry axis of dynamic diaphragm (1), is on 95% the glass microsphere (2) but two the symmetrical round tube holes (1-1) in the dynamic diaphragm (1) place two diameters to be 0.32mm and sphericity respectively; Electromagnetism substrate (41) comprises substrate (4-1), bottom electrode (4-2), (4-6), microballoon pedestal (4-3), two pairs of identical planar spiral windings (4-4), (4-8), two magnetic cores (4-5), (4-9), magnetic conduction substrate (4-7), lead-in wire port (4-13) to (4-18) and draw lead, substrate (4-1) is made the rectangular slab that length is respectively 10mm, 6mm, 0.5mm with ceramic material; On the longitudinal axis of this substrate, print hard magnetic material or permanent magnetic material, make length, wide, height is respectively 4mm, 1mm, 0.7mm cuboid microballoon pedestal (4-3), the cross section of this microballoon pedestal (4-3) is I-shaped, the thickness of this I-shaped upper and lower side is 0.1mm, I-shaped vertical section the width that is positioned at substrate through-hole is 0.5mm, but have two diameters to be the round tube hole of 0.3mm (4-11) in the microballoon pedestal (4-3) relative with two round tube holes (1-1) on the dynamic diaphragm (1), two glass microspheres (2) place respectively on the round tube hole (4-11) in the microballoon pedestal (4-3); Go up symmetry at substrate (4-1) and print two magnetic core (4-5,4-9), two pairs of planar spiral windings (4-4), (4-8), lead-in wire port (4-13) is to (4-18), upper surface symmetry at substrate (4-1) is printed bottom electrode (4-2), (4-6), two magnetic cores (4-5),) (4-9) longitudinal axis with substrate (4-1) be symmetry axis, be distributed in symmetrically with the longitudinal axis of substrate (4-1) on the transverse axis of the substrate (4-1) of 2.9mm, two magnetic cores (4-5), inner and outer diameter (4-9) and height are 0.3mm respectively, 0.5mm, 0.7mm hollow cylinder, two pairs of planar spiral windings (4-4), (4-9) all adopt resistivity less than 1 * 10
-7Ω .m and permeability greater than 100mH/m and depth-to-width ratio greater than 0.5 permalloy lead, two magnetic cores (4-5), upper and lower side (4-9) respectively be positioned at substrate (4-1) upper and lower surface on an end of corresponding two pairs of planar spiral windings fixedly connected, be positioned at two planar spiral windings (4-4) on substrate (4-1) upper surface, the other end (4-9) by draw lead respectively with microballoon pedestal (4-3) upper surface two ends the lead-in wire port (4-14) on the right substrate (4-1), (4-17) fixedly connected, the other end that is positioned at two planar spiral windings on substrate (4-1) lower surface links together by drawing lead, each circle in each planar spiral winding is 0.05mm at the printing width of substrate (4-1) upper and lower surface, the spacing distance that each circle is adjacent circle is 0.025mm, and every pair of planar spiral winding number of turn is 40 * 2; Be positioned at the bottom electrode (4-2) on substrate (4-1) the upper surface two ends, (4-6) be four long, wide, height is 1.8mm, 0.8mm, 0.1mm the cuboid electrode, these four bottom electrodes (4-2), but (4-6) respectively with dynamic diaphragm one end and the other end on T type top electrode (1-2), (1-3) end respectively relatively, and respectively with substrate (4-1) upper surface one end and the other end on lead-in wire port (4-15), (4-16) and (4-13), (4-18) symmetry is fixedly connected, (4-1) is preceding for substrate, three of rear end lead-in wire ports (4-13) to (4-15) and (4-16) lay respectively on the same straight line to the center of (4-18), the length of each lead-in wire port, wide, height is respectively 0.8mm, 0.8mm, 0.7mm rectangular body, the cross section of each lead-in wire port is I-shaped, this I-shaped vertical section width, highly be 0.5mm, it is the round tube hole of 0.3mm that there is a diameter at the middle part of each lead-in wire port; Two magnetic cores (4-5), (4-9), two pairs of planar spiral windings (4-4), (4-8), bottom electrode (4-2), (4-6) and lead-in wire port (4-13) to (4-18) are all made with permalloy, and at two magnetic cores (4-5), (4-9), two pairs of planar spiral windings (4-4), (4-8), it is that 0.025 mm and resistivity are less than 1 * 10 that the surface of bottom electrode (4-2), (4-6) and lead-in wire port (4-13) to (4-18) plates thickness
-7The alloy firm of Ω .m, in the scope that substrate (4-1) lower surface lead-in wire port (4-13) to (4-18) is enclosed, print long, wide, the thick 8.8mm that is respectively, 3.9mm, 0.05mm dielectric film (4-12), make the planar spiral winding (4-4) on this dielectric film covered substrate (4-1) lower surface, (4-8) with microballoon pedestal (4-3), go up with permalloy or Ferrite Material printing long at dielectric film (4-12) and substrate (4-1), wide, the thick 9.0mm that is respectively, 4.0mm, 0.1mm rectangle magnetic conduction substrate (7), weld diameter is the metal ball shaped pin of 0.8mm respectively on the lead-in wire port (4-13) to (4-18) of substrate (4-1) lower surface.
3. bistable microcomputer electric relay according to claim 2, the microballoon pedestal (4-3) that it is characterized in that the electromagnetism substrate (42) in the bistable microcomputer electric relay 2 adopts permalloy or ferrite to make, and magnetically hard alloy sheet or permanent magnetic material are adopted in magnetic conduction substrate (4-7), and magnetic conduction substrate (4-7) mounted on the lower surface of electromagnetism substrate (42), the substrate (4-1) of electromagnetism substrate (42) adopts the polymeric printing circuit board, and cap 3 adopts polymeric material by the pressure sintering moulding.
4. bistable microcomputer electric relay according to claim 1, it is characterized in that bistable microcomputer electric relay 3 is a magnetic core with microballoon pedestal (4-3), print planar spiral winding (4-10) around microballoon pedestal (4-3) symmetry respectively on substrate (4-1) upper and lower surface of electromagnetism substrate (43), the coil turn that is positioned on substrate (4-1) upper and lower surface respectively is 40 circles; Spacing between the lead of this coil wide and lead and the adjacent wires is 0.015mm, the length of substrate 4-1, wide, height is respectively 8mm, 8mm, 0.5mm, microballoon pedestal (4-3) adopts permalloy to make length, wide, height is respectively 2mm, 0.5mm, 0.7mm cuboid and be positioned on the longitudinal axis of substrate (4-1), along there being two diameters to be 0.3mm on the longitudinal axis of microballoon pedestal (4-3), centre distance is the round tube hole (4-11) of 1.5mm, it is that 95% glass microsphere (2) is positioned at respectively on the round tube hole (4-11) of microballoon pedestal (4-3) versatilely that two diameters are 0.32mm and sphericity, fixedly connected with the end of planar spiral winding (4-10) on being positioned at substrate (4-1) upper surface in the upper surface rear end of microballoon pedestal (4-3), the upper surface rear end of the other end that is positioned at the planar spiral winding (4-10) on substrate (4-1) upper surface by drawing lead and microballoon pedestal (4-3) the lead-in wire port (4-17) on the right substrate (4-1) fixedly connected, the lower surface front end of microballoon pedestal (4-3) connects with an end that is positioned at the planar spiral winding (4-10) on substrate (4-1) lower surface is fixing, the other end that is positioned at the planar spiral winding (4-10) on substrate (4-1) lower surface and the lower surface front end of microballoon pedestal (4-3) the lead-in wire port (4-14) on the right substrate fixedly connected; Two magnetic cores (4-5), (4-9) all adopt permalloy or ferrite to make length, wide, height is 5.0mm, 1.5mm, 0.7mm I-shaped cuboid and diameter is all arranged is the 0.3mm round tube hole at its middle part, being somebody's turn to do this I-shaped upper and lower side thick respectively is 0.1mm, vertical section height in this I-shaped middle part and width are 0.5mm, two magnetic cores (4-5), (4-9) be positioned at and the parallel symmetry of microballoon pedestal (4-3) and two magnetic cores (4-5), center line (4-9) all with the center line of microballoon pedestal (4-3) respectively on the transverse axis of the substrate (4-1) of 2.3mm, bottom electrode (4-2), (4-6) for to make four identical square electrodes with permalloy, one right-angle side of each square electrode is long, another right angle length of side, width and thickness respectively are 0.6mm, 0.6mm, 0.4mm, 0.1mm, but a right angle end of these four square electrodes respectively with dynamic diaphragm (1) one end and the other end on T type top electrode (1-2), (1-3) each two lead-in wires of end opposing substrates (4-1) upper surface one end and other end port (4-15), (4-16) and (4-13), (4-18) symmetry is fixedly connected, makes the other end of the square electrode before and after substrate (4-1) upper surface one end and the other end relative; Two magnetic cores (4-5), (4-9), microballoon pedestal (4-3), planar spiral winding (4-10), bottom electrode (4-2), (4-6) and lead-in wire port (4-13) to (4-18) all adopt permalloy to make and its surface is coated with the high conductivity alloy firm that thickness is 0.025mm, on substrate (4-1) lower surface, print long, wide, the thick 6.4mm that is respectively, 5.4mm, 0.05mm dielectric film (4-12), make microballoon pedestal (4-3) and planar spiral winding (4-10) on this dielectric film covered substrate (4-1) lower surface, in six lead-in wire scopes that port enclosed of substrate (4-1) lower surface, print long, wide, the thick 7.0mm that is, 6.0mm, 0.1mm the rectangle permanent magnet film as magnetic conduction substrate (4-7), make two magnetic cores (4-5) on magnetic conduction substrate (4-7) covered substrate (4-1) lower surface, (4-9) and dielectric film (4-12), cap (3) is for long, wide, the thick 8mm that is respectively, 8mm, 0.6mm square, this cap has length in (3), wide, be respectively 7.0mm deeply, 6.0mm, 0.4mm blind hole, the fin (3-1) that long 5mm is arranged on the longitudinal axis of cap (3) bottom relative with microballoon (2), before and after on relative with round tube hole in the lead-in wire port (4-13) to (4-18) of substrate (4-1) again cap (3) bottom surface three salient points are arranged respectively, but the length of dynamic diaphragm (1), wide, height is respectively 6.8mm, 5.8mm, 0.1mm, but have diameter to be 0.3mm and center two the symmetrical round tube holes (1-1) at a distance of 1.5mm on vertical symmetry axis of dynamic diaphragm (1), weld diameter is the metal ball shaped pin of 0.8mm respectively on the lead-in wire port (4-13) to (4-18) of substrate (4-1) lower surface.
5. bistable microcomputer electric relay according to claim 1, the length that it is characterized in that the cap (3) in the bistable microcomputer electric relay 4, wide, height is respectively 6mm, 4mm, 0.6mm cuboid, cap has length in (3), wide, height is respectively 5.6mm, 3.6mm, 0.4mm blind hole, on the longitudinal axis of cap (3) bottom relative, the long fin of 2.5mm (3-1) that is is arranged with microballoon (2), the cross section of this fin (3-1) is wide by top, height is respectively 0.2mm, 0.1mm rectangle and the bottom is protruding downwards and radius is that the circular arc of 0.1mm constitutes, this fin (3-1) but distance between lower surface and dynamic diaphragm (1) upper surface when being in level is 0.05mm; But the length of dynamic diaphragm (1) is respectively the rectangular sheet of 5.4mm, 3.4mm, 0.1mm, be 0.27mm and center line two the symmetrical round tube holes (1-1) at a distance of 2.2mm but go out diameter with laser processing on the longitudinal axis of dynamic diaphragm (1), it is on two metallic microspheres (2) of 95% that these two symmetrical round tube holes (1-1) place diameter to be 0.28mm and sphericity respectively; Electromagnetism substrate (44) comprises substrate (4-1), microballoon pedestal (4-3), two plane thread pipeline circles (4-19), (4-20), bottom electrode (4-2), (4-6), magnetic conduction substrate (4-7), lead-in wire port (4-13) are to (4-18), and substrate (4-1) is made the rectangular slab that length is respectively 6mm, 4mm, 0.3mm with ceramic material; On substrate (4-1) upper surface, print two plane thread pipeline circles (4-19), ground floor lead (4-20), this conductor width is 0.025mm, spacing between lead and the adjacent wires is 0.025mm, with substrate (4-1) upper surface transverse axis is symmetry axis, on substrate (4-1) upper surface and ground floor lead, print long with FeCrCo hard magnetic material or permanent magnetic material, wide, height is respectively 5.4mm, 3.3mm, 0.1mm cuboid magnetic conduction substrate (4-7), it is the dielectric film (4-12) of 0.05mm that thickness is arranged on the outer surface of magnetic conduction substrate (4-7), symmetry is printed two plane thread pipeline circles (4-19) on the upper surface of this dielectric film and front and rear surfaces, second layer lead (4-20), lead in each snail spool coil is 0.8 ° around the helical angle of magnetic conduction substrate (4-7), ground floor lead on substrate (4-1) upper surface is fixedlyed connected with the second layer lead correspondence on the front and rear surfaces with the upper surface of dielectric film (4-12), go up two plane thread pipeline circles (4-19) that are 50 circles of formation in magnetic conduction substrate (4-7), (4-20), two plane thread pipeline circles (4-19), lead head end (4-20) connects by lead fixed, two plane thread pipeline circles (4-19), wire end (4-20) respectively by draw microballoon pedestal (4-3) front and back end on lead and the substrate (4-1) right lead-in wire port (4-14), (4-17) fixedly connected, at two plane thread pipeline circles (4-19), print long with permalloy or ferrite on dielectric film (4-12) longitudinal axis of magnetic conduction substrate (4-7) upper surface (4-20), wide, height is respectively 3.4mm, 0.8mm, 0.1mm cuboid microballoon pedestal (4-3), but have two diameters to be the round tube hole of 0.27mm (4-11) in the microballoon pedestal (4-3) relative with two round tube holes (1-1) on the dynamic diaphragm (1), the metallic microspheres (2) that two diameters are 0.28mm places respectively on two round tube holes in the microballoon pedestal (4-3) versatilely; Upper and lower surface symmetry at substrate (4-1) end and the other end is printed lead-in wire port (4-13), (4-18) and (4-15), (4-16), bottom electrode (4-2), (4-6) be four identical square electrodes, the length of each square electrode sections, height is respectively 0.25mm, 0.1mm, the two right angle length of sides of each square electrode are 0.5mm, but a right angle end of these four electrodes respectively with dynamic diaphragm 1 one ends and the other end on T type top electrode (1-2), (1-3) lead-in wire of four before and after end opposing substrates (4-1) upper surface one end and other end port (4-15), (4-16) and (4-13), (4-18) symmetry is fixedly connected, another right angle end of these four electrodes is positioned on the dielectric film (4-12) of magnetic conduction substrate (4-7) upper surface, three of substrate front and back end lead-in wire ports (4-13) to (4-15) and (4-16) lay respectively on the same straight line to the center of (4-18), the length of each lead-in wire port, wide, height is respectively 0.6mm, 0.6mm, 0.5mm I-shaped square body, the width that this is I-shaped vertical section, highly be 0.4mm, it is the round tube hole of 0.27mm that there is a diameter at the middle part of each lead-in wire port.
6. bistable microcomputer electric relay according to claim 1, but it is characterized in that a T-shaped spring beam (1-4) is respectively arranged on dynamic diaphragm (1) front and back sides center line, each T-shaped spring beam (1-4) comprises length, wide, the thick 1-30mm that is respectively, 0.3-3mm, 0.05-1mm the rectangle crossbeam and with this beam vertical and length, wide, the thick 0.1-1mm that is respectively, 0.1-1mm, 0.05-1mm square longeron, have in the rectangle crossbeam one with this rectangle crossbeam area than the rectangular through holes that is 30%, on the rectangle crossbeam lower surface longitudinal axis, respectively have one with the resiliently mounted anchor point of substrate (4-1) (1-5).
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| CNB2007100929499A CN100573768C (en) | 2007-11-08 | 2007-11-08 | Bistable microcomputer electric relay |
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| CNB2007100929499A CN100573768C (en) | 2007-11-08 | 2007-11-08 | Bistable microcomputer electric relay |
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| CN103443020A (en) * | 2011-01-14 | 2013-12-11 | 卡文迪什动力有限公司 | Method for increasing a sacrificial layer etching rate and device formed thereof |
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| CN104038385A (en) * | 2014-05-30 | 2014-09-10 | 国家电网公司 | Relay array based multi-channel gating attenuation network system |
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2007
- 2007-11-08 CN CNB2007100929499A patent/CN100573768C/en not_active Expired - Fee Related
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| CN103443020B (en) * | 2011-01-14 | 2015-11-25 | 卡文迪什动力有限公司 | The method improving sacrificial layer etching speed and the device formed by the method |
| CN103443020A (en) * | 2011-01-14 | 2013-12-11 | 卡文迪什动力有限公司 | Method for increasing a sacrificial layer etching rate and device formed thereof |
| TWI421984B (en) * | 2011-04-28 | 2014-01-01 | Univ Nat Chunghsing | Four steady state constant force system |
| CN104425186B (en) * | 2013-08-20 | 2016-08-24 | 梁智全 | Bistable relay and bistable actuator |
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| WO2015024469A1 (en) * | 2013-08-20 | 2015-02-26 | Liang Chih-Chuan | Bistable relay and bistable actuator |
| TWI553685B (en) * | 2013-08-20 | 2016-10-11 | 梁智全 | Bistable latching relay and bistable actuator |
| US9934924B2 (en) | 2013-08-20 | 2018-04-03 | Chih-Chuan Liang | Bistable relay and bistable actuator |
| CN104038385A (en) * | 2014-05-30 | 2014-09-10 | 国家电网公司 | Relay array based multi-channel gating attenuation network system |
| CN104038385B (en) * | 2014-05-30 | 2017-11-21 | 国家电网公司 | Multi channel selecting attenuation network system based on relay array |
| CN107911002A (en) * | 2017-10-31 | 2018-04-13 | 西安交通大学 | A kind of bistable electromagnetic steering engine and start method based on E shape iron yokes |
| CN108231909A (en) * | 2017-12-22 | 2018-06-29 | 中国振华集团永光电子有限公司（国营第八七三厂） | A kind of highly reliable microminiature glassivation compound diode and its preparation method and application |
| CN110739184A (en) * | 2019-09-09 | 2020-01-31 | 成都阿尔刚雷绝缘连电插座制造有限公司 | kinds of relay with quick response |
| CN110739184B (en) * | 2019-09-09 | 2022-04-15 | 成都阿尔刚雷绝缘连电插座制造有限公司 | Quick response relay |
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